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ME60 V800R010C10SPC500 Hardware Description

This is ME60 V800R010C10SPC500 Hardware Description
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Huawei uses machine translation combined with human proofreading to translate this document to different languages in order to help you better understand the content of this document. Note: Even the most advanced machine translation cannot match the quality of professional translators. Huawei shall not bear any responsibility for translation accuracy and it is recommended that you refer to the English document (a link for which has been provided).
Heat Dissipation System of the ME60-X3

Heat Dissipation System of the ME60-X3

System Air Channel

The ME60-X3 supports one fan module. Each fan module consists of two fans.

The ME60-X3 draws in air from the left and exhausts air from the rear. The air intake vent is located at the left side of the chassis and the air exhaust vent is located at the rear of the chassis.

The fan module of the ME60-X3 is located at the air exhaust vent. The system draws in air for heat dissipation, as shown in Figure 9-1 and Figure 9-2.

Figure 9-1 Air flow in the ME60-X3 DC chassis

Figure 9-2 Air flow in the ME60-X3 AC chassis

The heat dissipation system consists of the following components:

  • One fan module

  • An air intake vent and an air exhaust vent

  • An air filter

  • Fans on power modules

Fan Speed Adjustment

When the system is fully configured, temperatures reported by the temperature sensors on the Interface boards and MPUs serve as the basis for fan speed adjustment. Table 9-1 lists general principles.

Table 9-1 Fan Speed Adjustment Principles
Ambient Temperature Rotational Speed Noise and Dissipation StandardsSR
-5°C - +27°C (23°F - 80.6°F) Low speed (50% rotational speed) When fans rotate at a constantly low speed, the noises meet the ETSI standard and the fans meet heat dissipation requirements of a fully configured system.
27°C - 45°C (80.6°F - 113°F) Linear variation The fan speed is adjusted smoothly in linear mode, without a sharp increase in noises.
Over 45°C (113°F) High speed (100% rotational speed) Fans rotate at high speed to meet heat dissipation requirements.

Fan Module

The fan module is located in the rear of the chassis, used for ventilation and heat dissipation of boards. The fan module consists of a fan tray, two fans, and a fan control board (FCB).


Table 9-2 Fan attributes




Fan Box





Table 9-3 Mapping products and versions


Earliest Software Version




Figure 9-3 Appearance of the fan module on the ME60-X3

Figure 9-4 shows the panel of the fan module on the ME60-X3

Figure 9-4 Panel of the fan module on the ME60-X3


Table 9-4 Description of indicators on the fan module


Status Description



If the indicator blinks, the fan module is working properly.


If the indicator blinks, the fan module or PEM fails.

Technical Specifications

Table 9-5 Technical specifications



Dimensions (H x W x D)

223.4mm x 170.4mm x 115.2mm (8.79 in. x 6.70 in. x 4.53 in.)


1.5kg (3.30 lb)

Fan quantity


Power consumption

55°C Ambient temperature: 210W

25°C Ambient temperature: 55W


Meets the ETSI requirements (<72dBA @ 23 °C)

Air Filter

The air filter of the ME60-X3 is located on the left rear of the chassis, as shown in Figure 9-5.

Figure 9-5 Air filter on the ME60-X3 air intake frame


The air filter of the ME60-X3 can be bent, which facilitates the maintenance within a limited space in the rear of the chassis.

Updated: 2019-01-04

Document ID: EDOC1100059474

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