NE5000E Hardware Guide (V800R022C00 to V800R024C00SPC100) (pdf)

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Published On：2025-05-16

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HUAWEI NE5000E Series
V800R022C00 to V800R024C00SPC100
Hardware Guide

Issue 04
Date 2025-04-30

HUAWEI TECHNOLOGIES CO., LTD.

Copyright © Huawei Technologies Co., Ltd. 2025. All rights reserved.
No part of this document may be reproduced or transmitted in any form or by any means without prior
written consent of Huawei Technologies Co., Ltd.

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and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.
All other trademarks and trade names mentioned in this document are the property of their respective
holders.

Notice
The purchased products, services and features are stipulated by the contract made between Huawei and
the customer. All or part of the products, services and features described in this document may not be
within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements,
information, and recommendations in this document are provided "AS IS" without warranties, guarantees
or representations of any kind, either express or implied.

The information in this document is subject to change without notice. Every effort has been made in the
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Huawei Technologies Co., Ltd.

Address: Huawei Industrial Base
Bantian, Longgang
Shenzhen 518129
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Website: https://www.huawei.com
Email: support@huawei.com

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Hardware Guide Contents

Contents

1 Document Declaration........................................................................................................... 1
2 Using the Hardware Tool.......................................................................................................4
3 Hardware Description.............................................................................................................5
3.1 NE5000E CLC Hardware Description................................................................................................................................ 5
3.1.1 Product Signal Flow Overview........................................................................................................................................ 5
3.1.1.1 General Service Process Overview.............................................................................................................................. 5
3.1.1.2 Signal Flow on the Control Plane............................................................................................................................... 7
3.1.1.3 Signal Flow on the Data Plane.................................................................................................................................... 9
3.1.1.4 Signal Flow on the Monitoring Plane..................................................................................................................... 12
3.1.2 Chassis................................................................................................................................................................................... 13
3.1.2.1 NE5000E-X16A................................................................................................................................................................ 13
3.1.2.2 NE5000E-X16B................................................................................................................................................................ 29
3.1.2.3 NE5000E-20..................................................................................................................................................................... 42
3.1.3 Power..................................................................................................................................................................................... 52
3.1.3.1 NE5000E-X16A Power Supply System.....................................................................................................................52
3.1.3.1.1 Overview........................................................................................................................................................................ 52
3.1.3.1.2 System Power Supply Architecture....................................................................................................................... 56
3.1.3.1.3 PDC-2200WB (PSU-PDC-2200WB-PM2200W DC Power Supply)............................................................. 56
3.1.3.1.4 DC PEM.......................................................................................................................................................................... 61
3.1.3.1.5 PAC-2700WB (2700W AC Power module).........................................................................................................62
3.1.3.1.6 AC PEM...........................................................................................................................................................................66
3.1.3.1.7 PHD-3000WA (3000W AC&HVDC Power Module)........................................................................................ 67
3.1.3.1.8 AC&HVDC PEM............................................................................................................................................................70
3.1.3.1.9 Switch............................................................................................................................................................................. 72
3.1.3.1.10 PMUA........................................................................................................................................................................... 73
3.1.3.1.11 Power System Technical Specifications.............................................................................................................74
3.1.3.2 NE5000E-X16B Power Supply System..................................................................................................................... 76
3.1.3.2.1 Overview........................................................................................................................................................................ 76
3.1.3.2.2 System Power Supply Architecture....................................................................................................................... 80
3.1.3.2.3 PDC-2200WB (PSU-PDC-2200WB-PM2200W DC Power Supply)............................................................. 82
3.1.3.2.4 DC PEM.......................................................................................................................................................................... 87
3.1.3.2.5 AC PEM...........................................................................................................................................................................88

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3.1.3.2.6 PHD-3000WA (3000W AC&HVDC Power Module)........................................................................................ 89
3.1.3.2.7 AC&HVDC PEM............................................................................................................................................................93
3.1.3.2.8 Switch............................................................................................................................................................................. 94
3.1.3.2.9 PMU.................................................................................................................................................................................95
3.1.3.2.10 Power System Technical Specifications.............................................................................................................96
3.1.3.3 NE5000E-20 Power Supply System.......................................................................................................................... 98
3.1.3.3.1 Overview........................................................................................................................................................................ 98
3.1.3.3.2 System Power Supply Architecture.................................................................................................................... 104
3.1.3.3.3 PDC-2200WC (PSU-PDC-2200WC-PM2200W DC Power Supply)........................................................... 106
3.1.3.3.4 Dual-input DC PEM................................................................................................................................................. 111
3.1.3.3.5 PAH-3000WA (02312JEA: 3000W Dual Inputs AC&HVDC Power Module)......................................... 112
3.1.3.3.6 Dual-Input AC & HVDC PEM................................................................................................................................119
3.1.3.3.7 Switch........................................................................................................................................................................... 120
3.1.3.3.8 Power System Technical Specifications.............................................................................................................121
3.1.4 Fan........................................................................................................................................................................................123
3.1.4.1 NE5000E-X16A Heat Dissipation System............................................................................................................ 123
3.1.4.1.1 System Air Channel................................................................................................................................................. 123
3.1.4.1.2 Fan Speed Adjustment........................................................................................................................................... 125
3.1.4.1.3 E000FBX08 (Fan Box)............................................................................................................................................. 126
3.1.4.1.4 Air Filter....................................................................................................................................................................... 128
3.1.4.2 NE5000E-X16B Heat Dissipation System.............................................................................................................129
3.1.4.2.1 System Air Channel................................................................................................................................................. 129
3.1.4.2.2 Fan Speed Adjustment........................................................................................................................................... 131
3.1.4.2.3 E000FBX08 (Fan Box)............................................................................................................................................. 132
3.1.4.2.4 Noise Reduction Module....................................................................................................................................... 134
3.1.4.2.5 Air Filter....................................................................................................................................................................... 136
3.1.4.3 NE5000E-20 Heat Dissipation System..................................................................................................................137
3.1.4.3.1 System Air Channel................................................................................................................................................. 137
3.1.4.3.2 Rotational Speed Adjustment Policy................................................................................................................. 140
3.1.4.3.3 CR9M000FBX64 (Fan Tray Assembly T 2.0).................................................................................................... 140
3.1.4.3.4 CR9M000FBX65 (FAN BOX B)..............................................................................................................................143
3.1.4.3.5 Air Filter....................................................................................................................................................................... 144
3.1.5 Boards................................................................................................................................................................................. 145
3.1.5.1 Overview......................................................................................................................................................................... 145
3.1.5.1.1 Board Structure......................................................................................................................................................... 145
3.1.5.1.2 Board and Subcard Specifications...................................................................................................................... 148
3.1.5.1.3 Filler Panel.................................................................................................................................................................. 150
3.1.5.1.4 Rules for Numbering Slots and Interfaces.......................................................................................................153
3.1.5.1.5 Board Indicators........................................................................................................................................................156
3.1.5.2 MPU..................................................................................................................................................................................161
3.1.5.2.1 CR5D0MPUB560 (NE5000E Main Processing Unit B5)...............................................................................161
3.1.5.2.2 CR5D0MPUB661 (NetEngine5000E,CR56MPUB62,Main Processing Unit B6).................................... 166

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3.1.5.2.3 CR5D0MPUN160 (NE5000E-20 Main Processing Unit N1(MPUN1))....................................................172
3.1.5.2.4 CR5D0MPUQ1D1 (NE5000E-20 Main Processing Unit Q1(MPUQ1))...................................................176
3.1.5.3 SFU................................................................................................................................................................................... 180
3.1.5.3.1 CR5D0SFUT060 (1T Switch Fabric Unit A(SFUI-1T))...................................................................................180
3.1.5.3.2 CR5DSFUIK06A (400G Switch Fabric Unit A for Single Chassis(SFUI-400-A))................................... 184
3.1.5.3.3 CR5DSFUIK06B (400G Cluster Access Switch Fabric Unit(SFUI-400-B)).............................................. 187
3.1.5.3.4 CR5DSFUIT06E (1T Switch Fabric Unit E for Single Chassis(SFU-1T-E)).............................................. 191
3.1.5.3.5 CR5DSFUIT06H (1T CLC Integrated Switch Fabric Unit for Multi-Chassis (SFUI-1T-H))................ 195
3.1.5.3.6 CR5DSFUIT260 (NE5000E-20 1.6T CLC Switch Fabric Unit D for Single Chassis(SFU-1T6-D)).... 198
3.1.5.3.7 CR5DSFUIT26A (2T Switch Fabric Unit A(SFU-2T-A)).................................................................................201
3.1.5.3.8 CR5DSFUIT26H (NE5000E-20 1.6T CLC Integrated Switch Fabric Unit for Multi-Chassis
(SFUI-1T6-H))............................................................................................................................................................................. 204
3.1.5.4 CMU................................................................................................................................................................................. 208
3.1.5.4.1 CR9D000CMU61 (Centralized Monitoring Module B)................................................................................ 208
3.1.5.4.2 CR9D000CMU62 (Centralized Monitoring Module C)................................................................................ 211
3.1.5.5 LPUF-400........................................................................................................................................................................ 213
3.1.5.5.1 CR5DLPUFK061 (400G Flexible Card Line Processing Unit(NE5000E LPUF-400,2 sub-slots))......213
3.1.5.6 LPUI-400......................................................................................................................................................................... 215
3.1.5.6.1 CR5D00LKXF6P (40-Port 10GBase LAN/WAN-SFP+ Integrated Line Process Unit (NE5000E
LPUI-400-CM))........................................................................................................................................................................... 215
3.1.5.7 LPUI-480......................................................................................................................................................................... 218
3.1.5.7.1 CR5D00LMXF61 (48-Port 10GBase LAN/WAN-SFP+ Integrated Line Process Unit(NE5000E
LPUI-480))....................................................................................................................................................................................218
3.1.5.8 LPUF-1T...........................................................................................................................................................................221
3.1.5.8.1 CR5DLPUFT060 (1T Flexible Card Line Processing Unit(NE5000E LPUF-1T-A,2 sub-slots))..........222
3.1.5.9 LPUI-1T............................................................................................................................................................................224
3.1.5.9.1 CR5D00E8NC60 (8-Port 100GBase LAN/WAN-CFP2 Integrated Line Process Unit(NE5000E
LPU-1T))....................................................................................................................................................................................... 224
3.1.5.10 LPUI-1T6....................................................................................................................................................................... 227
3.1.5.10.1 CR5D00E4KB61 (4-Port 400GBase QSFP-DD Integrated Line Process Unit CM(NE5000E
LPUI-1T6-CM))........................................................................................................................................................................... 227
3.1.5.10.2 CR5D00EDNB64 (16-Port 100GBase QSFP28 Integrated Line Process Unit CM(NE5000E
LPUI-1T6-CM))........................................................................................................................................................................... 231
3.1.5.10.3 CR5D00LRXF61 (72-Port 10GBase LAN/WAN-SFP+ Integrated Line Process Unit CM(NE5000E
LPUI-1T6-CM))........................................................................................................................................................................... 234
3.1.5.11 LPUI-2T......................................................................................................................................................................... 240
3.1.5.11.1 CR5D00EDNB60 (16-Port 100GBase QSFP28 Integrated Line Process Unit(NE5000E LPUI-2T))
......................................................................................................................................................................................................... 240
3.1.5.11.2 CR5D00EDNB6P (16-Port 100GBase-QSFP28 Integrated Line Process Unit (NE5000E LPUI-2T-
CM))............................................................................................................................................................................................... 243
3.1.5.12 CP100............................................................................................................................................................................ 246
3.1.5.12.1 CR5D00P8UF60 (8-Port OC-48c/12c/3c STM-16c/4c/1c POS-SFP Flexible Card(CP100,Occupy 1
sub-slot))...................................................................................................................................................................................... 246
3.1.5.13 CP400............................................................................................................................................................................ 249
3.1.5.13.1 CR5D00E1NC61 (1-Port 100GBase-CFP Flexible Card(CP400,Occupy 1 sub-slots))......................249

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3.1.5.13.2 CR5D00E2NB60 (2-Port 100G QSFP28 Flexible Card(CP400,Occupy 1 sub-slot))......................... 252
3.1.5.13.3 CR5D00E2NC61 (2-Port 100GBase-CXP Flexible Card(CP400,Occupy 1 sub-slot))....................... 255
3.1.5.13.4 CR5D00E2NC62 (2-Port 100GBase LAN CFP2 Flexible Card(CP400-A))............................................258
3.1.5.13.5 CR5D00E5MF61 (5-Port 40GBase-QSFP+ Flexible Card(CP400,Occupy 1 sub-slot)).................... 261
3.1.5.13.6 CR5D00LEXF61 (20-Port 10GBase LAN/WAN-SFP+ Flexible Card B(CP400,Occupy 2 sub-slots))
......................................................................................................................................................................................................... 263
3.1.5.13.7 CR5D00N2NC61 (2-Port 100G OTN/ETH-CFP2 Flexible Card(CP400,Occupy 1 sub-slot))......... 266
3.1.5.13.8 CR5D00NBGF60 (12-Port 10G OTN/ETH-SFP+ Flexible Card(CP400,Occupy 1 sub-slot)).......... 270
3.1.5.13.9 CR5D00P4XX60 (4-Port OC-192c/STM-64c POS-XFP Flexible Card(CP400,Occupy 1 sub-slot))
......................................................................................................................................................................................................... 273
3.1.5.14 CP1T............................................................................................................................................................................... 275
3.1.5.14.1 CR5D00E4NB60 (4-Port 100GBase QSFP28 Flexible Card(CP1T,Occupy 1 sub-slot))................... 275
3.1.5.14.2 CR5D00LFXF60 (24-Port 10GBase LAN/WAN SFP+ Flexible Card(CP1T,Occupy 1 sub-slot)).....278
3.1.5.14.3 CR5D00LMXB60 (48-Port 10GBase LAN/WAN QSFP+ Sharp Flexible Card(CP1T, Occupy 1 sub-
slot))...............................................................................................................................................................................................281
3.1.5.14.4 CR5D00N4NC60 (4-Port 100G OTN/ETH CFP4 Flexible Card(CP1T,Occupy 1 sub-slot)).............285
3.1.6 Fiber Breakout.................................................................................................................................................................. 288
3.1.6.1 Breakout Fibers.............................................................................................................................................................288
3.1.6.2 Breakout Boxes............................................................................................................................................................. 292
3.1.6.2.1 Product Overview..................................................................................................................................................... 292
3.1.6.2.2 10-Port-MPO-12-40-Port-LC-Breakout Box(single-mode)........................................................................ 293
3.2 NE5000E Cluster Hardware Description..................................................................................................................... 295
3.2.1 NE5000E Cluster.............................................................................................................................................................. 295
3.2.1.1 Overview......................................................................................................................................................................... 296
3.2.1.2 NE5000E Single-chassis............................................................................................................................................. 300
3.2.1.2.1 NE5000E-X16A Chassis...........................................................................................................................................301
3.2.1.2.2 NE5000E-20 Chassis................................................................................................................................................ 302
3.2.1.3 CCC-0 System................................................................................................................................................................ 303
3.2.1.3.1 Overview..................................................................................................................................................................... 304
3.2.1.3.2 Inter-chassis Connections in a CCC-0 System.................................................................................................307
3.2.1.4 CCC-2 System................................................................................................................................................................ 313
3.2.1.4.1 Overview of CCC-2 consisting of 400G CCCs................................................................................................. 313
3.2.1.4.2 Inter-chassis Connections in a CCC-2 System That Consists of 400G CCCs.........................................315
3.2.1.4.3 CCC-2 System Consisting of 400G/1T CCC-As................................................................................................316
3.2.1.4.4 Inter-chassis Connections in a CCC-2 System Consisting of 400G/1T CCC-As....................................318
3.2.1.4.5 Overview of a CCC-2 System with 1T CCC-As................................................................................................334
3.2.1.4.6 Inter-Chassis Connections in a CCC-2 System with 1T CCC-As................................................................ 337
3.2.1.4.7 Overview of a CCC-2 Cluster Consisting of 1.6T CCC-As............................................................................346
3.2.1.4.8 Inter-Chassis Connections in a CCC-2 System Consisting of 1.6T CCC-As............................................349
3.2.1.5 Stratum-3 Clock Deployment.................................................................................................................................. 353
3.2.1.5.1 Stratum-3 Clock Deployment in CCC-0............................................................................................................ 355
3.2.1.5.2 Stratum-3 Clock Deployment in CCC-2............................................................................................................ 358
3.3 NE5000E CCC Hardware Description...........................................................................................................................361

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3.3.1 Chassis................................................................................................................................................................................ 361
3.3.1.1 NE5000E CCC................................................................................................................................................................ 361
3.3.1.2 NE5000E CCC-A............................................................................................................................................................367
3.3.2 Power Supply System.....................................................................................................................................................387
3.3.2.1 NE5000E CCC-A Power Supply System................................................................................................................ 387
3.3.2.1.1 Overview..................................................................................................................................................................... 387
3.3.2.1.2 System Power Supply Architecture.................................................................................................................... 393
3.3.2.1.3 PDC-2200WB (PSU-PDC-2200WB-PM2200W DC Power Supply)........................................................... 395
3.3.2.1.4 Single-input DC PEM...............................................................................................................................................400
3.3.2.1.5 PDC-2200WC (PSU-PDC-2200WC-PM2200W DC Power Supply)........................................................... 401
3.3.2.1.6 Dual-input DC PEM................................................................................................................................................. 406
3.3.2.1.7 PAC-2700WB (2700W AC Power module)...................................................................................................... 407
3.3.2.1.8 AC PEM........................................................................................................................................................................ 411
3.3.2.1.9 PHD-3000WA (3000W AC&HVDC Power Module)...................................................................................... 412
3.3.2.1.10 AC&HVDC PEM....................................................................................................................................................... 415
3.3.2.1.11 PAH-3000WA (02312JEA: 3000W Dual Inputs AC&HVDC Power Module).......................................417
3.3.2.1.12 Dual-Input AC & HVDC PEM............................................................................................................................. 423
3.3.2.1.13 Switch.........................................................................................................................................................................424
3.3.2.1.14 PMU............................................................................................................................................................................ 425
3.3.2.1.15 Power System Technical Specifications.......................................................................................................... 426
3.3.2.2 NE5000E CCC Power Supply System.....................................................................................................................429
3.3.2.2.1 Architecture of the Power Supply System....................................................................................................... 429
3.3.2.2.2 CR52-PWRB-DC (DC/DC Power Module,8000W,-5degC,55degC,-38V--75V,-36V--75V,Main Output
67.5A*3,Auxiliary -48V/13A,0A,I2C Communication).................................................................................................... 431
3.3.2.2.3 CR5B0PWRBX61 (Power Distribution Cabinet,220V,1PH,50/60Hz,0A)..................................................434
3.3.3 FAN...................................................................................................................................................................................... 435
3.3.3.1 NE5000E CCC-A Heat Dissipation System.......................................................................................................... 435
3.3.3.1.1 System Air Channel................................................................................................................................................. 435
3.3.3.1.2 Fan Speed Adjustment........................................................................................................................................... 438
3.3.3.1.3 E000FBX09 (Fan Tray Assembly,CR56FCBJ,Fan U)........................................................................................ 439
3.3.3.1.4 CR9M000FBX63 (Fan Tray Assembly 2.0)........................................................................................................ 441
3.3.3.1.5 CR9M000FBX64 (Fan Tray Assembly T 2.0).................................................................................................... 444
3.3.3.1.6 Air Filter....................................................................................................................................................................... 446
3.3.3.2 NE5000E CCC Heat Dissipation System...............................................................................................................448
3.3.3.2.1 System Air Channel................................................................................................................................................. 448
3.3.3.2.2 Fan Speed Adjustment........................................................................................................................................... 450
3.3.3.2.3 E000FBX06 (Fan Box,NE5000E Cluster,CR5E2TSRA,Fan Box,Front Fan Unit)......................................450
3.3.3.2.4 E000FBX05 (Fan Box,NE5000E Cluster,CR5E1TSRB,Fan Box,Rear Fan Unit)....................................... 452
3.3.3.2.5 Air Filter....................................................................................................................................................................... 453
3.3.4 Boards................................................................................................................................................................................. 454
3.3.4.1 MPU..................................................................................................................................................................................454
3.3.4.1.1 CR5D0MPUA750 (Cluster Central Main Processing Unit A7)................................................................... 454
3.3.4.1.2 CR5D0MPUA851 (NE5000E CCC-A Cluster Central Main Processing Unit A8).................................. 460

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3.3.4.1.3 CR5D0MPUB550 (NetEngine5000E Cluster Central Main Processing Unit B)....................................465
3.3.4.2 SFU................................................................................................................................................................................... 470
3.3.4.2.1 CR5DSFUFK050 (NetEngine5000E Cluster ,CR55SFUF400A,400G Cluster Central Switch Fabric
Unit)............................................................................................................................................................................................... 470
3.3.4.2.2 CR5DSFUFT050 (1T Cluster Central Switch Fabric Unit A(SFUF-1T-G))...............................................473
3.3.4.2.3 CR5DSFUIT250 (NE5000E CCC-A 1.6T Cluster Central Switch Fabric Unit G(SFUI-1T6-G))......... 477
3.3.4.3 ICU.................................................................................................................................................................................... 481
3.3.4.3.1 CR5D00ICUB50 (NetEngine5000E Cluster Internal Communication Unit B)......................................481
3.3.4.3.2 CR5D00ICUC52 (Cluster Internal Communication Unit C)........................................................................486
3.3.4.4 OFC................................................................................................................................................................................... 489
3.3.4.4.1 CR5D0OFCT050 (1T Cluster Optical Flexible Card)..................................................................................... 489
3.3.4.4.2 CR5M0OFCK050 (NetEngine5000E,400G Cluster Central Switch Flexible Optical Card)............... 495
3.4 Optical Module....................................................................................................................................................................499
3.4.1 Pluggable Optical Modules......................................................................................................................................... 499
3.4.1.1 Optical Module Structure......................................................................................................................................... 499
3.4.1.2 Optical Module Classification..................................................................................................................................500
3.4.1.3 Optical Module Appearance.................................................................................................................................... 502
3.4.1.4 How to Use an Optical Module..............................................................................................................................506
3.4.1.5 Optical Attenuator Configuration.......................................................................................................................... 517
3.4.2 Optical Amplifier Overview......................................................................................................................................... 519
3.4.2.1 Functions........................................................................................................................................................................ 519
3.4.2.2 Appearance and Structure........................................................................................................................................ 520
3.4.2.3 Application Scenario................................................................................................................................................... 521
3.4.2.4 Guide to Using Optical Amplifier........................................................................................................................... 522
3.4.3 155Mbps eSFP Optical Module.................................................................................................................................. 525
3.4.3.1 155Mbps-eSFP-SMF-1550nm-80km-commercial.............................................................................................526
3.4.3.2 155Mbps-eSFP-SMF-1310nm-40km-commercial.............................................................................................527
3.4.3.3 155Mbps-eSFP-MMF-1310nm-2km-commercial............................................................................................. 528
3.4.3.4 155Mbps-eSFP-SMF-1310nm-15km-commercial.............................................................................................529
3.4.4 622Mbps eSFP Optical Module.................................................................................................................................. 531
3.4.4.1 622Mbps-eSFP-SMF-1310nm-15km-commercial.............................................................................................531
3.4.4.2 622Mbps-eSFP-SMF-1310nm-40km-commercial.............................................................................................532
3.4.4.3 622Mbps-eSFP-SMF-1550nm-80km-commercial.............................................................................................533
3.4.5 1Gbps Electrical Module............................................................................................................................................... 534
3.4.5.1 1Gbps-SFP-100m-industry........................................................................................................................................535
3.4.6 1.25Gbps eSFP Optical Module.................................................................................................................................. 535
3.4.6.1 1.25Gbps-eSFP-MMF-850nm-500m-extended.................................................................................................. 535
3.4.6.2 1.25Gbps-eSFP-SMF-1550nm-100km-commercial.......................................................................................... 537
3.4.6.3 1.25Gbps-eSFP-SMF-1550nm-80km-commercial.............................................................................................538
3.4.6.4 1.25Gbps-eSFP-SMF-1310nm-10km-commercial.............................................................................................539
3.4.6.5 1.25Gbps-eSFP-SMF-1310nm-40km-commercial.............................................................................................540
3.4.7 125M~2.67Gbps eSFP DWDM Optical Module.................................................................................................... 542
3.4.7.1 125M~2.67Gbps-eSFP-SMF-1557.36nm-120km-commercial...................................................................... 542

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3.4.7.2 125M~2.67Gbps-eSFP-SMF-1556.55nm-120km-commercial...................................................................... 543
3.4.7.3 125M~2.67Gbps-eSFP-SMF-1555.75nm-120km-commercial...................................................................... 544
3.4.7.4 125M~2.67Gbps-eSFP-SMF-1554.94nm-120km-commercial...................................................................... 546
3.4.7.5 125M~2.67Gbps-eSFP-SMF-1554.13nm-120km-commercial...................................................................... 547
3.4.7.6 125M~2.67Gbps-eSFP-SMF-1553.33nm-120km-commercial...................................................................... 548
3.4.7.7 125M~2.67Gbps-eSFP-SMF-1552.52nm-120km-commercial...................................................................... 549
3.4.7.8 125M~2.67Gbps-eSFP-SMF-1551.72nm-120km-commercial...................................................................... 551
3.4.7.9 125M~2.67Gbps-eSFP-SMF-1550.92nm-120km-commercial...................................................................... 552
3.4.7.10 125M~2.67Gbps-eSFP-SMF-1550.12nm-120km-commercial.................................................................... 553
3.4.7.11 125M~2.67Gbps-eSFP-SMF-1549.32nm-120km-commercial.................................................................... 554
3.4.7.12 125M~2.67Gbps-eSFP-SMF-1548.51nm-120km-commercial.................................................................... 556
3.4.7.13 125M~2.67Gbps-eSFP-SMF-1547.72nm-120km-commercial.................................................................... 557
3.4.7.14 125M~2.67Gbps-eSFP-SMF-1546.92nm-120km-commercial.................................................................... 558
3.4.7.15 125M~2.67Gbps-eSFP-SMF-1546.12nm-120km-commercial.................................................................... 559
3.4.7.16 125M~2.67Gbps-eSFP-SMF-1545.32nm-120km-commercial.................................................................... 561
3.4.7.17 125M~2.67Gbps-eSFP-SMF-1544.53nm-120km-commercial.................................................................... 562
3.4.7.18 125M~2.67Gbps-eSFP-SMF-1543.73nm-120km-commercial.................................................................... 563
3.4.7.19 125M~2.67Gbps-eSFP-SMF-1542.94nm-120km-commercial.................................................................... 564
3.4.7.20 125M~2.67Gbps-eSFP-SMF-1542.14nm-120km-commercial.................................................................... 566
3.4.7.21 125M~2.67Gbps-eSFP-SMF-1541.35nm-120km-commercial.................................................................... 567
3.4.7.22 125M~2.67Gbps-eSFP-SMF-1540.56nm-120km-commercial.................................................................... 568
3.4.7.23 125M~2.67Gbps-eSFP-SMF-1539.77nm-120km-commercial.................................................................... 569
3.4.7.24 125M~2.67Gbps-eSFP-SMF-1538.98nm-120km-commercial.................................................................... 571
3.4.7.25 125M~2.67Gbps-eSFP-SMF-1538.19nm-120km-commercial.................................................................... 572
3.4.7.26 125M~2.67Gbps-eSFP-SMF-1537.40nm-120km-commercial.................................................................... 573
3.4.7.27 125M~2.67Gbps-eSFP-SMF-1536.61nm-120km-commercial.................................................................... 574
3.4.7.28 125M~2.67Gbps-eSFP-SMF-1535.82nm-120km-commercial.................................................................... 576
3.4.7.29 125M~2.67Gbps-eSFP-SMF-1535.04nm-120km-commercial.................................................................... 577
3.4.7.30 125M~2.67Gbps-eSFP-SMF-1534.25nm-120km-commercial.................................................................... 578
3.4.7.31 125M~2.67Gbps-eSFP-SMF-1533.47nm-120km-commercial.................................................................... 579
3.4.7.32 125M~2.67Gbps-eSFP-SMF-1532.68nm-120km-commercial.................................................................... 581
3.4.7.33 125M~2.67Gbps-eSFP-SMF-1531.90nm-120km-commercial.................................................................... 582
3.4.7.34 125M~2.67Gbps-eSFP-SMF-1531.12nm-120km-commercial.................................................................... 583
3.4.7.35 125M~2.67Gbps-eSFP-SMF-1530.33nm-120km-commercial.................................................................... 584
3.4.7.36 125M~2.67Gbps-eSFP-SMF-1529.55nm-120km-commercial.................................................................... 586
3.4.8 2.5Gbps eSFP Optical Module.................................................................................................................................... 587
3.4.8.1 2.5Gbps-eSFP-SMF-1310nm-40km-commercial............................................................................................... 587
3.4.8.2 2.5Gbps-eSFP-SMF-1310nm-2km-commercial................................................................................................. 588
3.4.8.3 2.5Gbps-eSFP-SMF-1310nm-15km-commercial............................................................................................... 589
3.4.8.4 2.5Gbps-eSFP-SMF-1550nm-80km-commercial............................................................................................... 591
3.4.9 10Gbps SFP+ Optical Module..................................................................................................................................... 592
3.4.9.1 10Gbps-SFP+-SMF-1550nm-80km-commercial................................................................................................592

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3.4.9.2 10Gbps-SFP+-SMF-1550nm-40km-commercial (02310TGH)...................................................................... 593
3.4.9.3 10Gbps-SFP+-SMF-1310nm-40km-commercial (02311YEB)....................................................................... 595
3.4.9.4 10Gbps-SFP+-SMF-1310nm-40km-commercial (34061409)....................................................................... 596
3.4.9.5 10Gbps-SFP+-MMF-850nm-0.3km-commercial............................................................................................... 597
3.4.9.6 10Gbps-SFP+-SMF-1310nm-10km-commercial (S4017483)....................................................................... 599
3.4.10 10Gbps SFP+ CWDM Optical Module................................................................................................................... 600
3.4.10.1 10Gbps-SFP+-SMF-1511nm-70km-commercial............................................................................................. 600
3.4.10.2 10Gbps-SFP+-SMF-1471nm-70km-commercial............................................................................................. 601
3.4.10.3 10Gbps-SFP+-SMF-1491nm-70km-commercial............................................................................................. 603
3.4.10.4 10Gbps-SFP+-SMF-1531nm-70km-commercial............................................................................................. 604
3.4.10.5 10Gbps-SFP+-SMF-1551nm-70km-commercial............................................................................................. 605
3.4.10.6 10Gbps-SFP+-SMF-1571nm-70km-commercial............................................................................................. 607
3.4.10.7 10Gbps-SFP+-SMF-1591nm-70km-commercial............................................................................................. 608
3.4.10.8 10Gbps-SFP+-SMF-1611nm-70km-commercial............................................................................................. 609
3.4.11 10Gbps SFP+ BIDI Optical Module......................................................................................................................... 610
3.4.11.1 10Gbps-SFP+-SMF-1270nm(Tx)/1330nm(Rx)-40km-commercial........................................................... 611
3.4.11.2 10Gbps-SFP+-SMF-1330nm(Tx)/1270nm(Rx)-40km-commercial........................................................... 612
3.4.11.3 10Gbps-SFP+-SMF-1270nm(Tx)/1330nm(Rx)-10km-industry.................................................................. 613
3.4.11.4 10Gbps-SFP+-SMF-1330nm(Tx)/1270nm(Rx)-10km-industry.................................................................. 615
3.4.12 10Gbps SFP+ OTN Optical Module........................................................................................................................ 616
3.4.12.1 10Gbps-SFP+-SMF-1528nm~1568nm-80km-commercial...........................................................................616
3.4.12.2 10Gbps-SFP+-SMF-1310nm-10km-commercial (34060613)..................................................................... 618
3.4.12.3 10Gbps-SFP+-SMF-1550nm-40km-commercial (34060711-002)............................................................619
3.4.13 10Gbps SFP+ SDH Optical Module.........................................................................................................................620
3.4.13.1 10Gbps-SFP+-SMF-1310nm-10km-commercial (34060613)..................................................................... 620
3.4.13.2 10Gbps-SFP+-SMF-1550nm-40km-commercial (34060711-002)............................................................622
3.4.14 10Gbps XFP Optical Module..................................................................................................................................... 623
3.4.14.1 10Gbps-XFP-SMF-1310nm-10km-commercial................................................................................................623
3.4.14.2 10Gbps-XFP-SMF-1550nm-40km-commercial................................................................................................625
3.4.14.3 10Gbps-XFP-SMF-1550nm-80km-commercial................................................................................................626
3.4.14.4 10Gbps-XFP-MMF-850nm-0.3km-commercial................................................................................................627
3.4.15 10Gbps SFP+ DWDM Optical Module...................................................................................................................629
3.4.15.1 10Gbps-SFP+-SMF-1528nm~1568nm-80km-commercial...........................................................................629
3.4.16 40Gbps CFP ETH&OTN Optical Module............................................................................................................... 630
3.4.16.1 40Gbps(1*39.8/1*43.1)-CFP-SMF-1550nm-2km-commercial.................................................................... 630
3.4.16.2 40Gbps(4*10.3/4*11.8)-CFP-SMF-1271~1331nm-10km-commercial..................................................... 632
3.4.17 40Gbps CFP Optical Module..................................................................................................................................... 633
3.4.17.1 40Gbps(4*10.3)-CFP-MMF-850nm-0.1km-commercial............................................................................... 633
3.4.17.2 40Gbps(4*10.3)-CFP-SMF-1531.12~1550.12nm-80km-commercial........................................................635
3.4.17.3 40Gbps(4*10.3)-CFP-SMF-1271~1331nm-40km-commercial................................................................... 636
3.4.17.4 40Gbps(4*10.3)-CFP-SMF-1271~1331nm-10km-commercial................................................................... 638
3.4.18 40Gbps QSFP+ Optical Module............................................................................................................................... 639

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3.4.18.1 40Gbps(4*10.3)-QSFP+-SMF-1271~1331nm-10km-commercial..............................................................640
3.4.18.2 40Gbps(4*10.3)-QSFP+-MMF-850nm-0.1km-commercial..........................................................................641
3.4.18.3 40Gbps(4*10.3)-QSFP+-SMF-1271~1331nm-40km-commercial..............................................................643
3.4.18.4 40Gbps(4*10.3)-QSFP+-SMF-1310nm-10km-commercial.......................................................................... 644
3.4.19 100Gbps CFP Optical Module.................................................................................................................................. 646
3.4.19.1 100Gbps(4*25.7)-CFP-SMF-1295.56~1309.14nm-40km-commercial..................................................... 646
3.4.19.2 100Gbps(4*25.7)-CFP-SMF-1295.56~1309.14nm-80km-commercial..................................................... 647
3.4.19.3 100Gbps(4*25.7)-CFP-SMF-1295.56~1309.14nm-10km-commercial..................................................... 649
3.4.19.4 100Gbps(10*10.3)-CFP-MMF-850nm-0.1km-commercial...........................................................................651
3.4.20 100Gbps CXP Optical Module.................................................................................................................................. 652
3.4.20.1 100Gbps(10*10.3)-CXP-MMF-850nm-0.1km-commercial.......................................................................... 652
3.4.21 100Gbps CFP2 ETH&OTN Optical Module.......................................................................................................... 653
3.4.21.1 100Gbps(4*25.7/4*27.9)-CFP2-SMF-1295.56~1309.14nm-10km-commercial.....................................653
3.4.22 100Gbps CFP2 Optical Module................................................................................................................................ 655
3.4.22.1 100Gbps(4*25.7)-CFP2-SMF-1295.56~1309.14nm-10km-commercial...................................................655
3.4.22.2 100Gbps(4*25.7)-CFP2-SMF-1295.56~1309.14nm-40km-commercial...................................................657
3.4.22.3 100Gbps(10*10.3)-CFP2-MMF-850nm-0.1km-commercial........................................................................ 658
3.4.23 100Gbps CFP4 Optical Module................................................................................................................................ 660
3.4.23.1 100Gbps(4*25.7)-CFP4-SMF-1295.56~1309.14nm-10km-commercial...................................................660
3.4.24 100Gbps CFP4 ETH&OTN Optical Module.......................................................................................................... 661
3.4.24.1 100Gbps(4*25.7/4*27.9)-CFP4-SMF-1295.56~1309.14nm-10km-commercial.....................................661
3.4.25 100Gbps QSFP28 Optical Module.......................................................................................................................... 663
3.4.25.1 100Gbps(4*25.7)-QSFP28-MMF-850nm-0.1km-commercial.....................................................................663
3.4.25.2 100Gbps(4*25.7)-QSFP28-SMF-1271~1331nm-2km-commercial........................................................... 665
3.4.25.3 100Gbps(4*25.7)-QSFP28-SMF-1310nm-30km(NO FEC)-40km(FEC)-commercial...........................666
3.4.25.4 100Gbps(4*25.7)-QSFP28-SMF-1295.56~1309.14nm-10km-commercial............................................. 668
3.4.25.5 100Gbps(4*25.7)-QSFP28-SMF-1295.56~1309.14nm-80km-commercial............................................. 670
3.4.25.6 100Gbps(4*25.7)-QSFP28-SMF-1295.56~1309.14nm-40km-commercial............................................. 672
3.4.26 100G QSFP28 ETH&OTN Optical Module............................................................................................................673
3.4.26.1 100Gbps(103.125&111.81Gb/s)-QSFP28-SMF-1295~1310nm-10km-commercial............................ 673
3.4.27 400Gbps QSFP-DD Optical Module....................................................................................................................... 675
3.4.27.1 400Gbps(8*56Gb/s PAM4)-QSFP-DD-SMF-1310nm-10km-commercial................................................675
3.4.27.2 400Gbps(8*56Gb/s PAM4)-QSFP-DD-SMF-1310nm-40km-commercial................................................677
3.4.27.3 400Gbps-QSFP-DD-SMF-1528.773~1567.133nm-commercial..................................................................679
3.4.27.4 400Gbps(4*100Gb/s PAM4)-QSFP-DD-SMF-1310nm-2km-commercial................................................681
3.4.27.5 400Gbps(8*50Gb/s PAM4)-QSFP-DD-MMF-850nm-0.1km-commercial............................................... 683
3.4.27.6 400Gbps(4*100Gb/s PAM4)-QSFP-DD-SMF-1310nm-6km-commercial................................................685
3.4.28 Optical Amplifier Module.......................................................................................................................................... 686
3.4.28.1 Optical Amplifier-QSFP28-SMF-1535nm~1547nm....................................................................................... 686
3.5 Power Distribution Box.....................................................................................................................................................688
3.5.1 APD32-12-24 (APD32-12-24 AC Power Distribution Unit).............................................................................. 688
3.5.2 APD32-4-24 (APD32-4-24 AC Power Distribution Unit)................................................................................... 691

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Hardware Guide Contents

3.5.3 APD63-2-24 (APD63-2-24 AC Power Distribution Unit)................................................................................... 694
3.5.4 APD63-6-24 (APD63-6-24 AC Power Distribution Unit)................................................................................... 697
3.5.5 CR8MP2KHDCC0 (380VDC HVDC and 220V AC Power Distribution Unit)................................................ 700
3.6 Cables..................................................................................................................................................................................... 702
3.6.1 NE5000E-X16A Power Cables..................................................................................................................................... 702
3.6.1.1 DC Power Cables..........................................................................................................................................................703
3.6.1.2 AC Power Cables.......................................................................................................................................................... 705
3.6.1.3 AC (220 V)/HVDC (240/380 V) Power Cables................................................................................................... 708
3.6.2 NE5000E-X16B Power Cables......................................................................................................................................713
3.6.2.1 DC Power Cables..........................................................................................................................................................713
3.6.2.2 AC Power Cables.......................................................................................................................................................... 715
3.6.2.3 AC (220 V)/HVDC (240/380 V) Power Cables................................................................................................... 718
3.6.3 NE5000E CCC-A Power Cables................................................................................................................................... 723
3.6.3.1 DC Power Cables..........................................................................................................................................................723
3.6.3.2 AC Power Cables.......................................................................................................................................................... 726
3.6.3.3 AC (220 V)/HVDC (240/380 V) Power Cables................................................................................................... 728
3.6.4 NE5000E-20 Power Cables...........................................................................................................................................736
3.6.4.1 DC Power Cables..........................................................................................................................................................736
3.6.4.2 AC Power Cables.......................................................................................................................................................... 738
3.6.4.3 AC (220 V)/HVDC (240/380 V) Power Cables................................................................................................... 741
3.6.5 NE5000E CCC Power Cables........................................................................................................................................ 749
3.6.5.1 DC Power Cables..........................................................................................................................................................749
3.6.5.2 AC Power Cables Connecting the PDF to the EPS150-4850A...................................................................... 751
3.6.5.3 DC Power Cables Connecting the EPS150-4850A to the NE5000E CCC...................................................753
3.6.6 Chassis and Cabinet Ground Cable........................................................................................................................... 755
3.6.6.1 Introduction................................................................................................................................................................... 755
3.6.6.2 Structure......................................................................................................................................................................... 755
3.6.6.3 Technical Specifications............................................................................................................................................. 756
3.6.7 Console Port Cable......................................................................................................................................................... 756
3.6.7.1 Introduction................................................................................................................................................................... 756
3.6.7.2 Structure......................................................................................................................................................................... 757
3.6.7.3 Technical Specifications............................................................................................................................................. 758
3.6.8 Clock Cable........................................................................................................................................................................758
3.6.8.1 Introduction................................................................................................................................................................... 758
3.6.8.2 Structure......................................................................................................................................................................... 759
3.6.8.3 Technical Specifications............................................................................................................................................. 762
3.6.9 CXP Fiber Optics.............................................................................................................................................................. 765
3.6.9.1 Overview of CXP Fiber Optics................................................................................................................................. 765
3.6.9.2 Structure......................................................................................................................................................................... 765
3.6.9.3 Technical Specifications............................................................................................................................................. 766
3.6.10 Optical Fiber................................................................................................................................................................... 769
3.6.10.1 Introduction.................................................................................................................................................................769

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Hardware Guide Contents

3.6.10.2 Structure....................................................................................................................................................................... 771
3.6.10.3 Technical Specifications...........................................................................................................................................776
3.6.11 USB-to-Ethernet Cable............................................................................................................................................... 777
3.6.11.1 USB-to-Ethernet Cable............................................................................................................................................ 777
3.7 Glossary................................................................................................................................................................................. 779
3.8 Acronyms and Abbreviations.......................................................................................................................................... 780
4 Hardware Installation and Parts Replacement............................................................783
4.1 Cabinet Quick Installation Guide.................................................................................................................................. 783
4.2 Installation Guide............................................................................................................................................................... 784
4.2.1 Safety Precautions.......................................................................................................................................................... 784
4.2.1.1 Alarm and Safety Symbols....................................................................................................................................... 784
4.2.1.2 General Safety Precautions...................................................................................................................................... 785
4.2.1.3 Electrical Safety............................................................................................................................................................ 787
4.2.1.4 Precautions for Connecting a Computer to the Device..................................................................................789
4.2.1.5 Inflammable Environment........................................................................................................................................790
4.2.1.6 Batteries.......................................................................................................................................................................... 790
4.2.1.6.1 VRLA Batteries........................................................................................................................................................... 790
4.2.1.6.2 Lithium Batteries...................................................................................................................................................... 792
4.2.1.7 Radiation........................................................................................................................................................................ 792
4.2.1.7.1 Electromagnetic Exposure..................................................................................................................................... 792
4.2.1.7.2 Forbidden Areas........................................................................................................................................................ 793
4.2.1.7.3 Lasers............................................................................................................................................................................793
4.2.1.8 Working at Heights.....................................................................................................................................................794
4.2.1.8.1 Hoisting Heavy Objects..........................................................................................................................................794
4.2.1.8.2 Using Ladders............................................................................................................................................................ 795
4.2.1.9 Mechanical Safety....................................................................................................................................................... 796
4.2.1.10 Others............................................................................................................................................................................798
4.2.2 Preparing for the Installation......................................................................................................................................798
4.2.2.1 Preparing before Construction................................................................................................................................ 799
4.2.2.1.1 Preparing Technical Documents..........................................................................................................................799
4.2.2.1.2 Preparing Tools and Meters..................................................................................................................................799
4.2.2.1.3 Qualification of Installation Engineers............................................................................................................. 800
4.2.2.2 Checking the Installation Environment................................................................................................................801
4.2.2.2.1 Checking the Equipment Room Structure....................................................................................................... 801
4.2.2.2.2 Checking the Equipment Room Environment................................................................................................ 801
4.2.2.2.3 Checking the Power Supply Systems in the Equipment Room................................................................ 802
4.2.2.2.4 Checking the Grounding........................................................................................................................................ 802
4.2.2.2.5 Checking Other Facilities....................................................................................................................................... 803
4.2.2.3 Environmental Requirements for Device Operation........................................................................................804
4.2.2.3.1 Requirements for Selecting a Site for Equipment Room............................................................................804
4.2.2.3.2 Equipment Room Layout....................................................................................................................................... 805
4.2.2.3.3 Construction Requirements for the Equipment Room................................................................................ 805

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4.2.2.3.4 Requirements for Handling Corrosive Gases.................................................................................................. 807
4.2.2.3.5 Requirements for Mechanically Active Substance........................................................................................ 808
4.2.2.3.6 Requirements for ESD Prevention...................................................................................................................... 809
4.2.2.3.7 Electromagnetism Requirements for the Equipment Room......................................................................809
4.2.2.3.8 Requirements for Lightning-Proof Grounding............................................................................................... 809
4.2.2.3.9 Requirements for Power Supply..........................................................................................................................812
4.2.2.4 Unpacking and Checking the Products................................................................................................................ 817
4.2.2.4.1 Checking the Package Container........................................................................................................................ 817
4.2.2.4.2 Unpacking and Checking the Device.................................................................................................................818
4.2.2.4.3 Unpacking the Box Containing the Carton and Wooden Tray................................................................. 821
4.2.2.5 Checking the Boards................................................................................................................................................... 823
4.2.2.6 Inspecting and Cleaning Optical Fiber Connectors and Adapters.............................................................. 823
4.2.2.6.1 Overview..................................................................................................................................................................... 824
4.2.2.6.2 Protection of Optical Fiber Connectors............................................................................................................ 824
4.2.2.6.3 Tools, Equipment, and Materials........................................................................................................................ 825
4.2.2.6.4 Inspecting Optical Fiber Connectors..................................................................................................................826
4.2.2.6.5 Inspecting the Optical Fiber Link........................................................................................................................829
4.2.2.6.6 Cleaning Optical Fiber Connectors Using the Cassette Cleaner.............................................................. 831
4.2.2.6.7 Cleaning Optical Fiber Connectors Using Lens Tissue................................................................................ 833
4.2.2.6.8 Cleaning Optical Fiber Adapters Using Dustfree Absorbent Swabs....................................................... 835
4.2.3 On-site Cable Assembly and Installation................................................................................................................837
4.2.3.1 Cable Assembling Precautions................................................................................................................................ 837
4.2.3.2 Assembling Power Cables......................................................................................................................................... 838
4.2.3.2.1 Assembling a Power Cable with an OT Terminal..........................................................................................838
4.2.3.2.2 Assembling a Power Cable with a JG Terminal............................................................................................. 842
4.2.3.2.3 Assembling a Power Cable to a Cord End Terminal.....................................................................................844
4.2.3.3 Assembling Ethernet Cables.................................................................................................................................... 847
4.2.3.3.1 Assembling an Ethernet Cable with a Shielded RJ45 Connector.............................................................848
4.2.3.3.2 Checking the Metal Contacts............................................................................................................................... 853
4.2.3.3.3 Testing the Connectivity of Assembled Ethernet Cables............................................................................ 856
4.2.3.4 Installing Cable Accessories..................................................................................................................................... 859
4.2.3.4.1 Precautions for Installing Cable Accessories...................................................................................................859
4.2.3.4.2 Installing Power Adapters..................................................................................................................................... 863
4.2.3.4.3 Installing Network Port Connectors.................................................................................................................. 868
4.2.3.4.4 Installing Fiber Connectors................................................................................................................................... 870
4.2.3.5 Replacing the Mould of a Crimping Tool............................................................................................................ 878
4.2.4 Equipment Grounding Specifications....................................................................................................................... 881
4.2.4.1 General Grounding Specifications..........................................................................................................................881
4.2.4.2 Grounding Specifications for Equipment Room................................................................................................882
4.2.4.3 Grounding Specifications for Devices................................................................................................................... 882
4.2.4.4 Grounding Specifications for Power Supply Systems...................................................................................... 883
4.2.4.5 Grounding Specifications for Signal Cables........................................................................................................884

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4.2.4.6 Specifications for Laying Ground Cables............................................................................................................. 884
4.2.5 Labels for Cables............................................................................................................................................................. 885
4.2.5.1 Introduction to Labels................................................................................................................................................ 885
4.2.5.1.1 Label Materials......................................................................................................................................................... 886
4.2.5.1.2 Type and Structure...................................................................................................................................................886
4.2.5.1.3 Label Printing............................................................................................................................................................ 888
4.2.5.1.4 Writing Labels........................................................................................................................................................... 889
4.2.5.1.5 Attaching Labels....................................................................................................................................................... 890
4.2.5.1.6 Contents of Labels................................................................................................................................................... 892
4.2.5.1.7 Precautions for Using Labels................................................................................................................................ 893
4.2.5.2 Labels for Fibers........................................................................................................................................................... 893
4.2.5.2.1 Labels for Fibers Connecting Devices................................................................................................................893
4.2.5.2.2 Labels for Fibers Connecting the Device and ODF....................................................................................... 895
4.2.5.3 Labels for Network Cables....................................................................................................................................... 897
4.2.5.4 Labels for Trunk Cables............................................................................................................................................. 899
4.2.5.4.1 Labels for Trunk Cables Between Devices....................................................................................................... 899
4.2.5.4.2 Labels for Trunk Cables Between the Device and a DDF...........................................................................900
4.2.5.5 Labels for User Cables............................................................................................................................................... 902
4.2.5.6 Labels for Power Cables............................................................................................................................................ 903
4.2.5.6.1 Labels for DC Power Cables..................................................................................................................................904
4.2.5.6.2 Labels for AC Power Cables.................................................................................................................................. 905
4.2.6 Powering on Devices...................................................................................................................................................... 906
4.2.6.1 Checking the Installation.......................................................................................................................................... 906
4.2.6.1.1 Device Installation Checklist.................................................................................................................................906
4.2.6.1.2 Cable Installation Checklist...................................................................................................................................909
4.2.7 (Optional) Checking Optical Power......................................................................................................................... 912
4.2.8 NE5000E-X16A/X16B Installation Guide................................................................................................................. 914
4.2.8.1 Specifications and Components of the NE5000E-X16A/X16B......................................................................914
4.2.8.2 Cabinet Introduction...................................................................................................................................................916
4.2.8.3 Installation Preparations........................................................................................................................................... 919
4.2.8.4 Installation Instructions............................................................................................................................................. 922
4.2.8.5 Cabinet Specifications................................................................................................................................................ 923
4.2.8.6 Required Tools and Meters.......................................................................................................................................925
4.2.8.6.1 Inspecting and Cleaning Optical Fiber Connectors and Adapters...........................................................926
4.2.8.7 Installing the NE5000E-X16A/X16B in a Cabinet..............................................................................................942
4.2.8.8 Installing Ground Cables........................................................................................................................................... 950
4.2.8.9 DC Power Distribution............................................................................................................................................... 951
4.2.8.10 240V High Voltage DC Power Distribution...................................................................................................... 958
4.2.8.11 380 V High Voltage DC Power Distribution..................................................................................................... 962
4.2.8.12 AC Power Distribution............................................................................................................................................. 968
4.2.8.13 Installing Boards and Subcards............................................................................................................................ 971
4.2.8.14 Installing Cascading Optical Fibers..................................................................................................................... 976

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4.2.8.14.1 Installing Fiber Management Trays................................................................................................................. 976
4.2.8.14.2 Laying Out Optical Fibers................................................................................................................................... 978
4.2.8.15 Installing Network Cables...................................................................................................................................... 981
4.2.8.16 Installing Optical Fibers.......................................................................................................................................... 984
4.2.8.17 Installation in Underfloor Cabling Mode.......................................................................................................... 987
4.2.8.18 Installing Noise Reduction Modules................................................................................................................... 988
4.2.8.19 Checking the Installation........................................................................................................................................990
4.2.8.20 (Optional) Checking Optical Power....................................................................................................................992
4.2.8.21 Power-on Check......................................................................................................................................................... 994
4.2.9 NE5000E CCC-A Installation Guide........................................................................................................................... 998
4.2.9.1 Specifications and Components of the NE5000E CCC-A............................................................................... 998
4.2.9.2 Installation Preparations.........................................................................................................................................1000
4.2.9.3 Installation Instructions.......................................................................................................................................... 1003
4.2.9.4 Cabinet Specifications..............................................................................................................................................1004
4.2.9.5 Installation tools........................................................................................................................................................ 1006
4.2.9.6 Inspecting and Cleaning Optical Fiber Connectors and Adapters............................................................1007
4.2.9.6.1 Overview................................................................................................................................................................... 1007
4.2.9.6.2 Protection of Optical Fiber Connectors.......................................................................................................... 1009
4.2.9.6.3 Tools, Equipment, and Materials...................................................................................................................... 1010
4.2.9.6.4 Inspecting Optical Fiber Connectors............................................................................................................... 1011
4.2.9.6.5 Inspecting the Optical Fiber Link..................................................................................................................... 1014
4.2.9.6.6 Cleaning Optical Fiber Connectors Using the Cassette Cleaner............................................................1016
4.2.9.6.7 Cleaning Optical Fiber Connectors Using Lens Tissue.............................................................................. 1019
4.2.9.6.8 Cleaning Optical Fiber Adapters Using Dustfree Absorbent Swabs.....................................................1021
4.2.9.7 Installing the NE5000E CCC-A into the Cabinet.............................................................................................1023
4.2.9.8 Installing Ground Cables........................................................................................................................................ 1028
4.2.9.9 DC Power Distribution............................................................................................................................................. 1028
4.2.9.10 240 V High Voltage DC Power Distribution...................................................................................................1034
4.2.9.11 380 V High Voltage DC Power Distribution...................................................................................................1039
4.2.9.12 AC Power Distribution...........................................................................................................................................1044
4.2.9.13 Installing Boards and Subcards.......................................................................................................................... 1049
4.2.9.14 Installing Cascading Optical Fibers...................................................................................................................1056
4.2.9.15 Installation in Underfloor Cabling Mode........................................................................................................1056
4.2.9.16 Installing Network Cables....................................................................................................................................1058
4.2.9.17 Checking the Installation..................................................................................................................................... 1059
4.2.9.18 (Optional) Checking Optical Power................................................................................................................. 1060
4.2.9.19 Power-on Check...................................................................................................................................................... 1062
4.2.10 NE5000E CCC Installation Guide.......................................................................................................................... 1066
4.2.10.1 NE5000E CCC Introduction.................................................................................................................................. 1066
4.2.10.2 Installation Preparations...................................................................................................................................... 1067
4.2.10.3 Installation Notes................................................................................................................................................... 1070
4.2.10.4 Requirements on Customers' Cabinets Purchased from Other Vendors............................................. 1071

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4.2.10.5 Installation tools..................................................................................................................................................... 1073
4.2.10.5.1 Inspecting and Cleaning Optical Fiber Connectors and Adapters......................................................1074
4.2.10.6 Installing the Chassis into the Cabinet............................................................................................................1091
4.2.10.7 Installing the PGND Cable................................................................................................................................... 1094
4.2.10.8 Installing Power Cables-DC Power Distribution...........................................................................................1096
4.2.10.9 Installing Power Cables-AC Power Distribution........................................................................................... 1100
4.2.10.10 Installing Boards and Sub-cards......................................................................................................................1108
4.2.10.11 Laying Network Cables...................................................................................................................................... 1109
4.2.10.12 (Optional) Checking Optical Power...............................................................................................................1110
4.2.11 NE5000E-20 Installation Guide............................................................................................................................. 1112
4.2.11.1 Precautions................................................................................................................................................................1112
4.2.11.2 Installation Flowchart........................................................................................................................................... 1113
4.2.11.3 Preparing for Installation..................................................................................................................................... 1114
4.2.11.3.1 Inspecting and Cleaning Optical Fiber Connectors and Adapters......................................................1115
4.2.11.4 Installing the Power Chassis............................................................................................................................... 1131
4.2.11.5 Installing the NE5000E-20 on a Concrete Floor...........................................................................................1138
4.2.11.6 Installing the NE5000E-20 on an ESD Floor..................................................................................................1145
4.2.11.7 Installing Cabinet Doors....................................................................................................................................... 1155
4.2.11.8 Installing a Ground Cable.................................................................................................................................... 1160
4.2.11.9 Installing the Fan Module of the NE5000E-20............................................................................................. 1161
4.2.11.10 Installing a PDU into a Cabinet.......................................................................................................................1162
4.2.11.11 Connecting PDU Input and Output Power Cables....................................................................................1173
4.2.11.12 Installing the Power Cable................................................................................................................................ 1176
4.2.11.12.1 DC Power Distribution.....................................................................................................................................1177
4.2.11.12.2 AC Power Distribution..................................................................................................................................... 1184
4.2.11.12.3 HVDC Power Distribution...............................................................................................................................1188
4.2.11.13 Installing an Advanced Door............................................................................................................................ 1194
4.2.11.14 Installing Boards and Subcards....................................................................................................................... 1199
4.2.11.15 Installing Cascading Optical Fibers................................................................................................................ 1206
4.2.11.15.1 Installing Fiber Management Trays............................................................................................................ 1206
4.2.11.15.2 Laying Out Optical Fibers.............................................................................................................................. 1210
4.2.11.16 Installing Network Cables................................................................................................................................. 1213
4.2.11.17 Installing Optical Fibers..................................................................................................................................... 1216
4.2.11.18 Checking Installation...........................................................................................................................................1218
4.2.11.19 Performing a Power-on Check......................................................................................................................... 1220
4.2.12 Quick Installation Guide for the Cable Management Cabinet...................................................................1224
4.2.12.1 Quick Installation Guide for the Cable Management Cabinet............................................................... 1224
4.3 Parts Replacement........................................................................................................................................................... 1227
4.3.1 Overview of Parts Replacement.............................................................................................................................. 1227
4.3.1.1 Basic Operation Process.......................................................................................................................................... 1227
4.3.2 Replacing Parts of the NE5000E CCC-A................................................................................................................ 1229
4.3.2.1 Replacing Boards....................................................................................................................................................... 1229

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4.3.2.1.1 Overview of Boards............................................................................................................................................... 1229
4.3.2.1.2 Introduction to Boards......................................................................................................................................... 1231
4.3.2.1.3 Replacing an MPU................................................................................................................................................. 1233
4.3.2.1.4 Replacing an ICU....................................................................................................................................................1239
4.3.2.1.5 Replacing an SFU................................................................................................................................................... 1245
4.3.2.1.6 Replacing an OFC.................................................................................................................................................. 1250
4.3.2.2 Replacing the SSD..................................................................................................................................................... 1254
4.3.2.3 Replacing the Fan Module of the NE5000E CCC-A....................................................................................... 1256
4.3.2.4 Replacing the Air Filter of the NE5000E CCC-A..............................................................................................1260
4.3.2.5 Replacing a Power Module.................................................................................................................................... 1265
4.3.2.5.1 Introduction to a Power Module...................................................................................................................... 1265
4.3.2.5.2 Replacing the PM, switch, or PMU of the NE5000E CCC-A.................................................................... 1266
4.3.3 Replacing Parts of the NE5000E CCC.................................................................................................................... 1271
4.3.3.1 Replacing Boards....................................................................................................................................................... 1271
4.3.3.1.1 Overview of Boards............................................................................................................................................... 1271
4.3.3.1.2 Introduction to Boards......................................................................................................................................... 1273
4.3.3.1.3 Replacing an MPU................................................................................................................................................. 1274
4.3.3.1.4 Replacing an ICU....................................................................................................................................................1278
4.3.3.1.5 Replacing a 100G SFU..........................................................................................................................................1282
4.3.3.1.6 Replacing an ECU/400G SFU............................................................................................................................. 1285
4.3.3.1.7 Replacing an 400G SFU....................................................................................................................................... 1290
4.3.3.1.8 Replacing an OFC.................................................................................................................................................. 1295
4.3.3.2 Replacing a CF Card................................................................................................................................................. 1299
4.3.3.2.1 Introduction to a CF Card................................................................................................................................... 1299
4.3.3.2.2 Replacing CF Card 1..............................................................................................................................................1299
4.3.3.2.3 Replacing CF Card 2..............................................................................................................................................1303
4.3.3.3 Replacing a Fan Module......................................................................................................................................... 1306
4.3.3.3.1 Introduction to a Fan Module........................................................................................................................... 1306
4.3.3.3.2 Replacing a Front Fan Module of the CCC................................................................................................... 1307
4.3.3.3.3 Replacing a Rear Fan Module of the CCC..................................................................................................... 1310
4.3.3.4 Replacing an Air Filter............................................................................................................................................. 1313
4.3.3.4.1 Replacing an Air Filter of the CCC................................................................................................................... 1313
4.3.3.5 Replacing a Power Module.................................................................................................................................... 1316
4.3.3.5.1 Introduction to a Power Module...................................................................................................................... 1316
4.3.3.5.2 Replacing the Power Module of the NE5000E CCC................................................................................... 1317
4.3.4 Replacing Parts of the NE5000E-X16A/X16B...................................................................................................... 1320
4.3.4.1 Replacing Boards....................................................................................................................................................... 1320
4.3.4.1.1 Overview of Boards............................................................................................................................................... 1320
4.3.4.1.2 Introduction to Boards......................................................................................................................................... 1322
4.3.4.1.3 Replacing an MPU................................................................................................................................................. 1323
4.3.4.1.4 Replacing the SFU of the NE5000E-X16A/X16B..........................................................................................1329
4.3.4.1.5 Replacing a Common LPU.................................................................................................................................. 1333

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4.3.4.1.6 Replacing an FPIC.................................................................................................................................................. 1338
4.3.4.2 Replacing a CF Card................................................................................................................................................. 1343
4.3.4.2.1 Introduction to a CF Card................................................................................................................................... 1343
4.3.4.2.2 Replacing CF Card 1..............................................................................................................................................1344
4.3.4.2.3 Replacing CF Card 2..............................................................................................................................................1347
4.3.4.3 Replacing the SSD..................................................................................................................................................... 1350
4.3.4.4 Replacing an Optical Module............................................................................................................................... 1352
4.3.4.5 Replacing a Fan Frame............................................................................................................................................1359
4.3.4.5.1 Introduction to a Fan Module........................................................................................................................... 1359
4.3.4.5.2 Replacing the Fan Module of the NE5000E-X16A/X16B.......................................................................... 1360
4.3.4.6 Replacing an Air Filter............................................................................................................................................. 1363
4.3.4.6.1 Replacing the Air Filter of the NE5000E-X16A/X16B................................................................................ 1363
4.3.4.7 Replacing a Power Module.................................................................................................................................... 1367
4.3.4.7.1 Introduction to a Power Module...................................................................................................................... 1367
4.3.4.7.2 Replacing the PM, switch, or PMU of the NE5000E-X16A/X16B...........................................................1368
4.3.5 Replacing Parts of the NE5000E-20....................................................................................................................... 1374
4.3.5.1 Replacing Boards....................................................................................................................................................... 1374
4.3.5.1.1 Introduction to Boards......................................................................................................................................... 1374
4.3.5.1.2 Replacing an MPU................................................................................................................................................. 1375
4.3.5.1.3 Replacing an SFU of NE5000E-20....................................................................................................................1378
4.3.5.1.4 Replacing an LPU................................................................................................................................................... 1381
4.3.5.2 Replacing Air Filters..................................................................................................................................................1384
4.3.5.3 Replacing the SSD..................................................................................................................................................... 1386
4.3.5.4 Replacing an Optical Module............................................................................................................................... 1389
4.3.5.5 Replacing the Fan Module of the NE5000E-20.............................................................................................. 1393
4.3.5.6 Replacing the PM...................................................................................................................................................... 1396
4.3.5.7 Replacing the Centralized Monitoring Unit (CMU) of NE5000E-20........................................................1398
4.3.6 Replacing Cables........................................................................................................................................................... 1400
4.3.6.1 Cable Types..................................................................................................................................................................1400
4.3.6.2 Replacing a Power Cable and a Ground Cable............................................................................................... 1401
4.3.6.3 Replacing a Clock Cable..........................................................................................................................................1402
4.3.6.4 Replacing a Network Cable................................................................................................................................... 1404
4.3.6.5 Replacing an Optical Cable................................................................................................................................... 1405
4.3.6.6 Replacing a CXP Fiber Optic.................................................................................................................................. 1407
4.3.7 Glossary............................................................................................................................................................................1409
4.3.8 Acronyms and Abbreviations.................................................................................................................................... 1410

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Hardware Guide 1 Document Declaration

1 Document Declaration

Purpose

This document describes hardware features of the NE5000E. It helps intended
readers obtain detailed information about each chassis, board, and cable, and
learn how to install and maintain devices.

NO TICE

The Hardware Guide includes hardware data of multiple versions. Before using this
document, check the first version supported by the hardware.

Related Version

NO TICE

The following table lists the product versions involved in this document. Before
reading this document, confirm whether your versions are included in this
document.

Product Name Version

HUAWEI NE5000E Series Applicable to:
● V800R022C00SPC100
● V800R022C00SPC500
● V800R022C10SPC100
● V800R024C00SPC100

Intended Audience

This document is intended for:

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HUAWEI NE5000E Series
Hardware Guide 1 Document Declaration

● Network planning engineers
● Hardware installation engineers
● Commissioning engineers
● On-site maintenance engineers
● System maintenance engineers

Special Declaration
● The pictures of hardware in this document are for reference only.
● The supported boards are described in the document. Whether a
customization requirement can be met is subject to the information provided
at the pre-sales interface.
● All device dimensions described in this document are designed dimensions
and do not include dimension tolerances. In the process of component
manufacturing, the actual size is deviated due to factors such as processing or
measurement.

Symbol Conventions
The symbols that may be found in this document are defined as follows.

Symbol Description

Indicates a hazard with a high level of risk which, if
not avoided, will result in death or serious injury.

Indicates a hazard with a medium level of risk
which, if not avoided, could result in death or
serious injury.

Indicates a hazard with a low level of risk which, if
not avoided, could result in minor or moderate
injury.

Indicates a potentially hazardous situation which, if
not avoided, could result in equipment damage,
data loss, performance deterioration, or
unanticipated results.
NOTICE is used to address practices not related to
personal injury.

Supplements the important information in the main
text.
NOTE is used to address information not related to
personal injury, equipment damage, and
environment deterioration.

Change History
● Changes in Issue 04 (2025-04-30)

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HUAWEI NE5000E Series
Hardware Guide 1 Document Declaration

This is the fourth official release.
● Changes in Issue 03 (2024-12-31)
This is the third official release.
● Changes in Issue 02 (2024-08-30)
This is the second official release.
● Changes in Issue 01 (2024-06-30)
This is the first official release.

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Hardware Guide 2 Using the Hardware Tool

2 Using the Hardware Tool

Enterprise:
In the enterprise network market, Info-Finder is a tool platform, It allows you to
search for key product information by product series and model. The key product
information includes basic information such as the software specifications, life
cycles, and hardware information, and operation and maintenance information
such as the licenses, alarms, logs, commands, and MIBs. The hardware-related
tools are as follows:
● Product image gallery: provides product photos, and network element icons
for you to produce design drawings and networking diagrams.
● Hardware configuration: automatically generates hardware configuration
diagrams after you select components are required and calculates the weight,
power consumption, and heat consumption.
● Hardware center: provides the technical specifications of devices and
components, as well as the mapping between devices, components, and
versions.
● 3D model: Using this function, you can query product images, product
overview, and component insertion/removal videos, enabling you to quickly
obtain product information in one-stop mode.

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Hardware Guide 3 Hardware Description

3 Hardware Description

3.1 NE5000E CLC Hardware Description
3.2 NE5000E Cluster Hardware Description
3.3 NE5000E CCC Hardware Description
3.4 Optical Module
3.5 Power Distribution Box
3.6 Cables
This chapter describes the structure and specifications of the external cables.
3.7 Glossary
3.8 Acronyms and Abbreviations

3.1 NE5000E CLC Hardware Description

3.1.1 Product Signal Flow Overview
This section describes how component units on a device process and forward
signal flows. This section demonstrates how data packets enter a device and how
the device forwards the data packets.

3.1.1.1 General Service Process Overview

Concept Analogy

A router is a device that searches for paths to transmit IP packets on the Internet.
The router functions as a post office. IP packets are to the router as mails to the
post office. The core function of a router is addressing and forwarding.

A post office must meet the following conditions before mails can be properly
delivered:

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● Has a mail collection center that collects all mails.
● Has a mail query and distribution center that queries addresses of the mails
and distributes these mails to their addresses.
A mail collection center, similar to the data plane on a router, delivers mails. A
mail query and distribution center, similar to the control plane on the router,
searches for paths and forwards mails along the paths to various addresses.

Logical Architecture

A router consists of the data and control planes, which implements addressing and
forwarding. In addition, the router has a monitoring plane, which helps ensure
stable addressing and forwarding performance. The three planes provide the
following functions:

● Data plane: Similar to a mail collection center, the data plane provides
interfaces that send and receive packets on a router, whereas processing the
packets at a high speed and switching data packets inside the router. The data
plane encapsulates packets, decapsulates packets, processes Ethernet,
Multiprotocol Label Switching (MPLS), IPv4, and IPv6 packets, implements
quality of service (QoS), schedules packets, and provides various statistics.
● Control plane: Similar to the mail query and distribution center, the control
plane is the central nervous system on a router. It uses system buses to
control system units and provide various functions. These functions allow the
router to calculate routes, generate LSPs, build multicast, unicast, and MPLS
forwarding tables, processes protocols and signalings, configure the routes,
maintain the route status, monitor the system status, and generate the
system status report.
● Monitoring plane: monitors the system environment and helps the data and
control plane operate stably and securely. The monitoring plane measures the
power voltage, controls the system power-on and power-off, monitors
temperatures, and controls fan modules. In addition, the monitoring plane
isolates a fault if a unit fails to prevent the fault from affecting other units on
the router.

Figure 3-1 illustrates the logical architecture of a router.

Figure 3-1 Logical architecture

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NO TE

The arrow in the figure indicates the direction in which data flows are forwarded.
CLK: Clock Card.
PIC: Physical Interface Card.

Physical Architecture
The physical architectures of the data, control, and monitoring planes on a router
are as follows:
● The data plane's forwarding function is implemented by the uplink and
downlink and a switch fabric unit (SFU) on the router.
● Control and monitoring plane functions are implemented by control units on
the main processing units (MPUs) and .

3.1.1.2 Signal Flow on the Control Plane
The control plane, functioning as the nerve center, integrates control and
management functions and uses buses to control system units.
The control plane consists of control units on MPUs and those on other boards.
Each MPU consists of the following three functional units:
● System management and control unit and system clock unit: work on the
control plane.
● System maintenance unit: works on the monitoring plane. For more
information, see section "Signal Flow on the Monitoring Plane" in this
document.
MPU units and board units communicate through system buses and the SFU.

Signal Flow on the Control Plane
Figure 3-2 illustrates the principles of signal flow transmission on the control
plane.

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Figure 3-2 Signal flow transmission on the control plane

The control plane processes the following signal flows:
● Signaling signal flow and operation and maintenance signal flow: processed
by the system management and control unit.
● Clock signal flow: processed by the system clock unit.
The signal flow on the control plane is bidirectional.
● Signal flow contains host packets carrying signals, for example, routing
protocols.
– Board-to-MPU signal flow: calculates data. Therefore, a board sends
these packets to the MPU, and the management and control unit on the
MPU parses these packets. Then the MPU delivers signaling to the data
plane so that they can be identified by the data plane.
– MPU-to-board signal flow: used to update entries in forwarding tables.
After the MPU delivers parsed data to a board, the board uses the data to
forward packets on the data plane.
In the following example, routing calculation is used. A packet arrives at an
interface of a board. The network processor (NP) on the board identifies the
packet that needs to be sent to the MPU. The NP sends the packet to the
MPU. The MPU calculates the packet and delivers the destination IP address

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and the next-hop IP address to the routing table on the NP. The data plane
forwards the packet to the next-hop address over a route to the destination IP
address.
● Operation and maintenance signal flow: Operation data includes
configuration, debugging, and query data. Maintenance data includes system-
generating data, such as logs and alarms.
– Board-to-MPU signal flow: contains maintenance signals. The system
management and control unit uses the system buses to collect
maintenance information, such as logs and alarms that are generated by
modules and saves the information in an information center. The
maintenance data helps query and maintain the device.
For example, when a user wants to query active alarms, the user runs the
display alarm active command. The control plane parses this command
and instructs the information center to display all collected active alarms.
– MPU-to-board signal flow: contains operation signals. The control plane
provides software interfaces to communicate with other devices,
communication interfaces to communicate with host software, and LAN
switch interfaces to communicate with other boards and modules. These
interfaces form a logical network. Operation commands are configured
on the control plane. The control plane then sorts information based on
types and priorities and sends the information through interfaces along
various channels to various modules.
For example, a user runs the power off slot 1 command to power off a
board in slot 1. The control plane parses the command and delivers the
command through an outband interface to the board in slot 1.
● Clock signal flow: contains synchronization Ethernet or 1588v2 (also called
IEEE Standard for a Precision Clock Synchronization Protocol for Networked
Measurement and Control Systems) signals.
– Board-to-MPU signal flow: used to obtain clock signals. An uplink board
obtains clock frequency signals from packets and sends them to the
system clock unit on an MPU. The system clock unit then selects a clock
source.
– MPU-to-board signal flow: used to restore the system clock frequency
and time. After the MPU selects a clock source, it restores the
synchronous system clock and delivers it to all boards so that a device
forwards packets all carrying the synchronous signals to downstream
devices through outbound interfaces.

Reliability
Both the MPUs and clocks are working in 1:1 redundancy mode. The master and
slave MPUs communicate and monitor each other's status. If the master MPU
fails, the slave MPU automatically takes over packets and becomes the new
master MPU, which improves device reliability.

3.1.1.3 Signal Flow on the Data Plane
The data plane processes and forwards data packets at a high speed. The signal
flow in the data plane is primarily service data signals.
Signals on the data plane flow through a physical link, an uplink board, an SFU, a
downlink board, and another physical link.

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Figure 3-3 illustrates the processing and forwarding of a signal flow on the data
plane.

Figure 3-3 Processing and forwarding of a signal flow on the data plane

The processing of an incoming signal flow is as follows:
1. An uplink physical interface card (PIC) provides an inbound interface for a
signal flow. Optical and electrical signals transmitted along a physical link
enter the uplink PIC. The PIC obtains the physical layer clock frequency and
performs data layer link protocol negotiation. Then the PIC encapsulates
packets into Ethernet frames and sends the frames to the uplink NP.
2. The uplink NP searches a forwarding table for an outbound interface for the
signal flow. The processing is as follows:
a. Inbound interface processing: Upon receipt of the signal flow, the
inbound interface of the NP parses the data link layer protocol carried in
the packets and obtains the packet types.
b. Traffic classification: The uplink NP prioritized packets, performs traffic
classification, and re-marks them.
c. Packet forwarding based on the forwarding table: The uplink NP searches
for forwarding entries based on destination MAC addresses, destination IP
addresses, and MPLS labels and obtains outbound interface names or
next-hop IP addresses contained in matching entries.
NO TE

Data packets are classified as Layer 2 MAC address-based packets, Layer 2.5
MPLS label-based packets, and Layer 3 IP address-based packets. The processing
module on the inbound interface identifies packet types and searches forwarding
tables based on these types so that the outbound interface names or next-hop IP
addresses for all types of packets can be found.
d. Traffic policing: The uplink NP limits the rate at which incoming packets
are sent based on the committed access rate (CAR) parameters
configured on the inbound interface or those configured in the incoming
traffic classification profile. If the forwarding behavior is to discard
packets, the uplink NP discards them before performing the CAR function.

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3. The uplink traffic management (TM) unit processes the signal flow as follows:
– Congestion management and avoidance: The uplink TM monitors
network resource usage. If traffic congestion worsens, the uplink TM
discards packets and adjusts traffic to relieve network overload.
– Traffic shaping: If traffic congestion occurs, the uplink TM caches packets
in queues and uses a specific scheduling algorithm to prioritize packets
before forwarding them.
After the uplink TM processes packets using QoS functions, it sends them to
the uplink flexible interface card (FIC).
4. The uplink FIC fragments the signal flows. The SFU switches packets based on
a fixed cell length. Before packets are sent to the SFU, the uplink FIC
fragments the packets that are longer than the fixed cell length. The
upstream FIC encapsulates the fragments into cells before sending them to
the SFU.
The SFU switches data between . Upon receipt of the cells, the SFU caches and
schedules them before sending them to the switching unit. The switching unit
balances the cells using multiple switching planes, which improves the fault
tolerance capability. The switching unit sends data packets through outbound
interfaces to a downlink board.
The processing of an outgoing signal flow is as follows:
1. Switched network cell assembly on the downstream FIC: The downstream FIC
assembles switched network cells into packets after switched network cells
flow from the SFU to the downlink FIC.
2. Queuing and scheduling on the downlink TM: The downstream TM puts
packets of the signal flow in queues and schedules them based on the traffic
shaping, policing, congestion avoidance parameters. Then it sends the packets
to the downstream NP.
NO TE

The downlink TM also replicates multicast packets before sending them through
several outbound interfaces.
3. Forwarding table lookup and data layer link information query: The downlink
NP obtains data link layer encapsulation information, processes packets using
a signal flow processing module and outbound interface-specific processing
modules. The processing is as follows:
a. The downstream NP obtains data link layer encapsulation information
and encapsulates packets. The encapsulation process varies according to
packet types. For example:
▪ For Layer 2 802.1q-in-802.1q (QinQ) packets, the downlink NP adds
a virtual local area network (VLAN) tag to each packet.
▪ For MPLS packets, the downlink NP adds an MPLS label to each
packet.
▪ For IP packets, the downlink NP searches for Address Resolution
Protocol (ARP) entries and adds MAC addresses mapped to ARP
entries to the packets.
b. The flow processing module performs traffic classification and re-marks
packets based on priorities configured on outbound interfaces.

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 11
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

c. The downstream NP limits the rate limit at which outgoing packets are
sent based on CAR parameters configured on the outbound interface or
those in the outgoing traffic classification profile.
d. Host packets destined for the MPU are sent to an MPU, and packets to be
forwarded are sent to the outbound interface-specific processing
modules.

NO TE

Due to limited CPU processing capability on an MPU, the limit on packets
destined for the CPU must be configured. This prevents attack or defective
packets from being sent to the MPU and causing high CPU usage, which
improves device security. The packets are verified, and only valid packets are sent
to the CPU at a specified rate, which defends against attacks on the CPU.
e. The outbound interface-specific processing module adds a Layer 2 header
to each packet and forwards the packets to the downlink PIC.
4. The downlink PIC converts data packets into optical and electrical signals and
forwards them through outbound interfaces connected to physical links.

3.1.1.4 Signal Flow on the Monitoring Plane
The monitoring plane monitors the system environment. If a fault occurs on a
unit, the monitoring plane isolates the fault to prevent it from affecting other
units on the device. The control and monitoring planes are working together to
support the operation and maintenance of a device and improve performance
stability.
Both the control plane and monitoring plane consist of the system operation and
maintenance unit and the monitoring units on LPUs and an SFU. Inter-board
communication is implemented using the system backplane.

NO TE

The CMU of the NE5000E-X16A is integrated on the main control board.
The CMU of the NE5000E-20 is a separate board.
Figure 3-4 illustrates the principles of signal flow transmission on the monitoring
plane.

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 12
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Figure 3-4 Signal flow transmission on the monitoring plane

The monitoring plane, like the control plane, supports bidirectional signal flows.
● Board-to-LPU signal flow: implements monitoring. The system maintenance
unit on each LPU uses a MonitorBus to collect operating information on
system units and generates control information based on the unit-specific
operating status.
● LPU-to-board signal flow: implements control. An LPU delivers control
information to modules to monitor board information, such as the installation
and operating status and fan speed. The LPU also loads a bus to locally or
remotely test or upgrade system units.
3.1.2 Chassis

3.1.2.1 NE5000E-X16A

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 13
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Overview

Table 3-1 Basic information about the NE5000E-X16A
Description Part Number Model First Last
supported supported
version version

Assembling 02350CFM CR5B0BKP166 V800R007C00 V800R024C00
Components, C SPC100 SPC500
NetEngine500
0E,CR5B0BKP
1600,NE5000
E-X16A 220V
AC/240V DC
Integrated
Chassis
Components

Assembling 02350CFN CR5B0BKP166 V800R007C00 V800R024C00
Components, D SPC100 SPC500
NetEngine500
0E,CR5B0BKP
1601,NE5000
E-X16A 380V
HVDC
Integrated
Chassis
Components

Assembling 02356681 CR5B0BKP166 V800R005C01 V800R024C00
Components, A SPC200 SPC500
CR5Z4BKP16
D00,NE5000E
-X16A
Integrated
Chassis
Components(
DC Power)

Assembling 02356682 CR5B0BKP166 V800R005C01 V800R024C00
Components, B SPC200 SPC500
CR5Z4BKP16
D00,NE5000E
-X16A
Integrated
Chassis
Components(
AC Power)

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 14
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Appearance

Figure 3-5 Appearance of the NE5000E-X16A

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 15
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Components

Figure 3-6 Components of the NE5000E-X16A

1. Air intake 2. Mounting 3. ESD jack 4. Air intake 5. Handle
frame (air ear (front) vent in the
filter) SFU area

6. Power 7. Power 8. Power 9. Switch 10. MPU
module cover module (PM) monitoring module
module (PMU)

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 16
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

11. Cable tray 12. Cable 13. SFU 14. LPU 15. Power
guide for entry module
switch and (PEM)
fabric units NOTE
(SFUs) An AC PEM is
used as an
example here.
The DC PEM is
also supported.

16. Fan 17. Air filter 18. Ground 19. Non-lifting 20. ESD jack
module terminal handle (rear)

Slot Layout

Figure 3-7 Slot Layout of the NE5000E-X16A

Table 3-2 Slots on the NE5000E-X16A
Slot Type Slot ID Slot Direction Remarks

LPU 1-7 The right side of -
the board faces
upwards

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Slot Type Slot ID Slot Direction Remarks

LPU 8-16 The right side of -
the board faces
downwards

MPU 17-18 The right side of -
the board faces
upwards

SFU 19-22 The top of the -
board faces
upwards.

Technical Specifications

Table 3-3 Technical specifications of the CR5B0BKP166C
Item Specification

Cabinet installation standards The chassis can be installed in a 19-
inch standard cabinet with a depth of
800 mm (31.50 in.). By default, the
chassis is installed in a Huawei N68E
cabinet with a height of 2200 mm
(86.61 in.).

Dimensions without packaging (H x W 1778 mm x 442 mm x 650 mm (70.00
x D) [mm(in.)] in. x 17.40 in. x 25.59 in.)

Chassis height [U] 40U

Weight without packaging [kg(lb)] 145 kg (319.67 lb)

Weight with packaging [kg(lb)] 257 kg (566.58 lb)

Weight without packaging (full 400G single-chassis (full
configuration) [kg(lb)] configuration): 364 kg (802.48 lb)
400G cluster (full configuration): 380
kg (837.76 lb)
1T single-chassis (full configuration):
384 kg (846.58 lb)
1T cluster (full configuration): 405 kg
(892.87 lb)
NOTE
The weight of a device can be estimated
based on the board configuration using
Info-Finder Hardware Configuration.

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 18
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Specification

Typical power consumption (with 400G single-chassis:10000 W
configuration) [W] 400G cluster:11000 W
1T single-chassis:11000 W
1T cluster:13000 W
NOTE
The power consumption of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

Typical heat dissipation (with 400G single-chassis:32444.2 BTU/hour
configuration) [BTU/hour] 400G cluster:35688.6 BTU/hour
1T single-chassis:35688.6 BTU/hour
1T cluster:42177.5 BTU/hour
NOTE
The heat dissipation of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

MTBF [year] 20.14 year

MTTR [hour] 0.5 hour

Availability 0.99999

Power supply mode AC/HVDC

Maximum number of power chassis (4 channels/PEM) x 4 PEM=(1
inputs channel/PM) x 4 PM x 4 PEM=16
channels

Rated input voltage [V] AC: 200 V to 240 V
HVDC: 240 V/380 V

Input voltage range [V] AC:
Voltage range:180 V to 264 V
220 V rated voltage:200 V to 240 V
HVDC:
192 V to 400 V

Maximum input current [A] AC:16 A/single-module
HVDC:14 A/single-module

Rated output power [W] 3000 W

Maximum input cable size [mm²] AC: Standard C19 cable
HVDC: 2.5 mm²

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 19
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Specification

Front-end circuit breaker/fuse [A] AC:16 A/single-module
HVDC:14 A/single-module
[400 bundle]HVDC device: 10 PMs, in
need of 10 channels of 14A
[1T bundle]HVDC device: 14 PMs, in
need of 14 channels of 14A

Airflow direction From front to back

Noise at normal temperature (acoustic Complies with the NEBS standard (<
power) [dB(A)] 78 dB(A) @ 27°C).

Number of slots 22

Number of service board slots 16

Switching capacity 40.96 Tbit/s

Redundant MPUs 1:1

Redundant Switch fabrics 3+1

Redundant CMUs 1+1

Redundant power supply N+N

Redundant fans Consists of upper and lower areas.
(400G) Two fan modules. If a single
fan fails, the system can still work for
a short period of time at an ambient
temperature of 40°C.
(1T) Three fan modules. If a single fan
fails, the system can still work for a
short period of time at an ambient
temperature of 40°C.

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

Restriction on the operating ≤ 0.5°C/min (32.9°F/min), non-
temperature variation rate [°C(°F)] condensing

Storage temperature [°C(°F)] –40°C to +70°C (–40°F to +158 °F)

Long-term operating relative humidity 5% RH to 85% RH, non-condensing
[RH]

Short-term operating relative humidity 5% RH to 95% RH, non-condensing
[RH]

Storage relative humidity [RH] 5% RH to 95% RH, non-condensing

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Specification

Long-term operating altitude [m(ft.)] 3000M @ 40°C

Storage altitude [m(ft.)] < 5000 m (16404.2 ft.)

Table 3-4 Technical specifications of the CR5B0BKP166D
Item Specification

Cabinet installation standards The chassis can be installed in a 19-
inch standard cabinet with a depth of
800 mm (31.50 in.). By default, the
chassis is installed in a Huawei N68E
cabinet with a height of 2200 mm
(86.61 in.).

Dimensions without packaging (H x W 1778 mm x 442 mm x 650 mm (70.00
x D) [mm(in.)] in. x 17.40 in. x 25.59 in.)

Chassis height [U] 40U

Weight without packaging [kg(lb)] 145 kg (319.67 lb)

Weight with packaging [kg(lb)] 257 kg (566.58 lb)

Weight without packaging (full 400G single-chassis (full
configuration) [kg(lb)] configuration): 364 kg (802.48 lb)
400G cluster (full configuration): 380
kg (837.76 lb)
1T single-chassis (full configuration):
384 kg (846.58 lb)
1T cluster (full configuration): 405 kg
(892.87 lb)
NOTE
The weight of a device can be estimated
based on the board configuration using
Info-Finder Hardware Configuration.

Typical power consumption (with 400G single-chassis:10000 W
configuration) [W] 400G cluster:11000 W
1T single-chassis:11000 W
1T cluster:13000 W
NOTE
The power consumption of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Specification

Typical heat dissipation (with 400G single-chassis:32444.2 BTU/hour
configuration) [BTU/hour] 400G cluster:35688.6 BTU/hour
1T single-chassis:35688.6 BTU/hour
1T cluster:42177.5 BTU/hour
NOTE
The heat dissipation of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

MTBF [year] 20.14 year

MTTR [hour] 0.5 hour

Availability 0.99999

Power supply mode HVDC

Maximum number of power chassis (4 channels/PEM) x 4 PEM=(1
inputs channel/PM) x 4 PM x 4 PEM=16
channels

Rated input voltage [V] 240V/380V

Input voltage range [V] 192 V to 400 V

Maximum input current [A] 14A/single-module

Rated output power [W] 3000 W

Maximum input cable size [mm²] 2.5 mm²

Front-end circuit breaker/fuse [A] 16 A/single-module
[400 bundle]HVDC device: 10 PMs, in
need of 10 channels of 16A
[1T bundle]HVDC device: 14 PMs, in
need of 14 channels of 16A

Airflow direction From front to back

Noise at normal temperature (acoustic Complies with the NEBS standard (<
power) [dB(A)] 78 dB(A) @ 27°C).

Number of slots 22

Number of service board slots 16

Switching capacity 40.96 Tbit/s

Redundant MPUs 1:1

Redundant Switch fabrics 3+1

Redundant CMUs 1+1

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 22
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Specification

Redundant power supply N+N

Redundant fans Consists of upper and lower areas.
(400G) Two fan modules. If a single
fan fails, the system can still work for
a short period of time at an ambient
temperature of 40°C.
(1T) Three fan modules. If a single fan
fails, the system can still work for a
short period of time at an ambient
temperature of 40°C.

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

Restriction on the operating ≤ 0.5°C/min (32.9°F/min), non-
temperature variation rate [°C(°F)] condensing

Storage temperature [°C(°F)] –40°C to +70°C (–40°F to +158 °F)

Long-term operating relative humidity 5% RH to 85% RH, non-condensing
[RH]

Short-term operating relative humidity 5% RH to 95% RH, non-condensing
[RH]

Storage relative humidity [RH] 5% RH to 95% RH, non-condensing

Long-term operating altitude [m(ft.)] 3000M @ 40°C

Storage altitude [m(ft.)] < 5000 m (16404.2 ft.)

Table 3-5 Technical specifications of the CR5B0BKP166A
Item Specification

Cabinet installation standards The chassis can be installed in a 19-
inch standard cabinet with a depth of
800 mm (31.50 in.). By default, the
chassis is installed in a Huawei N68E
cabinet with a height of 2200 mm
(86.61 in.).

Dimensions without packaging (H x W 1778 mm x 442 mm x 650 mm (70.00
x D) [mm(in.)] in. x 17.40 in. x 25.59 in.)

Chassis height [U] 40U

Weight without packaging [kg(lb)] 123 kg (271.17 lb)

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 23
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Specification

Weight with packaging [kg(lb)] 145 kg (319.67 lb)

Weight without packaging (full 400G single-chassis (full
configuration) [kg(lb)] configuration): 364 kg (802.48 lb)
400G cluster (full configuration): 380
kg (837.76 lb)
1T single-chassis (full configuration):
384 kg (846.58 lb)
1T cluster (full configuration): 405 kg
(892.87 lb)
NOTE
The weight of a device can be estimated
based on the board configuration using
Info-Finder Hardware Configuration.

Typical power consumption (with 400G single-chassis:10000 W
configuration) [W] 400G cluster:11000 W
1T single-chassis:11000 W
1T cluster:13000 W
NOTE
The power consumption of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

Typical heat dissipation (with 400G single-chassis:32444.2 BTU/hour
configuration) [BTU/hour] 400G cluster:35688.6 BTU/hour
1T single-chassis:35688.6 BTU/hour
1T cluster:42177.5 BTU/hour
NOTE
The heat dissipation of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

MTBF [year] 20.14 year

MTTR [hour] 0.5 hour

Availability 0.99999

Power supply mode DC

Maximum number of power chassis (4 channels/PEM) x 4 PEM=(1
inputs channel/PM) x 4 PM x 4 PEM=16
channels

Rated input voltage [V] –48 V/–60 V

Input voltage range [V] –40 V to –72 V

Maximum input current [A] 63 A/single-module

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Specification

Rated output power [W] 2200 W

Maximum input cable size [mm²] 35 mm²/channel

Front-end circuit breaker/fuse [A] > 63A/single-module

Airflow direction From front to back

Noise at normal temperature (acoustic Complies with the NEBS standard (<
power) [dB(A)] 78 dB(A) @ 27°C).

Number of slots 22

Number of service board slots 16

Switching capacity 40.96 Tbit/s

Redundant MPUs 1:1

Redundant Switch fabrics 3+1

Redundant CMUs 1+1

Redundant power supply N+N

Redundant fans Consists of upper and lower areas.
(400G) Two fan modules. If a single
fan fails, the system can still work for
a short period of time at an ambient
temperature of 40°C.
(1T) Three fan modules. If a single fan
fails, the system can still work for a
short period of time at an ambient
temperature of 40°C.

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

Restriction on the operating ≤ 0.5°C/min (32.9°F/min), non-
temperature variation rate [°C(°F)] condensing

Storage temperature [°C(°F)] –40°C to +70°C (–40°F to +158 °F)

Long-term operating relative humidity 5% RH to 85% RH, non-condensing
[RH]

Short-term operating relative humidity 5% RH to 95% RH, non-condensing
[RH]

Storage relative humidity [RH] 5% RH to 95% RH, non-condensing

Long-term operating altitude [m(ft.)] 3000M @ 40°C

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 25
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Specification

Storage altitude [m(ft.)] < 5000 m (16404.2 ft.)

Table 3-6 Technical specifications of the CR5B0BKP166B
Item Specification

Cabinet installation standards The chassis can be installed in a 19-
inch standard cabinet with a depth of
800 mm (31.50 in.). By default, the
chassis is installed in a Huawei N68E
cabinet with a height of 2200 mm
(86.61 in.).

Dimensions without packaging (H x W 1778 mm x 442 mm x 650 mm (70.00
x D) [mm(in.)] in. x 17.40 in. x 25.59 in.)

Chassis height [U] 40U

Weight without packaging [kg(lb)] 123 kg (271.17 lb)

Weight with packaging [kg(lb)] 145 kg (319.67 lb)

Weight without packaging (full 400G single-chassis (full
configuration) [kg(lb)] configuration): 364 kg (802.48 lb)
400G cluster (full configuration): 380
kg (837.76 lb)
1T single-chassis (full configuration):
384 kg (846.58 lb)
1T cluster (full configuration): 405 kg
(892.87 lb)
NOTE
The weight of a device can be estimated
based on the board configuration using
Info-Finder Hardware Configuration.

Typical power consumption (with 400G single-chassis:10000 W
configuration) [W] 400G cluster:11000 W
1T single-chassis:11000 W
1T cluster:13000 W
NOTE
The power consumption of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 26
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Specification

Typical heat dissipation (with 400G single-chassis:32444.2 BTU/hour
configuration) [BTU/hour] 400G cluster:35688.6 BTU/hour
1T single-chassis:35688.6 BTU/hour
1T cluster:42177.5 BTU/hour
NOTE
The heat dissipation of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

MTBF [year] 20.14 year

MTTR [hour] 0.5 hour

Availability 0.99999

Power supply mode AC

Maximum number of power chassis (4 channels/PEM) x 4 PEM=(1
inputs channel/PM) x 4 PM x 4 PEM=16
channels

Rated input voltage [V] 200V to 240V

Input voltage range [V] 180V to 264V

Maximum input current [A] 16 A/single-module

Rated output power [W] 3000 W

Maximum input cable size [mm²] Standard C19 cable

Front-end circuit breaker/fuse [A] 16A/single-module

Airflow direction From front to back

Noise at normal temperature (acoustic Complies with the NEBS standard (<
power) [dB(A)] 78 dB(A) @ 27°C).

Number of slots 22

Number of service board slots 16

Switching capacity 40.96 Tbit/s

Redundant MPUs 1:1

Redundant Switch fabrics 3+1

Redundant CMUs 1+1

Redundant power supply N+N

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 27
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Specification

Redundant fans Consists of upper and lower areas.
(400G) Two fan modules. If a single
fan fails, the system can still work for
a short period of time at an ambient
temperature of 40°C.
(1T) Three fan modules. If a single fan
fails, the system can still work for a
short period of time at an ambient
temperature of 40°C.

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

Restriction on the operating ≤ 0.5°C/min (32.9°F/min), non-
temperature variation rate [°C(°F)] condensing

Storage temperature [°C(°F)] –40°C to +70°C (–40°F to +158 °F)

Long-term operating relative humidity 5% RH to 85% RH, non-condensing
[RH]

Short-term operating relative humidity 5% RH to 95% RH, non-condensing
[RH]

Storage relative humidity [RH] 5% RH to 95% RH, non-condensing

Long-term operating altitude [m(ft.)] 3000M @ 40°C

Storage altitude [m(ft.)] < 5000 m (16404.2 ft.)

NO TE

● About condensation
The ability of air to contain moisture reduces as the temperature decreases. There is a
relationship between temperature and relative humidity. As the temperature decreases,
the air becomes more saturated with moisture, meaning the relative humidity increases.
But at a low enough temperature (called the dew point), the air can no longer contain
moisture, which is then precipitated as liquid water. Such water on the surface of
relevant equipment is called condensation.
● Hazards of condensation
When condensation mixes with dust inside the equipment, it forms conductive channels
that affect the electrical insulation of the equipment. As a result, a non-conductive area
of the equipment can become conductive, causing the equipment to malfunction.
● Conditions that cause condensation
Condensation is related to temperature changes and humidity. It occurs when the
temperature continues to decrease below the dew point at a given humidity. For
example, given that the relative humidity is 50% RH and the temperature is 25°C (77°F),
condensation occurs when the temperature decreases below 13.9°C (57.02°F).

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 28
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

3.1.2.2 NE5000E-X16B

Overview

Table 3-7 Basic information about the NE5000E-X16B
Description Part Number Model First Last
supported supported
version version

Assembling 02350CME CR5BBKP6BD V800R007C00 V800R024C00
Components, 61 SPC100 SPC500
NetEngine500
0E,CR5BBKP6
BD01,NE5000
E-X16B 220V
AC/240V DC
Integrated
Chassis
Components

Assembling 02350CMF CR5BBKP6BD V800R007C00 V800R024C00
Components, 62 SPC100 SPC500
NetEngine500
0E,CR5BBKP6
BD02,NE5000
E-X16B 380V
DC Integrated
Chassis
Components

Assembling 02359085 CR5BBKP6BD V800R006C00 V800R024C00
Components, 60 SPC600 SPC500
CR5Z5BKP16G
00,NE5000E-
X16B
Integrated
Chassis
Components(
DC Power)

Assembling 02359086 CR5BBKP6BA V800R006C00 V800R024C00
Components, 60 SPC600 SPC500
CR5Z5BKP16G
01,NE5000E-
X16B
Integrated
Chassis
Components(
AC Power)

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 29
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Appearance

Figure 3-8 Appearance of the NE5000E-X16B

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 30
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Components

Figure 3-9 Components of the NE5000E-X16B

1. Air intake 2. Mounting 3. ESD jack 4. Air intake 5. Handle
frame (air ear (front) vent in the
filter) SFU area

6. Power 7. Power 8. Power 9. Switch 10. MPU
module cover module (PM) monitoring module
module (PMU)

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 31
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

11. Cable tray 12. Cable 13. SFU 14. LPU 15. Power
guide for entry module
switch and (PEM)
fabric units NOTE
(SFUs) An AC PEM is
used as an
example here.
The DC PEM is
also supported.

16. Fan 17. Air filter 18. Ground 19. Non-lifting 20. ESD jack
module terminal handle (rear)

Slot Layout

Figure 3-10 Slot Layout of the NE5000E-X16B

Table 3-8 Slots on the NE5000E-X16B
Slot Type Slot ID Slot Direction Remarks

LPU 1-7 The right side of -
the board faces
upwards

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Slot Type Slot ID Slot Direction Remarks

LPU 8-16 The right side of -
the board faces
downwards

MPU 17-18 The right side of -
the board faces
upwards

SFU 19-22 The top of the -
board faces
upwards.

Technical Specifications

Table 3-9 Technical specifications of the CR5BBKP6BD61
Item Specification

Cabinet installation standards Can be installed in a 1000 mm-deep
standard 19-inch cabinet and is
installed in a 2200 mm-high Huawei
N610E cabinet by default.

Dimensions without packaging (H x W 1778 mm x 442 mm x 650 mm (70.00
x D) [mm(in.)] in. x 17.40 in. x 25.59 in.)

Chassis height [U] 40U

Weight without packaging [kg(lb)] 145 kg (319.67 lb)

Weight with packaging [kg(lb)] 148 kg (326.28 lb)

Weight without packaging (full 1T single-chassis (full configuration):
configuration) [kg(lb)] 376 kg (828.94 lb)
2T cluster (full configuration): 434 kg
(956.81 lb)
NOTE
The weight of a device can be estimated
based on the board configuration using
Info-Finder Hardware Configuration.

Typical power consumption (with 1T single-chassis:12300 W
configuration) [W] 2T single-chassis:19100 W
NOTE
The power consumption of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Specification

Typical heat dissipation (with 1T single-chassis:39906.4 BTU/hour
configuration) [BTU/hour] 2T single-chassis:61968.4 BTU/hour
NOTE
The heat dissipation of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

MTBF [year] 12.20 year

MTTR [hour] 0.5 hour

Availability 0.99999

Power supply mode AC/HVDC

Maximum number of power chassis (4 channels/PEM) x 4 PEM=(1
inputs channel/PM) x 4 PM x 4 PEM=16
channels

Rated input voltage [V] AC: 200 V to 240 V
HVDC: 240 V/380 V

Input voltage range [V] AC:
Voltage range:180 V to 264 V
220 V rated voltage:200 V to 240 V
HVDC:
192 V to 400 V

Maximum input current [A] AC:16A/single-module
HVDC:14A/single-module

Rated output power [W] 3000 W

Maximum input cable size [mm²] AC: Standard C19 cable
HVDC: 2.5 mm²

Front-end circuit breaker/fuse [A] AC: 16 A/single-module
HVDC: 14 A/single-module
[1T bundle] HVDC device: 14 PMs, in
need of 14 channels of 14A
[2T bundle] HVDC device: 16 PMs, in
need of 16 channels of 14A

Airflow direction From front to back

Noise at normal temperature (acoustic Complies with the NEBS standard (<
power) [dB(A)] 78 dB(A) @ 27°C).

Number of slots 22

Number of service board slots 16

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Specification

Switching capacity 81.92 Tbit/s

Redundant MPUs 1:1

Redundant Switch fabrics 3+1

Redundant CMUs 1+1

Redundant power supply N+N

Redundant fans Consists of upper and lower areas.
Three fan modules. If a single fan fails,
the system can still work for a short
period of time at an ambient
temperature of 40°C.

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

Restriction on the operating ≤ 0.5°C/min (32.9°F/min), non-
temperature variation rate [°C(°F)] condensing

Storage temperature [°C(°F)] –40°C to +70°C (–40°F to +158 °F)

Long-term operating relative humidity 5% RH to 85% RH, non-condensing
[RH]

Short-term operating relative humidity 5% RH to 95% RH, non-condensing
[RH]

Storage relative humidity [RH] 5% RH to 95% RH, non-condensing

Long-term operating altitude [m(ft.)] 3000M @ 40°C

Storage altitude [m(ft.)] < 5000 m (16404.2 ft.)

Table 3-10 Technical specifications of the CR5BBKP6BD62
Item Specification

Cabinet installation standards Can be installed in a 1000 mm-deep
standard 19-inch cabinet and is
installed in a 2200 mm-high Huawei
N610E cabinet by default.

Dimensions without packaging (H x W 1778 mm x
x D) [mm(in.)] 442 mm x 650 mm (70.00 in. x 17.40
in. x 25.59 in.)

Chassis height [U] 40U

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Specification

Weight without packaging [kg(lb)] 145 kg (319.67 lb)

Weight with packaging [kg(lb)] 148 kg (326.28 lb)

Weight without packaging (full 1T single-chassis (full configuration):
configuration) [kg(lb)] 376 kg (828.94 lb)
2T cluster (full configuration): 434 kg
(956.81 lb)
NOTE
The weight of a device can be estimated
based on the board configuration using
Info-Finder Hardware Configuration.

