No relevant resource is found in the selected language.

This site uses cookies. By continuing to browse the site you are agreeing to our use of cookies. Read our privacy policy>Search

Reminder

To have a better experience, please upgrade your IE browser.

upgrade

KunLun 9016 V100R001 User Guide 12

This document describes the appearance, specifications, parameters, and structure of the KunLun 9016, and how to install an OS, replace parts, and install, remove, configure, and troubleshoot the server.
Rate and give feedback:
Huawei uses machine translation combined with human proofreading to translate this document to different languages in order to help you better understand the content of this document. Note: Even the most advanced machine translation cannot match the quality of professional translators. Huawei shall not bear any responsibility for translation accuracy and it is recommended that you refer to the English document (a link for which has been provided).
SCE

SCE

SCE Physical Structure (Front View)

Front View (Not Supporting REEs)

Figure 2-11 shows the front view of a system compute enclosure (SCE).

Figure 2-11 SCE components at the front

Table 2-5 SCE components at the front

No.

Name

Function

1

Enclosure

Houses and protects SCE components.

2

System compute modules (SCMs)

Each SCM consists of two memory board modules (MBMs) and a CPU board module.

SCMs are numbered 1 to 8 from left to right. SCMs 1 to 4 belong to basic partition unit (BPU) A, and SCMs 5 to 8 belong to BPU B.

3

Front I/O module (FIO)

The SCE supports two types of FIOs:

  • FIO-A: supports a maximum of 12 hard disks, two RAID controller cards, and six standard PCIe slots.
  • FIO-B: supports a maximum of 24 hard disks and two RAID controller cards.
NOTE:

The PCIe slots in the FIO support only standard PCIe cards without external cables, such as PCIe SSD and GPU cards. PCIe cards with external cables, such as network interface cards (NICs), Fibre Channel (FC) cards, and InfiniBand (IB) cards, cannot be installed.

Front View (Supporting REEs)

Figure 2-12 shows the SCE physical structure (front view) of a 9016 that support resource expansion enclosure (REEs). Except the FIO module, other components are the same as those of an SCE of a 9016 that does not support REEs.

Figure 2-12 Main components

Table 2-6 Component description

No.

Name

Description

1

Enclosure

The enclosure is used for housing and protecting devices.

2

SCMs

Each SCM consists of two MBMs and a CPU board module. SCMs are numbered 1 to 8 from left to right. SCMs 1 to 4 belong to basic partition unit (BPU) A, and SCMs 5 to 8 belong to BPU B.

3

G-type front I/O module (FIO-G)

An FIO-G is used to repeat PCIe signals of SCEs and lead the signals to REEs.

Front View

Front View (Not Supporting REEs)

The 9016 provides two types of front I/O modules (FIOs):

  • Front I/O module of model A (FIO-A): The FIO-A supports a maximum of 12 SAS HDDs, or SSDs, two RAID controller cards, and six standard PCIe slots on PCIe riser cards.
  • Front I/O module of model B (FIO-B): The FIO-B supports a maximum of 24 SAS HDDs, or SSDs and two RAID controller cards. It does not support standard PCIe slots.

Figure 2-13 and Figure 2-14 shows the front view of a system compute enclosure (SCE).

Figure 2-13 SCE front view (FIO-A)

1

Left mounting ear

2

Hard disk

3

FIO-A

4

Memory board module (MBM)

5

SCM

-

-

NOTE:

A basic partition unit (BPU) is a basic unit for physical partitioning.

A BPU includes four system compute modules (SCMs), six hard disk drives (HDDs) or solid-state disks (SSDs) when an FIO-A is configured or 12 HDDs or SDDs when an FIO-B is configured, one local partition management module (LPM), one LAN on motherboard (LOM), one back I/O module (BIO), one node controller module (NCM), and one RAID controller card.

An SCE has two BPUs, BPU A and BPU B. A physical partition can include one or more BPUs. A physical partition has only one primary BPU: the BPU that hosts the SCMs with CPUs connected to the legacy platform controller hub (PCH).

SCMs in an SCE are numbered 1 to 8 from left to right. Table 2-7 provides the SCM slot layout.

