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KunLun 9016 V100R001 User Guide 12

This document describes the appearance, specifications, parameters, and structure of the KunLun 9016, and how to install an OS, replace parts, and install, remove, configure, and troubleshoot the server.
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Huawei uses machine translation combined with human proofreading to translate this document to different languages in order to help you better understand the content of this document. Note: Even the most advanced machine translation cannot match the quality of professional translators. Huawei shall not bear any responsibility for translation accuracy and it is recommended that you refer to the English document (a link for which has been provided).
REE

REE

REE Physical Structure (Front View)

Figure 2-27 shows the front view of an REE.

Figure 2-27 REE components at the front

REE components

No.

Name

Function

1

Enclosure

Houses and protects REE components.

2

Switch module

Consists of hard disks, RAID controller cards, supercapacitors, and an air duct.

3

Fan modules

Dissipate heat from the REE. Fan modules are hot-swappable and redundant. If one fan module becomes faulty, the other fan modules run at full speed to balance heat dissipation for the REE.

REE Physical Structure (Rear View)

The REE supports two types of back I/O modules (BIOs):

  • Full-height BIO-E with hot-swappable PCIe cards
  • Half-height BIO-C and BIO-D with non-hot-swappable PCIe cards

Figure 2-28 and Figure 2-29 show the rear views of REEs with different BIOs.

Figure 2-28 REE rear view (BIO-E)

Component description

No.

Name

Function

1

Enclosure

Houses and protects REE components.

2

BIO-Es

Each BIO-E provides three PCIe x8 slots and two PCIe x16 slots to support hot-swappable PCIe cards.

3

PCIe cards

The BIO-E supports PCIe 3.0 x8 and PCIe 3.0 x16 cards.

4

Power supply units (PSUs)

Each REE has two 1500 W AC PSUs in 1+1 redundancy mode.

Figure 2-29 REE rear view

Component description

No.

Name

Function

1

Enclosure

Houses and protects REE components.

2

Half-height BIO with non-hot-swappable PCIe cards (7 slots)

Houses non-hot-swappable PCIe cards.

Seven x8 PCIe slots

3

Half-height BIO with non-hot-swappable PCIe cards (8 slots)

Houses non-hot-swappable PCIe cards.

Eight x8 PCIe slots

4

PCIe cards

PCIe 3.0 x4 and PCIe 3.0 x8 cards

5

PSUs

Each REE has two 1500 W AC PSUs in 1+1 redundancy mode.

Front and Rear Views

Front View

Figure 2-30 shows the front view of REE.

Figure 2-30 REE front view

1

Switch module

2

Hard disks

3

Fan modules

4

Flexible printed circuit (FPCs)

Table 2-20 provides the hard disk slot layout of the REE from left to right.

Table 2-20 Hard disk slot layout

HDD0

HDD3

HDD6

HDD9

HDD1

HDD4

HDD7

HDD10

HDD2

HDD5

HDD8

HDD11

Table 2-21 provides the fan slot layout of the REE from left to right.

Table 2-21 Fan slot layout

Fan1

Fan2

Fan3

Fan4

Fan5

Rear View

The REE supports two types of back I/O modules (BIOs): full-height BIO-E with hot-swappable PCIe cards and half-height BIO-C and BIO-D with non-hot-swappable PCIe cards. The two types of BIOs can be configured in four modes, as shown in Figure 2-31, Figure 2-32, Figure 2-33, and Figure 2-34.

Figure 2-31 REE rear view

1

BIO-E

2

PSU

Figure 2-32 REE rear view

1

BIO-D (seven slots)

2

BIO-C (eight slots)

3

PSU

-

-

Table 2-22 provides the BIO slot layout of the REE from left to right.

Table 2-22 BIO slot layout

BIO1

BIO2

BIO3

BIO4

SLOT1

SLOT1

SLOT1

SLOT1

SLOT2

SLOT2

SLOT2

SLOT2

SLOT3

SLOT3

SLOT3

SLOT3

SLOT4

SLOT4

SLOT4

SLOT4

SLOT5

SLOT5

SLOT5

SLOT5

SLOT6

SLOT6

SLOT6

SLOT6

SLOT7

SLOT7

SLOT7

SLOT7

-

SLOT8

-

SLOT8

Figure 2-33 REE rear view

1

BIO-E

2

BIO-D (seven slots)

3

BIO-C (eight slots)

4

PSU

Figure 2-34 REE rear view

1

BIO-D (seven slots)

2

BIO-C (eight slots)

3

BIO-E

4

PSU

FPC Physical Structure

The flexible printed circuit (FPC) is used to connect an SCE and an REE. It leads PCIe resources and control resources in the SCE to the REE, expanding the number of PCIe slots and enabling enclosure-level management.

Figure 2-35 shows the physical structure of an FPC.

Figure 2-35 FPC components

Switch Module Physical Structure

Figure 2-36 shows the physical structure of the switch module.

Figure 2-36 Switch module components

Component description

No.

Name

Description

1

Hard disks

Store data.

Up to 12 hot-swappable 2.5-inch SAS HDDs, or SSDs

2

PCIe chips

Support PCIe 3.0 to implement PCIe signal switching.

3

RAID controller cards

Use LSI SAS3108 chips, and support RAID level migration and RAID configuration memory.

Two types of RAID controller cards are supported:

  • RAID controller card that supports RAID 0, 1, 10, 5, 50, 6, and 60 with up to 1GB cache
  • RAID controller card that supports RAID 0, 1, 10, 5, 50, 6, and 60 with up to 2 GB cache

Support BBUs or supercapacitors for 24/3 power-off protection.

4

Supercapacitors

Protect cache data from power failures for the LSISAS3108 controller cards.

5

Hard disk backplane

Supplies power to hard disks and provides data transmission channels.

REE BIO Physical Structure

The REE supports two types of back I/O modules (BIOs).

  • Full-height BIO-E with hot-swappable PCIe cards

    Figure 2-37 shows the physical structure of a BIO-E.

Figure 2-37 BIO-E physical structure

BIO-E components

No.

Name

Function

1

BIO-E enclosure

Supports and protects a BIO-E.

2

BIO-E support board

Provides PCIe slots.

3

PCIe card bracket

Secures a PCIe card.

4

PCIe card

Slots 1 and 2 support PCIe 3.0 x16 cards. Slots 3 to 5 support PCIe 3.0 x8 cards.

  • Half-height BIO-C and BIO-D with non-hot-swappable PCIe cards

    Figure 2-38 shows the physical structure of a BIO-C.

Figure 2-38 BIO-C physical structure

BIO-C components

No.

Name

Function

1

BIO-C enclosure

Supports and protects a BIO-C.

2

BIO-C support board

Provides PCIe slots.

3

PCIe cards

7-slot BIO-D: supports seven PCIe x8 cards.

8-slot BIO-C: supports eight PCIe x4 cards.

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Updated: 2019-05-20

Document ID: EDOC1000111827

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