RAS Config
This section describes how to configure the memory RAS on the RAS Config screen.
Figure 4-31 shows the RAS Config screen. Table 4-21 describes the parameters.
Parameter |
Description |
Default Value |
---|---|---|
Support RAS |
Enables or disables the memory/PCIe/CPU RAS function. The options are as follows:
|
Enable |
Support FDM |
Enables or disables the memory/PCIe/CPU FDM function. After this function is enabled, the BIOS reports the CPU bus information, system platform information, and TF address segment of the ARM server in the startup phase. For the address information recorded in the ARER core or cache, the BMC needs to translate the address. The BIOS reports the memory address information to the BMC in the startup phase. The options are as follows:
NOTE:
This parameter is unavailable when Support RAS is set to Disable. |
Enable |
Memory RAS Config |
Provides access to RAS configuration. NOTICE:
When the BBU is in position, modifying parameters on the Memory RAS Config screen will cause data loss in the battery-protected memory. |
N/A |
PCIe RAS Config |
Provides access to PCIe RAS configuration. NOTE:
This menu item is unavailable when Support RAS is set to Disable. |
N/A |
CPU RAS Config |
Provides access to CPU RAS configuration. NOTE:
|
- |
Figure shows the Memory RAS Config screen. Table 4-22 describes the parameters.
When the BBU is in position, modifying parameters on the Memory RAS Config screen will cause data loss in the battery-protected memory.
Parameter |
Description |
Default Value |
---|---|---|
Poison |
Enables or disables an identifier. The options are as follows:
|
Enable |
Active Scrub |
Enables or disables the inspection. The options are as follows:
|
Enable |
Active Scrub Interval |
Sets the inspection period. The value ranges from 0 to 24 hours. The value 0 indicates automatic inspection. |
24 |
Passive Scrub |
Enables or disables the passive inspection. The options are as follows:
|
Enable NOTE:
The default value of this parameter varies depending on the server or BIOS version. |
AB check |
Enables or disables AB check. The options are as follows:
|
Disable |
First Error Correction Interval |
Sets the first error correction interval. The value ranges from 0 to 1440 minutes. NOTE:
This parameter is available only when AB check is set to Enable. |
10 |
Same memory check interval |
Sets the interval between two error correction detections for the same DIMM. The value ranges from 0 to 1440 minutes. NOTE:
This parameter is available only when AB check is set to Enable. |
10 |
Page Isolation |
Isolates the memory addresses that have ever generated UE errors. A maximum of 16 memory addresses can be isolated. The options are as follows:
|
Disable |
Correct Error handle |
Provides access to correctable error configuration. NOTE:
This menu is displayed when Support RAS is set to Enable. |
N/A |
Figure 4-33 shows the Correct Error handle screen. Table 4-23 describes the parameters.
Parameter |
Description |
Default Value |
---|---|---|
Correct Error Threshold |
Sets the correctable error threshold. The value ranges from 1 to 8000. |
6000 |
Funnel Period |
Sets the funnel function period. The options are as follows:
|
Enable |
Advanced Device Correction |
Sets the solution of error threshold warning. The options are as follows:
NOTE:
|
Disable |
Figure 4-34 shows the PCIe RAS Config screen. Table 4-24 describes the parameters.
Parameter |
Description |
Default Value |
---|---|---|
ECRC Feature |
Enables or disables the ECRC verification function. The options are as follows:
|
Disable |
Hot-Plug |
Enables or disables the PCIe hot swap function. The options are as follows:
NOTE:
|
Enable |
Figure 4-35 shows the CPU RAS Config screen. Table 4-25 describes the parameters.
- TaiShan 200 Pro server (model 2480)
- TaiShan 200 Pro server (model 2280) configured with Kunpeng 920 5225 processors