Table 2-7 SCM slot layout

SCM 1

SCM 2

SCM 3

SCM 4

SCM 5

SCM 6

SCM 7

SCM 8

Each SCM consists of two MBMs. Table 2-8 provides the MBM slot layout from left to right.

Table 2-8 MBM slot layout

MBM 1

MBM 3

MBM 5

MBM 7

MBM 9

MBM 11

MBM 13

MBM 15

MBM 2

MBM 4

MBM 6

MBM 8

MBM 10

MBM 12

MBM 14

MBM 16

Each SCE provides 12 hard disk slots. Table 2-9 provides the hard disk slot layout from left to right.

Table 2-9 Hard disk slot layout (FIO-A)

HDD 0

HDD 3

HDD 6

HDD 9

HDD 1

HDD 4

HDD 7

HDD 10

HDD 2

HDD 5

HDD 8

HDD 11

Figure 2-14 SCE front view (FIO-B)

1

Label (including the ESN label)

2

HDD LED board (12 hard disk status indicators on the board)

3

HDD drawer

4

FIO-B

Press the yellow ejector release button on the HDD drawer. The ejector lever ejects automatically. Pull out the HDD drawer by holding the ejector lever.

Table 2-10 describes the hard disk layout (from inside slots to outside slots) in the left HDD drawer on the SCE with FIO-B.

Table 2-10 Hard disk layout in the left HDD drawer (FIO-B)

HDD0

HDD3

HDD6

HDD9

HDD1

HDD4

HDD7

HDD10

HDD2

HDD5

HDD8

HDD11

Table 2-11 describes the hard disk layout (from inside slots to outside slots) in the right HDD drawer on the SCE with FIO-B.

Table 2-11 Hard disk layout in the right HDD drawer (FIO-B)

HDD12

HDD15

HDD18

HDD21

HDD13

HDD16

HDD19

HDD22

HDD14

HDD17

HDD20

HDD23

Front View (Supporting REEs)

Figure 2-15 shows the front view of an SCE of a 9016 that supports REEs. Except the FIO module (FIO-G), other components are the same as those of an SCE of a 9016 that does not support REEs.

Figure 2-15 SCE front view

1

Flexible printed circuit (FPC) slot

2

FIO-G

SCM Physical Structure

SCM Physical Structure shows the physical structure of a system compute module (SCM).

Figure 2-16 SCM components

Table 2-12 SCM components

No.

Name

Function

1

DDR4 memory board modules (MBMs)

Contain DDR4 DIMMs. Each SCM supports a maximum of two MBMs.

2

DDR4 DIMMs

Provide:

  • Up to 64 GB per DDR4 DIMM
  • Up to 12 DIMMs per MBM
  • Up to 1 T (2DPC) per MBM

3

Enclosure

Houses one CPU board module and two MBMs.

SCMs are numbered 1 to 8 from left to right, as identified by the silk screens on the SCE.

4

CPU

Interconnects with other CPUs through three Quick Path Interconnect (QPI) channels.

Each SCM supports one Intel® Xeon® E7-48xx or E7-88xx v3 or v4 series CPU.

5

Heat sink

Dissipates heat from the CPU.

A heat sink adopts foolproof design and supports screw-free installation.

Each CPU is configured with one heat sink.

FIO Physical Structure

FIO Physical Structure (Not Supporting REEs)
  • FIO-A

    Figure 2-17 shows the physical structure of a front I/O module (FIO).

Figure 2-17 FIO components (FIO-A)

Table 2-13 FIO-A components

1

Hard disks

Store data.

Up to 12 hot-swappable 2.5-inch SAS HDDs or SSDs.

2

FIO-A enclosure

Houses hard disks, a hard disk backplane, PCIe cards, PRMs, RAID controller cards, and supercapacitors.

3

PRMs

Two PRMs per FIO

Each PRM provides two standard PCIe 3.0 x8 slots and one standard PCIe 3.0 x16 slot.

4

RAID controller card 1 (RAID-1)

Uses an LSISAS3108 chip, and supports RAID level migration and RAID configuration memory.