Typical power consumption (with 1T single-chassis:12300 W
configuration) [W] 2T single-chassis:19100 W
NOTE
The power consumption of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

Typical heat dissipation (with 1T single-chassis:39906.4 BTU/hour
configuration) [BTU/hour] 2T single-chassis:61968.4 BTU/hour
NOTE
The heat dissipation of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

MTBF [year] 12.20 year

MTTR [hour] 0.5 hour

Availability 0.99999

Power supply mode HVDC

Maximum number of power chassis (4 channels/PEM) x 4 PEM=(1
inputs channel/PM) x 4 PM x 4 PEM=16
channels

Rated input voltage [V] 240V/380V

Input voltage range [V] 192 V to 400 V

Maximum input current [A] 14A/single-module

Rated output power [W] 3000 W

Maximum input cable size [mm²] 2.5 mm²

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 36
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Specification

Front-end circuit breaker/fuse [A] 14 A/single-module
[1T bundle] HVDC device: 14 PMs, in
need of 14 channels of 14A
[2T bundle] HVDC device: 16 PMs, in
need of 16 channels of 14A

Airflow direction From front to back

Noise at normal temperature (acoustic Complies with the NEBS standard (<
power) [dB(A)] 78 dB(A) @ 27°C).

Number of slots 22

Number of service board slots 16

Switching capacity 81.92 Tbit/s

Redundant MPUs 1:1

Redundant Switch fabrics 3+1

Redundant CMUs 1+1

Redundant power supply N+N

Redundant fans Consists of upper and lower areas.
Three fan modules. If a single fan fails,
the system can still work for a short
period of time at an ambient
temperature of 40°C.

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

Restriction on the operating ≤ 0.5°C/min (32.9°F/min), non-
temperature variation rate [°C(°F)] condensing

Storage temperature [°C(°F)] –40°C to +70°C (–40°F to +158 °F)

Long-term operating relative humidity 5% RH to 85% RH, non-condensing
[RH]

Short-term operating relative humidity 5% RH to 95% RH, non-condensing
[RH]

Storage relative humidity [RH] 5% RH to 95% RH, non-condensing

Long-term operating altitude [m(ft.)] 3000M @ 40°C

Storage altitude [m(ft.)] < 5000 m (16404.2 ft.)

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 37
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Table 3-11 Technical specifications of the CR5BBKP6BD60
Item Specification

Cabinet installation standards Can be installed in a 1000 mm-deep
standard 19-inch cabinet and is
installed in a 2200 mm-high Huawei
N610E cabinet by default.

Dimensions without packaging (H x W 1778 mm x 442 mm x 650 mm (70.00
x D) [mm(in.)] in. x 17.40 in. x 25.59 in.)

Chassis height [U] 40U

Weight without packaging [kg(lb)] 145 kg (319.67 lb)

Weight with packaging [kg(lb)] 148 kg (326.28 lb)

Weight without packaging (full 1T single-chassis (full configuration):
configuration) [kg(lb)] 376 kg (828.94 lb)
2T cluster (full configuration): 434 kg
(956.81 lb)
NOTE
The weight of a device can be estimated
based on the board configuration using
Info-Finder Hardware Configuration.

Typical power consumption (with 1T single-chassis:12300 W
configuration) [W] 2T single-chassis:19100 W
NOTE
The power consumption of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

Typical heat dissipation (with 1T single-chassis:39906.4 BTU/hour
configuration) [BTU/hour] 2T single-chassis:61968.4 BTU/hour
NOTE
The heat dissipation of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

MTBF [year] 12.20 year

MTTR [hour] 0.5 hour

Availability 0.99999

Power supply mode DC

Maximum number of power chassis (4 channels/PEM) x 4 PEM=(1
inputs channel/PM) x 4 PM x 4 PEM=16
channels

Rated input voltage [V] –48 V/–60 V

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Specification

Input voltage range [V] –40 V to –72 V

Maximum input current [A] 63 A/single-module

Rated output power [W] 2200 W

Maximum input cable size [mm²] 35 mm²/channel

Front-end circuit breaker/fuse [A] > 63A/single-module

Airflow direction From front to back

Noise at normal temperature (acoustic Complies with the NEBS standard (<
power) [dB(A)] 78 dB(A) @ 27°C).

Number of slots 22

Number of service board slots 16

Switching capacity 81.92 Tbit/s

Redundant MPUs 1:1

Redundant Switch fabrics 3+1

Redundant CMUs 1+1

Redundant power supply N+1

Redundant fans Consists of upper and lower areas.
Three fan modules. If a single fan fails,
the system can still work for a short
period of time at an ambient
temperature of 40°C.

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

Restriction on the operating ≤ 0.5°C/min (32.9°F/min), non-
temperature variation rate [°C(°F)] condensing

Storage temperature [°C(°F)] –40°C to +70°C (–40°F to +158 °F)

Long-term operating relative humidity 5% RH to 85% RH, non-condensing
[RH]

Short-term operating relative humidity 5% RH to 95% RH, non-condensing
[RH]

Storage relative humidity [RH] 5% RH to 95% RH, non-condensing

Long-term operating altitude [m(ft.)] 3000M @ 40°C

Storage altitude [m(ft.)] < 5000 m (16404.2 ft.)

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 39
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Table 3-12 Technical specifications of the CR5BBKP6BA60
Item Specification

Cabinet installation standards Can be installed in a 1000 mm-deep
standard 19-inch cabinet and is
installed in a 2200 mm-high Huawei
N610E cabinet by default.

Dimensions without packaging (H x W 1778 mm x 442 mm x 650 mm (70.00
x D) [mm(in.)] in. x 17.40 in. x 25.59 in.)

Chassis height [U] 40U

Weight without packaging [kg(lb)] 145 kg (319.67 lb)

Weight with packaging [kg(lb)] 148 kg (326.28 lb)

Weight without packaging (full 1T single-chassis (full configuration):
configuration) [kg(lb)] 376 kg (828.94 lb)
2T cluster (full configuration): 434 kg
(956.81 lb)
NOTE
The weight of a device can be estimated
based on the board configuration using
Info-Finder Hardware Configuration.

Typical power consumption (with 1T single-chassis:12300 W
configuration) [W] 2T single-chassis:19100 W
NOTE
The power consumption of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

Typical heat dissipation (with 1T single-chassis:39906.4 BTU/hour
configuration) [BTU/hour] 2T single-chassis:61968.4 BTU/hour
NOTE
The heat dissipation of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

MTBF [year] 12.20 year

MTTR [hour] 0.5 hour

Availability 0.99999

Power supply mode AC

Maximum number of power chassis (4 channels/PEM) x 4 PEM=(1
inputs channel/PM) x 4 PM x 4 PEM=16
channels

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Specification

Rated input voltage [V] 200V to 240V

Input voltage range [V] 180V to 264V

Maximum input current [A] 16 A/single-module

Rated output power [W] 3000 W

Maximum input cable size [mm²] Standard C19 cable

Front-end circuit breaker/fuse [A] 16A/single-module

Airflow direction From front to back

Noise at normal temperature (acoustic Complies with the NEBS standard (<
power) [dB(A)] 78 dB(A) @ 27°C).

Number of slots 22

Number of service board slots 16

Switching capacity 81.92 Tbit/s

Redundant MPUs 1:1

Redundant Switch fabrics 3+1

Redundant CMUs 1+1

Redundant power supply N+N

Redundant fans Consists of upper and lower areas.
Three fan modules. If a single fan fails,
the system can still work for a short
period of time at an ambient
temperature of 40°C.

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

Restriction on the operating ≤ 0.5°C/min (32.9°F/min), non-
temperature variation rate [°C(°F)] condensing

Storage temperature [°C(°F)] –40°C to +70°C (–40°F to +158 °F)

Long-term operating relative humidity 5% RH to 85% RH, non-condensing
[RH]

Short-term operating relative humidity 5% RH to 95% RH, non-condensing
[RH]

Storage relative humidity [RH] 5% RH to 95% RH, non-condensing

Long-term operating altitude [m(ft.)] 3000M @ 40°C

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Specification

Storage altitude [m(ft.)] < 5000 m (16404.2 ft.)

NO TE

● About condensation
The ability of air to contain moisture reduces as the temperature decreases. There is a
relationship between temperature and relative humidity. As the temperature decreases,
the air becomes more saturated with moisture, meaning the relative humidity increases.
But at a low enough temperature (called the dew point), the air can no longer contain
moisture, which is then precipitated as liquid water. Such water on the surface of
relevant equipment is called condensation.
● Hazards of condensation
When condensation mixes with dust inside the equipment, it forms conductive channels
that affect the electrical insulation of the equipment. As a result, a non-conductive area
of the equipment can become conductive, causing the equipment to malfunction.
● Conditions that cause condensation
Condensation is related to temperature changes and humidity. It occurs when the
temperature continues to decrease below the dew point at a given humidity. For
example, given that the relative humidity is 50% RH and the temperature is 25°C (77°F),
condensation occurs when the temperature decreases below 13.9°C (57.02°F).

3.1.2.3 NE5000E-20

Overview

Table 3-13 Basic information about the NE5000E-20
Description Part Number Model First Remarks
supported
version

NE5000E-20 02353BSP CR5B0BKP206 V800R011C10 Including the
Integrated C SPC500 main chassis
Chassis and (02351VYV)
Cabinet DC and power
Components frame
(include (02312NSH)
chassis and
power
distribution
frame)

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Description Part Number Model First Remarks
supported
version

NE5000E-20 02353BSS CR5B0BKP206 V800R011C10 Including the
Integrated D SPC500 main chassis
Chassis and (02351WBJ)
Cabinet AC and power
and HVDC frame
Components(i (02312LWQ)
nclude chassis
and power
distribution
frame)

Appearance

Figure 3-11 Appearance of the NE5000E-20

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Components

Figure 3-12 Components of the NE5000E-20

1. PM cover 2. PM slot 3. Switch slot 4. CMU slot

5. Overhead cable 6. LPU slot 7. Front cabinet 8. MPU slot
tray door

9. SFU slot 10. Front ESD jack 11. Bottom cable 12. Ground
tray terminal

13. PEM slot 14. Fan Tray 15. Advanced 16. Rear ESD jack
Assembly-T 2.0 cabinet door

17. Fan Tray 18. Ejector lever - -
Assembly B

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

NO TE

The advanced cabinet door consists of an enclosure frame and left and right doors and resides
at the rear of the NE5000E chassis. It significantly reduces noise to protect human ears. The
weight of the advanced cabinet door is 43.5 kg, and the dimensions (H x W x D) of the
advanced cabinet door are 2200 mm x 600 mm x 227.5 mm.

Slot Layout

Figure 3-13 Slot Layout of the NE5000E-20

Table 3-14 Slots on the NE5000E-20

Slot Type Slot ID Slot Direction Remarks

LPU 1-10 The right side of -
the board faces
upwards

LPU 11-20 The right side of -
the board faces
downwards

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Slot Type Slot ID Slot Direction Remarks

MPU 21-22 The top of the -
board faces
upwards.

SFU 23-30 The top of the -
board faces
upwards.

CMU 32-33 The top of the -
board faces
upwards.

FAN 39-48 The top of the -
board faces
upwards.

PEM 37 The top of the -
board faces
upwards.

Technical Specifications

Table 3-15 Technical specifications of the CR5B0BKP206C
Item Specification

Cabinet installation standards Integrated chassis and cabinet (with
acoustic doors)

Dimensions without packaging (H x W 2200 mm x
x D) [mm(in.)] 600 mm x 1000 mm (86.61 in. x 23.62
in. x 39.37 in.)

Chassis height [U] 49.5U

Weight without packaging [kg(lb)] 374 kg (824.52 lb)

Weight with packaging [kg(lb)] 440 kg (970.02 lb)

Weight without packaging (full 1.6T single-chassis (full configuration
configuration) [kg(lb)] 100GE): 830.9 kg (1832.12 lb)
1.6T cluster (full configuration 100GE):
852.5 kg (1879.75 lb)
NOTE
The weight of a device can be estimated
based on the board configuration using
Info-Finder Hardware Configuration.

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Specification

Typical power consumption (with 1.6T single-chassis: 27030 W(2*MPU +
configuration) [W] 2*CMU + 8*SFU1T6D + 20*16*100GE +
8*FAN2.0 + 2*FAN)
1.6T cluster(configuration SFU
CR5DSFUIT26H): 29610 W(2*MPU +
2*CMU + 8*SFUI1T6H + 20*16*100GE +
8*FAN2.0 + 2*FAN)
NOTE
The power consumption of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

Typical heat dissipation (with 1.6T single-chassis: 87696.7 BTU/hour
configuration) [BTU/hour] (2*MPU + 2*CMU + 8*SFU1T6D +
20*16*100GE + 8*FAN2.0 + 2*FAN)
1.6T cluster(configuration SFU
CR5DSFUIT26H): 96067.3 BTU/hour
(2*MPU + 2*CMU + 8*SFUI1T6H +
20*16*100GE + 8*FAN2.0 + 2*FAN)
NOTE
The heat dissipation of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

MTBF [year] 23.72 year

MTTR [hour] 0.5 hour

Availability 0.99999

Power supply mode DC

Maximum number of power chassis (8 channels/PEM)*6 PEM=(2 channels/
inputs PM)*6 PM*4 PEM=48 channels

Rated input voltage [V] -48 V /-60 V

Input voltage range [V] –40 V to –72 V

Maximum input current [A] 63 A/single-module

Rated output power [W] 2200 W

Maximum input cable size [mm²] 35 mm²/channel

Front-end circuit breaker/fuse [A] 2 channels of 63 A/single-module

Heat dissipation mode I-shaped air channel

Airflow direction From front to back

Noise at normal temperature (acoustic Complies with the NEBS standard (<
power) [dB(A)] 78 dB(A) @ 27°C).

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Specification

Number of slots 32

Number of service board slots 20

Switching capacity 248.2 Tbit/s

Redundant MPUs 1:1

Redundant Switch fabrics 7+1

Redundant CMUs 1+1

Redundant power supply N+1

Redundant fans The fan modules are distributed into
the SFU area and the LPU area.
The fan modules in the SFU area are
located in the middle of the rear side
of the chassis. There are two fan
modules in total on the left and right
sides of the chassis. The device can
work properly for a short time at 40ºC
if a single fan module fails.
The fan modules in the LPU area are
located in the upper and lower areas
at the rear of the chassis. Each area
has four fan modules. For each area,
the device can work properly for a
short time at 40ºC if a single fan
module fails.

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

Restriction on the operating ≤ 0.5°C/min (32.9°F/min), non-
temperature variation rate [°C(°F)] condensing

Storage temperature [°C(°F)] –40°C to +70°C (–40°F to +158 °F)

Long-term operating relative humidity 5% RH to 85% RH, non-condensing
[RH]

Short-term operating relative humidity 5% RH to 95% RH, non-condensing
[RH]

Storage relative humidity [RH] 5% RH to 95% RH, non-condensing

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Specification

Long-term operating altitude [m(ft.)] ≤ 4000 m (13123.2 ft.) (For the
altitude in the range of 1800 m to
4000 m [5905.44 ft. to 13123.2 ft.], the
operating temperature of the device
must decrease by 1°C [1.8°F] for every
220 m [721.78 ft.].)

Storage altitude [m(ft.)] < 5000 m (16404.2 ft.)

Table 3-16 Technical specifications of the CR5B0BKP206D
Item Specification

Cabinet installation standards Integrated chassis and cabinet (with
acoustic doors)

Dimensions without packaging (H x W 2200 mm x
x D) [mm(in.)] 600 mm x 1000 mm (86.61 in. x 23.62
in. x 39.37 in.)

Chassis height [U] 49.5U

Weight without packaging [kg(lb)] 374 kg (824.52 lb)

Weight with packaging [kg(lb)] 440 kg (970.02 lb)

Weight without packaging (full 1.6T single-chassis (full configuration
configuration) [kg(lb)] 100GE): 830.9 kg (1832.12 lb)
1.6T cluster (full configuration 100GE):
852.5 kg (1879.75 lb)
NOTE
The weight of a device can be estimated
based on the board configuration using
Info-Finder Hardware Configuration.

Typical power consumption (with 1.6T single-chassis: 27030 W(2*MPU +
configuration) [W] 2*CMU + 8*SFU1T6D + 20*16*100GE +
8*FAN2.0 + 2*FAN)
1.6T cluster(configuration SFU
CR5DSFUIT26H): 29610 W(2*MPU +
2*CMU + 8*SFUI1T6H + 20*16*100GE +
8*FAN2.0 + 2*FAN)
NOTE
The power consumption of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Specification

Typical heat dissipation (with 1.6T single-chassis: 87696.7 BTU/hour
configuration) [BTU/hour] (2*MPU + 2*CMU + 8*SFU1T6D +
20*16*100GE + 8*FAN2.0 + 2*FAN)
1.6T cluster(configuration SFU
CR5DSFUIT26H): 96067.3 BTU/hour
(2*MPU + 2*CMU + 8*SFUI1T6H +
20*16*100GE + 8*FAN2.0 + 2*FAN)
NOTE
The heat dissipation of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

MTBF [year] 23.72 year

MTTR [hour] 0.5 hour

Availability 0.99999

Power supply mode AC/HVDC

Maximum number of power chassis (8 channels/PEM)*6 PEM=(2 channels/
inputs PM)*6 PM*4 PEM=48 channels

Rated input voltage [V] AC: 200 V to 240 V
High-voltage DC: 240 V/380 V

Input voltage range [V] AC:
Maximum range: 180 V to 264 V
Rated voltage of the 220 V power grid:
200 V–240 V
High-voltage DC:
192 V–400 V

Maximum input current [A] AC: 16 A per module
High-voltage DC: 14 A per module

Rated output power [W] 3000 W

Maximum input cable size [mm²] AC: Standard C19 cable
High-voltage DC: 2.5 mm²

Front-end circuit breaker/fuse [A] AC: 16 A per module
High-voltage DC: 14 A per module

Heat dissipation mode I-shaped air channel

Airflow direction From front to back

Noise at normal temperature (acoustic Complies with the NEBS standard (<
power) [dB(A)] 78 dB(A) @ 27°C).

Number of slots 32

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Specification

Number of service board slots 20

Switching capacity 248.2 Tbit/s

Redundant MPUs 1:1

Redundant Switch fabrics 7+1

Redundant CMUs 1+1

Redundant power supply N+1

Redundant fans The fan modules are distributed into
the SFU area and the LPU area.
The fan modules in the SFU area are
located in the middle of the rear side
of the chassis. There are two fan
modules in total on the left and right
sides of the chassis. The device can
work properly for a short time at 40ºC
if a single fan module fails.
The fan modules in the LPU area are
located in the upper and lower areas
at the rear of the chassis. Each area
has four fan modules. For each area,
the device can work properly for a
short time at 40ºC if a single fan
module fails.

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

Restriction on the operating ≤ 0.5°C/min (32.9°F/min), non-
temperature variation rate [°C(°F)] condensing

Storage temperature [°C(°F)] –40°C to +70°C (–40°F to +158 °F)

Long-term operating relative humidity 5% RH to 85% RH, non-condensing
[RH]

Short-term operating relative humidity 5% RH to 95% RH, non-condensing
[RH]

Storage relative humidity [RH] 5% RH to 95% RH, non-condensing

Long-term operating altitude [m(ft.)] ≤ 4000 m (13123.2 ft.) (For the
altitude in the range of 1800 m to
4000 m [5905.44 ft. to 13123.2 ft.], the
operating temperature of the device
must decrease by 1°C [1.8°F] for every
220 m [721.78 ft.].)

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Hardware Guide 3 Hardware Description

Item Specification

Storage altitude [m(ft.)] < 5000 m (16404.2 ft.)

NO TE

● About condensation
The ability of air to contain moisture reduces as the temperature decreases. There is a
relationship between temperature and relative humidity. As the temperature decreases,
the air becomes more saturated with moisture, meaning the relative humidity increases.
But at a low enough temperature (called the dew point), the air can no longer contain
moisture, which is then precipitated as liquid water. Such water on the surface of
relevant equipment is called condensation.
● Hazards of condensation
When condensation mixes with dust inside the equipment, it forms conductive channels
that affect the electrical insulation of the equipment. As a result, a non-conductive area
of the equipment can become conductive, causing the equipment to malfunction.
● Conditions that cause condensation
Condensation is related to temperature changes and humidity. It occurs when the
temperature continues to decrease below the dew point at a given humidity. For
example, given that the relative humidity is 50% RH and the temperature is 25°C (77°F),
condensation occurs when the temperature decreases below 13.9°C (57.02°F).
3.1.3 Power

3.1.3.1 NE5000E-X16A Power Supply System

3.1.3.1.1 Overview

Introduction to Modules
As shown in Figure 3-14, the NE5000E-X16A power system is located at the top of
the chassis. The main components are the PMs, PMUs, and switches in the front of
the chassis and the PEMs at the rear of the chassis. Table 3-17 describes the
functions of each module.

Figure 3-14 Main components of the power system

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Table 3-17 Functions of main components of the NE5000E-X16A power system

Component Description

1 PM Converts the power supplied to the PEM and supplies
power to the entire device through the backplane.

2 PMU Manages PMs and PEMs by monitoring their working
status and reporting the status to the host.

3 Switch Controls the power output of PMs. The two switches back
up each other. When one or two switches are in the ON
state, the power output of PMs is enabled.

4 PEM Connects to the external power supply system and
supplies power to the NE5000E-X16A. The right and left
parts of the PEM correspond to power supply areas A and
B, respectively.
Power supply areas A and B are two power supply
systems with different sources. The system connects to
different power supply systems, ensuring that the system
remains powered-on if one power supply system fails.
NOTE
PEMs are integrated into the chassis and do not need to be
configured onsite. Do not remove and install PEMs onsite.

Power Module Mappings

The NE5000E-X16A supports multiple power supply scenarios, which vary in the
installed PEMs and PMs. Table 3-18 lists the mappings between power supply
scenarios and PEMs/PMs.

Table 3-18 Mappings between power supply scenarios and PEMs/PMs on the
NE5000E-X16A

Power Supply Scenario PEM PM

-48 V DC power supply DC PEM DC PM

AC power supply ● AC PEM ● 2700 W AC PM
● AC&HVDC PEM ● 3000 W AC&HVDC
PM

240 V HVDC power AC/HVDC PEM 3000 W AC&HVDC PM
supply

380 V HVDC power AC/HVDC PEM 3000 W AC&HVDC PM
supply

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Hardware Guide 3 Hardware Description

The NE5000E-X16A supports N+N power module backup. The power supply
system supports the backup of power supply areas A and B on the user side. Every
N power modules are connected to one power supply area, ensuring that the
entire system can work properly if any power supply area fails.
The NE5000E-X16A has four PEMs. Each PEM has four inputs. The NE5000E-X16A
provides 16 inputs (eight inputs on each of area A and area B) to achieve a
maximum of 8+8 backup. Figure 3-15 and Table 3-19 show the mappings
between PEMs and PMs

Figure 3-15 Connections between PEMs and PMs

Table 3-19 Mappings between PEMs and PMs
Powe Nam Location
r e
Suppl
y
Area

A PEM A1 A2 A3 A4 A5 A6 A7 A8

PM A1 A2 A3 A4 A5 A6 A7 A8

B PEM B1 B2 B3 B4 B5 B6 B7 B8

PM B1 B2 B3 B4 B5 B6 B7 B8

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Hardware Guide 3 Hardware Description

Power Supply Principles

PMs can be configured based on the overall power consumption of the device to
flexibly supply power.

In the -48 V DC power supply scenario, the output power of the DC PM is 2200 W.
PMs are configured based on the N+N backup mechanism. To be specific, N
(N>=1) PMs are configured for each of area A and area B on the user side. The
value of N x 2200 W must be greater than the power consumption of the entire
system. Table 3-20 shows the details.

NO TE

If PMs are not fully configured, power cables are routed only for the PEM interfaces whose
corresponding PMs are installed. To facilitate the deployment of new power cables during
capacity expansion of PMs, you are advised to configure the PMs from the top down and
leave a filler panel in the position where no PM is installed.

Table 3-20 Power supply examples

Overall Power PM Configuration PEM Cabling N+N
Consumption Backup

P<2200W A1,B1 A1,B1 1+1

2200W=<P<4400 A1,B1;A2,B2 A1,B1;A2,B2 2+2
W

4400W=<P<6600 A1,B1;A2,B2;A3,B3 A1,B1;A2,B2;A3,B3 3+3
W

... ... ... ...

15400W=<P<176 A1,B1;A2,B2;A3,B3;A4 A1,B1;A2,B2;A3,B3;A4,B 8+8
00W ,B4;A5,B5;A6,B6;A7,B 4;A5,B5;A6,B6;A7,B7;A8
7;A8,B8 ,B8

Table 3-21 describes recommended power supply configurations. You can choose
the PM configuration based on the actual platform.

Table 3-21 Recommended configurations

Power Supply Scenario 400G 1T

-48 V DC power supply 6+6 8+8

AC power supply 5+5 7+7

240 V HVDC power 5+5 7+7
supply

380 V HVDC power 5+5 7+7
supply

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

3.1.3.1.2 System Power Supply Architecture

The NE5000E-X16A uses the non-partitioned power supply architecture. The
NE5000E-X16A backplane has one area, which houses two power inputs
converged on boards.

As shown in Figure 3-16, after the external power is input to PMs through PEMs,
the PMs convert power and output the power to the power supply backplane.
Each PEM provides four channels of power inputs (with two partitioned into
power supply source A and two partitioned into power supply source B) for four
PMs. There are 16 PMs on the device.

Figure 3-16 Power supply

3.1.3.1.3 PDC-2200WB (PSU-PDC-2200WB-PM2200W DC Power Supply)

Overview

Table 3-22 Basic information about the PDC-2200WB

Item Details

Description PSU-PDC-2200WB-PM2200W DC
Power Supply

Part Number 02311CNP

Model PDC-2200WB

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

NO TE

The external power is input to PMs through PEMs, the PMs perform current equalization
and regulation and output the power to the power supply backplane. The DC PMs have
dual redundant inputs (Input A and Input B). Each DC PM can be connected to two
separate sources. If two sources are connected and the voltage values of the two sources
are different, the source with higher DC voltage provides greater current.

Appearance

Figure 3-17 Appearance of the PDC-2200WB

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=02311CNP&productModel=PDC-2200WB#matchRelation

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 57
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Panel

Figure 3-18 Panel of the PDC-2200WB

Table 3-23 Indicators on the PDC-2200WB
Silkscreen Name Color Status Description

INPUT Input Green On Normal
Indicator status.

Green Blinking The input
voltage
exceeds the
preset
operating
voltage range.

- Off ● No DC
input.
● Positive
and
negative
terminals
are
incorrectly
connected
to each
other.

OUTPUT Output Green On Normal
Indicator status.

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 58
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Silkscreen Name Color Status Description

- Off ● The power
module
does not
have DC
output.
● Output
voltage is
too low.

ALARM Alarm Red On ● Fans are
Indicator faulty.
● The device
is powered
off due to
overtempe
rature.
● The device
is powered
off due to
over-
output-
voltage.
● The device
is powered
off due to
overcurren
t or short
circuit.
● The
current of
modules is
seriously
imbalance
d.

- Off Normal
status.

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 59
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Hardware Guide 3 Hardware Description

Functions and Features

Table 3-24 Functions and features of the PDC-2200WB
Functions and Features Description

Input undervoltage protection In this protection state, the power
module stops supplying power, but
automatically resumes power supply
when the system recovers.
The INPUT indicator blinks green.

Input overcurrent protection In this protection state, the power
module stops supplying power and
cannot automatically resume power
supply.
The INPUT indicator is off.

Output overvoltage protection In this protection state, the power
module is turned off and stops
supplying power. When the system
recovers from input overcurrent, the
power module cannot automatically
resume power supply.
The OUTPUT indicator is off.

Output current limiting protection In this protection state, the power
module limits the current within a
certain range, but automatically
resumes power supply when the
system recovers.
The OUTPUT indicator is steady green.

Output short circuit protection In this protection state, the power
module supplies power intermittently
and limits the current within a certain
range, but automatically resumes
power supply when the system
recovers.
The OUTPUT indicator is off.

Overtemperature protection When the temperature exceeds 55°C
(131°F), the power module stops
supplying power. When the
temperature falls below 55°C (131°F),
the power module automatically
resumes power supply. The OUTPUT
indicator is off.

Heat dissipation mode The power module has a built-in fan
module, which uses a front-to-back
airflow design.

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Hardware Guide 3 Hardware Description

Functions and Features Description

Hot swap Supported.

Technical Specifications

Table 3-25 Technical specifications of the PDC-2200WB
Item Specification

Dimensions without packaging (H x W 41 mm x 106.5 mm x 485 mm (1.61 in.
x D) [mm(in.)] x 4.19 in. x 19.09 in.)

Weight without packaging [kg(lb)] 2.35 kg (5.18 lb)

Number of inputs 2

Rated input voltage [V] -48 V / -60 V

Input voltage range [V] –40 V to –72 V

Maximum input current [A] 63 A

Rated output voltage [V] 53.5 V

Rated output current [A] 42 A

Rated output power [W] 2200 W

Power supply efficiency 0.94

Power dissipation Mode Built-in fan

3.1.3.1.4 DC PEM
DC power is input through DC PEMs. Each PEM provides four channels of power
input. The two terminals on the right of a PEM connect to power supply area A,
and the two terminals on the left connect to power supply area B. DC PEMs are
fully configured when a device is delivered.

Appearance
Figure 3-19 shows the appearance of a DC PEM.

Figure 3-19 DC PEM

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 61
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Panel

Table 3-26 Interface description

Interface Description Power Cable Terminal
Name

NEG(-) Input interface ● JG2-25mm2-M6-150A, applicable to
for –48 V power 25mm2 power cables
supply ● JG2-34.3mm2-M6(1/4")-134A, applicable
RTN(+) Input interface to 35mm2 power cables
for BGND power
supply

Input Requirements
● Protection components must be provided for PDFs to ensure that the rated
current of each channel is not less than 63 A.

NO TICE

Note the derating requirements of protection components when using
protection components such as fuses and circuit breakers. If the current of a
PDF is less than 63 A, it cannot supply power to the NE5000E. In this case,
reconstruct power supply in the equipment room.

● If the front-end PDF does not provide enough power inputs, configure a PDB
that meets the following requirements:
– The current of each channel output by the DC PDB is not less than 63 A.
– Double-channel backup is used.
– The input current is not less than the sum of current of its connected
output lines.

3.1.3.1.5 PAC-2700WB (2700W AC Power module)

Overview

Table 3-27 Basic information about the PAC-2700WB

Item Details

Description 2700W AC Power module

Part Number 02310SHP

Model PAC-2700WB

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

NO TE

The PM accesses external AC power through PEMs, the PMs convert AC power into
regulated DC power and output the power to the power supply backplane.

Appearance

Figure 3-20 Appearance of the PAC-2700WB

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=02310SHP&productModel=PAC-2700WB#matchRelation

Panel

Figure 3-21 Panel of the PAC-2700WB

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 63
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Table 3-28 Indicators on the PAC-2700WB
Silkscreen Name Color Status Description

INPUT Input Green On Normal
Indicator status.

Green Blinking The input
voltage
exceeds the
preset
operating
voltage range.

- Off No AC input.

OUTPUT Output Green On Normal
Indicator status.

- Off The power
module does
not have
output.

ALARM Alarm Red On ● Fans are
Indicator faulty.
● The device
is powered
off due to
overtempe
rature.
● The device
is powered
off due to
over-
output-
voltage.
● The device
is powered
off due to
overcurren
t or short
circuit.
● The
current of
modules is
seriously
imbalance
d.

- Off Normal
status.

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 64
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Technical Specifications

Table 3-29 Technical specifications of the PAC-2700WB
Item Specification

Dimensions without packaging (H x W 41 mm x 106.5 mm x 485 mm (1.61 in.
x D) [mm(in.)] x 4.19 in. x 19.09 in.)

Weight without packaging [kg(lb)] 2 kg (4.41 lb)

Number of inputs 1

Rated input voltage [V] 200V AC to 240V AC

Input voltage range [V] 180V AC to 264V AC

Maximum input current [A] 16 A

Rated output voltage [V] 53.5 V

Rated output current [A] 56 A

Rated output power [W] 2700 W

Power supply efficiency 0.96

Power dissipation Mode Built-in fan

Table 3-30 Technical specifications of the PAC-2700WB
Item Specification

Dimensions without packaging (H x W 41 mm x 106.5 mm x 485 mm (1.61 in.
x D) [mm(in.)] x 4.19 in. x 19.09 in.)

Weight without packaging [kg(lb)] 2 kg (4.41 lb)

Number of inputs 1

Rated input voltage [V] 200V AC to 240V AC

Input voltage range [V] 180V AC to 264V AC

Maximum input current [A] 16 A

Rated output voltage [V] 53.5 V

Rated output power [W] 2700 W

Power supply efficiency 0.96

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 65
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Hardware Guide 3 Hardware Description

NO TE

The AC power system supports 200-240 V AC power. It supports 110 V dual-live-wire inputs
but not 110 V AC single-phase inputs. If 110 V dual-live-wire inputs are used, the voltage
must range from 180 V to 264 V.

3.1.3.1.6 AC PEM
AC power is input through AC PEMs. Each PEM provides four channels of power
input. The two terminals on the right of a PEM connect to power supply area A,
and the two terminals on the left connect to power supply area B. AC PEMs are
fully configured when a device is delivered.

Appearance
Figure 3-22 shows the appearance of a PEM.

Figure 3-22 AC PEM

Panel

Table 3-31 Interface description
Interface Description Power Cable Terminal
Name

C20 AC Input interface C19
socket for 220 V AC
power supply

Input Requirements
● The 220 V AC input is supported. In the 110 V AC scenario, the dual-live wire
input mode can be used. Figure 3-23 shows the connection.

Figure 3-23 110 V dual-live wire connection

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

● Protection components must be provided for PDFs to ensure that the rated AC
current of each channel is not less than 16 A.

NO TICE

Note the derating requirements of protection components when using
protection components such as fuses and circuit breakers.

NO TE

The input circuit breakers of a PDF must match the output circuit breakers.
● If the front-end PDF does not provide enough power inputs, configure a PDB
that meets the following requirements:
– The current of each channel output by the AC PDB is not less than 16 A.
– Double-channel backup is used.
– The input current is not less than the sum of current of its connected
output lines.

3.1.3.1.7 PHD-3000WA (3000W AC&HVDC Power Module)

Overview

Table 3-32 Basic information about the PHD-3000WA
Item Details

Description 3000W AC&HVDC Power Module

Part Number 02310VMA

Model PHD-3000WA

NO TE

The external power is input to PMs through PEMs, the PMs convert AC power into
regulated DC power and output the power to the power supply backplane.
The AC power system supports 200-240 V AC power. It supports 110 V dual-live-wire inputs
but not 110 V AC single-phase inputs. If 110 V dual-live-wire inputs are used, the voltage
must range from 180 V to 264 V.
240 V HVDC power system, the input voltage range from 192 V to 288 V DC. 380 V HVDC
power system, the input voltage range from 260 V to 400 V.

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 67
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Appearance

Figure 3-24 Appearance of the PHD-3000WA

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=02310VMA&productModel=PHD-3000WA#matchRelation

Panel

Figure 3-25 Panel of the PHD-3000WA

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 68
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Table 3-33 Indicators on the PHD-3000WA
Silkscreen Name Color Status Description

INPUT Input Green On Normal
Indicator status.

Green Blinking The input
voltage
exceeds the
preset
operating
voltage range.

- Off No input.

OUTPUT Output Green On Normal
Indicator status.

- Off ● The power
module
does not
have DC
output.
● Output
voltage is
too low.

ALARM Alarm Red On ● Fans are
Indicator faulty.
● The device
is powered
off due to
overtempe
rature.
● The device
is powered
off due to
over-
output-
voltage.
● The device
is powered
off due to
overcurren
t or short
circuit.
● The
current of
modules is
seriously
imbalance
d.

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 69
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Silkscreen Name Color Status Description

- Off Normal
status.

Technical Specifications

Table 3-34 Technical specifications of the PHD-3000WA
Item Specification

Dimensions without packaging (H x W 41 mm x 106.5 mm x 485 mm (1.61 in.
x D) [mm(in.)] x 4.19 in. x 19.09 in.)

Weight without packaging [kg(lb)] 2.26 kg (4.98 lb)

Number of inputs 1

Rated input voltage [V] 200 V AC to 240 V AC (220 V power
grid)
240 V DC/380 V DC

Input voltage range [V] 180 V AC to 264 V AC
192 V DC to 400 V DC

Maximum input current [A] AC: 16A
HVDC: 14A

Rated output voltage [V] 53.5 V

Rated output current [A] 56 A

Rated output power [W] 3000 W

Power supply efficiency 0.94

Power dissipation Mode Built-in fan

3.1.3.1.8 AC&HVDC PEM
AC or HVDC power is input through AC&HVDC PEMs. Each PEM provides four
channels of power input. The two terminals on the right of a PEM connect to
power supply area A, and the two terminals on the left connect to power supply
area B. AC&HVDC PEMs are fully configured when a device is delivered.

Appearance
Figure 3-26 shows the appearance of an AC&HVDC PEM.

Figure 3-26 AC&HVDC PEM

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Panel

Table 3-35 Interface description
Interface Description Power Cable Terminal
Name

Input 220 V AC/240V HVDC dedicated terminal (240 V)
interface HVDC and 380 V HVDC dedicated terminal (380V)
for power HVDC power
supply input interfaces

Input Requirements
● The 220 V AC input is supported. In the 110 V AC scenario, the dual-live wire
input mode can be used. Figure 3-27 shows the connection.

Figure 3-27 110 V dual-live wire connection

● Protection components must be provided for PDFs to ensure that the rated AC
current of each channel is not less than 16 A and the rated HVDC current of
each channel is not less than 14 A.

NO TICE

Note the derating requirements of protection components when using
protection components such as fuses and circuit breakers.

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Hardware Guide 3 Hardware Description

NO TE

The input circuit breakers of a PDF must match the output circuit breakers.
In HVDC application scenarios, ensure that the protection components meet HVDC
certification and the fuses and circuit breakers meet positive and negative pole
protection.
● If the front-end PDF does not provide enough power inputs, configure a PDB
that meets the following requirements:
– The current of each channel output by the AC PDB is not less than 16 A.
– The current of each channel output by the HVDC PDB is not less than 14
A.
– Double-channel backup is used.
– The input current is not less than the sum of current of its connected
output lines.

3.1.3.1.9 Switch

The switch controls the power output of PMs. The two switches back up each
other. When one or two switches are in the ON state, the power output of PMs is
enabled.

Appearance

Figure 3-28 shows the appearance of a switch.

Figure 3-28 Main components of the power system

Panel

Table 3-36 Switch

Switch Name Description

OFF/ON Controls the device power connectivity.

Function

When one or both switches are turned on, the PMs output power, and the device
is powered on. When both switches are turned off, the PMs do not output power,
and the device is powered off.

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Hardware Guide 3 Hardware Description

NO TICE

Ensure that both switches are turned on when the device is running for reliability
purposes.

3.1.3.1.10 PMUA
The PMUA is used to manage the power module and the power access module,
monitor their working status, and report the status to the host.

Appearance

Figure 3-29 PMUA power monitoring module

Panel

Table 3-37 PMUA Panel
Indicator Status Description

RUN If the indicator blinks green slowly, the
board is working properly. If the
indicator blinks green quickly, the
board fails to communicate with the
main control board.

ALM If the indicator is steady red, the PM or
PMUA is not working properly. If the
indicator is off, no alarms are reported.

ACT If the indicator is steady green, the
board is in the active state. If the
indicator is off, the board is in the
standby state.

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Function
Supporting flexible configuration, dynamic management, and voltage and current
detection functions
Providing power alarms and supporting 485 communication

3.1.3.1.11 Power System Technical Specifications

-48 V DC

Table 3-38 -48 V DC power system specifications
Item Description

Number of power modules 16 (full configuration)

Input channels 16 (full configuration)

Maximum input diameter 35mm^2 per input

Input voltage -40 V to -72 V (rated voltage -48
V/-60 V)

Input current A maximum of 63 A

Front-end circuit breaker/fuse No less than 63 A per module

Output channels 16 (full configuration)

Output voltage 53.5 V DC

Output current 46 A per module

Output power 2200 W per module

Typical power consumption 148.5 W per module

Typical heat dissipation 481.8 BTU/hour per module

AC

Table 3-39 AC power system specifications
Item Description

Number of power modules 16 (full configuration)

Input channels 16 (full configuration)

Maximum input diameter Standard C19 cable

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Item Description

Input voltage ● Voltage range:90Vac to 290Vac.
● 220 V rated voltage:200Vac to
240Vac.
● 110V rated voltage:100Vac to
120Vac, the input of double live
wires is required.

Input current 16 A per module

Front-end circuit breaker/fuse 16 A

Output channels 16 (full configuration)

Output voltage 53.5 V DC

Output current 56 A per module

Output power 3000 W per module

Typical power consumption 182 W per module

Typical heat dissipation 590.5 BTU/hour per module

HVDC

Table 3-40 HVDC power system specifications
Item Description

Number of power modules 16 (full configuration)

Input channels 16 (full configuration)

Maximum input diameter 2.5mm^2

Input voltage 192 V to 400 V (rated voltage 240
V/380 V)

Input current 14 A per module

Front-end circuit breaker/fuse 16A per module

Output channels 16 (full configuration)

Output voltage 53.5 V DC

Output current 56 A per module

Output power 3000 W per module

Typical power consumption 182 W per module

Typical heat dissipation 590.5 BTU/hour per module

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3.1.3.2 NE5000E-X16B Power Supply System

3.1.3.2.1 Overview

Introduction to Modules
As shown in Figure 3-30, the NE5000E-X16B power system is located at the top of
the chassis. The main components are the PMs, PMUs, and switches in the front of
the chassis and the PEMs at the rear of the chassis. Table 3-41 describes the
functions of each module.

Figure 3-30 Main components of the power system

Table 3-41 Functions of main components of the NE5000E-X16B power system
Component Description

1 PM Converts the power supplied to the PEM and supplies
power to the entire device through the backplane.

2 PMU Manages PMs and PEMs by monitoring their working
status and reporting the status to the host.

3 Switch Controls the power output of PMs. The two switches back
up each other. When one or two switches are in the ON
state, the power output of PMs is enabled.

4 PEM Connects to the external power supply system and
supplies power to the NE5000E-X16B. The right and left
parts of the PEM correspond to power supply areas A and
B, respectively.
Power supply areas A and B are two power supply
systems with different sources. The system connects to
different power supply systems, ensuring that the system
remains powered-on if one power supply system fails.
NOTE
PEMs are integrated into the chassis and do not need to be
configured onsite.

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Power Module Mappings
The NE5000E-X16B supports multiple power supply scenarios, which vary in the
installed PEMs and PMs. Table 3-42 lists the mappings between power supply
scenarios and PEMs/PMs.

Table 3-42 Mappings between power supply scenarios and PEMs/PMs on the
NE5000E-X16B
Power Supply Scenario PEM PM

-48 V DC power supply DC PEM DC PM

AC power supply ● AC PEM 3000 W AC&HVDC PM
● AC&HVDC PEM

240 V HVDC power AC/HVDC PEM 3000 W AC&HVDC PM
supply

380 V HVDC power AC/HVDC PEM 3000 W AC&HVDC PM
supply

The -48 V DC power supply system supports N+1 power module backup (1
indicates the number of backup modules). The AC, 240 V HVDC, and 380 V HVDC
power supply systems support N+N power module backup (N power modules for
working, and N power modules for backup).
● N+1 (-48 V DC)
The NE5000E-X16B has four PEMs. Each PEM has eight inputs. There are
altogether 32 inputs (16 inputs in each of area A and area B). Each PM has
two inputs. The two inputs are from power supply areas A and B, respectively.
In this manner, power supply areas A and B back up each other. A maximum
of 16 PMs can be configured based on the N+1 backup mechanism. Figure
3-31 and Table 3-43 show the mappings between PEMs and PMs

Figure 3-31 Connections between PEMs and PMs

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Table 3-43 Mappings between PEMs and PMs
N Location
a
m
e

P A A A A A A A A A A A A A A A A
E 1/ 2/ 3/ 4/ 5/ 6/ 7/ 8/ 9/ 1 1 1 1 1 1 1
M B B B B B B B B B 0/ 1/ 2/ 3/ 4/ 5/ 6/
1 2 3 4 5 6 7 8 9 B B B B B B B
1 1 1 1 1 1 1
0 1 2 3 4 5 6

P 1 2 3 4 5 6 7 8 9 1 1 1 1 1 1 1
M 0 1 2 3 4 5 6

● N+N (AC/HVDC)
The NE5000E-X16B supports N+N backup for PMs. The power supply system
supports the backup of power supply areas A and B on the user side. Every N
power modules are connected to one power supply area, ensuring that the
entire system can work properly if any power supply area fails.
The NE5000E-X16B has four PEMs. Each PEM has four inputs. The NE5000E-
X16B provides 16 inputs (eight inputs in each of area A and area B) to achieve
a maximum of 8+8 backup. Figure 3-32 and Table 3-44 show the mappings
between PEMs and PMs

Figure 3-32 Connections between PEMs and PMs

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Table 3-44 Mappings between PEMs and PMs

Pow Nam Location
er e
Supp
ly
Area

A PEM A1 A2 A3 A4 A5 A6 A7 A8

PM A1 A2 A3 A4 A5 A6 A7 A8

B PEM B1 B2 B3 B4 B5 B6 B7 B8

PM B1 B2 B3 B4 B5 B6 B7 B8

Power Supply Principles

PMs can be configured based on the overall power consumption of the device to
flexibly supply power.

● N+1 (-48 V DC)
A DC PM has output power of 2200 W. N+1 PMs are configured for power
supply, with N being the number of PMs required for the power consumption
of the entire device. The value of N x 2200 W must be greater than the
overall power consumption of the entire device. Table 3-45 shows the details.

NO TE

If PMs are not fully configured, power cables are routed only for the PEM interfaces
whose corresponding PMs are installed. To facilitate the deployment of new power
cables during capacity expansion of PMs, you are advised to configure the PMs from
the top down and leave a filler panel in the position where no PM is not installed.

Table 3-45 Power supply examples

Overall Power PM PM Cabling N+1 Backup
Consumption Configuration

P<2200W 1,2 A1,B1,A2,B2 1+1

2200W≤P<4400 1,2,3 A1,B1,A2,B2,A3,B 2+1
W 3

4400W≤P<6600 1,2,3,4 A1,B1,A2,B2,A3,B 3+1
W 3,A4,B4

…… …… …… ……

30800W≤P<3300 1,2,3,4,5,6,7,8,9,1 A1,B1,A2,B2,A3,B 15+1
0W 0,11,12,13,14,15, 3……A16,B16
16

● N+N (AC/HVDC)

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Hardware Guide 3 Hardware Description

A AC/HVDC PM has output power of 3000 W. PMs are configured based on
the N+N backup mechanism. To be specific, N (N>=1) PMs are configured for
each of area A and area B on the user side. The value of N x 3000 W must be
greater than the power consumption of the entire system. Table 3-46 shows
the details.

NO TE

If PMs are not fully configured, power cables are routed only for the PEM interfaces
whose corresponding PMs are installed. To facilitate the deployment of new power
cables during capacity expansion of PMs, you are advised to configure the PMs from
the top down and leave a filler panel in the position where no PM is installed.

Table 3-46 Power supply examples
Overall Power PM Configuration PEM Cabling N+N
Consumption Backup

P<3000W A1,B1 A1,B1 1+1

3000W≤P<6000 A1,B1,A2,B2 A1,B1,A2,B2 2+2
W

6000W≤P<9000 A1,B1,A2,B2,A3,B3 A1,B1,A2,B2,A3,B3 3+3
W

…… …… …… ……

2100W≤P<2400 A1,B1,A2,B2,A3,B3 A1,B1,A2,B2,A3,B3…… 8+8
0W ……A8,B8 A8,B8

Table 3-47 describes recommended power supply configurations. You can choose
the PM configuration based on the actual platform.

Table 3-47 Recommended configurations
Power Supply Scenario 1T 2T

-48 V DC power supply 9+1 11+1

AC power supply 7+7 8+8

240 V HVDC power 7+7 8+8
supply

380 V HVDC power 7+7 8+8
supply

3.1.3.2.2 System Power Supply Architecture
The NE5000E-X16B uses the non-partitioned power supply architecture.

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-48 V DC Power Supply
As shown in Figure 3-33, the NE5000E-X16B has four PEMs. Each PEM has eight
inputs. There are altogether 32 inputs (16 inputs on each of area A and area B).
Each PM has two inputs. The two inputs are from power supply areas A and B,
respectively. The PM converts the power and outputs the power to the power
supply backplane. In this manner, power supply areas A and B back up each other
A maximum of 16 PMs can be configured based on the N+M backup mechanism.

Figure 3-33 DC power supply

AC and HVDC Power Supply
As shown in Figure 3-34, after the external power is input to PMs through PEMs,
the PMs convert power and output the power to the power supply backplane.
Each PEM provides four channels of power inputs (with two partitioned into area
A and two partitioned into area B) for four PMs. There are 16 PMs on the device.

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Figure 3-34 HVDC and AC power supply

3.1.3.2.3 PDC-2200WB (PSU-PDC-2200WB-PM2200W DC Power Supply)

Overview

Table 3-48 Basic information about the PDC-2200WB
Item Details

Description PSU-PDC-2200WB-PM2200W DC
Power Supply

Part Number 02311CNP

Model PDC-2200WB

NO TE

The external power is input to PMs through PEMs, the PMs perform current equalization
and regulation and output the power to the power supply backplane. The DC PMs have
dual redundant inputs (Input A and Input B). Each DC PM can be connected to two
separate sources. If two sources are connected and the voltage values of the two sources
are different, the source with higher DC voltage provides greater current.

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Appearance

Figure 3-35 Appearance of the PDC-2200WB

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=02311CNP&productModel=PDC-2200WB#matchRelation

Panel

Figure 3-36 Panel of the PDC-2200WB

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Hardware Guide 3 Hardware Description

Table 3-49 Indicators on the PDC-2200WB
Silkscreen Name Color Status Description

INPUT Input Green On Normal
Indicator status.

Green Blinking The input
voltage
exceeds the
preset
operating
voltage range.

- Off ● No DC
input.
● Positive
and
negative
terminals
are
incorrectly
connected
to each
other.

OUTPUT Output Green On Normal
Indicator status.

- Off ● The power
module
does not
have DC
output.
● Output
voltage is
too low.

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Silkscreen Name Color Status Description

ALARM Alarm Red On ● Fans are
Indicator faulty.
● The device
is powered
off due to
overtempe
rature.
● The device
is powered
off due to
over-
output-
voltage.
● The device
is powered
off due to
overcurren
t or short
circuit.
● The
current of
modules is
seriously
imbalance
d.

- Off Normal
status.

Functions and Features

Table 3-50 Functions and features of the PDC-2200WB
Functions and Features Description

Input undervoltage protection In this protection state, the power
module stops supplying power, but
automatically resumes power supply
when the system recovers.
The INPUT indicator blinks green.

Input overcurrent protection In this protection state, the power
module stops supplying power and
cannot automatically resume power
supply.
The INPUT indicator is off.

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Functions and Features Description

Output overvoltage protection In this protection state, the power
module is turned off and stops
supplying power. When the system
recovers from input overcurrent, the
power module cannot automatically
resume power supply.
The OUTPUT indicator is off.

Output current limiting protection In this protection state, the power
module limits the current within a
certain range, but automatically
resumes power supply when the
system recovers.
The OUTPUT indicator is steady green.

Output short circuit protection In this protection state, the power
module supplies power intermittently
and limits the current within a certain
range, but automatically resumes
power supply when the system
recovers.
The OUTPUT indicator is off.

Overtemperature protection When the temperature exceeds 55°C
(131°F), the power module stops
supplying power. When the
temperature falls below 55°C (131°F),
the power module automatically
resumes power supply. The OUTPUT
indicator is off.

Heat dissipation mode The power module has a built-in fan
module, which uses a front-to-back
airflow design.

Hot swap Supported.

Technical Specifications

Table 3-51 Technical specifications of the PDC-2200WB
Item Specification

Dimensions without packaging (H x W 41 mm x 106.5 mm x 485 mm (1.61 in.
x D) [mm(in.)] x 4.19 in. x 19.09 in.)

Weight without packaging [kg(lb)] 2.35 kg (5.18 lb)

Number of inputs 2

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Item Specification

Rated input voltage [V] -48 V / -60 V

Input voltage range [V] –40 V to –72 V

Maximum input current [A] 63 A

Rated output voltage [V] 53.5 V

Rated output current [A] 42 A

Rated output power [W] 2200 W

Power supply efficiency 0.94

Power dissipation Mode Built-in fan

3.1.3.2.4 DC PEM
DC power is input through DC PEMs. Each PEM provides eight channels of power
input. The four terminals on the right of a PEM connect to power supply area A,
and the four terminals on the left connect to power supply area B. DC PEMs are
fully configured when a device is delivered.

Appearance
Figure 3-37 shows the appearance of a DC PEM.

Figure 3-37 DC PEM

Panel

Table 3-52 Interface description
Interface Description Power Cable Terminal
Name

NEG(-) Input interface JG2-34.3mm2-M6(1/4")-134A, applicable to
for –48 V power 35mm2 power cables
supply

RTN(+) Input interface
for BGND power
supply

Input Requirements
● Protection components must be provided for PDFs to ensure that the rated
current of each channel is not less than 63 A.

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NO TICE

Note the derating requirements of protection components when using
protection components such as fuses and circuit breakers. If the current of a
PDF is less than 63 A, it cannot supply power to the NE5000E. In this case,
reconstruct power supply in the equipment room.

● If the front-end PDF does not provide enough power inputs, configure a PDB
that meets the following requirements:
– The current of each channel output by the DC PDB is not less than 63 A.
– Double-channel backup is used.
– The input current is not less than the sum of current of its connected
output lines.

3.1.3.2.5 AC PEM

AC power is input through AC PEMs. Each PEM provides four channels of power
input. The two terminals on the right of a PEM connect to power supply area A,
and the two terminals on the left connect to power supply area B. AC PEMs are
fully configured when a device is delivered.

Appearance

Figure 3-38 shows the appearance of a PEM.

Figure 3-38 AC PEM

Panel

Table 3-53 Interface description

Interface Description Power Cable Terminal
Name

C20 AC Input interface C19
socket for 220 V AC
power supply

Input Requirements
● The 220 V AC input is supported. In the 110 V AC scenario, the dual-live wire
input mode can be used. Figure 3-39 shows the connection.

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Hardware Guide 3 Hardware Description

Figure 3-39 110 V dual-live wire connection

● Protection components must be provided for PDFs to ensure that the rated AC
current of each channel is not less than 16 A.

NO TICE

Note the derating requirements of protection components when using
protection components such as fuses and circuit breakers.

NO TE

The input circuit breakers of a PDF must match the output circuit breakers.
● If the front-end PDF does not provide enough power inputs, configure a PDB
that meets the following requirements:
– The current of each channel output by the AC PDB is not less than 16 A.
– Double-channel backup is used.
– The input current is not less than the sum of current of its connected
output lines.

3.1.3.2.6 PHD-3000WA (3000W AC&HVDC Power Module)

Overview

Table 3-54 Basic information about the PHD-3000WA

Item Details

Description 3000W AC&HVDC Power Module

Part Number 02310VMA

Model PHD-3000WA

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NO TE

The external power is input to PMs through PEMs, the PMs convert AC power into
regulated DC power and output the power to the power supply backplane.
The AC power system supports 200-240 V AC power. It supports 110 V dual-live-wire inputs
but not 110 V AC single-phase inputs. If 110 V dual-live-wire inputs are used, the voltage
must range from 180 V to 264 V.
240 V HVDC power system, the input voltage range from 192 V to 288 V DC. 380 V HVDC
power system, the input voltage range from 260 V to 400 V.

Appearance

Figure 3-40 Appearance of the PHD-3000WA

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=02310VMA&productModel=PHD-3000WA#matchRelation

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Panel

Figure 3-41 Panel of the PHD-3000WA

Table 3-55 Indicators on the PHD-3000WA
Silkscreen Name Color Status Description

INPUT Input Green On Normal
Indicator status.

Green Blinking The input
voltage
exceeds the
preset
operating
voltage range.

- Off No input.

OUTPUT Output Green On Normal
Indicator status.

- Off ● The power
module
does not
have DC
output.
● Output
voltage is
too low.

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Silkscreen Name Color Status Description

ALARM Alarm Red On ● Fans are
Indicator faulty.
● The device
is powered
off due to
overtempe
rature.
● The device
is powered
off due to
over-
output-
voltage.
● The device
is powered
off due to
overcurren
t or short
circuit.
● The
current of
modules is
seriously
imbalance
d.

- Off Normal
status.

Technical Specifications

Table 3-56 Technical specifications of the PHD-3000WA

Item Specification

Dimensions without packaging (H x W 41 mm x 106.5 mm x 485 mm (1.61 in.
x D) [mm(in.)] x 4.19 in. x 19.09 in.)

Weight without packaging [kg(lb)] 2.26 kg (4.98 lb)

Number of inputs 1

Rated input voltage [V] 200 V AC to 240 V AC (220 V power
grid)
240 V DC/380 V DC

Input voltage range [V] 180 V AC to 264 V AC
192 V DC to 400 V DC

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Item Specification

Maximum input current [A] AC: 16A
HVDC: 14A

Rated output voltage [V] 53.5 V

Rated output current [A] 56 A

Rated output power [W] 3000 W

Power supply efficiency 0.94

Power dissipation Mode Built-in fan

3.1.3.2.7 AC&HVDC PEM

AC or HVDC power is input through AC&HVDC PEMs. Each PEM provides four
channels of power input. The two terminals on the right of a PEM connect to
power supply area A, and the two terminals on the left connect to power supply
area B. AC&HVDC PEMs are fully configured when a device is delivered.

Appearance

Figure 3-42 shows the appearance of an AC&HVDC PEM.

Figure 3-42 AC&HVDC PEM

Panel

Table 3-57 Interface description

Interface Description Power Cable Terminal
Name

Input 220 V AC/240V HVDC dedicated terminal (240 V)
interface HVDC and 380 V HVDC dedicated terminal (380 V)
for power HVDC power
supply input interfaces

Input Requirements
● The 220 V AC input is supported. In the 110 V AC scenario, the dual-live wire
input mode can be used. Figure 3-43 shows the connection.

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Figure 3-43 110 V dual-live wire connection

● Protection components must be provided for PDFs to ensure that the rated AC
current of each channel is not less than 16 A and the rated HVDC current of
each channel is not less than 14 A.

NO TICE

Note the derating requirements of protection components when using
protection components such as fuses and circuit breakers.

NO TE

The input circuit breakers of a PDF must match the output circuit breakers.
In HVDC application scenarios, ensure that the protection components meet HVDC
certification and the fuses and circuit breakers meet positive and negative pole
protection.
● If the front-end PDF does not provide enough power inputs, configure a PDB
that meets the following requirements:
– The current of each channel output by the AC PDB is not less than 16 A.
– The current of each channel output by the HVDC PDB is not less than 14
A.
– Double-channel backup is used.
– The input current is not less than the sum of current of its connected
output lines.

3.1.3.2.8 Switch

The switch controls the power output of PMs. The two switches back up each
other. When one or two switches are in the ON state, the power output of PMs is
enabled.

Appearance

Figure 3-44 shows the appearance of a switch.

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Figure 3-44 Main components of the power system

Panel

Table 3-58 Switch
Switch Name Description

OFF/ON Controls the device power connectivity.

Function
When one or both switches are turned on, the PMs output power, and the device
is powered on. When both switches are turned off, the PMs do not output power,
and the device is powered off.

NO TICE

Ensure that both switches are turned on when the device is running for reliability
purposes.

3.1.3.2.9 PMU
The PMUA is used to manage the power module and the power access module,
monitor their working status, and report the status to the host.

Appearance

Figure 3-45 PMUA power monitoring module

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Panel

Table 3-59 PMUA Panel

Indicator Status Description

RUN If the indicator blinks green slowly, the
board is working properly. If the
indicator blinks green quickly, the
board fails to communicate with the
main control board.

ALM If the indicator is steady red, the PM or
PMUA is not working properly. If the
indicator is off, no alarms are reported.

ACT If the indicator is steady green, the
board is in the active state. If the
indicator is off, the board is in the
standby state.

Function

Supporting flexible configuration, dynamic management, and voltage and current
detection functions

Providing power alarms and supporting 485 communication

3.1.3.2.10 Power System Technical Specifications

-48 V DC

Table 3-60 -48 V DC power system specifications

Item Description

Number of power modules 16 (full configuration)

Input channels 32 (full configuration)

Maximum input diameter 35mm^2 per input

Input voltage -40 V to -72 V (rated voltage -48
V/-60 V)

Input current A maximum of 63 A

Front-end circuit breaker/fuse No less than 63 A per module

Output channels 16 (full configuration)

Output voltage 53.5 V DC

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Item Description

Output current 46 A per module

Output power 2200 W per module

Typical power consumption 148.5 W per module

Typical heat dissipation 481.8 BTU/hour per module

AC

Table 3-61 AC power system specifications

Item Description

Number of power modules 16 (full configuration)

Input channels 16 (full configuration)

Maximum input diameter Standard C19 cable

Input voltage ● Voltage range:90Vac to 290Vac.
● 220 V rated voltage:200Vac to
240Vac.
● 110V rated voltage:100Vac to
120Vac, the input of double live
wires is required.

Input current 16 A per module

Front-end circuit breaker/fuse 16 A

Output channels 16 (full configuration)

Output voltage 53.5 V DC

Output current 56 A per module

Output power 3000 W per module

Typical power consumption 182 W per module

Typical heat dissipation 590.5 BTU/hour per module

HVDC

Table 3-62 HVDC power system specifications

Item Description

Number of power modules 16 (full configuration)

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Item Description

Input channels 16 (full configuration)

Maximum input diameter 2.5mm^2

Input voltage 192 V to 400 V (rated voltage 240
V/380 V)

Input current 14 A per module

Front-end circuit breaker/fuse 14 A per module
[400G bundle] HVDC device: 12 PMs,
requiring 12 channels of 14 A
[1T bundle] HVDC device: 16 PMs,
requiring 16 channels of 14 A

Output channels 16 (full configuration)

Output voltage 53.5 V DC

Output current 56 A per module

Output power 3000 W per module

Typical power consumption 182 W per module

Typical heat dissipation 590.5 BTU/hour per module

3.1.3.3 NE5000E-20 Power Supply System

3.1.3.3.1 Overview

Introduction to Modules
As shown in Figure 3-46, the NE5000E-20 power system is located at the top of
the chassis. The main components are the PMs, CMUs, and switches in the front of
the chassis and the PEMs at the rear of the chassis.

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Figure 3-46 Main components of the power system

Table 3-63 Functions of main components of the NE5000E-20 power system
Component Description

1 Cover plate -
for the PM

2 PM Converts the power supplied to the PEM and supplies
power to the entire device through the backplane.

3 CMU Provides device monitoring, management, and energy
saving functions for high reliability.

4 Switch Controls the power output of PMs. The two switches back
up each other. When one or two switches are in the ON
state, the power output of PMs is enabled.

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Component Description

5 PEM Connects to the external power supply system and
supplies power to the NE5000E-20. The right and left
parts of the PEM correspond to power supply areas A and
B, respectively.
Power supply areas A and B are two power supply
systems with different sources. The system connects to
different power supply systems, ensuring that the system
remains powered-on if one power supply system fails.

Power Module Mappings
The NE5000E-20 supports multiple power supply scenarios, which vary in the
installed PEMs and PMs. Table 3-64 lists the mappings between power supply
scenarios and PEMs/PMs.

Table 3-64 Mappings between power supply scenarios and PEMs/PMs on the
NE5000E-20
Power Supply Scenario PEM PM

-48 V DC power supply DC PEM DC PM

Dual Input AC&HVDC Dual Input AC&HVDC Dual Input AC&HVDC
power supply PEM PM

The power system supports a maximum of 24 PMs that are working in N+M
backup mode (N indicates the number of working modules and M indicates the
number of backup modules). The value M is 1 by default. Each power module has
two power inputs, which are connected to power supply areas A and B
respectively. Power supply areas A and B back up each other. A single-area fault or
m module faults do not affect system running.
● -48 V DC
An NE5000E-20 has six PEMs. Each PEM has eight inputs. There are
altogether 48 inputs (24 inputs in each of area A and area B). Power supply
areas A and B back up each other. If one power supply area has no current
output, the other power supply area can provide all the current required for
the normal operation of the device. In this way, power supply source-level
backup is implemented. A maximum of 24 PMs can be configured. Each PM
has two power inputs, which are from power supply areas A and B output by
the power entry module (PEM), respectively. The PM combines the two power
inputs and outputs one. Figure 3-47 and Table 3-65 show the mappings
between PEMs and PMs

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Figure 3-47 Connections between PEMs and PMs

Table 3-65 Mappings between PEMs and PMs

Name Location

PEM A1/B1 A2/B2 A3/B3 ...... A22/B2 A23/B2 A24/B2
2 3 4

PM 1 2 3 ...... 22 23 24

● Dual Input AC&HVDC
An NE5000E-20 has six PEMs. Each PEM has eight inputs. There are
altogether 48 inputs (24 inputs in each of area A and area B). Power supply
areas A and B back up each other in N+N backup mode. If one power supply
area has no current output, the other power supply area can provide all the
current required for the normal operation of the device. In this way, power
supply source-level backup is implemented. A maximum of 24 PMs can be
configured. Each PM has two power inputs, which are from power supply
areas A and B output by the power entry module (PEM), respectively. The PM
combines the two power inputs and outputs one. The system uses N+M (M ≥

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1) power module backup mode so that the device works properly even if M
power modules fail. Figure 3-48 and Table 3-66 show the mappings between
PEMs and PMs

Figure 3-48 Connections between PEMs and PMs

Table 3-66 Mappings between PEMs and PMs

Name Location

PEM A1/B1 A2/B2 A3/B3 ...... A22/B2 A23/B2 A24/B2
2 3 4

PM 1 2 3 ...... 22 23 24

Power Supply Principles

PEMs are integrated into the chassis and do not need to be configured onsite. Do
not remove and install PEMs onsite. PMs can be configured based on the overall
power consumption of the device to flexibly supply power.

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● -48 V DC
A DC PM can provide 2200 W power. Configure the PMs based on the power
consumption of the entire device. Use the N+1 PM backup mechanism as an
example. N+1 PMs are configured for power supply, with N being the number
of PMs required for the power consumption of the entire device. The value of
N x 2200 W must be greater than the overall power consumption of the
entire device. Table 3-67 shows the details.

NO TE

1. PM slots and PEM slots must be mapped. Each PM must have two inputs, which
are from power supply areas A and B, respectively.
2. If PMs are not fully configured, power cables are routed only for the PEM
interfaces whose corresponding PMs are installed. To facilitate the deployment of
new power cables during capacity expansion of PMs, you are advised to configure
the PMs from the top down and leave a filler panel in the position where no PM is
installed.

Table 3-67 Power supply examples
Overall Power PM PM N PEM Cabling PEM N+N
Max Configura +1 Backup
Consumption tion Backu
p

P<2200W 1,2 1+1 A1,B1,A2,B2 2+2

2200W=<P<440 1,2,3 2+1 A1,B1,A2,B2,A3, 3+3
0W B3

4400W=<P<660 1,2,3,4 3+1 A1,B1,A2,B2,A3, 4+4
0W B3,A4,B4

... ... …… ... ……

48400W=<P<50 1,2,3,4,5,6, 23+1 A1,B1,A2,B2,A3, 24+24
600W 7,8,9,10,11 B3...A24,B24
,12,13,14,1
5,16,17,18,
19,20,21,2
2,23,24

● Dual Input AC&HVDC
A single dual-input AC&high-voltage DC PM provides 3000 W power.
Determine the number of PMs based on the maximum power consumption of
the entire chassis. Use the N+1 PM backup mechanism as an example. N+1
PMs are configured for power supply, with N being the number of PMs
required for the power consumption of the entire device. The value of N x
3000 W must be greater than the overall power consumption of the entire
device. Table 3-68 shows the details.

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NO TE

1. PM slots and PEM slots must be mapped. Each PM must have two inputs, which
are from power supply areas A and B, respectively.
2. If PMs are not fully configured, power cables are routed only for the PEM
interfaces whose corresponding PMs are installed. To facilitate the deployment of
new power cables during capacity expansion of PMs, you are advised to configure
the PMs from the top down and leave a filler panel in the position where no PM is
installed.
3. By default, PM1, PM2, PM5, PM6..., PM21, and PM22 provide power supply A, and
PM3, PM4, PM7, PM8, ..., PM23, and PM24 provide power supply B.

Table 3-68 Power supply examples
Overall PM PM N PEM Cabling PEM N+N
Power Max Configuratio +1 Backup
Consumpti n Backup
on

P<3000W 1,2 1+1 A1,B1,A2,B2 2+2

3000W≤P< 1,2,3 2+1 A1,B1,A2,B2,A3, 3+3
6000W B3

6000W≤P< 1,2,3,4 3+1 A1,B1,A2,B2,A3, 4+4
9000W B3,A4,B4

... ... …… ... ……

66000W≤P 1,2,3,4,5,6,7,8, 23+1 A1,B1,A2,B2,A3, 24+24
<69000W 9,10,11,12,13, B3...A24,B24
14,15,16,17,1
8,19,20,21,22,
23,24

Table 3-69 describes recommended power supply configurations. You can choose
the PM configuration based on the actual platform.

Table 3-69 Recommended configurations
Power Supply -48 V DC AC power 240 V HVDC 380 V HVDC
Scenario power supply power supply power supply
supply

1.6T Platform 17+1 13+1 13+1 13+1

3.1.3.3.2 System Power Supply Architecture
The NE5000E-20 uses a flexible power supply architecture.

-48 V DC Power Supply
As shown in Figure 3-49, the NE5000E-20 has six PEMs. Each PEM has eight
inputs. There are altogether 48 inputs (24 inputs on each of power supply source

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A and power supply source B). Each PM has two inputs. The two inputs are from
power supply areas A and B, respectively. The PM converts the power and outputs
the power to the power supply backplane. In this manner, power supply source A
and B back up each other A maximum of 24 PMs can be configured based on the
N+m(m≥1) backup mechanism.

Figure 3-49 DC power supply

Dual Input AC&HVDC Power Supply
As shown in Figure 3-50, the NE5000E-20 has six PEMs. Each PEM has eight
inputs. There are altogether 48 inputs (24 inputs on each of power supply source
A and power supply source B). Each PM has two inputs. The two inputs are from
power supply areas A and B, respectively. The PM converts the power and outputs
the power to the power supply backplane. In this manner, power supply source A
and B back up each other A maximum of 24 PMs can be configured based on the
N+m(m≥1) backup mechanism.

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Figure 3-50 Dual Input AC&HVDC power supply

3.1.3.3.3 PDC-2200WC (PSU-PDC-2200WC-PM2200W DC Power Supply)

Overview

Table 3-70 Basic information about the PDC-2200WC
Item Details

Description PSU-PDC-2200WC-PM2200W DC
Power Supply

Part Number 02312GDC

Model PDC-2200WC

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Item Details

Remarks 1. PMs can be configured based on the
overall power consumption of the
device to implement flexible power
distribution.
2. For PMs of the same type or
different types, the power indicator
may have slight color variation due to
temperature fluctuation or material
tolerance.
3. Ensure that the upstream circuit
breaker/fuse connects to the power
supply in one-to-one mode. Do not
connect one circuit breaker/fuse to
multiple power supplies.

NO TICE

● The external power is input to PMs through PEMs. The PMs output power to
the power supply backplane. The DC power supply uses dual inputs (input A
and input B). Two inputs of each DC power supply may be connected to two
different sources, and if the voltage values of the two sources are different, the
source with a higher DC voltage value provides a larger or all current.
● Ensure that the upstream input and circuit breakers on areas A and B meet the
power supply requirements of the entire system. Otherwise, the power supply
of the entire system may be affected if one area cannot provide all the power
required by the entire system.

Appearance

Figure 3-51 Appearance of the PDC-2200WC

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find

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desired information and filter the mapping data for more fine-grained data
display.

enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=02312GDC&productModel=PDC-2200WC#matchRelation

Panel

Figure 3-52 Panel of the PDC-2200WC

Table 3-71 Indicators on the PDC-2200WC

Silkscreen Name Color Status Description

INPUT Input Green On Normal
Indicator status.

Green Blinking The input
voltage
exceeds the
preset
operating
voltage range.

- Off ● No DC
input.
● Positive
and
negative
terminals
are
incorrectly
connected
to each
other.

OUTPUT Output Green On Normal
Indicator status.

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Silkscreen Name Color Status Description

- Off ● The power
module
does not
have DC
output.
● Output
voltage is
too low.

ALARM Alarm Red On ● Fans are
Indicator faulty.
● The device
is powered
off due to
overtempe
rature.
● The device
is powered
off due to
over-
output-
voltage.
● The device
is powered
off due to
overcurren
t or short
circuit.
● The
current of
modules is
seriously
imbalance
d.

- Off Normal
status.

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Functions and Features

Table 3-72 Functions and features of the PDC-2200WC
Functions and Features Description

Input undervoltage protection In this protection state, the power
module stops supplying power, but
automatically resumes power supply
when the system recovers.
The INPUT indicator blinks green.

Input overcurrent protection In this protection state, the power
module stops supplying power and
cannot automatically resume power
supply.
The INPUT indicator is off.

Output overvoltage protection In this protection state, the power
module is turned off and stops
supplying power. When the system
recovers from input overcurrent, the
power module cannot automatically
resume power supply.
The OUTPUT indicator is off.

Output current limiting protection In this protection state, the power
module limits the current within a
certain range, but automatically
resumes power supply when the
system recovers.
The OUTPUT indicator is steady green.

Output short circuit protection In this protection state, the power
module supplies power intermittently
and limits the current within a certain
range, but automatically resumes
power supply when the system
recovers.
The OUTPUT indicator is off.

Overtemperature protection When the temperature exceeds 55°C
(131°F), the power module stops
supplying power. When the
temperature falls below 55°C (131°F),
the power module automatically
resumes power supply. The OUTPUT
indicator is off.

Heat dissipation mode The power module has a built-in fan
module, which uses a front-to-back
airflow design.

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Functions and Features Description

Hot swap Supported.

Technical Specifications

Table 3-73 Technical specifications of the PDC-2200WC

Item Specification

Dimensions without packaging (H x W 41 mm x 106.5 mm x 485 mm (1.61 in.
x D) [mm(in.)] x 4.19 in. x 19.09 in.)

Weight without packaging [kg(lb)] 2.4 kg (5.29 lb)

Number of inputs 2

Rated input voltage [V] -48 V / -60 V

Input voltage range [V] –40 V to –72 V

Maximum input current [A] 63 A

Rated output voltage [V] 53.5 V

Rated output current [A] 42 A

Rated output power [W] 2200 W

Power supply efficiency 0.94

Power dissipation Mode Built-in fan

3.1.3.3.4 Dual-input DC PEM

DC PEMs are delivered with the device to provide DC power input. Each PEM
provides eight power inputs. The four terminals on the right back of a PEM
connect to power supply area A, and the four terminals on the left back connect
to power supply area B. Power supply areas A and B back up each other. If one
power supply area has no current output, the other power supply area can provide
all current required for the device to work properly.

Appearance

Figure 3-53 shows the appearance of a DC PEM.

Figure 3-53 DC PEM

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Panel

Table 3-74 Interface description
Interface Description Power Cable Terminal
Name

NEG(-) Input interface ● JG2-25mm2-M6-150A, applicable to
for –48 V power 25mm2 power cables
supply ● JG2-34.3mm2-M6(1/4")-134A, applicable
RTN(+) Input interface to 35mm2 power cables
for BGND power
supply

Input Requirements
● Protection components must be provided for PDFs to ensure that the rated
current of each channel is not less than 63 A.

NO TICE

Note the derating requirements of protection components when using
protection components such as fuses and circuit breakers. If the current of a
PDF is less than 63 A, it cannot supply power to the NE5000E. In this case,
reconstruct power supply in the equipment room.
The PEM requires two power inputs for backup.

● If the front-end PDF does not provide enough power inputs, configure a PDB
that meets the following requirements:
– The current of each channel output by the DC PDB is not less than 63 A.
– Double-channel backup is used.
– The input current is not less than the sum of current of its connected
output lines.

3.1.3.3.5 PAH-3000WA (02312JEA: 3000W Dual Inputs AC&HVDC Power Module)

Overview

Table 3-75 Basic information about the PAH-3000WA
Item Details

Description 3000W Dual Inputs AC&HVDC Power
Module

Part Number 02312JEA

Model PAH-3000WA

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Item Details

Remarks 1. PMs can be configured based on the
overall power consumption of the
device to implement flexible power
distribution.
2. For PMs of the same type or
different types, the power indicator
may have slight color variation due to
temperature fluctuation or material
tolerance.
3. Ensure that the upstream circuit
breaker/fuse connects to the power
supply in one-to-one mode. Do not
connect one circuit breaker/fuse to
multiple power supplies.

NO TE

● After the external power is input to PMs through PEMs, the PMs output the power to
the power supply backplane. Each PM has two inputs, which are from power supply
areas A and B, respectively. The PM combines the two power inputs and outputs one.
● The power module supports AC and HVDC mixed power supply:
● If the two power supplies have different power systems, the AC power supply is
preferentially used as the active power supply (to ensure the highest power supply
efficiency), and the high-voltage DC power supply is used as the standby power
supply.
● If the two power supplies have the same power system, power supply A is
preferentially used as the active power supply, and power supply B is used as the
standby power supply.

NO TICE

1. Ensure that the upstream input and circuit breakers on areas A and B meet the
power supply requirements of the entire system. Otherwise, the power supply
of the entire system may be affected if one area cannot provide all the power
required by the entire system.
2. If the active power supply is abnormal, the system automatically switches to
the standby power supply. When the active power supply recovers, the system
automatically switches back to the active power supply.
3. When the fan of the Power Module is faulty, the Power Module hiccup occurs
every three minutes. The Power Module attempts to establish output again. At
this time, the Output Indicator is On and the Alarm Indicator is Off. If the fault
persists, the Output Indicator is Off and the Alarm Indicator is On 30 seconds
later.

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Hardware Guide 3 Hardware Description

Appearance

Figure 3-54 Appearance of the PAH-3000WA

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=02312JEA&productModel=PAH-3000WA#matchRelation

Panel

Figure 3-55 Panel of the PAH-3000WA

Table 3-76 Indicators on the PAH-3000WA
Silkscreen Name Color Status Description

Input Input Green On Normal
Indicator status.

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Silkscreen Name Color Status Description

Green Blinking The voltage
slowly (0.5 of the two
Hz) inputs
exceeds the
acceptable
range.

Green Blinking The parity
rapidly (4 Hz) check of the
address signal
fails (the
power
address is
incorrect).

Output Output Green On Normal
Indicator status.

Green Blinking The parity
rapidly (4 Hz) check of the
address signal
fails (the
power
address is
incorrect).

- Off ● The power
module
does not
have DC
output.
● Output
voltage is
too low.

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Silkscreen Name Color Status Description

Alarm Alarm Red On ● Power
Indicator failure
caused by
an internal
Power
failure.
● Fans are
faulty.
● The device
is powered
off due to
overtempe
rature.
● The device
is powered
off due to
over-
output-
voltage.
● The device
is powered
off due to
overcurren
t or short
circuit.
● The
current of
modules is
seriously
imbalance
d.

Red Blinking The parity
rapidly (4 Hz) check of the
address signal
fails (the
power
address is
incorrect).

- Off Normal
status.

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Functions and Features

Table 3-77 Functions and features of the PAH-3000WA
Functions and Features Description

Input undervoltage protection In this protection state, the power
module stops supplying power, but
automatically resumes power supply
when the system recovers.
The Input indicator is blinking green.

Input overvoltage protection In this protection state, the power
module stops supplying power, but
automatically resumes power supply
when the system recovers.
The Input indicator is blinking green.

Input overcurrent protection In this protection state, the power
module stops supplying power and
cannot automatically resume power
supply.
The Input indicator is off.

Output overvoltage protection If output overvoltage is caused by the
power module itself, the power
module stops supplying power and
cannot automatically resume power
supply. The Output indicator is off.
If output overvoltage is caused by
external voltage, the power module
stops supplying power, but
automatically resumes power supply
when the system recovers. The Output
indicator is steady green.

Output current limiting protection In this protection state, the power
module limits the current within a
certain range, but automatically
resumes power supply when the
system recovers.
The Output indicator is steady green.
When the output voltage is lower than
44 V DC, the Output indicator is off.

Output short circuit protection In this protection state, the power
module supplies power intermittently
and limits the current within a certain
range, but automatically resumes
power supply when the system
recovers.
The Output indicator is off.

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Functions and Features Description

Overtemperature protection When the temperature exceeds 55°C,
the power module stops supplying
power. When the temperature falls
below 55°C, the power module
automatically resumes power supply.
The Output indicator is off.

Heat dissipation mode The power module has a built-in fan
module, which uses a front-to-back
airflow design.

Dual input power supply switchover When dual power inputs are used, if
power input A fails, power input B is
automatically used. To prevent power
supply flapping, the system does not
switch back to power supply A
immediately but waits for 4.5 hours
after power supply A recovers.

Hot swap Supported

Technical Specifications

Table 3-78 Technical specifications of the PAH-3000WA

Item Specification

Dimensions without packaging (H x W 41 mm x 106.5 mm x 485 mm (1.61 in.
x D) [mm(in.)] x 4.19 in. x 19.09 in.)

Weight without packaging [kg(lb)] 2.87 kg (6.33 lb)

Number of inputs 2

Rated input voltage [V] 200 V AC to 240 V AC (220 V power
grid)
240 V DC/380 V DC

Input voltage range [V] 180 V AC to 264 V AC
192 V DC to 400 V DC

Maximum input current [A] 16 A

Rated output voltage [V] 53.5 V

Rated output current [A] 56 A

Rated output power [W] 3000 W

Power supply efficiency 0.96

Power dissipation Mode Built-in fan

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NO TE

The AC power supply system supports 200 V to 240 V and the power supply voltage ranges
from 180 V to 264 V. The 110 V single-phase AC input is not supported. The 110 V dual-
live-wire system must be supported. The dual-live-wire power supply voltage ranges from
180 V to 264 V.
240 V high-voltage DC power supply system, with the input voltage ranging from 192 V to
288 V. 380 V high-voltage DC power supply system with the input voltage ranging from 260
V to 400 V.

3.1.3.3.6 Dual-Input AC & HVDC PEM

Dual-input AC and high-voltage DC PEMs are fully configured when the device is
delivered. Each PEM provides eight channels of power inputs. The four terminals
on the right back of the PEM connect to power supply area A, and the four
terminals on the left back connect to power supply area B. Power supply areas A
and B back up each other. If one power supply area has no current output, the
other power supply area can provide all current required for the device to work
properly.

NO TE

● The PEM does not support on-site replacement.
● The PEM can use only AC&HVDC power cables.

Appearance

Figure 3-56 shows the appearance of a dual-input AC&HVDC PEM.

Figure 3-56 Appearance of a dual-input AC&HVDC PEM

Panel

Table 3-79 Interface description

Interface Description Power Cable Terminal

Power 220 V AC, 240 V HVDC 3 straight female
connector HVDC, and 380 V
HVDC power
input interfaces

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Input Requirements
● Protection components must be provided for PDFs to ensure that the rated AC
current of each channel is not less than 16 A and the rated HVDC current of
each channel is not less than 14 A.

NO TICE

Note the derating requirements of protection components when using
protection components such as fuses and circuit breakers.
The PEM requires two power inputs for backup.

NO TE

● The input circuit breakers of a PDF must match the output circuit breakers.
● In the AC power supply scenario, the rated voltage for single-phase AC input must
be 200–240 V AC.
● In the HVDC power supply scenario, ensure that the protection components meet
HVDC certification requirements and the fuses and circuit breakers meet positive
and negative pole protection requirements.
● If the front-end PDF does not provide enough power inputs, configure a
power distribution box (PDB) that meets the following requirements:
– The current of each output of the AC PDB is not less than 16 A.
– The current of each output of the HVDC PDB is not less than 14 A.
– The PDB supports dual-output backup.
– The input current of the PDB is not less than the sum of current of the
used outputs.

3.1.3.3.7 Switch
The switch controls the power output of PMs. The two switches back up each
other. When one or two switches are in the ON state, the power output of PMs is
enabled.

Appearance
Figure 3-57 shows the appearance of a switch.

Figure 3-57 Main components of the power system

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Panel

Table 3-80 Switch

Switch Name Description

OFF/ON Controls power-on or power-off of
devices.

Function
When one or both switches are turned on, the PMs output power, and the device
is powered on. When both switches are turned off, the PMs do not output power,
and the device is powered off.

NO TICE
Ensure that both switches are turned on when the device is running for reliability
purposes.

3.1.3.3.8 Power System Technical Specifications

-48 V DC

Table 3-81 -48 V DC power system specifications

Item Description

Number of power modules 24 (full configuration)

Input channels 48 (full configuration)

Maximum input diameter 35mm^2 per input

Input voltage -40 V to -72 V (rated voltage -48
V/-60 V)

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Item Description

Input current A maximum of 63 A for an input per
module

Front-end circuit breaker/fuse 2-channel 63 A per module

Output channels 24 (full configuration)

Output voltage 53.5 V DC

Output current 46 A per module

Output power 2200 W per module

Converting efficiency 0.94

AC

Table 3-82 AC power system specifications
Item Description

Number of power modules 24 (full configuration)

Input channels 48(full configuration)

Maximum input diameter Standard cable

Input voltage 180 V to 264 V (rated voltage 200 V to
240 V)

Input current A maximum of 16 A for an input per
module

Front-end circuit breaker/fuse 2-channel 16 A per module

Output channels 24 (full configuration)

Output voltage 53.5 V DC

Output current 56 A per module

Output power 3000 W per module

Converting efficiency 0.96

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HVDC

Table 3-83 HVDC power system specifications
Item Description

Number of power modules 24 (full configuration)

Input channels 48 (full configuration)

Maximum input diameter Standard cable

Input voltage 192 V to 400 V (rated voltage 240V/
380V)

Input current A maximum of 14 A for an input per
module

Front-end circuit breaker/fuse 2-channel 16 A per module

Output channels 24 (full configuration)

Output voltage 53.5 V DC

Output current 56 A per module

Output power 3000 W per module

Converting efficiency 0.96

3.1.4 Fan
This section describes the appearance, functions, and technical specifications of
the fan module.

3.1.4.1 NE5000E-X16A Heat Dissipation System

3.1.4.1.1 System Air Channel
The NE5000E-X16A supports a maximum of six fan modules. For a platform with
forwarding capacity less than 400 Gbit/s, only four fan modules need to be
configured. For a 1T platform, six fan modules need to be configured. Each fan
module consists of six fans.
Figure 3-58 shows the locations of the fan module and the air intake vent.

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Hardware Guide 3 Hardware Description

Figure 3-58 Locations of the fan module and the air channel

1. Upper air intake 2. Lower air intake 3. Air intake vent 4. Fan module
vent vent in the SFU area

The NE5000E-X16A provides three air channels. Each of the upper board cage and
the lower board cage has an air channel. Both air channels draw air from the front
and exhaust air from the rear. The SFU slot area has an air channel. The air
channel draws air from the left and exhausts air from the rear top and rear
bottom. The system draws air for heat dissipation. Figure 3-59 shows air flows.

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Figure 3-59 Diagram of air flows

3.1.4.1.2 Fan Speed Adjustment
This section describes the fan Speed adjustment.
When the system is in full configuration, the temperatures reported by the
temperature sensors on the SFUs, and MPUs serve as the basis for fan speed
adjustment. General rules are listed as follows:

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Table 3-84 Fan Speed Adjustment Principles
Ambient Rotational Noise and Dissipation Standards
Tempera Speed
ture

-5°C - ● Low rotation When fans rotate at a constantly low speed and
+27°C speed (400G/ the fans meet heat dissipation requirements of a
(23°F - 800G 38%) fully configured system.
80.6°F)

27°C - Linear variation The fan speed is adjusted smoothly in linear
40°C mode, without a sharp increase in noises.
(80.6°F -
104°F)

Over High speed Fans rotate at a high speed to meet heat
40°C (100%) dissipation requirements.
(104°F)

3.1.4.1.3 E000FBX08 (Fan Box)

Overview

Table 3-85 Basic information about the E000FBX08
Item Details

Description Fan Box

Part Number 02120866

Model E000FBX08

NO TE

The fan module is located on the air exhaust vent.

Appearance

Figure 3-60 Appearance of the E000FBX08

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The Info-Finder hardware center incorporates comprehensive hardware
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enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
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Panel

Table 3-86 Indicators on the E000FBX08

Silkscreen Name Color Status Description

STATUS Running Green Blinking If the
status indicator
indicator blinks once
every two
seconds (0.5
Hz), the fan
module is
working
properly.

Green Blinking If the
rapidly indicator
blinks four
times every
second (4
Hz), the fan
module is
registering.

Red Blinking If the
indicator
blinks once
every two
seconds (0.5
Hz), the fan
module is
faulty.

Orange Steady on If the
indicator is
steady on, the
fan module is
faulty.

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Technical Specifications

Table 3-87 Technical specifications of the E000FBX08
Item Specification

Dimensions without packaging (H x W 131 mm x 440 mm x 120 mm (5.16 in.
x D) [mm(in.)] x 17.32 in. x 4.72 in.)

Weight without packaging [kg(lb)] 5.4 kg (11.9 lb)

Number of fans 6

Typical power consumption [W] 40 W

3.1.4.1.4 Air Filter
A black sponge air filter on the air intake vent prevents dust from getting into the
system. The air filter can be removed and cleaned. Cleaning air filters once every
three months is recommended.
The NE5000E-X16A has three air filters, the locations of which are shown in
Figure 3-61.

Figure 3-61 Location of air filters

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1. Upper air filter 2. Lower air filter 3. Air filter in the SFU
area

The appearance of the air filter is shown in Figure 3-62.

Figure 3-62 Appearance of the air filter

The appearance of the air filter in the SFU slot area is shown in Figure 3-62.

Figure 3-63 Appearance of the air filter in the SFU slot area

3.1.4.2 NE5000E-X16B Heat Dissipation System

3.1.4.2.1 System Air Channel
The NE5000E-X16B supports a maximum of six fan modules. For a platform with
forwarding capacity as 400 Gbit/s or below. Each fan module consists of six fans.
Figure 3-64 shows the locations of the fan module and the air intake vent.

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Hardware Guide 3 Hardware Description

Figure 3-64 Locations of the fan module and the air channel

1. Upper air intake 2. Lower air intake 3. Air intake vent 4. Fan module
vent vent in the SFU area

The NE5000E-X16B provides three air channels. Each of the upper board cage and
the lower board cage has an air channel. Both air channels draw air from the front
and exhaust air from the rear. The SFU slot area has an air channel. The air
channel draws air from the left and exhausts air from the rear top and rear
bottom. The system draws air for heat dissipation. Figure 3-65 shows air flows.

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Figure 3-65 Diagram of air flows

3.1.4.2.2 Fan Speed Adjustment
This section describes the fan Speed adjustment.
When the system is in full configuration, the temperatures reported by the
temperature sensors on the SFUs, and MPUs serve as the basis for fan speed
adjustment. General rules are listed as follows:

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Table 3-88 Fan Speed Adjustment Principles
Ambient Rotational Noise and Dissipation Standards
Tempera Speed
ture

-5°C - ● Low rotation When fans rotate at a constantly low speed and
+27°C speed (400G/ the fans meet heat dissipation requirements of a
(23°F - 800G 38%) If fully configured system.
80.6°F) NE5000E–
X16B 2T
platform,
Low rotation
speed (42%)

27°C - Linear variation The fan speed is adjusted smoothly in linear
40°C mode, without a sharp increase in noises.
(80.6°F -
104°F)

Over High speed Fans rotate at a high speed to meet heat
40°C (100%) dissipation requirements.
(104°F)

3.1.4.2.3 E000FBX08 (Fan Box)

Overview

Table 3-89 Basic information about the E000FBX08
Item Details

Description Fan Box

Part Number 02120866

Model E000FBX08

NO TE

The fan module is located on the air exhaust vent.

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Appearance

Figure 3-66 Appearance of the E000FBX08

Version Mapping

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The Info-Finder hardware center incorporates comprehensive hardware
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display.

enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=02120866&productModel=E000FBX08#matchRelation

Panel

Table 3-90 Indicators on the E000FBX08

Silkscreen Name Color Status Description

STATUS Running Green Blinking If the
status indicator
indicator blinks once
every two
seconds (0.5
Hz), the fan
module is
working
properly.

Green Blinking If the
rapidly indicator
blinks four
times every
second (4
Hz), the fan
module is
registering.

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Silkscreen Name Color Status Description

Red Blinking If the
indicator
blinks once
every two
seconds (0.5
Hz), the fan
module is
faulty.

Orange Steady on If the
indicator is
steady on, the
fan module is
faulty.

Technical Specifications

Table 3-91 Technical specifications of the E000FBX08
Item Specification

Dimensions without packaging (H x W 131 mm x 440 mm x 120 mm (5.16 in.
x D) [mm(in.)] x 17.32 in. x 4.72 in.)

Weight without packaging [kg(lb)] 5.4 kg (11.9 lb)

Number of fans 6

Typical power consumption [W] 40 W

3.1.4.2.4 Noise Reduction Module
This section describes the appearance and technical specifications of the noise
reduction module.

Appearance
The noise reduction module is located behind the fan module and consists of the
parts in the upper and lower chassis. The noise reduction module can significantly
reduce noise, preventing noise-induced hearing loss. Figure 3-67 shows the noise
reduction module in the upper chassis, and Figure 3-68 shows the noise reduction
module in the lower chassis.

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Figure 3-67 Noise reduction module in the upper chassis

Figure 3-68 Noise reduction module in the lower chassis

Technical Specifications

Table 3-92 lists technical specifications of the noise reduction module.

Table 3-92 Technical specifications of the noise reduction modules

BOM Number Dimensions (H x W x Weight
D)

21242201 442 mm x 440 mm x 200 11 kg
mm

21242202 442 mm x 440 mm x 200 11 kg
mm

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3.1.4.2.5 Air Filter
A black sponge air filter on the air intake vent prevents dust from getting into the
system. The air filter can be removed and cleaned. Cleaning air filters once every
three months is recommended.
The NE5000E-X16B has three air filters, the locations of which are shown in Figure
3-69.

Figure 3-69 Location of air filters

1. Upper air filter 2. Lower air filter 3. Air filter in the SFU
area

The appearance of the air filter is shown in Figure 3-70.

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Hardware Guide 3 Hardware Description

Figure 3-70 Appearance of the air filter

The appearance of the air filter in the SFU slot area is shown in Figure 3-71.

Figure 3-71 Appearance of the air filter in the SFU slot area

3.1.4.3 NE5000E-20 Heat Dissipation System

3.1.4.3.1 System Air Channel
This section describes the system air channel.
The NE5000E-20 chassis is integrated in a cabinet, and the air filter is installed on
the cabinet front door.
Figure 3-72 shows the locations of the fan modules and air intake vents. Fan
module 1 corresponds to heat dissipation area a, fan module 2 corresponds to
heat dissipation area b, and fan module 3 corresponds to heat dissipation area c.

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Hardware Guide 3 Hardware Description

Figure 3-72 Mapping between fan modules and heat dissipation areas

The NE5000E-20 has three air channels, which draw air from the front and
exhaust air from the back. The system draws air for heat dissipation. Figure 3-73
shows the air flow in the chassis.

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Hardware Guide 3 Hardware Description

Figure 3-73 Air flow in the chassis

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3.1.4.3.2 Rotational Speed Adjustment Policy
This section describes the policy of adjusting the fan rotational speed.
The fan rotational speeds are adjusted based on the temperatures reported by the
sensors on the LPUs, SFUs, and MPUs. The rules for adjusting the fan rotational
speeds are as follows:

Ambient Temperature Rotational Speed Noise/Heat Dissipation
Standards

-5°C to +27°C Low speed Fans rotate at a fixed
(1.6T SFU areas: 35%, low speed. Fan noise
LPU areas: 57%) meets the ETSI
standards, and heat
dissipation meets the
requirements of typical
configuration.

27°C to 40°C Linear and silent speed The fan rotation speeds
adjustment are adjusted smoothly,
and the fan noise does
not change violently.

Higher than 40°C High speed (100%) Fans rotate at a high
speed to meet heat
dissipation requirements.

3.1.4.3.3 CR9M000FBX64 (Fan Tray Assembly T 2.0)
Each fan module contains six fans. Supports hot swap. When a fan fails, the fan
chassis still works properly and other fans will make up for the airflow loss.

Overview

Table 3-93 Basic information about the CR9M000FBX64
Item Details

Description Fan Tray Assembly T 2.0

Part Number 02122158

Model CR9M000FBX64

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Appearance

Figure 3-74 Appearance of the CR9M000FBX64

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
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desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
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Panel

Table 3-94 Indicators on the CR9M000FBX64
Silkscreen Name Color Status Description

STATUS Running Green Blinking If the
status indicator
indicator blinks once
every two
seconds (0.5
Hz), the fan
module is
working
properly.

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Silkscreen Name Color Status Description

Green Blinking If the
quickly indicator
blinks four
times every
second (4
Hz), the fan
module is
registering.

Red Blinking If the
indicator
blinks once
every two
seconds (0.5
Hz), the fan
module is
faulty.

Orange Steady on If the
indicator is
steady on, the
fan module is
faulty.

Technical Specifications

Table 3-95 Technical specifications of the CR9M000FBX64
Item Specification

Dimensions without packaging (H x W 131 mm x 440 mm x 122.5 mm (5.16
x D) [mm(in.)] in. x 17.32 in. x 4.82 in.)

Weight without packaging [kg(lb)] 5 kg (11.02 lb)

Number of fans 6

Typical power consumption [W] 105 W

NO TE

The typical power consumption of the CR9M000FBX64 fan depends on the selected boards
and chassis. Details are as follows:
NE5000E-20: 105 W for 1.6T boards.
NE5000E CCC-A: 60 W for 1.6T boards.

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3.1.4.3.4 CR9M000FBX65 (FAN BOX B)
The fan tray assembly of the NE5000E is located on the air exhaust vent. Each fan
module contains five fans. Supports hot swap. When a fan fails, the fan chassis
still works properly and other fans will make up for the airflow loss.

Overview

Table 3-96 Basic information about the CR9M000FBX65
Item Details

Description FAN BOX B

Part Number 02122319

Model CR9M000FBX65

Appearance

Figure 3-75 Appearance of the CR9M000FBX65

Version Mapping
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display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=02122319&productModel=CR9M000FBX65#matchRelation

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Panel

Table 3-97 Indicators on the CR9M000FBX65

Silkscreen Name Color Status Description

STATUS Running Green Blinks once The fan
status every two module is
indicator seconds (0.5 working
Hz) properly.

Green Blinks four The fan
times every module is
second (4 Hz) registering.

Red Blinks once The fan
every two module is
seconds (0.5 faulty.
Hz)

Orange Steady on The fan
module is
faulty.

Technical Specifications

Table 3-98 Technical specifications of the CR9M000FBX65

Item Specification

Dimensions without packaging (H x W 87 mm x 490 mm x 135 mm (3.43 in. x
x D) [mm(in.)] 19.29 in. x 5.31 in.)

Weight without packaging [kg(lb)] 4.2 kg (9.26 lb))

Number of fans 10

Typical power consumption [W] 61 W

NO TE

The typical power consumption of the CR9M000FBX65 fan depends on the selected boards.
Details are as follows:
NE5000E-20: 61 W for 1.6T boards.

3.1.4.3.5 Air Filter

The NE5000E-20 chassis is integrated in a cabinet, and the air filter is installed on
the cabinet front door. Cleaning air filters once every three months is
recommended.

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Figure 3-76 Appearance of the air filter

3.1.5 Boards

3.1.5.1 Overview
This chapter describes the appearance and structure of boards and subcards, filler
panel, board and subcard specifications, rules for numbering slots and interfaces.

3.1.5.1.1 Board Structure
This section describes the appearance and structure of boards and subcards.
● Structure of the integrated board
The integrated board on the NE5000E is a plug-in board and consists of the
circuit board, connector, heat sinks, interface panel, ejector lever, and captive
screws, as shown in Figure 3-77.

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Figure 3-77 Structure of the integrated board

1. Captive screw 2. Interfaces 3. Ejector lever 4. Protection cover

● Structure of the flexible board
A flexible board consists of two parts:
– Motherboard
– Flexible subcard
– Structure of the motherboard
The flexible board is a plug-in board and consists of the circuit board,
connector, heat sinks, interface panel, ejector lever, and captive screws, as
shown in Figure 3-78.

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Hardware Guide 3 Hardware Description

Figure 3-78 Structure of the flexible board

1. Captive screw 2. Subcard slots 3. Ejector lever 4. Protection cover

– Flexible subcard
The flexible subcard is a plug-in board and consists of the circuit board,
connector, heat sinks, interface panel, ejector lever, and captive screws, as
shown in Figure 3-79.

Figure 3-79 Structure of the flexible subcard

1. Captive 2. Ejector 3. Interfaces 4. Heat sinks 5. Connector 6. Circuit
screw lever board

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3.1.5.1.2 Board and Subcard Specifications

This section describes the board and subcard specifications.

Height, Width, and Depth

Figure 3-80 and Figure 3-81 show the height, width, and depth.

Figure 3-80 Board

Figure 3-81 Subcard

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Subcard Specifications
There are three subcard specifications.
● Full-dimensional subcard (1H, 1W)
Only one full-dimensional subcard (1H, 1W) can be installed on an LPU
motherboard, as shown in Figure 3-82.

Figure 3-82 Full-dimensional subcard (1H, 1W)

● Full-height half-width subcard (1H, 1/2W)
Two full-height half-width subcards (1H, 1/2W) can be installed on an LPU
motherboard, as shown in Figure 3-83.

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Figure 3-83 Full-height half-width subcard (1H, 1/2W)

● Full-height quarter-width subcard (1H, 1/4W)
Four full-height quarter-width subcards (1H, 1/4W) can be installed on an
LPU motherboard, as shown in Figure 3-84.

Figure 3-84 Full-height quarter-width subcard (1H, 1/4W)

3.1.5.1.3 Filler Panel
The filler panel can be used to fill the idle board or subcard slots to ensure normal
device operations.

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Filler Panel Appearance

A filler panel does not house any indicators, interfaces, circuit boards, heat sinks,
or connectors.

Figure 3-85 shows the appearance of various board and subcard filler panels.

Figure 3-85 Filler panel appearance

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Filler Panel Functions

The main functions of a filler panel are described as follows:

● Provides electromagnetic shielding performance to protect the chassis against
electromagnetic radiation.
● Fills the idle slots to ensure normal operation of the heat dissipation system.
● Frees the chassis from dust.
● Covers the internal circuits.

Example

All the LPU slots on the chassis are equipped with filler panels by default. One
filler panel is removed only when a board is to be installed in the slot.

Use the NE5000E-20 as an example. Figure 3-86 shows how filler panels are
installed on the chassis.

Figure 3-86 Filler panels on the NE5000E-20

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3.1.5.1.4 Rules for Numbering Slots and Interfaces
This section describes the rules for numbering slots and interfaces.

Numbering rules
● LPU slots are numbered in left-right and top-down order. The slot number is
marked on the slots.
Use the NE5000E-20 as an example. LPU slot numbers start from 1 and range
from 1 to 20, as shown in Figure 3-87.

Figure 3-87 Slot layout on the NE5000E-20

● Slot numbers
The slot numbers start from 0. Figure 3-88, Figure 3-89, and Figure 3-90
show the numbering rules.

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Figure 3-88 Numbering rules for the full-dimensional subcard (1H, 1W)

Figure 3-89 Numbering rules for the full-height half-width subcard (1H,
1/2W)

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Figure 3-90 Numbering rules for the full-height quarter-width subcard (1H,
1/4W)

● Interface number
Interfaces are numbered from 0 in left-right and top-down order.
Interfaces are arranged in a single row or two rows. Figure 3-91 shows how
interfaces are numbered.

