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XH321L V5 Server Node V100R005 Maintenance and Service Guide 02

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Huawei uses machine translation combined with human proofreading to translate this document to different languages in order to help you better understand the content of this document. Note: Even the most advanced machine translation cannot match the quality of professional translators. Huawei shall not bear any responsibility for translation accuracy and it is recommended that you refer to the English document (a link for which has been provided).
Environmental Specifications

Environmental Specifications

Table 8-2 describes the environmental specifications for the XH321L V5.

Table 8-2 Environmental specifications

Item

Specifications

Temperature

  • Operating temperature: 5°C to 35°C (41°F to 95°F)
  • Non-working temperature (with water inside): 5°C to 35°C (41°F to 95°F)
  • Storage temperature: –40°C to +65°C (–40°F to +149°F)
  • Long-term storage temperature: 21°C to 27°C (69.8°F to 80.6°F)
NOTE:
  • Drain the compute node before long-term storage.
  • For the maximum temperature supported by the server configured with a supercapacitor, optical modules, or 240G M.2 RAID controller card, see Table 8-3, Table 8-4 and Table 8-5.

Maximum temperature change rate

20°C/h (68°F/h)

Humidity

  • Operating humidity: 8% RH to 90% RH (non-condensing)
  • Storage humidity: 5% RH to 95% RH (non-condensing)

Altitude

  • Operating altitude: ≤ 3,050 m (10006.44 ft)
NOTE:

When the server is used at an altitude between 900 m (2952.76 ft) and 3050 m (10006.44 ft), the maximum operating temperature decreases by 1°C (1.8°F) for every increase of 300 m (984.25 ft).

  • HDDs are not supported when the altitude is higher than 3,050 m (10006.44 ft).
  • Titanium PSUs are required when the altitude is higher than 3,050 m (10006.44 ft).

Vibration

One cyclical sweep in each axial direction at the rate of 0.1 oct/min, with a total of three axial directions

5 Hz to 10 Hz: 5 mm (0.20 in., peak-to-peak value)

10 Hz to 100 Hz: 1 m/s2

Shock

Half sine wave, peak acceleration of 2 G, 11 ms, 3 times for each surface, and a total of three axial directions

Acoustic noise

The following data is the declared A-weighted sound power levels (LWAd) and declared average bystander position A-weighted sound pressure levels (LpAm) when the server is operating at 23°C (73.4°F). Noise emissions are measured in accordance with ISO 7999 (ECMA 74) and declared in accordance with ISO 9296 (ECMA 109).

Idle:

  • LWAd: 7.4 Bels
  • LpAm: 57 dBA

Operating:

  • LWAd: 7.7 Bels
  • LpAm: 60 dBA
NOTE:

The actual sound levels generated when the server is operating vary depending on the server configuration, workload, and ambient temperature.

Corrosive gaseous contaminant

  • Copper corrosion rate test requirements: The corrosion product thickness growth rate is lower than 300 Å/month (meeting level G1 requirements of the ANSI/ISA-71.04-2013 standard on gaseous corrosion).
  • Silver corrosion rate test requirements: The corrosion product thickness growth rate is lower than 200 Å/month.

Particulate pollutant

  • The equipment room environment meets the requirements of ISO 14664-1 Class 8.

    You are advised to ask a professional organization to monitor particulate pollutants in the equipment room.

