Installing a Processor
- Only Huawei technical support or personnel authorized by Huawei can install the processors from Huawei servers.
- Do not wear ESD gloves during processor replacement. The gloves may catch on pins on the processor socket and damage it.
- The same model of processors must be used in a server.
- Before installing a processor, clean the surface of the processor, the heat sink, and the processor carrier. If there is residual thermal compound, use a tissue to clean it.
Procedure
- Power off the server.
For details, see Power-Off Procedure.
- Remove the power cables from the PSUs.
For details, see Removing PSU Cables.
- Remove the server.
For details, see Removing the Server.
- Place the server on the ESD workstation.
- Remove the chassis cover.
For details, see Removing the Chassis Cover.
- Remove the air duct or built-in drive module.
For details, see Removing the Air Duct or Removing the Built-in Drive Module.
- Take the spare part out of its ESD bag.
- Determine the position of the processor.Figure 8-95 Positions of processors
- Install the processor on the carrier.
- Take a processor carrier out of an ESD bag.
- Aligning the notch in one edge of the processor with the protrusion on the processor carrier, secure it.
Ensure that the processor corner with a triangle mark is in the corner of the processor carrier with a notched triangle.
Figure 8-96 Installing one end of the processor - Bend the other edge of the processor carrier in the arrow direction.Figure 8-97 Installing the other end of the processor
- Release the processor carrier so that the other edge of the processor clips into place.
- Check that the processor and the carrier are level and the processor is firmly secured. If the processor is tilted, press the tilted part to fasten it.
- Apply thermal compound.
- Determine the area on the processor that will be in contact with the heat sink, and evenly apply 0.4 ml of thermal compound on the area.
- When applying thermal compound, place the processor carrier on the desktop.
- The thermal compound injector has volume marks.
The two-line, five-dot, s-shape, and X-shape patterns are recommended.
Figure 8-98 Pasting patterns - Use a clean card or blade to smear the thermal compound over the entire center of the CPU.
The thickness of the thermal compound is about that of a piece of ordinary paper. Ensure that the thermal compound is evenly and fully coated.
Figure 8-99 Smeared thermal compound layer
- Determine the area on the processor that will be in contact with the heat sink, and evenly apply 0.4 ml of thermal compound on the area.
- Install the processor carrier to the heat sink.
- Aligning the processor corner with a triangle mark with the corner of the heat sink with a notched triangle, buckle the processor carrier on the heat sink.Figure 8-100 Installing the processor carrier
- Place the assembled processor and heat sink upside down on the desk, and check that the processor carrier and the heat sink are firmly secured. If the processor carrier is not firmly buckled with the heat sink, press the processor carrier to secure it.Figure 8-101 Checking the assembly
- Aligning the processor corner with a triangle mark with the corner of the heat sink with a notched triangle, buckle the processor carrier on the heat sink.
- Install the processor and heat sink.
- Remove the processor socket cover.
When removing the socket cover, keep it parallel with the board to prevent damage to pins.
Figure 8-102 Removing the processor socket cover - Shine a light at various angles onto the processor socket to check for twisted pins, foreign matter, and pad damage.
If bent pins or foreign matters are found or the bonding pad is damaged, stop the operation and contact Huawei technical support.
- Horizontally holding the processor and heat sink, align the notched corner on the heat sink with the notched corner on the processor socket, and place the processor and heat sink downwards on the socket along the guide sleeves.
Keep the processor and heat sink parallel with the mainboard to prevent damage to processor socket pins.
- Use a Phillips screwdriver to tighten the two diagonal screws (marked 1 on the label) on the heat sink. See (1) in Figure 8-103.
- Use a Phillips screwdriver to tighten the four screws (marked 2 in the label) in the middle of the heat sink in a diagonal sequence. See (2) in Figure 8-103.
- Remove the processor socket cover.
- Install the air duct or built-in drive module.
For details, see Installing the Air Duct or Installing the Built-in Drive Module.
- Install the chassis cover.
For details, see Installing the Chassis Cover.
- Install the server.
For details, see Installing a Server.
- Connect the power cables to the PSUs.
For details, see Connecting PSU Cables.
- Power on the server.
For details, see Power-On Procedure.
- Log in to the iBMC WebUI, and check whether the new component is normal.
For details, see Atlas 800 Inference Server iBMC User Guide (Model 3010).