Figure 3-91 Interface numbers

Example for Naming Interfaces

Interfaces are named in the format of LPU slot/FPIC slot/interface number.

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Hardware Guide 3 Hardware Description

Use the NE5000E-X16A as an example. As shown in Figure 3-92, the LPU slot
number is 7, the FPIC slot number is 1, and the interface number is 2. Therefore,
the interface is named 7/1/2.

Figure 3-92 Interface numbers

NO TE

● If the LPU is a fixed interface board, the FPIC slot number is considered 0.
● If the LPU slot number is special, use the actual board information to name the
interface.

3.1.5.1.5 Board Indicators
Indicators are present on the front panel of each board. This section describes the
common indicators. For details about the indicators, see the corresponding board
description page.

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Table 3-99 Descriptions of MPU indicators
Indicat Name Color Status Description
or

OFL Board Red Steady on The board can be removed
insertio safely.
n/
removal
indicato
r

MST Cluster Green Steady on The chassis functions as the
master/ master chassis.
slave
status - Off The chassis functions as the
indicato slave chassis.
r

RUN Running Green MPUN: Before The system is starting and
status registration: has not registered.
indicato blinking twice
r every second (2
Hz).
MPUQ/MPUV:
Before the
board is
powered on
and registered,
the indicator
blinks four
times every
second (4 Hz).

Green After the board The system is running
is powered on properly.
and registered:
The indicator
blinks once
every two
seconds (0.5
Hz).

ALM Alarm Red Steady on Alarms have been generated.
indicato
r - Steady off No alarms have been
generated.

ACT Control Green Steady on The board functions as the
status master main control board.
indicato
r - Steady off The board functions as the
slave main control board.

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Indicat Name Color Status Description
or

USB ACT Reserved Reserved Reserved
ACT indicato
r

HP-GE Interfac Green Steady on The link is Up.
e status
indicato Green Blinking Data is being transmitted
r and received.

MGMT- LINK Green Steady on The link is Up.
ETH status
LINK indicato - Steady off The link is Down.
r

MGMT- ACT Yellow Blinking Data is being transmitted
ETH indicato and received.
ACT r
- Steady off No data is being transmitted
or received.

FSP FSP Green Steady on The link is Up.
indicato
r Green Steady off The link is Down.
Yellow Steady on An error occurs in data
transmission.

Yellow Steady off Data is being transmitted.

GE/ GE/ Green Steady on The link is Up.
10GE 10GE
interfac Green Off The link is Down.
e status Yellow Blinking Data is being transmitted or
indicato received.
r
Yellow Off No data is being transmitted.

USB USB Reserved Reserved Reserved.
OFL offline
indicato
r

10GE 10GE Green Steady on The link is Up.
port
status Green Blinking Data is being transmitted
indicato and received.
r

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Table 3-100 Descriptions of SFU indicators

Indicat Name Color Status Description
or

RUN Runnin Green Blinking once The system is running
g every 2s (0.5 properly.
indicat Hz)
or
Green Blinks quickly The board has not
(2 Hz) or Off > completed registration.
blinks quickly
(4 Hz) > off >
steady on >
blinks slowly
(0.5 Hz, that is,
once every 2s)

Green Others The board is abnormal or
faulty.

OFC Inserti Green Blinking The optical module is
on working normally.
status
indicat Green Steady on or The optical module is faulty
or of off or not installed.
the
CXP3
optical
modul
e

ACT ACT Green On The board is working
indicat properly.
or
Green Off The board is faulty.

OFL Board Red Steady on The board can be securely
inserti removed.
on/
remov - Off Working properly. After you
al press and hold the OFL
indicat button till the board
or becomes offline, the
indicator turns red.

CXP Inserti Green Blinking The optical module is
on working normally.
status
indicat Green Steady on or The optical module is faulty.
or of off
the
CXP
optical
modul
e

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Hardware Guide 3 Hardware Description

Table 3-101 Descriptions of LPU indicators
Indicat Name Color Status Description
or

OFL Offline Red On The board can be removed.
indicat
or

L/A Interfa Green On The link is Up.
ce
status Green Blinking Data is being transmitted or
indicat received.
or - Off The link is Down.

RUN Runnin Green Blinks once The system is running
g every 2s (0.5 properly.
indicat Hz)
or
- Blinking twice The board is starting and has
every second (2 not completed registration.
Hz)

Breako Breako Green Reserved Reserved
ut ut
optical
modul
e
chann
el
indicat
or

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Hardware Guide 3 Hardware Description

Indicat Name Color Status Description
or

00/10/ Port Green - The 00/10/20/30 indicator is
20/30 status steady on in turn.
0~9 indicat If the 00 indicator is steady
or on,the 0~9 indicator is
steady on, the link 0~9 is Up.
If the 0~9 indicator blinks,
data is being transmitted or
received. If the 0~9 indicator
is off, the link is Down.
If the 10 indicator is steady
on,the 0~9 indicator is
steady on, the link 10~19 is
Up. If the 0~9 indicator
blinks, data is being
transmitted or received. If
the 0~9 indicator is off, the
link is Down.
If the 20 indicator is steady
on,the 0~9 indicator is
steady on, the link 20~29 is
Up. If the 0~9 indicator
blinks, data is being
transmitted or received. If
the 0~9 indicator is off, the
link is Down.
If the 30 indicator is steady
on,the 0~5 indicator is
steady on, the link 30~35 is
Up. If the 0~5 indicator
blinks, data is being
transmitted or received. If
the 0~5 indicator is off, the
link is Down.

3.1.5.2 MPU

3.1.5.2.1 CR5D0MPUB560 (NE5000E Main Processing Unit B5)

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Hardware Guide 3 Hardware Description

Overview

Table 3-102 Basic information about the CR5D0MPUB560
Item Details

Description NE5000E Main Processing Unit B5

Part Number 03054991

Model CR5D0MPUB560

Card type MPU

Silkscreen MPUB

Remarks -

Appearance

Figure 3-93 Appearance of the CR5D0MPUB560

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03054991&productModel=CR5D0MPUB560#matchRelation

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Hardware Guide 3 Hardware Description

Indicators and Buttons

Table 3-103 Indicators on the CR5D0MPUB560
Silkscreen Name Color Status Description

OFL Board Red Steady on The board can
insertion/ be securely
removal removed.
indicator

RUN Running Green Blinking(0.5H The system is
status Z) running
indicator properly.

Green Before the -
board is
powered on
and registers,
this indicator
status
changes in
the following
sequence: off
-> blinks
quickly (4 Hz)
-> off >
steady on ->
blinks slowly
(0.5 Hz).

ALM Alarm Red Steady on Alarm.
indicator
- Off Normal
status.

ACT Control status Green Steady on Active main
indicator control board.

- Off Standby main
control board.

L/A Interface Green Steady on The link is up.
status
indicator Green Blinking Data is being
transmitted or
received.

ETH LINK Link status Green Steady on The link is up.
indicator(on
the Ethernet - Off The link is
interface) down.

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Silkscreen Name Color Status Description

ETH ACT ACT status Yellow Blinking Data is being
indicator(on transmitted or
the Ethernet received.
interface)
- Off No data is
being
transmitted or
received.

Table 3-104 Buttons on the CR5D0MPUB560
Silkscreen Name Description

OFL Board removal button Before removing a board,
press and hold the OFL
button for about 6
seconds until the OFL
indicator comes on.
Then, you can remove
the board.
NOTE
This button takes effect
only on the slave MPU.

RST Board reset button To reset the board, press
the RST button.

Ports

Table 3-105 Ports on the CR5D0MPUB560
Port Connector Type Description Available
Components

FSP0, FSP1 RJ45 Interface for fast 8-core shielded
inter-chassis cable (crossover
switchover. cable)
NOTE
Crossover cables
must be used.

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Hardware Guide 3 Hardware Description

Port Connector Type Description Available
Components

GE/10GE SFP/SFP+ Inter-chassis Uses optical fibers
cascading or category 5
interface. It shielded twisted
supports GE/10G pairs.
Optical Modules
and 1000M/100M
Electrical
Modules.

ETH RJ45 Connects to the Uses category 5
NMS workstation shielded twisted
and supports half- pairs.
duplex and full-
duplex modes.

Console RJ45 Connects to the Uses 8-core
control platform shielded cables.
and implements
on-site system
configuration. The
baud rate can be
set, and the
default value is
9600 bit/s.

AUX RJ45 Reserved. Uses 8-core
shielded cables.

CLK/TOD0, CLK/ RJ45 Used to input or Uses 120-ohm
TOD1 output 2 Mbit/s clock cables.
clock signals, 2
MHz clock signals,
1pps+ASCII time
signals, or two-
channel DCLS
time signals.

CLK/1PPS SMB Used to input or Uses 75-ohm
output 2 Mbit/s clock cables.
clock signals, 2
MHz clock signals,
or 1 PPS signals.

CLK/Serial SMB Used to input or Uses 75-ohm
output 2-Mbit/s clock cables.
clock signals, 2-
MHz clock signals,
or RS232 signals.

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Functions and Features

Table 3-106 Functions and features of the CR5D0MPUB560
Functions and Features Description

Basic function It is responsible for system control and
management, including route
calculation, device management and
maintenance, and device monitoring.
In addition, it functions as the system
synchronization unit to provide high-
precision and high-reliability
synchronization clock and time signals.

Reliability and availability The board supports 1:1 backup.
Hot swappable.

Restrictions and remarks Cannot be installed in the same
chassis with other main control boards.

Technical Specifications

Table 3-107 Technical specifications of the CR5D0MPUB560
Item Specification

Dimensions without packaging (H x W 40 mm x 398 mm x 554 mm (1.57 in. x
x D) [mm(in.)] 15.67 in. x 21.81 in.)

Weight without packaging [kg(lb)] 6.4 kg (14.11 lb)

Typical power consumption [W] 130 W

Typical heat dissipation [BTU/hour] 421.77 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

CPU Quad-core 2.0GHZ

SDRAM 8 GB

Storage SSD card: 8 GB

3.1.5.2.2 CR5D0MPUB661 (NetEngine5000E,CR56MPUB62,Main Processing Unit B6)

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Hardware Guide 3 Hardware Description

Overview

Table 3-108 Basic information about the CR5D0MPUB661
Item Details

Description NetEngine5000E,CR56MPUB62,Main
Processing Unit B6

Part Number 03058734

Model CR5D0MPUB661

Card type MPU

Silkscreen MPUB6

Remarks -

Appearance

Figure 3-94 Appearance of the CR5D0MPUB661

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03058734&productModel=CR5D0MPUB661#matchRelation

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Hardware Guide 3 Hardware Description

Indicators and Buttons

Table 3-109 Indicators on the CR5D0MPUB661
Silkscreen Name Color Status Description

OFL Offline Red On The board can
indicator be removed.

RUN Running Green Blinking(0.5H The system is
status Z) running
indicator properly.

Green Before the -
board is
powered on
and registers,
this indicator
status
changes in
the following
sequence: off
-> blinks
quickly (4 Hz)
-> off >
steady on ->
blinks slowly
(0.5 Hz).

ALM Alarm Red On Alarms have
indicator been
generated.

- Off No alarms
have been
generated.

ACT Master/slave Green On The master
status chassis is
indicator working.

- Off The slave
chassis is
working.

L/A Interface Green On The link is Up.
status
indicator Green Blinking Data is being
transmitted
and received.

ETH LINK Link status Green On The link is Up.
indicator(on
the Ethernet - Off The link is
interface) Down.

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Silkscreen Name Color Status Description

ETH ACT ACT status Yellow Blinking Data is being
indicator(on indicator(on transmitted
the Ethernet the Ethernet and received.
interface) interface)
- Off No data is
being
transmitted or
received.

USB OFL USB offline Green - led for USB
indicator offline.

Table 3-110 Buttons on the CR5D0MPUB661
Silkscreen Name Description

OFL Board removal button Before removing a board,
press and hold the OFL
button for about 6
seconds until the OFL
indicator comes on.
Then, you can remove
the board.
NOTE
This button takes effect
only on the slave MPU.

RST Board reset button To reset the board, press
the RST button.

USB OFL USB OFL button Reserved.

Ports

Table 3-111 Ports on the CR5D0MPUB661
Port Connector Type Description Available
Components

FSP0, FSP1 RJ45 Interface for fast 8-core shielded
inter-chassis cable (crossover
switchover. cable)
NOTE
Crossover cables
must be used.

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Hardware Guide 3 Hardware Description

Port Connector Type Description Available
Components

GE/10GE SFP+/SFP Inter-chassis Uses optical fibers
cascading or category 5
interface. It shielded twisted
supports GE/10G pairs.
Optical Modules
and 1000M/100M
Electrical
Modules.

MGMT-ETH RJ45 Connects to the Uses category 5
NMS workstation. shielded twisted
pairs.

CON RJ45 Connects to the Uses 8-core
control platform shielded cables.
and implements
on-site system
configuration.

AUX RJ45 Reserved. Uses 8-core
shielded cables.

CLK RJ45 Used to input or Uses 120-ohm
output 2 Mbps clock cables.
clock signals or 2
MHz clock signals.

TOD RJ45 Used to input or Uses 120-ohm
output 1pps clock cables.
+ASCII time
signals, or DCLS
time signals.

CLK-INT RJ45 Used to input or Uses 120-ohm
output 2 Mbit/s clock cables.
clock signals, 2
MHz clock signals,
1pps+ASCII time
signals, or two-
channel DCLS
time signals.

SMB SMB Clock test port. Uses 75-ohm
clock cables.

USB USB Type A Reserved. -

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Functions and Features

Table 3-112 Functions and features of the CR5D0MPUB661
Functions and Features Description

Basic function It is responsible for system control and
management, including route
calculation, device management and
maintenance, and device monitoring.
In addition, it functions as the system
synchronization unit to provide high-
precision and high-reliability
synchronization clock and time signals.

Reliability and availability The MPUB6 boards work in 1:1 backup
mode. They monitor each other. If the
master MPUB6 fails, the slave MPUB6
automatically becomes the master.
Hot swappable.

Restrictions and remarks Cannot be installed in the same
chassis with other main control boards.

Technical Specifications

Table 3-113 Technical specifications of the CR5D0MPUB661
Item Specification

Dimensions without packaging (H x W 41 mm x 398 mm x 554 mm (1.61 in. x
x D) [mm(in.)] 15.67 in. x 21.81 in.)

Weight without packaging [kg(lb)] 7.5 kg (16.53 lb)

Typical power consumption [W] 170 W

Typical heat dissipation [BTU/hour] 551.55 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

CPU Octa-core 2.3GHZ

SDRAM 32 GB

Storage SSD card: 8 GB

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Hardware Guide 3 Hardware Description

3.1.5.2.3 CR5D0MPUN160 (NE5000E-20 Main Processing Unit N1(MPUN1))

Overview

Table 3-114 Basic information about the CR5D0MPUN160

Item Details

Description NE5000E-20 Main Processing Unit
N1(MPUN1)

Part Number 03058204

Model CR5D0MPUN160

Card type MPU

Silkscreen MPUN1

Remarks -

Appearance

Figure 3-95 Appearance of the CR5D0MPUN160

Version Mapping

The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.

The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.

enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03058204&productModel=CR5D0MPUN160#matchRelation

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Hardware Guide 3 Hardware Description

Buttons

Table 3-115 Buttons on the CR5D0MPUN160
Silkscreen Name Description

OFL Offline button Before removing a board,
press and hold the OFL
button until the OFL
indicator turns on (about
six seconds). The board
can then be safely
removed.
NOTE
This button is effective
only for the slave MPU.

RST Board reset button When this button is
pressed, the board is
reset.

USB OFL USB offline button Reserved

Ports

Table 3-116 Ports on the CR5D0MPUN160
Port Connector Type Description Available
Components

GE/10GE SFP/SFP+ Inter-chassis Optical fiber/
cascading super category 5
interface. It shielded twisted
supports GE/10GE pair
optical modules
and 1000M/100M
electrical
modules.

USB USB Type A USB port -
(reserved)

SMB SMB Clock test port. 75-ohm clock
cable

FSP RJ45 Interface for fast 8-core shielded
inter-chassis cable (crossover
switchover. cable)
NOTE
Crossover cables
must be used.

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Hardware Guide 3 Hardware Description

Port Connector Type Description Available
Components

Console RJ45 Baud rate: 9600 8-core shielded
bit/s (default cable
value), which is
configurable Data
device type: Data
circuit-
terminating
equipment (DCE)
It connects to the
console for onsite
system
configuration.

AUX RJ45 Reserved. Baud 8-core shielded
rate: 9600 bit/s cable
(default value),
which is
configurable Data
device type: Data
terminal
equipment (DTE)
It connects to the
modem for
remote
maintenance by
means of dial-up.

CLK-INT RJ45 Used to input or 120-ohm shielded
output 2 Mbps clock cable
clock signals/2
MHz clock
signals/1pps
+ASCII time
signals/2 channels
of DCLS time
signals.

CLK RJ45 External 120-ohm clock
synchronization cable
interface, used to
input or output 2
Mbit/s or 2 MHz
clock signals.

TOD RJ45 External 120-ohm clock
synchronization cable
interface, used to
input or output
1pps+ASCII or
DCLS time signals

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Hardware Guide 3 Hardware Description

Port Connector Type Description Available
Components

MGMT-ETH RJ45 Connects to the Super category 5
NMS workstation. shielded twisted
pair

Functions and Features

Table 3-117 Functions and features of the CR5D0MPUN160

Functions and Features Description

Basic function This board is responsible for system
control and management operations,
including route calculation, device
management and maintenance, and
device monitoring. As a system
synchronization unit, this board
provides high-precise and reliable
clock and time signals.

Reliability and availability The MPUN1s work in 1:1 backup
mode. The MPUN1s monitor each
other. If the active MPUN1 is faulty,
the standby MPUN1 automatically
becomes the active one.
Hot swappable.

Restrictions and remarks Cannot be installed in the same
chassis with other main control boards.

Technical Specifications

Table 3-118 Technical specifications of the CR5D0MPUN160

Item Specification

Dimensions without packaging (H x W 42.7 mm x 467.2 mm x 533.4 mm
x D) [mm(in.)] (1.68 in. x 18.39 in. x 21.00 in.)

Dimensions with packaging (H x W x 195 mm x 750 mm x 735 mm (7.68 in.
D) [mm(in.)] x 29.53 in. x 28.94 in.)

Weight without packaging [kg(lb)] 7.4 kg (16.31 lb)

Weight with packaging [kg(lb)] 12.6 kg (27.78 lb)

Typical power consumption [W] 175 W

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Hardware Guide 3 Hardware Description

Item Specification

Typical heat dissipation [BTU/hour] 567.77 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

CPU 10-core 2.4GHz

SDRAM 16 GB x 2

Storage SSD card: 32 GB

3.1.5.2.4 CR5D0MPUQ1D1 (NE5000E-20 Main Processing Unit Q1(MPUQ1))

Overview

Table 3-119 Basic information about the CR5D0MPUQ1D1
Item Details

Description NE5000E-20 Main Processing Unit
Q1(MPUQ1)

Part Number 03059134

Model CR5D0MPUQ1D1

Card type MPU

Silkscreen MPUQ1

Remarks -

Appearance

Figure 3-96 Appearance of the CR5D0MPUQ1D1

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03059134&productModel=CR5D0MPUQ1D1#matchRelation

Buttons

Table 3-120 Buttons on the CR5D0MPUQ1D1
Silkscreen Name Description

OFL Offline button Before removing a board,
press and hold the OFL
button until the OFL
indicator turns on (about
six seconds). The board
can then be safely
removed.
NOTE
This button is effective
only for the slave MPU.

RST Board reset button When this button is
pressed, the board is
reset.

USB OFL USB offline button Reserved

Ports

Table 3-121 Ports on the CR5D0MPUQ1D1
Port Connector Type Description Available
Components

USB USB Type A USB interface, -
reserved

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Port Connector Type Description Available
Components

GE/10GE SFP/SFP+ Inter-chassis Optical fiber/
cascading super category 5
interface. It shielded twisted
supports GE/10GE pair
optical modules
and 1000M/100M
electrical
modules.

MGMT-ETH RJ45 Connects to the Super category 5
NMS workstation. shielded twisted
pair

CLK/TEST SMA Clock test port. 50-ohm clock
cable

FSP RJ45 Interface for fast 8-core shielded
inter-chassis cable (crossover
switchover. cable)
NOTE
Crossover cables
must be used.

Console RJ45 Baud rate: 9600 8-core shielded
bit/s. Data device cable
type: data circuit-
terminating
equipment (DCE).
It connects to the
console for onsite
system
configuration.

AUX RJ45 Reserved. Baud 8-core shielded
rate: 9600 bit/s cable
(default value),
which is
configurable. Data
device type: data
terminal
equipment (DTE).

CLK-INT RJ45 Used to input or 120-ohm shielded
output 2 Mbps clock cable
clock signals/2
MHz clock
signals/1pps
+ASCII time
signals/2 channels
of DCLS time
signals.

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Hardware Guide 3 Hardware Description

Port Connector Type Description Available
Components

CLK RJ45 Used to input or 120-ohm clock
output 2 Mbps cable
clock signals or 2
MHz clock signals.

TOD RJ45 Inputs or outputs 120-ohm clock
1pps+ASCII time cable
signals or DCLS
time signals.

Functions and Features

Table 3-122 Functions and features of the CR5D0MPUQ1D1

Functions and Features Description

Basic function This board is responsible for system
control and management operations,
including route calculation, device
management and maintenance, and
device monitoring. As a system
synchronization unit, this board
provides high-precise and reliable
clock and time signals.

Reliability and availability The MPUQ1s work in 1:1 backup
mode. The MPUQ1s monitor each
other. If the active MPUQ1 is faulty,
the standby MPUQ1 automatically
becomes the active one.
Hot swappable.

Restrictions and remarks Cannot be installed in the same
chassis with other main control boards.

Technical Specifications

Table 3-123 Technical specifications of the CR5D0MPUQ1D1

Item Specification

Dimensions without packaging (H x W 42.7 mm x 467.2 mm x 533.4 mm
x D) [mm(in.)] (1.68 in. x 18.39 in. x 21.00 in.)

Dimensions with packaging (H x W x 195 mm x 750 mm x 735 mm (7.68 in.
D) [mm(in.)] x 29.53 in. x 28.94 in.)

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Hardware Guide 3 Hardware Description

Item Specification

Weight without packaging [kg(lb)] 7.5 kg (16.53 lb)

Weight with packaging [kg(lb)] 12.7 kg (28.00 lb)

Typical power consumption [W] 160 W

Typical heat dissipation [BTU/hour] 519.11 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

CPU 24-core 2.5GHz

SDRAM 32 GB

Storage SSD card: 32 GB

3.1.5.3 SFU

3.1.5.3.1 CR5D0SFUT060 (1T Switch Fabric Unit A(SFUI-1T))

Overview

Table 3-124 Basic information about the CR5D0SFUT060
Item Details

Description 1T Switch Fabric Unit A(SFUI-1T)

Part Number 03030TBT

Model CR5D0SFUT060

Card type SFU

Silkscreen SFUI-1T

Remarks -

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Appearance

Figure 3-97 Appearance of the CR5D0SFUT060

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03030TBT&productModel=CR5D0SFUT060#matchRelation

Indicators and Buttons

Table 3-125 Indicators on the CR5D0SFUT060
Silkscreen Name Color Status Description

OFL Offline Red On The board can
indicator be removed.

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Hardware Guide 3 Hardware Description

Silkscreen Name Color Status Description

RUN Running Green Blinking(0.5H The system is
status Z) working
indicator properly.
NOTE
If the
indicator is
off, the
possible
causes are as
follows:
The BootROM
is damaged.
A power-on
failure occurs.
If the
indicator
blinks quickly,
the possible
causes are as
follows:
The flash
memory is
faulty.
The network
interface is
faulty.

Green Before the -
board is
powered on
and registers,
this indicator
status
changes in
the following
sequence: off
-> blinks
quickly (4 Hz)
-> off >
steady on ->
blinks slowly
(0.5 Hz).

ACT ACT indicator Green On The board is
working
properly.

- Off The board is
faulty.

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Hardware Guide 3 Hardware Description

Table 3-126 Buttons on the CR5D0SFUT060

Silkscreen Name Description

OFL Board removal button To remove the board,
hold down the OFL
button for about six
seconds until the OFL
indicator turns on. Then,
you can remove the
board.

Functions and Features

Table 3-127 Functions and features of the CR5D0SFUT060

Functions and Features Description

Reliability and availability The entire SFU works in 3+1 backup
mode. The four SFUs balance services
at the same time. If one SFU is faulty
or replaced, the other three SFUs
automatically take over its services to
ensure uninterrupted services and
improve system reliability.
Supports hot swapping.

Restrictions and remarks When four SFUI-1Ts are installed, they
can support line-rate data switching
for 16 LPUI-1Ts, LPUF-400s, or
LPUI-480s in the entire system.

Technical Specifications

Table 3-128 Technical specifications of the CR5D0SFUT060

Item Specification

Dimensions without packaging (H x W 40 mm x 411 mm x 557 mm (1.57 in. x
x D) [mm(in.)] 16.18 in. x 21.93 in.)

Weight without packaging [kg(lb)] 8 kg (17.64 lb)

Typical power consumption [W] 271 W

Typical heat dissipation [BTU/hour] 879.24 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

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Hardware Guide 3 Hardware Description

Item Specification

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

3.1.5.3.2 CR5DSFUIK06A (400G Switch Fabric Unit A for Single Chassis(SFUI-400-
A))

Overview

Table 3-129 Basic information about the CR5DSFUIK06A

Item Details

Description 400G Switch Fabric Unit A for Single
Chassis(SFUI-400-A)

Part Number 03030RED

Model CR5DSFUIK06A

Card type SFU

Silkscreen SFUI400

Remarks -

Appearance

Figure 3-98 Appearance of the CR5DSFUIK06A

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Hardware Guide 3 Hardware Description

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03030RED&productModel=CR5DSFUIK06A#matchRelation

Indicators and Buttons

Table 3-130 Indicators on the CR5DSFUIK06A
Silkscreen Name Color Status Description

OFL Offline Red On The board can
indicator be removed.

RUN Running Green Blinking(0.5H The system is
status Z) working
indicator properly.
NOTE
If the
indicator is
off, the
possible
causes are as
follows:
The BootROM
is damaged.
A power-on
failure occurs.
If the
indicator
blinks quickly,
the possible
causes are as
follows:
The flash
memory is
faulty.
The network
interface is
faulty.

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Hardware Guide 3 Hardware Description

Silkscreen Name Color Status Description

Green Before the -
board is
powered on
and registers,
this indicator
status
changes in
the following
sequence: off
-> blinks
quickly (4 Hz)
-> off >
steady on ->
blinks slowly
(0.5 Hz).

ACT ACT indicator Green On The board is
working
properly.

- Off The board is
faulty.

Table 3-131 Buttons on the CR5DSFUIK06A
Silkscreen Name Description

OFL Board removal button To remove the board,
hold down the OFL
button for about six
seconds until the OFL
indicator turns on. Then,
you can remove the
board.

Functions and Features

Table 3-132 Functions and features of the CR5DSFUIK06A
Functions and Features Description

Basic function The SFUI400A on a single chassis can
exchange data with the LPUF-100,
LPUF-400, or LPUI-480.

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Functions and Features Description

Reliability and availability The entire SFU works in 3+1 backup
mode. The four SFUs balance services
at the same time. If one SFU is faulty
or replaced, the other three SFUs
automatically take over its services to
ensure uninterrupted services and
improve system reliability.
Supports hot swapping.

Restrictions and remarks The SFUI400A supports service
switching of single chassis. It cannot
be used together with the SFUF100C.
When four SFUI400As are installed,
they can support line-rate data
switching of sixteen LPUF-400/
LPUI-480 boards of the entire system.

Technical Specifications

Table 3-133 Technical specifications of the CR5DSFUIK06A
Item Specification

Dimensions without packaging (H x W 40 mm x 411 mm x 557 mm (1.57 in. x
x D) [mm(in.)] 16.18 in. x 21.93 in.)

Weight without packaging [kg(lb)] 5 kg (11.02 lb)

Typical power consumption [W] 130 W

Typical heat dissipation [BTU/hour] 421.77 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

Switching capacity 400 Gbit/s

3.1.5.3.3 CR5DSFUIK06B (400G Cluster Access Switch Fabric Unit(SFUI-400-B))

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Hardware Guide 3 Hardware Description

Overview

Table 3-134 Basic information about the CR5DSFUIK06B

Item Details

Description 400G Cluster Access Switch Fabric
Unit(SFUI-400-B)

Part Number 03030TDS

Model CR5DSFUIK06B

Card type SFU

Silkscreen SFUI-400-B

Remarks -

Appearance

Figure 3-99 Appearance of the CR5DSFUIK06B

Version Mapping

The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.

The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.

enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03030TDS&productModel=CR5DSFUIK06B#matchRelation

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Indicators and Buttons

Table 3-135 Indicators on the CR5DSFUIK06B
Silkscreen Name Color Status Description

OFL Offline Red On The board can
indicator be removed.

RUN Running Green Blinking(0.5H The system is
status Z) working
indicator properly.
NOTE
If the
indicator is
off, the
possible
causes are as
follows:
The BootROM
is damaged.
A power-on
failure occurs.
If the
indicator
blinks quickly,
the possible
causes are as
follows:
The flash
memory is
faulty.
The network
interface is
faulty.

Green Before the -
board is
powered on
and registers,
this indicator
status
changes in
the following
sequence: off
-> blinks
quickly (4 Hz)
-> off >
steady on ->
blinks slowly
(0.5 Hz).

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Hardware Guide 3 Hardware Description

Silkscreen Name Color Status Description

0 to 11 Insertion Green Blinking The CXP
status optical
indicator of module is
the CXP working
optical normally.
module
- On/Off The CXP
optical
module is
faulty.

Table 3-136 Buttons on the CR5DSFUIK06B
Silkscreen Name Description

OFL Board removal button To remove the board,
hold down the OFL
button for about six
seconds until the OFL
indicator turns on. Then,
you can remove the
board.

Functions and Features

Table 3-137 Functions and features of the CR5DSFUIK06B
Functions and Features Description

Basic function An SFUI400B can exchange data with
an LPUF-100, LPUF-400, or LPUI-480,
and can be connected to a CCC's SFU
to exchange data between chassis.

Reliability and availability The entire SFU works in 3+1 backup
mode. The four SFUs balance services
at the same time. If one SFU is faulty
or replaced, the other three SFUs
automatically take over its services to
ensure uninterrupted services and
improve system reliability.
Supports hot swapping.

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Hardware Guide 3 Hardware Description

Functions and Features Description

Restrictions and remarks The SFUI400B can be used as the SFU
of the cluster and connects the data
channel. Each SFUI400B provides the
400G switching capacity. When four
SFUI400Bs are installed, they can
support line-rate data switching for
sixteen LPUF-400/LPUI-480 boards of
the entire system.

Technical Specifications

Table 3-138 Technical specifications of the CR5DSFUIK06B

Item Specification

Dimensions without packaging (H x W 40 mm x 411 mm x 557 mm (1.57 in. x
x D) [mm(in.)] 16.18 in. x 21.93 in.)

Weight without packaging [kg(lb)] 9 kg (19.84 lb)

Typical power consumption [W] 400 W

Typical heat dissipation [BTU/hour] 1297.77 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

Switching capacity 400 Gbit/s

3.1.5.3.4 CR5DSFUIT06E (1T Switch Fabric Unit E for Single Chassis(SFU-1T-E))

Overview

Table 3-139 Basic information about the CR5DSFUIT06E

Item Details

Description 1T Switch Fabric Unit E for Single
Chassis(SFU-1T-E)

Part Number 03031XST

Model CR5DSFUIT06E

Card type SFU

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Item Details

Silkscreen SFU-1T-E

Remarks -

Appearance

Figure 3-100 Appearance of the CR5DSFUIT06E

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03031XST&productModel=CR5DSFUIT06E#matchRelation

Indicators and Buttons

Table 3-140 Indicators on the CR5DSFUIT06E
Silkscreen Name Color Status Description

OFL Offline Red On The board can
indicator be removed.

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Hardware Guide 3 Hardware Description

Silkscreen Name Color Status Description

RUN Running Green Blinking(0.5H The system is
status Z) working
indicator properly.
NOTE
If the
indicator is
off, the
possible
causes are as
follows:
The BootROM
is damaged.
A power-on
failure occurs.
If the
indicator
blinks quickly,
the possible
causes are as
follows:
The flash
memory is
faulty.
The network
interface is
faulty.

Green Before the -
board is
powered on
and registers,
this indicator
status
changes in
the following
sequence: off
-> blinks
quickly (4 Hz)
-> off >
steady on ->
blinks slowly
(0.5 Hz).

ACT ACT indicator Green On The board is
working
properly.

- Off The board is
faulty.

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Hardware Guide 3 Hardware Description

Table 3-141 Buttons on the CR5DSFUIT06E

Silkscreen Name Description

OFL Board removal button To remove the board,
hold down the OFL
button for about six
seconds until the OFL
indicator turns on. Then,
you can remove the
board.

Functions and Features

Table 3-142 Functions and features of the CR5DSFUIT06E

Functions and Features Description

Basic function The SFU-1T-E on a single chassis can
exchange data with the LPUF-400,
LPUI-480, or LPUI-1T.

Reliability and availability The entire SFU works in 3+1 backup
mode. The four SFUs balance services
at the same time. If one SFU is faulty
or replaced, the other three SFUs
automatically take over its services to
ensure uninterrupted services and
improve system reliability.
Supports hot swapping.

Restrictions and remarks When four SFU-1T-Es are installed,
they support line-rate data switching
for sixteen LPUF-400/LPUI-480/
LPUI-1T boards in the entire system.

Technical Specifications

Table 3-143 Technical specifications of the CR5DSFUIT06E

Item Specification

Dimensions without packaging (H x W 40 mm x 411 mm x 557 mm (1.57 in. x
x D) [mm(in.)] 16.18 in. x 21.93 in.)

Weight without packaging [kg(lb)] 7.2 kg (15.87 lb)

Typical power consumption [W] 202 W

Typical heat dissipation [BTU/hour] 655.37 BTU/hour

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Item Specification

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

Switching capacity 800 Gbit/s

3.1.5.3.5 CR5DSFUIT06H (1T CLC Integrated Switch Fabric Unit for Multi-Chassis
(SFUI-1T-H))

Overview

Table 3-144 Basic information about the CR5DSFUIT06H
Item Details

Description 1T CLC Integrated Switch Fabric Unit
for Multi-Chassis (SFUI-1T-H)

Part Number 03032AAR

Model CR5DSFUIT06H

Card type SFU

Silkscreen SFUI-1T-H

Remarks -

Appearance

Figure 3-101 Appearance of the CR5DSFUIT06H

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Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03032AAR&productModel=CR5DSFUIT06H#matchRelation

Indicators and Buttons

Table 3-145 Indicators on the CR5DSFUIT06H

Silkscreen Name Color Status Description

RUN Running Green Blinking(0.5H The system is
status Z) running
indicator properly.

Green Before the -
board is
powered on
and registers,
this indicator
status
changes in
the following
sequence: off
-> blinks
quickly (4 Hz)
-> off >
steady on ->
blinks slowly
(0.5 Hz).

OFL Offline Red On The board can
indicator be removed.
NOTE
To power off
the board,
press the OFL
button until
the Red
indicator
turns on.

- Off The board is
working
properly

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Hardware Guide 3 Hardware Description

Table 3-146 Buttons on the CR5DSFUIT06H

Silkscreen Name Description

OFL Board removal button To remove the board,
hold down the OFL
button for about six
seconds until the OFL
indicator turns on. Then,
you can remove the
board.

Functions and Features

Table 3-147 Functions and features of the CR5DSFUIT06H

Functions and Features Description

Basic function An SFU-1T-H can exchange data with
an LPUF-400, LPUI-480, or LPUI-1T,
and can be connected to a CCC's SFU
to exchange data between chassis.

Reliability and availability The entire SFU works in 3+1 backup
mode. The four SFUs balance services
at the same time. If one SFU is faulty
or replaced, the other three SFUs
automatically take over its services to
ensure uninterrupted services and
improve system reliability.
Supports hot swapping.

Restrictions and remarks The SFUI-1T-H can be used as the SFU
of the cluster and connects the data
channel. Each SFUI-1T-H provides the
1T switching capacity. When four
SFUI-1T-Hs are installed, they can
support line-rate data switching for
sixteen LPUF-400/LPUI-480/LPUF-1T
boards of the entire system.

Technical Specifications

Table 3-148 Technical specifications of the CR5DSFUIT06H

Item Specification

Dimensions without packaging (H x W 40 mm x 411 mm x 557 mm (1.57 in. x
x D) [mm(in.)] 16.18 in. x 21.93 in.)

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Item Specification

Weight without packaging [kg(lb)] 12.7 kg (28.00 lb)

Typical power consumption [W] 690 W

Typical heat dissipation [BTU/hour] 2238.65 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

Switching capacity 800 Gbit/s

3.1.5.3.6 CR5DSFUIT260 (NE5000E-20 1.6T CLC Switch Fabric Unit D for Single
Chassis(SFU-1T6-D))

Overview

Table 3-149 Basic information about the CR5DSFUIT260

Item Details

Description NE5000E-20 1.6T CLC Switch Fabric
Unit D for Single Chassis(SFU-1T6-D)

Part Number 03032UJM

Model CR5DSFUIT260

Card type SFU

Silkscreen SFU-1T6-D

Remarks -

Appearance

Figure 3-102 Appearance of the CR5DSFUIT260

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Hardware Guide 3 Hardware Description

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03032UJM&productModel=CR5DSFUIT260#matchRelation

Indicators and Buttons

Table 3-150 Indicators on the CR5DSFUIT260
Silkscreen Name Color Status Description

OFL Board Red Steady on A board can
removal be securely
indicator removed.

RUN Running Green Before the The system is
status board is working
indicator powered on properly.
and registers, NOTE
this indicator If the
status indicator is
changes in off, the
the following BootROM
may be
sequence: off damaged, or
-> blinks a power-on
quickly (4 Hz) failure may
-> off > occur.
steady on -> If the
blinks slowly indicator
(0.5 Hz, that blinks quickly,
is, once every the flash
memory or
2s). network
After the interface may
board be faulty.
registration: If
the indicator
blinks once
every 2s (0.5
Hz)

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Hardware Guide 3 Hardware Description

Table 3-151 Buttons on the CR5DSFUIT260

Silkscreen Name Description

OFL Board removal button To remove a board, hold
down the OFL button for
about 6s until the OFL
indicator turns on, and
then remove the board.

Functions and Features

Table 3-152 Functions and features of the CR5DSFUIT260

Functions and Features Description

Basic function This board is responsible for cell
transmission between LPUs and
implements Ethernet communications
with the MPU for centralized system
control and management of the MPU.
In addition, this board supports board
temperature and voltage monitoring.

Reliability and availability The SFUs work in 7+1 backup mode.
The eight SFUs balance services at the
same time. If one SFU is faulty or
replaced, the other seven SFUs
automatically take over its services to
prevent service interruptions and
improve system reliability.
Supports hot swapping.

Technical Specifications

Table 3-153 Technical specifications of the CR5DSFUIT260

Item Specification

Dimensions without packaging (H x W 42.7 mm x 467.2 mm x 533.4 mm
x D) [mm(in.)] (1.68 in. x 18.39 in. x 21.00 in.)

Dimensions with packaging (H x W x 195 mm x 750 mm x 735 mm (7.68 in.
D) [mm(in.)] x 29.53 in. x 28.94 in.)

Weight without packaging [kg(lb)] 8.9 kg (19.62 lb)

Weight with packaging [kg(lb)] 14.1 kg (31.08 lb)

Typical power consumption [W] 312.3 W

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Item Specification

Typical heat dissipation [BTU/hour] 1013.2 BTU/hour

Long-term operating temperature 0 °C~ 40°C (32°F ~ 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

Switching capacity 1.6 Tbit/s

SDRAM 2GB

3.1.5.3.7 CR5DSFUIT26A (2T Switch Fabric Unit A(SFU-2T-A))

Overview

Table 3-154 Basic information about the CR5DSFUIT26A
Item Details

Description 2T Switch Fabric Unit A(SFU-2T-A)

Part Number 03031WLG

Model CR5DSFUIT26A

Card type SFU

Silkscreen SFU-2T-A

Remarks -

Appearance

Figure 3-103 Appearance of the CR5DSFUIT26A

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The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03031WLG&productModel=CR5DSFUIT26A#matchRelation

Indicators and Buttons

Table 3-155 Indicators on the CR5DSFUIT26A
Silkscreen Name Color Status Description

OFL Offline Red On The board can
indicator be removed.

RUN Running Green Blinking(0.5H The system is
status Z) working
indicator properly.
NOTE
If the
indicator is
off, the
possible
causes are as
follows:
The BootROM
is damaged.
A power-on
failure occurs.
If the
indicator
blinks quickly,
the possible
causes are as
follows:
The flash
memory is
faulty.
The network
interface is
faulty.

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Silkscreen Name Color Status Description

Green Before the -
board is
powered on
and registers,
this indicator
status
changes in
the following
sequence: off
-> blinks
quickly (4 Hz)
-> off >
steady on ->
blinks slowly
(0.5 Hz).

ACT ACT indicator Green On The board is
working
properly.

- Off The board is
faulty.

Table 3-156 Buttons on the CR5DSFUIT26A
Silkscreen Name Description

OFL Board removal button To remove the board,
hold down the OFL
button for about six
seconds until the OFL
indicator turns on. Then,
you can remove the
board.

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Hardware Guide 3 Hardware Description

Functions and Features

Table 3-157 Functions and features of the CR5DSFUIT26A
Functions and Features Description

Reliability and availability The entire SFU works in 3+1 backup
mode. The four SFUs balance services
at the same time. If one SFU is faulty
or replaced, the other three SFUs
automatically take over its services to
ensure uninterrupted services and
improve system reliability.
Supports hot swapping.

Restrictions and remarks An SFU-2T-A supports line-rate data
switching for 16 LPUI-2T, LPUI-1T,
LPUF-400, or LPUI-480s in the entire
system.

Technical Specifications

Table 3-158 Technical specifications of the CR5DSFUIT26A
Item Specification

Dimensions without packaging (H x W 40 mm x 411 mm x 557 mm (1.57 in. x
x D) [mm(in.)] 16.18 in. x 21.93 in.)

Weight without packaging [kg(lb)] 9.7 kg (21.38 lb)

Typical power consumption [W] 448 W

Typical heat dissipation [BTU/hour] 1453.5 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

3.1.5.3.8 CR5DSFUIT26H (NE5000E-20 1.6T CLC Integrated Switch Fabric Unit for
Multi-Chassis (SFUI-1T6-H))

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Hardware Guide 3 Hardware Description

Overview

Table 3-159 Basic information about the CR5DSFUIT26H
Item Details

Description NE5000E-20 1.6T CLC Integrated
Switch Fabric Unit for Multi-Chassis
(SFUI-1T6-H)

Part Number 03032UHN

Model CR5DSFUIT26H

Card type SFU

Silkscreen SFUI-1T6-H

Remarks -

Appearance

Figure 3-104 Appearance of the CR5DSFUIT26H

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
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display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
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Indicators and Buttons

Table 3-160 Indicators on the CR5DSFUIT26H
Silkscreen Name Color Status Description

RUN Running Green Before the The system is
status board is working
indicator powered on properly.
and registers, NOTE
this indicator If the
status indicator is
changes in off, the
the following BootROM
may be
sequence: off damaged, or
-> blinks a power-on
quickly (4 Hz) failure may
-> off > occur.
steady on -> If the
blinks slowly indicator
(0.5 Hz, that blinks quickly,
is, once every the flash
memory or
2s). network
After the interface may
board be faulty.
registration: If
the indicator
blinks once
every 2s (0.5
Hz)

OFC0/1(0 to Insertion Green Blinking The optical
8) status module is
indicator of working
the CXP2 normally.
optical
module Green Steady on or The optical
off module is
faulty or not
installed.

OFL Board Red Steady on The board can
removal be removed
indicator securely.

- Steady off You can
remove the
board.

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Hardware Guide 3 Hardware Description

Table 3-161 Buttons on the CR5DSFUIT26H
Silkscreen Name Description

OFL Board removal button To remove the board,
hold down the OFL
button for about six
seconds until the OFL
indicator turns on. Then,
you can remove the
board.

Ports

Table 3-162 Ports on the CR5DSFUIT26H
Port Connector Type Description Available
Components

0/0 to 0/8 CXP2 Used to input and Uses optical
1/0 to 1/8 output 25Gbps fibers.
optical signals.

Functions and Features

Table 3-163 Functions and features of the CR5DSFUIT26H
Functions and Features Description

Basic function This board is responsible for cell
transmission between LPUs and
implements Ethernet communications
with the MPU for centralized system
control and management of the MPU.
In addition, this board supports board
temperature and voltage monitoring.

Reliability and availability The SFUs work in 7+1 backup mode.
The eight SFUs balance services at the
same time. If one SFU is faulty or
replaced, the other seven SFUs
automatically take over its services to
prevent service interruptions and
improve system reliability.
Supports hot swapping.

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Hardware Guide 3 Hardware Description

Functions and Features Description

Restrictions and remarks The SFUI-1T6-H can be used as the
SFU of the cluster and connects the
data channel. Each SFUI-1T6-H
provides the 1.6T switching capacity.
When eight SFUI-1T6-Hs are installed,
they can support line-rate data
switching for twenty LPUF-1T6 boards
of the entire system.

Technical Specifications

Table 3-164 Technical specifications of the CR5DSFUIT26H
Item Specification

Dimensions without packaging (H x W 42.7 mm x 467.2 mm x 533.4 mm
x D) [mm(in.)] (1.68 in. x 18.39 in. x 21.00 in.)

Dimensions with packaging (H x W x 195 mm x 750 mm x 735 mm (7.68 in.
D) [mm(in.)] x 29.53 in. x 28.94 in.)

Weight without packaging [kg(lb)] 11.6 kg (25.57 lb)

Weight with packaging [kg(lb)] 16.8 kg (37.04 lb)

Typical power consumption [W] 635 W

Typical heat dissipation [BTU/hour] 2060.2 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

Switching capacity 1.6 Tbit/s

SDRAM 2GB

3.1.5.4 CMU

3.1.5.4.1 CR9D000CMU61 (Centralized Monitoring Module B)

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Overview

Table 3-165 Basic information about the CR9D000CMU61
Item Details

Description Centralized Monitoring Module B

Part Number 03033DCD

Model CR9D000CMU61

Card type CMU

Silkscreen CMU

Remarks -

Appearance

Figure 3-105 Appearance of the CR9D000CMU61

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03033DCD&productModel=CR9D000CMU61#matchRelation

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Hardware Guide 3 Hardware Description

Ports

Table 3-166 Ports on the CR9D000CMU61

Port Connector Type Description Available
Components

ETH RJ45 Ethernet -
monitoring
interface

RS485 RJ45 RS485 monitoring -
interface

ALM IN RJ45 Is used for -
Boolean
detection.

Functions and Features

Table 3-167 Functions and features of the CR9D000CMU61

Functions and Features Description

Basic function Monitors the temperature and voltage.

Reliability and availability Hot swappable.

Technical Specifications

Table 3-168 Technical specifications of the CR9D000CMU61

Item Specification

Dimensions without packaging (H x W 30.0 mm x 150.9 mm x 500.0 mm
x D) [mm(in.)] (1.18 in. x 5.94 in. x 19.69 in.)

Weight without packaging [kg(lb)] 0.72 kg (1.58 lb)

Typical power consumption [W] 11 W

Typical heat dissipation [BTU/hour] 36 BTU/hour

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

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3.1.5.4.2 CR9D000CMU62 (Centralized Monitoring Module C)

Overview

Table 3-169 Basic information about the CR9D000CMU62
Item Details

Description Centralized Monitoring Module C

Part Number 03033VGE

Model CR9D000CMU62

Card type CMU

Silkscreen CMU

Remarks -

Appearance

Figure 3-106 Appearance of the CR9D000CMU62

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03033VGE&productModel=CR9D000CMU62#matchRelation

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Ports

Table 3-170 Ports on the CR9D000CMU62

Port Connector Type Description Available
Components

ETH RJ45 Ethernet -
monitoring
interface

RS485 RJ45 RS485 monitoring -
interface

ALM IN RJ45 Is used for -
Boolean
detection.

Functions and Features

Table 3-171 Functions and features of the CR9D000CMU62

Functions and Features Description

Basic function Monitors the fan and power supply
status

Reliability and availability Hot swappable.

Breakout supported No

Interface rate auto-sensing supported No

Technical Specifications

Table 3-172 Technical specifications of the CR9D000CMU62

Item Specification

Dimensions without packaging (H x W 30.0 mm x 150.9 mm x 500.0 mm
x D) [mm(in.)] (1.18 in. x 5.94 in. x 19.69 in.)

Weight without packaging [kg(lb)] 0.72 kg (1.58 lb)

Typical power consumption [W] 11 W

Typical heat dissipation [BTU/hour] 36 BTU/hour

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

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Item Specification

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

3.1.5.5 LPUF-400

3.1.5.5.1 CR5DLPUFK061 (400G Flexible Card Line Processing Unit(NE5000E
LPUF-400,2 sub-slots))

Overview

Table 3-173 Basic information about the CR5DLPUFK061

Item Details

Description 400G Flexible Card Line Processing
Unit(NE5000E LPUF-400,2 sub-slots)

Part Number 03054989

Model CR5DLPUFK061

Card type Mother Flexible Board

Silkscreen NE5000ELPUF-400

Remarks -

Appearance

Figure 3-107 Appearance of the CR5DLPUFK061

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Version Mapping

The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.

The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.

enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03054989&productModel=CR5DLPUFK061#matchRelation

Indicators and Buttons

Table 3-174 Indicators on the CR5DLPUFK061

Silkscreen Name Color Status Description

OFL Offline Red On The board can
indicator be removed.

RUN Running Green Blinking(0.5H The system is
status Z) running
indicator properly.

Green Blinking(2HZ) The system is
registering.

Table 3-175 Buttons on the CR5DLPUFK061

Silkscreen Name Description

OFL Board removal button To remove the board,
hold down the OFL
button for about six
seconds until the OFL
indicator turns on. Then,
you can remove the
board.

Functions and Features

Table 3-176 Functions and features of the CR5DLPUFK061

Functions and Features Description

Basic function Supports 400G line-rate processing.

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Hardware Guide 3 Hardware Description

Functions and Features Description

Reliability and availability Hot swappable

Breakout supported No

Interface rate auto-sensing supported No

Technical Specifications

Table 3-177 Technical specifications of the CR5DLPUFK061

Item Specification

Dimensions without packaging (H x W 41 mm x 400 mm x 520 mm (1.61 in. x
x D) [mm(in.)] 15.75 in. x 20.47 in.)

Weight without packaging [kg(lb)] 8.4 kg (18.52 lb)

Typical power consumption [W] 359 W

Typical heat dissipation [BTU/hour] 1164.75 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

3.1.5.6 LPUI-400

3.1.5.6.1 CR5D00LKXF6P (40-Port 10GBase LAN/WAN-SFP+ Integrated Line Process
Unit (NE5000E LPUI-400-CM))

Overview

Table 3-178 Basic information about the CR5D00LKXF6P

Item Details

Description 40-Port 10GBase LAN/WAN-SFP+
Integrated Line Process Unit (NE5000E
LPUI-400-CM)

Part Number 03057697

Model CR5D00LKXF6P

Card type Fixed Board

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Item Details

Silkscreen LPUI-400-CM

Appearance

Figure 3-108 Appearance of the CR5D00LKXF6P

Version Mapping

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where you can easily obtain hardware mapping information.

The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
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display.

enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03057697&productModel=CR5D00LKXF6P#matchRelation

Indicators and Buttons

Table 3-179 Indicators on the CR5D00LKXF6P

Silkscreen Name Color Status Description

OFL Offline Red On The board can
indicator be removed.

RUN Running Green Blinking(0.5H The system is
status Z) running
indicator properly.

Green Blinking(2HZ) The system is
registering.

0 to 19 Interface Green On The link is Up.
status
indicator - Off The link is
Down.

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Silkscreen Name Color Status Description

Green Blinking Data is being
transmitted
and received.

Table 3-180 Buttons on the CR5D00LKXF6P
Silkscreen Name Description

OFL Board removal button Before removing a board,
press and hold the OFL
button for about 6
seconds until the OFL
indicator turns on. Then,
you can remove the
board.

Ports

Table 3-181 Ports on the CR5D00LKXF6P
Port Connector Type Description Available
Components

0 to 19 SFP+ Interface for 1.25Gbps eSFP
0 to 19 inputting and Optical Module
outputting 10GE 10Gbps SFP+
optical signals Optical Module

Table 3-182 Port attributes about the CR5D00LKXF6P
Attributes Details

Working mode Full-duplex

Standards compliance IEEE 802.3

Frame format Ethernet_II, Ethernet_SAP and
Ethernet_SNAP

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Functions and Features

Table 3-183 Functions and features of the CR5D00LKXF6P
Functions and Features Description

Basic function Provides forty 10GE interfaces for line-
rate forwarding.

Reliability and availability Hot swappable

Breakout supported No

Interface rate auto-sensing supported Supports GE/10GE auto-sensing.

FlexE supported No

Technical Specifications

Table 3-184 Technical specifications of the CR5D00LKXF6P
Item Specification

Dimensions without packaging (H x W 41 mm x 400 mm x 520 mm (1.61 in. x
x D) [mm(in.)] 15.75 in. x 20.47 in.)

Weight without packaging [kg(lb)] 10 kg (22.05 lb)

Typical power consumption [W] 497 W

Typical heat dissipation [BTU/hour] 1612.48 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

3.1.5.7 LPUI-480

3.1.5.7.1 CR5D00LMXF61 (48-Port 10GBase LAN/WAN-SFP+ Integrated Line Process
Unit(NE5000E LPUI-480))

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Overview

Table 3-185 Basic information about the CR5D00LMXF61
Item Details

Description 48-Port 10GBase LAN/WAN-SFP+
Integrated Line Process Unit(NE5000E
LPUI-480)

Part Number 03054990

Model CR5D00LMXF61

Card type Fixed Board

Silkscreen NE5000E LPUI-480
48x10GBase LAN/WAN-SFP+

Appearance

Figure 3-109 Appearance of the CR5D00LMXF61

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03054990&productModel=CR5D00LMXF61#matchRelation

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Indicators and Buttons

Table 3-186 Indicators on the CR5D00LMXF61

Silkscreen Name Color Status Description

OFL Offline Red On The board can
indicator be removed.

RUN Running Green Blinking(0.5H The system is
status Z) running
indicator properly.

Green Blinking(2HZ) The system is
registering.

0/0 to 0/23 Interface Green On The link is Up.
1/0 to 1/23 status
indicator - Off The link is
Down.

Green Blinking Data is being
transmitted
and received.

Table 3-187 Buttons on the CR5D00LMXF61

Silkscreen Name Description

OFL Board removal button To remove the board,
hold down the OFL
button for about six
seconds until the OFL
indicator turns on. Then,
you can remove the
board.

Ports

Table 3-188 Ports on the CR5D00LMXF61

Port Connector Type Description Available
Components

0/0 to 0/23 SFP+ Interface for 1.25Gbps eSFP
1/0 to 1/23 inputting and Optical Module
outputting 10GE 10Gbps SFP+
optical signals Optical Module

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Table 3-189 Port attributes about the CR5D00LMXF61

Attributes Details

Working mode Full-duplex

Standards compliance IEEE 802.3

Frame format Ethernet_II, Ethernet_SAP and
Ethernet_SNAP

Functions and Features

Table 3-190 Functions and features of the CR5D00LMXF61

Functions and Features Description

Basic function Provides forty-eight 10GE interfaces.

Reliability and availability Hot swappable

Breakout supported No

Interface rate auto-sensing supported No

FlexE supported No

Technical Specifications

Table 3-191 Technical specifications of the CR5D00LMXF61

Item Specification

Dimensions without packaging (H x W 41 mm x 400 mm x 520 mm (1.61 in. x
x D) [mm(in.)] 15.75 in. x 20.47 in.)

Weight without packaging [kg(lb)] 10 kg (22.05 lb)

Typical power consumption [W] 524 W

Typical heat dissipation [BTU/hour] 1700.08 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

3.1.5.8 LPUF-1T

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3.1.5.8.1 CR5DLPUFT060 (1T Flexible Card Line Processing Unit(NE5000E LPUF-1T-
A,2 sub-slots))

Overview

Table 3-192 Basic information about the CR5DLPUFT060

Item Details

Description 1T Flexible Card Line Processing
Unit(NE5000E LPUF-1T-A,2 sub-slots)

Part Number 03057574

Model CR5DLPUFT060

Card type Mother Flexible Board

Silkscreen NE5000ELPUF-1T

Remarks -

Appearance

Figure 3-110 Appearance of the CR5DLPUFT060

Version Mapping

The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.

The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.

enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03057574&productModel=CR5DLPUFT060#matchRelation

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Indicators and Buttons

Table 3-193 Indicators on the CR5DLPUFT060
Silkscreen Name Color Status Description

OFL Offline Red On The board can
indicator be removed.

RUN Running Green Blinking(0.5H The system is
status Z) running
indicator properly.

Green Blinking(2HZ) The system is
registering.

Table 3-194 Buttons on the CR5DLPUFT060
Silkscreen Name Description

OFL Board removal button To remove the board,
hold down the OFL
button for about six
seconds until the OFL
indicator turns on. Then,
you can remove the
board.

Functions and Features

Table 3-195 Functions and features of the CR5DLPUFT060
Functions and Features Description

Basic function Supports 1T line-rate processing.

Reliability and availability Hot swappable

Breakout supported No

Interface rate auto-sensing supported No

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Hardware Guide 3 Hardware Description

Technical Specifications

Table 3-196 Technical specifications of the CR5DLPUFT060
Item Specification

Dimensions without packaging (H x W 41 mm x 400 mm x 520 mm (1.61 in. x
x D) [mm(in.)] 15.75 in. x 20.47 in.)

Weight without packaging [kg(lb)] 9.1 kg (20.06 lb)

Typical power consumption [W] 527 W

Typical heat dissipation [BTU/hour] 1709.81 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

3.1.5.9 LPUI-1T

3.1.5.9.1 CR5D00E8NC60 (8-Port 100GBase LAN/WAN-CFP2 Integrated Line Process
Unit(NE5000E LPU-1T))

Overview

Table 3-197 Basic information about the CR5D00E8NC60
Item Details

Description 8-Port 100GBase LAN/WAN-CFP2
Integrated Line Process Unit(NE5000E
LPU-1T)

Part Number 03030SPS

Model CR5D00E8NC60

Card type Fixed Board

Silkscreen NE5000ELPUI-1T
8x100GBase-CFP2

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Appearance

Figure 3-111 Appearance of the CR5D00E8NC60

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03030SPS&productModel=CR5D00E8NC60#matchRelation

Indicators and Buttons

Table 3-198 Indicators on the CR5D00E8NC60
Silkscreen Name Color Status Description

OFL Offline Red On The board can
indicator be removed.

RUN Running Green Blinking(0.5H The system is
status Z) running
indicator properly.

Green Blinking(2HZ) The system is
registering.

0 to 7(100GE) Interface Green On The link is Up.
status
indicator Green Blinking Data is being
transmitted
and received.

- Off The link is
Down.

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Hardware Guide 3 Hardware Description

Table 3-199 Buttons on the CR5D00E8NC60
Silkscreen Name Description

OFL Board removal button To remove the board,
hold down the OFL
button for about six
seconds until the OFL
indicator turns on. Then,
you can remove the
board.

Ports

Table 3-200 Ports on the CR5D00E8NC60
Port Connector Type Description Available
Components

0 to 7 CFP2 Interface for 100Gbps CFP2
inputting and Optical Module
outputting 100GE 100Gbps CFP2
optical signals ETH&OTN
Optical Module

Table 3-201 Port attributes about the CR5D00E8NC60
Attributes Details

Working mode Full-duplex

Standards compliance IEEE 802.3

Frame format Ethernet_II, Ethernet_SAP and
Ethernet_SNAP

Functions and Features

Table 3-202 Functions and features of the CR5D00E8NC60
Functions and Features Description

Basic function Provides 8x100GE interfaces for line-
rate forwarding.

Reliability and availability Hot swappable

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Hardware Guide 3 Hardware Description

Functions and Features Description

Breakout supported Yes.
To enable the breakout function on a
port, run the port split command.

Interface rate auto-sensing supported No

FlexE supported No

Technical Specifications

Table 3-203 Technical specifications of the CR5D00E8NC60

Item Specification

Dimensions without packaging (H x W 41 mm x 400 mm x 520 mm (1.61 in. x
x D) [mm(in.)] 15.75 in. x 20.47 in.)

Weight without packaging [kg(lb)] 10 kg (22.05 lb)

Typical power consumption [W] 670 W

Typical heat dissipation [BTU/hour] 2173.76 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

3.1.5.10 LPUI-1T6

3.1.5.10.1 CR5D00E4KB61 (4-Port 400GBase QSFP-DD Integrated Line Process Unit
CM(NE5000E LPUI-1T6-CM))

Overview

Table 3-204 Basic information about the CR5D00E4KB61

Item Details

Description 4-Port 400GBase QSFP-DD Integrated
Line Process Unit CM(NE5000E
LPUI-1T6-CM)

Part Number 03058780

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Details

Model CR5D00E4KB61

Card type Fixed Board

Silkscreen NE5000E LPUI-1T6-CM
4x400GE-QSFP-DD

Appearance

Figure 3-112 Appearance of the CR5D00E4KB61

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03058780&productModel=CR5D00E4KB61#matchRelation

Indicators and Buttons

Table 3-205 Indicators on the CR5D00E4KB61
Silkscreen Name Color Status Description

OFL Board Red Steady on The board can
removal be removed.
indicator

RUN Running Green Blinks once The system is
status every 2s (0.5 running
indicator Hz) properly.

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Hardware Guide 3 Hardware Description

Silkscreen Name Color Status Description

- Blinks twice The board is
every second starting and
(2 Hz) has not
completed
registration.

0/0 to 1 1/0 Link status Green Steady on The link is Up.
to 1 indicator
- Blinking Data is being
transmitted or
received.

- Off The link is
Down.

0/Breakout:0 Breakout Green Reserved Reserved
to 7 optical
module
1/Breakout:0 channel Green Reserved Reserved
to 7 indicator

Table 3-206 Buttons on the CR5D00E4KB61
Silkscreen Name Description

OFL Board removal button To remove the board,
hold down the OFL
button for about six
seconds until the OFL
indicator turns on. Then,
you can remove the
board.

0/Breakout 1/Breakout Reserved Reserved

Ports

Table 3-207 Ports on the CR5D00E4KB61
Port Connector Type Description Available
Components

0/0 to 1 1/0 to 1 QSFP-DD Interface for 400Gbps QSFP-
inputting and DD Optical
outputting 400GE Module
optical signals

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Hardware Guide 3 Hardware Description

Table 3-208 Port attributes about the CR5D00E4KB61

Attributes Details

Working mode Full-duplex

Standards compliance IEEE 802.3

Frame format Ethernet_II, Ethernet_SAP and
Ethernet_SNAP

Functions and Features

Table 3-209 Functions and features of the CR5D00E4KB61

Functions and Features Description

Basic function Provides four 400G interfaces for line-
rate forwarding.

Reliability and availability Hot swappable

Breakout supported No

Interface rate auto-sensing supported No

FlexE supported No

Technical Specifications

Table 3-210 Technical specifications of the CR5D00E4KB61

Item Specification

Dimensions without packaging (H x W 45.2 mm x 521.9 mm x 533.4 mm
x D) [mm(in.)] (1.78 in. x 20.55 in. x 21.00 in.)

Dimensions with packaging (H x W x 195 mm x 750 mm x 735 mm (7.68 in.
D) [mm(in.)] x 29.53 in. x 28.94 in.)

Weight without packaging [kg(lb)] 14.4 kg (31.75 lb)

Weight with packaging [kg(lb)] 19.6 kg (43.21 lb)

Typical power consumption [W] 1110 W

Typical heat dissipation [BTU/hour] 3601.31 BTU/hour

Long-term operating temperature 0 °C~ 40°C (32°F ~ 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

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Hardware Guide 3 Hardware Description

Item Specification

SDRAM 16 GB x 1

3.1.5.10.2 CR5D00EDNB64 (16-Port 100GBase QSFP28 Integrated Line Process Unit
CM(NE5000E LPUI-1T6-CM))

Overview

Table 3-211 Basic information about the CR5D00EDNB64

Item Details

Description 16-Port 100GBase QSFP28 Integrated
Line Process Unit CM(NE5000E
LPUI-1T6-CM)

Part Number 03059808

Model CR5D00EDNB64

Card type Fixed Board

Silkscreen NE5000E LPUI-1T6-CM
16x100GE-QSFP28

Appearance

Figure 3-113 Appearance of the CR5D00EDNB64

Version Mapping

The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.

The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.

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enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03059808&productModel=CR5D00EDNB64#matchRelation

Indicators and Buttons

Table 3-212 Indicators on the CR5D00EDNB64

Silkscreen Name Color Status Description

OFL Board Red Steady on The board can
insertion/ be securely
removal removed.
indicator

RUN Running Green Blinking once The system is
status every two running
indicator seconds (0.5 normally.
Hz)

- Blink twice The device is
every second starting and
(2 Hz) has not
completed
registration.

0/0–7 1/0–7 Link status Green Steady on The link is up.
indicator
- Blinking Data is being
transmitted or
received.

- Steady off The link is
down.

0/Breakout: Breakout Green Reserved Reserved
0–3 optical
1/Breakout: module
0–3 channel
indicator

Table 3-213 Buttons on the CR5D00EDNB64

Silkscreen Name Description

OFL Board removal button To remove a board, hold
down the OFL button for
about 6s until the OFL
indicator turns on, and
then remove the board.

0/Breakout 1/Breakout Reserved Reserved

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Hardware Guide 3 Hardware Description

Ports

Table 3-214 Ports on the CR5D00EDNB64

Port Connector Type Description Available
Components

0/0–7 1/0–7 QSFP28 Interface for 40Gbps QSFP+
inputting and Optical Module
outputting 100GE 100Gbps QSFP28
optical signals Optical Module
100Gbps CFP2
ETH&OTN
Optical Module
NOTE
When an 80 km
optical module is
used, the short-
term operating
temperature of the
board is 45°C.

Table 3-215 Port attributes about the CR5D00EDNB64

Attributes Details

Working mode Full-duplex

Standards compliance IEEE 802.3

Frame format Ethernet_II, Ethernet_SAP and
Ethernet_SNAP

Functions and Features

Table 3-216 Functions and features of the CR5D00EDNB64

Functions and Features Description

Basic function Provides sixteen 100G interfaces for
line-rate forwarding.

Reliability and availability Hot swappable

Breakout supported No

Interface rate auto-sensing supported No

FlexE supported No

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Hardware Guide 3 Hardware Description

Technical Specifications

Table 3-217 Technical specifications of the CR5D00EDNB64
Item Specification

Dimensions without packaging (H x W 45.2 mm x 521.9 mm x 533.4 mm
x D) [mm(in.)] (1.78 in. x 20.55 in. x 21.00 in.)

Dimensions with packaging (H x W x 195 mm x 750 mm x 735 mm (7.68 in.
D) [mm(in.)] x 29.53 in. x 28.94 in.)

Weight without packaging [kg(lb)] 14.2 kg (31.31 lb)

Weight with packaging [kg(lb)] 19.4 kg (42.77 lb)

Typical power consumption [W] 1070.0 W

Typical heat dissipation [BTU/hour] 3471.53 BTU/hour

Long-term operating temperature 0 °C~ 40°C (32°F ~ 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

SDRAM 16 GB x 1

3.1.5.10.3 CR5D00LRXF61 (72-Port 10GBase LAN/WAN-SFP+ Integrated Line
Process Unit CM(NE5000E LPUI-1T6-CM))

Overview

Table 3-218 Basic information about the CR5D00LRXF61
Item Details

Description 72-Port 10GBase LAN/WAN-SFP+
Integrated Line Process Unit
CM(NE5000E LPUI-1T6-CM)

Part Number 03058652

Model CR5D00LRXF61

Card type Fixed Board

Silkscreen NE5000E LPUI-1T6-CM
72xGE/10GE

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Hardware Guide 3 Hardware Description

Appearance

Figure 3-114 Appearance of the CR5D00LRXF61

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03058652&productModel=CR5D00LRXF61#matchRelation

Indicators and Buttons

Table 3-219 Indicators on the CR5D00LRXF61
Silkscreen Name Color Status Description

OFL Board Red Steady on The board can
removal be removed.
indicator

RUN Running Green Blinks once The system is
status every 2s (0.5 running
indicator Hz) properly.

Green Blinks twice The board is
every second starting and
(2 Hz) has not
completed
registration.

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Hardware Guide 3 Hardware Description

Silkscreen Name Color Status Description

0/00 0/10 Port status Green - The
0/20 0/30 indicator 00/10/20/30
1/00 1/10 indicator is
1/20 1/30 steady on in
turn.
0/0~9 1/0~9
If the 00
indicator is
steady on,the
0~9 indicator
is steady on,
the link 0~9 is
Up. If the 0~9
indicator
blinks, data is
being
transmitted or
received. If
the 0~9
indicator is
off, the link is
Down.
If the 10
indicator is
steady on,the
0~9 indicator
is steady on,
the link
10~19 is Up.
If the 0~9
indicator
blinks, data is
being
transmitted or
received. If
the 0~9
indicator is
off, the link is
Down.
If the 20
indicator is
steady on,the
0~9 indicator
is steady on,
the link
20~29 is Up.
If the 0~9
indicator
blinks, data is
being
transmitted or

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Hardware Guide 3 Hardware Description

Silkscreen Name Color Status Description

received. If
the 0~9
indicator is
off, the link is
Down.
If the 30
indicator is
steady on,the
0~5 indicator
is steady on,
the link
30~35 is Up.
If the 0~5
indicator
blinks, data is
being
transmitted or
received. If
the 0~5
indicator is
off, the link is
Down.

Table 3-220 Buttons on the CR5D00LRXF61
Silkscreen Name Description

OFL Board removal button To remove the board,
hold down the OFL
button for about six
seconds until the OFL
indicator turns on. Then,
you can remove the
board.

0/SEL 1/SEL Switching button of port When you press the
mode status indicator button, the channel
00/10/20/30 indicators stop status
cycling and remain in the
current status. Then,
each time you press the
button, the channel
indicators' status
switches. If you do not
press the button in 60s,
the indicators
automatically start
status cycling.

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Hardware Guide 3 Hardware Description

Ports

Table 3-221 Ports on the CR5D00LRXF61
Port Connector Type Description Available
Components

0/0 to 0/35 1/0 to SFP+ Interface for 10Gbps SFP+
1/35 inputting and Optical Module
outputting 10GE 10Gbps SFP+
optical signals BIDI Optical
Module
1.25Gbps eSFP
Optical Module
NOTE
The electrical
module is a non-
commercial feature
on the board and
is used only for
commissioning or
fault locating.

Table 3-222 Port attributes about the CR5D00LRXF61
Attributes Details

Working mode Full-duplex

Standards compliance IEEE 802.3

Frame format Ethernet_II, Ethernet_SAP and
Ethernet_SNAP

Functions and Features

Table 3-223 Functions and features of the CR5D00LRXF61
Functions and Features Description

Basic function Provides seventy-two 10G interfaces
for line-rate forwarding.

Reliability and availability Hot swappable

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Functions and Features Description

Restrictions and remarks Exception {0/8}, {0/9}, {0/22}, {0/23},
{1/8}, {1/9}, {1/22}, {1/23} port, Each 4
physical interfaces is one Group in the
order of number. There can be up two
modes one time in each Group, such
as GE/FE and WAN, GE/FE and LAN,
WAN and LAN. These Groups as:
{{0/0,0/1,0/2,0/3},{0/4,0/5,0/6,0/7},
{0/10,0/11,0/12,0/13},
{0/14,0/15,0/16,0/17},
{0/18,0/19,0/20,0/21},
{0/24,0/25,0/26,0/27},
{0/28,0/29,0/30,0/31},
{0/32,0/33,0/34,0/35},{1/0,1/1,1/2,1/3},
{1/4,1/5,1/6,1/7},{1/10,1/11,1/12,1/13},
{1/14,1/15,1/16,0/17},
{1/18,1/19,1/20,1/21},
{1/24,1/25,1/26,1/27},
{1/28,1/29,1/30,1/31},
{1/32,1/33,0/34,1/35}}

Breakout supported No

Interface rate auto-sensing supported No. You need to run a command to
perform the switching.

FlexE supported No

Technical Specifications

Table 3-224 Technical specifications of the CR5D00LRXF61
Item Specification

Dimensions without packaging (H x W 45.2 mm x 521.9 mm x 533.4 mm
x D) [mm(in.)] (1.78 in. x 20.55 in. x 21.00 in.)

Dimensions with packaging (H x W x 195 mm x 750 mm x 735 mm (7.68 in.
D) [mm(in.)] x 29.53 in. x 28.94 in.)

Weight without packaging [kg(lb)] 15 kg (33.07 lb)

Weight with packaging [kg(lb)] 20.2 kg (44.53 lb)

Typical power consumption [W] 800 W

Typical heat dissipation [BTU/hour] 2595.54 BTU/hour

Long-term operating temperature 0 °C~ 40°C (32°F ~ 104°F)
[°C(°F)]

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Hardware Guide 3 Hardware Description

Item Specification

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

SDRAM 16 GB x 1

3.1.5.11 LPUI-2T

3.1.5.11.1 CR5D00EDNB60 (16-Port 100GBase QSFP28 Integrated Line Process
Unit(NE5000E LPUI-2T))

Overview

Table 3-225 Basic information about the CR5D00EDNB60
Item Details

Description 16-Port 100GBase QSFP28 Integrated
Line Process Unit(NE5000E LPUI-2T)

Part Number 03031XCM

Model CR5D00EDNB60

Card type Fixed Board

Silkscreen NE5000ELPUI-2T
16x100GBase-QSFP28

Appearance

Figure 3-115 Appearance of the CR5D00EDNB60

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03031XCM&productModel=CR5D00EDNB60#matchRelation

Indicators and Buttons

Table 3-226 Indicators on the CR5D00EDNB60
Silkscreen Name Color Status Description

OFL Offline Red On The board can
indicator be removed.

RUN Running Green Blinking(0.5H The system is
status Z) running
indicator properly.

Green Blinking(2HZ) The system is
registering.

40G/100G:0 Interface Green On The link is Up.
to 15 status
indicator Green Blinking Data is being
transmitted
and received.

- Off The link is
Down.

Table 3-227 Buttons on the CR5D00EDNB60
Silkscreen Name Description

OFL Board removal button To remove the board,
hold down the OFL
button for about six
seconds until the OFL
indicator turns on. Then,
you can remove the
board.

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Hardware Guide 3 Hardware Description

Ports

Table 3-228 Ports on the CR5D00EDNB60
Port Connector Type Description Available
Components

0 to 15 QSFP28/QSFP+ Interface for 100Gbps QSFP28
inputting and Optical Module
outputting 40Gbps QSFP+
100GE/40GE/ Optical Module
10GE optical
NOTE
signals No Supported
80Km 100Gbps
QSFP28 Optical
Module.

Table 3-229 Port attributes about the CR5D00EDNB60
Attributes Details

Working mode Full-duplex

Standards compliance IEEE 802.3

Frame format Ethernet_II, Ethernet_SAP and
Ethernet_SNAP

Functions and Features

Table 3-230 Functions and features of the CR5D00EDNB60
Functions and Features Description

Basic function Supports 16 x 100G/40G line-rate
forwarding.

Reliability and availability Hot swappable

Breakout supported No

Interface rate auto-sensing supported No

FlexE supported No

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Hardware Guide 3 Hardware Description

Technical Specifications

Table 3-231 Technical specifications of the CR5D00EDNB60
Item Specification

Dimensions without packaging (H x W 41 mm x 400 mm x 520 mm (1.61 in. x
x D) [mm(in.)] 15.75 in. x 20.47 in.)

Weight without packaging [kg(lb)] 12.5 kg (27.56 lb)

Typical power consumption [W] 966 W

Typical heat dissipation [BTU/hour] 3134.11 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

3.1.5.11.2 CR5D00EDNB6P (16-Port 100GBase-QSFP28 Integrated Line Process Unit
(NE5000E LPUI-2T-CM))

Overview

Table 3-232 Basic information about the CR5D00EDNB6P
Item Details

Description 16-Port 100GBase-QSFP28 Integrated
Line Process Unit (NE5000E LPUI-2T-
CM)

Part Number 03032PFP

Model CR5D00EDNB6P

Card type Fixed Board

Silkscreen LPUI-2T-CM

Appearance

Figure 3-116 Appearance of the CR5D00EDNB6P

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 243
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Version Mapping

The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.

The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.

enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03032PFP&productModel=CR5D00EDNB6P#matchRelation

Indicators and Buttons

Table 3-233 Indicators on the CR5D00EDNB6P

Silkscreen Name Color Status Description

OFL Offline Red On The board can
indicator be removed.

RUN Running Green Blinking(0.5H The system is
status Z) running
indicator properly.

Green Blinking(2HZ) The system is
registering.

40G/100G:0 Interface Green On The link is Up.
to 15 status
indicator Green Blinking Data is being
transmitted
and received.

- Off The link is
Down.

Table 3-234 Buttons on the CR5D00EDNB6P

Silkscreen Name Description

OFL Board removal button Before removing a board,
press and hold the OFL
button until the OFL
indicator turns on (about
six seconds). The board
can then be safely
removed.
This button takes effect
only for the standby
MPU.

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Hardware Guide 3 Hardware Description

Ports

Table 3-235 Ports on the CR5D00EDNB6P
Port Connector Type Description Available
Components

0 to 15 QSFP28 Interface for 100Gbps QSFP28
inputting and Optical Module
outputting 100GE NOTE
optical signals No Supported
80Km module

Table 3-236 Port attributes about the CR5D00EDNB6P
Attributes Details

Working mode Full-duplex

Standards compliance IEEE 802.3

Frame format Ethernet_II, Ethernet_SAP and
Ethernet_SNAP

Functions and Features

Table 3-237 Functions and features of the CR5D00EDNB6P
Functions and Features Description

Basic function Provides sixteen 100GE interfaces for
line-rate forwarding.

Reliability and availability Hot swappable

Breakout supported No

Interface rate auto-sensing supported No

FlexE supported No

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Hardware Guide 3 Hardware Description

Technical Specifications

Table 3-238 Technical specifications of the CR5D00EDNB6P
Item Specification

Dimensions without packaging (H x W 41 mm x 400 mm x 520 mm (1.61 in. x
x D) [mm(in.)] 15.75 in. x 20.47 in.)

Weight without packaging [kg(lb)] 12.5 kg (27.56 lb)

Typical power consumption [W] 966 W

Typical heat dissipation [BTU/hour] 3134.11 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

3.1.5.12 CP100

3.1.5.12.1 CR5D00P8UF60 (8-Port OC-48c/12c/3c STM-16c/4c/1c POS-SFP Flexible
Card(CP100,Occupy 1 sub-slot))

Overview

Table 3-239 Basic information about the CR5D00P8UF60
Item Details

Description 8-Port OC-48c/12c/3c STM-16c/4c/1c
POS-SFP Flexible Card(CP100,Occupy 1
sub-slot)

Part Number 03030RLC

Model CR5D00P8UF60

Card type Flexible Board

Silkscreen CP100-8xOC-48c/12c/3c
STM-16c/4c/1c POS-SFP

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Hardware Guide 3 Hardware Description

Appearance

Figure 3-117 Appearance of the CR5D00P8UF60

Version Mapping

The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.

The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.

enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03030RLC&productModel=CR5D00P8UF60#matchRelation

Indicators

Table 3-240 Indicators on the CR5D00P8UF60

Silkscreen Name Color Status Description

STATUS Running Green Blinking(0.5H The system is
status Z) running
indicator properly.

Green Blinking(2HZ) The system is
running in
alarm mode.

0 to 7 Interface Green On The link is Up.
status
indicator Green Blinking Data is being
transmitted
and received.

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Hardware Guide 3 Hardware Description

Silkscreen Name Color Status Description

- Off The link is
Down.

Ports

Table 3-241 Ports on the CR5D00P8UF60
Port Connector Type Description Available
Components

0–7 SFP Interface for 155Mbps eSFP
inputting and Optical Module
outputting 2.5G/ 2.5Gbps eSFP
622M/155M POS Optical Module
optical signals

Table 3-242 Port attributes about the CR5D00P8UF60
Attributes Details

Working mode Full-duplex

Standards compliance IEEE 802.3

Frame format PPP and HDLC

Functions and Features

Table 3-243 Functions and features of the CR5D00P8UF60
Functions and Features Description

Basic function Provides eight 2.5GE POS interfaces
(can be auto-adapted to 155M or
622M) for line-rate transmitting and
receiving.

Reliability and availability Hot swappable

Breakout supported No

Interface rate auto-sensing supported No

FlexE supported No

Link protocol PPP, HDLC, FR

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 248
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Hardware Guide 3 Hardware Description

Technical Specifications

Table 3-244 Technical specifications of the CR5D00P8UF60
Item Specification

Dimensions without packaging (H x W 35 mm x 178 mm x 180 mm (1.38 in. x
x D) [mm(in.)] 7.01 in. x 7.09 in.)

Weight without packaging [kg(lb)] 1 kg (2.20 lb)

Typical power consumption [W] 36 W

Typical heat dissipation [BTU/hour] 116.8 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

3.1.5.13 CP400

3.1.5.13.1 CR5D00E1NC61 (1-Port 100GBase-CFP Flexible Card(CP400,Occupy 1
sub-slots))

Overview

Table 3-245 Basic information about the CR5D00E1NC61
Item Details

Description 1-Port 100GBase-CFP Flexible
Card(CP400,Occupy 1 sub-slots)

Part Number 03030RJR

Model CR5D00E1NC61

Card type Flexible Board

Silkscreen CP400-1x100GBase LAN-CFP

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Hardware Guide 3 Hardware Description

Appearance

Figure 3-118 Appearance of the CR5D00E1NC61

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03030RJR&productModel=CR5D00E1NC61#matchRelation

Indicators

Table 3-246 Indicators on the CR5D00E1NC61
Silkscreen Name Color Status Description

STATUS Running Green Blinking(0.5H The system is
status Z) running
indicator properly.

Green Blinking(2HZ) The system is
running in
alarm mode.

L/A Interface Green On The link is Up.
status
indicator Green Blinking Data is being
transmitted
and received.

- Off The link is
Down.

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Hardware Guide 3 Hardware Description

Ports

Table 3-247 Ports on the CR5D00E1NC61

Port Connector Type Description Available
Components

None CFP Interface for 100Gbps CFP
inputting and Optical Module
outputting 100GE
optical signals

Table 3-248 Port attributes about the CR5D00E1NC61

Attributes Details

Working mode Full-duplex

Standards compliance IEEE 802.3

Frame format Ethernet_II, Ethernet_SAP and
Ethernet_SNAP

Functions and Features

Table 3-249 Functions and features of the CR5D00E1NC61

Functions and Features Description

Basic function Provides one 100G interface for line-
rate transmitting and receivings.

Reliability and availability Hot swappable

Breakout supported No

Interface rate auto-sensing supported No

FlexE supported No

Technical Specifications

Table 3-250 Technical specifications of the CR5D00E1NC61

Item Specification

Dimensions without packaging (H x W 35 mm x 178 mm x 180 mm (1.38 in. x
x D) [mm(in.)] 7.01 in. x 7.09 in.)

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Hardware Guide 3 Hardware Description

Item Specification

Weight without packaging [kg(lb)] 1.3 kg (2.87 lb)

Typical power consumption [W] 35 W

Typical heat dissipation [BTU/hour] 113.55 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

3.1.5.13.2 CR5D00E2NB60 (2-Port 100G QSFP28 Flexible Card(CP400,Occupy 1 sub-
slot))

Overview

Table 3-251 Basic information about the CR5D00E2NB60

Item Details

Description 2-Port 100G QSFP28 Flexible
Card(CP400,Occupy 1 sub-slot)

Part Number 03032KKK

Model CR5D00E2NB60

Card type Flexible Board

Silkscreen CP400-2x100GBase-QSFP28

Appearance

Figure 3-119 Appearance of the CR5D00E2NB60

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 252
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03032KKK&productModel=CR5D00E2NB60#matchRelation

Indicators

Table 3-252 Indicators on the CR5D00E2NB60
Silkscreen Name Color Status Description

STATUS Running Green Blinking(0.5H The system is
status Z) running
indicator properly.

Green Blinking(2HZ) The system is
running in
alarm mode.

0 to 1 Interface Green On The link is Up.
status
indicator - Off The link is
Down.

Green Blinking Data is being
transmitted
and received.

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Hardware Guide 3 Hardware Description

Ports

Table 3-253 Ports on the CR5D00E2NB60
Port Connector Type Description Available
Components

0 to 1 QSFP28 Interface for 100Gbps QSFP28
inputting and Optical Module
outputting 100GE NOTE
optical signals When 80 km
optical modules
are used, the
highest short-term
operating
temperature of the
board is 45°C.

Table 3-254 Port attributes about the CR5D00E2NB60
Attributes Details

Working mode Full-duplex

Standards compliance IEEE 802.3

Frame format Ethernet_II, Ethernet_SAP and
Ethernet_SNAP

Functions and Features

Table 3-255 Functions and features of the CR5D00E2NB60
Functions and Features Description

Basic function Provides two 100GE interfaces for line-
rate transmitting and receiving.

Reliability and availability Hot swappable

Breakout supported Yes.
To enable the breakout function on a
port, run the port split command.

Interface rate auto-sensing supported No

FlexE supported No

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Hardware Guide 3 Hardware Description

Technical Specifications

Table 3-256 Technical specifications of the CR5D00E2NB60
Item Specification

Dimensions without packaging (H x W 35 mm x 178 mm x 180 mm (1.38 in. x
x D) [mm(in.)] 7.01 in. x 7.09 in.)

Weight without packaging [kg(lb)] 0.8 kg (1.76 lb)

Typical power consumption [W] 60.7 W

Typical heat dissipation [BTU/hour] 196.94 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

3.1.5.13.3 CR5D00E2NC61 (2-Port 100GBase-CXP Flexible Card(CP400,Occupy 1
sub-slot))

Overview

Table 3-257 Basic information about the CR5D00E2NC61
Item Details

Description 2-Port 100GBase-CXP Flexible
Card(CP400,Occupy 1 sub-slot)

Part Number 03030RDY

Model CR5D00E2NC61

Card type Flexible Board

Silkscreen CP400-2x100GBase-CXP

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Appearance

Figure 3-120 Appearance of the CR5D00E2NC61

Version Mapping

The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.

The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.

enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03030RDY&productModel=CR5D00E2NC61#matchRelation

Indicators

Table 3-258 Indicators on the CR5D00E2NC61

Silkscreen Name Color Status Description

STATUS Running Green Blinking(0.5H The system is
status Z) running
indicator properly.

Green Blinking(2HZ) The system is
running in
alarm mode.

L/A Interface Green On The link is Up.
status
indicator Green Blinking Data is being
transmitted
and received.

- Off The link is
Down.

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Hardware Guide 3 Hardware Description

Ports

Table 3-259 Ports on the CR5D00E2NC61

Port Connector Type Description Available
Components

0 to 1 CXP Interface for 100Gbps CXP
inputting and Optical Module
outputting 100GE
optical signals

Table 3-260 Port attributes about the CR5D00E2NC61

Attributes Details

Working mode Full-duplex

Standards compliance IEEE 802.3

Frame format Ethernet_II, Ethernet_SAP and
Ethernet_SNAP

Functions and Features

Table 3-261 Functions and features of the CR5D00E2NC61

Functions and Features Description

Basic function Provides two 100G interfaces for line-
rate transmitting and receiving.

Reliability and availability Hot swappable

Breakout supported No

Interface rate auto-sensing supported No

FlexE supported No

Technical Specifications

Table 3-262 Technical specifications of the CR5D00E2NC61

Item Specification

Dimensions without packaging (H x W 35 mm x 178 mm x 180 mm (1.38 in. x
x D) [mm(in.)] 7.01 in. x 7.09 in.)

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Hardware Guide 3 Hardware Description

Item Specification

Weight without packaging [kg(lb)] 1 kg (2.20 lb)

Typical power consumption [W] 42.5 W

Typical heat dissipation [BTU/hour] 137.89 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

3.1.5.13.4 CR5D00E2NC62 (2-Port 100GBase LAN CFP2 Flexible Card(CP400-A))

Overview

Table 3-263 Basic information about the CR5D00E2NC62
Item Details

Description 2-Port 100GBase LAN CFP2 Flexible
Card(CP400-A)

Part Number 03030TCG

Model CR5D00E2NC62

Card type Flexible Board

Silkscreen CP400-2x100GBase-CFP2

Appearance

Figure 3-121 Appearance of the CR5D00E2NC62

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 258
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Version Mapping

The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.

The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.

enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03030TCG&productModel=CR5D00E2NC62#matchRelation

Indicators

Table 3-264 Indicators on the CR5D00E2NC62

Silkscreen Name Color Status Description

STATUS Running Green Blinking(0.5H The system is
status Z) running
indicator properly.

Green Blinking(2HZ) The system is
running in
alarm mode.

L/A Interface Green On The link is Up.
status
indicator Green Blinking Data is being
transmitted
and received.

- Off The link is
Down.

Ports

Table 3-265 Ports on the CR5D00E2NC62

Port Connector Type Description Available
Components

0 to 1 CFP2 Interface for 100Gbps CFP2
inputting and Optical Module
outputting 100GE 100Gbps CFP2
optical signals ETH&OTN
Optical Module

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Hardware Guide 3 Hardware Description

Table 3-266 Port attributes about the CR5D00E2NC62
Attributes Details

Working mode Full-duplex

Standards compliance IEEE 802.3

Frame format Ethernet_II, Ethernet_SAP and
Ethernet_SNAP

Functions and Features

Table 3-267 Functions and features of the CR5D00E2NC62
Functions and Features Description

Basic function Provides two 100G interfaces for line-
rate transmitting and receiving.

Reliability and availability Hot swappable

Breakout supported No

Interface rate auto-sensing supported No

FlexE supported No

Technical Specifications

Table 3-268 Technical specifications of the CR5D00E2NC62
Item Specification

Dimensions without packaging (H x W 35 mm x 178 mm x 180 mm (1.38 in. x
x D) [mm(in.)] 7.01 in. x 7.09 in.)

Weight without packaging [kg(lb)] 1.1 kg (2.43 lb)

Typical power consumption [W] 58.8 W

Typical heat dissipation [BTU/hour] 190.77 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

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Hardware Guide 3 Hardware Description

3.1.5.13.5 CR5D00E5MF61 (5-Port 40GBase-QSFP+ Flexible Card(CP400,Occupy 1
sub-slot))

Overview

Table 3-269 Basic information about the CR5D00E5MF61
Item Details

Description 5-Port 40GBase-QSFP+ Flexible
Card(CP400,Occupy 1 sub-slot)

Part Number 03030TLF

Model CR5D00E5MF61

Card type Flexible Board

Silkscreen CP400-5x40GBase-QSFP+

Appearance

Figure 3-122 Appearance of the CR5D00E5MF61

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03030TLF&productModel=CR5D00E5MF61#matchRelation

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Hardware Guide 3 Hardware Description

Indicators

Table 3-270 Indicators on the CR5D00E5MF61
Silkscreen Name Color Status Description

STATUS Running Green Blinking(0.5H The system is
status Z) running
indicator properly.

Green Blinking(2HZ) The system is
running in
alarm mode.

L/A Interface Green On The link is Up.
status
indicator Green Blinking Data is being
transmitted
and received.

- Off The link is
Down.

Ports

Table 3-271 Ports on the CR5D00E5MF61
Port Connector Type Description Available
Components

0 to 4 QSFP+ Interface for 40Gbps QSFP+
inputting and Optical Module
outputting 40GE
optical signals

Table 3-272 Port attributes about the CR5D00E5MF61
Attributes Details

Working mode Full-duplex

Standards compliance IEEE 802.3

Frame format Ethernet_II, Ethernet_SAP and
Ethernet_SNAP

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Hardware Guide 3 Hardware Description

Functions and Features

Table 3-273 Functions and features of the CR5D00E5MF61

Functions and Features Description

Basic function Provides five 40G interfaces for line-
rate transmitting and receiving.

Reliability and availability Hot swappable

Breakout supported No

Interface rate auto-sensing supported No

FlexE supported No

Technical Specifications

Table 3-274 Technical specifications of the CR5D00E5MF61

Item Specification

Dimensions without packaging (H x W 35 mm x 178 mm x 180 mm (1.38 in. x
x D) [mm(in.)] 7.01 in. x 7.09 in.)

Weight without packaging [kg(lb)] 0.9 kg (1.98 lb)

Typical power consumption [W] 58.8 W

Typical heat dissipation [BTU/hour] 190.77 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

3.1.5.13.6 CR5D00LEXF61 (20-Port 10GBase LAN/WAN-SFP+ Flexible Card
B(CP400,Occupy 2 sub-slots))

Overview

Table 3-275 Basic information about the CR5D00LEXF61

Item Details

Description 20-Port 10GBase LAN/WAN-SFP+
Flexible Card B(CP400,Occupy 2 sub-
slots)

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Hardware Guide 3 Hardware Description

Item Details

Part Number 03030RGM

Model CR5D00LEXF61

Card type Flexible Board

Silkscreen CP400-20x10GBase LAN/WAN-SFP+

Appearance

Figure 3-123 Appearance of the CR5D00LEXF61

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03030RGM&productModel=CR5D00LEXF61#matchRelation

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Hardware Guide 3 Hardware Description

Indicators

Table 3-276 Indicators on the CR5D00LEXF61
Silkscreen Name Color Status Description

STATUS Running Green Blinking(0.5H The system is
status Z) running
indicator properly.

Green Blinking(2HZ) The system is
running in
alarm mode.

L/A Interface Green On The link is Up.
status
indicator Green Blinking Data is being
transmitted
and received.

- Off The link is
Down.

Ports

Table 3-277 Ports on the CR5D00LEXF61
Port Connector Type Description Available
Components

0 to 19 SFP+ Interface for 1.25Gbps eSFP
inputting and Optical Module
outputting 10GE 10Gbps SFP+
optical signals Optical Module

Table 3-278 Port attributes about the CR5D00LEXF61
Attributes Details

Working mode Full-duplex

Standards compliance IEEE 802.3

Frame format Ethernet_II, Ethernet_SAP and
Ethernet_SNAP

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Hardware Guide 3 Hardware Description

Functions and Features

Table 3-279 Functions and features of the CR5D00LEXF61

Functions and Features Description

Basic function Provides twenty 10GE interfaces for
line-rate transmitting and receiving.

Reliability and availability Hot swappable

Breakout supported No

Interface rate auto-sensing supported No

FlexE supported No

Technical Specifications

Table 3-280 Technical specifications of the CR5D00LEXF61

Item Specification

Dimensions without packaging (H x W 35 mm x 178 mm x 180 mm (1.38 in. x
x D) [mm(in.)] 7.01 in. x 7.09 in.)

Weight without packaging [kg(lb)] 0.9 kg (1.98 lb)

Typical power consumption [W] 49 W

Typical heat dissipation [BTU/hour] 158.98 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

3.1.5.13.7 CR5D00N2NC61 (2-Port 100G OTN/ETH-CFP2 Flexible
Card(CP400,Occupy 1 sub-slot))

Overview

Table 3-281 Basic information about the CR5D00N2NC61

Item Details

Description 2-Port 100G OTN/ETH-CFP2 Flexible
Card(CP400,Occupy 1 sub-slot)

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Hardware Guide 3 Hardware Description

Item Details

Part Number 03031ESR

Model CR5D00N2NC61

Card type Flexible Board

Silkscreen CP400-2xOTU4/2x100GBase LAN-CFP2

Appearance

Figure 3-124 Appearance of the CR5D00N2NC61

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03031ESR&productModel=CR5D00N2NC61#matchRelation

Indicators

Table 3-282 Indicators on the CR5D00N2NC61

Silkscreen Name Color Status Description

STATUS Running Green Blinking(0.5H The system is
status Z) running
indicator properly.

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Hardware Guide 3 Hardware Description

Silkscreen Name Color Status Description

Green Blinking(2HZ) The system is
running in
alarm mode.

L/A Interface Green On The link is Up.
status
indicator Green Blinking Data is being
transmitted
and received.

- Off The link is
Down.

Ports

Table 3-283 Ports on the CR5D00N2NC61
Port Connector Type Description Available
Components

0 to 1 CFP2 Interface for 100Gbps CFP2
inputting and Optical Module
outputting 100G 100Gbps CFP2
OTN/ETH optical ETH&OTN
signals Optical Module
NOTE
When the OTN
rate is used, 100
Gbps CFP2
ETH&OTN Optical
Modules are
supported.
When the LAN rate
is used, 100 Gbps
CFP2 Optical
Modules and 100
Gbps CFP2
ETH&OTN Optical
Modules are
supported.

Table 3-284 Port attributes about the CR5D00N2NC61
Attributes Details

Working mode Full-duplex

Standards compliance IEEE 802.3

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Attributes Details

Frame format Ethernet_II, Ethernet_SAP and
Ethernet_SNAP

Functions and Features

Table 3-285 Functions and features of the CR5D00N2NC61

Functions and Features Description

Basic function Provides two 100G interfaces for line-
rate transmitting and receiving.

Reliability and availability Hot swappable

Restrictions and remarks The 2-port 100G OTN/ETH-CFP2
flexible card supports OTN and
Ethernet modes. The OTN mode only
supports standard type. Two
interconnected routers must use the
same FEC type.

Breakout supported No

Interface rate auto-sensing supported No

FlexE supported No

Technical Specifications

Table 3-286 Technical specifications of the CR5D00N2NC61

Item Specification

Dimensions without packaging (H x W 35 mm x 178 mm x 180 mm (1.38 in. x
x D) [mm(in.)] 7.01 in. x 7.09 in.)

Weight without packaging [kg(lb)] 1.1 kg (2.43 lb)

Typical power consumption [W] 87.3 W

Typical heat dissipation [BTU/hour] 283.08 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

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3.1.5.13.8 CR5D00NBGF60 (12-Port 10G OTN/ETH-SFP+ Flexible Card(CP400,Occupy
1 sub-slot))

Overview

Table 3-287 Basic information about the CR5D00NBGF60

Item Details

Description 12-Port 10G OTN/ETH-SFP+ Flexible
Card(CP400,Occupy 1 sub-slot)

Part Number 03032KVB

Model CR5D00NBGF60

Card type Flexible Board

Silkscreen CP400-12x10G OTU2-SFP+
CR5D00NBGF60

Appearance

Figure 3-125 Appearance of the CR5D00NBGF60

Version Mapping

The huge hardware mapping data is migrated to the Info-Finder hardware center,
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Indicators

Table 3-288 Indicators on the CR5D00NBGF60
Silkscreen Name Color Status Description

STATUS Running Green Blinking(0.5H The system is
status Z) running
indicator properly.

- Off The system is
faulty or has
not
completed
registration.

0 to 11 Interface Green On The link is Up.
status
indicator Green Blinking Data is being
transmitted
and received.

- Off The link is
Down.

Ports

Table 3-289 Ports on the CR5D00NBGF60
Port Connector Type Description Available
Components

0 to 11 SFP+ Interface for 10Gbps SFP+
inputting and Optical Module
outputting 10GE 10Gbps SFP+
OTN/ETH optical OTN Optical
signals Module
NOTE
When the OTN
rate is used,
10Gbps SFP+ OTN
Optical Modules
are supported.
When the LAN rate
is used, 10Gbps
SFP+ Optical
Modules are
supported.

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Table 3-290 Port attributes about the CR5D00NBGF60
Attributes Details

Working mode Full-duplex

Standards compliance IEEE 802.3

Frame format Ethernet_II, Ethernet_SAP and
Ethernet_SNAP

Functions and Features

Table 3-291 Functions and features of the CR5D00NBGF60
Functions and Features Description

Basic function Provides twelve 10GE interfaces for
line-rate transmitting and receiving.

Reliability and availability Hot swappable

Breakout supported No

Interface rate auto-sensing supported No

FlexE supported No

Technical Specifications

Table 3-292 Technical specifications of the CR5D00NBGF60
Item Specification

Dimensions without packaging (H x W 35 mm x 178 mm x 180 mm (1.38 in. x
x D) [mm(in.)] 7.01 in. x 7.09 in.)

Weight without packaging [kg(lb)] 0.8 kg (1.76 lb)

Typical power consumption [W] 56 W

Typical heat dissipation [BTU/hour] 181.69 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

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3.1.5.13.9 CR5D00P4XX60 (4-Port OC-192c/STM-64c POS-XFP Flexible
Card(CP400,Occupy 1 sub-slot))

Overview

Table 3-293 Basic information about the CR5D00P4XX60

Item Details

Description 4-Port OC-192c/STM-64c POS-XFP
Flexible Card(CP400,Occupy 1 sub-
slot)

Part Number 03032SMV

Model CR5D00P4XX60

Card type Flexible Board

Silkscreen CP400-4xOC192c/STM64c POS-XFP

Appearance

Figure 3-126 Appearance of the CR5D00P4XX60

Version Mapping

The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.

The Info-Finder hardware center incorporates comprehensive hardware
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desired information and filter the mapping data for more fine-grained data
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Indicators

Table 3-294 Indicators on the CR5D00P4XX60
Silkscreen Name Color Status Description

STATUS Running Green Blinking(0.5H The system is
status Z) running
indicator properly.

- Off The system is
faulty or has
not
completed
registration.

0 to 3 Interface Green On The link is Up.
status
indicator - Off The link is
Down.

Green Blinking Data is being
transmitted
and received.

Ports

Table 3-295 Ports on the CR5D00P4XX60
Port Connector Type Description Available
Components

0 to 3 XFP Interface for 10Gbps XFP
inputting and Optical Module
outputting 10G
POS optical
signals

Table 3-296 Port attributes about the CR5D00P4XX60
Attributes Details

Working mode Full-duplex

Standards compliance IEEE 802.3

Frame format PPP and HDLC

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Functions and Features

Table 3-297 Functions and features of the CR5D00P4XX60
Functions and Features Description

Basic function Provides four 10G POS interfaces for
line-rate transmitting and receiving.

Reliability and availability Hot swappable

Breakout supported No

Interface rate auto-sensing supported No

FlexE supported No

Link protocol PPP, HDLC, FR

Technical Specifications

Table 3-298 Technical specifications of the CR5D00P4XX60
Item Specification

Dimensions without packaging (H x W 35 mm x 178 mm x 180 mm (1.38 in. x
x D) [mm(in.)] 7.01 in. x 7.09 in.)

Weight without packaging [kg(lb)] 1.1 kg (2.43 lb)

Typical power consumption [W] 56.2 W

Typical heat dissipation [BTU/hour] 182.34 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

3.1.5.14 CP1T

3.1.5.14.1 CR5D00E4NB60 (4-Port 100GBase QSFP28 Flexible Card(CP1T,Occupy 1
sub-slot))

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Overview

Table 3-299 Basic information about the CR5D00E4NB60

Item Details

Description 4-Port 100GBase QSFP28 Flexible
Card(CP1T,Occupy 1 sub-slot)

Part Number 03032EQQ

Model CR5D00E4NB60

Card type Flexible Board

Silkscreen CP1T-4x100GBase-QSFP28

Appearance

Figure 3-127 Appearance of the CR5D00E4NB60

Version Mapping

The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.

The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.

enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
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Indicators

Table 3-300 Indicators on the CR5D00E4NB60
Silkscreen Name Color Status Description

STATUS Running Green Blinking(0.5H The system is
status Z) running
indicator properly.

Green Blinking(2HZ) The system is
running in
alarm mode.

0 to 3 Interface Green On The link is Up.
status
indicator - Off The link is
Down.