  • There is no explosive, conductive, magnetic, or corrosive dust in the equipment room.
Table 8-3 Maximum temperatures supported by the server configured with a RAID controller card supercapacitor

Hard Disk Backplane

Disk Quantity (Q)

CPU Power

Maximum Temperature

X6000 V5 C00 24*2.5-inch NVMe backplane

16 < Q ≤ 24

P ≤ 165 W

30°C (86°F)

8 < Q ≤ 16

125 W ≤ P ≤ 165 W

30°C (86°F)

P < 125 W

35°C (95°F)

X6000 V5 C00 24*2.5-inch SAS backplane

16 < Q ≤ 24

125 W ≤ P ≤ 165 W

32°C (89.6°F)

P < 125 W

35°C (95°F)

8 < Q ≤ 16

140 W ≤ P ≤ 165 W

32°C (89.6°F)

P < 140 W

35°C (95°F)

0 < Q ≤ 8

P ≤ 165 W

35°C (95°F)

X6000 V5 C10 24*2.5-inch NVMe backplane

16 < Q ≤ 24

165 W < P ≤ 205 W: not supported

N/A

P ≤ 165 W

32°C (89.6°F)

8 < Q ≤ 16

165 W < P ≤ 205 W: not supported

N/A

125 W ≤ P ≤ 165 W

32°C (89.6°F)

P < 125 W

35°C (95°F)

0 < Q ≤ 8

N/A

N/A

X6000 V5 C10 24*2.5-inch SAS backplane

16 < Q ≤ 24

165 W < P ≤ 205 W: not supported

N/A

125 W ≤ P ≤ 165 W

34°C (93.2°F)

P < 125 W

35°C (95°F)

8 < Q ≤ 16

165 W < P ≤ 205 W

30°C (86°F)

140 W ≤ P ≤ 165 W

34°C (93.2°F)

P < 140 W

35°C (95°F)

0 < Q ≤ 8

165 W < P ≤ 205 W

34°C (93.2°F)

P ≤ 165 W

35°C (95°F)

X6000 V5 C10 12*3.5-inch SAS backplane

8 < Q ≤ 12

165 W < P ≤ 205 W: not supported

N/A

125 W ≤ P ≤ 165 W

32°C (89.6°F)

P < 125 W

35°C (95°F)

4 < Q ≤ 8

165 W < P ≤ 205 W

30°C (86°F)

140 W ≤ P ≤ 165 W

32°C (89.6°F)

P < 140 W

35°C (95°F)

0 <Q ≤ 4

165 W < P ≤ 205 W

32°C (89.6°F)

P ≤ 165 W

35°C (95°F)

NOTE:

For configurations not listed in the table, the maximum temperature is 30°C (86°F). If you need special configuratons and temperature requirements, contact Huawei technical support.

Table 8-4 Maximum temperatures supported by the server configured with an onboard or PCIe optical module

Hard Disk Backplane

Disk Quantity (Q)

CPU Power

Maximum Temperature

with an Onboard Optical Module

Maximum Temperature

with a PCIe Optical Module

X6000 V5 C00 24*2.5-inch NVMe backplane

16 < Q ≤ 24

140 W < P ≤ 165 W

30°C (86°F)

30°C (86°F)

125 W < P ≤ 140 W

35°C (95°F)

30°C (86°F)

P ≤ 125 W

35°C (95°F)

35°C (95°F)

8 < Q ≤ 16

140 W < P ≤ 165 W

30°C (86°F)

30°C (86°F)

125 W < P ≤ 140 W

35°C (95°F)

30°C (86°F)

P ≤ 125 W

35°C (95°F)

35°C (95°F)

0 < Q ≤ 8

140 W < P ≤ 165 W

35°C (95°F)

30°C (86°F)

P ≤ 140 W

35°C (95°F)

35°C (95°F)

X6000 V5 C00 24*2.5-inch SAS backplane

16 < Q ≤ 24

140 W < P ≤ 165 W

35°C (95°F)

30°C (86°F)

P ≤ 140 W

35°C (95°F)

30°C (86°F) (10GE optical module: 35°C (95°F))

8 < Q ≤ 16

140 W < P ≤ 165 W

35°C (95°F)

30°C (86°F)

P ≤ 140 W

35°C (95°F)

35°C (95°F)

0 < Q ≤ 8

P ≤ 165 W

35°C (95°F)

35°C (95°F)