An LSISAS3108 controller card supports RAID 0, 1, 5, 6, 10, 50, and 60, and provides a supercapacitor to protect cache data from power failures.

An FIO supports two RAID controller cards, which belong to different system compute modules (SCMs):

  • RAID-1 belongs to SCM 1.
  • RAID-2 belongs to SCM 5.
NOTE:

The RAID controller card mapping to a vacant SCM slot is unavailable.

5

RAID controller card 2 (RAID-2)

6

Supercapacitor

Protects cache data from power failures for the LSISAS3108 controller card.

7

PCIe card

Installed on a PCIe riser module (PRM)

An FIO supports three types of PCIe cards:

  • PCIe 3.0 x4
  • PCIe 3.0 x8
  • PCIe 3.0 x16

A standard PCIe SSD card and GPU is supported.

Figure 2-18 shows the PCIe slot layout for the FIO-A.

Figure 2-18 PCIe slot layout for the FIO-A

The FIO-A provides six standard PCIe slots. Table 2-14 describes the slots.

NOTE:

The PCIe slots mapping to a vacant SCM slot are unavailable.

Table 2-14 PCIe slots of the FIO

Slot 11

SCM 4

PCIe 3.0x8

Not supported

Slot 12

SCM 4

PCIe 3.0x8

Not supported

Slot 13

SCM 1

PCIe 3.0x16

Not supported

Slot 14

SCM 8

PCIe 3.0x8

Not supported

Slot 15

SCM 8

PCIe 3.0x8

Not supported

Slot 16

SCM 5

PCIe 3.0x16

Not supported

  • FIO-B

    Figure 2-19 shows the physical structure of a FIO-B.

Figure 2-19 FIO-B Component

Table 2-15 FIO-B Component

1

FIO-B enclosure

The enclosure supports hard disks, RAID controller cards, and a supercapacitor.

2

Hard disk

Store data.

Up to 24 hot-swappable 2.5-inch SAS HDDs,or SSDs per FIO

3

Disk tray

The FIO-B is configured with two disk trays, and each one supports 12 disks.

4

Front I/O board of model B

The FIO-B houses RAID controller cards and provides the management function.

5

RAID controller card

Uses an LSISAS3108 chip, and supports RAID level migration and RAID configuration memory.

An LSISAS3108 controller card supports RAID 0, 1, 5, 6, 10, 50, and 60, and provides a supercapacitor to protect cache data from power failures.

An FIO-B supports two RAID controller cards, which belong to different SCMs:

  • RAID-1 belongs to SCM 1.
  • RAID-2 belongs to SCM 5.
NOTE:

The RAID controller card mapping to a vacant SCM slot is unavailable.

6

Supercapacitor

Protects cache data from power failures for the LSISAS3108 controller card.

FIO Physical Structure (Supporting REEs)

Figure 2-20 shows the physical structure of an FIO.

Figure 2-20 Main components

Table 2-16 Component description

1

FIO-G enclosure

Houses the FIO and provides two flexible printed circuit (FPC) slots to connect to the REE.

2

FIO-G

Contains components, such as the PCIe switch chip and PCIe Redriver, and supports signal relay.

SCE Physical Structure (Rear View)

Figure 2-21 shows the rear view of a system compute enclosure (SCE).

Figure 2-21 SCE components at the rear

Table 2-17 SCE components at the rear

No.

Name

Function

1

Enclosure

Houses and protects components inside.

2

Fan modules

Dissipate heat from the server.

Fan modules are hot-swappable and redundant. If one fan module becomes faulty, the adjacent fan modules run at full speed to balance heat dissipation for the server.

3

Power supply units (PSUs)

Convert AC power into DC power.

Each SCE has four 3000 W AC PSUs in 2+2 redundancy mode.

4

Local partition management modules (LPMs)

Work with the central partition interconnect modules (CPIs) to implement physical partitioning and manage devices in basic partition units (BPUs).

5

(Optional) Trusted platform modules (TPMs)

  • Comply with the Trusted Computing Group (TCG) standards.
  • Protect the platform from viruses and unauthorized operations.

6

(Optional) USB flash drives

Reserved (not supported currently)

7

Built-in NICs

Connect the server to a network.

