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CH222 Compute Node V100R001 User Guide 18

This document describes the appearance, functions, structure, and installation, removal, and configuration methods of the CH222 compute node.
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Huawei uses machine translation combined with human proofreading to translate this document to different languages in order to help you better understand the content of this document. Note: Even the most advanced machine translation cannot match the quality of professional translators. Huawei shall not bear any responsibility for translation accuracy and it is recommended that you refer to the English document (a link for which has been provided).
Hardware Structure

Hardware Structure

This topic describes the components of the CH222and provides detailed information about the PCIe devices, layouts of the mainboard, hard disk backboard, and hard disk baseboard.

Components

Figure 2-7 shows the components of the CH222.

Figure 2-7 Components of the CH222

1

RAID controller card

2

(Optional) USB flash drive

3

(Optional) TPM

4

DIMM

5

Hard disk tray

6

CPU

7

Mainboard

8

Heat sink

9

Mezz module

10

iBBU

11

(Optional) PCIe card

12

(Optional) PCIe card tray

13

Hard disk baseboard

14

Hard disk

15

Hard disk backboard

16

(Optional) USB 2.0

17

BIOS battery

-

-

Table 2-3 describes the components of the CH222.

Table 2-3 Component description

No.

Item

Description

1

RAID controller card

The RAID controller card externally connects to hard disks to expand the storage capacity of the compute node. The RAID controller card provides eight Serial Attached SCSI (SAS) or Serial Advanced Technology Attachment (SATA) ports for connecting disks and expands the number of SAS or SATA ports to 15 through the midplane.

The mainboard supports RAID controller cards with the LSISAS2208 and LSISAS2308 chips.

  • LSISAS2208: supports RAID 0, 1, 5, 6, 10, 50, and 60.
  • LSISAS2308: supports RAID 0, 1, 1E, and 10.

2

(Optional) USB flash drive

The mainboard provides a flash storage module with a maximum capacity of 8 GB as the startup media.

3

(Optional) TPM

The Trusted Platform Module (TPM) is a security solution that complies with the Trusted Computing Group (TCG) standards. It enhances platform security by preventing viruses or unauthorized operations.

4

DIMM

Up to 24 dual in-line memory module (DIMM) slots for installing DIMMs (12 DIMMs for each CPU).

  • Maximum memory speed: 1866 MHz
  • Memory protection: error-correcting code (ECC), mirroring, and sparing.
  • DIMM type: registered DIMM (RDIMM) and load-reduced DIMM (LRDIMM). A compute node does not allow mixed use of DIMM types (RDIMMs and LRDIMMs) or DIMM specifications (such as the capacity, bit width, number of ranks, and height). Therefore, all DIMMs on a compute node must use the same BOM number. For details about the BOM numbers, see Intelligent Computing Compatibility Checker.
    • RDIMMs: up to 768 GB for 24 x 32 GB RDIMMs and two CPUs
    • LRDIMMs: up to 768 GB for 24 x 32 GB LRDIMMs and two CPUs

5

Hard disk tray

The hard disk tray on the CH222 mainboard does not hold hard disks.

6

CPU

The mainboard supports one or two CPUs.

  • The following CPUs are supported:
    • Intel® Xeon® E5-2600 (Sandy Bridge-EP) CPUs of 60 W, 70 W, 80 W, 95 W, 115 W, 130 W, and 135 W, with a maximum of 12 cores per CPU.
    • Intel® Xeon® E5-2600 v2 (Ivy Bridge-EP) CPUs of 70 W, 80 W, 95 W, 115 W, 130 W, and 135 W, with a maximum of 12 cores per CPU.
  • Each CPU integrates a memory controller for supporting four DDR3 memory channels. Each channel supports three DDR3 DIMMs of 1333 MHz, 1600 MHz, or 1866 MHz.
  • Each CPU integrates a PCIe controller for supporting PCIe 3.0, and provides 40 lanes.
  • Every two CPUs are interconnected through two QuickPath Interconnect (QPI) links, with each link delivering up to 8.0 GT/s.
  • The maximum core frequency supported by the CPUs reaches 3.5 GHz.

7

Mainboard

The mainboard holds the CPUs, DIMMs, hard disk interface modules, power control module, iMana 200 (integrated management module), logic module, chipset and display adapter.

The server chipset is the Platform Controller Hub (PCH) using the Intel® C602 chip.

A video chip with 16 MB display memory integrated into the FPGA chip of iMana 200. The maximum resolution is 1280 x 1024 at 60 Hz with 16 M colors.

8

Heat sink

The heat sink is used to cool CPUs. Each CPU is configured with one heat sink.

9

Mezz module

The mainboard provides two mezzanine card connectors to connect to the switch modules or pass-through modules through the backplane.

