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MM910 Management Module V100R001 User Guide 24

This document provides the product description, installation and configuration methods, and common operations of the E9000 server chassis management module MM910.
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Huawei uses machine translation combined with human proofreading to translate this document to different languages in order to help you better understand the content of this document. Note: Even the most advanced machine translation cannot match the quality of professional translators. Huawei shall not bear any responsibility for translation accuracy and it is recommended that you refer to the English document (a link for which has been provided).
Removing an MM910

Removing an MM910

Scenarios

Remove an MM910 from the E9000 chassis.

Impact on the System

After the MM910 is removed, all services running on the MM910 will be stopped.

Prerequisites

Conditions

The panel cables have been removed.

Tools

  • ESD gloves
  • ESD bag
  • Phillips screwdriver (PH2 is 6 mm or 0.25 in.)

Process

Figure 3-5 shows the process for removing an MM910.

Figure 3-5 Process for removing an MM910

Procedure

  1. Determine the MM910 to be removed.

    Figure 3-6 shows the slots of MM910s.

    Figure 3-6 Slot numbers

  2. Remove the MM910.

    1. Use a Phillips screwdriver to loosen the M3 captive screw on the MM910. See (1) in Figure 3-7.
      Figure 3-7 Removing the MM910

    2. Raise the ejector lever on the MM910. See (2) in Figure 3-7.
    3. Pull out the MM910 from the chassis slot horizontally. See (3) in Figure 3-7.
    4. Lower the ejector lever on the MM910. See (4) in Figure 3-7.
    5. Place the removed MM910 in an ESD bag.

    An ESD bag can hold only one MM910.

  3. Install a filler panel.

    1. Insert a filler panel into the slot horizontally. See (1) in Figure 3-8.
      Figure 3-8 Installing a filler panel

    2. Use a Phillips screwdriver to tighten the M3 captive screw on the MM910 filler panel. See (2) in Figure 3-8.
    NOTE:

    Install filler panels in vacant slots. Otherwise, the ventilation, heat dissipation, electromagnetic shielding, and dust resistance of the chassis will be affected.

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Updated: 2019-04-10

Document ID: EDOC1000015900

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