Green Blinking Data is being
transmitted
and received.

Ports

Table 3-301 Ports on the CR5D00E4NB60
Port Connector Type Description Available
Components

0 to 3 QSFP28 Interface for 100Gbps QSFP28
inputting and Optical Module
outputting 100GE NOTE
optical signals When 80 km
optical modules
are used, the
highest short-term
operating
temperature of the
board is 45°C.

Table 3-302 Port attributes about the CR5D00E4NB60
Attributes Details

Working mode Full-duplex

Standards compliance IEEE 802.3

Frame format Ethernet_II, Ethernet_SAP and
Ethernet_SNAP

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Functions and Features

Table 3-303 Functions and features of the CR5D00E4NB60

Functions and Features Description

Basic function Provides four 100GE interfaces for line-
rate transmitting and receiving.

Reliability and availability Hot swappable

Breakout supported No

Interface rate auto-sensing supported No

FlexE supported No

Technical Specifications

Table 3-304 Technical specifications of the CR5D00E4NB60

Item Specification

Dimensions without packaging (H x W 35 mm x 193 mm x 178 mm (1.38 in. x
x D) [mm(in.)] 7.6 in. x 7.01 in.)

Weight without packaging [kg(lb)] 1.5 kg (3.31 lb)

Typical power consumption [W] 30 W

Typical heat dissipation [BTU/hour] 97.33 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

3.1.5.14.2 CR5D00LFXF60 (24-Port 10GBase LAN/WAN SFP+ Flexible
Card(CP1T,Occupy 1 sub-slot))

Overview

Table 3-305 Basic information about the CR5D00LFXF60

Item Details

Description 24-Port 10GBase LAN/WAN SFP+
Flexible Card(CP1T,Occupy 1 sub-slot)

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Item Details

Part Number 03032EFP

Model CR5D00LFXF60

Card type Flexible Board

Silkscreen CP1T-24x10GBase LAN/WAN-SFP+

Appearance

Figure 3-128 Appearance of the CR5D00LFXF60

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03032EFP&productModel=CR5D00LFXF60#matchRelation

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Indicators

Table 3-306 Indicators on the CR5D00LFXF60
Silkscreen Name Color Status Description

STA Running Green Blinking(0.5H The system is
status Z) running
indicator properly.

Green Blinking(2HZ) The system is
running in
alarm mode.

0 to 23 Interface Green On The link is Up.
status
indicator Green Blinking Data is being
transmitted
and received.

- Off The link is
Down.

Ports

Table 3-307 Ports on the CR5D00LFXF60
Port Connector Type Description Available
Components

0 to 23 SFP+ Interface for 10Gbps SFP+
inputting and Optical Module
outputting 10GE
optical signals

Table 3-308 Port attributes about the CR5D00LFXF60
Attributes Details

Working mode Full-duplex

Standards compliance IEEE 802.3

Frame format Ethernet_II, Ethernet_SAP and
Ethernet_SNAP

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Functions and Features

Table 3-309 Functions and features of the CR5D00LFXF60
Functions and Features Description

Basic function Provides twenty-four 10GE interfaces
for line-rate transmitting and
receiving.

Reliability and availability Hot swappable

Breakout supported No

Interface rate auto-sensing supported No

FlexE supported No

Technical Specifications

Table 3-310 Technical specifications of the CR5D00LFXF60
Item Specification

Dimensions without packaging (H x W 35 mm x 193 mm x 178 mm (1.38 in. x
x D) [mm(in.)] 7.6 in. x 7.01 in.)

Weight without packaging [kg(lb)] 1.5 kg (3.31 lb)

Typical power consumption [W] 36.5 W

Typical heat dissipation [BTU/hour] 118.42 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

3.1.5.14.3 CR5D00LMXB60 (48-Port 10GBase LAN/WAN QSFP+ Sharp Flexible
Card(CP1T, Occupy 1 sub-slot))

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Overview

Table 3-311 Basic information about the CR5D00LMXB60

Item Details

Description 48-Port 10GBase LAN/WAN QSFP+
Sharp Flexible Card(CP1T, Occupy 1
sub-slot)

Part Number 03032EFT

Model CR5D00LMXB60

Card type Flexible Board

Silkscreen CP1T-48x10GBase LAN/WAN-QSFP+

Appearance

Figure 3-129 Appearance of the CR5D00LMXB60

Version Mapping

The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.

The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.

enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03032EFT&productModel=CR5D00LMXB60#matchRelation

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Indicators and Buttons

Table 3-312 Indicators on the CR5D00LMXB60
Silkscreen Name Color Status Description

STATUS Running Green Blinking(0.5H The system is
status Z) running
indicator properly.

Green Blinking(2HZ) The system is
running in
alarm mode.

0 to 11 Interface Green On The link is Up.
status
indicator - Off The link is
Down.

Green Blinking Data is being
transmitted
and received.

40GE Breakout Green On The link is Up.
Breakout:0 to indicator
3 - Off The link is
Down.

Green Blinking Data is being
transmitted or
received.

Table 3-313 Buttons on the CR5D00LMXB60
Silkscreen Name Description

Breakout Indicator switching When you press the
button of interfaces that button, the channel
are broken out from an indicators stop status
interface cycling and remain in the
current status. Then,
each time you press the
button, the channel
indicators' status
switches. If you do not
press the button in 60s,
the indicators
automatically start
status cycling.

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Ports

Table 3-314 Ports on the CR5D00LMXB60

Port Connector Type Description Available
Components

0 to 11 QSFP+ Interface for 40Gbps QSFP+
inputting and Optical Module
outputting 10GE NOTE
optical signals Modules with the
BOM number of
02310WUT and
02311LVJ are not
supported.

Table 3-315 Port attributes about the CR5D00LMXB60

Attributes Details

Working mode Full-duplex

Standards compliance IEEE 802.3

Frame format Ethernet_II, Ethernet_SAP and
Ethernet_SNAP

Functions and Features

Table 3-316 Functions and features of the CR5D00LMXB60

Functions and Features Description

Basic function 1. 40*10GE line-rate configuration
principle on a subcard: Ports 10 and 11
are not used. Ports 0 to 9 are used.
Each port can provide 4*10G, meaning
a total of 40*10GE line-rate can be
provided.
2. LAN/WAN configuration principle on
a subcard: Three QSFP+ ports form a
group. For example, port numbers 0, 2,
and 4, numbers 1, 3, and 5, numbers 6,
8, and 10, and numbers 7, 9, and 11
each form a group. Each group
consists of three QSFP+ ports. A total
of twelve 10GE ports can be provided.
Each group must work in the same
mode, either LAN or WAN.

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Functions and Features Description

Reliability and availability Hot swappable

Breakout supported No

Interface rate auto-sensing supported No

FlexE supported No

Technical Specifications

Table 3-317 Technical specifications of the CR5D00LMXB60
Item Specification

Dimensions without packaging (H x W 35 mm x 193 mm x 178 mm (1.38 in. x
x D) [mm(in.)] 7.6 in. x 7.01 in.)

Weight without packaging [kg(lb)] 1.5 kg (3.31 lb)

Typical power consumption [W] 37 W

Typical heat dissipation [BTU/hour] 120.04 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

3.1.5.14.4 CR5D00N4NC60 (4-Port 100G OTN/ETH CFP4 Flexible Card(CP1T,Occupy
1 sub-slot))

Overview

Table 3-318 Basic information about the CR5D00N4NC60
Item Details

Description 4-Port 100G OTN/ETH CFP4 Flexible
Card(CP1T,Occupy 1 sub-slot)

Part Number 03032CGE

Model CR5D00N4NC60

Card type Flexible Board

Silkscreen CP1T-4xOTU4/4x100GBase CFP4

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Appearance

Figure 3-130 Appearance of the CR5D00N4NC60

Version Mapping

The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.

The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.

enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03032CGE&productModel=CR5D00N4NC60#matchRelation

Indicators

Table 3-319 Indicators on the CR5D00N4NC60

Silkscreen Name Color Status Description

STATUS Running Green Blinking(0.5H The system is
status Z) running
indicator properly.

Green Blinking(2HZ) The system is
running in
alarm mode.

0 to 3 Interface Green On The link is Up.
status
indicator - Off The link is
Down.

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Silkscreen Name Color Status Description

Green Blinking Data is being
transmitted
and received.

Ports

Table 3-320 Ports on the CR5D00N4NC60
Port Connector Type Description Available
Components

0 to 3 CFP4 Interface for 100Gbps CFP4
inputting and Optical Module
outputting 100G 100Gbps CFP4
OTN/ETH optical ETH&OTN
signals Optical Module
NOTE
When the OTN
rate is used, 100
Gbps CFP4
ETH&OTN Optical
Modules are
supported.
When the LAN rate
is used, 100 Gbps
CFP4 Optical
Modules and 100
Gbps CFP4
ETH&OTN Optical
Modules are
supported.

Table 3-321 Port attributes about the CR5D00N4NC60
Attributes Details

Working mode Full-duplex

Standards compliance IEEE 802.3

Frame format Ethernet_II, Ethernet_SAP and
Ethernet_SNAP

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Functions and Features

Table 3-322 Functions and features of the CR5D00N4NC60

Functions and Features Description

Basic function Provides four 100G OTN/ETH
interfaces for line-rate transmitting
and receiving.

Reliability and availability Hot swappable

Breakout supported No

Interface rate auto-sensing supported No

FlexE supported No

Technical Specifications

Table 3-323 Technical specifications of the CR5D00N4NC60

Item Specification

Dimensions without packaging (H x W 35 mm x 193 mm x 178 mm (1.38 in. x
x D) [mm(in.)] 7.6 in. x 7.01 in.)

Weight without packaging [kg(lb)] 3 kg (6.61 lb)

Typical power consumption [W] 80 W

Typical heat dissipation [BTU/hour] 259.55 BTU/hour

Long-term operating temperature 0 °C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

3.1.6 Fiber Breakout

This section describes breakout fibers, breakout boxes and maintenance of the
breakout fibers and boxes.

3.1.6.1 Breakout Fibers

This section describes the positioning, usage scenario, structure, and technical
specifications of breakout fibers.

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Positioning
Breakout fibers are used to flexibly allocate bandwidth resources to routers. They
cooperate with a breakout optical module to convert an MPO interface into
multiple LC interfaces to facilitate fiber layout.

Usage Scenario
The breakout function applies to a scenario where bandwidth resources are
unevenly allocated between two routers at different levels. In comparison with
breakout boxes, breakout fibers implement the following functions:
● Loosen fiber layout.
● Extend the cabling distance.

Fiber Structure
To insert a breakout optical module (multimode and short transmission distance)
into a board, use an MPO-LC fiber to directly connect the board and the optical
module.

Figure 3-131 MPO-LC fiber structure

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NO TE
When using a breakout optical fiber, insert the X1 end into a 40GE QSFP+ optical module
and the X2 end into four 10GE interfaces. If the 40GE interface is Down but the four 10GE
interfaces are Up, check the 40GE interface status.
● Check whether the 40GE interface supports the breakout function. If the 40GE interface
does not support the breakout function, replace it with another interface that supports
the breakout function.
● Check whether the 40GE interface is in the breakout state. If the 40GE interface is not in
the breakout state, configure the 40GE interface to be in the breakout state.

Technical Specifications
Table 3-324 lists the breakout fibers supported by the NE5000E.

Table 3-324 Breakout fibers supported
Type BOM Number Official Name Mode

Optical Cable 14132538 MPO12-4DLC- Single mode
Assembly,MPO/ SM-15
APC,4*DLC/
PC,Singlemode,GJ
FH
8G.657A2(LSZH),1
5m,3.5mm,8
Cores,0m/
1m,2mm

Optical Cable 14131058 SS-OP- Multimode
Parts,MPO/ MPO12-4*DLC-
PC,4DLC/PC,Multi- M-15
mode,15m,8
cores,0m/
12m,GYFH-8A1a.
2(OM3),3.5mm,2
mm,LSZH,43mm
short
MPO,Bending
insensitive

Optical Cable 14132537 SS-OP- Multimode
Parts,MPO/ MPO12-4*DLC-
PC,4DLC/PC,Multi- M-5
mode,5m,8
cores,0/1m,GJFH-
8A1a.2(OM3),3.5
mm,2mm,LSZH,43
mm Short
MPO,Bending
insensitive

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Type BOM Number Official Name Mode

Optical Cable 14132537-001 SS-OP- Multimode
Parts,MPO/ MPO12-4*DLC-
PC,4DLC/PC,Multi- M-100
mode,100m,8
cores,0/1m,GJFH-
8A1a.2(OM3),3.5
mm,2mm,LSZH,43
mm Short
MPO,Bending
insensitive

Table 3-325 lists the optical modules and boards mapping breakout fibers.

Table 3-325 Optical modules and boards mapping breakout fibers
Breakout Fiber Optical Module Board

[14132538/ [02311NUA/ ● [03032EFT/
MPO12-4DLC-SM-15] OSM010N11] Function CR5D00LMXB60]
Optical Cable Module,OSM010N11,Hig Finished
Assembly,MPO/ h Speed Transceiver,QSFP Board,NetEngine5000
APC,4*DLC/ +,1310,41.25Gbps,-8.2dB E,CR56EBMBA0,48-
PC,Singlemode,GJFH m,0.5dBm,-12.6dBm,MP Port 10GBase
8G.657A2(LSZH),15m,3.5 O,SM,10km LAN/WAN QSFP+
mm,8 Cores,0m/1m,2mm Sharp Flexible
Card(CP1T,Occupy 1
Optical Cable [02310WUU/ sub-slot)
Parts,MPO/PC,4DLC/ OMXD30010] High
PC,Multi-mode,15m,8 Speed Transceiver,QSFP ● [03031XCM/
cores,0m/ +,850nm,41.25Gbps,-7.6d CR5D00EDNB60] 16-
12m,GYFH-8A1a.2(OM3) Bm,-1dBm,-9.5dBm,MPO, Port 100GBase-
,3.5mm,2mm,LSZH,43m MMF,0.15km QSFP28 Integrated
m short MPO,Bending Line Process Unit
insensitive (NE5000E LPUI-2T)

Optical Cable
Parts,MPO/PC,4DLC/
PC,Multi-mode,5m,8
cores,0/1m,GJFH-8A1a.2(
OM3),3.5mm,2mm,LSZH,
43mm Short
MPO,Bending insensitive

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Breakout Fiber Optical Module Board

Optical Cable
Parts,MPO/PC,4DLC/
PC,Multi-mode,100m,8
cores,0/1m,GJFH-8A1a.2(
OM3),3.5mm,2mm,LSZH,
43mm Short
MPO,Bending insensitive

NO TE
Characters in the brackets indicate the BOM number and official name that are separated
using a slash ("/") in the [BOM number/Official name] format.

3.1.6.2 Breakout Boxes

This section describes breakout boxes.

3.1.6.2.1 Product Overview

This section describes the positioning, features, and usage scenarios of breakout
boxes.

Positioning

Breakout boxes are used to flexibly allocate bandwidth resources to routers. They
cooperate with a breakout optical module and optical jumper to convert an MPO
interface into multiple LC interfaces to facilitate fiber layout.

Product Features
● LC interfaces support automatic dust-proof covers, and MPO interfaces
support dust-proof plugs.
● In comparison with breakout fibers (MPO-LC fibers), breakout boxes feature
more flexible fiber layout.
● There is no restriction on the installation direction of breakout boxes, so that
the breakout boxes can be installed positively or negatively as needed.

Usage Scenario

The breakout function applies to a scenario where bandwidth resources are
unevenly allocated between two routers at different levels. In comparison with
breakout fibers, breakout boxes implement the following functions:
● Increase the density of fiber layout.
● Shorten the cabling distance.

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Figure 3-132 Breakout box cabling

3.1.6.2.2 10-Port-MPO-12-40-Port-LC-Breakout Box(single-mode)
This section describes the appearance, components, MPO-12 jumper, and technical
specifications of this product.

Appearance

Figure 3-133 10-Port-MPO-12-40-Port-LC-Breakout Box(single-mode)

Components

Figure 3-134 10-Port-MPO-12-40-Port-LC-Breakout Box(single-mode)

1. MPO adapter 2. LC adapter 3. Mounting ear

MPO adapters map LC adapters according to their numbers displayed on the
panel. Figure 3-135 shows the mapping between MPO and LC adapters.

Figure 3-135 Mapping between MPO and LC adapters

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MPO-12 Jumper
The TYPE-B MPO jumper is used. The following figure shows the MPO-12 jumper
structure and line orders of X1 and X2 ports.

Table 3-326 describes the mappings between the lanes of the X1 and X2 ports.

Table 3-326 Mappings between the lanes of the X1 and X2 ports

Start End Start End

X1-1 X2-12 X1-7 /

X1-2 X2-11 X1-8 /

X1-3 X2-10 X1-9 X2-4

X1-4 X2-9 X1-10 X2-3

X1-5 / X1-11 X2-2

X1-6 / X1-12 X2-1

NO TE

If the pin assignment sequence of connector X1 is the same as that of connector X2, the
connection type is A. If the pin assignment sequence of connector X1 is reverse to that of
connector X2, the connection type is B. For example, the connection type of MPO-12
Jumper is B (Key Up/Key Up).

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Technical Specifications

Table 3-327 Technical specifications of the 10-Port-MPO-12-40-Port-LC-Breakout
Box (single-mode)
Item Description

BOM Number 02082890

Official Name ODBS10040

Dimensions (H x W x D) 43.6 mm x 442 mm x 164 mm

Mounting ear 19-inch supported

Weight 2.3 kg

Insertion loss ≤ 0.75 db

Return loss Single-mode: ≥ 30 db

Operating temperature –40°C to +65°C

Storage temperature –40°C to +70°C

Relative operating humidity ● Long term: 5% RH to 85% RH, non-
condensing
● Short term: 5% RH to 95% RH,
non-condensing

Relative storage humidity 0% RH to 95% RH, non-condensing

Table 3-328 Optical modules, jumpers, and boards supported by the 10-Port-
MPO-12-40-Port-LC-Breakout Box (single-mode)
Optical Module MPO-MPO Fiber Board

[02311NUA/ [14134759/MPO12- [03032EFT/
OSM010N11] Function MPO12-SM-10] Optical CR5D00LMXB60]
Module,OSM010N11,Hig Cable Parts,MPO/ Finished
h Speed Transceiver,QSFP APC,MPO/APC,Single Board,NetEngine5000E,C
+,1310,41.25Gbps,-8.2dB mode,10m,8 R56EBMBA0,48-Port
m,0.5dBm,-12.6dBm,MP cores,GJFH-8G.657A2,3.5 10GBase LAN/WAN QSFP
O,SM,10km mm,LSZH,43mm Short + Sharp Flexible
MPO,Bending insensitive Card(CP1T,Occupy 1 sub-
slot)

3.2 NE5000E Cluster Hardware Description

3.2.1 NE5000E Cluster

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3.2.1.1 Overview
The Huawei NetEngine5000E Core Router (NE5000E), which has large capacity
and high performance, is developed to meet the requirement of carrier-class
reliability. Based on the powerful versatile routing platform (VRP), the NE5000E
provides strong switching capabilities, dense ports, and high reliability. NE5000Es
mainly serve as super-core nodes on carriers' backbone networks, core nodes on
metropolitan area networks (MANs), egresses in large-scale Internet data centers
(IDCs), or core nodes on large-scale enterprise networks.
NE5000E clusters are positioned as super-core nodes on backbone networks,
supporting Layer 3 routing and Multiprotocol Label Switching (MPLS) forwarding.
In an NE5000E cluster, a cluster central chassis functions as a level-2 switching
module and routing engine module in a three-stage switch fabric; a cluster line-
card chassis (CLC) functions as a level-1 or level-3 switching module and
forwarding module.
● NE5000E CCC
An NE5000E CCC supports 400G clusters.

● NE5000E CCC-A
An NE5000E CCC-A supports 400G clusters, 1T clusters and larger-capacity
clusters to be developed.

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● NE5000E-X16A CLC
An NE5000E-X16A CLC provides 16 LPU slots. Its forwarding capacity is 12.8 T
when the maximum number of 400G boards are equipped. Its forwarding
capacity is 32 T when the maximum number of 1T boards are equipped.

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● NE5000E-X16B CLC
An NE5000E-X16B CLC provides 16 LPU slots. Its forwarding capacity is 12.8 T
when the maximum number of 400G boards are equipped. Its forwarding
capacity is 25.6 T when the maximum number of 1T boards are equipped. Its
forwarding capacity is 51.2 T when the maximum number of 2T boards are
equipped. An NE5000E-X16B does not have the cluster capability.

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● NE5000E-20 CLC
An NE5000E-20 CLC provides 20 LPU slots.
Its forwarding capacity is 64T when the maximum number of 1.6T boards are
equipped.

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Table 3-329 lists the NE5000E cluster models.

Table 3-329 NE5000E cluster models
Cluster Model Description

CCC-0 Consists of two CLCs.
The CLCs can be both NE5000E-X16As, both NE5000E-20s, or a
combination of NE5000E-X16As, and NE5000E-20s.

CCC-2 Consists of two NE5000E CCCs or NE5000E CCC-A and
N(N<=8) CLCs.
The CLCs can be all NE5000E-X16As, all NE5000E-20s, or a
combination of NE5000E-X16As, and NE5000E-20.

An NE5000E series router can be an NE5000E-X16A single chassis, an NE5000E-
X16B single chassis, an NE5000E-20 single chassis, or an NE5000E cluster.

3.2.1.2 NE5000E Single-chassis

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3.2.1.2.1 NE5000E-X16A Chassis
This section describes the system overview.
The router of the NE5000E-X16A series uses a centralized routing engine and a
distributed forwarding architecture. This helps to provide rich and flexible service
and to perform large-capacity forwarding.
The NE5000E-X16A uses an integrated chassis, and the main components all
support hot swapping.
As shown in Figure 3-136, the NE5000E-X16A has 16 LPU slots. The NE5000E-
X16A supports all the Line Processing Units (LPUs) on the NE5000E, but uses new
Main Processing Units (MPUs) and Switch and Fabric Units (SFUs).

Figure 3-136 Appearance of the NE5000E-X16A

Boards Supported by an NE5000E-X16A
The NE5000E-X16A supports 400G and 1T platforms. The following table lists
boards supported by an NE5000E-X16A.

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Table 3-330 Boards supported by an NE5000E-X16A
Board Type 400G Platform 1T Platform

MPUB5 MPUB6
(CR5D0MPUB560) (CR5D0MPUB660)
MPU
MPUB6
(CR5D0MPUB660)

SFU400A(CR5DSFUIK06A SFU1TE(CR5DSFUIT06E)
) used for CLC used for CLC
SFU
SFU400B(CR5DSFUIK06B SFU1TH(CR5DSFUIT06H)
) used for cluster used for cluster

3.2.1.2.2 NE5000E-20 Chassis
This section describes the system overview.
The router of the NE5000E-20 series uses a centralized routing engine and a
distributed forwarding architecture. This helps to provide rich and flexible service
and to perform large-capacity forwarding.
The NE5000E-20 uses an integrated chassis, and the main components all support
hot swapping.
As shown in Figure 3-137, the NE5000E-20 has 20 LPU slots.

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Figure 3-137 Appearance of the NE5000E-20

Boards Supported by an NE5000E-20

The NE5000E-20 supports 1.6Tplatform. The following table lists boards supported
by an NE5000E-20.

Table 3-331 Boards supported by an NE5000E-20

Board Type 1.6T Platform

MPUN1 (CR5D0MPUN160)
MPU
MPUQ1 (CR5D0MPUQ1D1)

SFU1T6D (CR5DSFUIT260) used for CLC
SFU
SFUI1T6H (CR5DSFUIT26H) used for cluster

3.2.1.3 CCC-0 System

This section describes the CCC-0 system.

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3.2.1.3.1 Overview
This section provides an overview of the CCC-0 system including a description of
the boards that the CCC-0 system supports.

Introduction to the CCC-0 System
The CCC-0 system is also known as a back-to-back (BTB) system. It uses a single
chassis hardware structure and consists of two CLCs.
In a CCC-0 system, one CLC is the master chassis, and the other CLC is the slave
chassis.
The CLC with chassis ID 1 (CLC1) is the master chassis, whereas the CLC with
chassis ID 2 (CLC2) is the slave chassis. The master chassis centrally manages all
devices in the system. By default, the master MPU on the master chassis is the
CCC-0 system's master MPU (that is, system master). All components of the
master and slave chassis, such as boards, power modules, and fan modules, must
register with the master MPU.

NO TE

The two NE5000E-20s or NE5000E-X16As support master/slave inter-chassis deployment in
a CCC-0 system.
● If fast detection cables between two CLCs are correctly connected and the MPUs of the
two CLCs have the same memory size, the CCC-0 system supports master/slave inter-
chassis deployment by default and the inter-chassis master/slave switchover.
● If fast detection cables between two CLCs are incorrectly connected or the MPU memory
sizes of the two CLCs are different, the CCC-0 system does not support inter-chassis
deployment. Instead, the system automatically switches to intra-chassis deployment
where the master and slave MPUs of the CCC-0 system are on the same chassis and
inter-chassis switchover is not supported.

CCC-0 System Models
A CCC-0 system can consist of two NE5000E-X16As, two NE5000E-20s, one
NE5000E-20 and one NE5000E-X16A.

NO TICE

When a CCC-0 system consists of one NE5000E-20 and one NE5000E-X16A, the
NE5000E-20 must be the master chassis. When a CCC-0 system consists of one
NE5000E-X16A, either of them can be the master or slave chassis.

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Figure 3-138 CCC-0
system consisting of two
1.6T NE5000E-20s

Figure 3-139 CCC-0 system consisting of one NE5000E-20 and one NE5000E-X16A

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Figure 3-140 CCC-0 system consisting of two NE5000E-X16As

Boards Supported by a CCC-0 System
In a CCC-0 system, the NE5000E-20 and NE5000E-X16A support different MPUs
and SFUs. The following table lists the boards supported by them in a CCC-0
system.

Table 3-332 Boards and cascading optical fibers supported by an NE5000E-20 and
NE5000E-X16A in a CCC-0 system
Device Model MPU SFU OFC Cascading
Optical Fiber

400G MPUB5(CR5D SFUI-400- OFC400B 24-core CXP
NE5000E- 0MPUB560) B(CR5DSFUIK
X16A MPUB6(CR5D 06B)
0MPUB660)

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Device Model MPU SFU OFC Cascading
Optical Fiber

1T NE5000E- MPUB6(CR5D SFUI-1T- OFC1TB 24-core CXP2
X16A 0MPUB660) H(CR5DSFUIT
06H)

1.6T MPUN1(CR5D SFUI-1T6- OFC2TB 24-core CXP2
NE5000E-20 0MPUN160) H(CR5DSFUIT OFC1T6F
MPUQ1(CR5D 26H)
0MPUQ1D0)

3.2.1.3.2 Inter-chassis Connections in a CCC-0 System
This section describes inter-chassis connections of control channels and data
forwarding channels in a CCC-0 system.

Inter-chassis Interconnection between 1.6T NE5000E-20s
The general rule of inter-chassis interconnection in a CCC-0 system is that the
interfaces on two NE5000E-20s can be interconnected only when they have the
same SFU slot ID, OFC ID, and port number.

NO TE

If both CLCs in a CCC-0 system are NE5000E-20s, the CCC-0 system supports fast inter-chassis
switchover upon detecting that the FAST0 and FAST1 channels between the CLCs are both
connected.
Inter-chassis interconnections in CCC-0 include control channel connection and
data forwarding channel connection:
● Control channel connection: GE/10GE interfaces on each MPU of each
NE5000E-20 are used for multi-chassis cascading.
● Data forwarding channel connection: The interfaces with the same SFU slot
ID, OFC ID, and port number on the two NE5000E-20s are interconnected.
The following figure uses OFC 0 on the SFU in slot 30 as an example. The
connections of the other SFUs are the same.

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Figure 3-141 Inter-chassis interconnection between 1.6T NE5000E-20s

Inter-chassis Interconnection between a 1.6T NE5000E-20 and a 1T/400G
NE5000E-X16A
When a CCC-0 system consists of one 1.6T NE5000E-20 and one 1T NE5000E-
X16A, the NE5000E-20 must be the master chassis, and the 400G NE5000E-X16A
must be the slave chassis.
Inter-chassis interconnections in CCC-0 include control channel connection and
data forwarding channel connection:
● Control channel connection: GE/10GE interfaces on each MPU of the
NE5000E-20 and those on the NE5000E-X16A are used for multi-chassis
cascading.
● Data forwarding channel connection: Each OFC on the master chassis provides
six optical fiber interfaces (numbered 0, 1, 2, 4, 5, and 6) to connect to the
slave chassis. Each SFU on the master chassis provides 12 optical fibers to
connect to an OFC on the slave chassis.
The following figure uses OFC 1 on the SFU in slot 22 as an example. The
connections of the other SFUs are the same.

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Figure 3-142 Inter-chassis interconnection between a 1.6T NE5000E-20 and a 1T
NE5000E-X16A

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Figure 3-143 Inter-chassis interconnection between a 1.6T NE5000E-20 and a
400G NE5000E-X16A

Both CLCs Being 1T NE5000E-X16As
The general rule of interconnection between CCC-0 clusters: Two NE5000E-X16A
interfaces with identical serial numbers connect. In this case, identical serial
numbers refer to identical slot, daughter card, and interface serial numbers.

NO TE

When a 1T NE5000E-X16A and a 400G NE5000E-X16A are interconnected to form a CCC-0
system, the 1T NE5000E-X16A is in chassis 1 and the 400G NE5000E-X16A is in chassis 2. The 1T
NE5000E-X16A uses the CR5D0MPUB660 with 32 GB memory, whereas the 400G NE5000E-X16A
uses the CR5D0MPUB560 with 8 GB memory. Because the memory sizes of the MPUs on the
two CLCs are different, inter-chassis switchover is not supported. As a result, there is no need for
a quick switchover cable.
Interconnection between CCC-0 clusters includes control tunnel interconnection
and data transmission tunnel interconnection
● In the control tunnel connection method shown below, the GE/10GE interface
on the MPU of the NE5000E-X16A is used in chassis cascading.
● The data transmission tunnel connection method shown below also adheres
to the principle of connection between NE5000E-X16A interfaces with
identical serial numbers. Each color corresponds to a connection between
interfaces with the same serial number.
In this situation, OFC 0 on the SFU in slot 22 is used as an example. The
connections on the other SFUs are the same as those in the example.

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Figure 3-144 Interconnection between 1T NE5000E-X16A chassis

Interconnection Between a 1T NE5000E-X16A and a 400G NE5000E-X16A
NO TE

When a 1T NE5000E-X16A and a 400G NE5000E-X16A are interconnected to form a CCC-0
system, the 1T NE5000E-X16A is in chassis 1 and the 400G NE5000E-X16A is in chassis 2.
The 1T NE5000E-X16A uses the CR5D0MPUB660 with 32 GB memory, whereas the 400G
NE5000E-X16A uses the CR5D0MPUB560 with 8 GB memory. Because the memory sizes of
the MPUs on the two CLCs are different, inter-chassis switchover is not supported. As a
result, there is no need for a quick switchover cable.
The general rule of interconnection between CCC-0 clusters: Two NE5000E-X16A
interfaces with identical serial numbers connect. In this case, identical serial
numbers refer to identical slot, daughter card, and interface serial numbers.
Interconnection between CCC-0 clusters includes control tunnel interconnection
and data transmission tunnel interconnection:
● In the control tunnel connection method shown below, the GE/10GE interface
on the MPU of the NE5000E-X16A is used in chassis cascading.
● The data transmission tunnel connection method shown below also adheres
to the principle of connection between NE5000E-X16A interfaces with
identical serial numbers. Each color corresponds to a connection between
interfaces with the same serial number.
In this situation, OFC 0 on the SFU in slot 22 is used as an example. The
connections on the other SFUs are the same as those in the example.

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Figure 3-145 Interconnection between a 1T NE5000E-X16A and a 400G NE5000E-
X16A

Both CLCs Being 400G NE5000E-X16As
The general rule for inter-chassis connections in the CCC-0 system is that the
interfaces with the same SFU slot, OFC, and interface numbers on the two
NE5000E-X16As are interconnected.
Inter-chassis connections in CCC-0 include control channels and data forwarding
channels, as shown in Figure 3-146.

NO TE

A CCC-0 system with two NE5000E-X16As supports inter-chassis fast switchover when all FAST0
and FAST1 interfaces are connected as follows.
● An NE5000E-X16A uses GE/10GE interfaces on MPUs to connect to the other
chassis, and four MPUs use GE/10GE interfaces for interconnection over
control channels.
● The general rule for data forwarding channel connection is the same as that
for control channel connection.
In this situation, OFC 0 on the SFU in slot 22 is used as an example. The
connections on the other SFUs are the same as those in the example.

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Figure 3-146 Inter-chassis connections

3.2.1.4 CCC-2 System
This section describes a CCC-2 system.

3.2.1.4.1 Overview of CCC-2 consisting of 400G CCCs
This section describes the forms of CCC-2 systems consisting of 400G CCCs.

System Introduction
In a 400G CCC-2 system, each CCC is 400G.

NO TE

To expand an existing CCC-2 to a 400G CCC-2, replace existing boards on CCCs with 400G
boards, without replacing CCC chassis.
In a CCC-2 system, all CCCs must use the same type of SFUs
A 400G CCC-2 system consists of two CCCs. In a CCC-2 system, the two CCCs
connect to all CLCs (including control channels and data forwarding channels).
Figure 3-147 shows components of a CCC.

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Figure 3-147 Components of a 400G CCC

1. MPUA6s 2. SFUF400Ds 3. Front fan 4. OFC400D
module

5. ICUA1s 6. Cable trough 7. Air intake vent 8. Power module

9. Air exhaust vent 10. Filler panel on 11. Filler panel on -
the rear fan an SFU
module

Each 400G CCC-2 consists of a maximum of four 400G CLCs.CLCs can be NE5000E-
X16s and X16As. In a 400G CCC-2 system, both NE5000E-X16s and NE5000E-
X16As can be used.

CCC-2 System Models
A CCC-2 system can consist of only NE5000E-X16s, only NE5000E-X16As, both
NE5000E-X16s and NE5000E-X16As.

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Figure 3-148 CCC-2 system consisting of NE5000E-X16As

Figure 3-149 CCC-2 system consisting of NE5000E-X16s and NE5000E-X16As

Figure 3-150 CCC-2 system consisting of NE5000E-X16s

3.2.1.4.2 Inter-chassis Connections in a CCC-2 System That Consists of 400G CCCs
This section describes inter-chassis connections of control channels and data
forwarding channels in a CCC-2 system that consists of 400G CCCs.

Overview
NO TE

● To expand an existing CCC to a 400G CCC, replace the CCC boards with 400G boards.
Board replacement involves MPUs, ICUs, SFUs, and OFCs on the existing CCC. The
existing 8000 W power modules and front fan modules on the original CCC remain in
use, and existing rear SFUs and fan module must be removed.
● Each 400G CCC must be equipped with a maximum of eight SFUF400Ds even if a CCC-2
system has vacant slots for CLCs.
● Only a single ICU can be equipped on each CCC of a CCC-2 system.
Inter-chassis connections in a 400G CCC-2 system include control channels and
data forwarding channels:

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● Control channel connection is implemented by connecting the ICU on the CCC
to the MPU on a CLC.
● Data forwarding channel connection is implemented by connecting the
SFUF400D on the CCC to the SFU on a CLC.

3.2.1.4.3 CCC-2 System Consisting of 400G/1T CCC-As
This section describes a CCC-2 system containing a CCC-A.

System Introduction
A CCC-2 system consists of two CCCs and a maximum of eight CLCs. In a CCC-2
system, one CCC-A connects to all CLCs (including control channels and data
forwarding channels). CLCs can be NE5000E-X16As, NE5000E-20s, or a mix of
them.
The CCC-2 uses level-1, level-2, and level-3 switching networks. A CLC provides
LPUs and level-1 and level-3 switching networks; A CCC provides a level-2
switching network. The CCC-2 system connects the SFUs on the NE5000E-X16A to
the SFUs on the CCC through high-density optical fibers, forming a Level 3
switching network. External super five category network cables are used to
connect the ICUs on the CCC and the cascading interfaces of the MPUs on the
CLCs to form a centralized control plane. The Stratum 3 clocks of all CLCs must
synchronize with an external BITS clock.

NO TE

In a CCC-2 system, all CCCs must use the same type of SFUs

CCC-2 System Models
A CCC-2 system consisting of CCC-As is formed with the following models:
● Connection between the NE5000E-X16A and NE5000E-X16A
● Connection between the NE5000E-20 and NE5000E-20, or connection
between the NE5000E-20 and NE5000E-X16A
Because an NE5000E-20 occupies two CLCs, a CCC-2 system supports a maximum
of four NE5000E-20 CLCs.

Figure 3-151 Both CLCs being NE5000E-X16As

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Figure 3-152 Both CLCs being NE5000E-20s

Boards Supported by a CCC-2 System

NO TICE

● When an NE5000E CCC-A is upgraded to a 400G&1T hybrid cluster, the 1T SFU
supports 400G OFCs. A 400G OFC can be installed only in slot OFC1.

In a CCC-2 system, the CCC-A, and NE5000E-X16A and NE5000E-20 support
different MPUs and SFUs. The following table lists the boards supported by them
in a CCC-2 system.

Table 3-333 Boards supported by the CCC-A, and NE5000E-X16A

Chassis Type Board Type 400G Platform 1T Platform

NE5000E CCC-A MPU MPUB(CR5D0MPU MPUA7(CR5D0MP
B550) UA750)
MPUA8(CR5D0MP
UA850)

SFU SFUF400A(CR5DSF SFUF1T(CR5DSFUF
UFK050) T050)

OFC OFC400A OFC1TA
OFC400A(The
OFC400A can only
be installed in the
OFC1 slot)

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Chassis Type Board Type 400G Platform 1T Platform

Cascading 24 cores 24 cores/24 cores
optical fiber CXP2

NE5000E-X16A MPU MPUB(CR5D0MPU MPUB(CR5D0MPU
CLC B560) B560)
MPUB6(CR5D0MP MPUB6(CR5D0MP
UB661) UB661)

SFU SFUI-400- SFUI-400-
B(CR5DSFUIK06B) B(CR5DSFUIK06B)
SFUI-1T-
H(CR5DSFUIT06H)

OFC OFC400B OFC400B/OFC1TB

Cascading 24 cores 24 cores/24 cores
optical fiber CXP2

Table 3-334 Boards supported by the NE5000E-20
Chassis Board 400G Platform 1T Platform 1.6T Platform
Type Type

NE5000E-2 MPU - MPUN1(CR5D0M MPUN1(CR5D0
0 CLC PUN160) MPUN160)
MPUQ1(CR5D0M MPUQ1(CR5D0
PUQ1D0) MPUQ1D0)

SFU - SFUI-1T6- SFUI-1T6-
H(CR5DSFUIT26 H(CR5DSFUIT2
H) 6H)

OFC - OFC2TB OFC2TB

Cascading - 24 cores CXP2 24 cores CXP2
optical
fiber

3.2.1.4.4 Inter-chassis Connections in a CCC-2 System Consisting of 400G/1T CCC-As
This section describes inter-chassis connections of control channels and data
forwarding channels in a CCC-2 system.

Overview
Inter-chassis connections in a CCC-2 system include control channels and data
forwarding channels.
● Control channel connection is implemented by connecting the ICU on the CCC
to the MPU on a CLC.

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● Data forwarding channel connection is implemented by connecting the SFU
on the CCC to the SFU on a CLC.

NO TICE

When a CCC-A is used and CLCs are not fully configured in a CCC-2 system,
the SFUs and OFCs on the CCC-A can be configured based on the actual
requirements, but not necessarily be fully configured.
One ICU is required on the CCC-A in the CCC-2 system. If two ICUs are
installed, the one that is installed later cannot register.
When the CCC-2 system is equipped with two CCC-As, each CCC-A requires
the master and slave MPUs.

Control Channel Connections - 400G/1T Cluster
● Any same type interface of the ICU on each CCC-A is connected to the ICU
and MPU on the other CCC-A.If the ICU in slot 22 is used, the MPU in slot 20
must be connected to the ICU in CCC-2. The MPU is connected to the ICU
through GE/10GE interfaces. Using the ICU in slot 19 is recommended.
● When an NE5000E-X16A functions as the CLC, the cascading interfaces on the
MPU of the CLC are connected to any interface numbered 6 to 13 on the ICUs
of CCC1 and CCC2.The two fast switchover interfaces on each MPU of the CCC
master chassis are connected to the fast switchover interfaces on the two
MPUs of the CCC slave chassis respectively. The cable connections are shown
by the yellow lines in Figure 3-153.
Figure 3-153 and Figure 3-154 show inter-chassis control channel connections.

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Figure 3-153 Inter-chassis control channel connections - 400G or 800G Cluster

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Figure 3-154 Inter-chassis control channel connections - 1T Cluster

Data Forwarding Channel Connections - 400G Cluster
● Data forwarding channel connections in a half-fabric connect mode
The 400G NE5000E CCC-A supports up to four 400G NE5000E-X16A
CLCFigure 3-156 shows data forwarding channel connections in half-fabric
connect mode. Only slots 2, 4, 6, 8, 11, 13, 15, and 17 are used on the
NE5000E CCC-A.
– OFC0 in slot 19 on the CLC is connected to the boards in slots 2 and 4 on
CCC1, and OFC1 is connected to the boards in slots 6 and 8 on CCC1.
– OFC0 in slot 20 on the CLC is connected to the boards in slots 11 and 13
on CCC1, and OFC1 is connected to the boards in slots 15 and 17 on
CCC1.

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– OFC0 in slot 21 on the CLC is connected to the boards in slots 2 and 4 on
CCC2, and OFC1 is connected to the boards in slots 6 and 8 on CCC2.
– OFC0 in slot 22 on the CLC is connected to the boards in slots 11 and 13
on CCC2, and OFC1 is connected to the boards in slots 15 and 17 on
CCC2.

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Figure 3-155 Data forwarding channel connections in a half-fabric connect
mode

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Figure 3-156 Data forwarding channel connections in a half-fabric connect
mode

● Data forwarding channel connections in a full-fabric connect mode
The 400G NE5000E CCC-A supports up to eight 400G NE5000E-X16A
CLCFigure 3-157 shows data forwarding channel connections in a full-fabric

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connect mode. The boards in slots 5 and 14 on the NE5000E CCC-A are not
used.
– OFC0 in slot 19 on the CLC is connected to the boards in slots 1, 2, 3, and
4 on CCC1, and OFC1 is connected to the boards in slots 6, 7, 8, and 9 on
CCC1.
– OFC0 in slot 20 on the CLC is connected to the boards in slots 10, 11, 12,
and 13 on CCC1, and OFC1 is connected to the boards in slots 15, 16, 17,
and 18 on CCC1.
– OFC0 in slot 21 on the CLC is connected to the boards in slots 1, 2, 3, and
4 on CCC2, and OFC1 is connected to the boards in slots 6, 7, 8, and 9 on
CCC2.
– OFC0 in slot 22 on the CLC is connected to the boards in slots 10, 11, 12,
and 13 on CCC2, and OFC1 is connected to the boards in slots 15, 16, 17,
and 18 on CCC2.

Figure 3-157 Data forwarding channel connections in a full-fabric connect
mode

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Data Forwarding Channel Connections - 1T Cluster
● Data forwarding channel connections in a half-fabric connect mode
The 1T NE5000E CCC-A supports up to two 1.6T NE5000E-20 CLC, four 1T
NE5000E-X16A CLC and 400G NE5000E-X16A CLC. The CCCs can be connected
to NE5000E-20, NE5000E-X16A CLCs in hybrid mode. An NE5000E-20 CLC
occupies two CLCs. Figure 3-158 shows data forwarding channel connections
when the CCCs in half-fabric optical fiber mode are connected to the
NE5000E-X16A CLCs. Only slots 2, 4, 6, 8, 11, 13, 15, and 17 are used on the
NE5000E CCC-A.
– OFC0 in slot 19 on the CLC is connected to the boards in slots 2 and 4 on
CCC1, and OFC1 is connected to the boards in slots 6 and 8 on CCC1.
– OFC0 in slot 20 on the CLC is connected to the boards in slots 11 and 13
on CCC1, and OFC1 is connected to the boards in slots 15 and 17 on
CCC1.
– OFC0 in slot 21 on the CLC is connected to the boards in slots 2 and 4 on
CCC2, and OFC1 is connected to the boards in slots 6 and 8 on CCC2.
– OFC0 in slot 22 on the CLC is connected to the boards in slots 11 and 13
on CCC2, and OFC1 is connected to the boards in slots 15 and 17 on
CCC2.

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Figure 3-158 Data forwarding channel connections when the CCCs in half-
fabric optical fiber mode are connected to the NE5000E-X16A CLCs

Figure 3-159 shows data forwarding channel connections when the CCCs in
half-fabric optical fiber mode are connected to the NE5000E-20 CLCs. Only
slots 2, 4, 6, 8, 11, 13, 15, and 17 are used on the NE5000E CCC-A:

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– OFC0 in slot 23 on the CLC is connected to the board in slot 4 on CCC1,
and OFC1 is connected to the board in slot 2 on CCC1.
– OFC0 in slot 24 on the CLC is connected to the board in slot 6 on CCC1,
and OFC1 is connected to the board in slot 8 on CCC1.
– OFC0 in slot 25 on the CLC is connected to the board in slot 13 on CCC1,
and OFC1 is connected to the board in slot 11 on CCC2.
– OFC0 in slot 26 on the CLC is connected to the board in slot 15 on CCC1,
and OFC1 is connected to the board in slot 17 on CCC2.
– OFC0 in slot 27 on the CLC is connected to the board in slot 4 on CCC2,
and OFC1 is connected to the board in slot 2 on CCC1.
– OFC0 in slot 28 on the CLC is connected to the board in slot 6 on CCC2,
and OFC1 is connected to the board in slot 8 on CCC1.
– OFC0 in slot 29 on the CLC is connected to the board in slot 13 on CCC2,
and OFC1 is connected to the board in slot 11 on CCC2.
– OFC0 in slot 30 on the CLC is connected to the board in slot 15 on CCC2,
and OFC1 is connected to the board in slot 17 on CCC2.

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Figure 3-159 Data forwarding channel connections when the CCCs in half-
fabric optical fiber mode are connected to the NE5000E-20 CLCs

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Figure 3-160 shows the data forwarding channel connections when the CCCs
in half-fabric fiber mode are connected to NE5000E-20, NE5000E-X16A CLCs
in hybrid mode.

Figure 3-160 Data forwarding channel connections when the CCCs in half-
fabric fiber mode are connected to NE5000E-20, NE5000E-X16A CLCs in
hybrid mode

NO TE

● The connections of the 1T NE5000E-X16A, 400G NE5000E-X16A are the same. The
difference is that different CXP cascading optical fibers are used by the 400G and
1T CLCs.
● The 1T SFU supports 400G OFCs. A 400G OFC can be installed only in slot OFC1.
● Data forwarding channel connections in a full-fabric connect mode
The 1T NE5000E CCC-A supports up to four 1.6T NE5000E-20 CLC, eight 1T
NE5000E-X16A CLC, 400G NE5000E-X16A CLC (the number of 400G CLC or 1T
CLC is not restricted). Figure 3-161 shows data forwarding channel
connections when the CCCs in full-fabric optical fiber mode are connected to
the NE5000E-X16A CLCs. The boards in slots 5 and 14 on the NE5000E CCC-A
are not used.
– OFC0 in slot 19 on the CLC is connected to the boards in slots 1, 2, 3, and
4 on CCC1, and OFC1 is connected to the boards in slots 6, 7, 8, and 9 on
CCC1.
– OFC0 in slot 20 on the CLC is connected to the boards in slots 10, 11, 12,
and 13 on CCC1, and OFC1 is connected to the boards in slots 15, 16, 17,
and 18 on CCC1.

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– OFC0 in slot 21 on the CLC is connected to the boards in slots 1, 2, 3, and
4 on CCC2, and OFC1 is connected to the boards in slots 6, 7, 8, and 9 on
CCC2.
– OFC0 in slot 22 on the CLC is connected to the boards in slots 10, 11, 12,
and 13 on CCC2, and OFC1 is connected to the boards in slots 15, 16, 17,
and 18 on CCC2.

Figure 3-161 Data forwarding channel connections when the CCCs in full-
fabric optical fiber mode are connected to the NE5000E-X16A CLCs

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Figure 3-162 shows data forwarding channel connections when the CCCs in
full-fabric optical fiber mode are connected to the NE5000E-20 CLCs. The
boards in slots 5 and 14 on the NE5000E CCC-A are not used:
– OFC0 in slot 23 on the CLC is connected to the boards in slots 1 and 2 on
CCC1, and OFC1 is connected to the boards in slots 3 and 4 on CCC1.
– OFC0 in slot 24 on the CLC is connected to the boards in slots 6 and 7 on
CCC1, and OFC1 is connected to the boards in slots 8 and 9 on CCC1.
– OFC0 in slot 25 on the CLC is connected to the boards in slots 12 and 13
on CCC1, and OFC1 is connected to the boards in slots 10 and 11 on
CCC1.
– OFC0 in slot 26 on the CLC is connected to the boards in slots 15 and 16
on CCC1, and OFC1 is connected to the boards in slots 17 and 18 on
CCC1.
– OFC0 in slot 27 on the CLC is connected to the boards in slots 1 and 2 on
CCC2, and OFC1 is connected to the boards in slots 3 and 4 on CCC1.
– OFC0 in slot 28 on the CLC is connected to the boards in slots 6 and 7 on
CCC2, and OFC1 is connected to the boards in slots 8 and 9 on CCC1.
– OFC0 in slot 29 on the CLC is connected to the boards in slots 12 and 13
on CCC2, and OFC1 is connected to the boards in slots 10 and 11 on
CCC1.
– OFC0 in slot 30 on the CLC is connected to the boards in slots 15 and 16
on CCC2, and OFC1 is connected to the boards in slots 17 and 18 on
CCC1.

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Figure 3-162 Data forwarding channel connections when the CCCs in full-
fabric optical fiber mode are connected to the NE5000E-20 CLCs

Figure 3-163 shows the data forwarding channel connections when the CCCs
in full-fabric fiber mode are connected to NE5000E-20, NE5000E-X16A CLCs in
hybrid mode.

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Figure 3-163 Data forwarding channel connections when the CCCs in full-
fabric fiber mode are connected to NE5000E-20, NE5000E-X16A CLCs in
hybrid mode

3.2.1.4.5 Overview of a CCC-2 System with 1T CCC-As
This section describes the forms of CCC-2 systems with 1T CCC-As.

System Overview
A CCC-2 system consists of two CCCs and a maximum of eight CLCs. Because an
NE5000E-20 occupies the places of two CLCs, a CCC-2 system can consist of a
maximum of only four NE5000E-20 CLCs. A CCC connects to all CLCs (over data
forwarding channels and control channels). CLCs can be NE5000E-X16As,
NE5000E-20s, or a mix of both.
A CCC-2 system involves three levels of switched networks. The CLCs provide LPUs
as well as the level-1 and level-3 switched networks, whereas the CCCs provide
the level-2 switched network. In a CCC-2 system, the SFUs on CLCs connect to
those on CCCs through high-density optical cables to form the level-3 switched
network. The cascading network or optical interfaces of the MPUs on CLCs
connect to the ICUs on CCCs through external Cat5e network cables to form a
centralized control plane. The stratum-3 clock of each CLC synchronizes with an
external BITS clock, which serves as the unified stratum-3 clock source for the
entire cluster.

System Forms
A CCC-A-based CCC-2 system supports multiple forms: NE5000E-X16A & NE5000E-
X16A cascading, NE5000E-20 & NE5000E-20 cascading, and NE5000E-20 &
NE5000E-X16A cascading.

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Figure 3-164 NE5000E-20 & NE5000E-X16A cascading

Figure 3-165 NE5000E-X16A & NE5000E-X16A cascading

Boards Supported

NO TICE

In a 400G & 1T hybrid cluster with NE5000E CCC-As, the 1T cluster SFUs can use
400G OFCs, but these OFCs must be installed in the OFC1 slots. An NE5000E-20
CLC cannot use CR5DSFUIT261 SFUs.
In a CCC-2 system, the two CCCs must use the same type of SFU. Mixed use of
SFUs is not allowed.

The following table lists the MPUs and SFUs supported by the CCC-As, NE5000E-
X16As, and NE5000E-20s in a CCC-2 system.

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Table 3-335 Boards supported by the CCC-As, NE5000E-X16As, and NE5000E-20s
Device Type Board 400G Cluster 1T Cluster
Type

NE5000E CCC-A MPU MPUB MPUA7
(CR5D0MPUB550) (CR5D0MPUA750)
MPUA8
(CR5D0MPUA850)

SFU SFUF400A SFUF1T
(CR5DSFUFK050) (CR5DSFUFT050)

OFC OFC400A OFC1TA
OFC400A (supporting
only slot 1)

Casca 24-core CXP optical 24-core CXP/CXP2
ding fibers optical fibers
optica
l fiber

NE5000E-X16A MPU MPUB MPUB (CR5D0MPUB560)
CLC (CR5D0MPUB560) MPUB6
MPUB6 (CR5D0MPUB660)
(CR5D0MPUB660)

SFU SFUI-400- SFUI-400-
B(CR5DSFUIK06B) B(CR5DSFUIK06B)
SFUI-1T-
H(CR5DSFUIT06H)

OFC OFC400B OFC400B/OFC1TB

Casca 24-core CXP optical 24-core CXP/CXP2
ding fibers optical fibers
optica
l fiber

NE5000E-20 CLC MPU - MPUN1
(CR5D0MPUN160)
MPUQ1
(CR5D0MPUQ1D0)

SFU - SFUI-1T6-H
(CR5DSFUIT26H)

OFC - OFC2TB

Casca - 24-core CXP2 optical
ding fibers
optica
l fiber

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3.2.1.4.6 Inter-Chassis Connections in a CCC-2 System with 1T CCC-As
This section describes inter-chassis connections for control and data forwarding
channels in a CCC-2 system with 1T CCC-As.

Overview
Inter-chassis connections in a CCC-2 system include control channel connections
and data forwarding channel connections.
● Control channel connections: connect the ICUs on CCCs to the MPUs on CLCs,
bridging the control planes of the CCCs and CLCs.
● Data forwarding channel connections: connect the SFUs on CCCs to those on
CLCs, bridging the forwarding planes of the CCCs and CLCs.

NO TICE

In a CCC-A-based CCC-2 system, if CLCs are not fully configured, the SFUs on
CLCs can be configured on demand instead of being fully configured. For
details, see the data forwarding channel connection diagram in this section.
Only one ICU needs to be configured for each NE5000E CCC-A in a CCC-2
system. If two ICUs are configured, the one configured later cannot register.
In a CCC-2 system equipped with two CCC-As, each CCC-A requires a pair of
active and standby MPUs.

Control Channel Connections
● The ICU on one CCC-A must connect to the ICU and MPU on the other CCC-A
through the same type of interface. (There is no restriction on which type of
interface can be used.) If CCC1's ICU is in slot 19, CCC1's MPU in slot 21 must
connect to CCC2's ICU. If CCC1's ICU is in slot 22, CCC1's MPU in slot 20 must
connect to CCC2's ICU. The MPUs of CLCs connect to the ICUs of CCC-As
through GE/10GE interfaces. Using the ICU in slot 19 is recommended.
● If an NE5000E-X16A functions as a CLC, each of the CLC's MPUs uses a
cascading interface to connect to any ICU interface on each of CCC1 and
CCC2.
● Each of the two fast switching interfaces on each of the master CCC's MPUs
connects to one of the two fast switching interfaces on the slave CCC's MPUs,
as shown in Figure 3-166.

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Figure 3-166 Inter-chassis control channel interconnections (1T cluster)

Data Channel Connections (1T Cluster)
● Data forwarding channels in half-fabric mode for a CCC-2 system
If the data forwarding channels are configured to work in half-fabric mode in
a CCC-2 system with NE5000E CCC-As, a 1T CCC-A supports a maximum of
two NE5000E-20s, four 1T NE5000E-X16As, or four 400G NE5000E-X16As.
Mixed use of NE5000E-20s and NE5000E-X16As is also allowed. Each
NE5000E-20 CLC occupies the places of two CLCs.
Figure 3-167 shows data forwarding channels in half-fabric mode used by
NE5000E-X16A CLCs. Only slots 2, 4, 6, 8, 11, 13, 15, and 17 are used by
NE5000E CCC-As. Specifically:

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– On each CLC, OFC0 in slot 19 connects to the OFCs in slots 2 and 4 on
CCC1, and OFC1 connects to the OFCs in slots 6 and 8 on CCC1.
– On each CLC, OFC0 in slot 20 connects to the OFCs in slots 11 and 13 on
CCC1, and OFC1 connects to the OFCs in slots 15 and 17 on CCC1.
– On each CLC, OFC0 in slot 21 connects to the OFCs in slots 2 and 4 on
CCC2, and OFC1 connects to the OFCs in slots 6 and 8 on CCC2.
– On each CLC, OFC0 in slot 22 connects to the OFCs in slots 11 and 13 on
CCC2, and OFC1 connects to the OFCs in slots 15 and 17 on CCC2.

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Figure 3-167 Data forwarding channels in half-fabric mode used by
NE5000E-X16A CLCs

Figure 3-168 shows data forwarding channels in half-fabric mode used by
NE5000E-20 CLCs. Only slots 2, 4, 6, 8, 11, 13, 15, and 17 are used by
NE5000E CCC-As. Specifically:
– On each CLC, OFC0 in slot 23 connects to the OFC in slot 4 on CCC1, and
OFC1 connects to the OFC in slot 2 on CCC1.

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– On each CLC, OFC0 in slot 24 connects to the OFC in slot 6 on CCC1, and
OFC1 connects to the OFC in slot 8 on CCC1.
– On each CLC, OFC0 in slot 25 connects to the OFC in slot 13 on CCC1,
and OFC1 connects to the OFC in slot 11 on CCC2.
– On each CLC, OFC0 in slot 26 connects to the OFC in slot 15 on CCC1,
and OFC1 connects to the OFC in slot 17 on CCC2.
– On each CLC, OFC0 in slot 27 connects to the OFC in slot 4 on CCC2, and
OFC1 connects to the OFC in slot 2 on CCC1.
– On each CLC, OFC0 in slot 28 connects to the OFC in slot 6 on CCC2, and
OFC1 connects to the OFC in slot 8 on CCC1.
– On each CLC, OFC0 in slot 29 connects to the OFC in slot 13 on CCC2,
and OFC1 connects to the OFC in slot 11 on CCC2.
– On each CLC, OFC0 in slot 30 connects to the OFC in slot 15 on CCC2,
and OFC1 connects to the OFC in slot 17 on CCC2.

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Figure 3-168 Data forwarding channels in half-fabric mode used by
NE5000E-20 CLCs

Figure 3-169 shows data forwarding channels in half-fabric mode for a
cluster with both NE5000E-20 and NE5000E-X16A CLCs.

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Figure 3-169 Data forwarding channels in half-fabric mode for a cluster with
both NE5000E-20 and NE5000E-X16A CLCs

NO TE

● A 1T cluster with CCC-As can have both 1T and 400G NE5000E-X16A CLCs. For
400G and 1T CLCs, the access rules are the same, but the inter-chassis cascading
CXP optical fibers are different.
● 1T SFUs support 400G OFCs, but these OFCs can be installed only in the OFC1
slots.
– Data forwarding channels in full-fabric mode for a CCC-2 system
In a CCC-2 system with NE5000E CCC-As, if data forwarding channels are
configured to work in full-fabric mode, there can be a maximum of four
NE5000E-20s or eight 1T and 400G NE5000E-X16As (there are no restrictions
on the specific numbers of 400G and 1T CLCs). Mixed use of NE5000E-20s
and NE5000E-X16As is also allowed. Each NE5000E-20 CLC occupies the
places of two CLCs.
Figure 3-170 shows data forwarding channels in full-fabric mode used by
NE5000E-X16A CLCs. Slots 5 and 14 on NE5000E CCC-As do not need
connections. Specifically:
– On each CLC, OFC0 in slot 19 connects to the OFCs in slots 1, 2, 3, and 4
on CCC1, and OFC1 connects to the OFCs in slots 6, 7, 8, and 9 on CCC1.
– On each CLC, OFC0 in slot 20 connects to the OFCs in slots 10, 11, 12,
and 13 on CCC1, and OFC1 connects to the OFCs in slots 15, 16, 17, and
18 on CCC1.
– On each CLC, OFC0 in slot 21 connects to the OFCs in slots 1, 2, 3, and 4
on CCC2, and OFC1 connects to the OFCs in slots 6, 7, 8, and 9 on CCC2.

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– On each CLC, OFC0 in slot 22 connects to the OFCs in slots 10, 11, 12,
and 13 on CCC2, and OFC1 connects to the OFCs in slots 15, 16, 17, and
18 on CCC2.

Figure 3-170 Data forwarding channels in full-fabric mode used by NE5000E-
X16A CLCs

Figure 3-171 shows data forwarding channels in full-fabric mode used by
NE5000E-20 CLCs. Slots 5 and 14 on NE5000E CCC-As do not need
connections. Specifically:
– On each CLC, OFC0 in slot 23 connects to the OFCs in slots 1 and 2 on
CCC1, and OFC1 connects to the OFCs in slots 3 and 4 on CCC1.

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– On each CLC, OFC0 in slot 24 connects to the OFCs in slots 6 and 7 on
CCC1, and OFC1 connects to the OFCs in slots 8 and 9 on CCC1.
– On each CLC, OFC0 in slot 25 connects to the OFCs in slots 12 and 13 on
CCC1, and OFC1 connects to the OFCs in slots 10 and 11 on CCC1.
– On each CLC, OFC0 in slot 26 connects to the OFCs in slots 15 and 16 on
CCC1, and OFC1 connects to the OFCs in slots 17 and 18 on CCC1.
– On each CLC, OFC0 in slot 27 connects to the OFCs in slots 1 and 2 on
CCC1, and OFC1 connects to the OFCs in slots 3 and 4 on CCC1.
– On each CLC, OFC0 in slot 28 connects to the OFCs in slots 6 and 7 on
CCC2, and OFC1 connects to the OFCs in slots 8 and 9 on CCC1.
– On each CLC, OFC0 in slot 29 connects to the OFCs in slots 12 and 13 on
CCC2, and OFC1 connects to the OFCs in slots 10 and 11 on CCC1.
– On each CLC, OFC0 in slot 30 connects to the OFCs in slots 15 and 16 on
CCC2, and OFC1 connects to the OFCs in slots 17 and 18 on CCC1.

Figure 3-171 Data forwarding channels in full-fabric mode used by
NE5000E-20 CLCs

Figure 3-172 shows data forwarding channels in full-fabric mode for a
cluster with both NE5000E-20 and NE5000E-X16A CLCs.

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Figure 3-172 Data forwarding channels in full-fabric mode for a cluster
with both NE5000E-20 and NE5000E-X16A CLCs

3.2.1.4.7 Overview of a CCC-2 Cluster Consisting of 1.6T CCC-As
This section describes various forms of CCC-2 cluster systems that consist of 1.6T
CCC-As.

System Introduction
A CCC-2 system consists of two CCCs and a maximum of eight CLCs. In a CCC-2
system, two CCCs connect to all CLCs (including control channels and data
forwarding channels). CLCs can be NE5000E-20s, NE5000E-X16As, or any
combination of them.
The CCC-2 system uses level-1, level-2, and level-3 switching networks. A CLC
provides LPUs and level-1 and level-3 switching networks; A CCC provides a
level-2 switching network. In a CCC-2 system, SFUs on CLCs (NE5000E-20s, or
NE5000E-X16As) connect to SFUs on CCCs through high-density optical fibers,
forming a level-3 switching network. ICUs on CCCs connect to MPUs on CLCs
through cascading network or optical interfaces using external super five category
network cables or optical fibers. The Stratum 3 clocks of all CLCs need to
synchronize with an external BITS clock.

System Forms
A CCC-2 system that consists of CCC-As supports multiple forms: NE5000E-20 &
NE5000E-20 cascading, NE5000E-20 & NE5000E-X16A cascading.

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Figure 3-173 NE5000E-20 & NE5000E-20 cascading

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Figure 3-174 NE5000E-20 & NE5000E-X16A(1T) cascading

Figure 3-175 NE5000E-20 & NE5000E-X16A(400G) cascading

Boards Supported by a CCC-2 System
In a CCC-2 system, the CCC-A, NE5000E-20, and NE5000E-X16A support different
MPUs and SFUs. The following table lists the boards supported by them in a
CCC-2 system.

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Table 3-336 Boards supported by the CCC-A, NE5000E-20, NE5000E-X16A
Device Type Board Type 1.6T Cluster

● MPUA7(CR5D0MPUA
750)
MPU
● MPUA8(CR5D0MPUA
851)

NE5000E CCC-A SFUI-1T6-
SFU
G(CR5DSFUIT250)

OFC OFC2TA

Cascading optical fiber 24-core CXP/CXP2

MPUN1(CR5D0MPUN16
0)
MPU
MPUQ1(CR5D0MPUQ1D
0)

NE5000E-20 CLC SFUI-1T6-
SFU
H(CR5DSFUIT26H)

OFC OFC2TB

Cascading optical fiber 24-core CXP2

MPUB(CR5D0MPUB661)
MPU MPUB6(CR5D0MPUB661
)

SFUI-400-
B(CR5DSFUIK06B)
NE5000E-X16A CLC SFU
SFUI-1T-
H(CR5DSFUIT06H)

OFC OFC400B/OFC1TB

Cascading optical fiber 24-core CXP/CXP2

NO TE

400G NE5000E-X16A CLCs can be upgraded to 1T CLCs.
In a CCC-2 system, all CCCs must use the same type of SFUs

3.2.1.4.8 Inter-Chassis Connections in a CCC-2 System Consisting of 1.6T CCC-As
This section describes inter-chassis connections between control channels and data
forwarding channels in a CCC-2 system that consists of 1.6T CCC-As.

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Overview
Inter-chassis connections in a CCC-2 system include control channel connections
and data forwarding channel connections:
● Control channel connections are implemented by connecting ICUs on CCCs to
MPUs on CLCs.
● Data forwarding channel connections are implemented by connecting SFUs
on CCCs to SFUs on CLCs.

NO TICE

If a CCC-2 cluster system that consists of CCC-As is not fully configured with
CLCs, SFUs on CCC-As can be configured as required. For details, see the data
channel interconnection diagram in the following section.
Only one ICU needs to be configured for each NE5000E CCC-A in a CCC-2
system. If two ICUs are configured, the last configured ICU cannot register.
When a CCC-2 system is equipped with two CCC-As, each CCC-A requires the
master and slave MPUs.

Control Channel Connections
● Any same type interface of the ICU on each CCC-A is connected to the ICU
and MPU on the other CCC-A. If the ICU in slot 19 is used in CCC1, the MPU
in slot 21 must be connected to the ICU in CCC2. If the ICU in slot 22 is used
in CCC1, the MPU in slot 20 must be connected to the ICU in CCC2. The MPU
is connected to the ICU through GE/10GE interfaces. Using the ICU in slot 19
is recommended. Figure 3-176 shows inter-chassis control channel
connections.
● When an NE5000E-20, or NE5000E-X16A functions as a CLC, the cascading
interfaces on the MPU of the CLC are connected to any interface numbered 0
to 13 on the ICUs of CCC1 and CCC2. Figure 3-176 shows control channel
connections.
● The two fast switchover interfaces on one MPU of the CCC master chassis are
connected to the fast switchover interfaces on the two MPUs of the CCC slave
chassis respectively. The cable connections are shown by the yellow lines in
Figure 3-176.

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Figure 3-176 Inter-chassis control channel connections - 1.6T cluster

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Data Forwarding Channel Connections - 1.6T Cluster
● Data forwarding channel connections in half-fabric mode
When NE5000E CCC-As in a CCC-2 system are configured to work in half-
fabric mode, one 1.6T CCC-A supports a maximum of four CLCs (any
combination of 1.6T NE5000E-20s, 1T NE5000E-X16As, 400G NE5000E-
X16As). Figure 3-177 shows data forwarding channel connections in half-
fabric mode. Only slots 2, 4, 6, 8, 11, 13, 15, and 17 are used on the NE5000E
CCC-A.
Interconnection with an NE5000E-20:
– OFC0 in slot 23 on the CLC is connected to the board in slot 4 on CCC1,
and OFC1 is connected to the board in slot 2 on CCC1.
– OFC0 in slot 24 on the CLC is connected to the board in slot 6 on CCC1,
and OFC1 is connected to the board in slot 8 on CCC1.
– OFC0 in slot 25 on the CLC is connected to the board in slot 13 on CCC1,
and OFC1 is connected to the board in slot 11 on CCC1.
– OFC0 in slot 26 on the CLC is connected to the board in slot 15 on CCC1,
and OFC1 is connected to the board in slot 17 on CCC1.
– OFC0 in slot 27 on the CLC is connected to the board in slot 4 on CCC2,
and OFC1 is connected to the board in slot 2 on CCC2.
– OFC0 in slot 28 on the CLC is connected to the board in slot 6 on CCC2,
and OFC1 is connected to the board in slot 8 on CCC2.
– OFC0 in slot 29 on the CLC is connected to the board in slot 13 on CCC2,
and OFC1 is connected to the board in slot 11 on CCC2.
– OFC0 in slot 30 on the CLC is connected to the board in slot 15 on CCC2,
and OFC1 is connected to the board in slot 17 on CCC2.
Interconnection with an NE5000E-X16A:
– OFC0 in slot 19 on the CLC is connected to the boards in slots 2 and 4 on
CCC1, and OFC1 is connected to the boards in slots 6 and 8 on CCC1.
– OFC0 in slot 20 on the CLC is connected to the boards in slots 11 and 13
on CCC1, and OFC1 is connected to the boards in slots 15 and 17 on
CCC1.
– OFC0 in slot 21 on the CLC is connected to the boards in slots 2 and 4 on
CCC2, and OFC1 is connected to the boards in slots 6 and 8 on CCC2.
– OFC0 in slot 22 on the CLC is connected to the boards in slots 11 and 13
on CCC2, and OFC1 is connected to the boards in slots 15 and 17 on
CCC2.

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Figure 3-177 Data Forwarding Channel Connections in Half-fabric Mode

NO TE

The 1.6T cluster consisting of CCC-As supports 1.6T NE5000E-20 CLCs, 1T or 400G
NE5000E-X16A CLCs. The access rule for 400G or 1T NE5000E-X16As are the same as
that for 1.6T NE5000E-20. However, the CXP optical fibers for inter-chassis cascading
between 400G and 1T CLCs are different.

3.2.1.5 Stratum-3 Clock Deployment
In a cluster, the Stratum-3 clock boards on the main control boards of CLCs are
used to synchronize the clocks of the service boards of the CLCs. The stratum-3
clock synchronization of the cluster depends on the external BITS clock source. In
actual deployments, you can set a high priority of the external clock sources on all
the CLCs and enable the CLCs to automatically select the reference clock source.
In a cluster, if a CLC traces an external clock source and another CLC transmits
clock signals to downstream devices, inter-chassis clock interconnection must be
deployed. If a CLC traces an external clock source and transmits clock signals to
downstream devices, inter-chassis clock interconnection does not need to be
deployed.

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Support for Clock Interfaces

Table 3-337 Support for clock interfaces
MPU Type Clock Interface Type Functions of Clock
Interfaces

MPUB4 CLK/1pps (SMB) Used to input 2 Mbit/s or
(CR5D0MPUB461) 2 MHz clock signals.
MPUB5 Used to input or output
(CR5D0MPUB560) 1pps time signals.

CLK/Serial (SMB) Used to output 2 Mbit/s
or 2 MHz clock signals.
Used to input or output
RS232 signals.

CLK/TOD0 (RJ45) Used for inter-chassis
synchronization in a
physical cluster.
Used to input or output
2 Mbit/s or 2 MHz clock
signals.
Used to input or output
two-channel DCLS or
1pps+ASCII time signals.

CLK/TOD1 (RJ45) Used to input or output
2 Mbit/s or 2 MHz clock
signals.
Used to input or output
two-channel DCLS or
1pps+ASCII time signals.

MPUB6 CLK (RJ45) Used to transmit 2 Mbps
(CR5D0MPUB660) or 2 MHz external clock
MPUQ1 signals.
(CR5D0MPUQ1D0) TOD (RJ45) Used to transmit 1pps or
DCLS external time
signals.

CLK-INT (RJ45) Used for inter-chassis
synchronization in a
physical cluster.

NO TE

CLCs that use MPUN (CR5D0MPUN160) do not support inter-chassis clock interconnection.
During inter-chassis synchronization in a physical cluster, if the main control board has a
CLK-INT interface, the CLK-INT interface is used for connection. If the main control board
has other interfaces, the CLK/TOD0 interface is used for connection.

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3.2.1.5.1 Stratum-3 Clock Deployment in CCC-0

CCC-0 consists of two CLCs. The CLKs/TOD0s or CLK-INTs on the main control
boards of the two CLCs are directly connected through 120-ohm trunk cables.
Clock cables must be connected to both the active and standby main control
boards to form a loop for link protection. The main control boards with CLK-INT
interfaces are connected through CLK-INT interfaces, and other main control
boards are connected through CLK/TOD0 interfaces.

Figure 3-178 shows the connection of stratum-3 clocks in CCC-0.

Figure 3-178 Diagram for connection of Stratum-3 clocks in CCC-0

Deploying a Stratum-3 Clock for a CCC-0 Cluster

BITSs inject external clock/time signals, and CLCxs form a ring topology through
cluster clock/time cascading interfaces.

Cable Connection Requirements

Use a 120-ohm trunk cable to connect the CLK/TOD0 or CLK-INT interfaces on the
main control boards in the active and standby chassis. Both the active and standby
main control boards must be connected to clock cables to form a loop for link
protection.

NO TE

During inter-chassis synchronization in a physical cluster, if the main control board has a
CLK-INT interface, the CLK-INT interface is used for connection. If the main control board
has other interfaces, the CLK/TOD0 interface is used for connection.

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Clock Cables

Table 3-338 Support for clock cables
Clock Cod Interfac Remarks
Cables e e Type

120-ohm 0404 RJ45 Trunk cable, 15m, 120ohm, 1E1, 0.4mm, MP8-
clock cable 0261 II, 120CC4P0.4P430U(S), MP8-II

0404 RJ45 Trunk cable, 30m, 120ohm, 1E1, 0.4mm, MP8-
0496 II, 120CC4P0.4P430U(S), MP8-II, Expert 2.0

0404 RJ45 Trunk cable, 80m, 120ohm, 1E1, 0.4mm, MP8-
0493 II, 120CC4P0.4P430U(S), MP8-II, Expert 2.0

120-ohm NA RJ45 Wire sequence:
clock cable End A: white orange, orange, white green, blue,
(customize white blue, green, white brown, and brown
d)
End B: blue, white blue, white brown, white
orange, orange, brown, white green, and green

75-ohm 0402 SMB Trunk cable, 20m, 75ohm, 2.2mm, SMB75SF-V,
clock cable 2629 SYFVZ75-1.2/0.25, HONET, DL2526

0402 SMB Trunk cable, 50m, 75ohm, 2.2mm, SMB75SF-V,
3972 SYFVZ75-1.2/0.25, C&C08B, DL3134

0406 SMB Trunk cable, 30m, 75ohm, 2.2mm, SMB75SF-V,
0205 SYFVZ75-1.2/0.25, mobile intelligent network

Clock cable 0402 SMB to Single cable,120ohm, 75ohm Converter Box
transfer 6814 RJ45 and (With SMB Socket 14040127),
box - RJ45 to (PCB03022834+Box Body 21210634)
Balun box SMB

Stratum-3 clock of CCC-0 (external clock connected to the MPUB4/MPUB5)
MPUB4s and MPUB5s have the same clock interfaces, external clocks, and inter-
chassis clock connections. This document uses MPUB5s as an example. Figure
3-179 shows the clock deployment solution.

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Figure 3-179 Stratum-3 clock deployment between MPUB5s and MPUB6s in
CCC-0

Stratum-3 clock of CCC-0 (external clock connected to the MPUB6/MPUQ1)
MPUB6s and MPUQ1s have the same clock interfaces, external clocks, and inter-
chassis clock connections. This document uses MPUQ1s as an example.
Figure 3-180 shows inter-chassis clock interconnections when CLK-INT and CLK/
TOD0 interfaces exist in CCC-0.

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Figure 3-180 Stratum-3 clock deployment between MPUB5s and MPUQ1s in
CCC-0

3.2.1.5.2 Stratum-3 Clock Deployment in CCC-2
Main control boards on a CCC do not provide any Stratum-3 clock board. On each
CLC, clocks of all service boards are synchronized with the Stratum-3 clock board
on the main control board of the CLC. The stratum-3 clock synchronization of the
cluster depends on the external BITS clock source. In actual deployments, you can
set a high priority of the external clock sources on all the CLCs and enable the
CLCs to automatically select the reference clock source.
The following figure shows the deployment of Stratum-3 clocks. Clocks of all CLCs
are synchronized with an external BITS clock source.

Taking a 2+4 cluster as an example, Figure 3-181 shows stratum-3 clock
deployment in CCC-2.
Similarly, when other types of clusters are deployed, the active and standby main
control boards also need to be connected through clock cables to form a loop for
link protection.

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Figure 3-181 Stratum-3 clock deployment in CCC-2

Deploying a Stratum-3 Clock for a CCC-2 Cluster

BITSs inject external clock/time signals, and CLCxs form a ring topology through
cluster clock/time cascading interfaces.

Cable Connection Requirements

Use a 120-ohm trunk cable to connect the CLK/TOD0 or CLK-INT interfaces on the
main control boards in the active and standby chassis. Both the active and standby
main control boards must be connected to clock cables to form a loop for link
protection.

NO TE

During inter-chassis synchronization in a physical cluster, if the main control board has a
CLK-INT interface, the CLK-INT interface is used for connection. If the main control board
has other interfaces, the CLK/TOD0 interface is used for connection.

Clock Cables

Table 3-339 Support for clock cables

Clock Cod Interfa Remarks
Cables e ce
Type

120-ohm 0404 RJ45 Trunk cable, 15m, 120ohm, 1E1, 0.4mm, MP8-II,
clock cable 0261 120CC4P0.4P430U(S), MP8-II

0404 RJ45 Trunk cable, 30m, 120ohm, 1E1, 0.4mm, MP8-II,
0496 120CC4P0.4P430U(S), MP8-II, Expert 2.0

0404 RJ45 Trunk cable, 80m, 120ohm, 1E1, 0.4mm, MP8-II,
0493 120CC4P0.4P430U(S), MP8-II, Expert 2.0

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Clock Cod Interfa Remarks
Cables e ce
Type

120-ohm NA RJ45 Wire sequence:
clock cable End A: white orange orange, white green, blue,
(customize white blue, green, white brown, and brown
d)
End B: blue white blue, white brown, white
orange, orange, brown, white green, and green

75-ohm 0402 SMB Trunk cable, 20m, 75ohm, 2.2mm, SMB75SF-V,
clock cable 2629 SYFVZ75-1.2/0.25, HONET, DL2526

0402 SMB Trunk cable, 50m, 75ohm, 2.2mm, SMB75SF-V,
3972 SYFVZ75-1.2/0.25, C&C08B, DL3134

0406 SMB Trunk cable, 30m, 75ohm, 2.2mm, SMB75SF-V,
0205 SYFVZ75-1.2/0.25, mobile intelligent network

Clock cable 0402 SMB to Single cable, 120ohm, 75ohm Converter Box
transfer 6814 RJ45 (With SMB Socket 14040127),
box - (PCB03022834+Box Body 21210634)
Balun box

Stratum-3 clock of CCC-2 (external clock connected to the MPUB4/MPUB5)
MPUB4s and MPUB5s have the same clock interfaces, external clocks, and inter-
chassis clock connections. This document uses MPUB5s as an example. Figure
3-182 shows the clock deployment solution.

Figure 3-182 Stratum-3 clock deployment in CCC-2 - external clock connected to
the MPUB5

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Stratum-3 clock of CCC-2 (external clock connected to the MPUB6/MPUQ1)
MPUB6s and MPUQ1s have the same clock interfaces, external clocks, and inter-
chassis clock connections. This document uses MPUQ1s as an example. Figure
3-183 shows the clock deployment solution.

Figure 3-183 Stratum-3 clock deployment in CCC-2 - external clock connected to
the MPUQ1

3.3 NE5000E CCC Hardware Description

3.3.1 Chassis

3.3.1.1 NE5000E CCC

Overview

Table 3-340 Basic information about the NE5000E CCC
Description Part Number Model First supported
version

NE5000E Cluster 02113425 CR5B00BKPB50 V800R003C00SPC
Chassis B 700

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Appearance

Figure 3-184 Appearance of the NE5000E CCC

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Components

Figure 3-185 Components of the NE5000E CCC

1. Air exhaust vent 2. Rear fan module 3. SFU 4. Grounding
terminal

5. Rack-mounting 6. Front fan 7. SFU 8. OFC
ear module

9. MPU 10. Carry handle 11. Power module 12. ICU

13. Cable tray 14. Air intake vent - -

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Slot Layout

Figure 3-186 Slot Layout of the NE5000E CCC

Table 3-341 Slots on the NE5000E CCC
Slot Type Slot ID Slot Direction Remarks

SFU 1-8 The right side of -
the board faces
upwards

MPU 9-10 The right side of -
the board faces
upwards

ICU 11-12 The right side of -
the board faces
upwards

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Technical Specifications

Table 3-342 Technical specifications of the CR5B00BKPB50
Item Specification

Cabinet installation standards Can be installed in a 1000 mm-deep
standard 19-inch cabinet and is
installed in a 2200 mm-high Huawei
N610E cabinet by default.

Dimensions without packaging (H x W 1241 mm x 442 mm x 800 mm (48.86
x D) [mm(in.)] in. x 17.40 in. x 31.50 in.)

Chassis height [U] 28U

Weight without packaging [kg(lb)] 146 kg (321.87 lb)

Weight with packaging [kg(lb)] 373 kg (822.32 lb)

Weight without packaging (full 400G: 260 kg (573.20 lb)
configuration) [kg(lb)] NOTE
The weight of a device can be estimated
based on the board configuration using
Info-Finder Hardware Configuration.

Typical power consumption (with 400G 2+4 cluster: 4100 W
configuration) [W] NOTE
The power consumption of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

Typical heat dissipation (with 400G 2+4 cluster: 13302.1 BTU/hour
configuration) [BTU/hour] NOTE
The heat dissipation of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

MTBF [year] 15.06 year

MTTR [hour] 0.5 hour

Availability 0.99999

Power supply mode DC

Maximum number of power chassis 3 channels per power slot = 6 channels
inputs

Rated input voltage [V] –48 V/–60 V

Input voltage range [V] -38V to -72V

Maximum input current [A] 75 A × 3

Rated output power [W] 8000 W

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Item Specification

Maximum input cable size [mm²] 35 mm²

Front-end circuit breaker/fuse [A] 80A/single-module

Airflow direction From front to back

Noise at normal temperature (acoustic 100G:
power) [dB(A)] 72.4 dB(A) (front chassis: fan speed
40%; rear chassis: fan speed 60%)
89.9 dB (A) (front chassis: fan speed
100%; rear chassis: fan speed 100%)
400G:
89.4 dB (A) (front chassis: fan speed
100%)

Number of slots 20

Number of service board slots 0

Redundant MPUs 1:1

Redundant Switch fabrics 7+1

Redundant CMUs 1+1

Redundant power supply 1+1

Redundant fans Consists of front and rear areas.
Two fan modules. If a single fan fails,
the system can still work for a short
period of time at an ambient
temperature of 40°C.

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

Restriction on the operating ≤ 0.5°C/min (32.9°F/min), non-
temperature variation rate [°C(°F)] condensing

Storage temperature [°C(°F)] –40°C to +70°C (–40°F to +158 °F)

Long-term operating relative humidity 5% RH to 85% RH, non-condensing
[RH]

Short-term operating relative humidity 5% RH to 95% RH, non-condensing
[RH]

Storage relative humidity [RH] 5% RH to 95% RH, non-condensing

Long-term operating altitude [m(ft.)] 3000M @ 40°C

Storage altitude [m(ft.)] < 5000 m (16404.2 ft.)

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NO TE

● About condensation
The ability of air to contain moisture reduces as the temperature decreases. There is a
relationship between temperature and relative humidity. As the temperature decreases,
the air becomes more saturated with moisture, meaning the relative humidity increases.
But at a low enough temperature (called the dew point), the air can no longer contain
moisture, which is then precipitated as liquid water. Such water on the surface of
relevant equipment is called condensation.
● Hazards of condensation
When condensation mixes with dust inside the equipment, it forms conductive channels
that affect the electrical insulation of the equipment. As a result, a non-conductive area
of the equipment can become conductive, causing the equipment to malfunction.
● Conditions that cause condensation
Condensation is related to temperature changes and humidity. It occurs when the
temperature continues to decrease below the dew point at a given humidity. For
example, given that the relative humidity is 50% RH and the temperature is 25°C (77°F),
condensation occurs when the temperature decreases below 13.9°C (57.02°F).

3.3.1.2 NE5000E CCC-A

Overview

Table 3-343 Basic information about the NE5000E CCC-A
Description Part Number Model First supported
version

Assembling 02350CLY CR5B0BKPCD51 V800R007C00SPC
Components,NetE 100
ngine5000E,CR5B
0BKPCD02,NE500
0E CCC-A Cluster
220V AC/240V DC
Chassis

Assembling 02350CMC CR5B0BKPCD52 V800R007C00SPC
Components,NetE 100
ngine5000E,CR5B
0BKPCD01,NE500
0E CCC-A Cluster
380V HVDC
Chassis

NE5000E CCC-A 02352DRN CR5B0BKPCA53 V800R011C10SPC
Cluster AC and 500
HVDC Chassis B

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Description Part Number Model First supported
version

NE5000E CCC-A 02352DRP CR5B0BKPCD53 V800R011C10SPC
Cluster DC Chassis 500
B

Assembling 02359128 CR5B0BKPCA50 V800R006C00SPC
Components,NetE 600
ngine5000E,CR5B
0BKPCA50,NE500
0E CCC-A Cluster
AC Chassis

Assembling 02359129 CR5B0BKPCD50 V800R006C00SPC
Components,NetE 600
ngine5000E,CR5B
0BKPCD50,NE500
0E CCC-A Cluster
DC Chassis

Appearance

Figure 3-187 Appearance of the NE5000E CCC-A

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Components

Figure 3-188 Components of the NE5000E CCC-A

1. Power module 2. Power module 3. Switch module 4. Power
cage cover (PM) slot slot monitoring module
(PMU) slot

5. Cable trough for 6. Main processing 7. ICU slot 8. Cable trough for
the vertically unit (MPU) slot the horizontally
inserted board inserted board

9. SFU slot 10. Mounting ear 11. Air intake 12. Power entry
frame module (PEM) slot

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13. Fan assembly 14. Lifting handle 15. ESD jack 16. Air filter
slot

17. Ground - - -
terminal

Slot Layout

Figure 3-189 Slot Layout of the NE5000E CCC-A

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Hardware Guide 3 Hardware Description

Table 3-344 Slots on the NE5000E CCC-A
Slot Type Slot ID Slot Direction Remarks

SFU 1-9 The right side of -
the board faces
upwards

SFU 10-18 The right side of -
the board faces
downwards

ICU 19, 22 The top of the -
board faces
upwards.

MPU 20-21 The top of the -
board faces
upwards.

PEM 23-24 The top of the Slot IDs of a dual-
board faces plane device:
upwards. 23-24; slot ID of a
single-plane
device: 23

FAN 25-32 The top of the -
board faces
upwards.

PMU 33-34 The top of the -
board faces
upwards.

Technical Specifications

Table 3-345 Technical specifications of the CR5B0BKPCD51
Item Specification

Cabinet installation standards The chassis can be installed in a
standard 19-inch 1000 mm deep
cabinet. By default, the customized
A610 cabinet is used.

Dimensions without packaging (H x W 1955 mm x 442 mm x 830 mm (76.97
x D) [mm(in.)] in. x 17.40 in. x 32.68 in.)

Chassis height [U] 44U

Weight without packaging [kg(lb)] 205 kg (451.94 lb)

Weight with packaging [kg(lb)] 454 kg (1000.89 lb)

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Item Specification

Weight without packaging (full 400G 2+8 cluster: 485 kg (1069.42 lb)
configuration) [kg(lb)] 1T 2+8 cluster: 506 kg (1115.73 lb)
1.6T 2+8 cluster: 528.4 kg (1164.90 lb)
NOTE
The weight of a device can be estimated
based on the board configuration using
Info-Finder Hardware Configuration.

Typical power consumption (with 400G 2+2 cluster:2310 W 400G 2+4
configuration) [W] cluster:3190 W 400G 2+8 cluster:5910
W
1T 2+2 cluster:3500 W 1T 2+4
cluster:4900 W 1T 2+8 cluster:9200 W
1.6T 2+2 cluster: 7450 W 1.6T 2+4
cluster: 8520 W 1.6T 2+8 cluster:
16230 W
NOTE
The power consumption of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

Typical heat dissipation (with 400G 2+2 cluster:7494.6 BTU/hour
configuration) [BTU/hour] 400G 2+4 cluster:10349.7 BTU/hour
400G 2+8 cluster:19174.5 BTU/hour
1T 2+2 cluster:11355.5 BTU/hour 1T
2+4 cluster:15897.7 BTU/hour 1T 2+8
cluster:29848.7 BTU/hour
1.6T 2+2 cluster:24170.9 BTU/hour
1.6T 2+4 cluster:27642.5 BTU/hour
1.6T 2+8 cluster:52656.9 BTU/hour
NOTE
The heat dissipation of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

MTBF [year] 15.06 year

MTTR [hour] 0.5 hour

Availability 0.99999

Power supply mode AC/HVDC

Maximum number of power chassis Double-plane chassis: (4 channels/
inputs PEM) x 5 PEMs = (1 channel/PM) x 4
PMs x 5 PEMs = 20 channels

Rated input voltage [V] AC: 200 V to 240 V
High-voltage DC: 240 V/380 V

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Item Specification

Input voltage range [V] AC:
Maximum range: 180 V to 264 V
Rated voltage of the 220 V power grid:
200 V to 240 V
High-voltage DC:
192 V to 400 V

Maximum input current [A] AC: 16 A per module
High-voltage DC: 14 A per module

Rated output power [W] 3000 W

Maximum input cable size [mm²] AC: C19 cable in standard
configuration
High-voltage DC: 2.5 mm²

Front-end circuit breaker/fuse [A] AC: 16 A per module
High-voltage DC: 14 A per module

Airflow direction From front to back

Noise at normal temperature (acoustic Complies with the NEBS standard (<
power) [dB(A)] 78 dB(A) @ 27°C).

Number of slots 22

Number of service board slots 0

Redundant MPUs 1:1

Redundant Switch fabrics 7+1

Redundant CMUs 1+1

Redundant power supply N+N

Redundant fans The fan tray assemblies are located in
the upper and lower areas at the rear
of the chassis. Each area is as follows:
(400G/1T configuration) Two fan tray
assemblies, allowing the device to
work properly for a short time at 40ºC
if a single fan module fails.
Three fan assemblies are configured
for 1.6T, allowing the device to work
properly for a short time at 40ºC if a
single fan module fails.

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

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Item Specification

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

Restriction on the operating ≤ 0.5°C/min (32.9°F/min), non-
temperature variation rate [°C(°F)] condensing

Storage temperature [°C(°F)] –40°C to +70°C (–40°F to +158 °F)

Long-term operating relative humidity 5% RH to 85% RH, non-condensing
[RH]

Short-term operating relative humidity 5% RH to 95% RH, non-condensing
[RH]

Storage relative humidity [RH] 5% RH to 95% RH, non-condensing

Long-term operating altitude [m(ft.)] 3000M @ 40°C

Storage altitude [m(ft.)] < 5000 m (16404.2 ft.)

Table 3-346 Technical specifications of the CR5B0BKPCD52
Item Specification

Cabinet installation standards Can be installed in a standard 19-inch
cabinet with a depth of 1000 mm. By
default, the customized A610 cabinet
is used.

Dimensions without packaging (H x W 1955 mm x 442 mm x 830 mm (76.97
x D) [mm(in.)] in. x 17.40 in. x 32.68 in.)

Chassis height [U] 44U

Weight without packaging [kg(lb)] 205 kg (451.94 lb)

Weight with packaging [kg(lb)] 454 kg (1000.89 lb)

Weight without packaging (full 400G 2+8 cluster: 485 kg (1069.42 lb)
configuration) [kg(lb)] 1T 2+8 cluster: 506 kg (1115.73 lb)
1.6T 2+8 cluster: 528.4 kg (1164.90 lb)
NOTE
The weight of a device can be estimated
based on the board configuration using
Info-Finder Hardware Configuration.

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Item Specification

Typical power consumption (with 400G 2+2 cluster:2310 W 400G 2+4
configuration) [W] cluster:3190 W 400G 2+8 cluster:5910
W
1T 2+2 cluster:3500 W 1T 2+4
cluster:4900 W 1T 2+8 cluster:9200 W
1.6T 2+2 cluster: 7450 W 1.6T 2+4
cluster: 8520 W 1.6T 2+8 cluster:
16230 W
NOTE
The power consumption of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

Typical heat dissipation (with 400G 2+2 cluster:7494.6 BTU/hour
configuration) [BTU/hour] 400G 2+4 cluster:10349.7 BTU/hour
400G 2+8 cluster:19174.5 BTU/hour
1T 2+2 cluster:11355.5 BTU/hour 1T
2+4 cluster:15897.7 BTU/hour 1T 2+8
cluster:29848.7 BTU/hour
1.6T 2+2 cluster:24170.9 BTU/hour
1.6T 2+4 cluster:27642.5 BTU/hour
1.6T 2+8 cluster:52656.9 BTU/hour
NOTE
The heat dissipation of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

MTBF [year] 15.06 year

MTTR [hour] 0.5 hour

Availability 0.99999

Power supply mode HVDC

Maximum number of power chassis Double-plane chassis: (4 channels/
inputs PEM) x 5 PEMs = (1 channel/PM) x 4
PMs x 5 PEMs = 20 channels

Rated input voltage [V] 240V/380V

Input voltage range [V] 192 V to 400 V

Maximum input current [A] 14A/single-module

Rated output power [W] 3000 W

Maximum input cable size [mm²] 2.5 mm²

Front-end circuit breaker/fuse [A] 16A/single-module

Airflow direction From front to back

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Item Specification

Noise at normal temperature (acoustic Complies with the NEBS standard (<
power) [dB(A)] 78 dB(A) @ 27°C).

Number of slots 22

Number of service board slots 0

Redundant MPUs 1:1

Redundant Switch fabrics 7+1

Redundant CMUs 1+1

Redundant power supply N+N

Redundant fans The fan tray assemblies are located in
the upper and lower areas at the rear
of the chassis. Each area is as follows:
(400G/1T configuration) Two fan tray
assemblies, allowing the device to
work properly for a short time at 40ºC
if a single fan module fails.
Three fan assemblies are configured
for 1.6T, allowing the device to work
properly for a short time at 40ºC if a
single fan module fails.

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

Restriction on the operating ≤ 0.5°C/min (32.9°F/min), non-
temperature variation rate [°C(°F)] condensing

Storage temperature [°C(°F)] –40°C to +70°C (–40°F to +158 °F)

Long-term operating relative humidity 5% RH to 85% RH, non-condensing
[RH]

Short-term operating relative humidity 5% RH to 95% RH, non-condensing
[RH]

Storage relative humidity [RH] 5% RH to 95% RH, non-condensing

Long-term operating altitude [m(ft.)] 3000M @ 40°C

Storage altitude [m(ft.)] < 5000 m (16404.2 ft.)

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Table 3-347 Technical specifications of the CR5B0BKPCA53

Item Specification

Cabinet installation standards The chassis can be installed in a
standard 19-inch 1000 mm deep
cabinet. By default, the customized
A610 cabinet is used.

Dimensions without packaging (H x W 1955 mm x 442 mm x 830 mm (76.97
x D) [mm(in.)] in. x 17.40 in. x 32.68 in.)

Chassis height [U] 44U

Weight without packaging [kg(lb)] 205 kg (451.94 lb)

Weight with packaging [kg(lb)] 454 kg (1000.89 lb)

Weight without packaging (full 1.6T 2+8 cluster: 528.4 kg (1164.90 lb)
configuration) [kg(lb)] NOTE
The weight of a device can be estimated
based on the board configuration using
Info-Finder Hardware Configuration.

Typical power consumption (with 400G 2+2 cluster:2310 W 400G 2+4
configuration) [W] cluster:3190 W 400G 2+8 cluster:5910
W
1T 2+2 cluster:3500 W 1T 2+4
cluster:4900 W 1T 2+8 cluster:9200 W
1.6T 2+2 cluster: 7450 W 1.6T 2+4
cluster: 8520 W 1.6T 2+8 cluster:
16230 W
NOTE
The power consumption of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

Typical heat dissipation (with 400G 2+2 cluster:7494.6 BTU/hour
configuration) [BTU/hour] 400G 2+4 cluster:10349.7 BTU/hour
400G 2+8 cluster:19174.5 BTU/hour
1T 2+2 cluster:11355.5 BTU/hour 1T
2+4 cluster:15897.7 BTU/hour 1T 2+8
cluster:29848.7 BTU/hour
1.6T 2+2 cluster:24170.9 BTU/hour
1.6T 2+4 cluster:27642.5 BTU/hour
1.6T 2+8 cluster:52656.9 BTU/hour
NOTE
The heat dissipation of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

MTBF [year] 15.06 year

MTTR [hour] 0.5 hour

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Item Specification

Availability 0.99999

Power supply mode AC/HVDC

Maximum number of power chassis Single-plane chassis: (8 channels/PEM)
inputs x 5 PEMs = (2 channel/PM) x 4 PMs x
5 PEMs = 40 channels

Rated input voltage [V] AC: 200 V to 240 V
High-voltage DC: 240 V/380 V

Input voltage range [V] AC:
Maximum range: 180 V to 264 V
Rated voltage of the 220 V power grid:
200 V to 240 V
High-voltage DC:
192 V to 400 V

Maximum input current [A] AC: 16 A per module
High-voltage DC: 14 A per module

Rated output power [W] 3000 W

Maximum input cable size [mm²] AC: C19 cable in standard
configuration
High-voltage DC: 2.5 mm²

Front-end circuit breaker/fuse [A] AC: 16 A per module
High-voltage DC: 14 A per module

Airflow direction From front to back

Noise at normal temperature (acoustic Complies with the NEBS standard (<
power) [dB(A)] 78 dB(A) @ 27°C).

Number of slots 22

Number of service board slots 0

Redundant MPUs 1:1

Redundant Switch fabrics 7+1

Redundant CMUs 1+1

Redundant power supply N+1

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Item Specification

Redundant fans The fan tray assemblies are located in
the upper and lower areas at the rear
of the chassis. The distribution in each
area is as follows:
Three fan tray assemblies for 1.6T,
allowing the device to work properly
for a short time at 40ºC if a single fan
module fails.

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

Restriction on the operating ≤ 0.5°C/min (32.9°F/min), non-
temperature variation rate [°C(°F)] condensing

Storage temperature [°C(°F)] –40°C to +70°C (–40°F to +158 °F)

Long-term operating relative humidity 5% RH to 85% RH, non-condensing
[RH]

Short-term operating relative humidity 5% RH to 95% RH, non-condensing
[RH]

Storage relative humidity [RH] 5% RH to 95% RH, non-condensing

Long-term operating altitude [m(ft.)] 3000M @ 40°C

Storage altitude [m(ft.)] < 5000 m (16404.2 ft.)

Table 3-348 Technical specifications of the CR5B0BKPCD53
Item Specification

Cabinet installation standards The chassis can be installed in a
standard 19-inch 1000 mm deep
cabinet. By default, the customized
A610 cabinet is used.

Dimensions without packaging (H x W 1955 mm x 442 mm x 830 mm (76.97
x D) [mm(in.)] in. x 17.40 in. x 32.68 in.)

Chassis height [U] 44U

Weight without packaging [kg(lb)] 205 kg (451.94 lb)

Weight with packaging [kg(lb)] 454 kg (1000.89 lb)

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Item Specification

Weight without packaging (full 1.6T 2+8 cluster: 528.4 kg (1164.90 lb)
configuration) [kg(lb)] NOTE
The weight of a device can be estimated
based on the board configuration using
Info-Finder Hardware Configuration.

Typical power consumption (with 400G 2+2 cluster:2310 W 400G 2+4
configuration) [W] cluster:3190 W 400G 2+8 cluster:5910
W
1T 2+2 cluster:3500 W 1T 2+4
cluster:4900 W 1T 2+8 cluster:9200 W
1.6T 2+2 cluster: 7450 W 1.6T 2+4
cluster: 8520 W 1.6T 2+8 cluster:
16230 W
NOTE
The power consumption of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

Typical heat dissipation (with 400G 2+2 cluster:7494.6 BTU/hour
configuration) [BTU/hour] 400G 2+4 cluster:10349.7 BTU/hour
400G 2+8 cluster:19174.5 BTU/hour
1T 2+2 cluster:11355.5 BTU/hour 1T
2+4 cluster:15897.7 BTU/hour 1T 2+8
cluster:29848.7 BTU/hour
1.6T 2+2 cluster:24170.9 BTU/hour
1.6T 2+4 cluster:27642.5 BTU/hour
1.6T 2+8 cluster:52656.9 BTU/hour
NOTE
The heat dissipation of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

MTBF [year] 15.06 year

MTTR [hour] 0.5 hour

Availability 0.99999

Power supply mode DC

Maximum number of power chassis Single-plane chassis: (8 channels/PEM)
inputs x 5 PEMs = (2 channel/PM) x 4 PMs x
5 PEMs = 40 channels

Rated input voltage [V] –48 V/–60 V

Input voltage range [V] –40 V to –72 V

Maximum input current [A] 46 A/single-module

Rated output power [W] 3000 W

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Item Specification

Maximum input cable size [mm²] 35 mm²/channel

Front-end circuit breaker/fuse [A] > 63A/single-module

Airflow direction From front to back

Noise at normal temperature (acoustic Complies with the NEBS standard (<
power) [dB(A)] 78 dB(A) @ 27°C).

Number of slots 22

Number of service board slots 0

Redundant MPUs 1:1

Redundant Switch fabrics 7+1

Redundant CMUs 1+1

Redundant power supply N+1

Redundant fans The fan tray assemblies are located in
the upper and lower areas at the rear
of the chassis. The distribution in each
area is as follows:
Three fan tray assemblies for 1.6T,
allowing the device to work properly
for a short time at 40ºC if a single fan
module fails.

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

Restriction on the operating ≤ 0.5°C/min (32.9°F/min), non-
temperature variation rate [°C(°F)] condensing

Storage temperature [°C(°F)] –40°C to +70°C (–40°F to +158 °F)

Long-term operating relative humidity 5% RH to 85% RH, non-condensing
[RH]

Short-term operating relative humidity 5% RH to 95% RH, non-condensing
[RH]

Storage relative humidity [RH] 5% RH to 95% RH, non-condensing

Long-term operating altitude [m(ft.)] 3000M @ 40°C

Storage altitude [m(ft.)] < 5000 m (16404.2 ft.)

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Table 3-349 Technical specifications of the CR5B0BKPCA50
Item Specification

Cabinet installation standards The chassis can be installed in a
standard 19-inch 1000 mm deep
cabinet. By default, the customized
A610 cabinet is used.

Dimensions without packaging (H x W 1955 mm x 442 mm x 830 mm (76.97
x D) [mm(in.)] in. x 17.40 in. x 32.68 in.)

Chassis height [U] 44U

Weight without packaging [kg(lb)] 205 kg (451.94 lb)

Weight with packaging [kg(lb)] 454 kg (1000.89 lb)

Weight without packaging (full 400G 2+8 cluster: 485 kg (1069.42 lb)
configuration) [kg(lb)] 1T 2+8 cluster: 506 kg (1115.73 lb)
1.6T 2+8 cluster: 528.4 kg (1164.90 lb)
NOTE
The weight of a device can be estimated
based on the board configuration using
Info-Finder Hardware Configuration.

