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ME60 V800R010C10SPC500 Hardware Description

This is ME60 V800R010C10SPC500 Hardware Description
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Huawei uses machine translation combined with human proofreading to translate this document to different languages in order to help you better understand the content of this document. Note: Even the most advanced machine translation cannot match the quality of professional translators. Huawei shall not bear any responsibility for translation accuracy and it is recommended that you refer to the English document (a link for which has been provided).
Overview

Overview

This chapter describes the appearance and structure of boards and subcards, filler panel, board and subcard specifications, rules for numbering slots and interfaces.

Board Structure

This section describes the appearance and structure of boards and subcards.

  • Structure of the integrated board
    The integrated board on the ME60 is a plug-in board and consists of the circuit board, connector, heat sinks, interface panel, ejector lever, and captive screws, as shown in Figure 10-1.
    Figure 10-1 Structure of the integrated board

    1. Captive screw 2. Interfaces 3. Ejector lever 4. Protection cover
  • Structure of the flexible board
    A flexible board consists of two parts:
    • Motherboard

    • Flexible subcard

    • Structure of the motherboard

      The flexible board is a plug-in board and consists of the circuit board, connector, heat sinks, interface panel, ejector lever, and captive screws, as shown in Figure 10-2.

      Figure 10-2 Structure of the flexible board

      1. Captive screw 2. Subcard slots 3. Ejector lever 4. Protection cover
    • Flexible subcard

      The flexible subcard is a plug-in board and consists of the circuit board, connector, heat sinks, interface panel, ejector lever, and captive screws, as shown in Figure 10-3.

      Figure 10-3 Structure of the flexible subcard

      1. Captive screw 2. Ejector lever 3. Interfaces 4. Heat sinks 5. Connector 6. Circuit board

Board and Subcard Specifications

This section describes the board and subcard specifications.

Height, Width, and Depth

Figure 10-4 and Figure 10-5 show the height, width, and depth.

Figure 10-4 Board

Figure 10-5 Subcard

Subcard Specifications

There are three subcard specifications.

  • Full-dimensional subcard (1H, 1W)
    Only one full-dimensional subcard (1H, 1W) can be installed on an LPU motherboard, as shown in Figure 10-6.
    Figure 10-6 Full-dimensional subcard (1H, 1W)

  • Full-height half-width subcard (1H, 1/2W)
    Two full-height half-width subcards (1H, 1/2W) can be installed on an LPU motherboard, as shown in Figure 10-7.
    Figure 10-7 Full-height half-width subcard (1H, 1/2W)

  • Half-height half-width subcard (1/2H, 1/2W)
    Four half-height half-width subcards (1/2H, 1/2W) can be installed on an LPU motherboard, as shown in Figure 10-8.
    Figure 10-8 Half-height half-width subcard (1/2H, 1/2W)

Filler Panel

The filler panel can be used to fill the idle board or subcard slots to ensure normal device operations.

Filler Panel Appearance

A filler panel does not house any indicators, interfaces, circuit boards, heat sinks, or connectors.

Figure 10-9 shows the appearance of various board and subcard filler panels.

Figure 10-9 Filler panel appearance

Filler Panel Functions

The main functions of a filler panel are described as follows:

  • Provides electromagnetic shielding performance to protect the chassis against electromagnetic radiation.
  • Fills the idle slots to ensure normal operation of the heat dissipation system.
  • Frees the chassis from dust.
  • Covers the internal circuits.

Example

All the LPU slots on the chassis are equipped with filler panels by default. One filler panel is removed only when a board is to be installed in the slot.

Use the ME60-X8 as an example. Figure 10-10 shows how filler panels are installed on the chassis.

Figure 10-10 Filler panels on the ME60-X8

Rules for Numbering Slots and Interfaces

This section describes the rules for numbering slots and interfaces.

Numbering rules

  • Slots are numbered in left-right and top-down order. The slot number is marked on the slots.

    Use the ME60-X8 as an example. Slot numbers start from 1 and range from 1 to 8, as shown in Figure 10-11.

    Figure 10-11 Slot layout on the ME60-X8

  • Slot numbers

    The slot numbers start from 0. Figure 10-12, Figure 10-13, and Figure 10-14 show the numbering rules.

    Figure 10-12 Numbering rules for the full-dimensional subcard (1H, 1W)

    Figure 10-13 Numbering rules for the full-height half-width subcard (1H, 1/2W)

    Figure 10-14 Numbering rules for the half-height half-width subcard (1/2H, 1/2W)

  • Interface number

    Interfaces are numbered from 0 in left-right and top-down order.

    Interfaces are arranged in a single row or two rows. Figure 10-15 shows how interfaces are numbered.

