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X6800 Server V100R003 User Guide 13

This document describes the Huawei X6800 server (X6000 for short) in terms of its appearance, features, specifications, system components, device installation, cable connections, and installation verification.
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Huawei uses machine translation combined with human proofreading to translate this document to different languages in order to help you better understand the content of this document. Note: Even the most advanced machine translation cannot match the quality of professional translators. Huawei shall not bear any responsibility for translation accuracy and it is recommended that you refer to the English document (a link for which has been provided).
Heat Dissipation

Heat Dissipation

The Heat Dissipation has the following features:

  • The system draws in air from the front of the chassis, delivers the cool air to the server nodes, hard disks, processors, dual in-line memory modules (DIMMs), backplane, and fan modules, and then discharges warm air through the rear of the chassis.
  • Two PSUs are installed in each side of the server chassis. Separated ventilation channels are reserved to deliver the return air from the PSU fans for cooling.
  • The system fans implement cooling of the management boards and I/O boards on the fan modules.
  • The high-pressure counter-rotating fans offer 10% higher air volume than common fans. The refined air channels implement concentrated cooling of heat-sensitive devices. The optimal distribution of temperature sensors covers all areas of high heat concentration (server hotspots), facilitating accurate fan speed adjustment. The cellular design on the panel offers a porosity of 66%, which is 10% higher than that of square holes. The fans use the PID algorithm to adjust the fan speed smoothly and efficiently. All these heat dissipation designs ensure long-term stable running of the server at 40ºC.

Figure 2-26 shows the X6800 ventilation channels.

Figure 2-26 Ventilation channels

NOTICE:

Do not block air vents to prevent device damage due to poor heat dissipation.

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Updated: 2018-09-06

Document ID: EDOC1000066339

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