Typical power consumption (with 400G 2+2 cluster:2310 W 400G 2+4
configuration) [W] cluster:3190 W 400G 2+8 cluster:5910
W
1T 2+2 cluster:3500 W 1T 2+4
cluster:4900 W 1T 2+8 cluster:9200 W
1.6T 2+2 cluster: 7450 W 1.6T 2+4
cluster: 8520 W 1.6T 2+8 cluster:
16230 W
NOTE
The power consumption of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

Typical heat dissipation (with 400G 2+2 cluster:7494.6 BTU/hour
configuration) [BTU/hour] 400G 2+4 cluster:10349.7 BTU/hour
400G 2+8 cluster:19174.5 BTU/hour
1T 2+2 cluster:11355.5 BTU/hour 1T
2+4 cluster:15897.7 BTU/hour 1T 2+8
cluster:29848.7 BTU/hour
1.6T 2+2 cluster:24170.9 BTU/hour
1.6T 2+4 cluster:27642.5 BTU/hour
1.6T 2+8 cluster:52656.9 BTU/hour
NOTE
The heat dissipation of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

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Hardware Guide 3 Hardware Description

Item Specification

MTBF [year] 15.06 year

MTTR [hour] 0.5 hour

Availability 0.99999

Power supply mode AC

Maximum number of power chassis Double-plane chassis: (4 channels/
inputs PEM) x 5 PEMs = (1 channel/PM) x 4
PMs x 5 PEMs = 20 channels

Rated input voltage [V] 200 V to 240 V

Input voltage range [V] Maximum range: 180 V to 264 V
Rated voltage of the 220 V power grid:
200 V to 240 V

Maximum input current [A] 16 A/single-module

Rated output power [W] 3000 W

Maximum input cable size [mm²] Standard C19 cable

Front-end circuit breaker/fuse [A] 16A/single-module

Airflow direction From front to back

Noise at normal temperature (acoustic Complies with the NEBS standard (<
power) [dB(A)] 78 dB(A) @ 27°C).

Number of slots 22

Number of service board slots 0

Redundant MPUs 1:1

Redundant Switch fabrics 7+1

Redundant CMUs 1+1

Redundant power supply N+N

Redundant fans The fan tray assemblies are located in
the upper and lower areas at the rear
of the chassis. Each area is as follows:
(400G/1T configuration) Two fan tray
assemblies, allowing the device to
work properly for a short time at 40ºC
if a single fan module fails.
Three fan assemblies are configured
for 1.6T, allowing the device to work
properly for a short time at 40ºC if a
single fan module fails.

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Item Specification

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

Restriction on the operating ≤ 0.5°C/min (32.9°F/min), non-
temperature variation rate [°C(°F)] condensing

Storage temperature [°C(°F)] –40°C to +70°C (–40°F to +158 °F)

Long-term operating relative humidity 5% RH to 85% RH, non-condensing
[RH]

Short-term operating relative humidity 5% RH to 95% RH, non-condensing
[RH]

Storage relative humidity [RH] 5% RH to 95% RH, non-condensing

Long-term operating altitude [m(ft.)] 3000M @ 40°C

Storage altitude [m(ft.)] < 5000 m (16404.2 ft.)

Table 3-350 Technical specifications of the CR5B0BKPCD50
Item Specification

Cabinet installation standards The chassis can be installed in a
standard 19-inch 1000 mm deep
cabinet. By default, the customized
A610 cabinet is used.

Dimensions without packaging (H x W 1955 mm x 442 mm x 830 mm (76.97
x D) [mm(in.)] in. x 17.40 in. x 32.68 in.)

Chassis height [U] 44U

Weight without packaging [kg(lb)] 205 kg (451.94 lb)

Weight with packaging [kg(lb)] 454 kg (1000.89 lb)

Weight without packaging (full 400G 2+8 cluster: 485 kg (1069.42 lb)
configuration) [kg(lb)] 1T 2+8 cluster: 506 kg (1115.73 lb)
1.6T 2+8 cluster: 528.4 kg (1164.90 lb)
NOTE
The weight of a device can be estimated
based on the board configuration using
Info-Finder Hardware Configuration.

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Item Specification

Typical power consumption (with 400G 2+2 cluster:2310 W 400G 2+4
configuration) [W] cluster:3190 W 400G 2+8 cluster:5910
W
1T 2+2 cluster:3500 W 1T 2+4
cluster:4900 W 1T 2+8 cluster:9200 W
1.6T 2+2 cluster: 7450 W 1.6T 2+4
cluster: 8520 W 1.6T 2+8 cluster:
16230 W
NOTE
The power consumption of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

Typical heat dissipation (with 400G 2+2 cluster:7494.6 BTU/hour
configuration) [BTU/hour] 400G 2+4 cluster:10349.7 BTU/hour
400G 2+8 cluster:19174.5 BTU/hour
1T 2+2 cluster:11355.5 BTU/hour 1T
2+4 cluster:15897.7 BTU/hour 1T 2+8
cluster:29848.7 BTU/hour
1.6T 2+2 cluster:24170.9 BTU/hour
1.6T 2+4 cluster:27642.5 BTU/hour
1.6T 2+8 cluster:52656.9 BTU/hour
NOTE
The heat dissipation of a device can be
estimated based on the board
configuration using Info-Finder Hardware
Configuration.

MTBF [year] 15.06 year

MTTR [hour] 0.5 hour

Availability 0.99999

Power supply mode DC

Maximum number of power chassis Double-plane chassis: (4 channels/
inputs PEM) x 5 PEMs = (1 channel/PM) x 4
PMs x 5 PEMs = 20 channels

Rated input voltage [V] -48 V /60 V

Input voltage range [V] –40 V to –70 V

Maximum input current [A] 46 A/single-module

Rated output power [W] 2200 W

Maximum input cable size [mm²] 35 mm²/channel

Front-end circuit breaker/fuse [A] > 63A/single-module

Airflow direction From front to back

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Item Specification

Noise at normal temperature (acoustic Complies with the NEBS standard (<
power) [dB(A)] 78 dB(A) @ 27°C).

Number of slots 22

Number of service board slots 0

Redundant MPUs 1:1

Redundant Switch fabrics 7+1

Redundant CMUs 1+1

Redundant power supply N+N

Redundant fans The fan tray assemblies are located in
the upper and lower areas at the rear
of the chassis. Each area is as follows:
(400G/1T configuration) Two fan tray
assemblies, allowing the device to
work properly for a short time at 40ºC
if a single fan module fails.
Three fan assemblies are configured
for 1.6T, allowing the device to work
properly for a short time at 40ºC if a
single fan module fails.

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

Restriction on the operating ≤ 0.5°C/min (32.9°F/min), non-
temperature variation rate [°C(°F)] condensing

Storage temperature [°C(°F)] –40°C to +70°C (–40°F to +158 °F)

Long-term operating relative humidity 5% RH to 85% RH, non-condensing
[RH]

Short-term operating relative humidity 5% RH to 95% RH, non-condensing
[RH]

Storage relative humidity [RH] 5% RH to 95% RH, non-condensing

Long-term operating altitude [m(ft.)] 3000M @ 40°C

Storage altitude [m(ft.)] < 5000 m (16404.2 ft.)

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NO TE

● About condensation
The ability of air to contain moisture reduces as the temperature decreases. There is a
relationship between temperature and relative humidity. As the temperature decreases,
the air becomes more saturated with moisture, meaning the relative humidity increases.
But at a low enough temperature (called the dew point), the air can no longer contain
moisture, which is then precipitated as liquid water. Such water on the surface of
relevant equipment is called condensation.
● Hazards of condensation
When condensation mixes with dust inside the equipment, it forms conductive channels
that affect the electrical insulation of the equipment. As a result, a non-conductive area
of the equipment can become conductive, causing the equipment to malfunction.
● Conditions that cause condensation
Condensation is related to temperature changes and humidity. It occurs when the
temperature continues to decrease below the dew point at a given humidity. For
example, given that the relative humidity is 50% RH and the temperature is 25°C (77°F),
condensation occurs when the temperature decreases below 13.9°C (57.02°F).
3.3.2 Power Supply System

3.3.2.1 NE5000E CCC-A Power Supply System

3.3.2.1.1 Overview

Introduction to Modules
As shown in Figure 3-190, the NE5000E CCC-A power system is located at the top
of the chassis. The main components are the PMs, PMUs, and switches in the front
of the chassis and the PEMs at the rear of the chassis. Table 3-351 describes the
functions of each module.

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Figure 3-190 Main components of the power system

Table 3-351 Functions of main components of the NE5000E CCC-A power system
Component Description

1 PM Converts the power supplied to the PEM and supplies
power to the entire device through the backplane.

2 Switch Controls the power output of PMs. The two switches back
up each other. When one or two switches are in the ON
state, the power output of PMs is enabled.

3 PMU Manages PMs and PEMs by monitoring their working
status and reporting the status to the host.

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Component Description

4 PEM Connects to the external power supply system and
supplies power to the NE5000E CCC-A. The right and left
parts of the PEM correspond to power supply areas A and
B, respectively.
Power supply areas A and B are two power supply
systems with different sources. The system connects to
different power supply systems, ensuring that the system
remains powered-on if one power supply system fails.
NOTE
PEMs are integrated into the chassis and do not need to be
configured onsite. Do not remove and install PEMs onsite.

Power Module Mappings

The NE5000E CCC-A supports multiple power supply scenarios, which vary in the
installed PEMs and PMs. Table 3-352 lists the mappings between power supply
scenarios and PEMs/PMs.

Table 3-352 Mappings between power supply scenarios and PEMs/PMs on the
NE5000E CCC-A

Power Supply Scenario PEM PM

-48 V DC power supply DC PEM DC PM

AC power supply ● AC PEM ● 2700 W AC PM
● AC&HVDC PEM ● 3000 W AC&HVDC
PM

240 V HVDC power AC/HVDC PEM 3000 W AC&HVDC PM
supply

380 V HVDC power AC/HVDC PEM 3000 W AC&HVDC PM
supply

Dual Input AC&HVDC Dual Input AC&HVDC Dual Input AC&HVDC
power supply PEM PM

The NE5000E CCC-A has two planes and supports N+N power module backup. The
power supply system supports the backup of power supply areas A and B on the
user side. Every N power modules are connected to one power supply area,
ensuring that the entire system can work properly if any power supply area fails.

The NE5000E CCC-A has five PEMs. Each PEM has four inputs. The NE5000E CCC-
A provides 20 inputs (10 inputs on each of area A and area B) to achieve a
maximum of 10+10 backup. Figure 3-191 and Table 3-353 show the mappings
between PEMs and PMs

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Figure 3-191 Connections between PEMs and PMs

Table 3-353 Mappings between PEMs and PMs
Pow Na Location
er me
Sup
ply
Are
a

A PEM A1 A2 A3 A4 A5 A6 A7 A8 A9 A10

PM A1 A2 A3 A4 A5 A6 A7 A8 A9 A10

B PEM B1 B2 B3 B4 B5 B6 B7 B8 B9 B10

PM B1 B2 B3 B4 B5 B6 B7 B8 B9 B10

NE5000E CCC-A chassis B has a single plane and supports –48 V DC dual-input
PEMs. The power system consists of 20 PMs that are working in N+M backup
mode (N indicates the number of working modules and M indicates the number
of backup modules). The value M is determined based on the PM model and
version.
There are five PEMs. Each PEM has eight inputs. There are altogether 40 inputs
(20 inputs in each of area A and area B). Each PM has two inputs. The two inputs
are from power supply areas A and B, respectively. In this manner, power supply
areas A and B back up each other. A maximum of 20 PMs can be configured based
on the N+1 backup mechanism.. Figure 3-192 and Table 3-353 show the
mappings between PEMs and PMs

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Figure 3-192 Connections between PEMs and PMs

Table 3-354 Mappings between PEMs and PMs
Name Location

PEM A1/B1 A2/B2 A3/B3 ...... A18/B1 A19/B1 A20/B2
8 9 0

PM 1 2 3 ...... 18 19 20

Power Supply Principles
PMs can be configured based on the overall power consumption of the device to
flexibly supply power.
For the CCC-A in dual-plane mode, if –48 V DC power supply is provided, the
output power of the DC PM is 2200 W. PMs are configured based on the N+N

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backup mechanism. To be specific, N (N>=1) PMs are configured for each of area
A and area B on the user side. The value of N x 2200 W must be greater than the
power consumption of the entire system. Table 3-355 shows the details.

NO TE

If PMs are not fully configured, power cables are routed only for the PEM interfaces whose
corresponding PMs are installed. To facilitate the deployment of new power cables during
capacity expansion of PMs, you are advised to configure the PMs from the top down and
leave a filler panel in the position where no PM is installed.

Table 3-355 Power supply examples

Overall Power PM Configuration PEM Cabling N+N
Consumption Backup

P<2200W 1,2 A1,B1 1+1

2200W=<P<4400 1,2,3,4 A1,B1;A2,B2 2+2
W

4400W=<P<6600 1,2,3,4,5,6 A1,B1;A2,B2;A3,B3 3+3
W

... ... ... ...

19800W=<P<220 1,2,3,4,5,6,7,8,9,10,11, A1,B1;A2,B2;A3,B3;A4,B 10+10
00W 12,13,14,15,16,17,18, 4;A5,B5;A6,B6;A7,B7;A8
19,20 ,B8;A9,B9;A10,B10

CCC-A chassis B in single-plane mode supports –48 V DC dual-input PEMs. the
output power of the DC PM is 2200 W. PMs are configured based on the N+M
backup mechanism. To be specific, N (M>=1) PMs are configured for each of area
A and area B on the user side. The value of N x 2200 W must be greater than the
power consumption of the entire system. Table 3-356 shows the details.

NO TE

If PMs are not fully configured, power cables are routed only for the PEM interfaces whose
corresponding PMs are installed. To facilitate the deployment of new power cables during
capacity expansion of PMs, you are advised to configure the PMs from the top down and
leave a filler panel in the position where no PM is installed.

Table 3-356 Power supply examples

Overall Power PM Configuration PEM Cabling N+1
Consumption Backup

P<2200W 1,2 A1,B1,A2,B2 1+1

2200W≤P<4400 1,2,3 A1,B1,A2,B2,A3,B3 2+1
W

4400W≤P<6600 1,2,3,4 A1,B1,A2,B2,A3,B3,A4,B 3+1
W 4

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Overall Power PM Configuration PEM Cabling N+1
Consumption Backup

... ... ... ...

48400W≤P<5060 1,2,3,4,5,6,7,8,9,10,11, A1,B1,A2,B2,A3,B3…… 19+1
0W 12,13,14,15,16,17,18, A20,B20
19,20

3.3.2.1.2 System Power Supply Architecture
NE5000E CCC-A chassis in dual-plane mode uses the non-partitioned power
supply architecture. The NE5000E CCC-A is connected to the power backplane and
system backplane through the BUSBAR.
As shown in Figure 3-193, after the external power is input to PMs through PEMs,
the PMs convert power and output the power to the power supply backplane.
Each PEM provides four channels of power inputs (with two partitioned into
power supply source A and two partitioned into power supply source B) for four
PMs. There are 20 PMs on the device.

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Figure 3-193 Power supply

NE5000E CCC-A chassis B in single-plane mode uses the non-partitioned power
supply architecture. The NE5000E CCC-A is connected to the power backplane and
system backplane through the BUSBAR.
As shown in Figure 3-194, after the external power is input to PMs through PEMs,
the PMs convert power and output the power to the power supply backplane.
Each PEM provides eight channels of power inputs (with two partitioned into
power supply source A and two partitioned into power supply source B) for four
PMs. There are 20 PMs on the device.

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Figure 3-194 Power supply

3.3.2.1.3 PDC-2200WB (PSU-PDC-2200WB-PM2200W DC Power Supply)

Overview

Table 3-357 Basic information about the PDC-2200WB
Item Details

Description PSU-PDC-2200WB-PM2200W DC
Power Supply

Part Number 02311CNP

Model PDC-2200WB

NO TE

The external power is input to PMs through PEMs, the PMs perform current equalization
and regulation and output the power to the power supply backplane. The DC PMs have
dual redundant inputs (Input A and Input B). Each DC PM can be connected to two
separate sources. If two sources are connected and the voltage values of the two sources
are different, the source with higher DC voltage provides greater current.

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Appearance

Figure 3-195 Appearance of the PDC-2200WB

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=02311CNP&productModel=PDC-2200WB#matchRelation

Panel

Figure 3-196 Panel of the PDC-2200WB

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Table 3-358 Indicators on the PDC-2200WB
Silkscreen Name Color Status Description

INPUT Input Green On Normal
Indicator status.

Green Blinking The input
voltage
exceeds the
preset
operating
voltage range.

- Off ● No DC
input.
● Positive
and
negative
terminals
are
incorrectly
connected
to each
other.

OUTPUT Output Green On Normal
Indicator status.

- Off ● The power
module
does not
have DC
output.
● Output
voltage is
too low.

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Silkscreen Name Color Status Description

ALARM Alarm Red On ● Fans are
Indicator faulty.
● The device
is powered
off due to
overtempe
rature.
● The device
is powered
off due to
over-
output-
voltage.
● The device
is powered
off due to
overcurren
t or short
circuit.
● The
current of
modules is
seriously
imbalance
d.

- Off Normal
status.

Functions and Features

Table 3-359 Functions and features of the PDC-2200WB
Functions and Features Description

Input undervoltage protection In this protection state, the power
module stops supplying power, but
automatically resumes power supply
when the system recovers.
The INPUT indicator blinks green.

Input overcurrent protection In this protection state, the power
module stops supplying power and
cannot automatically resume power
supply.
The INPUT indicator is off.

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Functions and Features Description

Output overvoltage protection In this protection state, the power
module is turned off and stops
supplying power. When the system
recovers from input overcurrent, the
power module cannot automatically
resume power supply.
The OUTPUT indicator is off.

Output current limiting protection In this protection state, the power
module limits the current within a
certain range, but automatically
resumes power supply when the
system recovers.
The OUTPUT indicator is steady green.

Output short circuit protection In this protection state, the power
module supplies power intermittently
and limits the current within a certain
range, but automatically resumes
power supply when the system
recovers.
The OUTPUT indicator is off.

Overtemperature protection When the temperature exceeds 55°C
(131°F), the power module stops
supplying power. When the
temperature falls below 55°C (131°F),
the power module automatically
resumes power supply. The OUTPUT
indicator is off.

Heat dissipation mode The power module has a built-in fan
module, which uses a front-to-back
airflow design.

Hot swap Supported.

Technical Specifications

Table 3-360 Technical specifications of the PDC-2200WB
Item Specification

Dimensions without packaging (H x W 41 mm x 106.5 mm x 485 mm (1.61 in.
x D) [mm(in.)] x 4.19 in. x 19.09 in.)

Weight without packaging [kg(lb)] 2.35 kg (5.18 lb)

Number of inputs 2

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Item Specification

Rated input voltage [V] -48 V / -60 V

Input voltage range [V] –40 V to –72 V

Maximum input current [A] 63 A

Rated output voltage [V] 53.5 V

Rated output current [A] 42 A

Rated output power [W] 2200 W

Power supply efficiency 0.94

Power dissipation Mode Built-in fan

3.3.2.1.4 Single-input DC PEM
DC power is input through DC PEMs. Each PEM provides four power inputs. The
two terminals on the right of a PEM connect to power supply area A, and the two
terminals on the left connect to power supply area B. DC PEMs are fully
configured when a device is delivered.

Appearance
Figure 3-197 shows the appearance of a DC PEM.

Figure 3-197 DC PEM

Panel

Table 3-361 Interface description
Interface Description Power Cable Terminal
Name

NEG(-) Input interface ● JG2-25mm2-M6-150A, applicable to
for –48 V power 25mm2 power cables
supply ● JG2-34.3mm2-M6(1/4")-134A, applicable
RTN(+) Input interface to 35mm2 power cables
for BGND power
supply

Input Requirements
● Protection components must be provided for PDFs to ensure that the rated
current of each channel is not less than 63 A.

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NO TICE

Note the derating requirements of protection components when using
protection components such as fuses and circuit breakers. If the current of a
PDF is less than 63 A, it cannot supply power to the NE5000E. In this case,
reconstruct power supply in the equipment room.

● If the front-end PDF does not provide enough power inputs, configure a PDB
that meets the following requirements:
– The current of each channel output by the DC PDB is not less than 63 A.
– Double-channel backup is used.
– The input current is not less than the sum of current of its connected
output lines.

3.3.2.1.5 PDC-2200WC (PSU-PDC-2200WC-PM2200W DC Power Supply)

Overview

Table 3-362 Basic information about the PDC-2200WC
Item Details

Description PSU-PDC-2200WC-PM2200W DC
Power Supply

Part Number 02312GDC

Model PDC-2200WC

Remarks 1. PMs can be configured based on the
overall power consumption of the
device to implement flexible power
distribution.
2. For PMs of the same type or
different types, the power indicator
may have slight color variation due to
temperature fluctuation or material
tolerance.
3. Ensure that the upstream circuit
breaker/fuse connects to the power
supply in one-to-one mode. Do not
connect one circuit breaker/fuse to
multiple power supplies.

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NO TICE

● The external power is input to PMs through PEMs. The PMs output power to
the power supply backplane. The DC power supply uses dual inputs (input A
and input B). Two inputs of each DC power supply may be connected to two
different sources, and if the voltage values of the two sources are different, the
source with a higher DC voltage value provides a larger or all current.
● Ensure that the upstream input and circuit breakers on areas A and B meet the
power supply requirements of the entire system. Otherwise, the power supply
of the entire system may be affected if one area cannot provide all the power
required by the entire system.

Appearance

Figure 3-198 Appearance of the PDC-2200WC

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=02312GDC&productModel=PDC-2200WC#matchRelation

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Panel

Figure 3-199 Panel of the PDC-2200WC

Table 3-363 Indicators on the PDC-2200WC
Silkscreen Name Color Status Description

INPUT Input Green On Normal
Indicator status.

Green Blinking The input
voltage
exceeds the
preset
operating
voltage range.

- Off ● No DC
input.
● Positive
and
negative
terminals
are
incorrectly
connected
to each
other.

OUTPUT Output Green On Normal
Indicator status.

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Silkscreen Name Color Status Description

- Off ● The power
module
does not
have DC
output.
● Output
voltage is
too low.

ALARM Alarm Red On ● Fans are
Indicator faulty.
● The device
is powered
off due to
overtempe
rature.
● The device
is powered
off due to
over-
output-
voltage.
● The device
is powered
off due to
overcurren
t or short
circuit.
● The
current of
modules is
seriously
imbalance
d.

- Off Normal
status.

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Functions and Features

Table 3-364 Functions and features of the PDC-2200WC
Functions and Features Description

Input undervoltage protection In this protection state, the power
module stops supplying power, but
automatically resumes power supply
when the system recovers.
The INPUT indicator blinks green.

Input overcurrent protection In this protection state, the power
module stops supplying power and
cannot automatically resume power
supply.
The INPUT indicator is off.

Output overvoltage protection In this protection state, the power
module is turned off and stops
supplying power. When the system
recovers from input overcurrent, the
power module cannot automatically
resume power supply.
The OUTPUT indicator is off.

Output current limiting protection In this protection state, the power
module limits the current within a
certain range, but automatically
resumes power supply when the
system recovers.
The OUTPUT indicator is steady green.

Output short circuit protection In this protection state, the power
module supplies power intermittently
and limits the current within a certain
range, but automatically resumes
power supply when the system
recovers.
The OUTPUT indicator is off.

Overtemperature protection When the temperature exceeds 55°C
(131°F), the power module stops
supplying power. When the
temperature falls below 55°C (131°F),
the power module automatically
resumes power supply. The OUTPUT
indicator is off.

Heat dissipation mode The power module has a built-in fan
module, which uses a front-to-back
airflow design.

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Functions and Features Description

Hot swap Supported.

Technical Specifications

Table 3-365 Technical specifications of the PDC-2200WC

Item Specification

Dimensions without packaging (H x W 41 mm x 106.5 mm x 485 mm (1.61 in.
x D) [mm(in.)] x 4.19 in. x 19.09 in.)

Weight without packaging [kg(lb)] 2.4 kg (5.29 lb)

Number of inputs 2

Rated input voltage [V] -48 V / -60 V

Input voltage range [V] –40 V to –72 V

Maximum input current [A] 63 A

Rated output voltage [V] 53.5 V

Rated output current [A] 42 A

Rated output power [W] 2200 W

Power supply efficiency 0.94

Power dissipation Mode Built-in fan

3.3.2.1.6 Dual-input DC PEM

DC PEMs are delivered with the device to provide DC power input. Each PEM
provides eight power inputs. The four terminals on the right back of a PEM
connect to power supply area A, and the four terminals on the left back connect
to power supply area B. Power supply areas A and B back up each other. If one
power supply area has no current output, the other power supply area can provide
all current required for the device to work properly.

Appearance

Figure 3-200 shows the appearance of a DC PEM.

Figure 3-200 DC PEM

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Panel

Table 3-366 Interface description
Interface Description Power Cable Terminal
Name

NEG(-) Input interface ● JG2-25mm2-M6-150A, applicable to
for –48 V power 25mm2 power cables
supply ● JG2-34.3mm2-M6(1/4")-134A, applicable
RTN(+) Input interface to 35mm2 power cables
for BGND power
supply

Input Requirements
● Protection components must be provided for PDFs to ensure that the rated
current of each channel is not less than 63 A.

NO TICE

Note the derating requirements of protection components when using
protection components such as fuses and circuit breakers. If the current of a
PDF is less than 63 A, it cannot supply power to the NE5000E. In this case,
reconstruct power supply in the equipment room.
The PEM requires two power inputs for backup.

● If the front-end PDF does not provide enough power inputs, configure a PDB
that meets the following requirements:
– The current of each channel output by the DC PDB is not less than 63 A.
– Double-channel backup is used.
– The input current is not less than the sum of current of its connected
output lines.

3.3.2.1.7 PAC-2700WB (2700W AC Power module)

Overview

Table 3-367 Basic information about the PAC-2700WB
Item Details

Description 2700W AC Power module

Part Number 02310SHP

Model PAC-2700WB

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NO TE

The PM accesses external AC power through PEMs, the PMs convert AC power into
regulated DC power and output the power to the power supply backplane.

Appearance

Figure 3-201 Appearance of the PAC-2700WB

Version Mapping
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where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=02310SHP&productModel=PAC-2700WB#matchRelation

Panel

Figure 3-202 Panel of the PAC-2700WB

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Hardware Guide 3 Hardware Description

Table 3-368 Indicators on the PAC-2700WB
Silkscreen Name Color Status Description

INPUT Input Green On Normal
Indicator status.

Green Blinking The input
voltage
exceeds the
preset
operating
voltage range.

- Off No AC input.

OUTPUT Output Green On Normal
Indicator status.

- Off The power
module does
not have
output.

ALARM Alarm Red On ● Fans are
Indicator faulty.
● The device
is powered
off due to
overtempe
rature.
● The device
is powered
off due to
over-
output-
voltage.
● The device
is powered
off due to
overcurren
t or short
circuit.
● The
current of
modules is
seriously
imbalance
d.

- Off Normal
status.

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Technical Specifications

Table 3-369 Technical specifications of the PAC-2700WB
Item Specification

Dimensions without packaging (H x W 41 mm x 106.5 mm x 485 mm (1.61 in.
x D) [mm(in.)] x 4.19 in. x 19.09 in.)

Weight without packaging [kg(lb)] 2 kg (4.41 lb)

Number of inputs 1

Rated input voltage [V] 200V AC to 240V AC

Input voltage range [V] 180V AC to 264V AC

Maximum input current [A] 16 A

Rated output voltage [V] 53.5 V

Rated output current [A] 56 A

Rated output power [W] 2700 W

Power supply efficiency 0.96

Power dissipation Mode Built-in fan

Table 3-370 Technical specifications of the PAC-2700WB
Item Specification

Dimensions without packaging (H x W 41 mm x 106.5 mm x 485 mm (1.61 in.
x D) [mm(in.)] x 4.19 in. x 19.09 in.)

Weight without packaging [kg(lb)] 2 kg (4.41 lb)

Number of inputs 1

Rated input voltage [V] 200V AC to 240V AC

Input voltage range [V] 180V AC to 264V AC

Maximum input current [A] 16 A

Rated output voltage [V] 53.5 V

Rated output power [W] 2700 W

Power supply efficiency 0.96

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NO TE

The AC power system supports 200-240 V AC power. It supports 110 V dual-live-wire inputs
but not 110 V AC single-phase inputs. If 110 V dual-live-wire inputs are used, the voltage
must range from 180 V to 264 V.

3.3.2.1.8 AC PEM
AC power is input through AC PEMs. Each PEM provides four power inputs. The
two terminals on the right of a PEM connect to power supply area A, and the two
terminals on the left connect to power supply area B. AC PEMs are fully
configured when a device is delivered.

Appearance
Figure 3-203 shows the appearance of a PEM.

Figure 3-203 AC PEM

Panel

Table 3-371 Interface description
Interface Description Power Cable Terminal
Name

C20 AC Input interface C19
socket for 220 V AC
power supply

Input Requirements
● The 220 V AC input is supported. In the 110 V AC scenario, the dual-live wire
input mode can be used. Figure 3-204 shows the connection.

Figure 3-204 110 V dual-live wire connection

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Hardware Guide 3 Hardware Description

● Protection components must be provided for PDFs to ensure that the rated AC
current of each channel is not less than 16 A.

NO TICE

Note the derating requirements of protection components when using
protection components such as fuses and circuit breakers.

NO TE

The input circuit breakers of a PDF must match the output circuit breakers.
● If the front-end PDF does not provide enough power inputs, configure a PDB
that meets the following requirements:
– The current of each channel output by the AC PDB is not less than 16 A.
– Double-channel backup is used.
– The input current is not less than the sum of current of its connected
output lines.

3.3.2.1.9 PHD-3000WA (3000W AC&HVDC Power Module)

Overview

Table 3-372 Basic information about the PHD-3000WA
Item Details

Description 3000W AC&HVDC Power Module

Part Number 02310VMA

Model PHD-3000WA

NO TE

The external power is input to PMs through PEMs, the PMs convert AC power into
regulated DC power and output the power to the power supply backplane.
The AC power system supports 200-240 V AC power. It supports 110 V dual-live-wire inputs
but not 110 V AC single-phase inputs. If 110 V dual-live-wire inputs are used, the voltage
must range from 180 V to 264 V.
240 V HVDC power system, the input voltage range from 192 V to 288 V DC. 380 V HVDC
power system, the input voltage range from 260 V to 400 V.

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Appearance

Figure 3-205 Appearance of the PHD-3000WA

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=02310VMA&productModel=PHD-3000WA#matchRelation

Panel

Figure 3-206 Panel of the PHD-3000WA

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Hardware Guide 3 Hardware Description

Table 3-373 Indicators on the PHD-3000WA
Silkscreen Name Color Status Description

INPUT Input Green On Normal
Indicator status.

Green Blinking The input
voltage
exceeds the
preset
operating
voltage range.

- Off No input.

OUTPUT Output Green On Normal
Indicator status.

- Off ● The power
module
does not
have DC
output.
● Output
voltage is
too low.

ALARM Alarm Red On ● Fans are
Indicator faulty.
● The device
is powered
off due to
overtempe
rature.
● The device
is powered
off due to
over-
output-
voltage.
● The device
is powered
off due to
overcurren
t or short
circuit.
● The
current of
modules is
seriously
imbalance
d.

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Silkscreen Name Color Status Description

- Off Normal
status.

Technical Specifications

Table 3-374 Technical specifications of the PHD-3000WA
Item Specification

Dimensions without packaging (H x W 41 mm x 106.5 mm x 485 mm (1.61 in.
x D) [mm(in.)] x 4.19 in. x 19.09 in.)

Weight without packaging [kg(lb)] 2.26 kg (4.98 lb)

Number of inputs 1

Rated input voltage [V] 200 V AC to 240 V AC (220 V power
grid)
240 V DC/380 V DC

Input voltage range [V] 180 V AC to 264 V AC
192 V DC to 400 V DC

Maximum input current [A] AC: 16A
HVDC: 14A

Rated output voltage [V] 53.5 V

Rated output current [A] 56 A

Rated output power [W] 3000 W

Power supply efficiency 0.94

Power dissipation Mode Built-in fan

3.3.2.1.10 AC&HVDC PEM
AC or HVDC power is input through AC&HVDC PEMs. Each PEM provides four
power inputs. The two terminals on the right of a PEM connect to power supply
area A, and the two terminals on the left connect to power supply area B.
AC&HVDC PEMs are fully configured when a device is delivered.

Appearance
Figure 3-207 shows the appearance of an AC&HVDC PEM.

Figure 3-207 AC&HVDC PEM

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Panel

Table 3-375 Interface description
Interface Description Power Cable Terminal
Name

Input 220 V AC/240V HVDC dedicated terminal (240 V)
interface HVDC and 380 V HVDC dedicated terminal (380V)
for power HVDC power
supply input interfaces

Input Requirements
● The 220 V AC input is supported. In the 110 V AC scenario, the dual-live wire
input mode can be used. Figure 3-208 shows the connection.

Figure 3-208 110 V dual-live wire connection

● Protection components must be provided for PDFs to ensure that the rated AC
current of each channel is not less than 16 A and the rated HVDC current of
each channel is not less than 14 A.

NO TICE

Note the derating requirements of protection components when using
protection components such as fuses and circuit breakers.

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NO TE

The input circuit breakers of a PDF must match the output circuit breakers.
In HVDC application scenarios, ensure that the protection components meet HVDC
certification and the fuses and circuit breakers meet positive and negative pole
protection.
● If the front-end PDF does not provide enough power inputs, configure a PDB
that meets the following requirements:
– The current of each channel output by the AC PDB is not less than 16 A.
– The current of each channel output by the HVDC PDB is not less than 14
A.
– Double-channel backup is used.
– The input current is not less than the sum of current of its connected
output lines.

3.3.2.1.11 PAH-3000WA (02312JEA: 3000W Dual Inputs AC&HVDC Power Module)

Overview

Table 3-376 Basic information about the PAH-3000WA
Item Details

Description 3000W Dual Inputs AC&HVDC Power
Module

Part Number 02312JEA

Model PAH-3000WA

Remarks 1. PMs can be configured based on the
overall power consumption of the
device to implement flexible power
distribution.
2. For PMs of the same type or
different types, the power indicator
may have slight color variation due to
temperature fluctuation or material
tolerance.
3. Ensure that the upstream circuit
breaker/fuse connects to the power
supply in one-to-one mode. Do not
connect one circuit breaker/fuse to
multiple power supplies.

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NO TE

● After the external power is input to PMs through PEMs, the PMs output the power to
the power supply backplane. Each PM has two inputs, which are from power supply
areas A and B, respectively. The PM combines the two power inputs and outputs one.
● The power module supports AC and HVDC mixed power supply:
● If the two power supplies have different power systems, the AC power supply is
preferentially used as the active power supply (to ensure the highest power supply
efficiency), and the high-voltage DC power supply is used as the standby power
supply.
● If the two power supplies have the same power system, power supply A is
preferentially used as the active power supply, and power supply B is used as the
standby power supply.

NO TICE

1. Ensure that the upstream input and circuit breakers on areas A and B meet the
power supply requirements of the entire system. Otherwise, the power supply
of the entire system may be affected if one area cannot provide all the power
required by the entire system.
2. If the active power supply is abnormal, the system automatically switches to
the standby power supply. When the active power supply recovers, the system
automatically switches back to the active power supply.
3. When the fan of the Power Module is faulty, the Power Module hiccup occurs
every three minutes. The Power Module attempts to establish output again. At
this time, the Output Indicator is On and the Alarm Indicator is Off. If the fault
persists, the Output Indicator is Off and the Alarm Indicator is On 30 seconds
later.

Appearance

Figure 3-209 Appearance of the PAH-3000WA

Version Mapping

The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.

The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.

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enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=02312JEA&productModel=PAH-3000WA#matchRelation

Panel

Figure 3-210 Panel of the PAH-3000WA

Table 3-377 Indicators on the PAH-3000WA
Silkscreen Name Color Status Description

Input Input Green On Normal
Indicator status.

Green Blinking The voltage
slowly (0.5 of the two
Hz) inputs
exceeds the
acceptable
range.

Green Blinking The parity
rapidly (4 Hz) check of the
address signal
fails (the
power
address is
incorrect).

Output Output Green On Normal
Indicator status.

Green Blinking The parity
rapidly (4 Hz) check of the
address signal
fails (the
power
address is
incorrect).

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Silkscreen Name Color Status Description

- Off ● The power
module
does not
have DC
output.
● Output
voltage is
too low.

Alarm Alarm Red On ● Power
Indicator failure
caused by
an internal
Power
failure.
● Fans are
faulty.
● The device
is powered
off due to
overtempe
rature.
● The device
is powered
off due to
over-
output-
voltage.
● The device
is powered
off due to
overcurren
t or short
circuit.
● The
current of
modules is
seriously
imbalance
d.

Red Blinking The parity
rapidly (4 Hz) check of the
address signal
fails (the
power
address is
incorrect).

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Silkscreen Name Color Status Description

- Off Normal
status.

Functions and Features

Table 3-378 Functions and features of the PAH-3000WA
Functions and Features Description

Input undervoltage protection In this protection state, the power
module stops supplying power, but
automatically resumes power supply
when the system recovers.
The Input indicator is blinking green.

Input overvoltage protection In this protection state, the power
module stops supplying power, but
automatically resumes power supply
when the system recovers.
The Input indicator is blinking green.

Input overcurrent protection In this protection state, the power
module stops supplying power and
cannot automatically resume power
supply.
The Input indicator is off.

Output overvoltage protection If output overvoltage is caused by the
power module itself, the power
module stops supplying power and
cannot automatically resume power
supply. The Output indicator is off.
If output overvoltage is caused by
external voltage, the power module
stops supplying power, but
automatically resumes power supply
when the system recovers. The Output
indicator is steady green.

Output current limiting protection In this protection state, the power
module limits the current within a
certain range, but automatically
resumes power supply when the
system recovers.
The Output indicator is steady green.
When the output voltage is lower than
44 V DC, the Output indicator is off.

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Functions and Features Description

Output short circuit protection In this protection state, the power
module supplies power intermittently
and limits the current within a certain
range, but automatically resumes
power supply when the system
recovers.
The Output indicator is off.

Overtemperature protection When the temperature exceeds 55°C,
the power module stops supplying
power. When the temperature falls
below 55°C, the power module
automatically resumes power supply.
The Output indicator is off.

Heat dissipation mode The power module has a built-in fan
module, which uses a front-to-back
airflow design.

Dual input power supply switchover When dual power inputs are used, if
power input A fails, power input B is
automatically used. To prevent power
supply flapping, the system does not
switch back to power supply A
immediately but waits for 4.5 hours
after power supply A recovers.

Hot swap Supported

Technical Specifications

Table 3-379 Technical specifications of the PAH-3000WA

Item Specification

Dimensions without packaging (H x W 41 mm x 106.5 mm x 485 mm (1.61 in.
x D) [mm(in.)] x 4.19 in. x 19.09 in.)

Weight without packaging [kg(lb)] 2.87 kg (6.33 lb)

Number of inputs 2

Rated input voltage [V] 200 V AC to 240 V AC (220 V power
grid)
240 V DC/380 V DC

Input voltage range [V] 180 V AC to 264 V AC
192 V DC to 400 V DC

Maximum input current [A] 16 A

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Item Specification

Rated output voltage [V] 53.5 V

Rated output current [A] 56 A

Rated output power [W] 3000 W

Power supply efficiency 0.96

Power dissipation Mode Built-in fan

NO TE

The AC power supply system supports 200 V to 240 V and the power supply voltage ranges
from 180 V to 264 V. The 110 V single-phase AC input is not supported. The 110 V dual-
live-wire system must be supported. The dual-live-wire power supply voltage ranges from
180 V to 264 V.
240 V high-voltage DC power supply system, with the input voltage ranging from 192 V to
288 V. 380 V high-voltage DC power supply system with the input voltage ranging from 260
V to 400 V.

3.3.2.1.12 Dual-Input AC & HVDC PEM

Dual-input AC and high-voltage DC PEMs are fully configured when the device is
delivered. Each PEM provides eight channels of power inputs. The four terminals
on the right back of the PEM connect to power supply area A, and the four
terminals on the left back connect to power supply area B. Power supply areas A
and B back up each other. If one power supply area has no current output, the
other power supply area can provide all current required for the device to work
properly.

NO TE

● The PEM does not support on-site replacement.
● The PEM can use only AC&HVDC power cables.

Appearance

Figure 3-211 shows the appearance of a dual-input AC&HVDC PEM.

Figure 3-211 Appearance of a dual-input AC&HVDC PEM

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Panel

Table 3-380 Interface description

Interface Description Power Cable Terminal

Power 220 V AC, 240 V HVDC 3 straight female
connector HVDC, and 380 V
HVDC power
input interfaces

Input Requirements
● Protection components must be provided for PDFs to ensure that the rated AC
current of each channel is not less than 16 A and the rated HVDC current of
each channel is not less than 14 A.

NO TICE

Note the derating requirements of protection components when using
protection components such as fuses and circuit breakers.
The PEM requires two power inputs for backup.

NO TE

● The input circuit breakers of a PDF must match the output circuit breakers.
● In the AC power supply scenario, the rated voltage for single-phase AC input must
be 200–240 V AC.
● In the HVDC power supply scenario, ensure that the protection components meet
HVDC certification requirements and the fuses and circuit breakers meet positive
and negative pole protection requirements.
● If the front-end PDF does not provide enough power inputs, configure a
power distribution box (PDB) that meets the following requirements:
– The current of each output of the AC PDB is not less than 16 A.
– The current of each output of the HVDC PDB is not less than 14 A.
– The PDB supports dual-output backup.
– The input current of the PDB is not less than the sum of current of the
used outputs.

3.3.2.1.13 Switch

The switch controls the power output of PMs. The two switches back up each
other. When one or two switches are in the ON state, the power output of PMs is
enabled.

Appearance

Figure 3-212 shows the appearance of a switch.

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Figure 3-212 Main components of the power system

Panel

Table 3-381 Switch

Switch Name Description

OFF/ON Controls the device power connectivity.

Function

When one or both switches are turned on, the PMs output power, and the device
is powered on. When both switches are turned off, the PMs do not output power,
and the device is powered off.

NO TICE
Ensure that both switches are turned on when the device is running for reliability
purposes.

3.3.2.1.14 PMU

The PMU manages PMs and PEMs by monitoring their working status and
reporting the status to the host.

Appearance

Figure 3-213 shows the appearance of a PMU.

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Figure 3-213 PMU

Panel

Table 3-382
Indicator Status Description

RUN If the indicator blinks green slowly, the
board is working properly. If the
indicator blinks green quickly, the
board fails to communicate with the
main control board.

ALM If the indicator is steady red, the PM or
PMU is not working properly. If the
indicator is off, no alarms are reported.

ACT If the indicator is steady green, the
board is in the active state. If the
indicator is off, the board is in the
standby state.

Function
Supports flexible configuration, dynamic management, and voltage and current
detection functions.
Provides power alarms and supports 485 communication.

3.3.2.1.15 Power System Technical Specifications

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-48 V DC

Table 3-383 -48 V DC power system specifications

Item Description

Number of power modules 20 (full configuration)

Input channels A single-plane device is fully
configured with 40 channels, and a
dual-plane device is fully configured
with 20 channels.

Maximum input diameter 35mm^2 per input

Input voltage -40 V to -72 V (rated voltage -48
V/-60 V)

Input current A maximum of 63 A

Front-end circuit breaker/fuse No less than 63 A per module

Output channels 20 (full configuration)

Output voltage 53.5 V DC

Output current 46 A per module

Output power 2200 W per module

Typical power consumption 148.5 W per module

Typical heat dissipation 481.8 BTU/hour per module

AC

Table 3-384 AC power system specifications

Item Description

Number of power modules 20 (full configuration)

Input channels 20 (full configuration)

Maximum input diameter Standard C19 cable

Input voltage ● Voltage range:180Vac to 264Vac.
● 220 V rated voltage:200Vac to
240Vac.
● 110V rated voltage:100Vac to
120Vac, the input of double live
wires is required.

Input current 16 A per module

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Item Description

Front-end circuit breaker/fuse 16 A

Output channels 20 (full configuration)

Output voltage 53.5 V DC

Output current 56 A per module

Output power 3000 W per module

Typical power consumption 182 W per module

Typical heat dissipation 590.5 BTU/hour per module

HVDC

Table 3-385 HVDC power system specifications
Item Description

Number of power modules 20 (full configuration)

Input channels 20 (full configuration)

Maximum input diameter 2.5mm^2

Input voltage 192 V to 400 V (rated voltage 240
V/380 V)

Input current 14 A per module

Front-end circuit breaker/fuse 16 A per module

Output channels 20 (full configuration)

Output voltage 53.5 V DC

Output current 56 A per module

Output power 3000 W per module

Typical power consumption 182 W per module

Typical heat dissipation 590.5 BTU/hour per module

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Dual-Input AC&HVDC

Table 3-386 Dual-Input AC&HVDC power system specifications
Item Description

Number of power modules 20 (full configuration)

Input channels 40 (full configuration)

Maximum input diameter Standard cable

Input voltage ● HVDC:
192 V to 400 V (rated voltage 240
V/380 V)
● AC:
Voltage range:90V to 290V.
220 V rated voltage:200V to 240V.
110V rated voltage:100V to 120V,
the input of double live wires is
required.

Input current 14 A per module

Front-end circuit breaker/fuse 16 A per module

Output channels 20 (full configuration)

Output voltage 53.5 V DC

Output current 56 A per module

Output power 3000 W per module

Typical power consumption 182 W per module

Typical heat dissipation 590.5 BTU/hour per module

3.3.2.2 NE5000E CCC Power Supply System

3.3.2.2.1 Architecture of the Power Supply System
This section describes the architecture of the power supply system.
A CCC supports DC and AC power supply. An AC-DC convertor needs to be used
for AC power supply.
The power module NEPS8000-D is used to supply three DC power outputs (each
output of 75 A and a total of 8000 W) for boards, and the secondary output of the
power module provides stable 48 V/13 A power for fans.
The DC power supply system has the following features:
● The power supply system consists of two DC power modules that work in 1+1
backup mode.

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● A DC power module has three DC power inputs.
● The DC power modules provide alarm functions and support dry contact
communication and I2C communication.
● Power supply by area is used.

A CCC partitions the boards into three areas.

As shown in , the first power input supplies power for the boards in the yellow
areas; the second power input supplies power for the boards in the gray areas; the
third power input supplies power for the boards in the blue areas.

The three power inputs work independently. If only the first power input is
available, only the boards in the yellow areas can be powered on.

Power modules work in load balancing mode. If the first power input of one
power module becomes faulty, the first power input of the other power module
supplies power for the boards in the yellow areas.

DC Power Supply

Figure Schematic diagram of DC power supply shows the DC power supply
system.

Figure 3-214 Schematic diagram of DC power supply

AC Power Supply

The NE5000E AC power supply solution is to add an AC/DC converter ahead of the
8000 W DC power supply. The NE5000E AC power supply system is composed of
two 8000 W DC power modules, two AC power distribution cabinets, and six
rectifier modules. In the system, AC power is sent to the three power inputs of
each power distribution cabinet, in which three rectifier modules transform the AC

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power into DC power and send the DC power to the three DC power inputs of
each DC power module.

3.3.2.2.2 CR52-PWRB-DC (DC/DC Power
Module,8000W,-5degC,55degC,-38V--75V,-36V--75V,Main Output 67.5A*3,Auxiliary
-48V/13A,0A,I2C Communication)
The PEM is a -48V DC power entry module.

Overview

Table 3-387 Basic information about the CR52-PWRB-DC
Item Details

Description DC/DC Power
Module,8000W,-5degC,55degC,-38V--7
5V,-36V--75V,Main Output
67.5A*3,Auxiliary -48V/13A,0A,I2C
Communication

Part Number 02270089

Model CR52-PWRB-DC

Appearance

Figure 3-215 Appearance of the CR52-PWRB-DC

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Panel

Table 3-388 Indicators on the CR52-PWRB-DC
Silkscreen Name Color Status Description

POWER1 Power failure Green On The first
indicator power input
and output
are normal.

Red On The first
power input
or output is
faulty.

POWER2 Green On The second
power input
and output
are normal.

Red On The second
power input
or output is
faulty.

POWER3 Green On The third
power input
and output
are normal.

Red On The third
power input
and output
are normal.

Table 3-389 Ports on the CR52-PWRB-DC
Port Description

IN1:NEG (-) The first power input:-48 V/-60 V
power input interface

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Port Description

IN1:RTN (+) The first power input:BGND power
input interface

IN1:ON OFF The first power input:Rated current of
the air-break: 60 A.
Used to control DC power input.

IN2:NEG (-) The second power input:-48 V/-60 V
power input interface

IN2:RTN (+) The second power input:BGND power
input interface

IN2:ON OFF The second power input:Rated current
of the air-break: 60 A.
Used to control DC power input.

IN3:NEG (-) The third power input:-48 V/-60 V
power input interface

IN3:RTN (+) The third power input:BGND power
input interface

IN3:ON OFF The third power input:Rated current of
the air-break: 60 A.
Used to control DC power input.

Functions and Features

The power modules can output primary straight-through power and secondary -48
V DC regulated voltage. Functions are described as follows:

● The primary straight-through power provides short-circuit protection.
● The secondary regulated voltage output provides protection against
overcurrent, overvoltage, and short circuit.
● Power can be supplied for the boards in partitioned areas.
● Alarms of the lightning-proof failure and circuit breakers are supported.

Technical Specifications

Table 3-390 Technical specifications of the CR52-PWRB-DC

Item Specification

Dimensions without packaging (H x W 183.8 mm x 450 mm x 126.4 mm (7.24
x D) [mm(in.)] in. x 17.72 in. x 4.98 in.)

Weight without packaging [kg(lb)] 9 kg (19.84 lb)

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Item Specification

Number of inputs 3

Rated input voltage [V] –48 V/–60 V

Input voltage range [V] -38 V to -72 V

Maximum input current [A] 75 A

Rated output power [W] 8000 W

Power dissipation Mode Air cooling

3.3.2.2.3 CR5B0PWRBX61 (Power Distribution Cabinet,220V,1PH,50/60Hz,0A)
AC power input is converted into regulated DC power by an AC/DC converter.

Overview

Table 3-391 Basic information about the CR5B0PWRBX61
Item Details

Description Power Distribution
Cabinet,220V,1PH,50/60Hz,0A

Part Number 02400486

Model CR5B0PWRBX61

Appearance

Figure 3-216 Appearance of the CR5B0PWRBX61

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Technical Specifications

Table 3-392 Technical specifications of the CR5B0PWRBX61
Item Specification

Dimensions without packaging (H x W 85 mm x 550 mm x 442 mm (3.35 in. x
x D) [mm(in.)] 21.65 in. x 17.4 in.)

Weight without packaging [kg(lb)] 10 kg (22.05 lb)

Number of inputs 3

Rated input voltage [V] 220 V rated voltage:200 V to 240 V
110 V rated voltage:100 V to 120 V,
the input of double live wires is
required.

Input voltage range [V] 90 V to 290 V

Maximum input current [A] 18.5 A

Rated output voltage [V] 53.5 V

Rated output current [A] 50 A

Power dissipation Mode Air cooling

3.3.3 FAN
This section describes the appearance, functions, and technical specifications of
the fan module.

3.3.3.1 NE5000E CCC-A Heat Dissipation System

3.3.3.1.1 System Air Channel
The NE5000E CCC-A supports a maximum of eight fan modules. For a platform
with forwarding capacity less than 400 Gbit/s and 1 Tbit/s, only four fan modules

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need to be configured. For a platform with forwarding capacity less than 1.6
Tbit/s, only six fan modules need to be configured.Each fan module consists of six
fans.
Figure 3-217 shows the locations of the fan module and the air intake vent.

Figure 3-217 Locations of the fan module and the air channel

1. Horizontal air 2. Upper air intake 3. Lower air intake 4. Fan module
intake vent vent vent

The NE5000E CCC-A provides three air channels. Each of the upper board cage
and the lower board cage has an air channel. Both air channels draw air from the
front and exhaust air from the rear. The horizontal slot area has an air channel.
The air channel draws air from the left and exhausts air from the rear top and
rear bottom. The system draws air for heat dissipation. The 400G system adopts
U-shaped airflow design. Figure 3-218shows air flows. The 1T and 1.6 and 3.2T
system adopts I-shaped airflow design. Figure 3-219 shows air flows.

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Figure 3-218 Diagram of air flows(400G)

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Figure 3-219 Diagram of air flows(1T&1.6T&3.2T)

3.3.3.1.2 Fan Speed Adjustment
This section describes the fan Speed adjustment.
When the system is in full configuration, the temperatures reported by the
temperature sensors on the SFUs, and MPUs serve as the basis for fan speed
adjustment. General rules are listed as follows:

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Table 3-393 Fan Speed Adjustment Principles
Ambient Rotational Noise and Dissipation Standards
Tempera Speed
ture

-5°C - Low rotation When fans rotate at a constantly low speed and
+27°C speed (400G/ the fans meet heat dissipation requirements of a
(23°F - 800G 35%) fully configured system.
80.6°F) (1.6T 45%)
If NE5000E–
X16B 2T
platform, Low
rotation speed
(42%)

27°C - Linear variation The fan speed is adjusted smoothly in linear
40°C mode, without a sharp increase in noises.
(80.6°F -
104°F)

Over High speed Fans rotate at a high speed to meet heat
40°C (100%) dissipation requirements.
(104°F)

3.3.3.1.3 E000FBX09 (Fan Tray Assembly,CR56FCBJ,Fan U)
Each fan module contains six fans. Supports hot swap. When a fan fails, the fan
chassis still works properly and other fans will make up for the airflow loss.

Overview

Table 3-394 Basic information about the E000FBX09
Item Details

Description Fan Tray Assembly,CR56FCBJ,Fan U

Part Number 02121105

Model E000FBX09

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Appearance

Figure 3-220 Appearance of the E000FBX09

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Panel

Table 3-395 Indicators on the E000FBX09
Silkscreen Name Color Status Description

STATUS Running Green Blinking If the
status indicator
indicator blinks once
every two
seconds (0.5
Hz), the fan
module is
working
properly.

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Silkscreen Name Color Status Description

Green Blinking If the
quickly indicator
blinks four
times every
second (4
Hz), the fan
module is
registering.

Red Blinking If the
indicator
blinks once
every two
seconds (0.5
Hz), the fan
module is
faulty.

Orange Steady on If the
indicator is
steady on, the
fan module is
faulty.

Technical Specifications

Table 3-396 Technical specifications of the E000FBX09
Item Specification

Dimensions without packaging (H x W 131 mm x 440 mm x 120 mm (5.16 in.
x D) [mm(in.)] x 17.32 in. x 4.72 in.)

Weight without packaging [kg(lb)] 4.9 kg (10.8 lb)

Number of fans 6

Typical power consumption [W] 40 W

3.3.3.1.4 CR9M000FBX63 (Fan Tray Assembly 2.0)
Each fan module contains six fans. Supports hot swap. When a fan fails, the fan
chassis still works properly and other fans will make up for the airflow loss.

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Overview

Table 3-397 Basic information about the CR9M000FBX63
Item Details

Description Fan Tray Assembly 2.0

Part Number 02122111

Model CR9M000FBX63

Appearance

Figure 3-221 Appearance of the CR9M000FBX63

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Panel

Table 3-398 Indicators on the CR9M000FBX63

Silkscreen Name Color Status Description

STATUS Running Green Blinking If the
status indicator
indicator blinks once
every two
seconds (0.5
Hz), the fan
module is
working
properly.

Green Blinking If the
quickly indicator
blinks four
times every
second (4
Hz), the fan
module is
registering.

Red Blinking If the
indicator
blinks once
every two
seconds (0.5
Hz), the fan
module is
faulty.

Orange Steady on If the
indicator is
steady on, the
fan module is
faulty.

Technical Specifications

Table 3-399 Technical specifications of the CR9M000FBX63

Item Specification

Dimensions without packaging (H x W 131 mm x 440 mm x 122.5 mm (5.16
x D) [mm(in.)] in. x 17.32 in. x 4.82 in.)

Weight without packaging [kg(lb)] 5 kg (11.02 lb)

Number of fans 6

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Item Specification

Typical power consumption [W] 105 W

3.3.3.1.5 CR9M000FBX64 (Fan Tray Assembly T 2.0)
Each fan module contains six fans. Supports hot swap. When a fan fails, the fan
chassis still works properly and other fans will make up for the airflow loss.

Overview

Table 3-400 Basic information about the CR9M000FBX64

Item Details

Description Fan Tray Assembly T 2.0

Part Number 02122158

Model CR9M000FBX64

Appearance

Figure 3-222 Appearance of the CR9M000FBX64

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Panel

Table 3-401 Indicators on the CR9M000FBX64

Silkscreen Name Color Status Description

STATUS Running Green Blinking If the
status indicator
indicator blinks once
every two
seconds (0.5
Hz), the fan
module is
working
properly.

Green Blinking If the
quickly indicator
blinks four
times every
second (4
Hz), the fan
module is
registering.

Red Blinking If the
indicator
blinks once
every two
seconds (0.5
Hz), the fan
module is
faulty.

Orange Steady on If the
indicator is
steady on, the
fan module is
faulty.

Technical Specifications

Table 3-402 Technical specifications of the CR9M000FBX64

Item Specification

Dimensions without packaging (H x W 131 mm x 440 mm x 122.5 mm (5.16
x D) [mm(in.)] in. x 17.32 in. x 4.82 in.)

Weight without packaging [kg(lb)] 5 kg (11.02 lb)

Number of fans 6

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Item Specification

Typical power consumption [W] 105 W

NO TE

The typical power consumption of the CR9M000FBX64 fan depends on the selected boards
and chassis. Details are as follows:
NE5000E-20: 105 W for 1.6T boards.
NE5000E CCC-A: 60 W for 1.6T boards.

3.3.3.1.6 Air Filter
This section describes and shows the appearance of the air filter.
A black sponge air filter placed at the air intake vent prevents dust from getting
into the system. The air filter can be removed for cleaning. It is recommended that
air filters be cleaned once every three months.
The NE5000E CCC-A has three air filters, the locations of which are shown in
Figure 3-223.

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Figure 3-223 Locations of air filters

1. Horizontal slot area air 2. Upper air filter 3. Lower air filter
filter

The appearance of the air filter is shown in Figure 3-224.

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Figure 3-224 Appearance of the air filter

The appearance of the air filter in the horizontal slot area is shown in Figure
3-225.

Figure 3-225 Appearance of the air filter in the horizontal slot area

3.3.3.2 NE5000E CCC Heat Dissipation System

3.3.3.2.1 System Air Channel
This section describes the air flow in the CCC.
The CCC has a front board insertion area and a rear board insertion area. The
front board insertion area has two fan modules, and each fan module contains
four fans; the rear board insertion area has two fan modules, and each fan
module contains two fans.
The locations of the fan modules and air intake vent are shown in Figure 3-226.

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Figure 3-226 Locations of the fan modules and air intake vent

1. Rear fan module 2. Front fan module 3. Air intake vent

The system has two air channels that share the same air intake vent and air
exhaust vent. Each of the two board insertion areas has an independent heat
dissipation system. The air flow is shown in Figure 3-227.

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Figure 3-227 Diagram of air flows

3.3.3.2.2 Fan Speed Adjustment

This section describes the fan speed adjustment for the fan module.

Fans rotate at high speed (100% of the maximum rotational speed) to meet heat
dissipation requirements.

3.3.3.2.3 E000FBX06 (Fan Box,NE5000E Cluster,CR5E2TSRA,Fan Box,Front Fan Unit)

Each front fan module contains four fans. Two front fan modules work in 1+1 hot
backup mode. When a single fan fails, the system can still work normally for a
short period of time at an ambient temperature of 40°C (104°F).

Overview

Table 3-403 Basic information about the E000FBX06

Item Details

Description Fan Box,NE5000E
Cluster,CR5E2TSRA,Fan Box,Front Fan
Unit

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Item Details

Part Number 02120620

Model E000FBX06

Appearance

Figure 3-228 Appearance of the E000FBX06

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Panel

Table 3-404 Indicators on the E000FBX06
Silkscreen Name Color Status Description

RUN Running Green Blinking at The fan
status 0.5 Hz module is
indicator working
properly.

ALM Alarm Red On The fan
indicator module is
faulty.

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Technical Specifications

Table 3-405 Technical specifications of the E000FBX06
Item Specification

Dimensions without packaging (H x W 44.5 mm x 434 mm x 511 mm (1.75 in.
x D) [mm(in.)] x 20.12 in. x 17.09 in.)

Weight without packaging [kg(lb)] 4.3 kg (9.48 lb)

Typical power consumption [W] 240 W

3.3.3.2.4 E000FBX05 (Fan Box,NE5000E Cluster,CR5E1TSRB,Fan Box,Rear Fan Unit)
Each rear fan module contains two fans. Two rear fan modules work in 1+1 hot
backup mode. When a single fan fails, the system can still work normally for a
short period of time at an ambient temperature of 40°C (104°F).

Overview

Table 3-406 Basic information about the E000FBX05
Item Details

Description Fan Box,NE5000E
Cluster,CR5E1TSRB,Fan Box,Rear Fan
Unit

Part Number 02120489

Model E000FBX05

Appearance

Figure 3-229 Appearance of the E000FBX05

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Panel

Table 3-407 Indicators on the E000FBX05
Silkscreen Name Color Status Description

RUN Running Green Blinking at The fan
status 0.5 Hz module is
indicator working
properly.

ALM Alarm Red On The fan
indicator module is
faulty.

Technical Specifications

Table 3-408 Technical specifications of the E000FBX05
Item Specification

Dimensions without packaging (H x W 61.3 mm x 400 mm x 252.3 mm (2.41
x D) [mm(in.)] in. x 9.93 in. x 15.75 in.)

Weight without packaging [kg(lb)] 3.5 kg (7.72 lb)

Typical power consumption [W] 80 W

3.3.3.2.5 Air Filter
The black sponge air filter on the air intake vent prevents dust from getting into
the system. The air filter can be removed and cleaned. Cleaning air filters once
every three months is recommended.
The CCC has one air filter, the location of which is shown in Figure 3-230.

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Figure 3-230 Location of the air filter

1. Air filter

The appearance of the air filter is shown in Figure 3-231.

Figure 3-231 Appearance of the air filter

3.3.4 Boards

3.3.4.1 MPU

3.3.4.1.1 CR5D0MPUA750 (Cluster Central Main Processing Unit A7)

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Overview

Table 3-409 Basic information about the CR5D0MPUA750
Item Details

Description Cluster Central Main Processing Unit
A7

Part Number 03032DAP

Model CR5D0MPUA750

Card type MPU

Silkscreen MPUA7

Remarks -

Appearance

Figure 3-232 Appearance of the CR5D0MPUA750

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Indicators and Buttons

Table 3-410 Indicators on the CR5D0MPUA750
Silkscreen Name Color Status Description

MASTER Master/slave Green On The MPU
status functions as
indicator the master
board.

- Off The MPU
functions as
the slave
board.

OFL Offline Red On The board can
indicator be removed.

RUN Running Green Blinking at The system is
status 0.5 Hz running
indicator properly.

Green Others The board is
abnormal or
faulty.

ALM Alarm Red On Alarms have
indicator been
generated.

- Off No alarms
have been
generated.

ACT Master/slave Green On The MPU
status functions as
indicator the master
board of the
CCC.

- Off The MPU
functions as
the slave
board of the
CCC.

MGMT-ETH Link status Green On The link is Up.
LINK indicator(on
the Ethernet - Off The link is
interface) Down.
Yellow Blinking Data is being
transmitted
and received.

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Silkscreen Name Color Status Description

- Off No data is
being
transmitted or
received.

40GE L/A 40GE Green On The link is Up.
Interface
status Green Blinking Data is being
indicator transmitted
and received.

- Off The link is
Down.

GE/10GE L/A GE/10GE Green On The link is Up.
Interface
status Green Blinking Data is being
indicator transmitted
and received.

- Off The link is
Down.

Table 3-411 Buttons on the CR5D0MPUA750
Silkscreen Name Description

OFL Board removal button Before removing a board,
press and hold the OFL
button for about 6
seconds until the OFL
indicator comes on.
Then, you can remove
the board.
NOTE
This button takes effect
only on the slave MPU.

RST Board reset button To reset the board, press
the RST button.

USB-OFL Board USB removal Before removing the
button USB, hold down the OFL
button for about five
seconds until the OFL
indicator turns on. Then,
you can remove the USB.
NOTE
This button is effective
only for the slave USB.

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Hardware Guide 3 Hardware Description

Ports

Table 3-412 Ports on the CR5D0MPUA750
Port Connector Type Description Available
Components

MGMT-ETH RJ45 Connects to the Uses 8-core
NMS shielded cables.
workstation ,
supports half-
duplex and full-
duplex modes,
and has LINK and
ACT indicators.

10GE Optical module LC Connects to CCCs Uses optical
interface and is compatible fibers.
with 10GE
interfaces.

40GE Optical module LC Connects to CCCs. Uses optical
interface Reserved. fibers.

USB USB USB interface. USB module.

Console RJ45 Connects to the Uses 8-core
control platform shielded cables.
and implements
on-site system
configuration.

AUX RJ45 Reserved. -

FSP0, FSP1 RJ45 Used to rapidly Uses crossover
switch services cables.
between two
CCCs. Note:
Crossover cables
must be used.

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Functions and Features

Table 3-413 Functions and features of the CR5D0MPUA750
Functions and Features Description

Basic function Responsible for system control and
management operations, including
route calculation, device management
and maintenance, and device
monitoring. As a system
synchronization unit, this board
provides high-precise and reliable
clock and time signals.

Reliability and availability The MPUA7 boards work in 1:1 backup
mode. They monitor each other. If the
master MPUA7 fails, the slave MPUA7
automatically becomes the master.
Hot swappable.

Restrictions and remarks This board cannot be installed in the
same chassis as other types of main
control boards.

Technical Specifications

Table 3-414 Technical specifications of the CR5D0MPUA750
Item Specification

Dimensions without packaging (H x W 35 mm x 400 mm x 633 mm (1.38 in. x
x D) [mm(in.)] 15.75 in. x 24.92 in.)

Weight without packaging [kg(lb)] 9.7 kg (21.38 lb)

Weight with packaging [kg(lb)] 10.2 kg (22.49 lb)

Typical power consumption [W] 180 W

Typical heat dissipation [BTU/hour] 584 BTU/hour

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

CPU 10-core 2.2 GHZ

Memory 64 GB

Storage SSD card: 32 GB

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3.3.4.1.2 CR5D0MPUA851 (NE5000E CCC-A Cluster Central Main Processing Unit
A8)

Overview

Table 3-415 Basic information about the CR5D0MPUA851

Item Details

Description NE5000E CCC-A Cluster Central Main
Processing Unit A8

Part Number 03033GMG

Model CR5D0MPUA851

Card type MPU

Silkscreen MPUA8

Remarks -

Appearance

Figure 3-233 Appearance of the CR5D0MPUA851

Version Mapping

The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.

The Info-Finder hardware center incorporates comprehensive hardware
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desired information and filter the mapping data for more fine-grained data
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keyword=03033GMG&productModel=CR5D0MPUA851#matchRelation

Indicators and Buttons

Table 3-416 Indicators on the CR5D0MPUA851
Silkscreen Name Color Status Description

MASTER Master status Green Steady on The MPU is
indicator the main
control board
of the cluster
router system.

- Off The MPU is
the standby
main control
board of the
cluster router
system.

OFL Board Red Steady on A board can
removal be securely
indicator removed.

RUN Running Green Flashing once The system is
status every 2 in normal
indicator seconds operation.
(0.5Hz)

Others - The board is
abnormal or
faulty.

ALM Alarm Red Steady on The board is
indicator in the alarm
state..

- Off The board is
working
properly.

ACT Standby Green Steady on The board
status functions as
indicator the master
board.

- Off The board
functions as
the slave
board.

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Silkscreen Name Color Status Description

MGMT-ETH LINK status Green Steady on The link is Up.
LINK indicator
- Off The link is
Down.

MGMT-ETH ACT indicator Yellow Blinking Data is being
ACT transmitted
and received.

- Off No data is
being
transmitted or
received.

FSP FSP indicator Green Steady on If the green
indicator is
on, a link is
Up.

Green Off If the green
indicator is
off, a link is
Down.

Yellow Steady on An error
occurs in data
transmission.

Yellow Off Data is being
transmitted.

Table 3-417 Buttons on the CR5D0MPUA851
Silkscreen Name Description

OFL Board removal button Before removing the
board, hold down the
OFL button for about six
seconds until the OFL
indicator turns on. Then,
you can remove the
board.
This button is effective
only for the slave MPU.

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Silkscreen Name Description

USB-OFL Board USB removal Before removing the
button USB, hold down the OFL
button for about five
seconds until the OFL
indicator turns on. Then,
you can remove the USB.
This button is effective
only for the slave USB.

RST Board reset button To reset the board, press
the RST button.

Ports

Table 3-418 Ports on the CR5D0MPUA851
Port Connector Type Description Available
Components

MGMT-ETH RJ45 Connects to the 8-core shielded
NMS cable
workstation ,
supports half-
duplex and full-
duplex modes,
and has LINK and
ACT indicators.

10GE Optical module LC Connects to CCCs Uses optical
interface and is compatible fibers.
with 10GE
interfaces.

40GE Optical module LC Connects to CCCs. Uses optical
interface Reserved. fibers.

USB USB USB interface. USB module.

Console RJ45 Connects to the 8-core shielded
control platform cable
and implements
on-site system
configuration.

AUX RJ45 Reserved. -

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Port Connector Type Description Available
Components

FSP0,FSP1 RJ45 Used for fast Uses crossover
inter-chassis cables.
switchover
between two
CCCs. Note:
Crossover cables
must be used.

Functions and Features

Table 3-419 Functions and features of the CR5D0MPUA851

Functions and Features Description

Basic function Responsible for system control and
management operations, including
route calculation, device management
and maintenance, and device
monitoring. As a system
synchronization unit, this board
provides high-precise and reliable
clock and time signals.

Reliability and availability The MPUA8s work in 1:1 backup
mode. The MPUA8s monitor each
other. When the master MPUA8 is
faulty, the slave MPUA8 is
automatically switched to the master
MPUA8.

Restrictions and remarks Cannot be installed in the same
chassis with other main control boards.

Technical Specifications

Table 3-420 Technical specifications of the CR5D0MPUA851

Item Specification

Dimensions without packaging (H x W 35.1 mm x 400.3 mm x 633.4 mm
x D) [mm(in.)] (1.38 in. x 15.76 in. x 24.94 in.)

Dimensions with packaging (H x W x 195 mm x 750 mm x 735 mm (7.68 in.
D) [mm(in.)] x 29.53 in. x 28.94 in.)

Weight without packaging [kg(lb)] 9.7 kg (21.38 lb)

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Hardware Guide 3 Hardware Description

Item Specification

Weight with packaging [kg(lb)] 14.9 kg (32.85 lb)

Typical power consumption [W] 180 W

Typical heat dissipation [BTU/hour] 584 BTU/hour

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

CPU 24-core 2.5 GHz

Memory 32 GB x 2

Storage SSD card: 32 GB

3.3.4.1.3 CR5D0MPUB550 (NetEngine5000E Cluster Central Main Processing Unit B)

Overview

Table 3-421 Basic information about the CR5D0MPUB550
Item Details

Description NetEngine5000E Cluster Central Main
Processing Unit B

Part Number 03030QXN

Model CR5D0MPUB550

Card type MPU

Silkscreen MPUB

Remarks -

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Appearance

Figure 3-234 Appearance of the CR5D0MPUB550

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03030QXN&productModel=CR5D0MPUB550#matchRelation

Indicators and Buttons

Table 3-422 Indicators on the CR5D0MPUB550
Silkscreen Name Color Status Description

MST Master/slave Green On The MPU
status functions as
indicator the master
board.

- Off The MPU
functions as
the slave
board.

OFL Offline Red On The board can
indicator be removed.

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Silkscreen Name Color Status Description

RUN Running Green Blinking at The system is
status 0.5 Hz running
indicator properly.

Green Others The board is
abnormal or
faulty.

ALM Alarm Red On Alarms have
indicator been
generated.

- Off No alarms
have been
generated.

ACT Master/slave Green On The board
status functions as
indicator the master
board.

- Off The board
functions as
the slave
board.

L/A Interface Green On The link is Up.
status
indicator Green Blinking Data is being
transmitted
and received.

- Off The link is
Down.

Table 3-423 Buttons on the CR5D0MPUB550

Silkscreen Name Description

OFL Board removal button Before removing a board,
press and hold the OFL
button for about 6
seconds until the OFL
indicator comes on.
Then, you can remove
the board.
NOTE
This button takes effect
only on the slave MPU.

RST Board reset button To reset the board, press
the RST button.

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Hardware Guide 3 Hardware Description

Ports

Table 3-424 Ports on the CR5D0MPUB550
Port Connector Type Description Available
Components

MGMT-ETH RJ45 Connects to the Uses 8-core
NMS shielded cables.
workstation ,
supports half-
duplex and full-
duplex modes,
and has LINK and
ACT indicators.

GE/10GE Optical module LC Connects to CCCs Uses optical
interface and is compatible fibers.
with GE/10GE
interfaces.

Console RJ45 Connects to the Uses 8-core
control platform shielded cables.
and implements
on-site system
configuration. The
baud rate can be
set, and the
default value is
9600 bit/s.

AUX RJ45 Reserved. Uses 8-core
shielded cables.

FSP0, FSP1 RJ45 Used to rapidly Uses crossover
switch services cables.
between two
CCCs. Note:
Crossover cables
must be used.

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Functions and Features

Table 3-425 Functions and features of the CR5D0MPUB550
Functions and Features Description

Basic function Responsible for system control and
management operations, including
route calculation, device management
and maintenance, and device
monitoring. As a system
synchronization unit, this board
provides high-precise and reliable
clock and time signals.

Reliability and availability The MPUB supports 1:1 backup.
Hot swappable.

Restrictions and remarks This board cannot be installed in the
same chassis as other types of main
control boards.

Technical Specifications

Table 3-426 Technical specifications of the CR5D0MPUB550
Item Specification

Dimensions without packaging (H x W 35 mm x 400 mm x 634 mm (1.38 in. x
x D) [mm(in.)] 15.75 in. x 24.96 in.)

Weight without packaging [kg(lb)] 6 kg (13.23 lb)

Weight with packaging [kg(lb)] 8.35 kg (18.41 lb)

Typical power consumption [W] 110 W

Typical heat dissipation [BTU/hour] 356.89 BTU/hour

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

CPU 4-core 2.0 GHz

Memory 16 GB

Storage SSD card: 8 GB

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3.3.4.2 SFU

3.3.4.2.1 CR5DSFUFK050 (NetEngine5000E Cluster ,CR55SFUF400A,400G Cluster
Central Switch Fabric Unit)

Overview

Table 3-427 Basic information about the CR5DSFUFK050
Item Details

Description NetEngine5000E
Cluster ,CR55SFUF400A,400G Cluster
Central Switch Fabric Unit

Part Number 03030TDP

Model CR5DSFUFK050

Card type SFU

Silkscreen SFUF400

Remarks -

Appearance

Figure 3-235 Appearance of the CR5DSFUFK050

Version Mapping
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where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find

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desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03030TDP&productModel=CR5DSFUFK050#matchRelation

Indicators and Buttons

Table 3-428 Indicators on the CR5DSFUFK050
Silkscreen Name Color Status Description

OFL Offline Red On The board can
indicator be removed.

RUN Running Green Blinking at The system is
status 0.5 Hz running
indicator properly.

Green Others The board is
abnormal or
faulty.

ACT ACT indicator Green On The board is
working
properly.

- Off The board is
faulty.

Table 3-429 Buttons on the CR5DSFUFK050
Silkscreen Name Description

OFL Board removal button To remove the board,
hold down the OFL
button for about six
seconds until the OFL
indicator turns on. Then,
you can remove the
board.

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Functions and Features

Table 3-430 Functions and features of the CR5DSFUFK050

Functions and Features Description

Basic function Connected to the SFU of the CLC
through the interfaces on the OFCs to
exchange data between chassis.

Reliability and availability Supports hot swap.

Restrictions and remarks Inter-chassis traffic switching
User traffic is divided into cells of a
fixed size and format on the LPU of
the CLC. The SFU of the CLC sends
these cells to the SFU of the CCC in
load-balancing mode according to
destination addresses carried by these
cells and the distribution table. Then
the SFU of the CCC sends data cells
and control cells to the destination
TM.
Configuration and monitoring
The SFUF400A configures and
manages the modules on it, and
maintains the management channel
between it and the MPU, as well as
the emergency channel between it and
the ICU.
Power supply management
SFUF400As provide and manage their
power modules and provide power-on
and power-off functions, as well as the
power exception detection function.

Technical Specifications

Table 3-431 Technical specifications of the CR5DSFUFK050

Item Specification

Dimensions without packaging (H x W 47 mm x 522 mm x 635 mm (1.85 in. x
x D) [mm(in.)] 20.55 in. x 25.00 in.)

Weight without packaging [kg(lb)] 7.5 kg (16.53 lb)

Weight with packaging [kg(lb)] 10.1 kg (22.27 lb)

Typical power consumption [W] 120 W

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Item Specification

Typical heat dissipation [BTU/hour] 389.33 BTU/hour

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

Switching capacity 400 Gbit/s

3.3.4.2.2 CR5DSFUFT050 (1T Cluster Central Switch Fabric Unit A(SFUF-1T-G))

Overview

Table 3-432 Basic information about the CR5DSFUFT050
Item Details

Description 1T Cluster Central Switch Fabric Unit
A(SFUF-1T-G)

Part Number 03032AVU

Model CR5DSFUFT050

Card type SFU

Silkscreen SFUF1T

Remarks -

Appearance

Figure 3-236 Appearance of the CR5DSFUFT050

Version Mapping
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where you can easily obtain hardware mapping information.

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display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03032AVU&productModel=CR5DSFUFT050#matchRelation

Indicators and Buttons

Table 3-433 Indicators on the CR5DSFUFT050
Silkscreen Name Color Status Description

RUN Running Green Blinking at The system is
status 0.5 Hz working
indicator properly.
NOTE
If the
indicator is
off, the
BootROM
may be
damaged, or
a power-on
failure may
occur.
If the
indicator
blinks quickly,
the flash
memory or
network
interface may
be faulty.

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Silkscreen Name Color Status Description

Green Blinking at 2 The system is
Hz registering.
NOTE
If the
indicator is
off, the
possible
causes are as
follows:
The BootROM
is damaged.
A power-on
failure occurs.
If the
indicator
blinks quickly,
the possible
causes are as
follows:
The flash
memory is
faulty.
The network
interface is
faulty.

ACT ACT indicator Green - Reserved

OFL Board Red Steady on The board can
insertion/ be removed.
removal NOTE
indicator To power off
the board,
press the OFL
button until
the Red
indicator
turns on.

- Steady off The board is
working
properly.

0 to 11 Interface Green Steady on The board is
status working
indicator normally.

Green Steady off The board is
faulty.

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Table 3-434 Buttons on the CR5DSFUFT050

Silkscreen Name Description

OFL Board removal button To remove the board,
hold down the OFL
button for about six
seconds until the OFL
indicator turns on. Then,
you can remove the
board.

Functions and Features

Table 3-435 Functions and features of the CR5DSFUFT050

Functions and Features Description

Basic function Connected to the SFU on the CLC
through the interfaces on the OFCs to
exchange data between chassis.

Reliability and availability Hot swappable.

Restrictions and remarks 1. A CCC is equipped with 16 SFUs,
each of which can be installed with
two OFC1TAs. In a multi-chassis
cluster system, a CCC connects to SFUs
on CLCs through OFC interfaces to
implement data communication.

Technical Specifications

Table 3-436 Technical specifications of the CR5DSFUFT050

Item Specification

Dimensions without packaging (H x W 47 mm x 522 mm x 635 mm (1.85 in. x
x D) [mm(in.)] 20.55 in. x 25.00 in.)

Weight without packaging [kg(lb)] 8.6 kg (18.96 lb)

Weight with packaging [kg(lb)] 15 kg (33.07 lb)

Typical power consumption [W] 193 W

Typical heat dissipation [BTU/hour] 626.17 BTU/hour

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

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Item Specification

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

Switching capacity 800 Gbit/s

3.3.4.2.3 CR5DSFUIT250 (NE5000E CCC-A 1.6T Cluster Central Switch Fabric Unit
G(SFUI-1T6-G))

Overview

Table 3-437 Basic information about the CR5DSFUIT250

Item Details

Description NE5000E CCC-A 1.6T Cluster Central
Switch Fabric Unit G(SFUI-1T6-G)

Part Number 03032UHP

Model CR5DSFUIT250

Card type SFU

Silkscreen SFUI-1T6-G

Remarks -

Appearance

Figure 3-237 Appearance of the CR5DSFUIT250

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 477
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03032UHP&productModel=CR5DSFUIT250#matchRelation

Indicators and Buttons

Table 3-438 Indicators on the CR5DSFUIT250
Silkscreen Name Color Status Description

RUN Running Green Blinking at The system is
status 0.5 Hz working
indicator properly.
NOTE
If the
indicator is
off, the
possible
causes are as
follows:
The BootROM
is damaged. A
power-on
failure occurs.
If the
indicator
blinks quickly,
the possible
causes are as
follows:
The flash
memory is
faulty.
The network
interface is
faulty.

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Silkscreen Name Color Status Description

Green Blinking at 2 The system is
Hz registering.
NOTE
If the
indicator is
off, the
possible
causes are as
follows:
The BootROM
is damaged.
A power-on
failure occurs.
If the
indicator
blinks quickly,
the possible
causes are as
follows:
The flash
memory is
faulty.
The network
interface is
faulty.

OFL Offline Red On The board can
indicator be removed.
NOTE
To power off
the board,
press the OFL
button until
the Red
indicator
turns on.

- Off The board is
working
properly.

OFC0/3(0 to Insertion Green Blinking The optical
7) status module is
indicator of working
the CXP2 normally.
optical
module Green On/Off The optical
module is
faulty or not
installed.

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Table 3-439 Buttons on the CR5DSFUIT250
Silkscreen Name Description

OFL Board removal button To remove the board,
hold down the OFL
button for about six
seconds until the OFL
indicator turns on. Then,
you can remove the
board.

Ports

Table 3-440 Ports on the CR5DSFUIT250
Port Connector Type Description Available
Components

0/0 to 0/7 CXP2 Used to input and Uses optical
1/0 to 1/7 output 25Gbps fibers.
optical signals.
2/0 to 2/7
3/0 to 3/7

Functions and Features

Table 3-441 Functions and features of the CR5DSFUIT250
Functions and Features Description

Basic function Connected to the SFU on the CLC
through the interfaces on the OFCs to
exchange data between chassis.

Reliability and availability Hot swappable.

Restrictions and remarks An SFUI-1T6-G provides thirty-two
CXP2 interfaces to connect to the SFU
of the CLC, implementing data plane
communication.

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Technical Specifications

Table 3-442 Technical specifications of the CR5DSFUIT250
Item Specification

Dimensions without packaging (H x W 47 mm x 522 mm x 633 mm (1.85 in. x
x D) [mm(in.)] 20.55 in. x 24.92 in.)

Dimensions with packaging (H x W x 95 mm x 290 mm x 370 mm (3.74 in. x
D) [mm(in.)] 11.42 in. x 14.57 in.)

Weight without packaging [kg(lb)] 15 kg (33.07 lb)

Weight with packaging [kg(lb)] 17.6 kg (38.8 lb)

Typical power consumption [W] 963.7 W

Typical heat dissipation [BTU/hour] 3126.65 BTU/hour

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

Switching capacity 1.6 Tbit/s

Memory 2 GB

3.3.4.3 ICU

3.3.4.3.1 CR5D00ICUB50 (NetEngine5000E Cluster Internal Communication Unit B)

Overview

Table 3-443 Basic information about the CR5D00ICUB50
Item Details

Description NetEngine5000E Cluster Internal
Communication Unit B

Part Number 03030QXG

Model CR5D00ICUB50

Card type ICU

Silkscreen ICUB

Remarks -

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Appearance

Figure 3-238 Appearance of the CR5D00ICUB50

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03030QXG&productModel=CR5D00ICUB50#matchRelation

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Indicators and Buttons

Table 3-444 Indicators on the CR5D00ICUB50
Silkscreen Name Color Status Description

RUN Running Green Blinking at The system is
status 0.5 Hz working
indicator properly.
NOTE
If the
indicator is
off, the
possible
causes are as
follows:
The BootROM
is damaged.
A power-on
failure occurs.
If the
indicator
blinks quickly,
the possible
causes are as
follows:
The flash
memory is
faulty.
The network
interface is
faulty.

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Silkscreen Name Color Status Description

Green Blinking at 2 The system is
Hz registering.
NOTE
If the
indicator is
off, the
possible
causes are as
follows:
The BootROM
is damaged.
A power-on
failure occurs.
If the
indicator
blinks quickly,
the possible
causes are as
follows:
The flash
memory is
faulty.
The network
interface is
faulty.

OFL Offline Red On The board can
indicator be removed.
NOTE
To power off
the board,
press the OFL
button until
the Red
indicator
turns on.

- Off The board is
working
properly

L/A Interface Green On The link is Up.
status
indicator Green Blinking Data is being
transmitted
and received.

- Off The link is
Down.

10/100/1000 Link status Green On The link is Up.
M BASE-T indicator(on
LINK the Ethernet - Off The link is
interface) Down.

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Silkscreen Name Color Status Description

Yellow Blinking Data is being
transmitted
and received.

- Off No data is
being
transmitted or
received.

Table 3-445 Buttons on the CR5D00ICUB50
Silkscreen Name Description

OFL Board removal button To remove the board,
hold down the OFL
button for about six
seconds until the OFL
indicator turns on. Then,
you can remove the
board.

Ports

Table 3-446 Ports on the CR5D00ICUB50
Port Connector Type Description Available
Components

CCC LINK GE/ LC/PC The interfaces Uses optical
10GE interface connect CCCs, are fibers.
compatible with
GE/10GE
interfaces, and are
numbered 0 to 5.

CLC LINK GE/ LC/PC Used for Uses optical
10GE interface interconnection fibers.
between CCCs
and CLCs. GE/
10GE interfaces
are compatible
and are numbered
from 6 to 13.

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Port Connector Type Description Available
Components

Ethernet interface RJ45 The interfaces Uses network
(10M/100M/ connect a CCC to cables.
1000M Base-TX a CLC and have
auto-sensing) LINK and ACT
indicators.

Functions and Features

Table 3-447 Functions and features of the CR5D00ICUB50
Functions and Features Description

Basic function Transmits control information reliably
between CCCs and between CCCs and
CLCs.

Reliability and availability Supports hot swap.

Restrictions and remarks ICUBs transmit control information in
a reliable manner between CCCs, and
between CCCs and CLCs.

Technical Specifications

Table 3-448 Technical specifications of the CR5D00ICUB50
Item Specification

Dimensions without packaging (H x W 30 mm x 400 mm x 634 mm (1.18 in. x
x D) [mm(in.)] 15.75 in. x 24.96 in.)

Weight without packaging [kg(lb)] 6 kg (13.23 lb)

Weight with packaging [kg(lb)] 8.44 kg (18.61 lb)

Typical power consumption [W] 90 W

Typical heat dissipation [BTU/hour] 292 BTU/hour

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

3.3.4.3.2 CR5D00ICUC52 (Cluster Internal Communication Unit C)

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Overview

Table 3-449 Basic information about the CR5D00ICUC52

Item Details

Description Cluster Internal Communication Unit C

Part Number 03033GME

Model CR5D00ICUC52

Card type ICU

Silkscreen ICUC

Remarks -

Appearance

Figure 3-239 Appearance of the CR5D00ICUC52

Version Mapping

The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.

The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.

enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03033GME&productModel=CR5D00ICUC52#matchRelation

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Buttons

Table 3-450 Buttons on the CR5D00ICUC52

Silkscreen Name Description

OFL Board removal button Before removing a board,
press and hold the OFL
button until the OFL
indicator turns on (about
six seconds). The board
can then be safely
removed.
NOTE
This button takes effect
only on the standby MPU.

Ports

Table 3-451 Ports on the CR5D00ICUC52

Port Connector Type Description Available
Components

GE/10GE interface LC/PC The interfaces Optical fiber
connect CCCs, or
the interfaces
connect the CCC
and CLC,are
compatible with
GE/10GE
interfaces, and are
numbered 0 to 17.

40GE interface LC/PC Reserved, used for Optical fiber
40GE
interconnection
between CCCs,
numbered 0 to 3.

Functions and Features

Table 3-452 Functions and features of the CR5D00ICUC52

Functions and Features Description

Basic function Transmits control information in a
reliable manner between CCCs, and
between CCCs and CLCs.

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Functions and Features Description

Reliability and availability Hot swappable.

Technical Specifications

Table 3-453 Technical specifications of the CR5D00ICUC52

Item Specification

Dimensions without packaging (H x W 30.0 mm x 400.3 mm x 634.3 mm
x D) [mm(in.)] (1.18 in. x 15.76 in. x 24.97 in.)

Dimensions with packaging (H x W x 195 mm x 750 mm x 735 mm (7.68 in.
D) [mm(in.)] x 29.53 in. x 28.94 in.)

Weight without packaging [kg(lb)] 6 kg (13.23 lb)

Weight with packaging [kg(lb)] 11.2 kg (24.69 lb)

Typical power consumption [W] 90 W

Typical heat dissipation [BTU/hour] 292.0 BTU/hour

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

Memory 2 GB

3.3.4.4 OFC

3.3.4.4.1 CR5D0OFCT050 (1T Cluster Optical Flexible Card)

Overview

Table 3-454 Basic information about the CR5D0OFCT050

Item Details

Description 1T Cluster Optical Flexible Card

Part Number 03032AVY

Model CR5D0OFCT050

Card type OFC

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Item Details

Silkscreen OFC1TA

Remarks -

Appearance

Figure 3-240 Appearance of the CR5D0OFCT050

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03032AVY&productModel=CR5D0OFCT050#matchRelation

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Indicators and Buttons

Table 3-455 Indicators on the CR5D0OFCT050
Silkscreen Name Color Status Description

RUN Running Green Blinking at The system is
status 0.5 Hz working
indicator properly.
NOTE
If the
indicator is
off, the
possible
causes are as
follows:
The BootROM
is damaged.
A power-on
failure occurs.
If the
indicator
blinks quickly,
the possible
causes are as
follows:
The flash
memory is
faulty.
The network
interface is
faulty.

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Silkscreen Name Color Status Description

Green Blinking at 2 The system is
Hz registering.
NOTE
If the
indicator is
off, the
possible
causes are as
follows:
The BootROM
is damaged.
A power-on
failure occurs.
If the
indicator
blinks quickly,
the possible
causes are as
follows:
The flash
memory is
faulty.
The network
interface is
faulty.

OFL Offline Red On The board can
indicator be removed.
NOTE
To power off
the board,
press the OFL
button until
the Red
indicator
turns on.

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Silkscreen Name Color Status Description

- Off When the
board is
working
properly, the
Red indicator
is off. To
power off the
board, press
the OFL
button until
the Red
indicator
turns on.
If the
indicator is
steady on,
you can
remove the
board.

0 to 11 Insertion Green Blinking The CXP
status optical
indicator of module is
the CXP working
optical normally.
module
Green On/Off The CXP
optical
module is
faulty.

Table 3-456 Buttons on the CR5D0OFCT050
Silkscreen Name Description

OFL Board removal button To remove the board,
hold down the OFL
button for about six
seconds until the OFL
indicator turns on. Then,
you can remove the
board.

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Ports

Table 3-457 Ports on the CR5D0OFCT050
Port Connector Type Description Available
Components

0/0 to 0/11 CXP2 Used to input and Uses optical
output 25Gbps fibers.
optical signals.

Functions and Features

Table 3-458 Functions and features of the CR5D0OFCT050
Functions and Features Description

Basic function Provides 12 CXP2 interfaces to connect
to the SFU on the motherboard and
the SFU on the CLC for data exchange.

Reliability and availability Supports hot swap.

Restrictions and remarks An OFC1TA is installed on an SFUF-1T-
G and provides twelve CXP2 interfaces
to connect to the SFU of the CLC,
implementing data plane
communication.
These CXP2 interfaces are also
connected to the backplane through
high-speed SerDes links.

Technical Specifications

Table 3-459 Technical specifications of the CR5D0OFCT050
Item Specification

Dimensions without packaging (H x W 47 mm x 226 mm x 350 mm (1.85 in. x
x D) [mm(in.)] 8.90 in. x 13.78 in.)

Weight without packaging [kg(lb)] 3.4 kg (7.5 lb)

Weight with packaging [kg(lb)] 4.8 kg (10.58 lb)

Typical power consumption [W] 170 W

Typical heat dissipation [BTU/hour] 551.55 BTU/hour

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Item Specification

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

3.3.4.4.2 CR5M0OFCK050 (NetEngine5000E,400G Cluster Central Switch Flexible
Optical Card)

Overview

Table 3-460 Basic information about the CR5M0OFCK050
Item Details

Description NetEngine5000E,400G Cluster Central
Switch Flexible Optical Card

Part Number 03030TDT

Model CR5M0OFCK050

Card type OFC

Silkscreen OFC400A

Remarks -

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Appearance

Figure 3-241 Appearance of the CR5M0OFCK050

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.
The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.
enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=03030TDT&productModel=CR5M0OFCK050#matchRelation

Indicators and Buttons

Table 3-461 Indicators on the CR5M0OFCK050

Silkscreen Name Color Status Description

RUN Running Green Blinking The system is
status running
indicator properly.

- Off The system is
not running.

OFL Offline Red On The board can
indicator be removed.

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Silkscreen Name Color Status Description

0 to 11 Insertion Green Blinking The CXP
status optical
indicator of module is
the CXP working
optical normally.
module
Green On/Off The CXP
optical
module is
faulty.

Table 3-462 Buttons on the CR5M0OFCK050
Silkscreen Name Description

OFL Board removal button To remove the board,
hold down the OFL
button for about six
seconds until the OFL
indicator turns on. Then,
you can remove the
board.

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Ports

Table 3-463 Ports on the CR5M0OFCK050

Port Connector Type Description Available
Components

0 to 11 CXP Used to input and Uses optical
output 10G fibers.
optical signals. It
supports 10G CXP
Optical Modules.
The interface
supports different
transmission
distances,
including 10 m,
15 m, 20 m, 25 m,
30 m, 60 m, and
90 m, with the
maximum inter-
chassis fiber
transmission
distance being 90
m.

Functions and Features

Table 3-464 Functions and features of the CR5M0OFCK050

Functions and Features Description

Basic function Provides 12 CXP interfaces to connect
to CLC SFUs for data exchange.

Reliability and availability Hot swappable.

Restrictions and remarks An OFC400A is installed on an
SFUF400A and provides 12 CXP
interfaces to connect to the SFU of the
CLC, implementing data plane
interconnection.
When being used on the SFUF1TG, the
OFC400A can only be installed in the
OFC1 slot.
The OFC400A implements high-speed
SerDes data link communication with
the mother board through the high-
speed connector interface.

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Technical Specifications

Table 3-465 Technical specifications of the CR5M0OFCK050

Item Specification

Dimensions without packaging (H x W 47 mm x 226 mm x 350 mm (1.85 in. x
x D) [mm(in.)] 8.90 in. x 13.78 in.)

Weight without packaging [kg(lb)] 3.5 kg (7.72 lb)

Weight with packaging [kg(lb)] 4.9 kg (10.8 lb)

Typical power consumption [W] 110 W

Typical heat dissipation [BTU/hour] 356.89 BTU/hour

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

3.4 Optical Module

3.4.1 Pluggable Optical Modules

3.4.1.1 Optical Module Structure

Figure1 shows the structure of an optical module.

Figure 3-242 Optical module structure

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1. Handle 2. Receiver 3. Transmitter 4. Shell

5. Label 6. Dust cap 7. Spring 8. Module
connector

3.4.1.2 Optical Module Classification
Optical modules are available in various types to meet diversified requirements.
● Classified by transmission rate
Currently, the transmission rates of optical modules cover a wide range.
According to different transmission rates, optical modules can be classified
into 400 Gbit/s optical modules, 200 Gbit/s optical modules, 100 Gbit/s optical
modules, 40 Gbit/s optical modules, 25 Gbit/s optical modules, and 10 Gbit/s
optical modules, 2.5 Gbit/s optical modules, 1.25 Gbit/s optical modules, 1000
Mbit/s optical modules, 155 Mbit/s optical modules, and 100 Mbit/s optical
modules.
● Classified by encapsulation type
The higher transmission rate an optical module provides, the more complex
structure it has. According to the encapsulation type, optical modules are
classified into SFP, eSFP, SFP+, XFP, SFP28, QSFP28, QSFP+, QSFP-DD, CXP, CFP,
and CSFP.
– SFP: small form-factor pluggable.
– eSFP: enhanced small form-factor pluggable. An eSFP optical module is
an SFP optical module that supports monitoring of voltage, temperature,
bias current, transmit optical power, and receive optical power. Currently,
SFP modules also have the preceding functions. Therefore, eSFP and SFP
optical modules are both called SFP optical modules.
– SFP+: small form-factor pluggable plus. An SPF+ optical module is an SFP
module with a higher rate. SFP+ optical modules are more sensitive to
electromagnetic interference (EMI) because they have a higher rate.
Compared with SFP modules, SFP+ optical modules use more springs and
tighter SFP+ optical module cages.
– XFP: 10G small form-factor pluggable. X is the Roman numeral 10,
meaning that all XFP optical modules provide a transmission rate of 10
Gbit/s. XFP optical modules are wider and longer than SFP+ optical
modules.
– SFP28: small form-factor pluggable 28. The size of an SFP28 optical
module is the same as that of an SFP+ optical module. An SFP28 port can
use a 25G SFP28 optical module or 10G SFP+ optical module.
– QSFP28: quad small form-factor pluggable 28. The size of a QSFP28
optical module is the same as that of a QSFP+ optical module. A QSFP28
port can use either a 100G QSFP28 optical module or a 40G QSFP+
optical module.
– QSFP+: quad small form-factor pluggable plus. QSFP+ optical modules
support MPO fiber connectors and are larger than SFP+ optical modules.
– QSFP-DD: quad small form factor pluggable-double density. A QSFP-DD
optical module is a high-speed pluggable module defined by the QSFP-
DD MSA group.

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– CXP: extended-capability form-factor pluggable. A CXP optical module is
a hot-pluggable high-density parallel optical module, which provides 12
channels of traffic in each of the Tx and Rx directions. It applies only to
short-distance multimode links.
– CFP: centum form-factor pluggable, a new standard for high-speed, hot-
pluggable optical transceivers that support data communication and
telecommunication applications. The dimensions of a CFP optical module
are 13.6 mm x 144.75 mm x 82 mm (0.54 in. x 5.70 in. x 3.23 in.).
– CSFP: compact small form-factor pluggable. A CSFP optical module is a
compact SFP transceiver with two 100 Mbit/s or 1 Gbit/s single-fiber
bidirectional transceivers inside a standard SFP form factor. Its compact
and low-power design allows the system supplier to double port density
and access channel quantity for the LPU. This type of optical module is
mainly used in scenarios where one CSFP optical module connects to two
BIDI SFP optical modules. It is essential to ensure that the transmit and
receive wavelengths are consistent and the transmission distances are the
same.
● Classified by physical layer standard
Different physical layer standards are defined to allow data transmission in
different modes. Therefore, different types of optical modules are produced to
comply with these standards. For details, see standards compliance of the
specific optical module.
● Classified by mode
Optical fibers are classified into single-mode and multimode fibers. Therefore,
optical modules are also classified into single-mode and multimode modules
to support different optical fibers.
– Single-mode optical modules are used with single-mode fibers. Single-
mode fibers support a wide band and large transmission capacity, and are
used for long-distance transmission.
– Multimode optical modules are used with multimode fibers. Multimode
fibers have lower transmission performance than single-mode fibers
because of modal dispersion, but their costs are also lower. They are used
for small-capacity, short-distance transmission.

WDM modules differ from other types of optical modules in center wavelengths. A
common optical module has a center wavelength of 850 nm, 1310 nm, or 1550
nm, whereas a WDM module has different center wavelengths. WDM modules are
classified into two types: coarse wavelength division multiplexing (CWDM) and
dense wavelength division multiplexing (DWDM). Within the same band, DWDM
modules are available in more types and use wavelength resources more
efficiently than CWDM modules. DWDM and CWDM modules allow lights with
different center wavelengths to be transmitted on one fiber without interfering
each other. Therefore, a passive multiplexer can be used to combine the lights into
one channel, which is then split into multiple channels by a demultiplexer on the
remote end. This reduces the optical fibers required. DWDM and CWDM modules
are used for long-distance transmission.

The transmit power of a long-distance optical module is often larger than its
overload power. Therefore, when using such optical modules, select optical fibers
of an appropriate length to ensure that the actual receive power is smaller than
the overload power. If the optical fibers connected to a long-distance optical

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module are too short, use an optical attenuator to reduce the receive power on
the remote optical module. Otherwise, the remote optical module may be burnt.

3.4.1.3 Optical Module Appearance
The following lists some common optical modules, which may not be supported
by this product. The figures are for reference only.

Table 3-466 Commonly used optical modules
Encaps Interface Appearance
ulatio type
n type

SFP LC Single-fiber bidirectional

RJ45 1 Gbps electrical module

eSFP LC Two-fiber bidirectional

Single-fiber bidirectional

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Encaps Interface Appearance
ulatio type
n type

SFP+ LC Two-fiber bidirectional

Single-fiber bidirectional

XFP LC Two-fiber bidirectional

Single-fiber bidirectional

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Encaps Interface Appearance
ulatio type
n type

SFP28 LC Two-fiber bidirectional

Single-fiber bidirectional

QSFP2 LC/MPO Two-fiber bidirectional
8

Single-fiber bidirectional

QSFP+ LC/MPO

CXP MPO

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Encaps Interface Appearance
ulatio type
n type

CFP LC/MPO CFP

CFP2

CFP4

CFP8

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Encaps Interface Appearance
ulatio type
n type

CSFP LC

QSFP- LC
DD

3.4.1.4 How to Use an Optical Module

This section provides instructions on how to use an optical module.

NO TE

Only optical modules matching Huawei products can be used. These optical modules are
strictly tested by Huawei. If non-matching optical modules are used, device requirements
may fail to be met, and services may fail to run properly. To replace optical modules, see
Parts Replacement > Replacing an Optical Module.

ESD Measures

Before touching any optical module, wear an ESD wrist strap or ESD gloves. Take
full ESD measures when installing optical apparatus such as optical modules
indoors or outdoors.

Figure 3-243 Method for wearing ESD gloves

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Figure 3-244 Method for wearing the ESD wrist strap

Placing Optical Apparatus and Fibers

Do not touch the pins or edge connectors of optical modules with bare hands.
Handle optical fibers gently. Use two fingers to hold the fiber connector instead of
grasping the fiber or fiber cover.

Avoid applying axial or lateral pressure to a fiber. Refrain from folding or twisting
a fiber or crushing its pigtail. Do not drag a fiber or apply pressure to the coupling
point of its pigtail. Figure 3-245 shows how to properly place optical apparatus
and fibers.

Figure 3-245 Methods for placing optical apparatus and fibers

NO TE

During installation, ensure that an optical fiber is coiled into a loop with a diameter of at
least 6 cm.

Uninstalling Optical Apparatus
● Release the latch and slowly take out the optical apparatus. Do not drag the
optical fiber to forcibly take out the optical module. Ensure that the optical
fiber is connected to and removed from the optical interface horizontally.
Before taking out an optical module, remove its optical fiber and release its
latch first.

