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CH225 V3 Compute Node V100R001 User Guide 07

This document describes the appearance, functions, and structure of the CH225 V3 storage expansion compute node (CH225 V3 for short), and methods of installing, removing, and configuring the CH225 V3.
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Removing a CH225 V3

Removing a CH225 V3

This section describes the precautions and procedure for removing a CH225 V3 from an E9000 chassis.

Scenarios

Remove a CH225 V3 from an E9000 chassis. Ensure that you are familiar with the hardware devices before the operation.

Impact on the System

After the CH225 V3 is removed, all services running on the CH225 V3 will stop.

Prerequisites

Conditions

You have backed up the services running on the CH225 V3 and safely powered off the CH225 V3 by shutting down the OS.

Data

Data preparation is not required for this operation.

Tools

The following tools are available before the operation:

  • Protective gloves.
  • ESD gloves.
  • ESD wrist strap.
  • ESD bag.

Workflow

Figure 3-9 shows the process for removing a CH225 V3.

Figure 3-9 Removal process

Procedure

  1. Determine the position for installing the CH225 V3 in the chassis. Figure 3-10 shows the numbering of the full-width slots.

    Figure 3-10 Slot numbers

  2. Remove the CH225 V3.

    1. Press the release buttons on the CH225 V3. See step (1) in Figure 3-11.
      Figure 3-11 Removing the CH225 V3
    2. Open the ejector levers on the CH225 V3 completely. See step (2) in Figure 3-11.
    3. Pull the CH225 V3 out of the chassis. See step (3) in Figure 3-11.
    4. Close the ejector levers on the CH225 V3. See step (4) in Figure 3-11.
    5. An ESD bag can hold only one CH225 V3.

      Place the removed CH225 V3 in an ESD bag.

  3. Install a filler panel.

    Insert the filler panel into the chassis horizontally. See in Figure 3-12.

    Figure 3-12 Installing a filler panel
    NOTE:

    Install a filler panel in a vacant slot. Otherwise, the ventilation, heat dissipation, electromagnetic shielding, and dust resistance effect of the chassis will be affected.

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Updated: 2019-07-10

Document ID: EDOC1000095351

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