X6000 V5 C10 24*2.5-inch NVMe backplane

16 < Q ≤ 24

165 W < P ≤ 205 W: not supported

N/A

N/A

140 W < P ≤ 165 W

30°C (86°F)

32°C (89.6°F)

125 W < P ≤ 140 W

35°C (95°F)

32°C (89.6°F)

P ≤ 125 W

35°C (95°F)

35°C

8 < Q ≤ 16

165 W < P ≤ 205 W: not supported

N/A

/

140 W < P ≤ 165 W

30°C (86°F)

30°C

125 W < P ≤ 140 W

35°C (95°F)

30°C

P ≤ 125 W

35°C (95°F)

35°C

0 < Q ≤ 8

165 W < P ≤ 205 W

30°C (86°F)

30°C

140 W < P ≤ 165 W

35°C (95°F)

32°C (89.6°F)

P ≤ 140 W

35°C (95°F)

35°C (95°F)

X6000 V5 C10 24*2.5-inch SAS backplane

16 < Q ≤ 24

165 W < P ≤ 205 W: not supported

N/A

N/A

140 W < P ≤ 165 W

35°C (95°F)

30°C (86°F)

P ≤ 140 W

35°C (95°F)

30°C (86°F) (10GE optical module: 35°C (95°F))

8 < Q ≤ 16

165 W < P ≤ 205 W

30°C (86°F)

30°C (86°F)

140 W < P ≤ 165 W

35°C (95°F)

32°C (89.6°F)

P ≤ 140 W

35°C (95°F)

35°C (95°F)

0 < Q ≤ 8

165 W < P ≤ 205 W

35°C (95°F)

32°C (89.6°F)

P ≤ 165 W

35°C (95°F)

35°C (95°F)

X6000 V5 C10 12*3.5-inch SAS backplane

8 < Q ≤ 12

165 W < P ≤ 205 W: not supported

N/A

N/A

140 W < P ≤ 165 W

35°C (95°F)

30°C (86°F)

P ≤ 140 W

35°C (95°F)

30°C (86°F) (10GE optical module: 35°C (95°F))

4 < Q ≤ 8

165 W < P ≤ 205 W

30°C (86°F)

30°C (86°F)

140 W < P ≤ 165 W

35°C (95°F)

32°C (89.6°F)

P ≤ 140 W

35°C (95°F)

35°C (95°F)

0 < Q ≤ 4

165 W < P ≤ 205 W

35°C (95°F)

30°C (86°F)

P ≤ 165 W

35°C (95°F)

35°C (95°F)

NOTE:

For configurations not listed in the table, the maximum temperature is 30°C (86°F). If you need special configuratons and temperature requirements, contact Huawei technical support.

Table 8-5 Maximum temperatures supported by the server configured with a 240G M.2 RAID controller card

Hard Disk Backplane

Disk Quantity (Q)

CPU Power

Maximum Temperature

X6000 V5 C00 24*2.5-inch NVMe backplane

16 < Q ≤ 24

140 W < P ≤ 165 W

28°C (82.4°F)

P ≤ 140 W

32°C (89.6°F)

8 < Q ≤ 16

140 W < P ≤ 165 W

30°C (86°F)

P ≤ 140 W

35°C (95°F)

0 < Q ≤ 8

140 W < P ≤ 165 W

35°C (95°F)

P ≤ 140 W

35°C (95°F)

X6000 V5 C00 24*2.5-inch SAS backplane

16 < Q ≤ 24

140 W < P ≤ 165 W

30°C (86°F)

P ≤ 140 W

35°C (95°F)

8 < Q ≤ 16

140 W < P ≤ 165 W

32°C (89.6°F)

P ≤ 140 W

35°C (95°F)

0 < Q ≤ 8

P ≤ 165 W

35°C (95°F)

X6000 V5 C10 24*2.5-inch NVMe backplane

16 < Q ≤ 24

165 W < P ≤ 205 W: not supported

N/A

140 W < P ≤ 165 W

30°C (86°F)