Figure 3-246 Closed latch

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Figure 3-247 Released latch

● The black plastic latch shown by (1) in Figure 3-248 is the unlocking device
for the 155 Mbit/s electrical transceiver. You can press the latch to unlock the
optical module. Hold the two sides of the optical module to remove it, as
shown by (2) in Figure 3-248.

Figure 3-248 Removing a 155 Mbit/s electrical transceiver

Do not remove the black plastic latch when removing the 155 Mbit/s
electrical transceiver.

If the black plastic latch falls off, use an auxiliary tool, such as a pair of
tweezers, to press the cage latch, as shown in Figure 3-249. Then, hold the
two sides of the optical module to remove it.

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Figure 3-249 Pressing the buckle of the optical cage

● If the CFP2 optical module is used, its unlocking device is a spring clip, as
shown by (1) in Figure 3-250. Before removing such an optical module,
release the latch first. Then, hold the latch to horizontally remove the optical
module.

Figure 3-250 Removing a CFP2 optical module

● When removing a CFP optical module, loosen the two screw rods of the
module and then remove the module slowly. Do not directly drag the optical
fiber to pull out the optical module or forcibly pull out the optical module.
Ensure that the optical fiber is connected to and removed from the optical
interface horizontally.

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CA UTION

The QSFP28 and QSFP-DD modules will get very hot during operation. To
prevent injuries, do not touch the module shells when removing the modules.

Precautions for Loose Optical Modules
● When installing an optical module, firmly push it into position until you hear
a click or feel a slight tremor, signaling that the optical module is securely
locked. If the optical module is not securely locked, its edge connector may be
loosely connected to the board connector, and the link may still be up.
However, if the optical module experiences tremors or collisions with other
objects, it may come loose or temporarily lose optical signals.
● When inserting the optical module, ensure that the latch is closed (the latch
locks the optical module). After the optical module is inserted, try pulling it
out to see if it is installed in position. If the optical module cannot be pulled
out, it is secured.
● If you cannot push the optical module into an optical module cage any
further, the optical module is in good contact with the board connector.
● When installing a CFP optical module, push the module panel horizontally
into the connector using even force with both thumbs. After the module is
inserted, push the module slightly to ensure that it has reached the stop
position.
● When inserting a CFP optical module into a board, ensure that the module is
in full contact with the connector. At the same time, fasten the captive screws

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at both ends of the CFP optical module. If you fasten the captive screws one
by one, the CFP optical module may fail to be securely installed. You are
advised to use a screwdriver to tighten the screws on the optical module.

Precautions for Receptacle Contamination
● Prepare cleaning tissues for onsite use. Clean an optical connector before
inserting it into the receptacle to protect the receptacle against
contamination.

NO TE

Use at least three cleaning tissues. Wipe the end of an optical connector horizontally
in one direction, and then shift the connector to the unused part of the cleaning tissue
to continue. Generally, one cleaning tissue is used for cleaning one optical connector.

● Cover optical modules that are temporarily unused with dust-proof caps to
prevent dust pollution. If no dust-proof caps are available, inserting fibers can
effectively prevent dust from entering these optical modules.
Covering temporarily unused optical modules with dust-proof caps

Using a fiber instead of a dust-proof cap to prevent dust pollution

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● Cover optical fiber jumpers that are temporarily unused with dust-proof caps
and place them on the optical distribution frame (ODF) or coil them up in a
fiber management tray. Ensure that they are not compressed or squeezed.

● If optical modules or fibers remain unused for a long time without being
covered with dust-proof caps, clean their receptacles or optical connectors
before using them again. Use cotton swabs to clean receptacles and fiber
cleaning tissues to clean fiber connectors.
NO TE

When cleaning a receptacle, gently insert a cotton swab and rotate it without applying
excessive force. Otherwise, the receptacle may be damaged.

● If optical signals are unexpectedly lost during device operation, use the
previously mentioned method to clean the receptacle or optical connector.
This can help exclude contamination as the cause of signal loss.

Precautions for Overload-caused Burnt Optical Modules
● When using an OTDR to test the connectivity or attenuation of a fiber
channel, disconnect the optical fiber from the optical module. Otherwise, the
optical module may be burnt.
● When performing a self-loop test, use an optical attenuator if necessary. Do
not loosen the optical connector instead.
● It is required that a long-distance optical module have an input optical power
of less than –7 dBm. If the input optical power is greater than –7 dBm, you
need to add an optical attenuator. For example, if the transmit optical power
is X dBm and the optical attenuation is Y dB, the receive optical power is X –
Y, which must be smaller than –7 dBm (X – Y < –7 dBm).

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Inspecting Optical Fiber Connectors
As the Ethernet port rate continues to rise, the quality standards for optical fibers
and cables rise accordingly. Table 3-467 describes requirements for the loss of
optical fiber connectors according to the national standard (GBT50312-2016).

Table 3-467 Maximum attenuation of optical fiber connectors
Type Maximum Attenuation of an Optical Fiber
Connector (dB)

Fiber splicing connector 0.3

Optical mechanical connector 0.3

Optical connector 0.75

NO TE

Fiber cores are connected through connectors, such as the ODF, optical attenuator, and
flange, in splicing and mechanical modes.
Table 3-468 describes requirements in IEEE Std 802.3-2018 for the reflection of
the optical fiber connector when Ethernet ports (such as 200G and 50G) use
PAM4 encoding to double the rate. More connectors bring lower requirements for
the reflection.

Table 3-468 Maximum reflection of connectors
Number of Optical Fiber Maximum Reflection of Each Connector
Connectors (dB)

1 –22

2 –29

4 –33

6 –35

8 –37

10 –39

The loss and reflectance values of optical fiber connectors are tested and
processed as follows:
1. Disconnect the peer optical fiber and use the OTDR to test the loss and
reflection of each link and node at the local end. Check whether the loss and
reflection of each link and node are normal (splicing connector loss < 0.3 dB/
node, connector loss < 0.75 dB/node, and connector reflection < –30 dB/
node). If the loss and reflection exceed the limits, handle the abnormal
interface.

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2. Based on the distance of the abnormal point in the OTDR test result, locate
the equipment room where the interface is located and preliminarily
determine the interface location. Disconnect the interface and perform the
OTDR test on the interface that reports the alarm to check whether the
distance is consistent with the previous test. If not, continue to test other
interfaces.
3. After locating the abnormal interface, use a fiberscope to check the interface.
If the interface is contaminated, clean it.
4. After the interface is cleaned, restore the interface and tighten the connector.
Perform an OTDR test on the interface that reports alarms to check whether
the loss and reflection of each link and node are normal.
5. If the fault persists, replace the flange plate and perform an OTDR test on the
interface that reports the alarm to check whether the loss and reflection of
each link and node are normal.
6. If the fault persists, replace the optical fiber and perform an OTDR test on the
interface that reports the alarm to check whether the loss and reflection of
each link and node are normal.
7. If there are multiple abnormal points on the link, repeat steps 2 to 6.

Other Precautions
● An optical connector must be horizontally inserted into a receptacle to avoid
damages to the receptacle.

● Mixed use of multimode and single-mode optical fibers is prohibited.
Otherwise, faults such as signal loss may occur.
The following table describes methods for distinguishing single-mode optical
modules from multimode optical modules.

Table 3-469 Method for distinguishing single-mode optical modules from
multimode optical modules

Item Single-Mode Multimode

Transmission distance 10 km or longer Below 0.5 km

Wavelength Non-850 nm 850 nm

Information on the SM MM
label

50G and 400G Optical Module Installation

1. Precautions for optical module installation

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(1) If a cabinet with a door is used, a sufficient distance must be reserved between
the optical module and the cabinet door to prevent the latch or pigtail from
bumping on the door.

(2) Long-distance optical modules must be equipped with optical attenuators for
self-loops. For a 50GBase-ER or 400GBase-ER (40 km) long-distance optical
module, the receive optical power damage threshold is lower than the average
minimum transmit optical power, making the module prone to damage caused by
self-loops. Therefore, the module must be equipped with an optical attenuator for
self-loops.

(3) When optical path quality is tested using an OTDR, optical fibers must be
removed from the associated optical module. This is because the OTDR's transmit
optical power is far greater than the optical power damage threshold at the
receive end of an optical module.

2. Method for checking an optical path

Figure 3-251 Method for checking an optical path

3. Method for cleaning the end faces of an optical fiber

Before cleaning the end faces of an optical fiber that is in use, ensure that the
optical fiber has no optical signals. To achieve this, shut down the ports at both
ends of the fiber. Then, clean the end faces and insert the optical fiber back into
the corresponding port.

To clean the end faces of an optical fiber that is not in use, remove the dust-proof
cap from the fiber connector (or the pigtail connector of the involved optical
component), and put the dust-proof cap into a dedicated cleaning kit. After the
cleaning is complete, re-install the dust-proof cap.

● Use the untouched part of a lint-free wipe to wipe the connector end face
along one direction.
● If the end face of an optical fiber cannot be cleaned due to serious
contamination, use a lint-free wipe dipped with cleanser to wipe the end face
along one direction. Then, use a dry lint-free wipe to clean the end face.
Ensure that the end face is dry before using the optical fiber.
● After the cleaning is complete, immediately install a dust-proof cap for any
optical fiber connector that is not in use.

4. Precautions for using a lint-free wipe to clean the end face of an optical
fiber

● Use the smooth surface of the lint-free wipe for cleaning.

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● Ensure that the optical fiber connector is vertical to the lint-free wipe during
cleaning.
● Wipe the end face along the direction of the lint-free wipe's grain.
● Wipe the end face along one direction only.
● Any part of a lint-free wipe can be used only once, and a small piece of lint-
free wipe can be used to clean only one connector.
5. Method for using lint-free swabs to clean the optical port of an optical
module
Remove the dust-proof cap from the optical port of the optical module, and put
the dust-proof cap into a dedicated cleaning kit.
● Select a proper lint-free swab based on the type of the optical port to be
cleaned. (For SC optical ports, use lint-free swabs with a diameter of 2.5 mm;
for LC and MTRJ optical ports, use lint-free swabs with a diameter of 1.25
mm.) Dip the lint-free swab into cleanser, insert it into the inside of the
optical port, and clean the optical port by rotating the swab 360 degrees in
one direction along the inner wall of the optical port.
● Insert a dry lint-free swab of the same type into the optical port and clean the
optical port by rotating the swab 360 degrees in one direction along the inner
wall of the optical port.
● Cover the optical port with a dust-proof cap after the cleaning is complete.
6. Precautions for using lint-free swabs to clean the optical port of an optical
module
● When cleaning the optical port of an optical module, clean the end faces of
associated optical fibers to prevent the optical fibers from contaminating the
optical port.
● In general, each lint-free swab can be used for cleaning only once. If a used
lint-free swab is confirmed clean and can be reused, it can be used for a
maximum of three times. For example, a lint-free swab that is ever used to
dry an optical port can be used for a maximum of three times.
7. Safety precautions
● Electrostatic protection: Active optical and electrical components are
extremely sensitive to electrostatic. Therefore, take strict measures to protect
against electrostatic. For example, wear ESD gloves during operations and
touch only the shell of the involved component.
● Laser protection: Do not look into optical ports without eye protection when
reseating a module.
8. Discrete reflectance
During link deployment, focus on the reflection indicators of each node. The
discrete reflection indicators must meet the IEEE specifications.

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Table 3-470 Maximum discrete reflectances of QSFP28 50G defined by IEEE
Number of QSFP28 50G-FR QSFP28 50G-LR QSFP28 50G-ER
Discrete (Maximum Value (Maximum Value (Maximum Value
Reflectances of Each Discrete of Each Discrete of Each Discrete
Greater Than –55 Reflectance Reflectance Reflectance
dB Coefficient) Coefficient) Coefficient)

1 –25 dB –22 dB –19 dB

2 –31 dB –29 dB –27 dB

4 –35 dB –33 dB -32 dB

6 –38 dB –35 dB –35 dB

8 –40 dB –37 dB –37 dB

10 –41 dB –39 dB –39 dB

Table 3-471 Maximum discrete reflectances of QSFP-DD 400G defined by IEEE
Number of QSFP-DD 400G- QSFP-DD 400G- QSFP-DD QSFP-
Discrete FR4 LR8 400G-ER8 DD
Reflectances (Maximum Value (Maximum (Maximum 400G-
Greater Than of Each Discrete Value of Each Value of LR4-6
–55 dB Reflectance Discrete Each (Maxi
Coefficient) Reflectance Discrete mum
Coefficient) Reflectance Value
Coefficient) of
Each
Discre
te
Reflec
tance
Coeffi
cient)

1 –25 dB –22 dB –19 dB –22 dB

2 –31 dB –29 dB –27 dB –29 dB

4 –35 dB –33 dB -32 dB –33 dB

6 –38 dB –35 dB –35 dB –35 dB

8 –40 dB –37 dB –37 dB –37 dB

10 –41 dB –39 dB –39 dB –39 dB

3.4.1.5 Optical Attenuator Configuration
This section describes how to configure an optical attenuator.

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Calculating the Optical Attenuation
You can calculate the optical attenuation based on the actual optical power.

Table 3-472 Parameters for calculating optical attenuation
Name Description

P(in)min Worst sensitivity (maximum value of
the worst sensitivity).

P(out)max Maximum transmit optical power.

S Transmission distance.

A Attenuation coefficient. Note that the
attenuation coefficient is related to
optical fiber types and wavelengths.
Generally, the attenuation coefficient is
0.45 dBm/km or 0.4 dBm/km. The
attenuation coefficient of a 1550-nm
wavelength is 0.235 dBm/km or 0.25
dBm/km.

P(in)max Maximum receive optical power, that
is, minimum overload point.

The principle for determining whether an attenuator needs to be configured at a
transmission point is as follows:
If P(out)max – S x A > P(in)max, an attenuator needs to be configured. The
optical attenuation is calculated in the following formula: T= P(out)max – S x A –
P(in)max.

Table 3-473 Reference for configuring an attenuator
Part Descriptio P(out) P(out) P(in) P(in)
Number n max min min max

34060276 eSFP,1310n –8 dBm –15 dBm –31 dBm –8 dbm
m,STM1,LC
,SM,15km

NO TE

● If P(in)max of an optical module equals P(out)max, you do not need to configure an
attenuator.
● You can choose the 5 dBm and 10 dBm attenuators for optical modules on the device.

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Part Numbers and Descriptions of Attenuators

Table 3-474 Part numbers and descriptions of attenuators

Part Number Description

45030021 Fixed Optical
Attenuator,1260nm~1620nm-5dB-LC/
PC-45dB

45030022 Fixed Optical
Attenuator,1260nm~1620nm-10dB-LC/
PC-45dB

NO TE

This table is for reference only. The part numbers of attenuators vary according to
configuration documents.
3.4.2 Optical Amplifier Overview

3.4.2.1 Functions

An optical amplifier (OA) is a C-band pluggable optical amplification module,
which can be configured at the transmit or receive end of a device according to
the actual scenario.

Table 3-475 OA functions

Function Description

Basic function Amplifies optical signals over C-band wavelengths in the range
from 1535 nm to 1547 nm.

Pluggable Is pluggable.

Gain Adjusts the gain based on the input optical power to achieve
adjustment continuous gain adjustment in the range from 9 dB to 23 dB.

Power Fixes the output power at 7 dBm according to the input power
adjustment range.

Working mode Indicates the working mode. In power locking and gain locking
modes, the EDFA module's gain is adjustable and its actual
gain can be queried.

Performance ● Monitors and reports optical power.
and alarm ● Controls the temperature of the pump laser.
monitoring
● Monitors the pump drive current, cooling current, pump
laser temperature, and ambient temperature of the board.

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3.4.2.2 Appearance and Structure

Figure 3-252 Appearance of an OA

Figure 3-253 shows the structure of an OA.

Figure 3-253 Structure of an OA

1. Shell 2. Signal direction 3. Pull tab
indication

4. Connector 5. Receive port 6. Transmit port

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Table 3-476 Type and function of OA ports
Port Silkscreen Port Type Function

IN/OUT LC Amplifies multiplexed
signals.

3.4.2.3 Application Scenario

When a router uses an 80 km QSFP-DD optical module, an OA is required.

Only single-span applications are supported.
1. If the link loss is less than 22 dB (standard), no site survey is required. An OA
needs to be installed only at the TX end (see scenario 1 in the following
figure).

Works with 400G ZR optical modules, When the transmission distance ranges from
40 km to 80 km and the insertion loss of the optical link is less than 22 dB, the
optical amplifier needs to be configured only at the transmit end.

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NO TE

The optical amplifier module works at the physical layer. If the corresponding physical port
is steady on, it indicates that the optical amplifier module works normally and no LOS
alarm is reported. If the corresponding physical port is off, it indicates that the optical
amplifier module does not work normally or a LOS alarm is reported. If the status of an
amplifier module port is up, the amplifier module board is working properly and no LOS
alarm is reported. If the status of an amplifier module port is down, the amplifier module
board is not working properly or a LOS alarm is reported.
Figure1shows how to configure an OA at the transmit end.

Figure 3-254 Configuring an OA at the transmit end

3.4.2.4 Guide to Using Optical Amplifier

NO TE

● OAs can be used in indoor scenarios with thermal power exchange or in environments
where the working conditions of the OAs can be guaranteed.
● The OA can be installed in the QSFP-DD, QSFP28, or dedicated power supply port on a
router.
● An OA can amplify the optical signals of just one optical fiber.
● OAs can only be used with 80 km 400GE optical modules. Specifically, the OAs and 80
km 400GE optical modules can be installed on the same board or span over different
boards.
● Only optical modules matching Huawei products can be used. If non-matching optical
modules are used, device requirements may fail to be met, and services may fail to run
properly.

ESD Measures
Before touching an OA, wear ESD gloves or an ESD wrist strap. Take ESD measures
when installing an OA indoors or outdoors.

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Figure 3-255 Methods of wearing an ESD glove

Figure 3-256 Methods of wearing an ESD wrist strap

Placing Optical Apparatus and Fibers
Avoid touching pins or edge connectors with bare hands. Handle optical fibers
delicately. Use two fingers to grip the fiber connector instead of directly holding
the fiber or its cover.
Avoid applying axial or lateral pressure to a fiber. Refrain from folding or twisting
a fiber or crushing its pigtail. Do not drag a fiber or apply pressure to the coupling
point of its pigtail. Figure 3-257 shows how to properly place optical apparatus
and fibers.

Figure 3-257 Methods of placing optical apparatus and fibers

NO TE

During installation, ensure that an optical fiber is coiled into a loop with a diameter of at
least 6 cm.

Uninstalling Optical Apparatus
When removing an OA, first disconnect its optical fiber, then pull the tab latch,
and slowly take out the OA. Avoid forcefully pulling out an OA by directly

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dragging its optical fiber. Ensure that the optical fiber is connected to and
removed from an OA horizontally.

Precautions for Loose OAs
● When installing an OA, firmly push it into position until you hear a click or
feel a slight tremor, signaling that the OA is securely locked. If the OA is not
securely locked, its edge connector may be loosely connected to the board
connector, and the link may still be up. However, if the OA experiences
tremors or collisions with other objects, it may come loose or temporarily lose
optical signals.
● When installing an OA into an optical module cage, push it firmly into
position until it cannot be pushed any further. This ensures that the OA has
good contact with the board connector.

Precautions for Receptacle Contamination
● Prepare clean tissues for onsite use. Clean an optical connector before
inserting it into the receptacle to protect the receptacle against
contamination.

NO TE

Use at least three cleaning tissues. Wipe the end of an optical connector horizontally
in one direction, and then shift the connector to the unused part of the cleaning tissue
to continue. Generally, one cleaning tissue is used for cleaning one optical connector.

● Cover OAs that are temporarily unused with dust-proof caps to prevent dust
pollution. If no dust-proof caps are available, inserting fibers can effectively
prevent dust from entering these OAs.
● Place optical fiber jumpers that are temporarily unused on the optical
distribution frame (ODF) or coil them up in a fiber management tray. Ensure
that they are not compressed or squeezed.

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● If OAs or optical fibers remain unused for a long time without being covered
with dust-proof caps, clean their receptacles or optical connectors before
using them again. Use cotton swabs to clean receptacles and cleaning tissues
to clean optical connectors.

NO TE

When cleaning a receptacle, gently insert a cotton swab and rotate it without applying
excessive force. Otherwise, the receptacle may be damaged.
● If optical signals are unexpectedly lost during device operation, use the
previously mentioned method to clean the receptacle or optical connector.
This can help exclude contamination as the cause of signal loss.

Precautions for Overload-caused Burnt OAs
● When using an OTDR to test the connectivity or attenuation of a fiber
channel, disconnect the optical fiber from the OA. Otherwise, the OA may be
burnt.
● When performing a self-loop test, use an optical attenuator if necessary. Do
not loosen the optical connector instead.
● If an OA is directly connected to an optical module, ensure that the output
power of the OA does not exceed the overload threshold (0 dBm) of the
optical module.

Other Precautions

An optical connector must be horizontally inserted into a receptacle to avoid
damages to the receptacle.

3.4.3 155Mbps eSFP Optical Module

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3.4.3.1 155Mbps-eSFP-SMF-1550nm-80km-commercial

Table 3-477 155Mbps-eSFP-SMF-1550nm-80km-commercial specifications

Item Value

Basic Information

Module name 155Mbps-eSFP-SMF-1550nm-80km-
commercial

Part Number 34060282

Model eSFP-FE-LH80-SM1550

Form factor eSFP

Application standard ITU-T G.957, STM-1

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s

Target transmission distance [km] 80 km

Transmitter Optical Characteristics

Center wavelength [nm] 1550 nm

Tx operating wavelength range [nm] 1480 nm - 1580 nm

Maximum Tx optical power (AVG) 0 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -5 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 10.5 dB

Receiver Optical Characteristics

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Item Value

Rx operating wavelength range [nm] 1263 nm - 1580 nm

Rx sensitivity (AVG) [dBm] -34 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -10 dBm

Overload power (OMA) [dBm] -

3.4.3.2 155Mbps-eSFP-SMF-1310nm-40km-commercial

Table 3-478 155Mbps-eSFP-SMF-1310nm-40km-commercial specifications
Item Value

Basic Information

Module name 155Mbps-eSFP-SMF-1310nm-40km-
commercial

Part Number S4015715

Model eSFP-FE-LH40-SM1310

Form factor eSFP

Application standard ITU-T G.957, STM-1

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s

Target transmission distance [km] 40 km

Transmitter Optical Characteristics

Center wavelength [nm] 1310 nm

Tx operating wavelength range [nm] 1263 nm - 1360 nm

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Item Value

Maximum Tx optical power (AVG) 0 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -5 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 10.5 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1263 nm - 1360 nm

Rx sensitivity (AVG) [dBm] -34 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -10 dBm

Overload power (OMA) [dBm] -10 dBm

3.4.3.3 155Mbps-eSFP-MMF-1310nm-2km-commercial

Table 3-479 155Mbps-eSFP-MMF-1310nm-2km-commercial specifications
Item Value

Basic Information

Module name 155Mbps-eSFP-MMF-1310nm-2km-
commercial

Part Number S4015731

Model SFP-FE-SX-MM1310

Form factor eSFP

Application standard ITU-T G.957, STM-1

Connector type LC

Optical fiber type MMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options -

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Item Value

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s

Target transmission distance [km] 2 km

Transmitter Optical Characteristics

Center wavelength [nm] 1310 nm

Tx operating wavelength range [nm] 1270 nm - 1380 nm

Maximum Tx optical power (AVG) -14 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -19 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 10 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1270 nm - 1380 nm

Rx sensitivity (AVG) [dBm] -30 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -14 dBm

Overload power (OMA) [dBm] -14 dBm

3.4.3.4 155Mbps-eSFP-SMF-1310nm-15km-commercial

Table 3-480 155Mbps-eSFP-SMF-1310nm-15km-commercial specifications
Item Value

Basic Information

Module name 155Mbps-eSFP-SMF-1310nm-15km-
commercial

Part Number S4015755

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Item Value

Model eSFP-FE-LX-SM1310

Form factor eSFP

Application standard ITU-T G.957, STM-1

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s

Target transmission distance [km] 15 km

Transmitter Optical Characteristics

Center wavelength [nm] 1310 nm

Tx operating wavelength range [nm] 1261 nm - 1360 nm

Maximum Tx optical power (AVG) -8 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -15 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1260 nm - 1580 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -8 dBm

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3.4.4 622Mbps eSFP Optical Module

3.4.4.1 622Mbps-eSFP-SMF-1310nm-15km-commercial

Table 3-481 622Mbps-eSFP-SMF-1310nm-15km-commercial specifications

Item Value

Basic Information

Module name 622Mbps-eSFP-SMF-1310nm-15km-
commercial

Part Number 34060277

Model eSFP-1310nm-S-4.1/ESCON SM/DVB
ASI SM

Form factor eSFP

Application standard ITU-T G.957, STM-4

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 622 Mbit/s

Target transmission distance [km] 15 km

Transmitter Optical Characteristics

Center wavelength [nm] 1310 nm

Tx operating wavelength range [nm] 1274 nm - 1356 nm

Maximum Tx optical power (AVG) -8 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -15 dBm
[dBm]

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Item Value

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.5 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1260 nm - 1580 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.4.2 622Mbps-eSFP-SMF-1310nm-40km-commercial

Table 3-482 622Mbps-eSFP-SMF-1310nm-40km-commercial specifications

Item Value

Basic Information

Module name 622Mbps-eSFP-SMF-1310nm-40km-
commercial

Part Number 34060280

Model eSFP-1310nm-L-4.1

Form factor eSFP

Application standard ITU-T G.957, STM-4

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 622 Mbit/s

Target transmission distance [km] 40 km

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Item Value

Transmitter Optical Characteristics

Center wavelength [nm] 1310 nm

Tx operating wavelength range [nm] 1296 nm - 1330 nm

Maximum Tx optical power (AVG) 2 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -3 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 10.5 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1296 nm - 1330 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.4.3 622Mbps-eSFP-SMF-1550nm-80km-commercial

Table 3-483 622Mbps-eSFP-SMF-1550nm-80km-commercial specifications
Item Value

Basic Information

Module name 622Mbps-eSFP-SMF-1550nm-80km-
commercial

Part Number 34060284

Model eSFP-1550nm-L-4.2

Form factor eSFP

Application standard ITU-T G.957, STM-4

Connector type LC

Optical fiber type SMF

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Item Value

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 622 Mbit/s

Target transmission distance [km] 80 km

Transmitter Optical Characteristics

Center wavelength [nm] 1550 nm

Tx operating wavelength range [nm] 1480 nm - 1580 nm

Maximum Tx optical power (AVG) 2 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -3 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 10.5 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1260 nm - 1580 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.5 1Gbps Electrical Module

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3.4.5.1 1Gbps-SFP-100m-industry

Table 3-484 1Gbps-SFP-100m-industry specifications

Item Value

Basic Information

Module name 1Gbps-SFP-100m-industry

Part Number 02310RAV

Model OEGD01N01

Form factor SFP

Application standard IEEE 802.3, 1000Base-T

Connector type RJ45

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] –40°C to +85°C(–40°F to +185°F)

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 10 Mbit/s
100 Mbit/s
1000 Mbit/s

Target transmission distance [km] 0.1 km

3.4.6 1.25Gbps eSFP Optical Module

3.4.6.1 1.25Gbps-eSFP-MMF-850nm-500m-extended

Table 3-485 1.25Gbps-eSFP-MMF-850nm-500m-extended specifications

Item Value

Basic Information

Module name 1.25Gbps-eSFP-MMF-850nm-500m-
extended

Part Number 34060286

Model eSFP-850nm-1000Base-Sx/FC200 MM

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Item Value

Form factor eSFP

Application standard IEEE 802.3, 1000BASE-SX

Connector type LC

Optical fiber type MMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] -20°C to 85°C(-4°F to 185°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 1.25 Gbit/s

Target transmission distance [km] 0.5 km(OM1)

Transmitter Optical Characteristics

Center wavelength [nm] 850 nm

Tx operating wavelength range [nm] 770 nm - 860 nm

Maximum Tx optical power (AVG) 0 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -9.5 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 9 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 760 nm - 860 nm

Rx sensitivity (AVG) [dBm] -17 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] 0 dBm

Overload power (OMA) [dBm] -

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3.4.6.2 1.25Gbps-eSFP-SMF-1550nm-100km-commercial

Table 3-486 1.25Gbps-eSFP-SMF-1550nm-100km-commercial specifications

Item Value

Basic Information

Module name 1.25Gbps-eSFP-SMF-1550nm-100km-
commercial

Part Number 34060295

Model eSFP-GE-ZX100-SM1550

Form factor eSFP

Application standard IEEE 802.3, 1000BASE-ZX

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 1.25 Gbit/s

Target transmission distance [km] 100 km

Transmitter Optical Characteristics

Center wavelength [nm] 1550 nm

Tx operating wavelength range [nm] 1500 nm - 1580 nm

Maximum Tx optical power (AVG) 5 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 9.5 dB

Receiver Optical Characteristics

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Item Value

Rx operating wavelength range [nm] 1260 nm - 1580 nm

Rx sensitivity (AVG) [dBm] -30 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -9 dBm

Overload power (OMA) [dBm] -

NOTE
The interface standard is Huawei-specific.

3.4.6.3 1.25Gbps-eSFP-SMF-1550nm-80km-commercial

Table 3-487 1.25Gbps-eSFP-SMF-1550nm-80km-commercial specifications
Item Value

Basic Information

Module name 1.25Gbps-eSFP-SMF-1550nm-80km-
commercial

Part Number 34060360

Model eSFP-1550nm-1000Base-Zx/FC100

Form factor eSFP

Application standard IEEE 802.3, 1000BASE-ZX

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 1.25 Gbit/s

Target transmission distance [km] 80 km

Transmitter Optical Characteristics

Center wavelength [nm] 1550 nm

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Item Value

Tx operating wavelength range [nm] 1500 nm - 1580 nm

Maximum Tx optical power (AVG) 5 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -2 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 9 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1260 nm - 1580 nm

Rx sensitivity (AVG) [dBm] -23 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -3 dBm

Overload power (OMA) [dBm] -

NOTE
The interface standard is Huawei-specific.

3.4.6.4 1.25Gbps-eSFP-SMF-1310nm-10km-commercial

Table 3-488 1.25Gbps-eSFP-SMF-1310nm-10km-commercial specifications

Item Value

Basic Information

Module name 1.25Gbps-eSFP-SMF-1310nm-10km-
commercial

Part Number S4016067

Model OSG010N05

Form factor eSFP

Application standard IEEE 802.3, 1000BASE-LX10

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

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Item Value

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 1.25 Gbit/s

Target transmission distance [km] 10 km

Transmitter Optical Characteristics

Center wavelength [nm] 1310 nm

Tx operating wavelength range [nm] 1270 nm - 1355 nm

Maximum Tx optical power (AVG) -3 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -9 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 9.5 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1270 nm - 1355 nm

Rx sensitivity (AVG) [dBm] -20 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -3 dBm

Overload power (OMA) [dBm] -3 dBm

3.4.6.5 1.25Gbps-eSFP-SMF-1310nm-40km-commercial

Table 3-489 1.25Gbps-eSFP-SMF-1310nm-40km-commercial specifications
Item Value

Basic Information

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Item Value

Module name 1.25Gbps-eSFP-SMF-1310nm-40km-
commercial

Part Number S4016954

Model OSG040002

Form factor eSFP

Application standard IEEE 802.3, 1000BASE-EX

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 1.25 Gbit/s

Target transmission distance [km] 40 km

Transmitter Optical Characteristics

Center wavelength [nm] 1310 nm

Tx operating wavelength range [nm] 1275 nm - 1350 nm

Maximum Tx optical power (AVG) 0 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -5 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 9.5 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1260 nm - 1580 nm

Rx sensitivity (AVG) [dBm] -23 dBm

Rx sensitivity (OMA) [dBm] -

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Item Value

Overload power (AVG) [dBm] -3 dBm

Overload power (OMA) [dBm] -3 dBm

3.4.7 125M~2.67Gbps eSFP DWDM Optical Module

3.4.7.1 125M~2.67Gbps-eSFP-SMF-1557.36nm-120km-commercial

Table 3-490 125M~2.67Gbps-eSFP-SMF-1557.36nm-120km-commercial
specifications

Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1557.36nm-120km-commercial

Part Number 34060375

Model eSFP-LH120-SM192.50

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1557.36 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

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Item Value

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.7.2 125M~2.67Gbps-eSFP-SMF-1556.55nm-120km-commercial

Table 3-491 125M~2.67Gbps-eSFP-SMF-1556.55nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1556.55nm-120km-commercial

Part Number 34060376

Model eSFP-LH120-SM192.60

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

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Item Value

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1556.55 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.7.3 125M~2.67Gbps-eSFP-SMF-1555.75nm-120km-commercial

Table 3-492 125M~2.67Gbps-eSFP-SMF-1555.75nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1555.75nm-120km-commercial

Part Number 34060377

Model eSFP-LH120-SM192.70

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Item Value

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1555.75 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

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3.4.7.4 125M~2.67Gbps-eSFP-SMF-1554.94nm-120km-commercial

Table 3-493 125M~2.67Gbps-eSFP-SMF-1554.94nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1554.94nm-120km-commercial

Part Number 34060378

Model eSFP-LH120-SM192.80

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1554.94 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

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Item Value

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.7.5 125M~2.67Gbps-eSFP-SMF-1554.13nm-120km-commercial

Table 3-494 125M~2.67Gbps-eSFP-SMF-1554.13nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1554.13nm-120km-commercial

Part Number 34060379

Model eSFP-LH120-SM192.90

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1554.13 nm

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Item Value

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.7.6 125M~2.67Gbps-eSFP-SMF-1553.33nm-120km-commercial

Table 3-495 125M~2.67Gbps-eSFP-SMF-1553.33nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1553.33nm-120km-commercial

Part Number 34060380

Model eSFP-LH120-SM193.00

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

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Hardware Guide 3 Hardware Description

Item Value

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1553.33 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.7.7 125M~2.67Gbps-eSFP-SMF-1552.52nm-120km-commercial

Table 3-496 125M~2.67Gbps-eSFP-SMF-1552.52nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1552.52nm-120km-commercial

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Hardware Guide 3 Hardware Description

Item Value

Part Number 34060381

Model eSFP-LH120-SM193.10

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1552.52 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

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Hardware Guide 3 Hardware Description

3.4.7.8 125M~2.67Gbps-eSFP-SMF-1551.72nm-120km-commercial

Table 3-497 125M~2.67Gbps-eSFP-SMF-1551.72nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1551.72nm-120km-commercial

Part Number 34060382

Model eSFP-LH120-SM193.20

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1551.72 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

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Hardware Guide 3 Hardware Description

Item Value

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.7.9 125M~2.67Gbps-eSFP-SMF-1550.92nm-120km-commercial

Table 3-498 125M~2.67Gbps-eSFP-SMF-1550.92nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1550.92nm-120km-commercial

Part Number 34060383

Model eSFP-LH120-SM193.30

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1550.92 nm

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Hardware Guide 3 Hardware Description

Item Value

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.7.10 125M~2.67Gbps-eSFP-SMF-1550.12nm-120km-commercial

Table 3-499 125M~2.67Gbps-eSFP-SMF-1550.12nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1550.12nm-120km-commercial

Part Number 34060384

Model eSFP-LH120-SM193.40

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

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Hardware Guide 3 Hardware Description

Item Value

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1550.12 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.7.11 125M~2.67Gbps-eSFP-SMF-1549.32nm-120km-commercial

Table 3-500 125M~2.67Gbps-eSFP-SMF-1549.32nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1549.32nm-120km-commercial

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Value

Part Number 34060385

Model eSFP-LH120-SM193.50

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1549.32 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

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Hardware Guide 3 Hardware Description

3.4.7.12 125M~2.67Gbps-eSFP-SMF-1548.51nm-120km-commercial

Table 3-501 125M~2.67Gbps-eSFP-SMF-1548.51nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1548.51nm-120km-commercial

Part Number 34060386

Model eSFP-LH120-SM193.60

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1548.51 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

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Hardware Guide 3 Hardware Description

Item Value

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.7.13 125M~2.67Gbps-eSFP-SMF-1547.72nm-120km-commercial

Table 3-502 125M~2.67Gbps-eSFP-SMF-1547.72nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1547.72nm-120km-commercial

Part Number 34060387

Model eSFP-LH120-SM193.70

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1547.72 nm

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Value

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.7.14 125M~2.67Gbps-eSFP-SMF-1546.92nm-120km-commercial

Table 3-503 125M~2.67Gbps-eSFP-SMF-1546.92nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1546.92nm-120km-commercial

Part Number 34060388

Model eSFP-LH120-SM193.80

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

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Hardware Guide 3 Hardware Description

Item Value

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1546.92 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.7.15 125M~2.67Gbps-eSFP-SMF-1546.12nm-120km-commercial

Table 3-504 125M~2.67Gbps-eSFP-SMF-1546.12nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1546.12nm-120km-commercial

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Value

Part Number 34060389

Model eSFP-LH120-SM193.90

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1546.12 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

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Hardware Guide 3 Hardware Description

3.4.7.16 125M~2.67Gbps-eSFP-SMF-1545.32nm-120km-commercial

Table 3-505 125M~2.67Gbps-eSFP-SMF-1545.32nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1545.32nm-120km-commercial

Part Number 34060390

Model eSFP-LH120-SM194.00

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1545.32 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

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Hardware Guide 3 Hardware Description

Item Value

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.7.17 125M~2.67Gbps-eSFP-SMF-1544.53nm-120km-commercial

Table 3-506 125M~2.67Gbps-eSFP-SMF-1544.53nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1544.53nm-120km-commercial

Part Number 34060391

Model eSFP-LH120-SM194.10

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1544.53 nm

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Hardware Guide 3 Hardware Description

Item Value

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.7.18 125M~2.67Gbps-eSFP-SMF-1543.73nm-120km-commercial

Table 3-507 125M~2.67Gbps-eSFP-SMF-1543.73nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1543.73nm-120km-commercial

Part Number 34060392

Model eSFP-LH120-SM194.20

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

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Hardware Guide 3 Hardware Description

Item Value

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1543.73 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.7.19 125M~2.67Gbps-eSFP-SMF-1542.94nm-120km-commercial

Table 3-508 125M~2.67Gbps-eSFP-SMF-1542.94nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1542.94nm-120km-commercial

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Value

Part Number 34060393

Model eSFP-LH120-SM194.30

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1542.94 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

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Hardware Guide 3 Hardware Description

3.4.7.20 125M~2.67Gbps-eSFP-SMF-1542.14nm-120km-commercial

Table 3-509 125M~2.67Gbps-eSFP-SMF-1542.14nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1542.14nm-120km-commercial

Part Number 34060394

Model eSFP-LH120-SM194.40

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1542.14 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

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Hardware Guide 3 Hardware Description

Item Value

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.7.21 125M~2.67Gbps-eSFP-SMF-1541.35nm-120km-commercial

Table 3-510 125M~2.67Gbps-eSFP-SMF-1541.35nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1541.35nm-120km-commercial

Part Number 34060395

Model eSFP-LH120-SM194.50

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1541.35 nm

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Value

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.7.22 125M~2.67Gbps-eSFP-SMF-1540.56nm-120km-commercial

Table 3-511 125M~2.67Gbps-eSFP-SMF-1540.56nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1540.56nm-120km-commercial

Part Number 34060396

Model eSFP-LH120-SM194.60

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

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Hardware Guide 3 Hardware Description

Item Value

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1540.56 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.7.23 125M~2.67Gbps-eSFP-SMF-1539.77nm-120km-commercial

Table 3-512 125M~2.67Gbps-eSFP-SMF-1539.77nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1539.77nm-120km-commercial

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Value

Part Number 34060397

Model eSFP-LH120-SM194.70

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1539.77 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

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Hardware Guide 3 Hardware Description

3.4.7.24 125M~2.67Gbps-eSFP-SMF-1538.98nm-120km-commercial

Table 3-513 125M~2.67Gbps-eSFP-SMF-1538.98nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1538.98nm-120km-commercial

Part Number 34060398

Model eSFP-LH120-SM194.80

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1538.98 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

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Hardware Guide 3 Hardware Description

Item Value

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.7.25 125M~2.67Gbps-eSFP-SMF-1538.19nm-120km-commercial

Table 3-514 125M~2.67Gbps-eSFP-SMF-1538.19nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1538.19nm-120km-commercial

Part Number 34060399

Model eSFP-LH120-SM194.90

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1538.19 nm

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Hardware Guide 3 Hardware Description

Item Value

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.7.26 125M~2.67Gbps-eSFP-SMF-1537.40nm-120km-commercial

Table 3-515 125M~2.67Gbps-eSFP-SMF-1537.40nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1537.40nm-120km-commercial

Part Number 34060400

Model eSFP-LH120-SM195.00

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

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Hardware Guide 3 Hardware Description

Item Value

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1537.4 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.7.27 125M~2.67Gbps-eSFP-SMF-1536.61nm-120km-commercial

Table 3-516 125M~2.67Gbps-eSFP-SMF-1536.61nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1536.61nm-120km-commercial

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Value

Part Number 34060401

Model eSFP-LH120-SM195.10

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1536.61 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

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Hardware Guide 3 Hardware Description

3.4.7.28 125M~2.67Gbps-eSFP-SMF-1535.82nm-120km-commercial

Table 3-517 125M~2.67Gbps-eSFP-SMF-1535.82nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1535.82nm-120km-commercial

Part Number 34060402

Model eSFP-LH120-SM195.20

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1535.82 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

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Hardware Guide 3 Hardware Description

Item Value

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.7.29 125M~2.67Gbps-eSFP-SMF-1535.04nm-120km-commercial

Table 3-518 125M~2.67Gbps-eSFP-SMF-1535.04nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1535.04nm-120km-commercial

Part Number 34060403

Model eSFP-LH120-SM195.30

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1535.04 nm

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Hardware Guide 3 Hardware Description

Item Value

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.7.30 125M~2.67Gbps-eSFP-SMF-1534.25nm-120km-commercial

Table 3-519 125M~2.67Gbps-eSFP-SMF-1534.25nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1534.25nm-120km-commercial

Part Number 34060404

Model eSFP-LH120-SM195.40

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

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Hardware Guide 3 Hardware Description

Item Value

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1534.25 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.7.31 125M~2.67Gbps-eSFP-SMF-1533.47nm-120km-commercial

Table 3-520 125M~2.67Gbps-eSFP-SMF-1533.47nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1533.47nm-120km-commercial

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 579
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Value

Part Number 34060405

Model eSFP-LH120-SM195.50

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1533.47 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

3.4.7.32 125M~2.67Gbps-eSFP-SMF-1532.68nm-120km-commercial

Table 3-521 125M~2.67Gbps-eSFP-SMF-1532.68nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1532.68nm-120km-commercial

Part Number 34060406

Model eSFP-LH120-SM195.60

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1532.68 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

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Hardware Guide 3 Hardware Description

Item Value

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.7.33 125M~2.67Gbps-eSFP-SMF-1531.90nm-120km-commercial

Table 3-522 125M~2.67Gbps-eSFP-SMF-1531.90nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1531.90nm-120km-commercial

Part Number 34060407

Model eSFP-LH120-SM195.70

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1531.9 nm

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Hardware Guide 3 Hardware Description

Item Value

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.7.34 125M~2.67Gbps-eSFP-SMF-1531.12nm-120km-commercial

Table 3-523 125M~2.67Gbps-eSFP-SMF-1531.12nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1531.12nm-120km-commercial

Part Number 34060408

Model eSFP-LH120-SM195.80

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

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Hardware Guide 3 Hardware Description

Item Value

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1531.12 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.7.35 125M~2.67Gbps-eSFP-SMF-1530.33nm-120km-commercial

Table 3-524 125M~2.67Gbps-eSFP-SMF-1530.33nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1530.33nm-120km-commercial

Issue 04 (2025-04-30) Copyright © Huawei Technologies Co., Ltd. 584
HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Value

Part Number 34060409

Model eSFP-LH120-SM195.90

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1530.33 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

3.4.7.36 125M~2.67Gbps-eSFP-SMF-1529.55nm-120km-commercial

Table 3-525 125M~2.67Gbps-eSFP-SMF-1529.55nm-120km-commercial
specifications
Item Value

Basic Information

Module name 125M~2.67Gbps-eSFP-
SMF-1529.55nm-120km-commercial

Part Number 34060410

Model eSFP-LH120-SM196.00

Form factor eSFP

Application standard SONET OC-48 LR-2, Gigabit Ethernet

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 155 Mbit/s ~ 2.67 Gbit/s

Target transmission distance [km] 120 km

Transmitter Optical Characteristics

Center wavelength [nm] 1529.55 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

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HUAWEI NE5000E Series
Hardware Guide 3 Hardware Description

Item Value

Rx operating wavelength range [nm] 1520 nm - 1570 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -8 dBm

Overload power (OMA) [dBm] -

3.4.8 2.5Gbps eSFP Optical Module

3.4.8.1 2.5Gbps-eSFP-SMF-1310nm-40km-commercial

Table 3-526 2.5Gbps-eSFP-SMF-1310nm-40km-commercial specifications

Item Value

Basic Information

Module name 2.5Gbps-eSFP-SMF-1310nm-40km-
commercial

Part Number 34060289

Model eSFP-1310nm-L-16.1

Form factor eSFP

Application standard ITU-T G.957, STM-16

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 2.5 Gbit/s

Target transmission distance [km] 40 km

Transmitter Optical Characteristics

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Item Value

Center wavelength [nm] 1310 nm

Tx operating wavelength range [nm] 1280 nm - 1335 nm

Maximum Tx optical power (AVG) 3 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -2 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1260 nm - 1580 nm

Rx sensitivity (AVG) [dBm] -27 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -9 dBm

Overload power (OMA) [dBm] -

3.4.8.2 2.5Gbps-eSFP-SMF-1310nm-2km-commercial

Table 3-527 2.5Gbps-eSFP-SMF-1310nm-2km-commercial specifications
Item Value

Basic Information

Module name 2.5Gbps-eSFP-SMF-1310nm-2km-
commercial

Part Number 34060484

Model eSFP-1310nm-155M-2.5G-LC-SM-2km

Form factor eSFP

Application standard ITU-T G.957, STM-16

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

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Item Value

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 2.5 Gbit/s

Target transmission distance [km] 2 km

Transmitter Optical Characteristics

Center wavelength [nm] 1310 nm

Tx operating wavelength range [nm] 1266 nm - 1360 nm

Maximum Tx optical power (AVG) -3 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -10 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.5 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1200 nm - 1650 nm

Rx sensitivity (AVG) [dBm] -18 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -3 dBm

Overload power (OMA) [dBm] -

3.4.8.3 2.5Gbps-eSFP-SMF-1310nm-15km-commercial

Table 3-528 2.5Gbps-eSFP-SMF-1310nm-15km-commercial specifications
Item Value

Basic Information

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Item Value

Module name 2.5Gbps-eSFP-SMF-1310nm-15km-
commercial

Part Number 34060485

Model eSFP-SM1310-155M~2.5G-15km

Form factor eSFP

Application standard ITU-T G.957, STM-16

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 2.5 Gbit/s

Target transmission distance [km] 15 km

Transmitter Optical Characteristics

Center wavelength [nm] 1310 nm

Tx operating wavelength range [nm] 1260 nm - 1360 nm

Maximum Tx optical power (AVG) 0 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -5 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.5 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1250 nm - 1620 nm

Rx sensitivity (AVG) [dBm] -18 dBm

Rx sensitivity (OMA) [dBm] -

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Item Value

Overload power (AVG) [dBm] 0 dBm

Overload power (OMA) [dBm] -

3.4.8.4 2.5Gbps-eSFP-SMF-1550nm-80km-commercial

Table 3-529 2.5Gbps-eSFP-SMF-1550nm-80km-commercial specifications
Item Value

Basic Information

Module name 2.5Gbps-eSFP-SMF-1550nm-80km-
commercial

Part Number 34060488

Model eSFP-1550nm-L-16.2

Form factor eSFP

Application standard ITU-T G.957, STM-16

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 2.5 Gbit/s

Target transmission distance [km] 80 km

Transmitter Optical Characteristics

Center wavelength [nm] 1550 nm

Tx operating wavelength range [nm] 1500 nm - 1580 nm

Maximum Tx optical power (AVG) 3 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

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Item Value

Minimum Tx optical power (AVG) -2 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1200 nm - 1650 nm

Rx sensitivity (AVG) [dBm] -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -9 dBm

Overload power (OMA) [dBm] -

3.4.9 10Gbps SFP+ Optical Module

3.4.9.1 10Gbps-SFP+-SMF-1550nm-80km-commercial

Table 3-530 10Gbps-SFP+-SMF-1550nm-80km-commercial specifications

Item Value

Basic Information

Module name 10Gbps-SFP+-SMF-1550nm-80km-
commercial

Part Number 02310PVU

Model OSX080N04

Form factor SFP+

Application standard IEEE 802.3ae, 10GBASE-ZR/ZW

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

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Item Value

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 9.953 Gbit/s
10.3125 Gbit/s

Target transmission distance [km] 80 km

Transmitter Optical Characteristics

Center wavelength [nm] 1550 nm

Tx operating wavelength range [nm] 1530 nm - 1565 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 9 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1260 nm - 1565 nm

Rx sensitivity (AVG) [dBm] -24 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -7 dBm

Overload power (OMA) [dBm] -

NOTE
The interface standard is Huawei-specific. Self-loop is not supported. An optical attenuator
must be added if self-loop is required.

3.4.9.2 10Gbps-SFP+-SMF-1550nm-40km-commercial (02310TGH)

Table 3-531 10Gbps-SFP+-SMF-1550nm-40km-commercial specifications
Item Value

Basic Information

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Item Value

Module name 10Gbps-SFP+-SMF-1550nm-40km-
commercial

Part Number 02310TGH

Model OSX040N07

Form factor SFP+

Application standard IEEE 802.3ae, 10GBASE-ER/EW

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 9.953 Gbit/s
10.3125 Gbit/s

Target transmission distance [km] 40 km

Transmitter Optical Characteristics

Center wavelength [nm] 1550 nm

Tx operating wavelength range [nm] 1530 nm - 1565 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -4.7 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 3 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1530 nm - 1565 nm

Rx sensitivity (AVG) [dBm] -15.8 dBm

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Item Value

Rx sensitivity (OMA) [dBm] -14.1 dBm

Overload power (AVG) [dBm] -1 dBm

Overload power (OMA) [dBm] -

3.4.9.3 10Gbps-SFP+-SMF-1310nm-40km-commercial (02311YEB)

Table 3-532 10Gbps-SFP+-SMF-1310nm-40km-commercial specifications
Item Value

Basic Information

Module name 10Gbps-SFP+-SMF-1310nm-40km-
commercial

Part Number 02311YEB

Model OSX040N14

Form factor SFP+

Application standard IEEE 802.3ae, 10GBASE-ER/EW

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 9.953 bit/s ~ 10.3125 Gbit/s

Target transmission distance [km] 40 km

Transmitter Optical Characteristics

Center wavelength [nm] 1310 nm

Tx operating wavelength range [nm] 1260 nm - 1355 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

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Item Value

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -2 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 3.5 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1260 nm - 1600 nm

Rx sensitivity (AVG) [dBm] -20 dBm

Rx sensitivity (OMA) [dBm] -20 dBm

Overload power (AVG) [dBm] -7 dBm

Overload power (OMA) [dBm] -7 dBm

NOTE
1310 nm- and 1550 nm-wavelength modules cannot be used together, because self-loop is
not supported. An optical attenuator must be added if self-loop is required.

3.4.9.4 10Gbps-SFP+-SMF-1310nm-40km-commercial (34061409)

Table 3-533 10Gbps-SFP+-SMF-1310nm-40km-commercial specifications

Item Value

Basic Information

Module name 10Gbps-SFP+-SMF-1310nm-40km-
commercial

Part Number 34061409

Model Default

Form factor SFP+

Application standard IEEE 802.3ae, 10GBASE-ER/EW

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

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Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 10.3125 Gbit/s

Target transmission distance [km] 40 km

Transmitter Optical Characteristics

Center wavelength [nm] 1310 nm

Tx operating wavelength range [nm] 1260 nm- 1355nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -2 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 9 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1260 nm-1600nm

Rx sensitivity (AVG) [dBm] -20 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -7 dBm

Overload power (OMA) [dBm] -

NOTE
The interface standard is Huawei-specific. Self-loop is not supported. An optical attenuator
must be added if self-loop is required.

3.4.9.5 10Gbps-SFP+-MMF-850nm-0.3km-commercial

Table 3-534 10Gbps-SFP+-MMF-850nm-0.3km-commercial specifications
Item Value

Basic Information

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Item Value

Module name 10Gbps-SFP+-MMF-850nm-0.3km-
commercial

Part Number S4017482

Model OSX040N03

Form factor SFP+

Application standard IEEE 802.3ae, 10GBASE-SR/SW

Connector type LC

Optical fiber type MMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 9.953 Gbit/s
10.3125 Gbit/s

Target transmission distance [km] 0.3 km(OM3)

Transmitter Optical Characteristics

Center wavelength [nm] 850 nm

Tx operating wavelength range [nm] 840 nm - 860 nm

Maximum Tx optical power (AVG) -1 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -7.3 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 3 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 840 nm - 860 nm

Rx sensitivity (AVG) [dBm] -9.9 dBm

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Item Value

Rx sensitivity (OMA) [dBm] -11.1 dBm

Overload power (AVG) [dBm] -1 dBm

Overload power (OMA) [dBm] -1 dBm

3.4.9.6 10Gbps-SFP+-SMF-1310nm-10km-commercial (S4017483)

Table 3-535 10Gbps-SFP+-SMF-1310nm-10km-commercial specifications
Item Value

Basic Information

Module name 10Gbps-SFP+-SMF-1310nm-10km-
commercial

Part Number S4017483

Model OSX001002

Form factor SFP+

Application standard IEEE 802.3ae, 10GBASE-LR/LW

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 9.953 Gbit/s
10.3125 Gbit/s

Target transmission distance [km] 10 km

Transmitter Optical Characteristics

Center wavelength [nm] 1310 nm

Tx operating wavelength range [nm] 1260 nm - 1355 nm

Maximum Tx optical power (AVG) 0.5 dBm
[dBm]

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Item Value

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -8.2 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 3.5 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1260 nm - 1355 nm

Rx sensitivity (AVG) [dBm] -14.4 dBm

Rx sensitivity (OMA) [dBm] -12.6 dBm

Overload power (AVG) [dBm] 0.5 dBm

Overload power (OMA) [dBm] 0.5 dBm

3.4.10 10Gbps SFP+ CWDM Optical Module

3.4.10.1 10Gbps-SFP+-SMF-1511nm-70km-commercial

Table 3-536 10Gbps-SFP+-SMF-1511nm-70km-commercial specifications

Item Value

Basic Information

Module name 10Gbps-SFP+-SMF-1511nm-70km-
commercial

Part Number 34060686

Model OSX070001

Form factor SFP+

Application standard IEEE 802.3ae, 10GBASE-X

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

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Item Value

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 9.953 Gbit/s
10.3125 Gbit/s

Target transmission distance [km] 70 km

Transmitter Optical Characteristics

Center wavelength [nm] 1511 nm

Tx operating wavelength range [nm] 1504.5 nm - 1517.5 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1460 nm - 1620 nm

Rx sensitivity (AVG) [dBm] -23 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -7 dBm

Overload power (OMA) [dBm] -

3.4.10.2 10Gbps-SFP+-SMF-1471nm-70km-commercial

Table 3-537 10Gbps-SFP+-SMF-1471nm-70km-commercial specifications
Item Value

Basic Information

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Item Value

Module name 10Gbps-SFP+-SMF-1471nm-70km-
commercial

Part Number 34060687

Model OSX070002

Form factor SFP+

Application standard IEEE 802.3ae, 10GBASE-X

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 9.953 Gbit/s
10.3125 Gbit/s

Target transmission distance [km] 70 km

Transmitter Optical Characteristics

Center wavelength [nm] 1471 nm

Tx operating wavelength range [nm] 1464.5 nm - 1477.5 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1460 nm - 1620 nm

Rx sensitivity (AVG) [dBm] -23 dBm

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Item Value

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -7 dBm

Overload power (OMA) [dBm] -

3.4.10.3 10Gbps-SFP+-SMF-1491nm-70km-commercial

Table 3-538 10Gbps-SFP+-SMF-1491nm-70km-commercial specifications
Item Value

Basic Information

Module name 10Gbps-SFP+-SMF-1491nm-70km-
commercial

Part Number 34060688

Model OSX070003

Form factor SFP+

Application standard IEEE 802.3ae, 10GBASE-X

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 9.953 Gbit/s
10.3125 Gbit/s

Target transmission distance [km] 70 km

Transmitter Optical Characteristics

Center wavelength [nm] 1491 nm

Tx operating wavelength range [nm] 1484.5 nm - 1497.5 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

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Item Value

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1460 nm - 1620 nm

Rx sensitivity (AVG) [dBm] -23 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -7 dBm

Overload power (OMA) [dBm] -

3.4.10.4 10Gbps-SFP+-SMF-1531nm-70km-commercial

Table 3-539 10Gbps-SFP+-SMF-1531nm-70km-commercial specifications

Item Value

Basic Information

Module name 10Gbps-SFP+-SMF-1531nm-70km-
commercial

Part Number 34060689

Model OSX070004

Form factor SFP+

Application standard IEEE 802.3ae, 10GBASE-X

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

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Item Value

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 9.953 Gbit/s
10.3125 Gbit/s

Target transmission distance [km] 70 km

Transmitter Optical Characteristics

Center wavelength [nm] 1531 nm

Tx operating wavelength range [nm] 1524.5 nm - 1537.5 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1460 nm - 1620 nm

Rx sensitivity (AVG) [dBm] -23 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -7 dBm

Overload power (OMA) [dBm] -

3.4.10.5 10Gbps-SFP+-SMF-1551nm-70km-commercial

Table 3-540 10Gbps-SFP+-SMF-1551nm-70km-commercial specifications
Item Value

Basic Information

Module name 10Gbps-SFP+-SMF-1551nm-70km-
commercial

Part Number 34060690

Model OSX070005

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Item Value

Form factor SFP+

Application standard IEEE 802.3ae, 10GBASE-X

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 9.953 Gbit/s
10.3125 Gbit/s

Target transmission distance [km] 70 km

Transmitter Optical Characteristics

Center wavelength [nm] 1551 nm

Tx operating wavelength range [nm] 1544.5 nm - 1557.5 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1460 nm - 1620 nm

Rx sensitivity (AVG) [dBm] -23 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -7 dBm

Overload power (OMA) [dBm] -

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3.4.10.6 10Gbps-SFP+-SMF-1571nm-70km-commercial

Table 3-541 10Gbps-SFP+-SMF-1571nm-70km-commercial specifications
Item Value

Basic Information

Module name 10Gbps-SFP+-SMF-1571nm-70km-
commercial

Part Number 34060691

Model OSX070006

Form factor SFP+

Application standard IEEE 802.3ae, 10GBASE-X

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 9.953 Gbit/s
10.3125 Gbit/s

Target transmission distance [km] 70 km

Transmitter Optical Characteristics

Center wavelength [nm] 1571 nm

Tx operating wavelength range [nm] 1564.5 nm - 1577.5 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

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Item Value

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1460 nm - 1620 nm

Rx sensitivity (AVG) [dBm] -23 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -7 dBm

Overload power (OMA) [dBm] -

3.4.10.7 10Gbps-SFP+-SMF-1591nm-70km-commercial

Table 3-542 10Gbps-SFP+-SMF-1591nm-70km-commercial specifications

Item Value

Basic Information

Module name 10Gbps-SFP+-SMF-1591nm-70km-
commercial

Part Number 34060692

Model OSX070007

Form factor SFP+

Application standard IEEE 802.3ae, 10GBASE-X

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 9.953 Gbit/s
10.3125 Gbit/s

Target transmission distance [km] 70 km

Transmitter Optical Characteristics

Center wavelength [nm] 1591 nm

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Item Value

Tx operating wavelength range [nm] 1584.5 nm - 1597.5 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1460 nm - 1620 nm

Rx sensitivity (AVG) [dBm] -21 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -7 dBm

Overload power (OMA) [dBm] -

3.4.10.8 10Gbps-SFP+-SMF-1611nm-70km-commercial

Table 3-543 10Gbps-SFP+-SMF-1611nm-70km-commercial specifications
Item Value

Basic Information

Module name 10Gbps-SFP+-SMF-1611nm-70km-
commercial

Part Number 34060693

Model OSX070008

Form factor SFP+

Application standard IEEE 802.3ae, 10GBASE-X

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

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DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 9.953 Gbit/s
10.3125 Gbit/s

Target transmission distance [km] 70 km

Transmitter Optical Characteristics

Center wavelength [nm] 1611 nm

Tx operating wavelength range [nm] 1604.5 nm - 1617.4 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1460 nm - 1620 nm

Rx sensitivity (AVG) [dBm] -21 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -7 dBm

Overload power (OMA) [dBm] -

3.4.11 10Gbps SFP+ BIDI Optical Module

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3.4.11.1 10Gbps-SFP+-SMF-1270nm(Tx)/1330nm(Rx)-40km-commercial

Table 3-544 10Gbps-SFP+-SMF-1270nm(Tx)/1330nm(Rx)-40km-commercial
specifications
Item Value

Basic Information

Module name 10Gbps-SFP+-SMF-1270nm(Tx)/
1330nm(Rx)-40km-commercial

Part Number 02311JNF

Model OSX040B10

Form factor SFP+

Application standard IEEE 802.3ae, 10GBASE-BX-U

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C (32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 9.953 Gbit/s
10.3125 Gbit/s

Target transmission distance [km] 40 km

Transmitter Optical Characteristics

Center wavelength [nm] 1270 nm

Tx operating wavelength range [nm] 1260 nm - 1280 nm

Maximum Tx optical power (AVG) 5 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

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Minimum extinction ratio [dB] 3.5 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1320 nm - 1340 nm

Rx sensitivity (AVG) [dBm] -18 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -9 dBm

Overload power (OMA) [dBm] -

NOTE
1. Ensure that the optical power on the receive side is less than or equal to –5 dBm. If the
optical power does not meet the requirement, add an optical attenuator. Do not use short-
distance optical fibers for direct connection.

3.4.11.2 10Gbps-SFP+-SMF-1330nm(Tx)/1270nm(Rx)-40km-commercial

Table 3-545 10Gbps-SFP+-SMF-1330nm(Tx)/1270nm(Rx)-40km-commercial
specifications
Item Value

Basic Information

Module name 10Gbps-SFP+-SMF-1330nm(Tx)/
1270nm(Rx)-40km-commercial

Part Number 02311JNQ

Model OSX040B11

Form factor SFP+

Application standard IEEE 802.3ae, 10GBASE-BX40-D

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

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Item Value

Transmission rate [bit/s] 9.953 Gbit/s
10.3125 Gbit/s

Target transmission distance [km] 40 km

Transmitter Optical Characteristics

Center wavelength [nm] 1330 nm

Tx operating wavelength range [nm] 1320 nm - 1340 nm

Maximum Tx optical power (AVG) 5 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 3.5 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1260 nm - 1280 nm

Rx sensitivity (AVG) [dBm] -18 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -9 dBm

Overload power (OMA) [dBm] -

NOTE
1. Ensure that the optical power on the receive side is less than or equal to –5 dBm. If the
optical power does not meet the requirement, add an optical attenuator. Do not use short-
distance optical fibers for direct connection.

3.4.11.3 10Gbps-SFP+-SMF-1270nm(Tx)/1330nm(Rx)-10km-industry

Table 3-546 10Gbps-SFP+-SMF-1270nm(Tx)/1330nm(Rx)-10km-industry
specifications
Item Value

Basic Information

Module name 10Gbps-SFP+-SMF-1270nm(Tx)/
1330nm(Rx)-10km-industry

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Item Value

Part Number 34060544-002

Model OSX010B10

Form factor SFP+

Application standard IEEE 802.3ae, 10GBASE-BX10-U

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] –40°C to +85°C(–40°F to +185°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 9.953 Gbit/s
10.3125 Gbit/s

Target transmission distance [km] 10 km

Transmitter Optical Characteristics

Center wavelength [nm] 1270 nm

Tx operating wavelength range [nm] 1260 nm - 1280 nm

Maximum Tx optical power (AVG) 0.5 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -8.2 dBm
[dBm]

Minimum Tx optical power (OMA) -5.2 dBm
[dBm]

Minimum extinction ratio [dB] 3.5 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1320 nm - 1340 nm

Rx sensitivity (AVG) [dBm] -14.4 dBm

Rx sensitivity (OMA) [dBm] -10.3 dBm

Overload power (AVG) [dBm] 0.5 dBm

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Item Value

Overload power (OMA) [dBm] -

3.4.11.4 10Gbps-SFP+-SMF-1330nm(Tx)/1270nm(Rx)-10km-industry

Table 3-547 10Gbps-SFP+-SMF-1330nm(Tx)/1270nm(Rx)-10km-industry
specifications

Item Value

Basic Information

Module name 10Gbps-SFP+-SMF-1330nm(Tx)/
1270nm(Rx)-10km-industry

Part Number 34060546-002

Model OSX010B11

Form factor SFP+

Application standard IEEE 802.3ae, 10GBASE-BX10-D

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] –40°C to +85°C(–40°F to +185°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 9.953 Gbit/s
10.3125 Gbit/s

Target transmission distance [km] 10 km

Transmitter Optical Characteristics

Center wavelength [nm] 1330 nm

Tx operating wavelength range [nm] 1320 nm - 1340 nm

Maximum Tx optical power (AVG) 0.5 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

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Item Value

Minimum Tx optical power (AVG) -8.2 dBm
[dBm]

Minimum Tx optical power (OMA) -5.2 dBm
[dBm]

Minimum extinction ratio [dB] 3.5 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1260 nm - 1280 nm

Rx sensitivity (AVG) [dBm] -14.4 dBm

Rx sensitivity (OMA) [dBm] -12.6 dBm

Overload power (AVG) [dBm] 0.5 dBm

Overload power (OMA) [dBm] -

3.4.12 10Gbps SFP+ OTN Optical Module

3.4.12.1 10Gbps-SFP+-SMF-1528nm~1568nm-80km-commercial

Table 3-548 10Gbps-SFP+-SMF-1528nm~1568nm-80km-commercial specifications

Item Value

Basic Information

Module name 10Gbps-SFP+-
SMF-1528nm~1568nm-80km-
commercial

Part Number 02311GSA

Model OSX080C00

Form factor SFP+

Application standard IEEE 802.3ae, 10GBASE-ZR/ZW, ITUT
G.709

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12(10GE)
<1x10E-4(OTU2, OTU2e)

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

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Item Value

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 9.953 Gbit/s
10.3125 Gbit/s
11.1 Gbit/s

Target transmission distance [km] 80 km

Transmitter Optical Characteristics

Center wavelength [nm] -

Tx operating wavelength range [nm] 1529.163 nm - 1560.606
nm

Maximum Tx optical power (AVG) 3 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -1 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 9 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1260 nm - 1600 nm

Rx sensitivity (AVG) [dBm] -24 dBm(10GE 1e-12);
-26 dBm(OTU2,OTU2e,1e-4)

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -7 dBm

Overload power (OMA) [dBm] -

NOTE
The interface standard is Huawei-specific.

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3.4.12.2 10Gbps-SFP+-SMF-1310nm-10km-commercial (34060613)

Table 3-549 10Gbps-SFP+-SMF-1310nm-10km-commercial specifications
Item Value

Basic Information

Module name 10Gbps-SFP+-SMF-1310nm-10km-
commercial

Part Number 34060613

Model OSX010N01

Form factor SFP+

Application standard IEEE 802.3ae, 10GBASE-LR/LW, ITU-T
G.709

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12(10GE)
<1x10E-4(OTU2, OTU2e)

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 9.953 Gbit/s
10.3125 Gbit/s
11.1 Gbit/s

Target transmission distance [km] 10 km

Transmitter Optical Characteristics

Center wavelength [nm] 1310 nm

Tx operating wavelength range [nm] 1260 nm - 1355 nm

Maximum Tx optical power (AVG) -1 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -6 dBm
[dBm]

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Item Value

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 6 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1260 nm - 1355 nm

Rx sensitivity (AVG) [dBm] -14.4 dBm

Rx sensitivity (OMA) [dBm] -12.6 dBm

Overload power (AVG) [dBm] 0.5 dBm

Overload power (OMA) [dBm] -

3.4.12.3 10Gbps-SFP+-SMF-1550nm-40km-commercial (34060711-002)

Table 3-550 10Gbps-SFP+-SMF-1550nm-40km-commercial specifications
Item Value

Basic Information

Module name 10Gbps-SFP+-SMF-1550nm-40km-
commercial

Part Number 34060711-002

Model OSX040M00

Form factor SFP+

Application standard IEEE 802.3ae, 10GBASE-ER/EW, ITU-T
G.709

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12(10GE)
<1x10E-4(OTU2, OTU2e)

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

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Item Value

Transmission rate [bit/s] 9.953 Gbit/s
10.3125 Gbit/s
11.1 Gbit/s

Target transmission distance [km] 40 km

Transmitter Optical Characteristics

Center wavelength [nm] 1550 nm

Tx operating wavelength range [nm] 1530 nm - 1565 nm

Maximum Tx optical power (AVG) 2 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -1 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1260 nm - 1565 nm

Rx sensitivity (AVG) [dBm] -15.8 dBm(10GE)
-16 dBm(OTU2, OTU2e, fec enable)

Rx sensitivity (OMA) [dBm] -14.1 dBm(10G)

Overload power (AVG) [dBm] -1 dBm

Overload power (OMA) [dBm] -

3.4.13 10Gbps SFP+ SDH Optical Module

3.4.13.1 10Gbps-SFP+-SMF-1310nm-10km-commercial (34060613)

Table 3-551 10Gbps-SFP+-SMF-1310nm-10km-commercial specifications
Item Value

Basic Information

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Hardware Guide 3 Hardware Description

Item Value

Module name 10Gbps-SFP+-SMF-1310nm-10km-
commercial

Part Number 34060613

Model OSX010N01

Form factor SFP+

Application standard IEEE 802.3ae, 10GBASE-LR/LW, ITU-T
G.709

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12(10GE)
<1x10E-4(OTU2, OTU2e)

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 9.953 Gbit/s
10.3125 Gbit/s
11.1 Gbit/s

Target transmission distance [km] 10 km

Transmitter Optical Characteristics

Center wavelength [nm] 1310 nm

Tx operating wavelength range [nm] 1260 nm - 1355 nm

Maximum Tx optical power (AVG) -1 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -6 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 6 dB

Receiver Optical Characteristics

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Rx operating wavelength range [nm] 1260 nm - 1355 nm

Rx sensitivity (AVG) [dBm] -14.4 dBm

Rx sensitivity (OMA) [dBm] -12.6 dBm

Overload power (AVG) [dBm] 0.5 dBm

Overload power (OMA) [dBm] -

3.4.13.2 10Gbps-SFP+-SMF-1550nm-40km-commercial (34060711-002)

Table 3-552 10Gbps-SFP+-SMF-1550nm-40km-commercial specifications
Item Value

Basic Information

Module name 10Gbps-SFP+-SMF-1550nm-40km-
commercial

Part Number 34060711-002

Model OSX040M00

Form factor SFP+

Application standard IEEE 802.3ae, 10GBASE-ER/EW, ITU-T
G.709

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12(10GE)
<1x10E-4(OTU2, OTU2e)

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 9.953 Gbit/s
10.3125 Gbit/s
11.1 Gbit/s

Target transmission distance [km] 40 km

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Item Value

Transmitter Optical Characteristics

Center wavelength [nm] 1550 nm

Tx operating wavelength range [nm] 1530 nm - 1565 nm

Maximum Tx optical power (AVG) 2 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -1 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1260 nm - 1565 nm

Rx sensitivity (AVG) [dBm] -15.8 dBm(10GE)
-16 dBm(OTU2, OTU2e, fec enable)

Rx sensitivity (OMA) [dBm] -14.1 dBm(10G)

Overload power (AVG) [dBm] -1 dBm

Overload power (OMA) [dBm] -

3.4.14 10Gbps XFP Optical Module

3.4.14.1 10Gbps-XFP-SMF-1310nm-10km-commercial

Table 3-553 10Gbps-XFP-SMF-1310nm-10km-commercial specifications

Item Value

Basic Information

Module name 10Gbps-XFP-SMF-1310nm-10km-
commercial

Part Number 02310SPD

Model OSX010N00

Form factor XFP

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Item Value

Application standard IEEE 802.3ae, 10GBASE-LR/LW;STM64/
OC-192

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-INF-8077i

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 9.953 Gbit/s
10.3125 Gbit/s

Target transmission distance [km] 10 km

Transmitter Optical Characteristics

Center wavelength [nm] 1310 nm

Tx operating wavelength range [nm] 1290 nm - 1330 nm

Maximum Tx optical power (AVG) -1 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -6 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 6 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1270 nm - 1600 nm

Rx sensitivity (AVG) [dBm] -14.4 dBm

Rx sensitivity (OMA) [dBm] -12.6 dBm

Overload power (AVG) [dBm] -1 dBm

Overload power (OMA) [dBm] -

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3.4.14.2 10Gbps-XFP-SMF-1550nm-40km-commercial

Table 3-554 10Gbps-XFP-SMF-1550nm-40km-commercial specifications
Item Value

Basic Information

Module name 10Gbps-XFP-SMF-1550nm-40km-
commercial

Part Number 02310SPF

Model OSX040N06

Form factor XFP

Application standard IEEE 802.3ae, 10GBASE-ER/EW;
STM64/OC-192;
ITU-T G.709 OTU2/2e

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-INF-8077i

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 9.953 Gbit/s
10.3125 Gbit/s

Target transmission distance [km] 40 km

Transmitter Optical Characteristics

Center wavelength [nm] 1550 nm

Tx operating wavelength range [nm] 1530 nm - 1565 nm

Maximum Tx optical power (AVG) 2 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -1 dBm
[dBm]

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Item Value

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1270 nm - 1600 nm

Rx sensitivity (AVG) [dBm] -14 dBm(STM64)
-15.8 dBm(10GE)
-16 dBm(OTU2, OTU2e, fec enable)

Rx sensitivity (OMA) [dBm] -14.1 dBm(10GE)

Overload power (AVG) [dBm] -1 dBm

Overload power (OMA) [dBm] -

NOTE
Self-loop is not supported. An optical attenuator must be added if self-loop is required.

3.4.14.3 10Gbps-XFP-SMF-1550nm-80km-commercial

Table 3-555 10Gbps-XFP-SMF-1550nm-80km-commercial specifications
Item Value

Basic Information

Module name 10Gbps-XFP-SMF-1550nm-80km-
commercial

Part Number 34060361

Model XFP-1550-STM64/FC10G/10GbE/
OTU2-80km

Form factor XFP

Application standard IEEE 802.3ae, 10GBASE-ZR/ZW;
STM64/OC-192

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-INF-8077i

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Item Value

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 9.953 Gbit/s
10.3125 Gbit/s

Target transmission distance [km] 80 km

Transmitter Optical Characteristics

Center wavelength [nm] 1550 nm

Tx operating wavelength range [nm] 1530 nm - 1565 nm

Maximum Tx optical power (AVG) 4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 9 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1270 nm - 1600 nm

Rx sensitivity (AVG) [dBm] -24 dBm

Rx sensitivity (OMA) [dBm] -19.1 dBm

Overload power (AVG) [dBm] -7 dBm

Overload power (OMA) [dBm] -

NOTE
The interface standard is Huawei-specific. Self-loop is not supported. An optical attenuator
must be added if self-loop is required.

3.4.14.4 10Gbps-XFP-MMF-850nm-0.3km-commercial

Table 3-556 10Gbps-XFP-MMF-850nm-0.3km-commercial specifications

Item Value

Basic Information

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Item Value

Module name 10Gbps-XFP-MMF-850nm-0.3km-
commercial

Part Number S4015798

Model XFP-850-FC10G/10GbE-0.3km

Form factor XFP

Application standard IEEE 802.3ae, 10GBASE-SR/SW

Connector type LC

Optical fiber type MMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-INF-8077i

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 9.953 Gbit/s
10.3125 Gbit/s

Target transmission distance [km] 0.3 km(OM3)

Transmitter Optical Characteristics

Center wavelength [nm] 850 nm

Tx operating wavelength range [nm] 840 nm - 860 nm

Maximum Tx optical power (AVG) -1 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -6.5 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 3 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 840 nm - 860 nm

Rx sensitivity (AVG) [dBm] -11.1 dBm

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Item Value

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -1 dBm

Overload power (OMA) [dBm] -1 dBm

3.4.15 10Gbps SFP+ DWDM Optical Module

3.4.15.1 10Gbps-SFP+-SMF-1528nm~1568nm-80km-commercial

Table 3-557 10Gbps-SFP+-SMF-1528nm~1568nm-80km-commercial specifications

Item Value

Basic Information

Module name 10Gbps-SFP+-
SMF-1528nm~1568nm-80km-
commercial

Part Number 02311GSA

Model OSX080C00

Form factor SFP+

Application standard IEEE 802.3ae, 10GBASE-ZR/ZW, ITUT
G.709

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12(10GE)
<1x10E-4(OTU2, OTU2e)

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8472

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 9.953 Gbit/s
10.3125 Gbit/s
11.1 Gbit/s

Target transmission distance [km] 80 km

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Item Value

Transmitter Optical Characteristics

Center wavelength [nm] -

Tx operating wavelength range [nm] 1529.163 nm - 1560.606
nm

Maximum Tx optical power (AVG) 3 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -1 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 9 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1260 nm - 1600 nm

Rx sensitivity (AVG) [dBm] -24 dBm(10GE 1e-12);
-26 dBm(OTU2,OTU2e,1e-4)

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -7 dBm

Overload power (OMA) [dBm] -

NOTE
The interface standard is Huawei-specific.

3.4.16 40Gbps CFP ETH&OTN Optical Module

3.4.16.1 40Gbps(1*39.8/1*43.1)-CFP-SMF-1550nm-2km-commercial

Table 3-558 40Gbps(1*39.8/1*43.1)-CFP-SMF-1550nm-2km-commercial
specifications

Item Value

Basic Information

Module name 40Gbps(1*39.8/1*43.1)-CFP-
SMF-1550nm-2km-commercial

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Hardware Guide 3 Hardware Description

Item Value

Part Number 02311FDD

Model OSM002N01

Form factor CFP

Application standard IEEE 802.3bg, 40GBASE-FR, ITU-T
G.693

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options CFP MSA

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 39.813 Gbit/s
43.018 Gbit/s

Target transmission distance [km] 2 km

Transmitter Optical Characteristics

Center wavelength [nm] 1550 nm

Tx operating wavelength range [nm] 1530 nm - 1565 nm

Maximum Tx optical power (AVG) 3 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8.2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] -

Rx sensitivity (AVG) [dBm] -6 dBm

Rx sensitivity (OMA) [dBm] -

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Item Value

Overload power (AVG) [dBm] 3 dBm

Overload power (OMA) [dBm] -

3.4.16.2 40Gbps(4*10.3/4*11.8)-CFP-SMF-1271~1331nm-10km-commercial

Table 3-559 40Gbps(4*10.3/4*11.8)-CFP-SMF-1271~1331nm-10km-commercial
specifications
Item Value

Basic Information

Module name 40Gbps(4*10.3/4*11.8)-CFP-
SMF-1271~1331nm-10km-commercial

Part Number 34060754

Model OSM010N02

Form factor CFP

Application standard IEEE 802.3ba, 40GBASE-LR4, ITU-T
G.693

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options CFP MSA

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 39.813 Gbit/s
43.018 Gbit/s

Target transmission distance [km] 10 km

Transmitter Optical Characteristics

Center wavelength [nm] 1271 nm
1291 nm
1311 nm
1331 nm

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Item Value

Tx operating wavelength range [nm] 1264.5 nm - 1277.5 nm
1284.5 nm - 1297.5 nm
1304.5 nm - 1317.5 nm
1324.5 nm - 1337.5 nm

Maximum Tx optical power (AVG) per lane: 2.3 dBm(OTN)
[dBm] per lane: 2.3 dBm(Ethernet)

Maximum Tx optical power (OMA) per lane: 3.5 dBm(Ethernet)
[dBm]

Minimum Tx optical power (AVG) per lane: -2.3 dBm(OTN)
[dBm] per lane: -7.0 dBm(Ethernet)

Minimum Tx optical power (OMA) per lane: -4 dBm(Ethernet)
[dBm]

Minimum extinction ratio [dB] 4.5 dB(OTN)
3.5 dB(Ethernet)

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1264.5 nm - 1277.5 nm
1284.5 nm - 1297.5 nm
1304.5 nm - 1317.5 nm
1324.5 nm - 1337.5 nm

Rx sensitivity (AVG) [dBm] per lane: -10.8(OTN) dBm

Rx sensitivity (OMA) [dBm] per lane: -11.5 dBm(Ethernet)

Overload power (AVG) [dBm] per lane: 2.3 dBm

Overload power (OMA) [dBm] -

NOTE
The optical power calculation is based on the OMA value. The optical power read by the
device is the average optical power, not the OMA optical power.

3.4.17 40Gbps CFP Optical Module

3.4.17.1 40Gbps(4*10.3)-CFP-MMF-850nm-0.1km-commercial

Table 3-560 40Gbps(4*10.3)-CFP-MMF-850nm-0.1km-commercial specifications

Item Value

Basic Information

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Hardware Guide 3 Hardware Description

Item Value

Module name 40Gbps(4*10.3)-CFP-
MMF-850nm-0.1km-commercial

Part Number 02310WUV

Model OSMD10N02

Form factor CFP

Application standard IEEE 802.3ba, 40GBASE-SR4

Connector type MPO-12

Optical fiber type MMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options CFP MSA

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 41.25 Gbit/s

Target transmission distance [km] 0.1 km(OM3)
0.15 km(OM4)

Transmitter Optical Characteristics

Center wavelength [nm] 850 nm

Tx operating wavelength range [nm] 840 nm - 860 nm

Maximum Tx optical power (AVG) -
[dBm]

Maximum Tx optical power (OMA) per lane: 3 dBm
[dBm]

Minimum Tx optical power (AVG) -
[dBm]

Minimum Tx optical power (OMA) per lane: -5.6 dBm
[dBm]

Minimum extinction ratio [dB] 3 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 840 nm - 860 nm

Rx sensitivity (AVG) [dBm] -

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Item Value

Rx sensitivity (OMA) [dBm] per lane: -5.4 dBm

Overload power (AVG) [dBm] per lane: 3.4 dBm

Overload power (OMA) [dBm] -

3.4.17.2 40Gbps(4*10.3)-CFP-SMF-1531.12~1550.12nm-80km-commercial

Table 3-561 40Gbps(4*10.3)-CFP-SMF-1531.12~1550.12nm-80km-commercial
specifications

Item Value

Basic Information

Module name 40Gbps(4*10.3)-CFP-
SMF-1531.12~1550.12nm-80km-
commercial

Part Number 02311AYS

Model OSX080N05

Form factor CFP

Application standard IEEE 802.3bm, 40GBASE-ZR4

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options CFP MSA

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 41.25 Gbit/s

Target transmission distance [km] 80 km

Transmitter Optical Characteristics

Center wavelength [nm] 1531.12 nm
1537.4 nm
1543.73 nm
1550.12 nm

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Item Value

Tx operating wavelength range [nm] 1530.09 nm - 1532.15 nm
1536.37 nm - 1538.43 nm
1542.7 nm - 1544.75 nm
1549.09 nm - 1551.15 nm

Maximum Tx optical power (AVG) per lane: 4.5 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) per lane: 0 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 9 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1530.09 nm - 1532.15 nm
1536.37 nm - 1538.43 nm
1542.7 nm - 1544.75 nm
1549.09 nm - 1551.15 nm

Rx sensitivity (AVG) [dBm] per lane: -20 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] per lane: 4.5 dBm

Overload power (OMA) [dBm] -

NOTE
The interface standard is Huawei-specific.

3.4.17.3 40Gbps(4*10.3)-CFP-SMF-1271~1331nm-40km-commercial

Table 3-562 40Gbps(4*10.3)-CFP-SMF-1271~1331nm-40km-commercial
specifications
Item Value

Basic Information

Module name 40Gbps(4*10.3)-CFP-
SMF-1271~1331nm-40km-commercial

Part Number 02311BLM

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Hardware Guide 3 Hardware Description

Item Value

Model OSM040C01

Form factor CFP

Application standard IEEE 802.3bm, 40GBASE-ER4

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] -5°C to 70°C(23°F to 158°F)

DDM options CFP MSA

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 41.25 Gbit/s

Target transmission distance [km] 40 km

Transmitter Optical Characteristics

Center wavelength [nm] 1271 nm
1291 nm
1311 nm
1331 nm

Tx operating wavelength range [nm] 1264.5 nm - 1277.5 nm
1284.5 nm - 1297.5 nm
1304.5 nm - 1317.5 nm
1324.5 nm - 1337.5 nm

Maximum Tx optical power (AVG) -
[dBm]

Maximum Tx optical power (OMA) per lane: 5 dBm
[dBm]

Minimum Tx optical power (AVG) -
[dBm]

Minimum Tx optical power (OMA) per lane: 0.3 dBm
[dBm]

Minimum extinction ratio [dB] 5.5 dB

Receiver Optical Characteristics

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Item Value

Rx operating wavelength range [nm] 1264.5 nm - 1277.5 nm
1284.5 nm - 1297.5 nm
1304.5 nm - 1317.5 nm
1324.5 nm - 1337.5 nm

Rx sensitivity (AVG) [dBm] -

Rx sensitivity (OMA) [dBm] per lane: -19 dBm

Overload power (AVG) [dBm] per lane: -4 dBm

Overload power (OMA) [dBm] -

3.4.17.4 40Gbps(4*10.3)-CFP-SMF-1271~1331nm-10km-commercial

Table 3-563 40Gbps(4*10.3)-CFP-SMF-1271~1331nm-10km-commercial
specifications
Item Value

Basic Information

Module name 40Gbps(4*10.3)-CFP-
SMF-1271~1331nm-10km-commercial

Part Number S4017471

Model OSM010C02

Form factor CFP

Application standard IEEE 802.3ba, 40GBASE-LR4

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options CFP MSA

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 41.25 Gbit/s

Target transmission distance [km] 10 km

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Item Value

Transmitter Optical Characteristics

Center wavelength [nm] 1271 nm
1291 nm
1311 nm
1331 nm

Tx operating wavelength range [nm] 1264.5 nm - 1277.5 nm
1284.5 nm - 1297.5 nm
1304.5 nm - 1317.5 nm
1324.5 nm - 1337.5 nm

Maximum Tx optical power (AVG) per lane: 2.3 dBm
[dBm]

Maximum Tx optical power (OMA) per lane: 3.5 dBm
[dBm]

Minimum Tx optical power (AVG) per lane: -7 dBm
[dBm]

Minimum Tx optical power (OMA) per lane: -4 dBm
[dBm]

Minimum extinction ratio [dB] 3.5 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1264.5 nm - 1277.5 nm
1284.5 nm - 1297.5 nm
1304.5 nm - 1317.5 nm
1324.5 nm - 1337.5 nm

Rx sensitivity (AVG) [dBm] -

Rx sensitivity (OMA) [dBm] per lane: -11.5 dBm

Overload power (AVG) [dBm] per lane: 2.3 dBm

Overload power (OMA) [dBm] per lane: 2.3 dBm

NOTE
The optical power calculation is based on the OMA value. The optical power read by the
device is the average optical power, not the OMA optical power.

3.4.18 40Gbps QSFP+ Optical Module

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Hardware Guide 3 Hardware Description

3.4.18.1 40Gbps(4*10.3)-QSFP+-SMF-1271~1331nm-10km-commercial

Table 3-564 40Gbps(4*10.3)-QSFP+-SMF-1271~1331nm-10km-commercial
specifications

Item Value

Basic Information

Module name 40Gbps(4*10.3)-QSFP+-
SMF-1271~1331nm-10km-commercial

Part Number 02310WUT

Model OMXD30009

Form factor QSFP+

Application standard IEEE 802.3ba, 40GBASE-LR4

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8436

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 41.25 Gbit/s

Target transmission distance [km] 10 km

Transmitter Optical Characteristics

Center wavelength [nm] 1271 nm
1291 nm
1311 nm
1331 nm

Tx operating wavelength range [nm] 1264.5 nm - 1277.5 nm
1284.5 nm - 1297.5 nm
1304.5 nm - 1317.5 nm
1324.5 nm - 1337.5 nm

Maximum Tx optical power (AVG) per lane: 2.3 dBm
[dBm]

Maximum Tx optical power (OMA) per lane: 3.5 dBm
[dBm]

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Item Value

Minimum Tx optical power (AVG) per lane: -7 dBm
[dBm]

Minimum Tx optical power (OMA) per lane: -4 dBm
[dBm]

Minimum extinction ratio [dB] 3.5 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1264.5 nm - 1277.5 nm
1284.5 nm - 1297.5 nm
1304.5 nm - 1317.5 nm
1324.5 nm - 1337.5 nm

Rx sensitivity (AVG) [dBm] -

Rx sensitivity (OMA) [dBm] per lane: -11.5 dBm

Overload power (AVG) [dBm] per lane: 2.3 dBm

Overload power (OMA) [dBm] -

NOTE
The optical power calculation is based on the OMA value.

3.4.18.2 40Gbps(4*10.3)-QSFP+-MMF-850nm-0.1km-commercial

Table 3-565 40Gbps(4*10.3)-QSFP+-MMF-850nm-0.1km-commercial
specifications

Item Value

Basic Information

Module name 40Gbps(4*10.3)-QSFP+-
MMF-850nm-0.1km-commercial

Part Number 02310WUU

Model OMXD30010

Form factor QSFP+

Application standard IEEE 802.3ba, 40GBASE-SR4

Connector type MPO-12

Optical fiber type MMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

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Item Value

DDM options SFF-8436

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 41.25 Gbit/s

Target transmission distance [km] 0.1 km(OM3)
0.15 km(OM4)

Transmitter Optical Characteristics

Center wavelength [nm] 850 nm

Tx operating wavelength range [nm] 840 nm - 860 nm

Maximum Tx optical power (AVG) per lane: 0.5 dBm
[dBm]

Maximum Tx optical power (OMA) per lane: 3 dBm
[dBm]

Minimum Tx optical power (AVG) per lane: -7.6 dBm
[dBm]

Minimum Tx optical power (OMA) per lane: -5.6 dBm
[dBm]

Minimum extinction ratio [dB] 3 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 840 nm - 860 nm

Rx sensitivity (AVG) [dBm] -

Rx sensitivity (OMA) [dBm] per lane: -9.5 dBm

Overload power (AVG) [dBm] per lane: 0.5 dBm

Overload power (OMA) [dBm] -

NOTE
The optical power calculation is based on the OMA value.

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Hardware Guide 3 Hardware Description

3.4.18.3 40Gbps(4*10.3)-QSFP+-SMF-1271~1331nm-40km-commercial

Table 3-566 40Gbps(4*10.3)-QSFP+-SMF-1271~1331nm-40km-commercial
specifications

Item Value

Basic Information

Module name 40Gbps(4*10.3)-QSFP+-
SMF-1271~1331nm-40km-commercial

Part Number 02311LVJ

Model OSM040N01

Form factor QSFP+

Application standard IEEE 802.3bm, 40GBASE-ER4

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8436

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 41.25 Gbit/s

Target transmission distance [km] 40 km

Transmitter Optical Characteristics

Center wavelength [nm] 1271 nm
1291 nm
1311 nm
1331 nm

Tx operating wavelength range [nm] 1264.5 nm - 1277.5 nm
1284.5 nm - 1297.5 nm
1304.5 nm - 1317.5 nm
1324.5 nm - 1337.5 nm

Maximum Tx optical power (AVG) per lane: 4.5 dBm
[dBm]

Maximum Tx optical power (OMA) per lane: 5 dBm
[dBm]

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Hardware Guide 3 Hardware Description

Item Value

Minimum Tx optical power (AVG) per lane: -2.7 dBm
[dBm]

Minimum Tx optical power (OMA) per lane: 0.3 dBm
[dBm]

Minimum extinction ratio [dB] 5.5 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1264.5 nm - 1277.5 nm
1284.5 nm - 1297.5 nm
1304.5 nm - 1317.5 nm
1324.5 nm - 1337.5 nm

Rx sensitivity (AVG) [dBm] -

Rx sensitivity (OMA) [dBm] per lane: -19 dBm

Overload power (AVG) [dBm] per lane: -4.5 dBm

Overload power (OMA) [dBm] -

NOTE
1. The optical power is subject to the OMA. The optical power of an optical module
displayed on a device is the average value, not the OMA optical power.
2. The 100GBASE-ER4 optical module has a maximum transmission distance of 40 km, with
a typical range between 10 km and 40 km. If the transmission distance is less than 10 km,
you can use the 100GBASE-LR4 optical module instead.
3. If the total receive optical power (P) is less than –4 dBm, use the 100GBASE-ER4 optical
module directly. If P is between –4 dBm and 1 dBm, add a 5 dB optical attenuator at the
receive end of the 100GBASE-ER4 optical module. If P is greater than –4 dBm, a 10 dB
optical attenuator needs to be added at the receive end of the 100GBASE-ER4.

3.4.18.4 40Gbps(4*10.3)-QSFP+-SMF-1310nm-10km-commercial

Table 3-567 40Gbps(4*10.3)-QSFP+-SMF-1310nm-10km-commercial
specifications
Item Value

Basic Information

Module name 40Gbps(4*10.3)-QSFP+-
SMF-1310nm-10km-commercial

Part Number 02311NUA

Model OSM010N11

Form factor QSFP+

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Hardware Guide 3 Hardware Description

Item Value

Application standard IEEE 802.3ba, 40GBASE-LR4

Connector type MPO-12

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8436

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 4x9.95328 Gbit/s
4x10.3125 Gbit/s

Target transmission distance [km] 10 km

Transmitter Optical Characteristics

Center wavelength [nm] 1310 nm

Tx operating wavelength range [nm] 1260 nm - 1355 nm

Maximum Tx optical power (AVG) per lane: 0.5 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) per lane: -8.2 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 3.5 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1260 nm - 1355 nm

Rx sensitivity (AVG) [dBm] -

Rx sensitivity (OMA) [dBm] per lane: -12.6 dBm

Overload power (AVG) [dBm] per lane: 0.5 dBm

Overload power (OMA) [dBm] -

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Hardware Guide 3 Hardware Description

3.4.19 100Gbps CFP Optical Module

3.4.19.1 100Gbps(4*25.7)-CFP-SMF-1295.56~1309.14nm-40km-commercial

Table 3-568 100Gbps(4*25.7)-CFP-SMF-1295.56~1309.14nm-40km-commercial
specifications

Item Value

Basic Information

Module name 100Gbps(4*25.7)-CFP-
SMF-1295.56~1309.14nm-40km-
commercial

Part Number 02310WUS

Model OSN040N02

Form factor CFP

Application standard IEEE 802.3ba, 100GBASE-ER4

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options CFP MSA

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 103.125 Gbit/s

Target transmission distance [km] 40 km

Transmitter Optical Characteristics

Center wavelength [nm] 1295.56 nm
1300.05 nm
1304.58 nm
1309.14 nm

Tx operating wavelength range [nm] 1294.53 nm - 1296.59 nm
1299.02 nm - 1301.09 nm
1303.54 nm - 1305.63 nm
1308.09 nm - 1310.19 nm

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Hardware Guide 3 Hardware Description

Item Value

Maximum Tx optical power (AVG) per lane: 2.9 dBm
[dBm]

Maximum Tx optical power (OMA) per lane: 4.5 dBm
[dBm]

Minimum Tx optical power (AVG) per lane: -2.9 dBm
[dBm]

Minimum Tx optical power (OMA) per lane: 0.1 dBm
[dBm]

Minimum extinction ratio [dB] 8 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1294.53 nm - 1296.59 nm
1299.02 nm - 1301.09 nm
1303.54 nm - 1305.63 nm
1308.09 nm - 1310.19 nm

Rx sensitivity (AVG) [dBm] -

Rx sensitivity (OMA) [dBm] per lane: -21.4 dBm

Overload power (AVG) [dBm] per lane: 4.5 dBm

Overload power (OMA) [dBm] -

NOTE
1. The optical power is subject to the OMA. The optical power of an optical module
displayed on a device is the average value, not the OMA optical power.
2. The 100GBASE-ER4 optical module has a maximum transmission distance of 40 km, with
a typical range between 10 km and 40 km. If the transmission distance is less than 10 km,
you can use the 100GBASE-LR4 optical module instead.
3. If the total receive optical power (P) is less than –4 dBm, use the 100GBASE-ER4 optical
module directly. If P is between –4 dBm and 1 dBm, add a 5 dB optical attenuator at the
receive end of the 100GBASE-ER4 optical module. If P is greater than –4 dBm, a 10 dB
optical attenuator needs to be added at the receive end of the 100GBASE-ER4.

3.4.19.2 100Gbps(4*25.7)-CFP-SMF-1295.56~1309.14nm-80km-commercial

Table 3-569 100Gbps(4*25.7)-CFP-SMF-1295.56~1309.14nm-80km-commercial
specifications

Item Value

Basic Information

Module name 100Gbps(4*25.7)-CFP-
SMF-1295.56~1309.14nm-80km-
commercial

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Hardware Guide 3 Hardware Description

Item Value

Part Number 02311JNT

Model OSN080N10

Form factor CFP

Application standard Huawei Define

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options CFP MSA

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1M

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 103.125 Gbit/s

Target transmission distance [km] 80 km

Transmitter Optical Characteristics

Center wavelength [nm] 1295.56 nm
1300.05 nm
1304.58 nm
1309.14 nm

Tx operating wavelength range [nm] 1294.53 nm - 1296.59 nm
1299.02 nm - 1301.09 nm
1303.54 nm - 1305.63 nm
1308.09 nm - 1310.19 nm

Maximum Tx optical power (AVG) per lane: 7 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) per lane: 2 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 8 dB

Receiver Optical Characteristics

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Item Value

Rx operating wavelength range [nm] 1294.53 nm - 1296.59 nm
1299.02 nm - 1301.09 nm
1303.54 nm - 1305.63 nm
1308.09 nm - 1310.19 nm

Rx sensitivity (AVG) [dBm] per lane: -30 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] per lane: -7 dBm

Overload power (OMA) [dBm] -

NOTE
1. The interface standard is Huawei-specific.
2. The optical power read by the device is the average optical power, not the OMA optical
power.
3. When the board is used for 80 km transmission, it must be interconnected with a Huawei
optical module of the same model.

3.4.19.3 100Gbps(4*25.7)-CFP-SMF-1295.56~1309.14nm-10km-commercial

Table 3-570 100Gbps(4*25.7)-CFP-SMF-1295.56~1309.14nm-10km-commercial
specifications
Item Value

Basic Information

Module name 100Gbps(4*25.7)-CFP-
SMF-1295.56~1309.14nm-10km-
commercial

Part Number S4017456

Model OSN010N04

Form factor CFP

Application standard IEEE 802.3ba, 100GBASE-LR4

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options CFP MSA

Environment standard RoHS

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Hardware Guide 3 Hardware Description

Item Value

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 103.125 Gbit/s

Target transmission distance [km] 10 km

Transmitter Optical Characteristics

Center wavelength [nm] 1295.56 nm
1300.05 nm
1304.58 nm
1309.14 nm

Tx operating wavelength range [nm] 1294.53 nm - 1296.59 nm
1299.02 nm - 1301.09 nm
1303.54 nm - 1305.63 nm
1308.09 nm - 1310.19 nm

Maximum Tx optical power (AVG) -
[dBm]

Maximum Tx optical power (OMA) per lane: 4.5 dBm
[dBm]

Minimum Tx optical power (AVG) -
[dBm]

Minimum Tx optical power (OMA) per lane: -4.3 dBm
[dBm]

Minimum extinction ratio [dB] 4 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1294.53 nm - 1296.59 nm
1299.02 nm - 1301.09 nm
1303.54 nm - 1305.63 nm
1308.09 nm - 1310.19 nm

Rx sensitivity (AVG) [dBm] -

Rx sensitivity (OMA) [dBm] per lane: -8.6 dBm

Overload power (AVG) [dBm] per lane: 4.5 dBm

Overload power (OMA) [dBm] per lane: 4.5 dBm

NOTE
The optical power calculation is based on the OMA value.

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Hardware Guide 3 Hardware Description

3.4.19.4 100Gbps(10*10.3)-CFP-MMF-850nm-0.1km-commercial

Table 3-571 100Gbps(10*10.3)-CFP-MMF-850nm-0.1km-commercial specifications
Item Value

Basic Information

Module name 100Gbps(10*10.3)-CFP-
MMF-850nm-0.1km-commercial

Part Number S4017457

Model OSN010003

Form factor CFP

Application standard IEEE 802.3ba, 100GBASE-SR10

Connector type MPO-24

Optical fiber type MMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options CFP MSA

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 103.125 Gbit/s

Target transmission distance [km] 0.1 km(OM3)
0.15 km(OM4)

Transmitter Optical Characteristics

Center wavelength [nm] 850 nm

Tx operating wavelength range [nm] 840 nm - 860 nm

Maximum Tx optical power (AVG) -
[dBm]

Maximum Tx optical power (OMA) per lane: -1 dBm
[dBm]

Minimum Tx optical power (AVG) -
[dBm]

Minimum Tx optical power (OMA) per lane: -7.6 dBm
[dBm]

Minimum extinction ratio [dB] 3 dB

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Item Value

Receiver Optical Characteristics

Rx operating wavelength range [nm] 840 nm - 860 nm

Rx sensitivity (AVG) [dBm] -

Rx sensitivity (OMA) [dBm] per lane: -5.4 dBm

Overload power (AVG) [dBm] per lane: 2.4 dBm

Overload power (OMA) [dBm] per lane: 2.4 dBm

NOTE
Querying the send and receive optical power is not supported.

3.4.20 100Gbps CXP Optical Module

3.4.20.1 100Gbps(10*10.3)-CXP-MMF-850nm-0.1km-commercial

Table 3-572 100Gbps(10*10.3)-CXP-MMF-850nm-0.1km-commercial specifications

Item Value

Basic Information

Module name 100Gbps(10*10.3)-CXP-
MMF-850nm-0.1km-commercial

Part Number 02310UWB

Model OMND10N10

Form factor CXP

Application standard IEEE 802.3ba, 100GBASE-SR10

Connector type MPO-24

Optical fiber type MMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options CXP Specification

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 10*10.3125 Gbit/s

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Item Value

Target transmission distance [km] 0.1 km(OM3)
0.15 km(OM4)

Transmitter Optical Characteristics

Center wavelength [nm] 850 nm

Tx operating wavelength range [nm] 840 nm - 860 nm

Maximum Tx optical power (AVG) per lane: 2.4 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) per lane: -7.6 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 3 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 840 nm - 860 nm

Rx sensitivity (AVG) [dBm] per lane: -7.6 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] -

Overload power (OMA) [dBm] -

3.4.21 100Gbps CFP2 ETH&OTN Optical Module

3.4.21.1 100Gbps(4*25.7/4*27.9)-CFP2-SMF-1295.56~1309.14nm-10km-
commercial

Table 3-573 100Gbps(4*25.7/4*27.9)-CFP2-SMF-1295.56~1309.14nm-10km-
commercial specifications

Item Value

Basic Information

Module name 100Gbps(4*25.7/4*27.9)-CFP2-
SMF-1295.56~1309.14nm-10km-
commercial

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Hardware Guide 3 Hardware Description

Item Value

Part Number 02311CSQ

Model OSN010N10

Form factor CFP2

Application standard IEEE 802.3ba, 100GBASE-LR4, ITU-T
G.959/ ITU-T G.709

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options CFP MSA

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 103.125 Gbit/s
111.81 Gbit/s

Target transmission distance [km] 10 km

Transmitter Optical Characteristics

Center wavelength [nm] 1295.56 nm
1300.05 nm
1304.58 nm
1309.14 nm

Tx operating wavelength range [nm] 1294.53 nm - 1296.59 nm
1299.02 nm - 1301.09 nm
1303.54 nm - 1305.63 nm
1308.09 nm - 1310.19 nm

Maximum Tx optical power (AVG) per lane:4.5 dBm(Ethernet)
[dBm] per lane:4 dBm | 2.9 dBm(OTN)

Maximum Tx optical power (OMA) per lane: 4.5 dBm(Ethernet)
[dBm]

Minimum Tx optical power (AVG) per lane: -4.3 dBm(Ethernet)
[dBm] per lane: -0.6 dBm | -2.5 dBm(OTN)

Minimum Tx optical power (OMA) per lane: -1.3 dBm(Ethernet)
[dBm]

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Item Value

Minimum extinction ratio [dB] per lane: 4 dB(Ethernet)
per lane: 4 dB | 7 dB(OTN)

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1294.53 nm - 1296.59 nm
1299.02 nm - 1301.09 nm
1303.54 nm - 1305.63 nm
1308.09 nm - 1310.19 nm

Rx sensitivity (AVG) [dBm] per lane: -8.4 dBm | -10.3 dBm(OTN)

Rx sensitivity (OMA) [dBm] per lane: -8.6 dBm(Ethernet)

Overload power (AVG) [dBm] -

Overload power (OMA) [dBm] per lane: 4.5 dBm(OMA, Ethernet)
4 dBm | 2.9 dBm(OMA,OTN)

NOTE
The optical power calculation is based on the OMA value. The optical power read by the
device is the average optical power, not the OMA optical power.

