Overview of the Heat Dissipation System

The heat dissipation system of CloudEngine 16800 series switches consists of fan modules and a chassis door.

• Fan modules installed at the rear of the device cool the MPUs, LPUs, and SFUs in the chassis through front-to-back airflow (from the perspective of the cabinet), ensuring a normal operating temperature range for the chassis.

  Power modules have their own fans, which take the heat generated by power modules out of the chassis through front-to-back airflow. These fans ensure that the power modules work in a normal temperature range.

• The chassis door is optional and installed at the front of the chassis to shield electromagnetic noise. The door also can prevent dust from entering the chassis with airflows so that the chassis can work properly.

Cover vacant power module and card slots with filler panels to ensure efficient heat dissipation and EMC compliance.

Heat Dissipation of Cards

The MPUs, LPUs, and SFUs use a front-to-back airflow design.

1. Front panels of the MPUs and LPUs have air holes. Cold air flows from these air holes into the MPUs and LPUs.
2. Cool air flows through the MPUs and LPUs to the SFUs.
3. Hot air flows through the SFUs and is exhausted from the chassis by fan modules.

Figure 5-1 shows the airflow for heat dissipation of the MPUs, LPUs, and SFUs.

Figure 5-1 Airflow for heat dissipation of the MPUs, LPUs, and SFUs (side view)

Heat Dissipation of Power Modules

The power modules use a front-to-back airflow design.

1. There are air holes on power module panels. Cold air flows into the power modules from these holes and is blown through the power module area by built-in fans of the power modules.
2. Cold air becomes hot air, passes through the power backplane, and goes out of the chassis from holes on the PEM.

Figure 5-2 shows the airflow for heat dissipation of power modules.

Figure 5-2 Airflow for heat dissipation of power modules (side view)