P ≤ 140 W

35°C (95°F)

8 < Q ≤ 16

165 W < P ≤ 205 W: not supported

N/A

140 W < P ≤ 165 W

32°C (89.6°F)

P ≤ 140 W

35°C (95°F)

0 <Q ≤ 8

165 W < P ≤ 205 W

28°C (82.4°F)

P ≤ 165 W

35°C (95°F)

X6000 V5 C10 24*2.5-inch SAS backplane

16 < Q ≤ 24

165 W < P ≤ 205 W: not supported

N/A

140 W < P ≤ 165 W

30°C (86°F)

P ≤ 140 W

35°C (95°F)

8 < Q ≤ 16

165 W < P ≤ 205 W

28°C (82.4°F)

P ≤ 165 W

35°C (95°F)

0 <Q ≤ 8

165 W < P ≤ 205 W

32°C (89.6°F)

P ≤ 165 W

35°C (95°F)

X6000 V5 C10 12*3.5-inch SAS backplane

8 < Q ≤ 12

165 W < P ≤ 205 W: not supported

N/A

140 W < P ≤ 165 W

30°C (86°F)

P ≤ 140 W

35°C (95°F)

4 < Q ≤ 8

165 W < P ≤ 205 W

30°C (86°F)

140 W < P ≤ 165 W

35°C (95°F)

0 <Q ≤ 4

P ≤ 205 W

35°C (95°F)

NOTE:

For configurations not listed in the table, the temperature range must be 5°C to 30°C (41°F to 86°F). If you need special configuratons and temperature requirements, contact Huawei technical support.

Table 8-6 describes the heat dissipation requirements of XH321L V5 CPUs of different models.

Table 8-6 Heat dissipation requirements of the server configured with CPUs of different models

Hard Disk Backplane

CPU Model

Heatsink

Disks and DIMMs

Maximum Inlet Temperature

X6000 V5 C00 24*2.5-inch SAS backplane

Intel® Xeon® 3100, 4100, 5100, 6100, and 8100 processors (165 W and lower)

Liquid-cooled heat sink

  • Disk ≤ 24
  • DIMMs ≤ 16

35°C (95°F)

X6000 V5 C00 24*2.5-inch NVMe backplane

Intel® Xeon® 3100, 4100, 5100, 6100, and 8100 processors (165 W and lower)

  • Disk ≤ 24
  • DIMMs ≤ 16

35°C (95°F)

X6000 V5 C10 24*2.5-inch NVMe backplane

Intel® Xeon® 3100, 4100, 5100, 6100, and 8100 processors (205 W and lower)

  • 0 < Disk ≤ 8
  • DIMMs ≤ 16

35°C (95°F)

Intel® Xeon® 3100, 4100, 5100, 6100, and 8100 processors (165 W and lower)

  • Disks ≤ 24
  • DIMMs ≤ 16

35°C (95°F)

X6000 V5 C10 24*2.5-inch SAS backplane

Intel® Xeon® 3100, 4100, 5100, 6100, and 8100 processors (205 W and lower)

  • 0 < Disks ≤ 16
  • DIMMs ≤ 16

35°C (95°F)

Intel® Xeon® 3100, 4100, 5100, 6100, and 8100 processors (165 W and lower)

  • Disks ≤ 24
  • DIMMs ≤ 16

35°C (95°F)

X6000 V5 C10 12*3.5-inch SAS backplane

Intel® Xeon® 3100, 4100, 5100, 6100, and 8100 processors (205 W and lower)

  • 0 < Disks ≤ 8
  • DIMMs ≤ 16

35°C (95°F)

Intel® Xeon® 3100, 4100, 5100, 6100, and 8100 processors (165 W and lower)

  • Disks ≤ 12
  • DIMMs ≤ 16

35°C (95°F)

NOTE:

For details about CPU models, see the Server Compatibility Checker.

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Updated: 2019-01-08

Document ID: EDOC1100033003

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