3.4.22 100Gbps CFP2 Optical Module

3.4.22.1 100Gbps(4*25.7)-CFP2-SMF-1295.56~1309.14nm-10km-commercial

Table 3-574 100Gbps(4*25.7)-CFP2-SMF-1295.56~1309.14nm-10km-commercial
specifications

Item Value

Basic Information

Module name 100Gbps(4*25.7)-CFP2-
SMF-1295.56~1309.14nm-10km-
commercial

Part Number 02310WUR

Model OSN010N09

Form factor CFP2

Application standard IEEE 802.3ba, 100GBASE-LR4

Connector type LC

Optical fiber type SMF

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Item Value

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options CFP MSA

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 103.125 Gbit/s

Target transmission distance [km] 10 km

Transmitter Optical Characteristics

Center wavelength [nm] 1295.56 nm
1300.05 nm
1304.58 nm
1309.14 nm

Tx operating wavelength range [nm] 1294.53 nm - 1296.59 nm
1299.02 nm - 1301.09 nm
1303.54 nm - 1305.63 nm
1308.09 nm - 1310.19 nm

Maximum Tx optical power (AVG) per lane: 4.5 dBm
[dBm]

Maximum Tx optical power (OMA) per lane: 4.5 dBm
[dBm]

Minimum Tx optical power (AVG) per lane: -4.3 dBm
[dBm]

Minimum Tx optical power (OMA) per lane: -1.3 dBm
[dBm]

Minimum extinction ratio [dB] 4 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1294.53 nm - 1296.59 nm
1299.02 nm - 1301.09 nm
1303.54 nm - 1305.63 nm
1308.09 nm - 1310.19 nm

Rx sensitivity (AVG) [dBm] -

Rx sensitivity (OMA) [dBm] per lane: -10.6 dBm

Overload power (AVG) [dBm] per lane: 4.5 dBm

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Hardware Guide 3 Hardware Description

Item Value

Overload power (OMA) [dBm] -

NOTE
The optical power calculation is based on the OMA value. The optical power read by the
device is the average optical power, not the OMA optical power.

3.4.22.2 100Gbps(4*25.7)-CFP2-SMF-1295.56~1309.14nm-40km-commercial

Table 3-575 100Gbps(4*25.7)-CFP2-SMF-1295.56~1309.14nm-40km-commercial
specifications

Item Value

Basic Information

Module name 100Gbps(4*25.7)-CFP2-
SMF-1295.56~1309.14nm-40km-
commercial

Part Number 02311FAP

Model OSN040N03

Form factor CFP2

Application standard IEEE 802.3ba, 100GBASE-ER4

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options CFP MSA

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 103.125 Gbit/s

Target transmission distance [km] 40 km

Transmitter Optical Characteristics

Center wavelength [nm] 1295.56 nm
1300.05 nm
1304.58 nm
1309.14 nm

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Item Value

Tx operating wavelength range [nm] 1294.53 nm - 1296.59 nm
1299.02 nm - 1301.09 nm
1303.54 nm - 1305.63 nm
1308.09 nm - 1310.19 nm

Maximum Tx optical power (AVG) per lane: 2.9 dBm
[dBm]

Maximum Tx optical power (OMA) per lane: 4.5 dBm
[dBm]

Minimum Tx optical power (AVG) per lane: -2.9 dBm
[dBm]

Minimum Tx optical power (OMA) per lane: 0.1 dBm
[dBm]

Minimum extinction ratio [dB] 8 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1294.53 nm - 1296.59 nm
1299.02 nm - 1301.09 nm
1303.54 nm - 1305.63 nm
1308.09 nm - 1310.19 nm

Rx sensitivity (AVG) [dBm] -

Rx sensitivity (OMA) [dBm] per lane: -21.4 dBm

Overload power (AVG) [dBm] per lane: 4.5 dBm

Overload power (OMA) [dBm] -

NOTE
The optical power calculation is based on the OMA value. The optical power read by the
device is the average optical power, not the OMA optical power.

3.4.22.3 100Gbps(10*10.3)-CFP2-MMF-850nm-0.1km-commercial

Table 3-576 100Gbps(10*10.3)-CFP2-MMF-850nm-0.1km-commercial
specifications

Item Value

Basic Information

Module name 100Gbps(10*10.3)-CFP2-
MMF-850nm-0.1km-commercial

Part Number 02311LYG

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Hardware Guide 3 Hardware Description

Item Value

Model OMND10N12

Form factor CFP2

Application standard IEEE 802.3ba, 100GBASE-SR10

Connector type MPO-24

Optical fiber type MMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options CFP MSA

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 103.125 Gbit/s

Target transmission distance [km] 0.1 km(OM3)
0.15 km(OM4)

Transmitter Optical Characteristics

Center wavelength [nm] 850 nm

Tx operating wavelength range [nm] 840 nm - 860 nm

Maximum Tx optical power (AVG) -
[dBm]

Maximum Tx optical power (OMA) per lane: 1 dBm
[dBm]

Minimum Tx optical power (AVG) -
[dBm]

Minimum Tx optical power (OMA) per lane: -7.6 dBm
[dBm]

Minimum extinction ratio [dB] 3 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 840 nm - 860 nm

Rx sensitivity (AVG) [dBm] -

Rx sensitivity (OMA) [dBm] per lane: -9.5 dBm

Overload power (AVG) [dBm] per lane: 2.4 dBm

Overload power (OMA) [dBm] -

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Hardware Guide 3 Hardware Description

3.4.23 100Gbps CFP4 Optical Module

3.4.23.1 100Gbps(4*25.7)-CFP4-SMF-1295.56~1309.14nm-10km-commercial

Table 3-577 100Gbps(4*25.7)-CFP4-SMF-1295.56~1309.14nm-10km-commercial
specifications
Item Value

Basic Information

Module name 100Gbps(4*25.7)-CFP4-
SMF-1295.56~1309.14nm-10km-
commercial

Part Number 02311NTW

Model OSN010N12

Form factor CFP4

Application standard IEEE 802.3ba, 100GBASE-LR4

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options CFP MSA

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 103.125 Gbit/s

Target transmission distance [km] 10 km

Transmitter Optical Characteristics

Center wavelength [nm] 1295.56 nm
1300.05 nm
1304.58 nm
1309.14 nm

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Hardware Guide 3 Hardware Description

Item Value

Tx operating wavelength range [nm] 1294.53 nm - 1296.59 nm
1299.02 nm - 1301.09 nm
1303.54 nm - 1305.63 nm
1308.09 nm - 1310.19 nm

Maximum Tx optical power (AVG) -
[dBm]

Maximum Tx optical power (OMA) per lane: 4.5 dBm
[dBm]

Minimum Tx optical power (AVG) -
[dBm]

Minimum Tx optical power (OMA) per lane: -1.3 dBm
[dBm]

Minimum extinction ratio [dB] 4 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1294.53 nm - 1296.59 nm
1299.02 nm - 1301.09 nm
1303.54 nm - 1305.63 nm
1308.09 nm - 1310.19 nm

Rx sensitivity (AVG) [dBm] -

Rx sensitivity (OMA) [dBm] per lane: -8.6 dBm

Overload power (AVG) [dBm] per lane: 5.5 dBm

Overload power (OMA) [dBm] -

3.4.24 100Gbps CFP4 ETH&OTN Optical Module

3.4.24.1 100Gbps(4*25.7/4*27.9)-CFP4-SMF-1295.56~1309.14nm-10km-
commercial

Table 3-578 100Gbps(4*25.7/4*27.9)-CFP4-SMF-1295.56~1309.14nm-10km-
commercial specifications
Item Value

Basic Information

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Hardware Guide 3 Hardware Description

Item Value

Module name 100Gbps(4*25.7/4*27.9)-CFP4-
SMF-1295.56~1309.14nm-10km-
commercial

Part Number 02311QDF

Model OSN010N17

Form factor CFP4

Application standard IEEE 802.3ba, 100GBASE-LR4, ITU-T
G.959

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options CFP MSA

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 103.125 Gbit/s
111.81 Gbit/s

Target transmission distance [km] 10 km

Transmitter Optical Characteristics

Center wavelength [nm] 1295.56 nm
1300.05 nm
1304.58 nm
1309.14 nm

Tx operating wavelength range [nm] 1294.53 nm - 1296.59 nm
1299.02 nm - 1301.09 nm
1303.54 nm - 1305.63 nm
1308.09 nm - 1310.19 nm

Maximum Tx optical power (AVG) per lane:4.5 dBm(Ethernet)
[dBm] per lane:4 dBm | 2.9 dBm(OTN)

Maximum Tx optical power (OMA) per lane: 4.5 dBm(Ethernet)
[dBm]

Minimum Tx optical power (AVG) per lane: -4.3 dBm(Ethernet)
[dBm] per lane: -0.6 dBm | -2.5 dBm(OTN)

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Item Value

Minimum Tx optical power (OMA) per lane: -1.3 dBm(Ethernet)
[dBm]

Minimum extinction ratio [dB] 4 dB(Ethernet)
4 dB | 7 dB(OTN)

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1294.53 nm - 1296.59 nm
1299.02 nm - 1301.09 nm
1303.54 nm - 1305.63 nm
1308.09 nm - 1310.19 nm

Rx sensitivity (AVG) [dBm] -

Rx sensitivity (OMA) [dBm] per lane: -8.6 dBm(Ethernet)
per lane: -8.4 dBm| -10.3 dBm(OTN)

Overload power (AVG) [dBm] -

Overload power (OMA) [dBm] per lane: 4 dBm(OMA, Ethernet)
per lane: 4 dBm | 2.9 dBm(OMA,OTN)

NOTE
The optical power calculation is based on the OMA value. The optical power read by the
device is the average optical power, not the OMA optical power.

3.4.25 100Gbps QSFP28 Optical Module

3.4.25.1 100Gbps(4*25.7)-QSFP28-MMF-850nm-0.1km-commercial

Table 3-579 100Gbps(4*25.7)-QSFP28-MMF-850nm-0.1km-commercial
specifications

Item Value

Basic Information

Module name 100Gbps(4*25.7)-QSFP28-
MMF-850nm-0.1km-commercial

Part Number 02311NTY

Model OMND10N13

Form factor QSFP28

Application standard IEEE 802.3bm, 100GBASE-SR4

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Item Value

Connector type MPO-12

Optical fiber type MMF

Bit error ratio (BER) <5x10E-5

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8636

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 103.125 Gbit/s

Target transmission distance [km] 0.07 km(OM3)
0.1 km(OM4)

Transmitter Optical Characteristics

Center wavelength [nm] 850 nm

Tx operating wavelength range [nm] 840 nm - 860 nm

Maximum Tx optical power (AVG) per lane: 2.4 dBm
[dBm]

Maximum Tx optical power (OMA) per lane: 3 dBm
[dBm]

Minimum Tx optical power (AVG) per lane: -8.4 dBm
[dBm]

Minimum Tx optical power (OMA) per lane: -6.4 dBm
[dBm]

Minimum extinction ratio [dB] 2 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 840 nm - 860 nm

Rx sensitivity (AVG) [dBm] -

Rx sensitivity (OMA) [dBm] per lane: -10.3 dBm

Overload power (AVG) [dBm] per lane: 2.4 dBm

Overload power (OMA) [dBm] -

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Item Value

NOTE
1. If the module needs to reach the nominal data, the board FEC function must be enabled.
2. The BER 5x10E - 5 is the data that is not enabled by FEC, so that 1x10E - 12 can be
reached after FEC .
3. The optical power calculation is based on the OMA value. The optical power read by the
device is the average optical power, not the OMA optical power.

3.4.25.2 100Gbps(4*25.7)-QSFP28-SMF-1271~1331nm-2km-commercial

Table 3-580 100Gbps(4*25.7)-QSFP28-SMF-1271~1331nm-2km-commercial
specifications

Item Value

Basic Information

Module name 100Gbps(4*25.7)-QSFP28-
SMF-1271~1331nm-2km-commercial

Part Number 02311QDH

Model OSN020N15

Form factor QSFP28

Application standard 100G CWDM4 MSA

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <5x10E-5

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8636

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 103.125 Gbit/s

Target transmission distance [km] 2 km

Transmitter Optical Characteristics

Center wavelength [nm] 1271 nm
1291 nm
1311 nm
1331 nm

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Item Value

Tx operating wavelength range [nm] 1264.5 nm - 1277.5 nm
1284.5 nm - 1297.5 nm
1304.5 nm - 1317.5 nm
1324.5 nm - 1337.5 nm

Maximum Tx optical power (AVG) per lane: 2.5 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) per lane: -6.5 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 3.5 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1264.5 nm - 1277.5 nm
1284.5 nm - 1297.5 nm
1304.5 nm - 1317.5 nm
1324.5 nm - 1337.5 nm

Rx sensitivity (AVG) [dBm] -

Rx sensitivity (OMA) [dBm] per lane: -10 dBm

Overload power (AVG) [dBm] per lane: 2.5 dBm

Overload power (OMA) [dBm] -

NOTE
1. If the module needs to reach the nominal data, the board FEC function must be enabled.
2. The BER 5x10E - 5 is the data that is not enabled by FEC, so that 1x10E - 12 can be
reached after FEC .

3.4.25.3 100Gbps(4*25.7)-QSFP28-SMF-1310nm-30km(NO FEC)-40km(FEC)-
commercial

Table 3-581 100Gbps(4*25.7)-QSFP28-SMF-1310nm-30km(NO FEC)-40km(FEC)-
commercial specifications
Item Value

Basic Information

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Item Value

Module name 100Gbps(4*25.7)-QSFP28-
SMF-1310nm-30km(NO
FEC)-40km(FEC)-commercial

Part Number 02312AUE

Model OSN030N05

Form factor QSFP28

Application standard IEEE 802.3ba, 100GBASE-ER4

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <5x10E-5

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8636

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 103.125 Gbit/s

Target transmission distance [km] 40 km(FEC)
30 km(NO FEC)

Transmitter Optical Characteristics

Center wavelength [nm] 1295.56 nm
1300.05 nm
1304.58 nm
1309.14 nm

Tx operating wavelength range [nm] 1294.53 nm - 1296.59 nm
1299.02 nm - 1301.09 nm
1303.54 nm - 1305.63 nm
1308.09 nm - 1310.19 nm

Maximum Tx optical power (AVG) per lane: 2.9 dBm
[dBm]

Maximum Tx optical power (OMA) per lane: 4.5 dBm
[dBm]

Minimum Tx optical power (AVG) per lane: -2.5 dBm
[dBm]

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Item Value

Minimum Tx optical power (OMA) per lane: 0.1 dBm
[dBm]

Minimum extinction ratio [dB] 8 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1294.53 nm - 1296.59 nm
1299.02 nm - 1301.09 nm
1303.54 nm - 1305.63 nm
1308.09 nm - 1310.19 nm

Rx sensitivity (AVG) [dBm] -

Rx sensitivity (OMA) [dBm] per lane: -21.4 dBm

Overload power (AVG) [dBm] per lane: -3.5 dBm

Overload power (OMA) [dBm] -

NOTE
1. If the module needs to reach 40 km, the board FEC function must be enabled. Otherwise,
it can reach only 30 km.
2. The BER 5x10E - 5 is the data obtained with FEC not enabled. After FEC is enabled, 1x10E
- 12 can be reached.
3. In 30 km application, the BER can reach 1x10E - 12.
4. The optical power calculation is based on the OMA value. The optical power read by the
device is the average value, not the OMA optical power.

3.4.25.4 100Gbps(4*25.7)-QSFP28-SMF-1295.56~1309.14nm-10km-
commercial

Table 3-582 100Gbps(4*25.7)-QSFP28-SMF-1295.56~1309.14nm-10km-
commercial specifications

Item Value

Basic Information

Module name 100Gbps(4*25.7)-QSFP28-
SMF-1295.56~1309.14nm-10km-
commercial

Part Number 02312BSS

Model OSN010N24

Form factor QSFP28

Application standard IEEE 802.3ba, 100GBASE-LR4

Connector type LC

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Item Value

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8636

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 500 V

Transmission rate [bit/s] 103.125 Gbit/s

Target transmission distance [km] 10 km

Transmitter Optical Characteristics

Center wavelength [nm] 1295.56 nm
1300.05 nm
1304.58 nm
1309.14 nm

Tx operating wavelength range [nm] 1294.53 nm - 1296.59 nm
1299.02 nm - 1301.09 nm
1303.54 nm - 1305.63 nm
1308.09 nm - 1310.19 nm

Maximum Tx optical power (AVG) per lane: 4.5 dBm
[dBm]

Maximum Tx optical power (OMA) per lane: 4.5 dBm
[dBm]

Minimum Tx optical power (AVG) per lane: -4.3 dBm
[dBm]

Minimum Tx optical power (OMA) per lane: -1.3 dBm
[dBm]

Minimum extinction ratio [dB] 4 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1294.53 nm - 1296.59 nm
1299.02 nm - 1301.09 nm
1303.54 nm - 1305.63 nm
1308.09 nm - 1310.19 nm

Rx sensitivity (AVG) [dBm] -

Rx sensitivity (OMA) [dBm] per lane: -8.6 dBm

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Item Value

Overload power (AVG) [dBm] per lane: 4.5 dBm

Overload power (OMA) [dBm] -

NOTE
The optical power calculation is based on the OMA value. The optical power read by the
device is the average optical power, not the OMA optical power.

3.4.25.5 100Gbps(4*25.7)-QSFP28-SMF-1295.56~1309.14nm-80km-
commercial

Table 3-583 100Gbps(4*25.7)-QSFP28-SMF-1295.56~1309.14nm-80km-
commercial specifications
Item Value

Basic Information

Module name 100Gbps(4*25.7)-QSFP28-
SMF-1295.56~1309.14nm-80km-
commercial

Part Number 02312NCX

Model QSFP28-100G-1310-80km-SM

Form factor QSFP28

Application standard Huawei Define

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8636

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 1000 V

Transmission rate [bit/s] 103.125 Gbit/s

Target transmission distance [km] 80 km

Transmitter Optical Characteristics

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Item Value

Center wavelength [nm] 1295.56 nm
1300.05 nm
1304.58 nm
1309.14 nm

Tx operating wavelength range [nm] 1294.53 nm - 1296.59 nm
1299.02 nm - 1301.09 nm
1303.54 nm - 1305.63 nm
1308.09 nm - 1310.19 nm

Maximum Tx optical power (AVG) per lane: 6.5 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) per lane: 2 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] 6 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1294.53 nm - 1296.59 nm
1299.02 nm - 1301.09 nm
1303.54 nm - 1305.63 nm
1308.09 nm - 1310.19 nm

Rx sensitivity (AVG) [dBm] per lane: -28 dBm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] per lane: -3.5 dBm

Overload power (OMA) [dBm] -

NOTE
1. To achieve the nominal value, the FEC function must be enabled on the board and G.652
fibers must be used.
2. The BER 5x10E-5 is the data when FEC is disabled. After FEC is enabled, the BER can
reach 1x10E-12.
3. When the optical module is used for 80 km transmission, it must be interconnected with
Huawei optical modules of the same model.

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3.4.25.6 100Gbps(4*25.7)-QSFP28-SMF-1295.56~1309.14nm-40km-
commercial

Table 3-584 100Gbps(4*25.7)-QSFP28-SMF-1295.56~1309.14nm-40km-
commercial specifications
Item Value

Basic Information

Module name 100Gbps(4*25.7)-QSFP28-
SMF-1295.56~1309.14nm-40km-
commercial

Part Number 02312NVQ

Model QSFP28-100G-1310-40km-SM

Form factor QSFP28

Application standard IEEE 802.3 100GBASE-ER4

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8636

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 1000 V

Transmission rate [bit/s] 103.125 Gbit/s

Target transmission distance [km] 40 km

Transmitter Optical Characteristics

Center wavelength [nm] 1295.56 nm
1300.05 nm
1304.58 nm
1309.14 nm

Tx operating wavelength range [nm] 1294.53 nm - 1296.59 nm
1299.02 nm - 1301.09 nm
1303.54 nm - 1305.63 nm
1308.09 nm - 1310.19 nm

Maximum Tx optical power (AVG) per lane: 2.9 dBm
[dBm]

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Item Value

Maximum Tx optical power (OMA) per lane: 4.5 dBm
[dBm]

Minimum Tx optical power (AVG) per lane: -2.9 dBm
[dBm]

Minimum Tx optical power (OMA) per lane: 0.1 dBm
[dBm]

Minimum extinction ratio [dB] 8 dB

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1294.53 nm - 1296.59 nm
1299.02 nm - 1301.09 nm
1303.54 nm - 1305.63 nm
1308.09 nm - 1310.19 nm

Rx sensitivity (AVG) [dBm] per lane: -20.9 dBm

Rx sensitivity (OMA) [dBm] per lane: -21.4 dBm

Overload power (AVG) [dBm] per lane: -3.5 dBm

Overload power (OMA) [dBm] -

NOTE
When an optical module is installed on an interface, the FEC function on the interface is
disabled by default. Pay attention to the FEC status of the peer interface during
interconnection.

3.4.26 100G QSFP28 ETH&OTN Optical Module

3.4.26.1 100Gbps(103.125&111.81Gb/s)-QSFP28-SMF-1295~1310nm-10km-
commercial

Table 3-585 100Gbps(103.125&111.81Gb/s)-QSFP28-SMF-1295~1310nm-10km-
commercial specifications

Item Value

Basic Information

Module name 100Gbps(103.125&111.81Gb/s)-
QSFP28-SMF-1295~1310nm-10km-
commercial

Part Number 02312GRB

Model OSN010N18

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Item Value

Form factor QSFP28

Application standard IEEE 802.3ba, 100GBASE-LR4, OTU4
4I1-9D1F, ITU-T G.959

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options SFF-8636

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 1000 V

Transmission rate [bit/s] 103.125 Gbit/s
111.81 Gbit/s

Target transmission distance [km] 10 km

Transmitter Optical Characteristics

Center wavelength [nm] 1295.56 nm
1300.05 nm
1304.58 nm
1309.14 nm

Tx operating wavelength range [nm] 1294.53 nm - 1296.59 nm
1299.02 nm - 1301.09 nm
1303.54 nm - 1305.63 nm
1308.09 nm - 1310.19 nm

Maximum Tx optical power (AVG) per lane: 4.5 dBm(Ethernet)
[dBm] per lane: 4 dBm(OTN)

Maximum Tx optical power (OMA) per lane: 4.5 dBm(Ethernet)
[dBm]

Minimum Tx optical power (AVG) per lane: -4.3 dBm(Ethernet)
[dBm] per lane: -0.6 dBm(OTN)

Minimum Tx optical power (OMA) per lane: -1.3 dBm(Ethernet)
[dBm]

Minimum extinction ratio [dB] 4 dB(Ethernet)
4 dB | 6.5(OTN)

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Item Value

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1294.53 nm - 1296.59 nm
1299.02 nm - 1301.09 nm
1303.54 nm - 1305.63 nm
1308.09 nm - 1310.19 nm

Rx sensitivity (AVG) [dBm] -

Rx sensitivity (OMA) [dBm] per lane: -8.6 dBm(Ethernet)
per lane: -8.4 dBm(OTN)

Overload power (AVG) [dBm] per lane: 4 dBm(OTN)

Overload power (OMA) [dBm] per lane: 4.5 dBm(OMA, Ethernet)

NOTE
The optical power calculation is based on the OMA value. The optical power read by the
device is the average optical power, not the OMA optical power.

3.4.27 400Gbps QSFP-DD Optical Module

3.4.27.1 400Gbps(8*56Gb/s PAM4)-QSFP-DD-SMF-1310nm-10km-commercial

Table 3-586 400Gbps(8*56Gb/s PAM4)-QSFP-DD-SMF-1310nm-10km-commercial
specifications

Item Value

Basic Information

Module name 400Gbps(8*56Gb/s PAM4)-QSFP-DD-
SMF-1310nm-10km-commercial

Part Number 02312HCM

Model OSK010N02

Form factor QSFP-DD

Application standard IEEE802.3 bs-2017

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12(after FEC)
<2.4E-4(before FEC)

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

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Item Value

DDM options QSFP-DD MSA

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 1000 V

Transmission rate [bit/s] 425 Gbit/s

Target transmission distance [km] 10 km

Transmitter Optical Characteristics

Center wavelength [nm] 1273.54 nm
1277.89 nm
1282.26 nm
1286.66 nm
1295.56 nm
1300.05 nm
1304.58 nm
1309.14 nm

Tx operating wavelength range [nm] 1272.55 nm ~ 1274.54 nm
1276.89 nm ~ 1278.89 nm
1281.25 nm ~ 1283.27 nm
1285.65 nm ~ 1287.68 nm
1294.53 nm ~ 1296.59 nm
1299.02 nm ~ 1301.09 nm
1303.54 nm ~ 1305.63 nm
1308.09 nm ~ 1310.19 nm

Maximum Tx optical power (AVG) 5.3 dBm
[dBm]

Maximum Tx optical power (OMA) 5.7 dBm
[dBm]

Minimum Tx optical power (AVG) -2.8 dBm
[dBm]

Minimum Tx optical power (OMA) 0.2 dBm
[dBm]

Minimum extinction ratio [dB] 3.5 dB

Modulation mode -

Receiver Optical Characteristics

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Item Value

Rx operating wavelength range [nm] 1272.55 nm ~ 1274.54 nm
1276.89 nm ~ 1278.89 nm
1281.25 nm ~ 1283.27 nm
1285.65 nm ~ 1287.68 nm
1294.53 nm ~ 1296.59 nm
1299.02 nm ~ 1301.09 nm
1303.54 nm ~ 1305.63 nm
1308.09 nm ~ 1310.19 nm

Rx sensitivity (AVG) [dBm] -10.1 dBm

Rx sensitivity (OMA) [dBm] -7.1 dBm

Overload power (AVG) [dBm] 5.3 dBm

Overload power (OMA) [dBm] -

NOTE
When this type of optical module is used to interconnect with WDM equipment, the
protection switching time of WDM client-side 1+1 protection is greater than 50 ms.

3.4.27.2 400Gbps(8*56Gb/s PAM4)-QSFP-DD-SMF-1310nm-40km-commercial

Table 3-587 400Gbps(8*56Gb/s PAM4)-QSFP-DD-SMF-1310nm-40km-commercial
specifications

Item Value

Basic Information

Module name 400Gbps(8*56Gb/s PAM4)-QSFP-DD-
SMF-1310nm-40km-commercial

Part Number 02312YQG

Model OSK040N02

Form factor QSFP-DD

Application standard IEEE802.3 bs-2017

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-12(after FEC)
<2.4E-4(before FEC)

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options QSFP-DD MSA

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Item Value

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 1000 V

Transmission rate [bit/s] 425 Gbit/s

Target transmission distance [km] 40 km

Transmitter Optical Characteristics

Center wavelength [nm] 1273.54 nm
1277.89 nm
1282.26 nm
1286.66 nm
1295.56 nm
1300.05 nm
1304.58 nm
1309.14 nm

Tx operating wavelength range [nm] 1272.55 nm ~ 1274.54 nm
1276.89 nm ~ 1278.89 nm
1281.25 nm ~ 1283.27 nm
1285.65 nm ~ 1287.68 nm
1294.53 nm ~ 1296.59 nm
1299.02 nm ~ 1301.09 nm
1303.54 nm ~ 1305.63 nm
1308.09 nm ~ 1310.19 nm

Maximum Tx optical power (AVG) 5.6 dBm
[dBm]

Maximum Tx optical power (OMA) 6.4 dBm
[dBm]

Minimum Tx optical power (AVG) -0.6 dBm
[dBm]

Minimum Tx optical power (OMA) 2.4 dBm
[dBm]

Minimum extinction ratio [dB] 6 dB

Modulation mode -

Receiver Optical Characteristics

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Item Value

Rx operating wavelength range [nm] 1272.55 nm ~ 1274.54 nm
1276.89 nm ~ 1278.89 nm
1281.25 nm ~ 1283.27 nm
1285.65 nm ~ 1287.68 nm
1294.53 nm ~ 1296.59 nm
1299.02 nm ~ 1301.09 nm
1303.54 nm ~ 1305.63 nm
1308.09 nm ~ 1310.19 nm

Minimum Rx optical power (AVG) -18.6 dBm
[dBm]

Maximum Rx optical power (AVG) -4.4 dBm
[dBm]

Maximum Rx optical power (OMA) -3.6 dBm
[dBm]

Rx sensitivity (AVG) [dBm] -18.6 dBm

Rx sensitivity (OMA) [dBm] -16.1 dBm

Overload power (AVG) [dBm] -4.4 dBm

Overload power (OMA) [dBm] -

NOTE
When the board is used for 40 km transmission, it must be interconnected with a Huawei
optical module of the same model.
When this type of optical module is used to interconnect with WDM equipment, the
protection switching time of WDM client-side 1+1 protection is greater than 50 ms.

3.4.27.3 400Gbps-QSFP-DD-SMF-1528.773~1567.133nm-commercial

Table 3-588 400Gbps-QSFP-DD-SMF-1528.773~1567.133nm-commercial
specifications

Item Value

Basic Information

Module name 400Gbps-QSFP-DD-
SMF-1528.773~1567.133nm-
commercial

Part Number 02313GSB

Model OSK080N03

Form factor QSFP-DD

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Item Value

Application standard IEEE802.3 cw

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1x10E-15(after FEC)
<1.25E-2(before FEC)

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options QSFP-DD MSA

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 1000 V

Transmission rate [bit/s] 478.75 Gbit/s

Target transmission distance [km] 80 km

Transmitter Optical Characteristics

Center wavelength [nm] 1528.773nm~1567.133nm

Tx operating wavelength range [nm] 1528.773nm~1567.133nm

Maximum Tx optical power (AVG) -6 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Minimum Tx optical power (AVG) -10 dBm
[dBm]

Minimum Tx optical power (OMA) -
[dBm]

Minimum extinction ratio [dB] -

Modulation mode 400G DP-16QAM

Number of tunable channels 48/64

Channel spacing [GHz] 75GHz/100GHz

Center frequency deviation [GHz] ±1.8 GHz

Tx channel tuning time [s] 180s

Output optical power in case of laser ≤-20 dBm
shutdown [dBm]

Receiver Optical Characteristics

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Item Value

Rx operating wavelength range [nm] 1528.773nm~1567.133nm

Rx sensitivity (OMA) [dBm] -

Overload power (AVG) [dBm] 0 dBm

Overload power (OMA) [dBm] -

FEC mode CFEC
RS-FEC

Rx optical power range [dBm] -12 dBm ~ 0 dBm

Minimum OSNR (back-to-back&EOL) 26 dB
[dB]

CD tolerance [ps/nm] 0 ps/nm ~ 2400 ps/nm

PMD tolerance [ps] 10 ps@0.5 dB OSNR penalty

PDL tolerance [dB] 3.5 with ≤ 1.3 dB OSNR penalty

SOP tolerance [krad/s] 50 krad/s@0.3dB penalty

NOTE
1. After being switched to the 400G ZR mode, modules with part numbers 02314MEF and
02314PXP cannot interconnect with this optical module.
2. Only the single-span application is supported. This optical module needs to be used with
the fiber amplifier module.
3. When this type of optical module is used to interconnect with WDM equipment, the
WDM client-side 1+1 protection switching time is greater than 50 ms.
4. According to the 400G ZR protocol, the hot start time of a port with a 400G ZR optical
module is less than 180s, and the cold start time is less than 200s.

3.4.27.4 400Gbps(4*100Gb/s PAM4)-QSFP-DD-SMF-1310nm-2km-commercial

Table 3-589 400Gbps(4*100Gb/s PAM4)-QSFP-DD-SMF-1310nm-2km-commercial
specifications

Item Value

Basic Information

Module name 400Gbps(4*100Gb/s PAM4)-QSFP-DD-
SMF-1310nm-2km-commercial

Part Number 02313KLT

Model OSK002N01

Form factor QSFP-DD

Application standard IEEE802.3 bs-2017

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Item Value

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <1E-4(before FEC)

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options QSFP-DD MSA

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 1000 V

Transmission rate [bit/s] 425 Gbit/s

Target transmission distance [km] 2 km

Transmitter Optical Characteristics

Center wavelength [nm] 1271 nm
1291 nm
1311 nm
1331 nm

Tx operating wavelength range [nm] 1264.5 nm ~ 1277.5 nm
1284.5 nm ~ 1297.5 nm
1304.5 nm ~ 1317.5 nm
1324.5 nm ~ 1337.5 nm

Maximum Tx optical power (AVG) per lane: 3.5 dBm
[dBm]

Maximum Tx optical power (OMA) per lane: 3.7 dBm
[dBm]

Minimum Tx optical power (AVG) per lane: -3.3 dBm
[dBm]

Minimum Tx optical power (OMA) per lane: -0.3 dBm
[dBm]

Minimum extinction ratio [dB] 3.5 dB

Modulation mode -

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1264.5 nm ~ 1277.5 nm
1284.5 nm ~ 1297.5 nm
1304.5 nm ~ 1317.5 nm
1324.5 nm ~ 1337.5 nm

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Item Value

Minimum Rx optical power (AVG) per lane: -7.3 dBm
[dBm]

Maximum Rx optical power (AVG) per lane: 3.5 dBm
[dBm]

Maximum Rx optical power (OMA) per lane: -7.6 dBm
[dBm]

Rx sensitivity (AVG) [dBm] per lane: -7.6 dBm

Rx sensitivity (OMA) [dBm] −4.6dBm, SECQ − 6.0dB

Overload power (AVG) [dBm] per lane: 3.5 dBm

Overload power (OMA) [dBm] -

NOTE
During link deployment, focus on the reflection indicators of each node. The discrete
reflection indicators must meet the IEEE specifications.
IEEE 802.3cu standard discrete reflection requirements: For a 400G FR4 link with six
reflection points, each reflection point must be less than or equal to –38 dB. For a 400G
FR4 link with eight reflection points, each reflection point must be less than or equal to –40
dB. For a 400G FR4 link with 10 reflection points, each reflection point must be less than or
equal to –41 dB.
When this type of optical module is used to interconnect with WDM equipment, the
protection switching time of WDM client-side 1+1 protection is greater than 50 ms.

3.4.27.5 400Gbps(8*50Gb/s PAM4)-QSFP-DD-MMF-850nm-0.1km-commercial

Table 3-590 400Gbps(8*50Gb/s PAM4)-QSFP-DD-MMF-850nm-0.1km-commercial
specifications
Item Value

Basic Information

Module name 400Gbps(8*50Gb/s PAM4)-QSFP-DD-
MMF-850nm-0.1km-commercial

Part Number 02313KST

Model QSFP-DD-400G-850-0.1km

Form factor QSFP-DD

Application standard IEEE802.3 bs-2017

Connector type MPO-16

Optical fiber type MMF

Bit error ratio (BER) <5E-6(Pre-FEC)

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Item Value

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options QSFP-DD MSA

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 1000 V

Transmission rate [bit/s] 425 Gbit/s

Target transmission distance [km] 100m@OM5
100m@OM4
70m@OM3

Transmitter Optical Characteristics

Center wavelength [nm] 850 nm

Tx operating wavelength range [nm] 840 nm~ 860 nm

Maximum Tx optical power (AVG) per lane: 4 dBm
[dBm]

Maximum Tx optical power (OMA) per lane: 3 dBm
[dBm]

Minimum Tx optical power (AVG) per lane: -6.5 dBm
[dBm]

Minimum Tx optical power (OMA) per lane: -4.5 dBm
[dBm]

Minimum extinction ratio [dB] 3 dB

Modulation mode PAM4

Receiver Optical Characteristics

Rx operating wavelength range [nm] 840 nm~ 860 nm

Minimum Rx optical power (AVG) per lane: -8.4 dBm
[dBm]

Maximum Rx optical power (AVG) per lane: 4 dBm
[dBm]

Maximum Rx optical power (OMA) per lane: 3 dBm
[dBm]

Rx sensitivity (AVG) [dBm] per lane: -7 dBm

Rx sensitivity (OMA) [dBm] per lane: −6.5 dBm

Overload power (AVG) [dBm] per lane: 4 dBm

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Item Value

Overload power (OMA) [dBm] -

3.4.27.6 400Gbps(4*100Gb/s PAM4)-QSFP-DD-SMF-1310nm-6km-commercial

Table 3-591 400Gbps(4*100Gb/s PAM4)-QSFP-DD-SMF-1310nm-6km-commercial
specifications
Item Value

Basic Information

Module name 400Gbps(4*100Gb/s PAM4)-QSFP-DD-
SMF-1310nm-6km-commercial

Part Number 02314LPE

Model OSK006N01

Form factor QSFP-DD

Application standard IEEE802.3 bs-2017

Connector type LC

Optical fiber type SMF

Bit error ratio (BER) <2E-5(before FEC)

Working case temperature [°C(°F)] 0°C to 70°C(32°F to 158°F)

DDM options QSFP-DD MSA

Environment standard RoHS

Security standard FCC Class B, IEC 60825-1 Class 1

ESD(HBM1) [V] 1000 V

Transmission rate [bit/s] 425 Gbit/s

Target transmission distance [km] 6 km

Transmitter Optical Characteristics

Center wavelength [nm] 1271 nm
1291 nm
1311 nm
1331 nm

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Item Value

Tx operating wavelength range [nm] 1264.5 nm ~ 1277.5 nm
1284.5 nm ~ 1297.5 nm
1304.5 nm ~ 1317.5 nm
1324.5 nm ~ 1337.5 nm

Maximum Tx optical power (AVG) per lane: 5.1 dBm
[dBm]

Maximum Tx optical power (OMA) per lane: 4.4 dBm
[dBm]

Minimum Tx optical power (AVG) per lane: -2.7 dBm
[dBm]

Minimum Tx optical power (OMA) per lane: 0.3 dBm
[dBm]

Minimum extinction ratio [dB] 3.5 dB

Modulation mode -

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1264.5 nm ~ 1277.5 nm
1284.5 nm ~ 1297.5 nm
1304.5 nm ~ 1317.5 nm
1324.5 nm ~ 1337.5 nm

Minimum Rx optical power (AVG) per lane: -9 dBm
[dBm]

Maximum Rx optical power (AVG) per lane: 5.1 dBm
[dBm]

Maximum Rx optical power (OMA) per lane: 4.4 dBm
[dBm]

Rx sensitivity (AVG) [dBm] per lane: -9 dBm

Rx sensitivity (OMA) [dBm] −6.8dBm, SECQ −8.2dB

Overload power (AVG) [dBm] per lane: 5.1 dBm

Overload power (OMA) [dBm] -

3.4.28 Optical Amplifier Module

3.4.28.1 Optical Amplifier-QSFP28-SMF-1535nm~1547nm

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Table 3-592 Optical Amplifier-QSFP28-SMF-1535nm~1547nm specifications
Item Value

Basic Information

Module name Optical Amplifier-QSFP28-
SMF-1535nm~1547nm

Part Number 02313JCM

Model QSFP28-Amplifier-SM

Form factor QSFP28

Connector type LC

Optical fiber type SMF

Working case temperature [°C(°F)] –5°C to +75°C (23°F to 167°F)

Environment standard RoHS

Security standard EN/IEC60825-1:2014;EN/
IEC62368-1:2014;UL 62368-1 Ed.2

ESD(HBM1) [V] 2000 V

Transmitter Optical Characteristics

Center wavelength [nm] 1547.715nm

Maximum Tx optical power (AVG) +7 dBm
[dBm]

Maximum Tx optical power (OMA) -
[dBm]

Receiver Optical Characteristics

Rx operating wavelength range [nm] 1535.82 nm~1547.72 nm

Minimum Rx optical power (AVG) -29 dbm
[dBm]

NOTE
Works with 400G ZR optical modules, When the transmission distance ranges from 40 km
to 80 km and the insertion loss of the optical link is less than 22 dB, the optical amplifier
needs to be configured only at the transmit end.
Note: The optical amplifier module works at the physical layer. If the corresponding
physical port is steady on, it indicates that the optical amplifier module works normally and
no LOS alarm is reported. If the corresponding physical port is off, it indicates that the
optical amplifier module does not work normally or a LOS alarm is reported. If the status
of an amplifier module port is up, the amplifier module board is working properly and no
LOS alarm is reported. If the status of an amplifier module port is down, the amplifier
module board is not working properly or a LOS alarm is reported.

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3.5 Power Distribution Box

3.5.1 APD32-12-24 (APD32-12-24 AC Power Distribution Unit)

Overview

Table 3-593 Basic information about the APD32-12-24
Item Details

Description APD32-12-24 AC Power Distribution
Unit

Part Number 02354GYQ

Model APD32-12-24

Remarks ● It can distribute 12 AC single-phase
32 A (MAX) inputs into twenty-four
16 A (MAX) outputs.
● There are two power distribution
areas: A and B. Each area has six AC
inputs, and each AC input is divided
into two outputs.
NOTE
1. Onsite installation tool list (additional
preparation is required): 3# screwdriver,
used to secure screws on input power
cables and ground cables; flat-head
screwdriver with a 0.6 mm x 3.5 mm head,
used to connect output power cables.
2. The input power cable must be a power
cable that can withstand 90°C.
3. The PDU uses 32 A circuit breakers,
which are derated to 16 A.

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Appearance

Figure 3-258 Appearance of the APD32-12-24

Version Mapping

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The Info-Finder hardware center incorporates comprehensive hardware
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enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=02354GYQ&productModel=APD32-12-24#matchRelation

Functions and Features

When the power distribution unit is used to supply power to the main equipment,
the input current of each power distribution unit does not exceed 32 A and the
output current of each power distribution unit does not exceed 16 A.

Figure 3-259 single-phase 32 A inputs

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Technical Specifications

Table 3-594 Technical specifications of the APD32-12-24
Item Specification

Dimensions without packaging (H x W 130.55 mm x 442 mm x 677 mm(5.14
x D) [mm(in.)] in. x 17.4 in. x 26.65 in.)

Dimensions with packaging (H x W x 280 mm x 650 mm x 860 mm (11.02
D) [mm(in.)] in. x 25.59 in. x 33.86 in.)

Weight without packaging [kg(lb)] 17 kg (37.49 lb) (The protective cover
on the rear panel is not included. This
cover has to be removed before the
device is installed in the cabinet.)

Cabinet installation standards · IEC 60297-1 19-inch standard cabinet
· Cabinet depth ≥ 800 mm

Hole distance for installing mounting 465.1mm
brackets [mm(in.)]

Installation type Horizontal installation. The positions
of mounting brackets are adjustable.
You can install front or rear mounting
brackets.

Rated input voltage [V] 200V to 240V AC

Input voltage range [V] 176V to 264V AC

Rated output voltage [V] 200V to 240V AC

Output voltage range [V] 176V to 264V AC

Maximum input current [A] 32A

Maximum output current [A] 16A

Number of inputs 6+6

Number of outputs 12+12

Front-end circuit breaker/fuse [A] 32A

Input terminal M6 OT terminal

Output terminal Cord end terminal

Long-term operating temperature 0°C to 45°C (32°F to 113°F)
[°C(°F)]

Short-term operating temperature -5°C to 50°C (23°F to 122°F)
[°C(°F)]

Storage temperature [°C(°F)] -40°C to 70°C(-40.0°F to 158.0°F)

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Item Specification

Long-term operating relative humidity 5% RH to 85% RH, non-condensing
[RH]

Short-term operating relative humidity 5% RH to 95% RH, non-condensing
[RH]

Long-term operating altitude [m(ft.)] 0 m to 5000 m (When the altitude
ranges from 1800 m to 5000 m, the
operating temperature decreases by
1°C for each additional 220 m.)

3.5.2 APD32-4-24 (APD32-4-24 AC Power Distribution Unit)

Overview

Table 3-595 Basic information about the APD32-4-24
Item Details

Description APD32-4-24 AC Power Distribution
Unit

Part Number 02354GYS

Model APD32-4-24

Remarks ● It can distribute four AC three-
phase 32 A (MAX) inputs into
twenty-four 16 A (MAX) outputs.
● There are two power distribution
areas: A and B. Each area has two
AC three-phase inputs. Each AC
input is divided into two outputs.
NOTE
1. Onsite installation tool list (additional
preparation is required): 3# screwdriver,
used to secure screws on input power
cables and ground cables; flat-head
screwdriver with a 0.6 mm x 3.5 mm head,
used to connect output power cables.
2. The input power cable must be a power
cable that can withstand 90°C.
3. The PDU uses 32 A circuit breakers,
which are derated to 16 A.

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Appearance

Figure 3-260 Appearance of the APD32-4-24

Version Mapping

The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.

The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.

enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=02354GYS&productModel=APD32-4-24#matchRelation

Functions and Features

When the power distribution unit is used to supply power to the main equipment,
the input current of each power distribution unit does not exceed 32 A and the
output current of each power distribution unit does not exceed 16 A.

Figure 3-261 three-phase 32 A inputs

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Hardware Guide 3 Hardware Description

Technical Specifications

Table 3-596 Technical specifications of the APD32-4-24

Item Specification

Dimensions without packaging (H x W 130.55 mm x 442 mm x 677 mm(5.14
x D) [mm(in.)] in. x 17.4 in. x 26.65 in.)

Dimensions with packaging (H x W x 280 mm x 650 mm x 860 mm (11.02
D) [mm(in.)] in. x 25.59 in. x 33.86 in.)

Weight without packaging [kg(lb)] 17 kg (37.49 lb) (The protective cover
on the rear panel is not included. This
cover has to be removed before the
device is installed in the cabinet.)

Cabinet installation standards · IEC 60297-1 19-inch standard
cabinet,
· Cabinet depth ≥ 800 mm

Hole distance for installing mounting 465.1mm
brackets [mm(in.)]

Installation type Horizontal installation. The positions
of mounting brackets are adjustable.
You can install front or rear mounting
brackets.

Rated input voltage [V] Three-phase , wire voltage 346V to
415V AC

Input voltage range [V] Three-phase, wire voltage:305V to
457V AC

Rated output voltage [V] 200V to 240V AC

Output voltage range [V] 176V to 264V AC

Maximum input current [A] 32A

Maximum output current [A] 16A

Number of inputs 2+2

Number of outputs 12+12

Front-end circuit breaker/fuse [A] 32A

Input terminal M6 OT terminal

Output terminal Cord end terminal

Long-term operating temperature 0°C to 45°C (32°F to 113°F)
[°C(°F)]

Short-term operating temperature -5°C to 50°C (23°F to 122°F)
[°C(°F)]

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Item Specification

Storage temperature [°C(°F)] -40°C to 70°C(-40.0°F to 158.0°F)

Long-term operating relative humidity 5% RH to 85% RH, non-condensing
[RH]

Short-term operating relative humidity 5% RH to 95% RH, non-condensing
[RH]

Long-term operating altitude [m(ft.)] 0 m to 5000 m (When the altitude
ranges from 1800 m to 5000 m, the
operating temperature decreases by
1°C for each additional 220 m.)

3.5.3 APD63-2-24 (APD63-2-24 AC Power Distribution Unit)

Overview

Table 3-597 Basic information about the APD63-2-24

Item Details

Description APD63-2-24 AC Power Distribution
Unit

Part Number 02354GYV

Model APD63-2-24

Remarks ● Two AC three-phase 63 A (MAX)
inputs can be distributed into
twenty-four 16 A (MAX) outputs.
● There are two power distribution
areas: A and B. Each area has one
AC three-phase input. AC input of
each channel and each phase is
distributed into four outputs.
NOTE
1. Onsite installation tool list (additional
preparation is required): 3# screwdriver,
used to secure input power cables and
ground cable screws; flat-head screwdriver
with a head size of 0.6 mm x 3.5 mm, used
to connect output power cables.
2. The input power cable must be a 90°C
temperature-resistant power cable.
3. The PDU uses 32 A circuit breakers,
which are derated to 16 A.

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Appearance

Figure 3-262 Appearance of the APD63-2-24

Version Mapping

The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.

The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.

enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=02354GYV&productModel=APD63-2-24#matchRelation

Functions and Features

When the power distribution unit is used to supply power to the main equipment,
the input current of each power distribution unit does not exceed 63 A and the
output current of each power distribution unit does not exceed 16 A.

Figure 3-263 three-phase 63 A inputs

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Hardware Guide 3 Hardware Description

Technical Specifications

Table 3-598 Technical specifications of the APD63-2-24

Item Specification

Dimensions without packaging (H x W 130.55 mm x 442 mm x 677 mm(5.14
x D) [mm(in.)] in. x 17.4 in. x 26.65 in.)

Dimensions with packaging (H x W x 280 mm x 650 mm x 860 mm (11.02
D) [mm(in.)] in. x 25.59 in. x 33.86 in.)

Weight without packaging [kg(lb)] 17 kg (37.49 lb) (The protective cover
on the rear panel is not included. This
cover has to be removed before the
device is installed in the cabinet.)

Cabinet installation standards · IEC 60297-1 19-inch standard
cabinet,
· Cabinet depth ≥ 800 mm

Hole distance for installing mounting 465.1mm
brackets [mm(in.)]

Installation type Horizontal installation. The positions
of mounting brackets are adjustable.
You can install front or rear mounting
brackets.

Rated input voltage [V] Three-phase , wire voltage 346V to
415V AC

Input voltage range [V] Three-phase, wire voltage:305V to
457V AC

Rated output voltage [V] 200V to 240V AC

Output voltage range [V] 176V to 264V AC

Maximum input current [A] 63A

Maximum output current [A] 16A

Number of inputs 1+1

Number of outputs 12+12

Front-end circuit breaker/fuse [A] 63A

Input terminal M6 OT terminal

Output terminal Cord end terminal

Long-term operating temperature 0°C to 45°C(32°F to 113°F)
[°C(°F)]

Short-term operating temperature -5°C to 50°C (23°F to 122°F)
[°C(°F)]

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Item Specification

Storage temperature [°C(°F)] -40°C to 70°C(-40.0°F to 158.0°F)

Long-term operating relative humidity 5% RH to 85% RH, non-condensing
[RH]

Short-term operating relative humidity 5% RH to 95% RH, non-condensing
[RH]

Long-term operating altitude [m(ft.)] 0 m to 5000 m (When the altitude
ranges from 1800 m to 5000 m, the
operating temperature decreases by
1°C for each additional 220 m.)

3.5.4 APD63-6-24 (APD63-6-24 AC Power Distribution Unit)

Overview

Table 3-599 Basic information about the APD63-6-24

Item Details

Description APD63-6-24 AC Power Distribution
Unit

Part Number 02354GYT

Model APD63-6-24

Remarks ● It can distribute six AC single-phase
63 A (MAX) inputs into twenty-four
16 A (MAX) outputs.
● There are two power distribution
areas: A and B. Each area has three
AC single-phase inputs, and each
AC input is divided into four
outputs.
NOTE
1. Onsite installation tool list (additional
preparation is required): 3# screwdriver,
used to secure screws on input power
cables and ground cables; flat-head
screwdriver with a 0.6 mm x 3.5 mm head,
used to connect output power cables.
2. The input power cable must be a power
cable that can withstand 90°C.
3. The PDU uses 32 A circuit breakers,
which are derated to 16 A.

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Appearance

Figure 3-264 Appearance of the APD63-6-24

Version Mapping

The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.

The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.

enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=02354GYT&productModel=APD63-6-24#matchRelation

Functions and Features

When the power distribution unit is used to supply power to the main equipment,
the input current of each power distribution unit does not exceed 63 A and the
output current of each power distribution unit does not exceed 16 A.

Figure 3-265 single-phase 63 A inputs

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Technical Specifications

Table 3-600 Technical specifications of the APD63-6-24
Item Specification

Dimensions without packaging (H x W 130.55 mm x 442 mm x 677 mm(5.14
x D) [mm(in.)] in. x 17.4 in. x 26.65 in.)

Dimensions with packaging (H x W x 280 mm x 650 mm x 860 mm (11.02
D) [mm(in.)] in. x 25.59 in. x 33.86 in.)

Weight without packaging [kg(lb)] 17 kg (37.49 lb) (The protective cover
on the rear panel is not included. This
cover has to be removed before the
device is installed in the cabinet.)

Cabinet installation standards · IEC 60297-1 19-inch standard cabinet
· Cabinet depth ≥ 800 mm

Hole distance for installing mounting 465.1mm
brackets [mm(in.)]

Installation type Horizontal installation. The positions
of mounting brackets are adjustable.
You can install front or rear mounting
brackets.

Rated input voltage [V] 200V to 240V AC

Input voltage range [V] 176V to 264V AC

Rated output voltage [V] 200V to 240V AC

Output voltage range [V] 176V to 264V AC

Maximum input current [A] 63A

Maximum output current [A] 16A

Number of inputs 3+3

Number of outputs 12+12

Front-end circuit breaker/fuse [A] 63A

Input terminal M6 OT terminal

Output terminal Cord end terminal

Long-term operating temperature 0°C to 45°C (32°F to 113°F)
[°C(°F)]

Short-term operating temperature -5°C to 50°C (23°F to 122°F)
[°C(°F)]

Storage temperature [°C(°F)] -40°C to 70°C(-40.0°F to 158.0°F)

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Item Specification

Long-term operating relative humidity 5% RH to 85% RH, non-condensing
[RH]

Short-term operating relative humidity 5% RH to 95% RH, non-condensing
[RH]

Long-term operating altitude [m(ft.)] 0 m to 5000 m (When the altitude
ranges from 1800 m to 5000 m, the
operating temperature decreases by
1°C for each additional 220 m.)

3.5.5 CR8MP2KHDCC0 (380VDC HVDC and 220V AC Power
Distribution Unit)

Overview

Table 3-601 Basic information about the CR8MP2KHDCC0
Item Details

Description 380VDC HVDC and 220V AC Power
Distribution Unit

Part Number 02122538

Model CR8MP2KHDCC0

Appearance

Figure 3-266 Appearance of the CR8MP2KHDCC0

Version Mapping
The huge hardware mapping data is migrated to the Info-Finder hardware center,
where you can easily obtain hardware mapping information.

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Hardware Guide 3 Hardware Description

The Info-Finder hardware center incorporates comprehensive hardware
information and mapping data by sales regions, allowing you to quickly find
desired information and filter the mapping data for more fine-grained data
display.

enterprise: https://info.support.huawei.com/info-finder/search-center/en/
enterprise/routers/ne5000e-pid-15833/hardwarecenter?
keyword=02122538&productModel=CR8MP2KHDCC0#matchRelation

Functions and Features

A 380 V high-voltage DC PDU supports 240 V/380 V DC and 220V AC power input
and provides two output groups A1 and B1. Each group controls four HVDC-3Z-03
sockets. When the groups are connected to a chassis, the total current of all
sockets in each group cannot exceed 63 A.

Figure 3-267 circuit principle

Technical Specifications

Table 3-602 Technical specifications of the CR8MP2KHDCC0

Item Specification

Dimensions without packaging (H x W 43.6 mm x 484 mm x 60 mm (1.72 in.
x D) [mm(in.)] x 19.06 in. x 2.36 in.)

Weight without packaging [kg(lb)] 2.1 kg (4.63 lb)

Cabinet installation standards IEC 60297-1 19-inch standard cabinet

Hole distance for installing mounting 465.1 mm
brackets [mm(in.)]

Installation type Horizontal Installation

Rated input voltage [V] HVDC: 240 V/380 V
AC: 220 V

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Item Specification

Input voltage range [V] HVDC: 188 V–400 V
AC: 176 V–264 V

Rated output voltage [V] HVDC: 240 V/380 V
AC: 220 V

Output voltage range [V] 240 V HVDC: 192–288 V DC
380 V HVDC: 260–400 V DC
220 V AC: 176–264 V AC

Maximum input current [A] 63 A

Maximum output current [A] 16 A

Number of inputs 2

Number of outputs 8/4

Output terminal Customized terminal

Long-term operating temperature 0°C to 40°C (32°F to 104°F)
[°C(°F)]

Short-term operating temperature –5°C to +50°C (23°F to 122°F)
[°C(°F)]

Storage temperature [°C(°F)] –40°C to 70°C (–40°F to 158°F)

Long-term operating relative humidity 5% RH to 85% RH, non-condensing
[RH]

Short-term operating relative humidity 5% RH to 95% RH, non-condensing
[RH]

Long-term operating altitude [m(ft.)] ≤ 4000 m (13123.36 ft.) (From 1800 m
to 4000 m [5905.51 ft. to 13123.36
ft.], the operating temperature of the
device decreases by 1°C [1.8°F] for
every 220 m [721.78 ft.] increase in
altitude.)

3.6 Cables
This chapter describes the structure and specifications of the external cables.

3.6.1 NE5000E-X16A Power Cables

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3.6.1.1 DC Power Cables
DC power cables can be used to connect a PDF on the user side to DC PEMs on
the NE5000E-X16ANE5000E CCC-A.

Appearance

Figure 3-268 DC power cables

Figure 3-269 Power cable terminals

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Figure 3-270 Heat shrink tubing

Specifications

Install cables based on the actual power distribution distance between the
NE5000E-X16A and PDF. Table 3-603 shows the specifications of the DC power
cables.

Table 3-603 Power cable specifications
Distance Item Specifications Remarks
from the
PDF to
the
Device

Shorter DC power Electronic|Electric Cable,450V/ Blue power cable
than or cable 750V,H07Z-K
equal to UL3386,25mm^2,Blue,138A,LSZ
25 m H Cable,VDE,UL

Electronic|Electric Cable,450V/ Black power cable
750V,H07Z-K
UL3386,25mm^2,Black,138A,LSZ
H Cable,VDE,UL

Electronic|Electric Cable,450V/ Red power cable
750V,H07Z-K
UL3386,25mm^2,Red,138A,LSZH
Cable,VDE,UL

Power Naked Crimping It is connected to
cable Connector,JG2,25mm^2,M6,Tin the device.
terminal Plating

Naked Crimping It is connected to
Terminal,OT,25mm^2,M8,Tin the PDF.
Plating,Naked Ring Terminal

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Distance Item Specifications Remarks
from the
PDF to
the
Device

Longer DC power Electronic|Electric Cable,450V/ Blue power cable
than 25 m cable 750V,60227 IEC
and 02(RV),35mm^2,Blue,138A,CCC,
shorter CE
than or
equal to Electronic|Electric Cable,450V/ Black power cable
35 m 750V,60227 IEC
02(RV),35mm^2,Black,138A,CCC
,CE

Electronic|Electric Cable,450V/ Red power cable
750V,60227 IEC
02(RV),35mm^2,Red,138A,CCC,C
E

Power Naked Crimping It is connected to
cable Connector,JG2,34.3mm^2,M6(1/ the device.
terminal 4"),Tin Plated,2AWG,Hole
Center Distance
15.875mm(5/8"),Short Tube

Naked Crimping It is connected to
Terminal,OT,38mm^2,M8,Tin the PDF.
Plating,Naked Ring Terminal,for
35mm^2~38mm^2 cable

Longer A PDF or the EOS must be placed close to the device.
than 35 m

3.6.1.2 AC Power Cables
AC power cables can be used to connect a PDF on the user side to AC PEMs on
the NE5000E-X16ANE5000E CCC-A.

Appearance
The AC power cable connectors vary according to countries and regions. Select the
corresponding power cables based on the local standard. Figure 3-271 uses an AC
power cable of a Chinese standard as an example.

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Hardware Guide 3 Hardware Description

Figure 3-271 AC power cable (C19 straight female-PI straight male)

Specifications
When the AC power cable is used, the connectors at both ends of the power cable
must match the sockets on the NE5000E-X16ANE5000E CCC-A and user-side PDF.
The connector type of the AC power cable on the device side is C19 straight
female. The connector type of the AC power cable on the PDF side varies in
different countries and regions. Table 3-604 lists the specifications of common
power cables used by the NE5000E-X16ANE5000E CCC-A.

Table 3-604 Power cable specifications
Description Appearance of the Power Cable (Connector on the PDF Side
– Connector on the Device Side)

Power Cords
Cable,China
AC Power
250V16A,3.0
m,PIAM,227IE
C53-2.5^2(3C
),C19SF,Black

Power
cord,BS546
250V16A,3.0
m,PM-
IAM,H05VV-
F-1.5mm^2(3
C),C19SF,250V
,16A,Black

Power Cords
Cable,Europe
AC Power
250V16A,3.0
m,PFAM,H05V
VF-1.5^2(3C),
C19SF,Black

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Description Appearance of the Power Cable (Connector on the PDF Side
– Connector on the Device Side)

Power
cord,Japan AC
Power
Cable,3.0m,N
EMA5-20PAM,
HVCTF-3.5m
m^2(3C),C19
SF,125V,20A,Bl
ack

Power Cords
Cable,North
America AC
Power
125V20A,3.0
m,NEMA5-20
PAM,12SJT(3C
),C19SF,Black

Power Cords
Cable,Australi
a AC Power
250V16A,3.0
m,PISM,H05V
VF-2.5^2(3C),
C19SF,Black

Power Cords
Cable,Brazil
AC Power
250V16A,3.0
m,PN-
ISM ,H05VVF-
1.5^2(3C),C19
SF,Black

Power Cords
Cable,Britain
AC Power
Cable,250V13
A,3.0m,PG
AM,H05VV-
F-1.5mm^2(3
C),C19
SF,Black

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3.6.1.3 AC (220 V)/HVDC (240/380 V) Power Cables
The power distribution frame (PDF) can be directly connected to the AC and
HVDC (240 V) PEMs of the NE5000E through cables to supply power for the
chassis. The same power cable configurations apply to AC (220 V) and HVDC (240
V) scenarios.

Direct Connection to a PDF
NO TE

Power cables with part numbers 04153331, 04153331-001, or 04153331-002 apply to both
AC (220 V) and HVDC (240/380 V) power cables.
Figure 3-272, Figure 3-273, and Figure 3-274 show the appearance of AC and
HVDC (240 V) power cables for the NE5000E-X16A. An HVDC 3 straight female
connector is used on the device side. Select power cables based on the ports on
the PDF side.

Figure 3-272 AC (220 V)/HVDC (240/380 V) power cable (HVDC 3-straight
female--OT M8)

Figure 3-273 AC&240 V high-voltage DC power cable (HVDC 3-straight female--PI
angle male)

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Figure 3-274 AC&240 V high-voltage DC power cable (HVDC 3-straight female--
C20 straight male)

Cable Connections for Direct Connection to a PDF
An AC (220 V)/HVDC (240/380 V) power cable is connected as follows:
● HVDC 3 straight female connector: is connected to a socket on a PEM at the
rear of the chassis.
● OT M8 connector: is connected to a PDF. The brown wire is connected to the L
terminal, the blue wire is connected to the N terminal, and the yellow/green
wire is connected to the ground terminal. The power cable connections may
vary according to local regulations or customer requirements.
Select AC/HVDC (240 V) power cables based on the types of power sockets used
in your equipment room. Huawei provides power distribution unit (PDU) power
cables and connector-specific power cables to suit different types of power
sockets.

Connection to a PDU
● C19 PDU power cables: HVDC straight female to C20 straight male AC power
cables, delivered with a PDU that has C19 straight female sockets. Figure
3-275 shows a PDU power cable.

Figure 3-275 PDU power cable and PDU

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Hardware Guide 3 Hardware Description

● Socket-type power cables: delivered in compliance with standards of the
destination country or region. For example, AC/HVDC (240 V) power cables
with PI angle male connectors are used in China. Figure 3-276 shows such a
power cable.

Figure 3-276 Chinese socket-type power cable and power strip

When 380 V HVDC power is used, Huawei horizontal HVDC PDUs with HVDC
straight female–HVDC straight male power cables are required.

Figure 3-277 Structure of a C19 PDU power cable

Figure 3-278 Structure of a socket-type power cable

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Figure 3-279 Structure of the AC (220 V)/HVDC (240/380 V) power cable
(connector on the device side–connector on the user PDF side)

Mapping between terminals and wires: (PE) — yellow and green — (E); (-) —
blue — (N); (+) — brown — (L)

Cable Connections for Connection to a PDU
An AC (220 V)/HVDC (240/380 V) power cable transmits AC (220 V)/HVDC
(240/380 V) power to a load. It is connected as follows:
● The HVDC 3 straight female connector is connected to a socket on a PEM at
the rear of the chassis.
● The other plug is connected to a PDU or an external socket.

Technical Specifications
● Technical specifications of PDU power cables
Table 3-605 lists the technical specifications of C19 PDU power cables, and
Figure 3-277 shows the cable structure.

Table 3-605 Technical specifications of C19 PDU power cables
Par Description Connector Connector Length
t X1 X2
Nu
mb
er

041 Power C20 HVDC 3 2.5 m
519 Cable,2.5m,3*1.5mm^2,HV straight straight
58 DC 3SF,(H05VV- male female
F-1.5mm^2(3C)
+14SJT(3C)),C20SM,PDU

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Par Description Connector Connector Length
t X1 X2
Nu
mb
er

041 Power HVDC 3 C20 straight 3 m
529 Cable,3m,3*1.5mm^2,Black, straight male
88 C20SM,227IEC57-1.5^2(3C) female
,HVDC 3SF,China AC PDU
Power 250V16A

041 Power C20 HVDC 3 5 m
525 Cable,5m,3*1.5mm^2,HVDC straight straight
08 3SF,(H05VV- male female
F-1.5mm^2(3C)
+14SJT(3C)),C20SM,PDU

041 Power C20 HVDC 3 10 m
525 Cable,10m,3*1.5mm^2,HVD straight straight
09 C 3SF,(H05VV- male female
F-1.5mm^2(3C)
+14SJT(3C)),C20SM,PDU

● Technical specifications of socket-type power cables
Table 3-606 lists the technical specifications of socket-type power cables.
Using the power cable with part number 04151963 as an example, the Figure
3-278 shows the cable structure.

Table 3-606 Technical specifications of socket-specific power cables

Par Description Connector Connector Length
t X1 X2
Nu
mb
er

041 Power PI angle HVDC 3 2.5 m
519 Cable,2.5m,3*1.5mm^2,HV male straight
63 DC female
3SF,227IEC53-1.5^2(3C),PIA
M,For China

041 Power HVDC 3 PI angle 3 m
529 Cable,3m,3*1.5mm^2,Black, straight male
86 PIAM,227IEC57-1.5^2(3C), female
HVDC 3SF,China AC Power
250V16A

041 Power HVDC 3 PI angle 5 m
525 Cable,5m,3*1.5mm^2,HVDC straight male
07 3SF,227IEC53-1.5^2(3C),PIA female
M,For China

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Par Description Connector Connector Length
t X1 X2
Nu
mb
er

041 Power Cable,2.5m,HVDC NEMA5-20 HVDC 3 2.5 m
527 3SF,12SJT(3C),NEMA5-20PA P angle straight
19 M,North America AC Power male female
125V20A

● Technical specifications of the AC (220 V)/HVDC (240/380 V) power cables
Table 3-607 lists the technical specifications of AC (220 V)/HVDC (240/380 V)
power cables, and Figure 3-279 lists the cable structure.

Table 3-607 Technical specifications of the AC (220 V)/HVDC (240/380 V)
power cables
Par Description Connector Connector Length
t X1 X2
Nu
mb
er

041 Power 3*OT2.5-8 HVDC 3 3 m
533 Cable,3m,3*2.5mm^2,HVDC straight
31 3SF,227IEC53-2.5^2(3C),3* female
OT2.5-8,380V high voltage
DC PEM dedicated

041 Power 3*OT2.5-8 HVDC 3 20 m
533 Cable,20m,3*2.5mm^2,HVD straight
31- C female
001 3SF,227IEC53-2.5^2(3C),3*
OT2.5-8,380V high voltage
DC PEM dedicated

041 Power 3*OT2.5-8 HVDC 3 25 m
533 Cable,25m,3*2.5mm^2,HVD straight
31- C female
002 3SF,227IEC53-2.5^2(3C),3*
OT2.5-8,380V high voltage
DC PEM dedicated,NO

3.6.2 NE5000E-X16B Power Cables

3.6.2.1 DC Power Cables
DC power cables can be used to connect a PDF on the user side to DC PEMs on
the NE5000E-X16B.

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Appearance

Figure 3-280 DC power cables

Figure 3-281 Power cable terminals

Figure 3-282 Heat shrink tubing

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Hardware Guide 3 Hardware Description

Specifications

Install cables based on the actual power distribution distance between the
NE5000E-X16B and PDF. Table 3-608 shows the specifications of the DC power
cables.

Table 3-608 Power cable specifications
Distance Item Specifications Remarks
from the
PDF to
the
Device

Shorter DC power Electronic|Electric Cable,450V/ Blue power cable
than or cable 750V,H07Z-K
equal to UL3386,25mm^2,Blue,138A,LSZ
35 m H Cable,VDE,UL

Electronic|Electric Cable,450V/ Black power cable
750V,H07Z-K
UL3386,25mm^2,Black,138A,LSZ
H Cable,VDE,UL

Electronic|Electric Cable,450V/ Red power cable
750V,H07Z-K
UL3386,25mm^2,Red,138A,LSZH
Cable,VDE,UL

Power Naked Crimping It is connected to
cable Connector,JG2,34.3mm^2,M6(1/ the device.
terminal 4"),Tin Plated,2AWG,Hole
Center Distance
15.875mm(5/8"),Short Tube

Naked Crimping It is connected to
Terminal,OT,38mm^2,M8,Tin the PDF.
Plating,Naked Ring Terminal,for
35mm^2~38mm^2 cable

Longer A PDF or the EOS must be placed close to the device.
than 35 m

3.6.2.2 AC Power Cables
AC power cables can be used to connect a PDF on the user side to AC PEMs on
the NE5000E-X16ANE5000E CCC-A.

Appearance
The AC power cable connectors vary according to countries and regions. Select the
corresponding power cables based on the local standard. Figure 3-283 uses an AC
power cable of a Chinese standard as an example.

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Hardware Guide 3 Hardware Description

Figure 3-283 AC power cable (C19 straight female-PI straight male)

Specifications
When the AC power cable is used, the connectors at both ends of the power cable
must match the sockets on the NE5000E-X16ANE5000E CCC-A and user-side PDF.
The connector type of the AC power cable on the device side is C19 straight
female. The connector type of the AC power cable on the PDF side varies in
different countries and regions. Table 3-609 lists the specifications of common
power cables used by the NE5000E-X16ANE5000E CCC-A.

Table 3-609 Power cable specifications
Description Appearance of the Power Cable (Connector on the PDF Side
– Connector on the Device Side)

Power Cords
Cable,China
AC Power
250V16A,3.0
m,PIAM,227IE
C53-2.5^2(3C
),C19SF,Black

Power
cord,BS546
250V16A,3.0
m,PM-
IAM,H05VV-
F-1.5mm^2(3
C),C19SF,250V
,16A,Black

Power Cords
Cable,Europe
AC Power
250V16A,3.0
m,PFAM,H05V
VF-1.5^2(3C),
C19SF,Black

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Hardware Guide 3 Hardware Description

Description Appearance of the Power Cable (Connector on the PDF Side
– Connector on the Device Side)

Power
cord,Japan AC
Power
Cable,3.0m,N
EMA5-20PAM,
HVCTF-3.5m
m^2(3C),C19
SF,125V,20A,Bl
ack

Power Cords
Cable,North
America AC
Power
125V20A,3.0
m,NEMA5-20
PAM,12SJT(3C
),C19SF,Black

Power Cords
Cable,Australi
a AC Power
250V16A,3.0
m,PISM,H05V
VF-2.5^2(3C),
C19SF,Black

Power Cords
Cable,Brazil
AC Power
250V16A,3.0
m,PN-
ISM ,H05VVF-
1.5^2(3C),C19
SF,Black

Power Cords
Cable,Britain
AC Power
Cable,250V13
A,3.0m,PG
AM,H05VV-
F-1.5mm^2(3
C),C19
SF,Black

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3.6.2.3 AC (220 V)/HVDC (240/380 V) Power Cables
The power distribution frame (PDF) can be directly connected to the AC and
HVDC (240 V) PEMs of the NE5000E through cables to supply power for the
chassis. The same power cable configurations apply to AC (220 V) and HVDC (240
V) scenarios.

Direct Connection to a PDF
NO TE

Power cables with part numbers 04153331, 04153331-001, or 04153331-002 apply to both
AC (220 V) and HVDC (240/380 V) power cables.
Figure 3-284, Figure 3-285, and Figure 3-286 show the appearance of AC and
HVDC (240 V) power cables for the NE5000E-X16A. An HVDC 3 straight female
connector is used on the device side. Select power cables based on the ports on
the PDF side.

Figure 3-284 AC (220 V)/HVDC (240/380 V) power cable (HVDC 3-straight
female--OT M8)

Figure 3-285 AC&240 V high-voltage DC power cable (HVDC 3-straight female--PI
angle male)

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Figure 3-286 AC&240 V high-voltage DC power cable (HVDC 3-straight female--
C20 straight male)

Cable Connections for Direct Connection to a PDF
An AC (220 V)/HVDC (240/380 V) power cable is connected as follows:
● HVDC 3 straight female connector: is connected to a socket on a PEM at the
rear of the chassis.
● OT M8 connector: is connected to a PDF. The brown wire is connected to the L
terminal, the blue wire is connected to the N terminal, and the yellow/green
wire is connected to the ground terminal. The power cable connections may
vary according to local regulations or customer requirements.
Select AC/HVDC (240 V) power cables based on the types of power sockets used
in your equipment room. Huawei provides power distribution unit (PDU) power
cables and connector-specific power cables to suit different types of power
sockets.

Connection to a PDU
● C19 PDU power cables: HVDC straight female to C20 straight male AC power
cables, delivered with a PDU that has C19 straight female sockets. Figure
3-287 shows a PDU power cable.

Figure 3-287 PDU power cable and PDU

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Hardware Guide 3 Hardware Description

● Socket-type power cables: delivered in compliance with standards of the
destination country or region. For example, AC/HVDC (240 V) power cables
with PI angle male connectors are used in China. Figure 3-288 shows such a
power cable.

Figure 3-288 Chinese socket-type power cable and power strip

When 380 V HVDC power is used, Huawei horizontal HVDC PDUs with HVDC
straight female–HVDC straight male power cables are required.

Figure 3-289 Structure of a C19 PDU power cable

Figure 3-290 Structure of a socket-type power cable

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Hardware Guide 3 Hardware Description

Figure 3-291 Structure of the AC (220 V)/HVDC (240/380 V) power cable
(connector on the device side–connector on the user PDF side)

Mapping between terminals and wires: (PE) — yellow and green — (E); (-) —
blue — (N); (+) — brown — (L)

Cable Connections for Connection to a PDU
An AC (220 V)/HVDC (240/380 V) power cable transmits AC (220 V)/HVDC
(240/380 V) power to a load. It is connected as follows:
● The HVDC 3 straight female connector is connected to a socket on a PEM at
the rear of the chassis.
● The other plug is connected to a PDU or an external socket.

Technical Specifications
● Technical specifications of PDU power cables
Table 3-610 lists the technical specifications of C19 PDU power cables, and
Figure 3-289 shows the cable structure.

Table 3-610 Technical specifications of C19 PDU power cables
Par Description Connector Connector Length
t X1 X2
Nu
mb
er

041 Power C20 HVDC 3 2.5 m
519 Cable,2.5m,3*1.5mm^2,HV straight straight
58 DC 3SF,(H05VV- male female
F-1.5mm^2(3C)
+14SJT(3C)),C20SM,PDU

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Par Description Connector Connector Length
t X1 X2
Nu
mb
er

041 Power HVDC 3 C20 straight 3 m
529 Cable,3m,3*1.5mm^2,Black, straight male
88 C20SM,227IEC57-1.5^2(3C) female
,HVDC 3SF,China AC PDU
Power 250V16A

041 Power C20 HVDC 3 5 m
525 Cable,5m,3*1.5mm^2,HVDC straight straight
08 3SF,(H05VV- male female
F-1.5mm^2(3C)
+14SJT(3C)),C20SM,PDU

041 Power C20 HVDC 3 10 m
525 Cable,10m,3*1.5mm^2,HVD straight straight
09 C 3SF,(H05VV- male female
F-1.5mm^2(3C)
+14SJT(3C)),C20SM,PDU

● Technical specifications of socket-type power cables
Table 3-611 lists the technical specifications of socket-type power cables.
Using the power cable with part number 04151963 as an example, the Figure
3-290 shows the cable structure.

Table 3-611 Technical specifications of socket-specific power cables

Par Description Connector Connector Length
t X1 X2
Nu
mb
er

041 Power PI angle HVDC 3 2.5 m
519 Cable,2.5m,3*1.5mm^2,HV male straight
63 DC female
3SF,227IEC53-1.5^2(3C),PIA
M,For China

041 Power HVDC 3 PI angle 3 m
529 Cable,3m,3*1.5mm^2,Black, straight male
86 PIAM,227IEC57-1.5^2(3C), female
HVDC 3SF,China AC Power
250V16A

041 Power HVDC 3 PI angle 5 m
525 Cable,5m,3*1.5mm^2,HVDC straight male
07 3SF,227IEC53-1.5^2(3C),PIA female
M,For China

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Hardware Guide 3 Hardware Description

Par Description Connector Connector Length
t X1 X2
Nu
mb
er

041 Power Cable,2.5m,HVDC NEMA5-20 HVDC 3 2.5 m
527 3SF,12SJT(3C),NEMA5-20PA P angle straight
19 M,North America AC Power male female
125V20A

● Technical specifications of the AC (220 V)/HVDC (240/380 V) power cables
Table 3-612 lists the technical specifications of AC (220 V)/HVDC (240/380 V)
power cables, and Figure 3-291 lists the cable structure.

Table 3-612 Technical specifications of the AC (220 V)/HVDC (240/380 V)
power cables
Par Description Connector Connector Length
t X1 X2
Nu
mb
er

041 Power 3*OT2.5-8 HVDC 3 3 m
533 Cable,3m,3*2.5mm^2,HVDC straight
31 3SF,227IEC53-2.5^2(3C),3* female
OT2.5-8,380V high voltage
DC PEM dedicated

041 Power 3*OT2.5-8 HVDC 3 20 m
533 Cable,20m,3*2.5mm^2,HVD straight
31- C female
001 3SF,227IEC53-2.5^2(3C),3*
OT2.5-8,380V high voltage
DC PEM dedicated

041 Power 3*OT2.5-8 HVDC 3 25 m
533 Cable,25m,3*2.5mm^2,HVD straight
31- C female
002 3SF,227IEC53-2.5^2(3C),3*
OT2.5-8,380V high voltage
DC PEM dedicated,NO

3.6.3 NE5000E CCC-A Power Cables

3.6.3.1 DC Power Cables
DC power cables can be used to connect a PDF on the user side to DC PEMs on
the NE5000E CCC-A for power supply.

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Appearance

Figure 3-292 DC power cables

Figure 3-293 Power cable terminals

Figure 3-294 Heat shrink tubing

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Hardware Guide 3 Hardware Description

Specifications

Install cables based on the actual power distribution distance between the
NE5000E CCC-A and PDF. Table 3-613 shows the specifications of the DC power
cables.

Table 3-613 Power cable specifications
Distance Item Specifications Remarks
from the
PDF to
the
Device

Shorter DC power Electronic|Electric Cable,450V/ Blue power cable
than or cable 750V,H07Z-K
equal to UL3386,25mm^2,Blue,138A,LSZ
25 m H Cable,VDE,UL

Electronic|Electric Cable,450V/ Black power cable
750V,H07Z-K
UL3386,25mm^2,Black,138A,LSZ
H Cable,VDE,UL

Electronic|Electric Cable,450V/ Red power cable
750V,H07Z-K
UL3386,25mm^2,Red,138A,LSZH
Cable,VDE,UL

Power Naked Crimping It is connected to
cable Connector,JG2,25mm^2,M6,Tin the device.
terminal Plating

Naked Crimping It is connected to
Terminal,OT,25mm^2,M8,Tin the PDF.
Plating,Naked Ring Terminal

Longer DC power Electronic|Electric Cable,450V/ Blue power cable
than 25 m cable 750V,60227 IEC
and 02(RV),35mm^2,Blue,138A,CCC,
shorter CE
than or
equal to Electronic|Electric Cable,450V/ Black power cable
35 m 750V,60227 IEC
02(RV),35mm^2,Black,138A,CCC
,CE

Electronic|Electric Cable,450V/ Red power cable
750V,60227 IEC
02(RV),35mm^2,Red,138A,CCC,C
E

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Distance Item Specifications Remarks
from the
PDF to
the
Device

Power Naked Crimping It is connected to
cable Connector,JG2,34.3mm^2,M6(1/ the device.
terminal 4"),Tin Plated,2AWG,Hole
Center Distance
15.875mm(5/8"),Short Tube

Naked Crimping It is connected to
Terminal,OT,38mm^2,M8,Tin the PDF.
Plating,Naked Ring Terminal,for
35mm^2~38mm^2 cable

Longer A PDF or the EOS must be placed close to the device.
than 35 m

3.6.3.2 AC Power Cables

AC power cables can be used to connect a PDF on the user side to AC PEMs on
the NE5000E-X16A.

Appearance

The AC power cable connectors vary according to countries and regions. Select the
corresponding power cables based on the local standard. Figure 3-295 uses an AC
power cable of a Chinese standard as an example.

Figure 3-295 AC power cable (C19 straight female-PI straight male)

Specifications

When the AC power cable is used, the connectors at both ends of the power cable
must match the sockets on the NE5000E-X16A and user-side PDF. The connector
type of the AC power cable on the device side is C19 straight female. The
connector type of the AC power cable on the PDF side varies in different countries
and regions. Table 3-614 lists the specifications of common power cables used by
the NE5000E-X16A.

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Table 3-614 Power cable specifications
Description Appearance of the Power Cable (Connector on the PDF Side
– Connector on the Device Side)

Power Cords
Cable,China
AC Power
250V16A,3.0
m,PIAM,227IE
C53-2.5^2(3C
),C19SF,Black

Power
cord,BS546
250V16A,3.0
m,PM-
IAM,H05VV-
F-1.5mm^2(3
C),C19SF,250V
,16A,Black

Power Cords
Cable,Europe
AC Power
250V16A,3.0
m,PFAM,H05V
VF-1.5^2(3C),
C19SF,Black

Power
cord,Japan AC
Power
Cable,3.0m,N
EMA5-20PAM,
HVCTF-3.5m
m^2(3C),C19S
F,125V,20A,Bla
ck

Power Cords
Cable,North
America AC
Power
125V20A,3.0
m,NEMA5-20
PAM,12SJT(3C
),C19SF,Black

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Description Appearance of the Power Cable (Connector on the PDF Side
– Connector on the Device Side)

Power Cords
Cable,Australi
a AC Power
250V16A,3.0
m,PISM,H05V
VF-2.5^2(3C),
C19SF,Black

Power Cords
Cable,Brazil
AC Power
250V16A,3.0
m,PN-
ISM ,H05VVF-
1.5^2(3C),C19
SF,Black

Power Cords
Cable,Britain
AC Power
Cable,250V13
A,3.0m,PG
AM,H05VV-
F-1.5mm^2(3
C),C19
SF,Black

3.6.3.3 AC (220 V)/HVDC (240/380 V) Power Cables
The power distribution frame (PDF) can be directly connected to the AC and
HVDC (240 V) PEMs of the NE5000E through cables to supply power for the
chassis. The same power cable configurations apply to AC (220 V) and HVDC (240
V) scenarios.

Direct Connection to a PDF
NO TE

Power cables with part numbers 04153331, 04153331-001, or 04153331-002 apply to both
AC (220 V) and HVDC (240/380 V) power cables.
Figure 3-296, Figure 3-297, and Figure 3-298 show the appearance of AC and
HVDC (240 V) power cables. An HVDC 3 straight female connector is used on the
device side. Select power cables based on the ports on the PDF side.

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Hardware Guide 3 Hardware Description

Figure 3-296 AC (220 V)/HVDC (240/380 V) power cable (HVDC 3-straight
female--OT M8)

Figure 3-297 AC&240 V high-voltage DC power cable (HVDC 3-straight female--PI
angle male)

Figure 3-298 AC&240 V high-voltage DC power cable (HVDC 3-straight female--
C20 straight male)

Cable Connections for Direct Connection to a PDF
An AC (220 V)/HVDC (240/380 V) power cable is connected as follows:
● HVDC 3 straight female connector: is connected to a socket on a PEM at the
rear of the chassis.

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● OT M8 connector: is connected to a PDF. The brown wire is connected to the L
terminal, the blue wire is connected to the N terminal, and the yellow/green
wire is connected to the ground terminal. The power cable connections may
vary according to local regulations or customer requirements.
Select AC/HVDC (240 V) power cables based on the types of power sockets used
in your equipment room. Huawei provides power distribution unit (PDU) power
cables and connector-specific power cables to suit different types of power
sockets.

Connection to a PDU
● C19 PDU power cables: HVDC straight female to C20 straight male AC power
cables, delivered with a PDU that has C19 straight female sockets. Figure
3-299 shows a PDU power cable.

Figure 3-299 PDU power cable and PDU

● Huawei horizontal PDU power cables: HVDC straight female to HVDC straight
male power cables, delivered with PDUs that have HVDC ports.

Figure 3-300 Horizontal PDU power cable and PDU

● Socket-type power cables: delivered in compliance with standards of the
destination country or region. For example, AC/HVDC (240 V) power cables

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with PI angle male connectors are used in China. Figure 3-301 shows such a
power cable.

Figure 3-301 Chinese socket-type power cable and power strip

When 380 V HVDC power is used, Huawei horizontal HVDC PDUs with HVDC
straight female–HVDC straight male power cables are required.

Figure 3-302 Structure of a C19 PDU power cable

Figure 3-303 Structure of a horizontal PDU power cable

Figure 3-304 Structure of a socket-type power cable

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Figure 3-305 Structure of the AC (220 V)/HVDC (240/380 V) power cable
(connector on the device side–connector on the user PDF side)

Mapping between terminals and wires: (PE) — yellow and green — (E); (-) —
blue — (N); (+) — brown — (L)

Cable Connections for Connection to a PDU
An AC (220 V)/HVDC (240/380 V) power cable transmits AC (220 V)/HVDC
(240/380 V) power to a load. It is connected as follows:
● The HVDC 3 straight female connector is connected to a socket on a PEM at
the rear of the chassis.
● The other plug is connected to a PDU or an external socket.

Technical Specifications
● Technical specifications of PDU power cables
Table 3-615 lists the technical specifications of C19 PDU power cables, and
Figure 3-302 shows the cable structure.

Table 3-615 Technical specifications of C19 PDU power cables
Par Description Connector Connector Length
t X1 X2
Nu
mb
er

041 Power C20 HVDC 3 2.5 m
519 Cable,2.5m,3*1.5mm^2,HV straight straight
58 DC 3SF,(H05VV- male female
F-1.5mm^2(3C)
+14SJT(3C)),C20SM,PDU

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Par Description Connector Connector Length
t X1 X2
Nu
mb
er

041 Power C20 HVDC 3 5 m
525 Cable,5m,3*1.5mm^2,HVDC straight straight
08 3SF,(H05VV- male female
F-1.5mm^2(3C)
+14SJT(3C)),C20SM,PDU

041 Power C20 HVDC 3 10 m
525 Cable,10m,3*1.5mm^2,HVD straight straight
09 C 3SF,(H05VV- male female
F-1.5mm^2(3C)
+14SJT(3C)),C20SM,PDU

Table 3-616 lists the technical specifications of horizontal PDU power cables,
and Figure 3-303 shows the cable structure.

Table 3-616 Technical specifications of horizontal PDU power cables
Par Description Connector Connector Length
t X1 X2
Nu
mb
er

041 Power HVDC 3 HVDC 3 3 m
529 Cable,3m,3*1.5mm^2,Black, straight straight
89 HVDC female male
3SM,227IEC57-1.5^2(3C),H
VDC 3SF,China 380V HVDC
PDU Power Cable

041 Power HVDC 3 HVDC 3 3 m
530 Cable,3m,3*1.5mm^2,Black, straight straight
57 HVDC 3SM,H05V2V2- female male
F-1.5mm^2(3C),HVDC
3SF,Europe 380V HVDC
PDU Power Cable

● Technical specifications of socket-type power cables
Table 3-617 lists the technical specifications of socket-type power cables.
Using the power cable with part number 04151963 as an example, the Figure
3-304 shows the cable structure.

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Hardware Guide 3 Hardware Description

Table 3-617 Technical specifications of socket-specific power cables
Par Description Connector Connector Length
t X1 X2
Nu
mb
er

041 Power PI angle HVDC 3 2.5 m
519 Cable,2.5m,3*1.5mm^2,HV male straight
63 DC female
3SF,227IEC53-1.5^2(3C),PIA
M,For China

041 Power Cable,2.5m,HVDC NEMA5-20 HVDC 3 2.5 m
527 3SF,12SJT(3C),NEMA5-20PA P angle straight
19 M,North America AC Power male female
125V20A

041 Power Cable,2.5m,HVDC PG angle HVDC 3 2.5 m
527 3SF,H05VV- male straight
20 F-1.5mm^2(3C),PG female
AM,Britain AC Power Cable
250V13A

041 Power Cable,2.5m,HVDC PF angle HVDC 3 2.5 m
527 3SF,H05VVF-1.5^2(3C),PFA male straight
21 M,Europe AC Power female
250V16A

041 Power Cable,2.5m,HVDC NEMA5-20 HVDC 3 2.5 m
527 3SF,HVCTF-3.5mm^2(3C),N P angle straight
22 EMA5-20PAM,Japan AC male female
Power Cable 125V20A

041 Power Cable,2.5m,HVDC PI straight HVDC 3 2.5 m
527 3SF,H05VV-F male straight
23 2.5mm^2(3C),PI female
SM,Australia AC Power
250V16A

041 Power Cable,2.5m,HVDC PM-III HVDC 3 2.5 m
527 3SF,IS angle male straight
24 694-1.5mm^2(3C),PM- female
IIIAM,India AC Power
250V16A

041 Power Cable,2.5m,HVDC PJ-II HVDC 3 2.5 m
527 3SF,H05VV- straight straight
25 F-1.5mm^2(3C),PJ-II male female
SM,Switzerland AC Power
Cable 250V16A

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Par Description Connector Connector Length
t X1 X2
Nu
mb
er

041 Power Cable,2.5m,HVDC PM angle HVDC 3 2.5 m
527 3SF,H05VV- male straight
26 F-1.5mm^2(3C),PMAM,Sou female
th Africa AC Power
250V16A

041 Power Cable,2.5m,HVDC PB straight HVDC 3 2.5 m
527 3SF,VCTFK3*2.0mm2(3C),P male straight
27 BSM,Taiwan(china) AC female
125V15A

041 Power Cable,2.5m,HVDC PN-I HVDC 3 2.5 m
527 3SF,H05VVF-1.5^2(3C),PN- straight straight
31 ISM,Brazil AC Power male female
250V16A

● Technical specifications of the AC (220 V)/HVDC (240/380 V) power cables
Table 3-618 lists the technical specifications of AC (220 V)/HVDC (240/380 V)
power cables, and Figure 3-305 lists the cable structure.

Table 3-618 Technical specifications of the AC (220 V)/HVDC (240/380 V)
power cables
Par Description Connector Connector Length
t X1 X2
Nu
mb
er

041 Power 3*OT2.5-8 HVDC 3 3 m
533 Cable,3m,3*2.5mm^2,HVDC straight
31 3SF,227IEC53-2.5^2(3C),3* female
OT2.5-8,380V high voltage
DC PEM dedicated

041 Power 3*OT2.5-8 HVDC 3 20 m
533 Cable,20m,3*2.5mm^2,HVD straight
31- C female
001 3SF,227IEC53-2.5^2(3C),3*
OT2.5-8,380V high voltage
DC PEM dedicated

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Hardware Guide 3 Hardware Description

Par Description Connector Connector Length
t X1 X2
Nu
mb
er

041 Power 3*OT2.5-8 HVDC 3 25 m
533 Cable,25m,3*2.5mm^2,HVD straight
31- C female
002 3SF,227IEC53-2.5^2(3C),3*
OT2.5-8,380V high voltage
DC PEM dedicated,NO

3.6.4 NE5000E-20 Power Cables

3.6.4.1 DC Power Cables
DC power cables can be used to connect a PDF on the user side to DC PEMs on
the NE5000E-20.

Appearance

Figure 3-306 DC power cables

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Hardware Guide 3 Hardware Description

Figure 3-307 Power cable terminals

Figure 3-308 Heat shrink tubing

Specifications

Install cables based on the actual power distribution distance between the
NE5000E-20 and PDF. Table 3-619 shows the specifications of the DC power
cables.

Table 3-619 Power cable specifications

Distance Item Specifications Remarks
from the
PDF to
the
Device

Shorter DC power Electronic|Electric Cable,450V/ Blue power cable
than or cable 750V,H07Z-K
equal to UL3386,25mm^2,Blue,138A,LSZ
25 m H Cable,VDE,UL

Electronic|Electric Cable,450V/ Black power cable
750V,H07Z-K
UL3386,25mm^2,Black,138A,LSZ
H Cable,VDE,UL

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Distance Item Specifications Remarks
from the
PDF to
the
Device

Electronic|Electric Cable,450V/ Red power cable
750V,H07Z-K
UL3386,25mm^2,Red,138A,LSZH
Cable,VDE,UL

Power Naked Crimping It is connected to
cable Connector,JG2,25mm^2,M6,Tin the device.
terminal Plating

Naked Crimping It is connected to
Terminal,OT,25mm^2,M8,Tin the PDF.
Plating,Naked Ring Terminal

Longer DC power Electronic|Electric Cable,450V/ Blue power cable
than 25 m cable 750V,60227 IEC
and 02(RV),35mm^2,Blue,138A,CCC,
shorter CE
than or
equal to Electronic|Electric Cable,450V/ Black power cable
35 m 750V,60227 IEC
02(RV),35mm^2,Black,138A,CCC
,CE

Electronic|Electric Cable,450V/ Red power cable
750V,60227 IEC
02(RV),35mm^2,Red,138A,CCC,C
E

Power Naked Crimping It is connected to
cable Connector,JG2,34.3mm^2,M6(1/ the device.
terminal 4"),Tin Plated,2AWG,Hole
Center Distance
15.875mm(5/8"),Short Tube

Naked Crimping It is connected to
Terminal,OT,38mm^2,M8,Tin the PDF.
Plating,Naked Ring Terminal,for
35mm^2~38mm^2 cable

Longer A PDF or the EOS must be placed close to the device.
than 35 m

3.6.4.2 AC Power Cables
AC power cables can be used to connect a PDF on the user side to AC PEMs on
the NE5000E-20.

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Hardware Guide 3 Hardware Description

Appearance
The AC power cable connectors vary according to countries and regions. Select the
corresponding power cables based on the local standard. Figure 3-309 uses an AC
power cable of a Chinese standard as an example.

Figure 3-309 AC power cable (C19 straight female-PI straight male)

Specifications
When the AC power cable is used, the connectors at both ends of the power cable
must match the sockets on the NE5000E-20 and user-side PDF. The connector type
of the AC power cable on the device side is C19 straight female. The connector
type of the AC power cable on the PDF side varies in different countries and
regions. Table 3-620 lists the specifications of common power cables used by the
NE5000E-20.

Table 3-620 Power cable specifications
Description Appearance of the Power Cable (Connector on the PDF Side
– Connector on the Device Side)

Power Cords
Cable,China
AC Power
250V16A,3.0
m,PIAM,227IE
C53-2.5^2(3C
),C19SF,Black

Power
cord,BS546
250V16A,3.0
m,PM-
IAM,H05VV-
F-1.5mm^2(3
C),C19SF,250V
,16A,Black

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Hardware Guide 3 Hardware Description

Description Appearance of the Power Cable (Connector on the PDF Side
– Connector on the Device Side)

Power Cords
Cable,Europe
AC Power
250V16A,3.0
m,PFAM,H05V
VF-1.5^2(3C),
C19SF,Black

Power
cord,Japan AC
Power
Cable,3.0m,N
EMA5-20PAM,
HVCTF-3.5m
m^2(3C),C19
SF,125V,20A,Bl
ack

Power Cords
Cable,North
America AC
Power
125V20A,3.0
m,NEMA5-20
PAM,12SJT(3C
),C19SF,Black

Power Cords
Cable,Australi
a AC Power
250V16A,3.0
m,PISM,H05V
VF-2.5^2(3C),
C19SF,Black

Power Cords
Cable,Brazil
AC Power
250V16A,3.0
m,PN-
ISM ,H05VVF-
1.5^2(3C),C19
SF,Black

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Hardware Guide 3 Hardware Description

Description Appearance of the Power Cable (Connector on the PDF Side
– Connector on the Device Side)

Power Cords
Cable,Britain
AC Power
Cable,250V13
A,3.0m,PG
AM,H05VV-
F-1.5mm^2(3
C),C19
SF,Black

3.6.4.3 AC (220 V)/HVDC (240/380 V) Power Cables
The power distribution frame (PDF) can be directly connected to the AC and
HVDC (240 V) PEMs of the NE5000E through cables to supply power for the
chassis. The same power cable configurations apply to AC (220 V) and HVDC (240
V) scenarios.

Direct Connection to a PDF
NO TE

Power cables with part numbers 04153331, 04153331-001, or 04153331-002 apply to both
AC (220 V) and HVDC (240/380 V) power cables.
Figure 3-310, Figure 3-311, and Figure 3-312 show the appearance of AC and
HVDC (240 V) power cables for the NE5000E. HVDC 3 straight female connectors
are used on the device side. Select power cables based on the ports on the PDF
side.
Figure 3-310 shows the appearance of a 380 V HVDC power cable for the
NE5000E. An HVDC 3 straight female connector is used on the device side. Select
power cables based on the ports on the PDF side.

Figure 3-310 AC (220 V)/HVDC (240/380 V) power cable (HVDC 3 straight female
– OT M8)

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Figure 3-311 AC/240 V HVDC power cable (HVDC 3 straight female – PI angle
male)

Figure 3-312 AC/240 V HVDC power cable (HVDC 3 straight female – C20 straight
male)

Cable Connections for Direct Connection to a PDF

An AC (220 V)/HVDC (240/380 V) power cable is connected as follows:

● HVDC 3 straight female connector: is connected to a socket on a PEM at the
rear of the chassis.
● OT M8 connector: is connected to a PDF. The brown wire is connected to the L
terminal, the blue wire is connected to the N terminal, and the yellow/green
wire is connected to the ground terminal. The power cable connections may
vary according to local regulations or customer requirements.

Select AC/HVDC (240 V) power cables based on the types of power sockets used
in your equipment room. Huawei provides power distribution unit (PDU) power
cables and connector-specific power cables to suit different types of power
sockets.

Connection to a PDU
● C19 PDU power cables: HVDC straight female to C20 straight male AC power
cables, delivered with a PDU that has C19 straight female sockets. Figure
3-313 shows a PDU power cable.

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Figure 3-313 PDU power cable and PDU

● Huawei horizontal PDU power cables: HVDC straight female to HVDC straight
male power cables, delivered with PDUs that have HVDC ports.

Figure 3-314 Horizontal PDU power cable and PDU

● Socket-type power cables: delivered in compliance with standards of the
destination country or region. For example, AC/HVDC (240 V) power cables
with PI angle male plugs are used in China. Figure 3-315 shows such a power
cable.

Figure 3-315 Chinese socket-type power cable and power strip

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When 380 V HVDC power is used, Huawei horizontal HVDC PDUs with HVDC
straight female–HVDC straight male power cables are required.

Figure 3-316 Structure of a C19 PDU power cable

Figure 3-317 Structure of a horizontal PDU power cable

Figure 3-318 Structure of a socket-type power cable

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Figure 3-319 Structure of the AC (220 V)/HVDC (240/380 V) power cable
(connector on the device side–connector on the user PDF side)

Mapping between terminals and wires: (PE) — yellow and green — (E); (-) —
blue — (N); (+) — brown — (L)

Cable Connections for Connection to a PDU
An AC (220 V)/HVDC (240/380 V) power cable transmits AC (220 V)/HVDC
(240/380 V) power to a load. It is connected as follows:
● The HVDC 3 straight female connector is connected to a socket on a PEM at
the rear of the chassis.
● The connector at the other end is connected to a PDU or an external socket.

Technical Specifications
● Technical specifications of PDU power cables
Table 3-621 lists the technical specifications of C19 PDU power cables, and
Figure 3-316 shows the cable structure.

Table 3-621 Technical specifications of C19 PDU power cables
Par Description Connector Connector Length
t X1 X2
Nu
mb
er

041 Power C20 HVDC 3 2.5 m
519 Cable,2.5m,3*1.5mm^2,HV straight straight
58 DC 3SF,(H05VV- male female
F-1.5mm^2(3C)
+14SJT(3C)),C20SM,PDU

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Par Description Connector Connector Length
t X1 X2
Nu
mb
er

041 Power HVDC 3 C20 straight 3 m
529 Cable,3m,3*1.5mm^2,Black, straight male
88 C20SM,227IEC57-1.5^2(3C) female
,HVDC 3SF,China AC PDU
Power 250V16A

041 Power C20 HVDC 3 5 m
525 Cable,5m,3*1.5mm^2,HVDC straight straight
08 3SF,(H05VV- male female
F-1.5mm^2(3C)
+14SJT(3C)),C20SM,PDU

041 Power C20 HVDC 3 10 m
525 Cable,10m,3*1.5mm^2,HVD straight straight
09 C 3SF,(H05VV- male female
F-1.5mm^2(3C)
+14SJT(3C)),C20SM,PDU

Table 3-622 lists the technical specifications of horizontal PDU power cables,
and Figure 3-317 shows the cable structure.

Table 3-622 Technical specifications of horizontal PDU power cables
Par Description Connector Connector Length
t X1 X2
Nu
mb
er

041 Power HVDC 3 HVDC 3 3 m
529 Cable,3m,3*1.5mm^2,Black, straight straight
89 HVDC female male
3SM,227IEC57-1.5^2(3C),H
VDC 3SF,China 380V HVDC
PDU Power Cable

041 Power HVDC 3 HVDC 3 3 m
529 Cable,3m,3*14AWG,Black,H straight straight
90 VDC 3SM,14SJT3(3C),HVDC female male
3SF,American 380V HVDC
PDU Power Cable

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Par Description Connector Connector Length
t X1 X2
Nu
mb
er

041 Power HVDC 3 HVDC 3 3 m
530 Cable,3m,3*1.5mm^2,Black, straight straight
57 HVDC 3SM,H05V2V2- female male
F-1.5mm^2(3C),HVDC
3SF,Europe 380V HVDC
PDU Power Cable

● Technical specifications of socket-type power cables
Table 3-623 lists the technical specifications of socket-type power cables.
Using the power cable with part number 04151963 as an example, the Figure
3-318 shows the cable structure.

