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CH225 V3 Compute Node V100R001 User Guide 07

This document describes the appearance, functions, and structure of the CH225 V3 storage expansion compute node (CH225 V3 for short), and methods of installing, removing, and configuring the CH225 V3.
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Installing a DIMM and Air Duct

Installing a DIMM and Air Duct

This section describes the precautions and procedure for installing a DIMM and air duct to a CH225 V3.

Scenarios

Install a DIMM in any of the following scenarios:

  • Replace a faulty DIMM.
  • Replace a DIMM with a new model.
  • Install DIMMs to expand the system memory capacity.

The CH225 V3 supports up to two CPUs and 24 DIMMs. Table 8-6 describes the sequence in installing DIMMs. For details about the positions of DIMMs, see Figure 2-6.

Table 8-6 DIMM installation sequence

CPU

DIMM Installation Sequence

CPU 1

1A1, 1B1, 1C1, 1D1, 1A2, 1B2, 1C2, 1D2, 1A3, 1B3, 1C3, and 1D3

CPUs 1 and 2

1A1, 2A1, 1B1, 2B1, 1C1, 2C1, 1D1, 2D1, 1A2, 2A2, 1B2, 2B2, 1C2, 2C2, 1D2, 2D2, 1A3, 2A3, 1B3, 2B3, 1C3, 2C3, 1D3, and 2D3

Prerequisites

Conditions

Data

Data preparation is not required for this operation.

Tools

Electrostatic discharge (ESD) gloves.

Hardware

Spare DIMMs.

Procedure

  1. Install a DIMM.

    1. Take a spare DIMM out of its ESD bag.
    2. Ensure that the two retaining clips of the DIMM slot are released, as shown in Figure 8-28.
      Figure 8-28 Releasing the retaining clips of a DIMM slot
    3. Align the DIMM with the DIMM slot, and insert the DIMM into the slot by gently pressing it down until it sits flush with the slot. See Figure 8-29.

      The two retaining clips pop up into place automatically.

      Figure 8-29 Installing a DIMM

  2. Install an air duct.

    1. Align the air duct with the DIMM group on both sides and install the air duct. See Figure 8-30.
      Figure 8-30 Installing an air duct
    2. Verification Method.

      Log in to the iBMC interface and check the DIMM status. For details, see E9000 Server Compute Node iBMC (Earlier Than V250) User Guide.

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Updated: 2019-07-10

Document ID: EDOC1000095351

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