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FusionServer G5500 Server G560 V5 Compute Node Maintenance and Service Guide 03

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Huawei uses machine translation combined with human proofreading to translate this document to different languages in order to help you better understand the content of this document. Note: Even the most advanced machine translation cannot match the quality of professional translators. Huawei shall not bear any responsibility for translation accuracy and it is recommended that you refer to the English document (a link for which has been provided).
G560 V5 Specifications

G560 V5 Specifications

Table 10-2 lists the mechanical specifications of the G560 V5.

Table 10-2 Mechanical specifications of the G560 V5

Item

Specifications

Dimensions (H x W x D)

60.46 mm x 423 mm x 537.2 mm (2.38 in. x 16.65 in. x 21.15 in.)

Color

  • Front panel: black
  • Case: silver

Weight

  • Net weight (with eight drives): 12 kg (26.46 lb)
  • Packing materials: 3.42 kg (7.54 lb)

Table 10-3 describes the technical specifications of the G560 V5.

Table 10-3 Technical specifications of the G560 V5

No.

Item

Specifications

1

SAS/SATA/NVMe drive

A maximum of six 2.5-inch HDDs or SSDs (including SAS/SATA/NVMe SSDs) can be configured. Six external SAS/SATA HDDs or SSDs are supported, or six PCIe 3.0 x4 slots are provided for NVMe SSDs.

Each SAS/SATA drive is hot-swappable and can be independently installed and removed.

Each NVMe SSD can be installed and removed independently and supports orderly hot-swap. Surprise hot-swap is not supported.

2

SAS/SATA/M.2 drive

A maximum of two 2.5-inch SAS/SATA drives or M.2 drive modules can be configured. Each M.2 drive module supports two M.2 SSDs. Each drive or module is hot-swappable and can be independently installed and removed.

3

TPM (optional)

Supports TPM 2.0. The TPM is a cost-effective security solution that complies with the Trusted Computing Group (TCG) standards. It enhances platform security by preventing viruses and unauthorized operations.

4

M.2 (optional)

Each M.2 drive module supports two M.2 SSDs, including the 2242 and 2280 models.

5

USB flash drive (optional)

The mainboard provides one built-in USB port, which can connect to a USB 3.0 device. The dimensions of the device cannot exceed 31.75 mm (height) x 12.00 mm (length) x 4.50 mm (width).

6

Supercapacitor (optional)

If the Avago SAS3508 RAID controller card is used, the supercapacitor provides power-off protection.

7

Mainboard

As the most important component of the G560 V5, the mainboard integrates basic components, such as the BIOS chip and PCH chip, and provides processor sockets and DIMM slots.

8

RAID controller card

The RAID controller card expands the storage capacity of the compute node through drives and ensures data security. The G560 V5 supports an LSI SAS3008, Avago SAS3408, or Avago SAS3508 RAID controller card.

The RAID controller card provides eight SAS or SATA ports for connecting to drives to support multiple RAID modes.

  • LSI SAS3008 supports two RAID modes, RAID 0 and 1.
  • Avago SAS3408 supports two RAID modes, RAID 0 and 1.
  • Avago SAS3508 supports seven RAID modes, RAID 0, 1, 5, 6, 10, 50, and 60.

    A supercapacitor can be configured to provide power-off protection for the Avago SAS3508 RAID controller card.

9

Memory

The mainboard provides 24 slots for installing DDR4 DIMMs (12 DIMMs for each processor).

  • Maximum memory speed: 2666 MHz
  • Memory protection: ECC, memory mirroring, and memory sparing
  • DIMM types: RDIMMs and LRDIMMs. DIMMs on the same compute node must be of the same type (RDIMM or LRDIMM) and the same specifications (capacity, bit width, rank, and height), and have the same BOM number. To query DIMM BOM numbers, use the Huawei Server Compatibility Checker.
    • RDIMMs: When twenty-four 32 GB RDIMMs and two CPUs are configured, the maximum memory capacity is 768 GB.
    • LRDIMMs: When twenty-four 64 GB LRDIMMs and two CPUs are configured, the maximum memory capacity is 1536 GB.

10

CPU

The mainboard supports two CPUs.
  • Each CPU is integrated with a memory controller and supports six DDR4 memory channels. Each channel supports two DDR4 DIMMs of a 2400 or 2666 MHz frequency.
  • Each CPU integrates a PCIe controller with 48 lanes and supports PCIe 3.0.
  • The two processors are interconnected through three UltraPath Interconnect (UPI) buses at 10.4 GT/s.
  • The maximum frequency is 3.6 GHz.
NOTE:

The G560 V5 does not support single-processor configuration, and the two processors must be of the same model.

11

Heat sink

Cools CPUs. Each CPU is configured with one heat sink.

12

DIMM air duct

Provides ventilation channels for DIMMs.

13

Mezzanine card

Two mezzanine cards. Each mezzanine card provides two PCIe 3.0 x16 channels and is connected to the mainboard through four connectors and to the GP608 through the chassis backplane. For details, see Logical Structure.

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Updated: 2018-12-14

Document ID: EDOC1100031432

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