    Figure 10-15 Interface numbers

Example for Naming Interfaces

Interfaces are named in the format of LPU slot/FPIC slot/interface number.

Use the ME60-X8 as an example. As shown in Figure 10-16, the LPU slot number is 7, the FPIC slot number is 1, and the interface number is 2. Therefore, the interface is named 7/1/2.

Figure 10-16 Interface numbers

NOTE:
  • If the LPU is a fixed interface board, the FPIC slot number is considered 0.
  • If the LPU slot number is special, use the actual board information to name the interface.

Bar Code for Boards

The bar code of a board is provided on the front panel of the board and contains the basic information about the board, including the BOM code and delivery time.

The bar code of a board provides the feature information about the board and varies according to boards. Figure 10-17 shows a bar code and Table 10-1 provides the description of the bar code.

Figure 10-17 Bar code of a board

NOTE:

The bar code in the figure is only an example and it may differ in practice.

Table 10-1 Description of the bar code of a board

Item

Description

Type Code

Indicates whether a board is a manufactured or finished board. "02" indicates a manufactured board and "03" indicates a finished board.

BOM Code

Indicates the last four digits of the BOM code of a board.

Vendor

Indicates the vendor of a board. "10" indicates Huawei.

Manufacture Year

Indicates the last digit of the year when a board is manufactured. For example, "4" indicates 2004. From 2010 onwards, a letter is used to indicate the manufacture year. For example, the letter A indicates 2010, the letter B indicates 2011, and so on.

Manufacture Month

Indicates the month when a board is manufactured. The value is expressed in hexadecimal format. For example, the letter B indicates November.

Serial Number

Indicates the production serial number of a board. The value ranges from 000001 to 999999.

Environmental Protection Property

Indicates the environmental protection property of a board.

Board Name

Indicates the name and associated information about a board.

Board Indicators

Indicators are present on the front panel of each board. This section describes the common indicators. For details about the indicators, see the corresponding board description page.

Table 10-2 Descriptions of MPU indicators
Indicator Name Color Status Description

OFL

Offline indicator

Red

On

The board can be removed.

RUN

Running status indicator

Green

Blinking once every 2s (0.5 Hz)

The system is running properly.

Green

Off > blinking quickly > steady on > blinking quickly > steady on > blinking slowly (0.5 Hz)

The board has not completed registration.

ALM

Alarm indicator

Red

On

An alarm is generated.

Red

Off

No alarm is generated.

ACT

ACT indicator

Green

On

The board functions as the master one.

Green

Off

The board functions as the slave one.

L/A

LINK/ACT indicator

-

On

The link is Up.

-

Blinking

Data is being transmitted or received.

-

Off

The link is Down.

CF ACT

CF ACT indicator

Green

On

The CF card is properly installed.

Green

Blinking

Data is being read or written.

Green

Off

You can remove the CF card or the CF card is not installed.

Table 10-3 Descriptions of SFU indicators
Indicator Name Color Status Description

RUN

Running status indicator

Green

Blinking once every 2s (0.5 Hz)

The system is running properly.

Green

Blinking twice every second (2 Hz)

The board has not completed registration.

ACT

ACT indicator

Green

On

The board is working properly.

Green

Off

The board is faulty.

OFL

Offline indicator

Red

On

The board is powered off.

Red

Off

The board is working properly.

Table 10-4 Descriptions of LPU/SPU indicators
Indicator Name Color Status Description

OFL

Offline indicator

Red

On

You can remove the board.

Note: If the indicator turns off 3s after turning on for SP80 or SP160, the board can be removed.

L/A, LINK/ACT

LINK/ACT indicator

Green

On

The link is Up.

Blinking

Data is being transmitted or received.

Off

The link is Down.

RUN, STATUS, STA

Status indicator

Green

Blinking once every 2s (0.5 Hz)

The system is running properly.

Green

Blinking twice every second (2 Hz)

The board has not completed registration.

Breakout

Breakout indicator for channels

Green

On

Breakout 0-X: breakout indicator. If breakout indicator X is on, the interface indicators are showing the running status of breakout channel X. For example, if breakout indicator 0 is on, interface indicators are showing the running status of breakout channel 0 (if an interface indicator is blinking, breakout channel 0 on this interface is receiving and transmitting data); if breakout indicator 1 is on, interface indicators are showing the running status of breakout channel 1.

If the board has breakout interfaces, each breakout indicator for channels 0 to X turns on for 5s in sequence to indicate the status of the corresponding channel. To rapidly identify the running status of a specific breakout channel, press the Breakout button to switch to your desired indicator. For example, if you want to check the running status of breakout channel 1 on each interface, press the Breakout button to have breakout indicator 1 turns on.

Green

Off

There is no breakout interface.

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Updated: 2019-01-04

Document ID: EDOC1100059474

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