Questo sito utilizza cookie di profilazione (propri e di terze parti) per ottimizzare la tua esperienza online e per inviarti pubblicità in linea con le tue preferenze. Continuando a utilizzare questo sito senza modificare le tue preferenze acconsenti all’uso dei cookie. Se vuoi saperne di più o negare il consenso a tutti o ad alcuni cookie clicca qui>
The website that you are visiting also provides Arabian language. Do you wish to switch language version?
يوفر موقع الويب الذي تزوره المحتوى باللغة العربية أيضًا. هل ترغب في تبديل إصدار اللغة؟
The website that you are visiting also provides Russia language Do you wish to switch language version?
Данный сайт есть в английской версии. Желаете ли Вы перейти на английскую версию?
The sound is too large.
(1) Remove the device. The device is powered off)
(2) The caused by memory inserted into the board. After the fiber removal to the fan, it is found that the heat sink and CPU did not fitting (no screws and no glue silicone, lenovo to loud problem may be caused due to this cause, thus raising the heat sink screws to tighten it. The power-on test solution.
(3) to tighten the screws, memory back, device installation. Ask the customer to IBMC management port IP address, used for test: Touch the Ethernet attribute — — enter — — command to enter the Huawei iBMC —— click “ alarm and event ” — — click system event — — detects HBA card is not displayed (Inquire of customers whether they have been imported to the service, the customer replied, has been imported to the service, But because of the sound turned off) — — again to log in to the iBMC to locate the fault — — — locate the 030 position memory is not properly inserted — — Reconnect — — problem is solved.
The heat sink is not connected to the CPU even together.
Install four radiator glue silicone are glued down and tighten the screws on the CPU