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CH225 V3 Compute Node V100R001 User Guide 07

This document describes the appearance, functions, and structure of the CH225 V3 storage expansion compute node (CH225 V3 for short), and methods of installing, removing, and configuring the CH225 V3.
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Technical Specifications

Technical Specifications

This topic describes technical specifications of the CH225 V3 components.

Table 2-2 lists the technical specifications.

Table 2-2 Technical specifications






A maximum of twelve 2.5-inch NVMe PCIe SSDs can be configured. The NVMe PCIe SSD backplane provides twelve PCIe 3.0 x4 slots for connecting to NVMe PCIe SSDs. The SSDs can be installed and removed independently and support scheduled hot-swap. Violence hot-swap is not supported.



A maximum of two 2.5-inch HDDs/SSDs can be configured. The HDD/SSD backplane provides two SAS/SATA ports for connecting to HDDs/SSDs. Each HDD/SSD is hot-swappable and can be independently installed and removed.


SATA or SAS HDD/SSD backplane

The backplane helps expand storage capacity and control SAS or SATA HDDs/SSDs in real time.


RAID controller card

A RAID controller card connects to hard disks to expand the storage capacity and improve data security for a compute node. A RAID controller card provides two SAS/SATA ports for connecting to two 2.5-inch hard disks.

The mainboard supports four types of RAID controller cards: LSISAS2208, LSISAS2308, LSISAS3008, and LSISAS3108. RAID 0 and RAID 1 are supported.


(Optional) USB 3.0

The mainboard provides a built-in USB port for connecting to a USB 3.0 device within the dimensions of 31.75 mm * 12.00 mm * 4.50 mm.


(Optional) Supercapacitor

When the LSISAS2208 or LSISAS3108 controller card is installed, you can install a supercapacitor to provide power-off protection at power failures.



A mainboard provides 24 slots for installing DIMMs (12 DIMMs for each processor).

  • Maximum memory speed: 2400 MHz
  • Memory protection: ECC, memory mirroring, and memory sparing
  • DIMM type: registered DIMM (RDIMM) and load-reduced DIMM (LRDIMM). A compute node does not allow mixed use of DIMM types (RDIMMs and LRDIMMs) or DIMM specifications (such as the capacity, bit width, number of ranks, and height). Therefore, all DIMMs on a compute node must use the same BOM number. For details about the BOM numbers, see Huawei Server Compatibility Checker.
    • RDIMMs: up to 768 GB for 24 x 32 GB RDIMMs and two CPUs
    • LRDIMMs: up to 1536 GB for 24 x 64 GB LRDIMMs and two CPUs


(Optional) TPM

Trusted Platform Module (TPM) 1.2 and TPM 2.0 are supported. The TPM is a security solution that complies with the Trusted Computing Group (TCG) standards. It enhances platform security by preventing viruses or unauthorized operations.



The mainboard supports one or two CPUs.

  • The following CPUs are supported:
    • Intel® Xeon® E5-2600 v3 (Haswell-EP) CPUs of 55 W, 65 W, 75 W, 85 W, 90 W, 105 W, 120 W, 135 W, and 145 W, with a maximum of 18 cores per CPU.
    • Intel® Xeon® E5-2600 v4 (Broadwell-EP) CPUs of 55 W, 65 W, 75 W, 85 W, 90 W, 105 W, 120 W, 135 W, and 145 W, with a maximum of 22 cores per CPU.
  • Each processor integrates a memory controller for supporting four DDR4 memory channels. Each channel supports three DDR4 DIMMs of 1600/1866/2133/2400 MHz.
  • Each processor integrates a PCIe controller for supporting PCIe 3.0 and providing 40 lanes.
  • Every two processors are interconnected through two QuickPath Interconnect (QPI) links, with each link delivering up to 9.6 GT/s.
  • Maximum dominant frequency: 3.5 GHz


Heat sink

The heat sink is used to cool CPUs. Each CPU is configured with one heat sink.


(Optional) microSD card

The mainboard provides two microSD card slots. Each slot supports a microSD card with a maximum capacity of 32 GB, and the microSD card can be used as the boot medium for a compute node. After the iBMC initialization is complete, two microSD cards are configured as a RAID 1 array when being detected. You can view the information about the microSD cards and RAID 1 array on the iBMC WebUI by choosing System Info > Other, but cannot modify the configuration or manually configure them.


Mezzanine card

The mainboard provides four mezzanine card connectors to connecting to the slots of switch modules or pass-through modules through the backplane.

  • The upper mezzanine card are Mezz 1 and Mezz 3, and the lower ones are Mezz 2 and Mezz 4.
  • CPU 1, CPU 2, Mezz 1, Mezz 2, Mezz 3, and Mezz 4 connect to the PCIe switch through x16 PCIe lanes. By default, PCIe switch ports connected to CPU 1 are uplink ports for Mezz 1 and Mezz 2, and those connected to CPU 2 are uplink ports for Mezz 3 and Mezz 4. The uplink to downlink bandwidth ratio of the PCIe switch is 1:2.
  • Mezz 1 and Mezz3 connect to slots 2X and 3X at the rear of the E9000 chassis.
  • Mezz 2 and Mezz4 connect to slots 1E and 4E at the rear of the E9000 chassis.


(Optional) SATADOM

The serial ATA disk on module (SATADOM) is a SATA SSD or SATA DOM electrical hard disk. It is a quick memory storage media unit that features energy efficiency and high stability.It can be used only as a boot device and cannot be used for data storage.


For details about STATADOM application scenarios,see the STATADOM Technical White Paper.


NVMe PCIe SSD backplane

The backplane helps expand storage capacity and control NVMe PCIe SSDs in real time.


BIOS battery

When the compute node is not powered on, the BIOS battery supplies power to the real time clock (RTC).

Updated: 2019-07-10

Document ID: EDOC1000095351

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