  • The upper mezzanine card is Mezz 1, and the lower one is Mezz 2.
  • Socket CPU 1 provides PCIe x16 bandwidth for connecting to Mezz 1 and Mezz 2 respectively.
  • Mezz 1 connects to slots 2X and 3X at the rear of the E9000 chassis.
  • Mezz 2 connects to slots 1E and 4E at the rear of the E9000 chassis.

10

iBBU

When the LSISAS2208 controller card is installed, you can install an iBBU to protect data from power failures.

11

(Optional) PCIe card

Standard PCIe card. The PCIe card can be an 400 GB, 800 GB, 1.2 TB, or 2.4 TB PCIe SSD.

If PCIe card is configured, no DIMMs can be inserted into the six DIMM slots below the PCIe card due to space limitations.

12

(Optional) PCIe card tray

The PCIe card tray is placed above the DIMMs. Each PCIe card tray provides one PCIe 3.0 x16 slot by using a riser card.

13

Hard disk baseboard

The hard disk baseboard helps supply power and connects to the mainboard.

14

Hard disk

The compute node supports a maximum of fifteen 2.5-inch hard disk drives (HDDs) or SSDs. Mixed configuration of HDDs and SSDs is supported. The hard disk backplane provides fifteen Serial Attached SCSI (SAS) and Serial Advanced Technology Attachment (SATA) ports for connecting SAS and SATA hard disks. Each hard disk is hot-swappable and can be installed and removed individually.

15

Hard disk backboard

The hard disk backboard helps expand storage capacity and control hard disks in real time.

16

(Optional) USB 2.0

The mainboard provides a built-in USB port for connecting to a USB 2.0 device within the dimensions of 33.9 mm * 14.5 mm * 7.12 mm.

17

BIOS battery

When the compute node is not powered on, the BIOS battery supplies power to the real time clock (RTC).

PCIe Slots

Table 2-4 describes the mapping between PCIe slots and CPUs, and the PCIe specifications of the CH222.

NOTE:

The PCIe slots mapping to a vacant CPU socket are unavailable.

Table 2-4 PCIe slot description

PCIe Device

Device Name on the BMC

CPU

PCIe Standard

Connector Bandwidth

Bus Width

Port

Device Size

RAID controller card

\

CPU 1

PCIe 3.0

x8

x8

Port 1A

Non-standard device

Mezz 1

\

CPU 1

PCIe 3.0

x16 or x8x8

x16 or x8x8

Port 3A (for x16) or ports 3A and 3C (for x8x8)

Non-standard device

Mezz 2

\

CPU 1

PCIe 3.0

x16 or x8x8

x16 or x8x8

Port 2A (for x16) or ports 2A and 2C (for x8x8)

Non-standard device

PCIe Riser 1

Slot1

CPU 2

PCIe 3.0

x16 (compatible with x8)

x16 (compatible with x8)

Port 2A

Full-height half-length

Mainboard Layout

Figure 2-8 shows the positions of connectors and other components on the CH222 mainboard.

Figure 2-8 Positions of the connectors and other components

1

HDD Backplane Connector

2

TPM Card Connector

3

HDD Tray

4

PCH(Platform Control Hub)

5

USB Flash drive connector

6

HLY indicator

7

UID button/indicator

8

Power button/indicator

9

High-density Port

10

BIOS Battery

11

USB Port

12

Expansion Card Connector 2

13

Expansion Card Connector 1 (for connecting to a PCIe card)

14

RAID Card Connector

15

Mezzanine Card Connector 2

16

Mezzanine Card Connector 1

17

PCIe Card Power Connector

18

Positioning Pin

19

Midplane Signal Connector

20

Mezzanine Card Tray

21

Midplane Power Connector

-

-

Hard Disk Backboard Layout

Figure 2-9 shows the positions of connectors and other components on the CH222 hard disk backboard.

Figure 2-9 Hard disk backboard

1

Power connector, connecting to the power connector on the hard disk baseboard

2

Signal connector, connecting to the signal connector on the hard disk baseboard

3

Mini SAS connector, connecting to the mainboard

4

SAS connector

5

Hard disk indicator

6

Peripheral Component Interconnect Express (PCIe) connector, connecting to the panel indicators

Hard Disk Baseboard Layout

Figure 2-10 shows the positions of connectors and other components on the CH222 hard disk baseboard.

Figure 2-10 Hard disk baseboard

1

The button that perceives whether the hard disk drawer is pulled out

2

Power connector, connecting to the chassis backboard

3

Power connector, connecting to the power connector on the hard disk backboard

4

Signal connector, connecting to the signal connector on the hard disk backboard

5

High-speed signal connector, connecting to the mainboard

-

-

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Updated: 2019-08-16

Document ID: EDOC1000018075

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