Two types of NICs are supported:

  • GE NICs: two or four GE ports
  • 10GE NICs: two 10GE ports
NOTE:

Both GE and 10GE NICs support the Network Controller Sideband Interface (NC-SI).

8

PCIe cards

Full-height 3/4-length PCIe cards that are hot-swappable or non-hot-swappable:

  • Hot-swappable: PCIe 3.0 x8 and PCIe 3.0 x16 cards
  • Non-hot-swappable: PCIe 3.0 x8 and PCIe 3.0 x16 cards

9

Back I/O modules (BIOs)

House and support hot-swappable or non-hot-swappable PCIe cards.

Three types of PCIe card specifications are selectable:

  • Four hot-swappable PCIe cards
  • Six non-hot-swappable PCIe cards
  • Two hot-swappable PCIe cards and three non-hot-swappable PCIe cards

10

Node controller modules (NCMs)

  • Control access to the SCMs in the SCE where the NCMs are located.
  • Support high-speed interconnections with other SCEs to form a cache coherent non-uniform memory access (CC-NUMA) system.

Rear Panel

Figure 2-22 shows the rear panel of a system compute enclosure (SCE).

Figure 2-22 SCE rear panel

1

Local partition management module (LPM) 2

2

Power supply unit (PSU) 4

3

BIO 2

4

PSU 3

5

LAN on motherboard (LOM)

6

PCIe card 3

7

PCIe card 2

8

PCIe card 1

9

Node controller module (NCM) 2

10

NCM 1

11

LOM

12

PSU 1

13

BIO 1

14

PSU 2

15

LPM 1

-

-

The 9016 server supports two types of back I/O modules (BIOs):

  • BIO-A: provides two standard slots for hot-swappable PCIe cards.
  • BIO-B: provides three standard slots for non-hot-swappable PCIe cards.

The BIOs shown in Figure 2-22 are BIO-Bs.

BIO Physical Structure

The 9016 server supports two types of back I/O modules (BIOs):

  • BIO-A: provides two standard slots for hot-swappable PCIe cards.
  • BIO-B: provides three standard slots for non-hot-swappable PCIe cards.

Figure 2-23 shows the physical structure of a BIO-A.

Figure 2-23 BIO-A components

Table 2-18 BIO-A components

No.

Name

Function

1

PCIe card bracket

Secures a PCIe card.

2

PCIe cards

PCIe 3.0 x8 and PCIe 3.0 x16 cards.

Any combination of these cards can be used.

3

BIO-A support board

Provides PCIe slots.

4

BIO-A enclosure

Supports and protects a BIO-A.

Figure 2-24 shows the physical structure of a BIO-B.

Figure 2-24 BIO-B components

Table 2-19 BIO-B components

No.

Name

Function

1

BIO-B enclosure

Supports and protects a BIO-B.

2

Air baffles

Ensure heat dissipation if a PCIe slot is vacant or a PCIe card has a hollowed-out metal bar on its outer side.

3

PCIe cards

PCIe 3.0 x8 and PCIe 3.0 x16 cards.

Any combination of these cards can be used.

4

BIO-B support board

Provides PCIe slots.

There are three possible BIO combinations:

  • Two BIO-As
  • Two BIO-Bs
  • One BIO-A and one BIO-B

9016-12P Model

A 9016-12P without REEs consists of SCE 1 (with SCMs fully configured) and SCE 2 (with SCMs installed in only slots 1 to slot 4 and filler modules installed in the other slots). Figure 2-25 shows the front view.

NOTE:

In the rear view, no filler panel is required to block any component.

Figure 2-25 9016-12P without REEs

A 9016-12P with REEs consists of SCE 1 (with SCMs fully configured) and SCE 2 (with SCMs installed in only slots 1 to slot 4 and filler modules installed in the other slots). Figure 2-26 shows the front view.

NOTE:

In the rear view, no filler panel is required to block any component.

Figure 2-26 9016-12P with REEs

Translation
Download
Updated: 2019-05-20

Document ID: EDOC1000111827

Views: 98537

Downloads: 248

Average rating:
This Document Applies to these Products
Related Documents
Related Version
Share
Previous Next