Table 3-623 Technical specifications of socket-specific power cables

Par Description Connector Connector Length
t X1 X2
Nu
mb
er

041 Power PI angle HVDC 3 2.5 m
519 Cable,2.5m,3*1.5mm^2,HV male straight
63 DC female
3SF,227IEC53-1.5^2(3C),PIA
M,For China

041 Power HVDC 3 PI angle 3 m
529 Cable,3m,3*1.5mm^2,Black, straight male
86 PIAM,227IEC57-1.5^2(3C), female
HVDC 3SF,China AC Power
250V16A

041 Power HVDC 3 PI angle 5 m
525 Cable,5m,3*1.5mm^2,HVDC straight male
07 3SF,227IEC53-1.5^2(3C),PIA female
M,For China

041 Power Cable,2.5m,HVDC NEMA5-20 HVDC 3 2.5 m
527 3SF,12SJT(3C),NEMA5-20PA P angle straight
19 M,North America AC Power male female
125V20A

041 Power Cable,2.5m,HVDC PG angle HVDC 3 2.5 m
527 3SF,H05VV- male straight
20 F-1.5mm^2(3C),PG female
AM,Britain AC Power Cable
250V13A

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Par Description Connector Connector Length
t X1 X2
Nu
mb
er

041 Power Cable,2.5m,HVDC PF angle HVDC 3 2.5 m
527 3SF,H05VVF-1.5^2(3C),PFA male straight
21 M,Europe AC Power female
250V16A

041 Power Cable,2.5m,HVDC NEMA5-20 HVDC 3 2.5 m
527 3SF,HVCTF-3.5mm^2(3C),N P angle straight
22 EMA5-20PAM,Japan AC male female
Power Cable 125V20A

041 Power Cable,2.5m,HVDC PI straight HVDC 3 2.5 m
527 3SF,H05VV-F male straight
23 2.5mm^2(3C),PI female
SM,Australia AC Power
250V16A

041 Power Cable,2.5m,HVDC PM-III HVDC 3 2.5 m
527 3SF,IS angle male straight
24 694-1.5mm^2(3C),PM- female
IIIAM,India AC Power
250V16A

041 Power Cable,2.5m,HVDC PJ-II HVDC 3 2.5 m
527 3SF,H05VV- straight straight
25 F-1.5mm^2(3C),PJ-II male female
SM,Switzerland AC Power
Cable 250V16A

041 Power Cable,2.5m,HVDC PM angle HVDC 3 2.5 m
527 3SF,H05VV- male straight
26 F-1.5mm^2(3C),PMAM,Sou female
th Africa AC Power
250V16A

041 Power Cable,2.5m,HVDC PB straight HVDC 3 2.5 m
527 3SF,VCTFK3*2.0mm2(3C),P male straight
27 BSM,Taiwan(china) AC female
125V15A

041 Power Cable,2.5m,HVDC PN-I HVDC 3 2.5 m
527 3SF,H05VVF-1.5^2(3C),PN- straight straight
31 ISM,Brazil AC Power male female
250V16A

● Technical specifications of the AC (220 V)/HVDC (240/380 V) power cables
Table 3-624 lists the technical specifications of AC (220 V)/HVDC (240/380 V)
power cables, and Figure 3-319 shows the cable structure.

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Table 3-624 Technical specifications of the AC (220 V)/HVDC (240/380 V)
power cables

Par Description Connector Connector Length
t X1 X2
Nu
mb
er

041 Power 3*OT2.5-8 HVDC 3 3 m
533 Cable,3m,3*2.5mm^2,HVDC straight
31 3SF,227IEC53-2.5^2(3C),3* female
OT2.5-8,380V high voltage
DC PEM dedicated

041 Power 3*OT2.5-8 HVDC 3 20 m
533 Cable,20m,3*2.5mm^2,HVD straight
31- C female
001 3SF,227IEC53-2.5^2(3C),3*
OT2.5-8,380V high voltage
DC PEM dedicated

041 Power 3*OT2.5-8 HVDC 3 25 m
533 Cable,25m,3*2.5mm^2,HVD straight
31- C female
002 3SF,227IEC53-2.5^2(3C),3*
OT2.5-8,380V high voltage
DC PEM dedicated,NO

3.6.5 NE5000E CCC Power Cables

3.6.5.1 DC Power Cables

DC power cables can be used to connect a PDF on the user side to PEMs on the
NE5000E CCC.

Appearance

Figure 3-320 DC power cables

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Figure 3-321 Power cable terminals

Figure 3-322 Heat shrink tubing

Specifications

Install cables based on the actual power distribution distance between the
NE5000E CCC and PDF. Table 3-625 shows the specifications of the DC power
cables.

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Table 3-625 Power cable specifications
Distance Item Specifications Remarks
from the
PDF to
the
Device

Shorter DC power Electronic|Electric Cable,450V/ Blue power cable
than or cable 750V,H07Z-K
equal to UL3386,25mm^2,Blue,138A,LSZ
25 m H Cable,VDE,UL

Electronic|Electric Cable,450V/ Black power cable
750V,H07Z-K
UL3386,25mm^2,Black,138A,LSZ
H Cable,VDE,UL

Power Naked Crimping It is connected to
cable Terminal,OT,16mm^2,M6,Tin the device.
terminal Plating,Naked Ring Terminal

Naked Crimping It is connected to
Terminal,OT,16mm^2,M8,Tin the PDF.
Plating,Naked Ring Terminal

Longer DC power Electronic|Electric Cable,450V/ Blue power cable
than 25 m cable 750V,60227 IEC
and 02(RV),35mm^2,Blue,138A,CCC,
shorter CE
than or
equal to Electronic|Electric Cable,450V/ Black power cable
35 m 750V,60227 IEC
02(RV),35mm^2,Black,138A,CCC
,CE

Electronic|Electric Cable,450V/ Red power cable
750V,60227 IEC
02(RV),35mm^2,Red,138A,CCC,C
E

Power Naked Crimping It is connected to
cable Terminal,OT,25mm^2,M6,Tin the device.
terminal Plating

Naked Crimping It is connected to
Terminal,OT,25mm^2,M8,Tin the PDF.
Plating,Naked Ring Terminal

Longer A PDF or the EOS must be placed close to the device.
than 35 m

3.6.5.2 AC Power Cables Connecting the PDF to the EPS150-4850A
In AC power supply scenarios, the external power EPS150-4850A is required to
convert AC power into DC power and then supply power to the NE5000E CCC. The

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mapping power cables consist of the following: AC power cables connecting the
PDF to the EPS150-4850A and the DC power cables connecting the EPS150-4850A
to the NE5000E CCC. This section describes the AC power cables connecting the
PDF to the EPS150-4850A.

Appearance

Figure 3-323 AC power cable

Figure 3-324 Power cable terminals

Specifications
Table 3-626 shows the specifications of the DC power cables for the NE5000E
CCC.

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Table 3-626 Power cable specifications
Distance Item Specifications Remarks
from the
PDF to
the
Device

Shorter AC power Electronic|Electric Cable,300V/ -
than or cable 500V,60227 IEC
equal to 10(BVV),2x6mm^2,Black(2Cores:
20 m Brown,Blue),46A,Outdoor
Cable,CCC,CE

Power Naked Crimping It is connected to
cable Terminal,OT,6mm^2,M6,Tin the input terminal
terminal Plating,Insulated Ring of the
Terminal,12~10AWG,yellow EPS150-4850A.

Naked Crimping It is connected to
Terminal,OT,6mm^2,M8,Tin the PDF.
Plating,Insulated Ring
Terminal,12~10AWG,yellow

Longer An AC PDF or the EOS must be placed close to the device.
than 20 m

3.6.5.3 DC Power Cables Connecting the EPS150-4850A to the NE5000E CCC
In AC power supply scenarios, the external power EPS150-4850A is required to
convert AC power into DC power and then supply power to the NE5000E CCC. The
mapping power cables consist of the following: AC power cables connecting the
PDF to the EPS150-4850A and the DC power cables connecting the EPS150-4850A
to the NE5000E CCC. This section describes the DC power cables connecting the
EPS150-4850A to the NE5000E CCC.

Appearance

Figure 3-325 DC power cables

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Figure 3-326 Power cable terminal

Figure 3-327 Heat shrink tubing

Specifications
Table 3-627 shows the specifications of the DC power cables for the NE5000E
CCC.

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Table 3-627 Power cable specifications

Distance Item Specifications Remarks
from the
PDF to
the
Device

Shorter DC power Electronic|Electric Cable,450V/ Blue power cable
than or cable 750V,60227 IEC
equal to 4 02(RV),25mm^2,Blue,112A,CCC,
m CE

Electronic|Electric Cable,450V/ Black power cable
750V,60227 IEC
02(RV),25mm^2,Black,112A,CCC
,CE

Electronic|Electric Cable,450V/ Red power cable
750V,60227 IEC
02(RV),25mm^2,Red,112A,CCC,C
E

Power Naked Crimping It is connected to
cable Connector,JG2,25mm^2,M6,Tin the device.
terminal Plating

Naked Crimping It is connected to
Connector,JG2,25mm^2,M6,Tin the output
Plating terminal of the
EPS150-4850A.

Longer ● It is recommended that the EPS150-4850A and NE5000E CCC be
than 4 m placed close to each other.
● If it is hard to place the EPS150–4850A and NE5000E CCC close
to each other, see 3.6.5.1 DC Power Cables for the DC power
cable specifications.

3.6.6 Chassis and Cabinet Ground Cable
This section describes the structure and technical specifications of the chassis and
cabinet ground cable.

3.6.6.1 Introduction

The chassis and cabinet ground cable connect the chassis and cabinet to the
ground. Ensure that the ground cables in the front, back and side panels of the
cabinet are correctly connected before delivery.

3.6.6.2 Structure

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Figure 3-328 Ground cable

The ground cable connector of the chassis and cabinet is the same as that of the
DC-input power cable.

3.6.6.3 Technical Specifications

The technical specifications of the chassis and cabinet ground cable are shown in
Table 3-628.

Table 3-628 Technical specifications of the chassis and cabinet ground cable
Item Description

PGND cable Terminal Naked Crimping Terminal,OT,25mm^2,M6,Tin
Plating,Width Less Than 12.4mm,For OEM

Naked Crimping Terminal,OT,25mm^2,M8,Tin
Plating, Naked Ring Terminal

Naked Crimping
Connector,JG2,25mm^2,M6,150A,Tin Plating,For
OEM

Cable Power cable-450V/750V-227 IEC
type 02(RV)-25mm^2-olivine-110A.

Fireproof class CM.

3.6.7 Console Port Cable
This section describes the structure and technical specifications of the Console port
cable.

3.6.7.1 Introduction

The console cable is used to connect the NE5000E console port to the serial port
of the console device to transmit device configuration data.
The console cable is an 8-core shielded cable. One end of the cable uses an RJ45
connector to connect to the console port of the MPU. The other end has two

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connectors, a DB9 female and DB25 female. Choose the appropriate one to plug
into the computer's serial port.

3.6.7.2 Structure

The Console cable is shown in Figure 3-329 and the pin assignments are shown in
Table 3-629.

Figure 3-329 Console cable

1. Direction A 2. DB25 female 3. Label 4. Network port
connector RJ45
5. Direction B 6. Direction C 7. DB9 female W1 and W2
communication cable

Table 3-629 Pin assignments of the Console cable

RJ45 Direction DB25 DB9 Signal

1 -> 5 8 CTS (Clear to Send)

2 -> 6 6 DSR (Data Set Ready)

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RJ45 Direction DB25 DB9 Signal

3 -> 3 2 RXD (Receive Data)

4 - 7 5 GND

5 - 8 1 GND

6 <- 2 3 TXD (Transmit Data)

7 <- 20 4 DTR (Data Terminal Ready)

8 <- 4 7 RTS (Request to Send)

3.6.7.3 Technical Specifications

Table 3-630 shows the technical specifications of the Console port cable.

Table 3-630 Technical specifications of the Console port cable
Item Description

Connector X1 Cable connector-D style-25PIN-female.

Connector X2 Network interface connector-crystal connector-8PIN-8bit-
shielded plug.

Connector X3 Cable connector-D style-9PIN-female.

Cable type (1) the symmetrical twisted cable-120-ohm-
SEYVPV-0.5mm-24AWG-8core-PANTONE 430U(2) the
symmetrical twisted cable-100-ohm-
SEYVP-0.48mm-26AWG-8core-black.

Number of 8.
cores

Fireproof CM.
class

Available 15 m (49.21 ft.) for 120-ohm cable ,3 m (9.84 ft.) for 100-ohm
length cable.

3.6.8 Clock Cable
This section describes the structure and technical specifications of the clock cable.

3.6.8.1 Introduction

The clock cable is used to connect the NE5000E to the clock interface of the
external equipment. With this cable, the NE5000E can receive two channels of

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2.048 MHz or 2.048 Mbit/s synchronous clocks provided by the upstream device. It
can also offer two channels of 2.048 MHz or 2.048 Mbit/s synchronous clock
signals to the downstream device.
One end of the clock cable uses an SMB connector to connect to the clock
interface on the MPU, and the other end is connected to the external clock
equipment.
There are two types of clock cables:
● 75-ohm clock cable
● 120-ohm clock cable
NO TE
The wire sequence of the relay cable used as a clock cable is different from that used as a
common Ethernet cable.

3.6.8.2 Structure

75-ohm Clock Cable
Figure 3-330 shows the structure of the 75-ohm clock cable.

Figure 3-330 75-ohm clock cable

1. Coaxial connector-SMB 2. Label

NO TE

● The NE5000E provides only the 75-ohm clock. If you need the 120-ohm clock, use a
transfer cable shown in Figure 3-331 and Figure 3-332. Choose the one-channel or
two-channel architecture as required.
● One section of the coaxial cable is a fixed length of 200 mm (7.87 in.) to ensure that
the transfer connector is installed inside or near the equipment.

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One-channel Clock Transfer Cable

Figure 3-331 shows the one-channel clock transfer cable.

Figure 3-331 One-channel clock transfer cable

1. Coaxial connector-SMB-75 ohm-straight/ 2. Main label
plug-female

3. 75-ohm/120-ohm transfer PCB -

Two-channel Clock Transfer Cable

Figure 3-332 shows the two-channel clock transfer cable.

Figure 3-332 Two-channel clock transfer cable

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1. Coaxial connector-SMB-75- 2. Label1:"1#" 3. Main label
ohm-straight/plug-female

4. 75-ohm/120-ohm transit 5. Label3:"1#" 6. Label 4:"2#"
PCB

7. Label 2:"2#" - -

Table 3-631 shows the pin assignments of the two-channel clock transfer cable.

Table 3-631 Pin assignments of the two-channel clock transfer cable

Connector 75-ohm Cable Color 120-ohm Cable

X1 Pin line Blue W3

Shielded layer White

X2 Pin line Blue W4

Shielded layer White

120-ohm relay cable

Figure 3-333 shows the 120-ohm relay cable structure with an RJ45 connector.

Figure 3-333 Structure of the 120-ohm relay cable

The pin assignments of the 120-ohm relay cable are shown in Table 3-632.

Table 3-632 Pin assignments of the 120-ohm relay cable

Connector X1 Connector X2 Relationship

X1.5 X2.2 Pair

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Connector X1 Connector X2 Relationship

X1.4 X2.1

X1.2 X2.5 Pair

X1.1 X2.4

X1.3 X2.7 Pair

X1.6 X2.8

X1.7 X2.3 Pair

X1.8 X2.6

Clock Cable Converter Box

Figure Appearance of the 120-ohm to 75-ohm converter box shows the
appearance of the 120-ohm to 75-ohm converter box.

Figure 3-334 Appearance of the 120-ohm to 75-ohm converter box

The board provides one synchronous clock interface and one synchronous time
interface. The connector on the board is an RJ45 connector. If the peer end uses an
SMB interface connector, a 120-ohm to 75-ohm converter box is required.

3.6.8.3 Technical Specifications

Table 3-633 shows the technical specifications of the 75-ohm clock cable.

Table 3-633 Technical specifications of the 75-ohm clock cable

Item Description

Connector Coaxial connector-SMB plug-75 ohm inline
female

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Item Description

Cable Type Coaxial
cable-75ohm-3.9mm-2.1mm-0.34mm-shield

Diameter of the 3.9mm-2.1mm-0.34mm
protection layer-
Diameter of the
internal insulation-
Diameter of the
internal conductor

Available length 10 m (32.81 ft.), 15 m (49.21 ft.), 20 m (65.62
ft.), and 30 m (98.42 ft.)

Table 3-634 shows the technical specifications of the one-channel 75 ohm
transfer 120 ohm clock cable.

Table 3-634 Technical specifications of the one-channel clock transfer cable
Item Description

Connector Coaxial connector-SMB plug-75 ohm inline
female

75-ohm Type Coaxial cable-75ohm-3.9mm-2.1mm-0.34mm-
cable shield

Diameter of the 3.9mm-2.1mm-0.34mm
protection layer-
Diameter of the
internal insulation-
Diameter of the
internal conductor

120- Type Symmetrical twisted cable -120ohm-
ohm SEYPVPV-0.4mm-26AWG-2 pairs-Pantone
cable 430U

Diameter of the 0.4mm/26AWG
internal conductor

Available length 30 m (98.42 ft.)

Table 3-635 shows the technical specifications of the two-channel 75 ohm
transfer 120 ohm clock transfer cable.

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Table 3-635 Technical specifications of the two-channel clock transfer cable
Item Description

X1/X2 connector Coaxial connector-SMB plug-75 ohm inline
female

75-ohm Type Coaxial cable-75ohm-3.9mm-2.1mm-0.34mm-
cable shield

Diameter of the 3.9mm-2.1mm-0.34mm
protection layer-
Diameter of the
internal insulation-
Diameter of the
internal conductor

120- Type Symmetrical twisted cable -120ohm-
ohm SEYPVPV-0.4mm-26AWG-2 pairs-Pantone
cable 430U

Diameter of the 0.4mm/26AWG
internal conductor

Available length 30 m (98.42 ft.)

Table 3-636 shows the technical specifications of the 120-ohm relay cable.

Table 3-636 Technical specifications of the 120-ohm relay cable
Item Description

120- Connector Network interface connector-8 PIN-8 bit-shielded-
ohm crystal model plug
cable
Type Cable,120ohm,1E1,0.4mm,MP8-
II,120CC4P0.4P430U(S),MP8-II,Expert 2.0

Length 3 m (9.84 ft.), 15 m (49.21 ft.), 30 m (98.42 ft.), 60 m
(196.85 ft.) and 80 m(262.46 ft.)

Table 3-637 shows the technical specifications of the 120-ohm to 75-ohm
converter box.

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Table 3-637 Table 5Technical specifications of the 120-ohm to 75-ohm converter
box
Part Mod Description Connect Connect
Numb el or X1 or X2
er

040268 CAB- Single Cable,120ohm,75ohm Converter RJ45 SMB
14 SMB Box(With SMB Socket
14040127),PCB03022834+Box Body
21210634)

3.6.9 CXP Fiber Optics
The is section describes the structure and technical specifications of CXP fiber
optics.

3.6.9.1 Overview of CXP Fiber Optics

CXP optical fibers are used to connect 400G multi-chassis systems and NE5000E-
X16A 400G CLCs.
CXP2 optical fibers are used to connect 1T and 1.6T multi-chassis systems and
support NE5000E-X16A 1T and NE5000E-20 1.6T CLCs.

3.6.9.2 Structure

CXP
NO TE

CXP optical fibers are made using one of two different materials, which offer the same
specifications but differ in appearance.
CXP optical fibers cannot be deployed across floors.

Figure 3-335 Finisar fiber optic appearance

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CXP2

NO TE

CXP2 optical fibers cannot be deployed across floors.

Figure 3-336 shows the appearance of a fiber optic.

Figure 3-336 Fiber optic appearance

3.6.9.3 Technical Specifications

Table 3-638 lists technical specifications of a CXP fiber optic.

Table 3-638 Technical specifications of a CXP fiber optic

Item Description Unit Remarks

Module
form CXP - -

Number of 12 Tx and 12 Rx - -
lanes

Maximum 126 Gb/s -
data rate

Maximum 10.5 Gb/s -
data rate
per lane

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Item Description Unit Remarks

Typical 10(32.81),30(98.42) m(ft.) -
cable
lengths

Supported Typical applications - -
protocol include Infiniband,
Fibre Channel, 100G
Ethernet, SATA/
SAS3

Electrical 84-pin connector - Pin-out as defined
interface in the CXP
and pin-out Specification by the
IBTA

Standard Multi-mode ribbon - -
fiber optic fiber cable
type assembly, riser-
rated

Maximum 3.5 W -
power
consumptio
n per end

Managemen Serial, I2C-based, - As defined by the
t interface 450 kHz maximum CXP Specification
frequency

Table 3-639 Technical specifications of a CXP2 fiber optic
Item Description Unit Remarks

Module
form CXP2 - -

Number of 12 Tx and 12 Rx - -
lanes

Maximum 300 Gb/s -
data rate

Maximum 25 Gb/s -
data rate
per lane

Typical 10(32.81),20(65.60) m(ft.) -
cable ,30(98.42),60(196.8
lengths 5),100(328.08)

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Item Description Unit Remarks

Supported Typical applications - -
protocol include Infiniband,
Fibre Channel

Electrical 84-pin connector - Pin-out as defined
interface in the CXP
and pin-out Specification by the
IBTA

Standard Multi-mode ribbon - -
fiber optic fiber cable
type assembly, riser-
rated

Maximum 6 to 7 W -
power
consumptio
n per end

Managemen Serial, I2C-based, - As defined by the
t interface 450 kHz maximum CXP Specification
frequency

Table 3-640 Technical specifications of a CXP3 fiber optic
Item Description Unit Remarks

Module
form CXP3 - -

Number of 12 Tx and 12 Rx - -
lanes

Maximum 637.5 Gb/s -
data rate

Maximum 53.125 Gb/s -
data rate
per lane

Typical 10(32.81),30(98.42) m(ft.) -
cable
lengths

Supported Typical applications - -
protocol include Infiniband,
Fibre Channel

Electrical 84-pin connector - Pin-out as defined
interface in the CXP
and pin-out Specification by the
IBTA

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Item Description Unit Remarks

Standard Multi-mode ribbon - -
fiber optic fiber cable
type assembly, riser-
rated

Maximum 13.5 W -
power
consumptio
n per end

Managemen Serial, I2C-based, - As defined by the
t interface 450 kHz maximum CXP Specification
frequency

3.6.10 Optical Fiber
This section describes the structure and technical specifications of the optical fiber.

3.6.10.1 Introduction

Table 3-641 shows the types of fibers that the NE5000E uses.

Table 3-641 Types of optical fibers

No. Cable and Use Local Remote Cable Mode
Connector Connector

1 Fiber LC/PC FC/PC Single-mode
connecting the
local interface
board to the
ODF

2 Fiber LC/PC LC/PC or SC/PC Single-mode /
connecting the multi-mode
local interface
boards

3 Fiber LC/PC LC/PC or SC/PC Single-mode /
connecting the multi-mode
local interface
board to the
other
equipment

4 Fiber MPO/PC MPO/PC Multi-mode
connecting the
local interface
boards

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NO TICE

● The optical transmission module of the multi-transverse mode needs to be
connected to the multi-mode fiber. The optical transmitting module of the
single-longitudinal mode or multi-longitudinal mode needs to be connected to
the single-mode fiber.
● For high-density subcards, you are advised to use the default 2 mm thin optical
fibers delivered by Huawei to facilitate cabling when devices are connected to
the network.

The connectors at both ends are LC/PC-LC/PC, LC/PC-FC/PC, or FC/PC-SC/PC
single-mode fibers. Multi-core fibers (each with a total of eight cores that can be
split into single fibers) can be used on NE5000Es to increase the fiber placement
efficiency.
Figure 3-337 shows the appearance of multi-core fibers.

Figure 3-337 Appearance of a multi-core fiber

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When using multi-core fibers, pay attention to the following points:

● Split each multi-core fiber inside the cabinet into different single-core fibers
at the cable inlet.
● When splitting a multi-core fiber, hold both sides of the fiber with your hands
and gradually tear the fiber with force. Do not over-bend the fiber or tear the
fiber from any intermediate core.

● The eight fibers split from the same multi-core fiber can be installed on
different boards. However, installing the eight fibers in both the upper and
lower chassis in the same cabinet is not recommended.

3.6.10.2 Structure

The NE5000E uses the following types of optical connectors:

● LC/PC optical connector
● SC/PC optical connector
● FC/PC optical connector
● MPO/PC optical connector

The outlines of connectors as well as a brief description of how to plug and
unplug them are described in the following sections.

LC/PC Optical Connector

Figure 3-338 shows the outline of the LC/PC optical connector.

Figure 3-338 LC/PC optical connector

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The plugging/unplugging of an LC/PC optical interface only needs an axial
operation, that is, a push/pull in line with the cable, instead of a rotation.
The operation procedures and precautions are as follows:
● To insert, carefully align the head of the fiber jumper with the optical
interface and push in the fiber using appropriate force.
● To remove, press the clip and slightly push in the fiber connector, and then
pull it out.

SC/PC Optical Connector
Figure 3-339 shows the outline of the SC/PC optical connector.

Figure 3-339 SC/PC optical connector

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FC/PC Optical Connector
Figure 3-340 shows the outline of the FC/PC optical connector.

Figure 3-340 FC/PC optical connector

MPO/PC Optical Connector
Figure 3-341 shows the outline of the MPO/PC optical connector.

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Figure 3-341 MPO/PC Optical Connector

The plugging/unplugging of MPO/PC optical interface only needs an axial
operation, that is, a push/pull in line with the cable, instead of a rotation.
The operation procedures and precautions are as follows:
● To insert, carefully align the head of the fiber jumper with the optical
interface and push in the fiber using appropriate force.
● To remove, press the clip and slightly push in the fiber connector, and then
pull it out.

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MPO/PC-4*DLC/PC Optical Connector

Figure 3-342 MPO/PC-4*DLC/PC,Singlemode Optical Connector

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Figure 3-343 MPO/PC-4*DLC/PC,Multi-mode Optical Connector

The plugging/unplugging of MPO/PC-4*DLC/PC optical interface only needs an
axial operation, that is, a push/pull in line with the cable, instead of a rotation.

The operation procedures and precautions are as follows:

● To insert, carefully align the head of the fiber jumper with the optical
interface and push in the fiber using appropriate force.
● To remove, press the clip and slightly push in the fiber connector, and then
pull it out.

3.6.10.3 Technical Specifications

Table 3-642 and Table 3-643 show the technical specifications of the optical fiber.

Table 3-642 Technical specifications of the optical fiber

Item Description

Fiber transmission mode Single-mode/Multi-mode

Fiber connector 1 LC/PC and SC/PC

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Item Description

Fiber connector 2 LC/PC, SC/PC and FC/PC

Fiber outer diameter 2 mm (0.08 in.)

Table 3-643 Technical specifications of the MPO optical fiber

Item Description

Fiber transmission mode Multi-mode

Fiber connector 1 MPO/PC

Fiber connector 2 MPO/PC

Fiber outer diameter 3.5mm (0.14 in.)

3.6.11 USB-to-Ethernet Cable

3.6.11.1 USB-to-Ethernet Cable

This section describes the structure and technical specifications of the USB-to-
Ethernet cable.

Overview

One end of a USB-to-Ethernet cable is a USB port used to connect to a client, and
the other end is split into two RJ45 connectors used to connect to routers. The two
RJ45 connectors include one standard console port and one non-standard console
port. Pin assignment for the two ports is different. For details, see Table 1.

Appearance

Figure 3-344 Structure of the USB-to-Ethernet cable

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Pin Assignment

Table 3-644 Pin assignment of the USB-to-Ethernet cable

Wire Rela Colo Desc Start Conv End Desc Colo Rela Wire
tion r ripti Pin erter Pin ripti r tion
on on

W3 Pair Whit +5V X1.1 USB X2.6 RS23 Blue Pair W1
e DC to 2_RX
RS23
Blue Data X1.2 2 X2.3 RS23 Whit
- conv 2_TX e
Pair Oran Data X1.3 ersio X2.5 GND Oran -
ge + n ge

Whit GND X1.4 X3.5 RS23 Blue Pair W2
e 2_RX

- - - - - X3.8 RS23 Whit
2_TX e

- - - - - X3.4 GND Oran -
ge

Technical Specifications

Table 3-645 Technical specifications of the USB-to-Ethernet cable

Part Mod Description Conn Conn Leng Nu Fire
Num el ector ector th mbe Ratin
ber X1 X2 r of g
Core
s

0407 - Signal Cable,USB-to- USB- MP8- 1.5 m - -
1851 Ethernet A(Ma II
cable,1.5m,USB- le)
A(Male),CC2P0.48B(S),2*
MP8-II

NO TICE

● To use the USB-to-Ethernet serial cable, download the driver from the website
and configure the driver as required. Download the driver from http://
www.wch-ic.com/search?q=CH340&t=downloads.
● The device uses the W1 cable number and the cable label is RS232.

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3.7 Glossary

A
Asynchronizati Asynchronization does not use the exact data signals timed by
on the clock. The signals have different frequencies and phases.
The asynchronizatioin usually encapsulates the bits into the
control flag, which specifies the beginning and end of the bits.
D
DCE Data Circuit-terminating Equipment is a network device
composing the UNI. DCE provides the physical connection to
the network, forwards the data, and provides the clock signals
for the DTE.
DRAM Dynamic Random Access Memory. The information stored in
the RAM must be refreshed periodically. When the contents of
the DRAM are being refreshed, a user cannot access it. Delay
can occur.
DTE Data terminal equipment is a user device composing the UNI.
The DTE accesses the data network through the DCE
equipment (for example, model) and usually uses the clock
signals produced by DCE.
F
Flash Flash is a kind of special Erasable Programmable Read Only
Memory (EEPROM), which can be erased and rewritten one
time instead of only one byte.
N
NVRAM Nonvolatile Random Access Memory. The data in NVRAM
cannot be lost when the system is Down.
R
RAM Random Access Memory is a memory that can be lost easily,
and read and rewritten by the micro processor.
ROM Read Only Memory is a memory that cannot be lost easily, and
can only be read, but not written by the micro processor.
S
SRAM Static Random Access Memory is a type of random access
memory. Its contents can be saved only if the SRAM is
provided with the uninterruptible power supply. Unlike the
DRAM, the SRAM does not need to be refreshed repeatedly.

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3.8 Acronyms and Abbreviations

A
AC Alternating Current
ATM Asynchronous Transfer Mode
AUX Auxiliary (port)
C
CAN Control Area Network
CE1 Channelized E1
CF Compact Flash
CLK Clock Card
CPU Central Processing Unit
CT1 Channelized T1
CTS Clear to Send
D
DC Direct Current
DCE Data Circuit-terminating Equipment
DSR Data Set Ready
DTE Data Terminal Equipment
DTR Data Terminal Ready
E
EMC Electro Magnetic Compatibility
F
FAD Fabric Adapter
FC Patch Cord (Connector + Fiber)
FCB Fan Control Board
FPIC Flexible Plug-in Card
G
GND Ground
I
IEC International Electrotechnical
Commission

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L
LC Lucent Connector
LPU Line Processing Unit
M
MPU Main Processing Unit
N
NEG Negative
NVRAM Non-Volatile Random Access Memory
O
ODF Optical Distribution Frame
OFL Offline
P
PC Personal Computer
PCB Printed Circuit Board
PCS Physical Coding Sublayer
PGND Protection Ground
PMD Physical Medium Dependent
R
RJ45 Registered Jack 45
RTS Request to Send
RXD Receive Data
S
SC Square Connector
SDRAM Synchronous Dynamic Random Access
Memory
SFU Switch Fabric Unit
SMB Sub-miniature B
SSD solid state disk
T
TXD Transmit Data
U
UART Universal Asynchronous Receiver/
Transmitter

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UTP Unshielded Twisted Pair
V
VRP Versatile Routing Platform

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4 Hardware Installation and Parts
Replacement

4.1 Cabinet Quick Installation Guide
4.2 Installation Guide
4.3 Parts Replacement

4.1 Cabinet Quick Installation Guide
N68E Cabinet Installation Guide

N610E Cabinet Installation Guide

A68 Cabinet Installation Guide

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A610 Cabinet Installation Guide

4.2 Installation Guide

4.2.1 Safety Precautions

This document provides safety precautions for installing, operating, and
maintaining the device.

4.2.1.1 Alarm and Safety Symbols

When installing or maintaining the device, strictly follow the precautions indicated
by alarm and safety symbols on the device to prevent personal injury and device
damage. This section describes the alarm and safety symbols on the device and
their meanings.

Alarm and Safety Symbols and Their Meanings

Table 4-1 lists the alarm and safety symbols on the device and their meanings.

Table 4-1 Alarm and safety symbols on the device and their meanings

Symbol Description

ESD Protection Symbol
Indicates that the device is static-sensitive.

Chassis Grounding Symbol
Indicates the position of a grounding
terminal. If the device is installed in a 19-
inch cabinet, it is recommended that you
use the grounding point indicated by this
symbol.

Chassis Grounding Symbol
Indicates the position of a grounding
terminal. If the device is installed in a
cabinet other than the 19-inch cabinet, it is
recommended that you use the grounding
point indicated by this symbol.

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Symbol Description

Fan Warning Symbol
Indicates hazardous moving parts. Keep
your fingers and other body parts away
from fan blades when the fan is running.

Operation Warning Symbol
Indicates precautions for handling a power
supply board.

Overheat Warning Symbol
Indicates scalding and overheat risks.

4.2.1.2 General Safety Precautions
This section describes safety precautions for selecting measuring and testing
instruments during the installation, operation, and maintenance of the device.

Safety Precautions
To ensure human and device safety, follow all safety precautions indicated by
symbols on the device and those provided in this document.
The "CAUTION", "WARNING", and "DANGER" sections in this document are
supplements to universal safety precautions and do not represent all safety
precautions.

Local Laws and Regulations
Follow local laws and regulations when performing operations on the device. The
safety precautions provided in this document are only supplements to the local
safety regulations.

General Installation Requirements
Personnel who plan to install, operate, or maintain the device need to receive a
thorough training, understand all necessary safety precautions, and be able to
correctly perform all operations.
● Only trained and qualified personnel are permitted to install, operate, and
maintain the device.
● Only qualified personnel are permitted to remove safety facilities and
overhaul the device.
● Only personnel authenticated or authorized by Huawei are permitted to
replace the device or its parts (including software).

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● Any fault or error that might cause safety problems must be reported
immediately to a supervisor.

Grounding Requirements
The following requirements apply only to devices that need to be grounded:

● When installing the device, connect the grounding cables first; when removing
the device, disconnect the grounding cables at last.
● Ensure that the grounding conductor is intact.
● Do not perform operations on the device before the grounding conductor is
installed.
● The device must always be connected to the protection ground (PGND).
Check the electrical connections of the device before performing operations
on the device, and ensure that the device is properly grounded.

Personal Safety
● Do not perform operations on the device or adjust cables during
thunderstorms.
● In a thunderstorm, disconnect the AC power connector and avoid using any
fixed terminals or touching any terminals or antenna connectors.

NO TE

The preceding requirements apply to fixed wireless station terminals.
● To avoid electric shocks, do not connect safety extra-low voltage (SELV) circuit
terminals to telecommunication network voltage (TNV) circuit terminals.
● Do not look into an optical port without eye protection. Otherwise, the laser
radiation may injure your eyes.
● Always take precautions against ESD whenever you perform operations on the
device. For example, wear an ESD coat, a pair of ESD gloves, or an ESD wrist
strap, and remove conductive objects like jewelry and watch. Otherwise, you
may get an electric shock or burn.
● In case of fire, leave the building or site where the device is located, and press
the fire alarm button or dial the fire emergency telephone number. Do not
enter the building on fire again in any case.

Device Safety
● Before any operation, ensure that the device is fixed firmly on the floor or any
other stable object, such as a wall or installation rack.
● When the device is running, ensure that the ventilation vent is not blocked.
● When installing a panel, use a tool to tighten the screws.
● After installing the device, remove the packing materials from the equipment
area.

Condensation Prevention
● Before installing the equipment, ensure that no condensation is on the
equipment. Otherwise, the equipment may fail to be powered on.

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● If the indoor and outdoor temperature difference is 15°C or more, wait eight
hours after moving devices to the equipment and then install them.
● Generally, when the outdoor humidity is greater than 80% RH and the indoor
and outdoor temperature difference is greater than 5°C, condensation forms.
In highly humid weather, before installing a device or board, you are advised
to remove the package inside an equipment room and check whether
condensation forms as follows: Touch the surface of the device or board with
dry fingers or ESD gloves to check whether water marks exist. If they do,
condensation forms, and the device or board must be kept in the equipment
room for 8 hours before being powered on.

NO TE

If the temperature difference is undetermined, wait one night before installing the
equipment.

4.2.1.3 Electrical Safety

This section describes safety precautions for high voltage, thunderstorms, high
leakage current, power cables, fuses, and electrostatic discharge.

High Voltage

DANGER

● Direct contact with a high-voltage power source or indirect contact through
damp objects can be fatal.
● Non-standard and incorrect high-voltage operations may result in fire, electric
shock, or other accidents.

Thunderstorm

This requirement applies only to wireless base stations or devices with antenna
feeders.

DANGER

High voltage and AC-related operations, or operations on a mast or steel tower
are prohibited during a thunderstorm.

High Leakage Current

CA UTION

To ensure personal and device safety, ground the device before powering it on.

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If a high leakage current symbol is labeled near the power terminal of the device,
ground the protection ground terminal before connecting it to an AC input power
supply. Otherwise, you may get an electric shock caused by leakage current.

Power Cables

DANGER

Do not install or remove power cables when the power is on. Transient contact
between the core of a power cable and a conductor may generate electric arcs or
sparks that can cause fire and hurt human eyes.

● Power off the device before installing or removing power cables.
● Confirm that the label on a power cable is correct before connecting the
power cable.

Fuses

CA UTION

If a fuse needs to be replaced, ensure that the new fuse is of the same type and
specification.

Electrostatic Discharge

NO TICE

The static electricity generated by human bodies may damage the electrostatic-
sensitive components, such as large-scale integrated (LSI) circuits, on boards.

● Static electromagnetic fields resulting from conditions such as human body
movement, friction between the body and clothes, friction between shoes and
the floor, and contact with plastic articles do not disappear before electric
discharge.
● To prevent the device and its electrostatic-sensitive components (such as
circuit boards and ASICs) from being damaged by the static electricity of
human body, wear an ESD wrist strap that is properly grounded before
touching them.
Figure 4-1 shows how to wear an ESD wrist strap.

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Figure 4-1 Wearing an ESD wrist strap

4.2.1.4 Precautions for Connecting a Computer to the Device
This section describes safety precautions for selecting measuring and testing
instruments during the installation, operation, and maintenance of the device.

Maintenance Terminal that Can Be Grounded (Desktop Computer)
A desktop maintenance terminal has a metal shell. Before connecting a desktop
maintenance terminal to a monitored device, you are advised to add an auxiliary
ground cable between them to enhance the equipotential connection. Figure 4-2
shows the grounding of a desktop maintenance terminal.

Figure 4-2 Schematic diagram for grounding a desktop maintenance terminal

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NO TE

On the maintenance terminal side, connect the auxiliary ground cable to the metal shell of
the terminal. You can connect the cable to a screw on the metal shell.
On the monitored device side, try to connect the auxiliary ground cable to the ground
terminal on the device or the supporting stand nearby first. If the two ground terminals are
unavailable, connect the auxiliary ground cable to the protection ground bar nearby in the
equipment room.
It is advisory to use a three-core power cable that contains a PE wire as the AC power cable
for the maintenance terminal. Collect the AC power cable to the AC power socket in the
equipment room.

Maintenance Terminal that Cannot Be Grounded (Portable Computer)

A maintenance terminal that does not have a metal shell, such as a portable
computer, cannot directly establish an equipotential connection with a monitored
device. In this case, take the following measures:

● After the portable computer is powered on and powered by batteries inside
the computer, use a cable to connect the computer to the monitored device.
● Wait for the connection between the maintenance terminal and monitored
device to be established and both of them enter the debugging state.
● If the portable computer has low battery and needs to be supplied with
external AC power after the preceding steps are complete, try to connect the
portable computer to the AC power socket used by the monitored device first.
If this is impossible, connect the portable computer to an AC power socket
located elsewhere in the equipment room.

4.2.1.5 Inflammable Environment

This section describes precautions for safe operating environments.

DANGER

Do not place the device in an environment that has inflammable and explosive air
or gas. Do not perform any operation in such an environment.

Any operation on electronic devices in a flammable environment may cause a
severe hazard.

4.2.1.6 Batteries

This section describes safety precautions for handling VRLA batteries and lithium
batteries.

4.2.1.6.1 VRLA Batteries

This section describes the precautions for handling VRLA batteries.

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DANGER

Before handling VRLA batteries, ensure that you have read the safety precautions
carefully and understand connection methods for VRLA batteries.

● Inappropriate handling of VRLA batteries may cause hazards. When handling
VRLA batteries, avoid short-circuits and electrolyte overflow or leakage.
● Electrolyte overflow may damage the device, as it can corrode metal parts
and ultimately cause board damage.
● A VRLA battery contains a great deal of energy. Inappropriate operations may
cause a short-circuit, resulting in serious personal injuries.

Preventive Measures

When installing and maintaining VRLA batteries, pay attention to the following:

● Use special insulated tools.
● Wear an eye protector and take effective protection measures.
● Wear rubber gloves and a protective suit to prevent hazards caused by
electrolyte overflow.
● When carrying a VRLA battery, ensure that its electrodes are upward. Avoid
leaning or reversing the battery.
● Switch off the power supply during battery installation and maintenance.

Battery Short Circuit

DANGER

A battery short circuit may cause personal injuries. Although the voltage of an
ordinary VRLA battery is low, the instantaneous high current caused by a short-
circuit releases a surge of energy.

Avoid any battery short-circuits caused by metal objects. If possible, disconnect the
battery in use before performing other operations.

Harmful Gas

NO TICE

Do not use unsealed VRLA batteries. Place and secure VRLA batteries horizontally
to prevent device inflammation or corrosion due to flammable gas emitted from
the batteries.

VRLA batteries in use can release flammable gas. Take ventilation and fireproofing
measures at sites where VRLA batteries are used.

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Battery Temperature

NO TICE

High battery temperature may result in battery distortion, damage, and electrolyte
overflow.

When the battery temperature is higher than 60°C, check whether electrolyte
overflows. If electrolyte overflows, take proper measures promptly.

Battery Leakage

NO TICE

When the electrolyte overflows, absorb and neutralize the electrolyte immediately.

Pay attention to personal safety when moving batteries with electrolyte leakage.
In the case of an electrolyte overflow, immediately use the following substances to
neutralize and absorb the leaked electrolyte:

● Sodium bicarbonate (baking soda): NaHCO3

● Sodium carbonate (calcined soda): Na2CO3
Follow instructions provided by related battery vendors when using these
materials for absorption and neutralization.
If you are exposed to the battery electrolyte accidentally, immediately rinse with
clean water and seek medical care if the situation is serious.

4.2.1.6.2 Lithium Batteries
This section describes safety precautions for handling lithium batteries.

CA UTION

Using lithium batteries of an incorrect type may cause explosion.

● Replace a used lithium battery with one of the same type or a substitute
recommended by the manufacturer.
● Dispose the used battery according to instructions from the manufacturer.
● Do not throw lithium batteries into fire.

4.2.1.7 Radiation
This section describes safety precautions for electromagnetic exposure and lasers.

4.2.1.7.1 Electromagnetic Exposure
This section describes safety precautions for electromagnetic exposure.

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CA UTION

Radio-frequency signals with high intensity are harmful to human body.

Before installing or maintaining an antenna on a tower or mast with a large
number transmit antennas, contact the related personnel to shut down these
antennas.
A working base transceiver station (BTS) produces electromagnetic radiation
(radiation hazard). Read the suggestions for safe operations before installing and
performing operations on a BTS. Comply with the local regulations when installing
a BTS.

4.2.1.7.2 Forbidden Areas
This section describes requirements for forbidden areas.
● Antennas must be installed in areas where the electromagnetic radiation level
is allowed to exceed the maximum permissible exposure limits (PELs) and
where the public have no access.
● Before entering such an area, determine where the electromagnetic radiation
is beyond the specified range and ask the related personnel to shut down the
transmitters. A forbidden area may not exist. If it exists, it should be within 10
meters away from antennas.
● A physical barrier and an eye-catching warning sign must be posted in each
forbidden area.

4.2.1.7.3 Lasers
This section describes safety precautions for lasers.

CA UTION

When handling optical cables, do not look into optical ports without eye
protection.

Laser transceivers are used in optical transmission systems and associated test
tools. The laser emitted by bare optical fibers or connector ports has a high power
density and is invisible to naked eyes. Directly looking into optical ports without
eye protection will cause eye injuries.
Generally, looking at an exposed optical fiber terminal or a damaged fiber from a
distance of more than 150 mm does not cause eye injuries even without eye
protection. If you, however, look at an optical fiber terminal using an optical
instrument, such as a microscope, magnifier, or eye loupe, eye injuries may occur.

Safety Instructions for Lasers
Follow these instructions to avoid laser radiation hazards:
● Ensure that all operations are performed by authorized personnel who have
competed required training courses.

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● Wear a pair of eye-protective glasses when handling lasers or optical fibers.
● Switch off the optical source before disconnecting optical fiber connectors.
● Do not look at the terminal of an exposed optical fiber or an open connector
when you are not sure whether the optical source is switched off or not.
● Use an optical power meter to measure the optical power and ensure that the
optical source is switched off.
● When opening the front door of an optical transmission system, protect
yourself against laser radiation.
● Do not use an optical instrument, such as a microscope, magnifier, or eye
loupe, to look at optical fiber connectors or terminals.

Instructions for Fiber Handling
Follow these instructions before handling fibers:
● Optical fibers must be cut and spliced by trained personnel.
● Before cutting or splicing an optical fiber, ensure that the fiber is disconnected
from the light source. After disconnecting an optical fiber, cap the fiber
connectors.

4.2.1.8 Working at Heights
This section describes safety precautions for working at heights.

CA UTION

When working at heights, take proper measures to prevent objects from falling.

The instructions for working at heights are as follows:
● Take required training courses before working at heights.
● Carry operation machinery and tools safely and prevent them from falling
down.
● Take safety measures, such as wearing a helmet and a safety belt.
● Wear warm clothes when working at heights in cold areas.
● Confirm that the hoisting equipment are in good condition before working at
heights.

4.2.1.8.1 Hoisting Heavy Objects
This section describes safety precautions for hoisting heavy objects during the
installation, operation, and maintenance of the device.

CA UTION

Do not walk under the arm or lifted object when a heavy object is being lifted.

● Ensure that the personnel for operating hoisting machinery have taken
required training courses and obtained qualifications.

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● Ensure that the hoisting tools to be used are complete and in good condition.
● Ensure that the hoisting tools are fixed to a fixture or wall with good weight-
bearing capacity.
● Issue orders with short and explicit words to avoid misoperation.

Ensure that the angle formed by two cables does not exceed 90°, as shown in
Figure 4-3.

Figure 4-3 Hoisting a heavy object

4.2.1.8.2 Using Ladders

This section describes safety precautions for using ladders.

Checking Ladders
● Confirm that a ladder is in good condition before using it.
● Ensure that you know the maximum weight that the ladder can support.
Avoid overweighting the ladder.

Placing Ladders

Maintaining a slant angle of 75° for the ladder is recommended, as shown in
Figure 4-4. You can measure the gradient of the ladder with a right angle ruler or
with arms. To prevent the ladder from sliding, place the wider feet of the ladder at
the bottom, or take protective measures on the base part of the ladder. Ensure
that the ladder is placed securely.

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Figure 4-4 Slanting a ladder

Climbing Ladders
When climbing a ladder, follow the following instructions:
● Ensure that the gravity center of your body does not deviate from the ladder
edge.
● Before performing any operations, keep your balance on the ladder to reduce
risks and ensure safety.
● Do not climb higher than the fourth highest step (counted top down) of the
ladder.
If you want to climb up a roof, ensure that the vertical height between the ladder
and the roof is no less than one meter, as shown in Figure 4-5.

Figure 4-5 Vertical height between the ladder top and the roof being one meter

4.2.1.9 Mechanical Safety
This section describes safety precautions for drilling holes, handling sharp objects,
handling fans, and carrying heavy objects.

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Drilling Holes

CA UTION

Do not drill holes on the cabinet without permission. Drilling holes that do not
meet the requirements may affect the electromagnetic shielding performance and
damage cables inside the cabinet. In addition, if the metal filings fall into the
cabinet, circuit boards may encounter short-circuits.

● Before drilling holes on the cabinet, move away cables inside the cabinet first.
● During the drilling, wear a pair of eye-protective glasses to prevent eye
injuries caused by flying metal filings.
● Wear protective gloves when drilling holes.
● Take measures to prevent metal filings from falling into the cabinet. After
drilling holes, clean up the metal filings in a timely manner.

Sharp Objects

CA UTION

When carrying a device by hands, wear protective gloves to avoid injuries by sharp
objects.

Fans
● When replacing a component, place the component, screws, and tools
properly to prevent objects from falling into running fans. Otherwise, the fans
and devices will be damaged.
● When replacing parts near a fan, keep your fingers and parts away from fan
blades before the fan is powered off and stops running.

Carrying Heavy Objects

When carrying heavy objects, wear protective gloves to prevent your hands from
injury.

CA UTION

● Before carrying a heavy object, well prepare yourself to avoid injury.
● When pulling out the chassis from the cabinet, pay attention to the unstable or
heavy devices installed on the cabinet to prevent injury.

● Generally, two persons are required to carry a chassis. Do not carry a heavy
chassis by yourself. When carrying a chassis, stretch your back and move
stably to avoid getting strained.

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● When moving or lifting a chassis, hold the handles or the bottom of the
chassis. Do not hold the handles of the modules, such as power modules, fan
modules, and boards, installed in the chassis.

4.2.1.10 Others
This section describes the safety precautions for inserting and removing boards,
binding signal cables, and routing cables at a low temperature.

Inserting and Removing Boards

NO TICE

Before installing a board, wear an ESD wrist strap or a pair of ESD gloves. Handle
the board gently to avoid distorting pins on the backplane.

● Insert the board along the guide rail.
● Keep board circuits from contacting with each other to avoid short-circuits
and scratches.
● Do not touch circuits, components, connectors, or wiring grooves with bare
hands. Otherwise, electrostatic discharge generated by human body will
damage sensitive components.

Binding Signal Cables

NO TICE

Bind signal cables separately from high-current or high-voltage cables.

Routing Cables
At an extremely low temperature, violent shocks or vibrations may result in cracks
in the plastic cable sheath. To ensure safety, follow the following requirements:
● When installing cables, ensure that the ambient temperature is above 0°C.
● If cables are stored in a place where the temperature is below 0°C, move and
keep these cables in a place with room temperature for over 24 hours before
routing.
● Handle cables gently, especially in a low-temperature environment. Do not
perform any inappropriate operations, for example, directly pushing cables
down from vehicles.
4.2.2 Preparing for the Installation
Before installing the hardware, prepare the technical documents, tools and meters,
arrange for experienced installation engineers, check the installation environment,
and perform the unpacking check.

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4.2.2.1 Preparing before Construction

This section describes the technical documents, tools and meters that need to be
available before the installation. It also describes the skills that the installation
engineers must possess, and the requirements that the installation engineers must
meet.

4.2.2.1.1 Preparing Technical Documents

Technical documents are a vital prerequisite for installing a cabinet successfully.
They are also the important information to be referred to during the installation.

● On-Site Survey Report. It is filled by the Huawei survey engineer during the
on-site survey.
● Other documents related to the engineering include the Contract Agreement
and the Packing List. They are provided by Huawei Technologies Co., Ltd. to
the customer when the device is delivered.

4.2.2.1.2 Preparing Tools and Meters

The owner of installation needs to arrange the tools and meters for hardware
installation.

Context

Tools Preparation

Diagonal pliers Phillips screwdriver Flat-head screwdriver

Heat gun
Adjustable wrench Marker

Ladder Multimeter ESD gloves

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ESD wrist strap Utility knife Wire stripper

Wire clippers RJ45 crimping tool Power cable crimping
tool

- -

Hydraulic pliers

Installation Related Material
1. PVC black insulation tape
2. Tie wrap
3. Binding tape
4. Heat shrink tube
5. Corrugated pipe
6. Label

4.2.2.1.3 Qualification of Installation Engineers

Installation engineers must possess the basic knowledge of safe operation. They
should receive the related training, should understand how to operate correctly,
and acquire corresponding operation qualification.

When arranging the installation engineers to perform this activity, the customer
needs to pay attention to the following points:

● The installation engineer must have been trained and certified by Huawei and
must understand the methods of installing and commissioning the system.
The installation engineer must obtain a qualification certificate before
installing and commissioning the device.
● The technical engineer of the customer must have received the basic training
conducted by Huawei and must understand the related methods of
installation and construction.

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● The number of installation engineers should be based on the specific
engineering schedule and the installation environment. In general, arrange for
three to five installation engineers.

4.2.2.2 Checking the Installation Environment
This section describes the requirements for the installation environment.

4.2.2.2.1 Checking the Equipment Room Structure
The construction, structure, heating and ventilation, power supply, lighting, and
fire control must meet the environment requirements of the device and also
comply with the local standards and regulations.
Check that the equipment room meets the following requirements:
● The minimum height of the equipment room, the distance between the
beams or ventilation pipe and the floor, must not be less than 3 m (9.84 ft.).
● The floor in the equipment room must be semi-conductive and dust-proof. An
antistatic movable floor is recommended. The movable floor must be stable
and the horizontal tolerance in each square meter must be less than 2 mm
(0.08 in.). If a movable floor is unavailable, use static electricity conductive
floor material, with a volume resistivity ranging from 1.0 x 107 ohm•m to 1.0
x 1010 ohm•m. The static electricity conductive floor material or the movable
floor must be grounded. You can connect the floor material or movable floor
to the grounding unit by using the current limiting resistor and connection
line. The resistance of the current limiting resistor is 1 megohm.
● The door and windows must be equipped with dust-proof plastic sealing
tapes. It is recommended to use double-layer glass windows and seal them
tightly.
● The walls can be processed using wallpaper or flat paint. Do not use
pulverized paint.
● Cable troughs must be available. The inner side of the cable troughs must be
smooth. The length and width of the cable troughs, and the number, position
and dimensions of the cable holes must comply with the requirements for
installing the device.
● Do not lay water supply pipes, drainpipes, or storm sewers across the
equipment room. Do not install a fire hydrant inside the equipment room.
Install the fire hydrant in the corridor or near a staircase so that it can be
accessed quickly.
● Air conditioners are positioned so that they do not blow air directly at the
device.

4.2.2.2.2 Checking the Equipment Room Environment
To ensure good working conditions for the device, take related measures so that
the equipment room environment meets the requirements for proper device
operation.
Check that the equipment room environment meets the following requirements:
● The lighting system, including main lighting, backup lighting and emergency
lighting must meet anticipated requirements.

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● The water supply and drainage systems must comply with the fire control
regulations.
● The air-conditioning system must be able to maintain appropriate
temperature and humidity conditions in the equipment room.
● The fire control facilities must be intact and function normally.
● The earthquake-resistance level of the equipment room must meet
anticipated requirements.
● The floor in the equipment room must be sturdy enough to support the
cabinets.

4.2.2.2.3 Checking the Power Supply Systems in the Equipment Room
Power supply systems, including AC power supply, DC power supply, and storage
batteries, in the equipment room must meet the anticipated requirements.

Check that the power supply systems in the equipment room meet the following
requirements:

● The AC power supply facilities must be complete. The AC power supply must
meet the anticipated requirements. Besides the AC power lead-in wires, a
diesel generator that supplies standby power must also be available.
● The DC power distribution unit must meet the anticipated requirements and
the voltage must be stable. The power output must be within the specified
range.
● Batteries with sufficient capacity must be available to ensure uninterrupted
running of the device during a power failure.

4.2.2.2.4 Checking the Grounding
Good grounding ensures that the device works steadily and protects against
lightning and interference. Before the installation, ensure that the grounding
conditions meet the anticipated requirements.

Checking the Grounding in the Equipment Room
Check that the following grounding requirements are met in the equipment room:

● The equipment room must be equipped with lightning-proof devices, such as
a lightning arrester.
● The ground of lightning-proof devices and the protection ground of the
equipment room must be connected to the same ground busbar.
● The ground resistance of the equipment room or the communication office
(site) must not exceed 10 ohms, and must comply with national and industry
standards.

Checking the Grounding of the Power Supply Device in the Equipment Room
Check that the power supply device meets the following grounding requirements:

● The working ground and protection ground of the power supply device must
be connected to the same ground busbar as the protection ground of the
communication device. When the power supply device and the

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communication device are installed in the same equipment room, the two
devices must be connected to the same protection ground bar.
● The -48 V DC output positive terminal (+24 V DC output negative terminal) of
the power supply device must be connected to the nearest ground terminal.

NO TE

● If only one protection ground bar is available in the equipment room, both the
PGND and BGND cables of the power supply device must be connected to this
ground bar.
● If two ground bars are available in the equipment room (a protection ground bar
and a working ground bar), the PGND and BGND cables of the power supply
device must be connected to the protection ground bar and the working ground
bar respectively. The two ground bars must be connected to the same ground
busbar.

Checking the Grounding of the Device

Check that the device meets the following grounding requirements:

● Protection grounding must be implemented on communication devices and
the accessory devices (mobile base stations, switches, and power devices) in
the equipment room. The PGND cables of various devices in the
communication office (site) must be connected to the ground busbar.
● The -48 V (or +24 V) power cable and the RTN cable that are routed out from
the power input terminals of the device must be connected to the -48 V (or
+24 V) busbar and the RTN busbar of the PDU that is provided and used by
the customer.
● The PGND cable that is routed out from the main ground terminal of the
device must be connected to the nearest protection ground bar.

Checking the Grounding of Signal Cables

Check that signal cables meet the following grounding requirements:

● A shielded cable or a cable with metal jacket is recommended for the signal
cable that is routed in to or out from the site. The free line in the cable must
be grounded in the equipment room.
● The shielded layer, metal jacket, or metal tube of the cable that is routed in to
the site must be connected to the nearest protection ground bar in the
equipment room.

4.2.2.2.5 Checking Other Facilities

In addition to checking the building, environment, power supply, and grounding
conditions of the equipment room, you also need to check other facilities at the
installation site.

The check requirements are as follows:

● The maintenance and monitoring room must be clean and tidy.
● An electrostatic discharge (ESD) PC workbench must be used and must be
located in the position as defined in the floor plan for the equipment room.

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● The maintenance terminal and the accessory devices must be correctly
identified and intact. The installation positions of these devices must comply
with the design requirements.

4.2.2.3 Environmental Requirements for Device Operation
This chapter describes the environmental requirements for device operation,
including the requirements for the environment of the equipment room and power
supply.

4.2.2.3.1 Requirements for Selecting a Site for Equipment Room
When designing a project, you should consider the communication network
planning and the technical requirements of the equipment. You should also
consider hydrographic, geological, seismic, power supply, and transportation
factors.
Construction, structure, heating and ventilation, power supply, lighting and fire
prevention of the equipment room should be designed by specialist construction
designers according to the environment requirements of the equipment. The
equipment room should also follow the relevant industrial, environment
protection, fire prevention, and civil defense regulations.
The equipment room should be located at a place free from high temperatures,
dust, toxic gases, explosive materials, or unstable voltage. Also ensure that the
equipment room is located away from sources of large vibrations, loud noises, and
power stations.
The specific requirements for selecting a site for equipment room are as follows:
● The room should be located at a distance of at least 5 km (3.11 mi.) from
heavy pollution sources such as smelteries and coal mines. It should be
located at a distance of at least 3.7 km (2.30 mi.) from medium pollution
sources such as chemical, rubber, and galvanization factories. It should be
located at a distance of at least 2 km (1.24 mi.) from light pollution sources
such as food processing factories. If these pollution sources cannot be
avoided, ensure that the equipment room is upwind of the pollution sources
and take extra measures to prevent the pollution from affecting the
equipment room.
● The room should be located away from livestock farms, or, if unavoidable,
upwind of the livestock farms. Do not use an old livestock room or fertilizer
warehouse as the equipment room.
● The air vent of the room should not be located near to the output of any
sewage works. Ensure that the equipment room is correctly pressurized so
that corrosive gasses are not drawn into the room.
● The room should be located away from industrial and heating boilers.
● You are recommended to locate the room in or above the second floor. If this
requirement cannot be met, the ground for equipment installation in the
room should be at least 600 mm (23.62 in.) above the maximum flood level
in the local record. The room should be at an altitude of lower than 3000 m
(118.11 in.).
● The room should be at least 3.7 km (2.30 mi.) away from the sea and salt
lakes. If this is not possible, the equipment room should be airtight with

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cooling facilities. In addition, alkalized soil cannot be used as the construction
material. If this is not possible, the equipment must be suitable for use in wet
conditions.
● The equipment room should be strong enough to resist strong wind and
downpours.
● The room should be located away from large sources of dust or sand. If this is
unavoidable, the doors and windows of the equipment room must face away
from the source of dust or sand.

4.2.2.3.2 Equipment Room Layout

An equipment room typically houses mobile switching equipment,
telecommunications equipment, power supply equipment, and other auxiliary
equipment. To facilitate maintenance and management, place equipment in
different rooms. Figure 4-6 shows the plane layout of an equipment room.

Figure 4-6 Layout of an equipment room

The general layout rules for an equipment room are as follows:
● It should meet requirements for laying out and maintaining communication
cables and power cables.
● Cabling distance should be minimized to simplify maintenance, reduce
potential communication faults, and enhance overall efficiency.
● Different types of cables — such as AC power, DC power, RF, ground,
transmission, and control cables — must be bundled and routed separately in
a neat and tidy manner, avoiding overlapping or entanglement. Additionally,
ground cables must be kept at least 30 mm away from other types of cables,
such as power or optical cables.

4.2.2.3.3 Construction Requirements for the Equipment Room

Table 4-2 lists the construction requirements for the equipment room.

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Table 4-2 Construction requirements for the equipment room
Item Requirements

Area The area of the equipment room should be large enough to
accommodate not only the current equipment but also
equipment that is expected to be added in the future.

Height The minimum height of the equipment room indicates the
height below the beam or the ventilation pipe. The minimum
height of the equipment room should not be less than 3 m (9.84
ft).

Floor The floor in the equipment room must be semi-conductive and
dust-proof. A raised ESD floor is recommended. Make sure that
the raised floor tiles are fitted together tightly and that the
raised floor is sturdy. The horizontal tolerance of each square
meter should be less than 2 mm (0.08 in.). If raised floors are
unavailable, use static electricity conductive floor material, with
a volume resistivity of 1.0 x 107 ohms to 1.0 x 1010 ohms.
Ground the static electricity conductive floor material or raised
floor so that the static electricity can be conducted. You can
connect the floor with the ground unit using the current limiting
resistor and connection line. The resistance of the current
limiting resistor is 1 megohm.

Load-bearing NE5000E X16A, NE5000E CCC larger than 550 kg/m2
capacity
NE5000E CCC-A larger than 600 kg/m2 (0.85 bf/in2).
NE5000E-20 larger than 680 kg/m2 (0.96 bf/in2).

Door and The door of the equipment room should be 2 m (6.56 ft) high
windows and 1 m wide. One door is enough. Seal the doors and windows
with dust-proof plastic tape. Install the windows with double-
layer glass and ensure that they are sealed properly.

Wall surface Cover the walls with wallpaper or paint the walls with flat paint,
treatment but do not use pulverized paint.

Grooves Use grooves to arrange cables. The inner side of the grooves
must be smooth. The reserved length and width of the grooves,
and the number, position, and dimensions of the holes must
comply with the requirements of router arrangement.

Water pipe Service pipes, drainpipes, and storm sewers should not pass
through the equipment room. A fire hydrant should be in the
corridor or near the staircase. Do not place a fire hydrant in the
equipment room.

Internal Separate the area where the equipment is installed from the
partition wall equipment room door. The partition wall helps prevent dust
getting in.

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Item Requirements

Installation Install the air conditioner that it does not blow air directly onto
position of the device.
the air
conditioner

Other Do not use insulation materials that contain sulfur or chlorine.
requirements Polyethylene Foam (PEF) is recommended.
Ensure that the equipment room is free from fungus, mold, and
any other micro-organisms that may harm the equipment. Also
ensure that no rodents, such as mice, have access to the
equipment room.

Figure 4-7 Internal partition wall inside the equipment room

4.2.2.3.4 Requirements for Handling Corrosive Gases

The room must be free from corrosive gases, such as SO2, H2S, and NH3. Table
4-3 lists the requirements for corrosive gas concentrations. For details, see the
indoor requirements specified in the GR-63 standard.

Table 4-3 Requirements for corrosive gas concentrations

Chemically
Active
Substance Unit Concentration

SO2 ppb ≤ 50

H2S ppb ≤ 40

NH3 ppb ≤ 500

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Chemically
Active
Substance Unit Concentration

Cl2 ppb ≤ 5

Take the following measures to ensure that the preceding requirements can be
met:
● Avoid constructing the equipment room near a place where there is a high
concentration of corrosive gases, such as a chemical plant.
● Ensure the air intake vent of the room is always upwind of the pollution
source, and is far away from any sewers.
● Use environmental protection decoration materials. For example, use the
Polyethylene Foam (PEF) to replace the rubber and plastic foam.
● Do not place batteries together.
● Monitor the corrosive gas concentrations regularly.

4.2.2.3.5 Requirements for Mechanically Active Substance

The equipment room should be free from explosive, conductive, magnetism-
permeable, and corrosive dust. Table 4-4 lists the requirements for concentration
of the mechanically active materials in the equipment room.

Table 4-4 Concentration of mechanically active materials

Mechanically
Active
Material Unit Concentration

Sand mg/m3 ≤ 300

Suspending mg/m3 ≤ 0.4
dust

Dust deposit mg/(m2h) ≤ 15

To meet these requirements, take the following measures in the equipment room:

● Use dustproof materials on the ground, wall, and ceiling of the equipment
room.
● Install screens for outdoor doors and windows, and use dustproof materials
for outer windows.
● Clean the equipment room, especially the air filters once every three months.
● In areas with heavy dust, you are advised to clean the equipment once a
year(Invite professional companies to do so).
● Wear shoe covers and ESD clothes before entering the equipment room.

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4.2.2.3.6 Requirements for ESD Prevention
The absolute value of electrostatic voltage must be less than 1000 V. To achieve
this, take the following measures:
● Train operators on ESD prevention.
● Keep proper humidity in the equipment room to reduce the impact of static
electricity.
● Lay out ESD flooring in the equipment room.
● Put on ESD shoes and clothing before entering the equipment room.
● Use ESD tools, such as wrist straps, tweezers, and pullers.
● Ground all conductive materials in the room, including computer terminals.
Use ESD worktables.
● Keep non-antistatic materials (such as common bags, foams, and rubbers) at
least 30 cm (0.98 ft) away from boards and ESD-sensitive components.

4.2.2.3.7 Electromagnetism Requirements for the Equipment Room
Electromagnetic interference can come from the equipment itself or from an
outside source. Electromagnetic interference negatively affects capacitance
coupling, inductance coupling, electromagnetic wave radiation, and common
impedance (including grounding system) coupling. To prevent the interference,
you should:
● Take effective measures against electricity net interference interfering with
power supply systems.
● Do not use the working ground of the equipment together with the
grounding or lightning protection grounding device of the power equipment.
Separate them as far as possible.
● Keep the equipment away from strong power wireless launchers, radar
launchers, and any other high-frequency and high-current equipment.
● Use electromagnetic shielding if necessary.

4.2.2.3.8 Requirements for Lightning-Proof Grounding
Table 4-5 lists the requirements for lightning-proof grounding.

Table 4-5 Requirements for lightning-proof grounding
Item Requirements

Construction Use reinforced concrete for the construction of the equipment
room.
Install a lightning-proof device like a lightning rod in the room.
The lightning-proof ground must be connected to the same
ground busbar as the protection ground of the room.

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Item Requirements

TN-S power Use a special power transformer for the telecommunication
system site. Use a metal jacket or steel tube to cover the power cables
before burying them under the ground. Ground both ends of
the metal jacket or steel tube nearby. Less than 15 m (49.21
ft) of the metal jacket of steel tube should be buried.
Install a gapless zinc oxide arrester to each of the three phase
lines at the low-voltage side of the AC power transformer. The
enclosure of the transformer, the neutral lines at the low-
voltage side, and the metal steel tubes of the power cables
that are connected to the enclosure of the transformer should
all be grounded nearby.

Lightning Do not route the AC/DC power cables in/out the
arresters for communications site overhead.
power cables After the AC low-voltage power cables are led into the room,
install the lightning arrester for the power cables in the AC
voltage stabilizer and the AC power distribution panel (box).
Ground the arrester nearby.
After the DC power cable is led into the equipment room from
outdoors, install a power lightning protection device for the DC
power cable. The lightning protection device should be
grounded in proximity.
For the equipment room in a city, install the power supply
arrester with a nominal discharging current of no less than 20
kA. For the equipment room built in the suburbs subject to
lightning strikes, install the power supply arrester with a
nominal discharging current larger than 60 kA. For the
equipment room in a mountainous area subject to lightning
strikes, or in a detached high-rise building in a city, install a
power supply arrester with the nominal discharging current
larger than 100 kA.
The ground cable of the lightning arrester should be a
maximum of 1 m long.

DC power Connect the DC working ground (positive pole of the -48 V DC
distribution power supply or the negative pole of the 24 V DC power
grounding supply) with the indoor collective ground cable nearby. The
ground cable should meet the maximum load of the
equipment.
The power equipment must have a BGND cable, which can
connect the power equipment to the collective ground cable of
the telecommunication site (or the protection ground bar of
the equipment room).

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Item Requirements

Equipotential Ground the devices and auxiliary devices, such as mobile base
bonding station, transmission, switching equipment, power supply
equipment, and cable distribution frame, in the equipment
room. Connect all protection ground cables to the collective
protection ground bar. Connect all protection ground cables in
one equipment room to one protection ground bar.
Apply joint grounding to the working ground and protection
ground of devices, which means the two share one grounding
network.
The cabling tray, rack or shell, metal ventilation pipe, metal
door or window of the equipment should be grounded for
protection.

General Do not connect the neutral line of the AC power cable with the
requirements protection ground of any telecom equipment in the equipment
for grounding room.
Do not install a fuse or switch on the ground cable.
All ground cables should be as short as possible, and should
not be coiled.

Grounding The grounding resistance must be lower than 1 ohm.
resistance The upper end of the ground busbar should be at least 0.7 m
(2.30 ft) over the ground. In cold areas, bury the ground
busbar below the frozen ground.
Measure the grounding resistance periodically to ensure
effective grounding.

Routing of Do not arrange the signal cables overhead in the equipment
signal cables room. All signal cables must be led into the site underground.
Use cables with a metal jacket or place them in a metal pipe if
they go into or come out of the equipment room.
Keep the ground cable of the lightning arrester as short as
possible. Ground any idle lines inside the cable in the
equipment room.

Collective Use a ground ring or ground bar for the collective ground
ground cable cable.
Do not use aluminum cables as ground cables. Adopt
measures to prevent electrification corrosion when connecting
different metal parts together.
Use a copper busbar with a cross-sectional area not less than
120 mm2 as the collective ground cable, or use galvanized flat
steel of the same resistance. Insulate the collective ground
cable from the reinforcing steel bars of the building.

Grounding The grounding lead-in should be a maximum of 30 m (98.42
lead-in ft) long. Use galvanized flat steel with cross-sectional area of
40 x 4 mm (0.16 in.) or 50 x 5 mm (0.20 in.).

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4.2.2.3.9 Requirements for Power Supply

This section describes the requirements for the power supply.

Requirements for AC Power Supply

An AC power supply that consists of mains electricity, uninterruptible power
supply (UPS), and self-supplied electric generator set can be used as an integrated
power supply. The AC power supply must feature simple connection line, safe
operation, flexible scheduling, and easy maintenance in addition to meeting the
requirements of site load.

Low voltage power should adopt three-phase five-wire mode or monophase three-
wire mode. Low voltage of AC power should be 110 V/127 V/220 V/380 V, and the
frequency is 50 Hz.

UPS is required as the AC potential power, and it should be the same phase as the
mains. The switching time of the UPS and mains should be less than 10 ms;
otherwise, the device will reboot or reset.

The working current and fault current of the device should be taken into account
when calculating the power distribution capacity in the equipment room. Ensure
that independent AC power protects independent devices. Configure the current
capacity of the protection switch of the equipment room to be higher than that of
the device.

Table 4-6 provides the voltage ranges of AC power for the device.

Table 4-6 Voltage range of AC power

Item Requirements

AC power capacity to -10% to +5% of the rated voltage
support the device

AC power capacity to -15% to +10% of the rated voltage
support the power
modules and important
buildings

AC frequency -4% to +4% of the rated voltage

Voltage waveform sine Within 5% of the rated current
distortion rate

The self-supplied electric generator set for a telecommunication office is an
automated generator set that must provide standard interfaces, use
telecommunication protocols, support remote communication and remote
management, and feature automatic input, removal, and supply.

AC power cables should accord with the following specifications:

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● AC neutral uses the conductor with the same cross section as the phase line.
● AC wires are non-flammable. The layout of AC wires complies with local
regulations. Low-voltage power distribution rooms comply with local
regulations.

Recommendations for AC Power Supply
The following lists several recommendations for AC power supply.
● If the power voltage of the mains, which supplies power for the device
directly, exceeds the rated voltage by -10% to 5%, or exceeds the voltage
range that the device can support, a voltage regulating device or voltage
stabilizing device is required.
● If the mains does not supply power for the device directly, and the mains
voltage exceeds the rated voltage by -15% to 10%, or exceeds the voltage
range that the DC power supply device allows AC to input, a voltage
regulating device or voltage stabilizing device is required.
● A UPS power supply system or inverter power supply system is required to
prevent interruption or surge of AC power supply.
● When an abnormality occurs on the mains, the telecommunication office
should be equipped with a self-supplied electric generator set as a power
supply to prevent power supply interruption. The capacity should be 1.5 to 2
times the capacity that ensures uninterrupted AC power.
● Storage batteries are usually installed in parallel connection of two groups.
UPS storage batteries are generally installed in one group. UPS can adopt a
serial or parallel connection to provide the required redundancy. When an
inverter or a UPS is used, the active inverter is determined by the maximum
power and a backup inverter is required.

Requirements for DC Power Supply
The telecommunication site should receive stable and reliable DC power supply.
Deploy the power equipment near the telecom equipment so that the DC feeder is
as short as possible. To reduce power consumption and installation costs, the loop
voltage drop from the battery port to the equipment port should be less than 3.2
V.
For a communication site with heavy traffic or with more than two switching
systems, two or more independent power supply systems are required.
For a large-scale communication site, multiple power supply systems are
configured on different floors to supply power to different equipment rooms. For a
common communication site with medium traffic, a centralized power room or
battery room is configured. You can also use a distributed power supply. Use the
integrated power supply for an office with light traffic. Prevent the corrosive gas
released by the battery from corroding the circuit board.
Table 4-7 lists the specifications for DC power.

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Table 4-7 Specifications for DC power
Item Requirements

Range of the -38 V to -72 V
-48 V input
voltage

DC power Greater than 1.5 times the rated current
capacity to
support the
surge current

Regulated If the AC input voltage is in the range of 85% to 110% of the
voltage rated value and the load current is in the range of 5% to 100%
precision of the rated value, the output voltage of the rectifier is an
integer in the range of -46.0 V to -56.4 V, with the regulated
voltage precision equal to or lower than 1%.

Overshoot Integral value of the DC output voltage ±5%
amplitude of
switch on/off

Peak-to-peak ≤ 200 mV
noise voltage

Dynamic The recovery time is less than 200 ms. The overshoot is in the
response range of the integral value of the DC output voltage ±5%.

Recommendations for DC Power Supply
The following lists several recommendations for DC power supply.
● Adopt a dispersed power supply. Use multiple DC power supply systems and
set power equipment in multiple positions.
● Adopt the standard DC power supply system, and set the output voltage of
the communications equipment to be within the required range.
● Improve the reliability of the AC power supply system, and reduce the
capacity of storage batteries. For the small offices, add the capacity of storage
batteries if it is difficult to enhance the reliability of the AC power supply
system.
● The total capacity of the high-frequency switch rectifier must satisfy the
power of the communication loading and battery charging. Configure the
backup rectifier modules. If there are 10 or fewer active modules, configure
one backup module. If there are more than 10 active modules, configure one
backup module for every 10 active modules.
● Install the storage batteries in two or more groups. The capacity is
determined by the duration that the storage batteries supply power to the
load. For most offices, the batteries should be able to supply power for one
hour at least.
● Positive (RTN) power cables must be routed in a separate layer from negative
(NEG) power cables, with multiple layers alternating between carrying
positive and negative power cables, as shown in Figure 4-8.

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Figure 4-8 Requirements for Routing Power Cables in the Equipment Room

Requirements for HVDC Power Supply

Communication sites require stable and reliable DC power supply. Deploy the
power equipment near the telecom equipment to make the DC feeder as short as
possible.

For a communication site with heavy traffic or with more than two switching
systems, deploy two or more independent power supply systems.

For a large-scale communication site, deploy multiple power supply systems on
different floors to supply power to different equipment rooms. For a common
communication site with medium traffic, use a centralized power room or battery
room. You can also use distributed power supply. Use integrated power supply for
a communication site with light traffic. Prevent the corrosive gas released by the
battery from corroding the circuit board.

When an HVDC device is being operated (with device doors open), all HVDC
components of the device must be protected, preventing operation and
maintenance personnel from unintentionally touching bare HVDC components.

Routers do not have any PDU and the cable length is 2.5 m. The customer needs
to provide the corresponding PDU with a 16 A wall-mounted PI angle male
connector or PDU-type C19/C20 connector.

Currently, the 240 V DC power cables of routers support three types of connectors:
OT terminal, PI male connector, and C20 straight male connector. 380 V power
supply supports only OT terminals, and 240 V power supply supports all the three
types of connectors.

Table 4-8 lists requirements for HVDC power supply.

Table 4-8 Requirements for HVDC power supply

Item Indicator

Range of the 192 V to 288 V
240 V input
voltage

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Item Indicator

Range of the 260 V to 400 V
380 V input
voltage

Output current The output current of a single channel is not less than 14 A.

Master/backup The output power of the equipment room must have both
power supply master and backup power supplies.

Output An HVDC circuit breaker or fuse must be used.
protection

Recommendations for HVDC Power Supply
The suggestions for HVDC power supply are as follows:
● Adopt distributed power supply. Use multiple DC power supply systems and
set power equipment in multiple positions.
● Improve the reliability of the AC power supply system and reduce the capacity
of storage batteries. For small communication sites, add the capacity of
storage batteries if it is difficult to enhance the reliability of the AC power
supply system.
● Install the storage batteries in two or more groups. The capacity is
determined by the duration when the storage batteries supply power to the
load. For most communication sites, the batteries should be able to supply
power for at least one hour.
● It is recommended that an upstream HVDC power distribution cabinet provide
the insulation monitoring function.
● For an HVDC device, the neutral wire, live wire, and PGND cable must be
isolated to meet insulation requirements.
● HVDC floating output is required. That is, DC high-resistance grounding must
be implemented, and the positive and negative ground resistance must be
greater than 2 Mbit/s.
● The HVDC power cables that can be touched must be double-layer insulation
cables with dual protection.
● When the device is being operated (with device doors open), prevent common
tools (screwdrivers) from touching components with energy hazards.
● Power connectors include standard plugs and sockets (such as C14/C20) as
well as customized connectors. If a connector is hot-pluggable, the connector
should be able to suppress the arc generated during the hot-plugging and
prevent plastic burning and even fires.
● If an AC PM is inserted into an HVDC device, ensure that there is no security
risk after the insertion.
● When you use a pluggable connector to remove a PM or board, do not touch
the connector's conductor to avoid dangerous voltage.
● Do not connect the positive and negative poles of a power input connector
reversely, or ensure that there is no risk or damage to the device when the
poles are connected reversely.

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4.2.2.4 Unpacking and Checking the Products
This section describes the procedure and precaution for unpacking and checking
the products after the engineering is started.

4.2.2.4.1 Checking the Package Container
Before unpacking and checking the products, check whether the package
container is intact.

Procedure

Step 1 Unload the products.

NO TICE
When unloading the products, place the package containers in order. Make sure
that the product labels on the package containers are in the same direction. This
facilitates the checking.

Step 2 After unloading the products, check whether the total number of the products are
the same as the number indicated on the Packing List. Check whether the
destination of delivery is the same as the actual site for installation.

Condition Action

The total number of products are the Perform step 4.
same as the number indicated on the
Packing List, and the products are
delivered to the correct destination.

The total number of products are Perform step 3.
different from the number indicated
on the Packing List, or the products
are delivered to the wrong destination.

Step 3 The engineering supervisor must send the Cargo Inspection Feedback Form that is
confirmed and signed by the customer to the order management engineer in the
local Huawei representative office within three days. At the same time, stop
unpacking the products.

Step 4 Check whether the exterior of the package container is intact. Check whether the
package container is placed correctly during transportation.

Condition Action

The external package is intact. Unpack and check the products.

The exterior of the package container Perform step 5.
is seriously damaged or shows signs of
water penetration.

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Step 5 Stop unpacking the products, trace the cause, report the problem to the order
management engineer of the local Huawei representative office, and wait for
further assistance.

NO TICE
To protect the device and trace the cause, transfer the unpacked device indoors to
ensure proper storage. Take photographs of the storage site, the device that is
rusted or corroded, the related package container, and the package materials.
Collect the photos and file them. Preserve the package container and package
materials that are unpacked.

----End

4.2.2.4.2 Unpacking and Checking the Device
Wooden cartons are typically used to pack heavy goods such as racks, cabinets,
and batteries. The packaging for a cabinet includes wooden panels, steel edges,
tongue pieces, and foam wrap angles. Before unpacking, move the packing box
into or near the equipment room (if space permits) to avoid damaging the cabinet
during transportation.

Prerequisites

NO TICE

● When moving or lifting the cabinet, use both hands to hold sturdy parts such
as brackets or major frames. Do not apply force to weaker parts such as the
cable support or the cable fixing beam. Otherwise, the cabinet may get
damaged or accidents may occur. Remove the lining boards of the rack at the
installation site to avoid damaging signal cables or boards while moving or
lifting the cabinet.
● If there is a NO IMPACT label affixed to the wooden carton, check whether the
label has turned red. It is a specialized label that uses color changes in the
monitoring tube to indicate whether the package has been subjected to
significant impact forces. If the label is not red, you do not need to check the
device. If the label is red, check whether the device is damaged and record the
damage in the handling list.
● The wooden carton must be positioned correctly. Do not place it upside down,
as doing so may severely damage the device.

Procedure

Step 1 Wear protective gloves.
Step 2 Lay the wooden carton flat on the ground, ensuring that the side with the pallet
faces downward.
Step 3 Insert one end of the wrench into the hole of a tongue piece, and then turn the
wrench to straighten it, as shown in Figure 4-9. You can also use a screwdriver or
a claw hammer to straighten the tongue piece.

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Figure 4-9 Straightening a tongue piece

1 Steel edge 2 Wooden panel

3 Tongue piece 4 Ejector lever

NO TICE

The edges of a tongue piece are sharp. Take preventive measures to avoid hand
injuries.

Step 4 After straightening all the tongue pieces on the cover, lift and remove the cover, as
shown in Figure 4-10.

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Figure 4-10 Lifting and removing the cover

Step 5 Straighten the tongue pieces securing side boards, and then remove the side
boards, as shown in Figure 4-11.

Figure 4-11 Removing other wooden boards from the wooden cartoon

Step 6 Stand the cabinet upright, and remove the wooden pallet, foam corner protectors,
and packaging bag.

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NO TICE

Three to five persons are required to stand the cabinet upright. Otherwise, the
cabinet may topple and cause personal injury.

Step 7 Check the cabinet according to the following requirements:
● Check the appearance of the cabinet. Ensure that its exterior (especially the
bottom) is intact and free from water penetration, distortion, and rust.
● Check the cabinet door. Ensure that it can be opened and closed normally.
● Check the surface of the cabinet. Ensure that it is clean and tidy, and the
external paint is intact.
● Check the labels on the cabinet. Ensure that they are correct, legible, and
complete.

----End

4.2.2.4.3 Unpacking the Box Containing the Carton and Wooden Tray

Space permitting, carry the carton into or near the equipment room before you
unpack it. This can prevent the chassis from being damaged when moved without
protective packaging.

Prerequisites

NO TICE

● The carton cannot stand strength. To move a carton, use the pallet trunk to
move the wooden tray under the carton.
● The wooden case must be positioned correctly. Do not place the wooden case
upside down. Otherwise, the device can get damaged severely.
● Check the tiltwatch label. If the tiltwatch turns red, the carton was tilted during
delivery. If the device in the carton is damaged in this case, the delivery party
should be responsible for the damage.

Procedure

Step 1 Wear protective gloves.

Step 2 Place the wooden case in an even manner on the ground, and make sure that the
side with the pallet faces downwards.

Step 3 Cut all wrapping tapes using knives or scissors.

Step 4 Remove the top of the carton, as illustrated by (1) in Figure 4-12.

Step 5 Open the carton, as illustrated by (2) in Figure 4-12.

Step 6 Remove the two foamed plastic materials from the chassis top, as illustrated by
(3) and (4) in Figure 4-12.

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Step 7 Separate the chassis from wooden tray using a socket wrench, as illustrated by (5)
in Figure 4-12.

Step 8 Remove the fixed component at the bottom of the chassis using a Phillips
screwdriver.

Figure 4-12 Unpacking

Step 9 Check the cabinet according to the following requirements:

NO TICE
Four to five persons are required to stand the cabinet. When standing the cabinet,
prevent the cabinet from tipping over, as this may cause injury to the personnel
who are handling it.

● Check the appearance of the chassis. Ensure that the exterior (especially the
bottom) of the chassis is intact, free from water penetration, distortion, and
rust.

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● Check the surface of the chassis. Ensure that the surface of the chassis is
clean, neat and completely painted.
● Check the labels on the chassis. Ensure that the labels on the chassis are
correct, legible and complete.

----End

4.2.2.5 Checking the Boards

This section describes how to check boards and provides guidelines for handling
them

Before installing the boards, ensure that the chassis and cabinet are clean. Wear
an antistatic wrist strap and remove the board from the antistatic package. Then,
check whether the moisture-sensitive test paper in the ESD box is normal, whether
the board name is consistent with the identifier on the package box, and whether
any board is damaged or any component is missing.

Check that the pins on the backplane of the chassis are straight, orderly, and
clean. Repair any bent pins in the board slots on the backplane.

The boards are sensitive to ESD. When handling them, observe the following
guidelines:

● Ground the equipment according to grounding requirements.
● Wear an antistatic wrist strap during the installation.
● Ensure that the metal tab of the wrist strap makes good contact with your
bare skin. Insert the other end of the wrist strap into the ESD jack on the
device.
● Ensure that the wrist strap functions correctly. Its resistance value must be
between 0.75 megohm and 10 megohm. If the service life (usually two years)
of the wrist strap expires or the resistance value fails to meet requirements,
replace it with another one.
● Avoid your clothes coming into contact with the board because static
electricity from them is beyond the protection scope of the wrist strap.
● Keep the board and other ESD-sensitive parts to be installed in antistatic bags
prior to installation. Place the removed boards and components on an
antistatic pad or other antistatic materials. Do not use non-antistatic
materials such as white foam, common plastic bags, or paper bags to pack
boards or let them touch boards.
● Wear an antistatic wrist strap when operating the ports of boards because
they are also ESD-sensitive. Discharge the static electricity of cables and
protective sleeves before connecting them to the ports.
● It is recommended that you reserve some packaging materials (such as
vacuum-formed boxes and antistatic bags) in the equipment room for later
use.

4.2.2.6 Inspecting and Cleaning Optical Fiber Connectors and Adapters

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4.2.2.6.1 Overview

This topic introduces the purpose and procedure of cleaning optical fiber
connectors, as well as polluters to optical fiber connectors.

Cleaning fiber connectors is to remove dust or other dirt to avoid performance
degradation of optical transmission systems.

Figure 4-13 shows an optical fiber connector.

Figure 4-13 Optical fiber connector

Optical fiber connectors should be free of:

● Dust
● Grease (usually brought by hands)
● Condensate residue
● Powder (evaporated residue of water or solvent)

Dust is the most common dirt in optical fiber connectors. The dust particles that
can be seen only by a microscope can affect the quality of optical signals,
deteriorate the system performance, and cause instability in network operation.

A 1-micrometer dust particle on the single-mode fiber connector can block 1%
light and cause 0.05 dB attenuation. A 9-micrometer dust particle that cannot be
seen by human eyes can block an entire fiber core. Therefore, small dirt even that
cannot be seen by human eyes should be removed.

NO TE

Before you connect any optical component, make sure that you have checked and cleaned
the component.

4.2.2.6.2 Protection of Optical Fiber Connectors

This topic describes requirements for fiber connector protection.

The requirements are as follows:

● All boards with optical ports must be packed properly, to avoid mechanical
and electrostatic damages and to reduce vibrations.
● The protective caps must be put in an ESD bag.

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● Protective caps must be installed on all optical fiber connectors when not in
use. The optical fiber connectors must be stored in proper packages to keep
them clean.
● Figure 4-14 shows the recommended protective caps, whereas Figure 4-15
shows the protective caps not recommended.

Figure 4-14 Protective caps recommended

Figure 4-15 Protective caps not recommended

NO TE

The protective caps not recommended are made of soft rubber, which are apt to absorb
dust and sundries, and difficult to clean.

4.2.2.6.3 Tools, Equipment, and Materials
Optical connectors should be cleaned using recommended tools, equipment and
materials.
The following provides the recommended tools, equipment and materials:

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● Optical power meter
● 400X fiber microscope (A video fiber microscope is recommended.)
● Cassette cleaner
● Cleaning solvent (Isoamylol is preferred, propyl alcohol is the next, and
alcohol or formalin is forbidden.)
● Non-woven lens tissue, fiber cleaning tissue, and dustfree cloth (Non-woven
lens tissue is recommended.)
● Special compressed air
● Special cleaning roll
● Dustfree absorbent swab (made of medical cotton or long fiber cotton)
shown in Figure 4-16 and Figure 4-17

Figure 4-16 Dustfree absorbent swabs for cleaning the SC and FC connectors

Figure 4-17 Dustfree absorbent swabs for cleaning the LC connectors

4.2.2.6.4 Inspecting Optical Fiber Connectors

This topic describes how to inspect the end face of optical fibers using a fiber
microscope.

Tools, Equipment, and Materials

The following provides the required tools, equipment and materials for inspecting
optical fiber connectors:

● Optical power meter
● 400X fiber microscope (A video fiber microscope is recommended.)

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Precautions

CA UTION

Laser energy is invisible and may cause eye injuries. Never look directly into fiber
connectors or ports.
Use a fiber microscope equipped with a safety device or a desktop video fiber
microscope when inspecting the optical fiber connectors.

NO TICE

Electrostatic discharge is hazardous to the electronic equipment. Wear an ESD
wrist strap and ensure that the strap is grounded properly before touching the
equipment and boards, to protect the static-sensitive components against
electrostatic discharge of the human body. Otherwise, the equipment may be
damaged or the service may be interrupted.

Procedure
1. Shut down the laser and disconnect the fiber end before inspecting the fiber
connector.
2. Test the optical power using a power meter to ensure that the laser is shut
down.
3. Use a fiber microscope to check whether the fiber connector is contaminated
or damaged. See the examples below.
– Clean fiber and face
Figure 4-18 shows an image of a clean fiber end face under the fiber
microscope.

Figure 4-18 Clean fiber and face

– Damaged fiber end face
Figure 4-19 shows images of the damaged fiber end face. The image on
the left shows a severely damaged fiber. Severely damaged fibers can

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cause damage to the equipment and should not be used. The image on
the right shows a defective fiber. If the output power is within a certain
range, the defective fiber might not cause any damage to the equipment.
If the output power is unstable or out of the range, however, the
defective fiber can cause damage to the equipment.

Figure 4-19 Damaged or defective fiber end face

NO TE

Figure 4-19 shows only the 800-micrometer fiber cores.
For details on acceptable and unacceptable fibers, see Figure 4-20, Figure
4-21 and Figure 4-22.

Figure 4-20 Clean fiber end face

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Figure 4-21 Acceptable fibers with imperfections

Figure 4-22 Unacceptable fibers with imperfections

4. If any dirt is detected, clean the optical fiber connector. For details, see
"Cleaning Optical Fiber Connectors Using the Cassette Cleaner" and "Cleaning
Optical Fiber Connectors Using Lens Tissue".
5. If any damage is detected, replace the fiber.

4.2.2.6.5 Inspecting the Optical Fiber Link
This section describes the insertion loss and reflection requirements of optical links
and the method of checking the quality of optical links for the application of 50G
optical modules with the PAM4 coding technology.

Tools, Equipment, and Materials
Tools and instruments for checking optical fiber links are as follows:
● OTDR meter
● Fiber microscope

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Precautions

CA UTION

Because the transmit optical power of the OTDR meter is much higher than the
damaged optical power threshold at the receive end, the optical fiber must be
removed from the optical module when the OTDR meter is used to test the optical
path quality.

Currently, the Ethernet port rate is increasing. Since the 50G optical module link
uses the PAM4 encoding technology, there are higher requirements on the optical
fiber and cable quality and the link is more sensitive to multipath reflection
interference of signals. If the fiber link connector, fiber section, or fiber splicing
surface is dirty, optical signals are reflected back and forth on the fiber link,
causing interference due to co-channel noise on the receive side. As a result, the
optical link is unstable or intermittently disconnected.

According to the national standard (GBT50312-2016), the loss of the optical fiber
link connector must meet the requirements described in Table 4-9.

Table 4-9 Maximum attenuation of the optical fiber connector

Type Maximum attenuation of an optical fiber
connector (dB)

Fiber splicing connector 0.3

Optical mechanical connector 0.3

Optical connector 0.75

NO TE

Fiber cores are connected through connectors, such as the ODF, optical attenuator, and
flange, in splicing and mechanical modes.

Table 4-10 describes requirements for the reflection of the optical fiber connector
when Ethernet ports (such as 50G) use PAM4 encoding to double the rate. More
connectors bring lower requirements for the reflection.

Table 4-10 Maximum reflection of connectors

Number of Maximum Reflection of Each Connector (dB)
Optical Fiber
Connectors 50GBASE-FR 50GBASE-LR 50GBASE-ER

1 -25 -22 -19

2 -31 -29 -27

4 -35 -33 -32

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Number of Maximum Reflection of Each Connector (dB)
Optical Fiber
Connectors 50GBASE-FR 50GBASE-LR 50GBASE-ER

6 -38 -35 -35

8 -40 -37 -37

10 -41 -39 -39

Procedure
1. After the optical fiber at the peer end is disconnected, use the OTDR meter to
test the local end. Check whether the loss and reflection of each link and
node are normal. (The loss of a fiber splicing connector should be less than
0.3 dB, the loss of a connector should be less than 0.75 dB, and the reflection
of a connector should be less than -30 dB.) If the test result is not within the
required range, process the abnormal port.
2. Locate the equipment room where the port resides based on the distance
between abnormal points in the OTDR test result. Preliminarily determine the
port location, disconnect the port, and perform an OTDR test on the port that
reports alarms. Check whether the distance is consistent with that in the
previous test. If not, continue to test other ports.
3. After the abnormal port is found, test the port using a fiber microscope. If the
port is dirty, clean it. For details, see "Inspecting and Cleaning Optical Fiber
Connectors and Adapters".
4. After the port is cleaned, restore the port, and ensure that the connector is
tightened. Perform an OTDR test on the port to check whether loss and
reflection of each link and node are normal.
5. If the fault persists, replace the flange and perform an OTDR test on the port
that reports alarms to check whether loss and reflection of each link and
node are normal.
6. If the fault persists, replace the optical fiber and perform an OTDR test on the
port that reports alarms to check whether loss and reflection of each link and
node are normal.
7. If multiple abnormal points exist on the link, repeat steps 2 to 6.

4.2.2.6.6 Cleaning Optical Fiber Connectors Using the Cassette Cleaner

This topic describes how to clean the fiber connectors using a cassette cleaner.

Prerequisites

Before cleaning, inspect the fiber end face with a fiber microscope or a magnifier
to confirm the degree of fiber contamination. Clean the fiber only when it is
severely contaminated. This is because the cleaning operation itself may introduce
dust, dirt, or cause damage to the fiber.

The following procedure provides the steps to clean the fiber connectors using
cartridge type cleaners.

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Tools, Equipment, and Materials
The following lists the required tools, equipment and materials for cleaning optical
fiber connectors:
● cassette cleaner
● Optical power meter
● 400X fiber microscope (A video fiber microscope is recommended.)

Precautions

CA UTION

Laser energy is invisible and may cause eye injuries. Never look directly into fiber
connectors or ports.

NO TICE

Electrostatic discharge is hazardous to the electronic equipment. Wear an ESD
wrist strap and ensure that the strap is grounded properly before touching the
equipment and boards, to protect the static-sensitive components against
electrostatic discharge of the human body. Otherwise, the equipment may be
damaged or the service may be interrupted.

Procedure
1. Shut down the laser and disconnect the fiber end before inspecting the fiber
connector.
2. Test the optical power using a power meter to ensure that the laser is shut
down.
3. Press down and hold the lever of the cassette cleaner. The shutter slides back
and exposes a new cleaning area.
4. Place the fiber end face gently against the cleaning area.
5. Drag the fiber end face gently on one cleaning area in the arrow direction
each time. Do it again on the other cleaning area in the same direction as the
first time once.

NO TICE

Do not drag the fiber end face on the same cleaning area more than once.
Otherwise, the connector can be contaminated or damaged.

6. Release the lever of the cassette cleaner to close the cleaning area.
7. Use a fiber microscope to inspect the fiber to check whether there is any dirt.
For details see the examples shown in "Inspecting Optical Fiber Connectors".
If the fiber end face is still dirty, repeat 1 to 6.

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8. Connect the fiber to the optical port immediately. If it is not used for the time
being, put a protective cap on it.
9. Turn on the laser after connecting the fiber to the board.

4.2.2.6.7 Cleaning Optical Fiber Connectors Using Lens Tissue
This topic describes how to clean the fiber connectors using lens tissue.

Prerequisites
Before cleaning, inspect the fiber end face with a fiber microscope or a magnifier
to confirm the degree of fiber contamination. Clean the fiber only when it is
severely contaminated. This is because the cleaning operation itself may introduce
dust, dirt, or cause damage to the fiber.

Tools, Equipment, and Materials
The following provides the required tools, equipment and materials:
● Optical power meter
● 400X fiber microscope (A video fiber microscope is recommended.)
● Cleaning solvent (Isoamylol is preferred, propyl alcohol is the next, and
alcohol or formalin is forbidden.)
● Non-woven lens tissue, fiber cleaning tissue, and dustfree cloth (Non-woven
lens tissue is recommended.)
● Special compressed air or cleaning roll

Precautions

CA UTION

Laser energy is invisible and may cause eye injuries. Never look directly into fiber
connectors or ports.

NO TICE

Electrostatic discharge is hazardous to the electronic equipment. Wear an ESD
wrist strap and ensure that the strap is grounded properly before touching the
equipment and boards, to protect the static-sensitive components against
electrostatic discharge of the human body. Otherwise, the equipment may be
damaged or the service may be interrupted.

Procedure
1. Shut down the laser and disconnect the fiber end before inspecting the fiber
connector.
2. Test the optical power using a power meter to ensure that the laser is shut
down.

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3. Put a little cleaning solvent on the lens tissue.
4. Clean the fiber end face on the lens tissue. See Figure 4-23 and Figure 4-24.

NO TICE

Drag the fiber end face on the same area in the lens tissue only once.
Otherwise, the connector can be contaminated or damaged.

Figure 4-23 Cleaning the fiber end face using the lens tissue on the desk

Figure 4-24 Cleaning the fiber end face using the lens tissue on the hand

5. Repeat 4 several times on the areas of the lens tissue that have not been
used.
6. Use the compressed air to blow off dust on the fiber end face.

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NO TE

● When using the compressed air, keep the nozzle as close as possible to the fiber
end face without touching it.
● Before using the compressed air, first spray it into the air to expel deposits in the
compressed air.
● If the compressed air is not available, use a cleaning roll instead.
7. Use a fiber microscope to inspect the fiber to check whether there is any dirt.
For details, see the examples shown in "Inspecting Optical Fiber Connectors".
If the fiber end face is still dirty, repeat 1 to 6.
8. Do not touch the fiber connector after cleaning it. Connect it to the optical
port immediately. If it is not used for the time being, put a protective cap on
it.

NO TE

Do not use the same cleaning area to clean the fiber connector for more than one
time.
9. Turn on the laser after connecting the fiber to the board.

4.2.2.6.8 Cleaning Optical Fiber Adapters Using Dustfree Absorbent Swabs

This topic describes how to clean fiber adapters using dustfree absorbent swabs.

Prerequisites

There are several types of dustfree absorbent swabs available. Select appropriate
dustfree absorbent swabs based on site conditions. You can obtain the following
tools and materials from a fiber cable and connector manufacturer.

Tools, Equipment, and Materials

The following lists the required tools, equipment and materials:
● Optical power meter
● 400X fiber microscope (A video fiber microscope is recommended.)
● Cleaning solvent (Isoamylol is preferred, propyl alcohol is the next, and
alcohol or formalin is forbidden.)
● Special compressed air
● Dustfree absorbent swab (made of medical cotton or long fiber cotton)

Precautions

CA UTION

Laser energy is invisible and may cause eye injuries. Never look directly into fiber
connectors or ports.

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NO TICE

Electrostatic discharge is hazardous to the electronic equipment. Wear an ESD
wrist strap and ensure that the strap is grounded properly before touching the
equipment and boards, to protect the static-sensitive components against
electrostatic discharge of the human body. Otherwise, the equipment may be
damaged or the service may be interrupted.

Procedure
1. Shut down the laser and disconnect the fiber end before inspecting the fiber
connector.
2. Test the optical power using a power meter to ensure that the laser is shut
down.
3. Select the dustfree absorbent swab with a proper diameter based on the type
of an adapter.

NO TE

For SC and FC fiber adapters, use the dustfree absorbent swab with a diameter of 2.5
mm (0.1 in.); for the LC fiber adapter, use the dustfree absorbent swab with a
diameter of 1.25 mm (0.05 in.). See Figure 4-25 and Figure 4-26.

Figure 4-25 Dustfree absorbent swabs for cleaning the SC and FC connectors

Figure 4-26 Dustfree absorbent swabs for cleaning the LC connectors

4. Put a little cleaning solvent on the dustfree absorbent swab.
5. Place the dustfree absorbent swab gently on the adapter so that the cleaning
solvent is against the fiber end face. Draw out the dustfree absorbent swab
from the fiber adapter and then rotate the dustfree absorbent swab clockwise
once. Ensure that the tip of the dustfree absorbent swab directly contacts the
fiber end face.

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6. Use the compressed air to blow off dust on the fiber end face.

NO TE

● When using the compressed air, keep the nozzle as close as possible to the fiber
end face without touching it.
● Before using the compressed air, first spray it into the air to expel deposits in the
compressed air.
7. Use a fiber microscope to inspect the fiber to check whether there is any dirt.
For details, see "Inspecting Optical Fiber Connectors". If the fiber end face is
still dirty, repeat 1 to 6.
8. Connect the fiber to the optical port immediately. If it is not used for the time
being, put a protective cap on it.
9. Turn on the laser after connecting the fiber to the board.
4.2.3 On-site Cable Assembly and Installation

This chapter describes how to assemble and install power cables, Ethernet cables,
and other cables.

4.2.3.1 Cable Assembling Precautions

Check the cables and connector components according to the following lists.

Checking Cables
● If the jacket or insulation layer of a cable is dirty, clean it before assembly.
● If the jacket or insulation layer of a cable has visible damage, irreparable
scuffing, or a defect, do not use the cable.
● If the shield layer of a cable is damaged, do not use the cable.
● If the jacket or insulation layer of a cable cracks after the cable is bent or
twisted, check whether the other cables have the same problem. If the other
cables are good, do not use this cable. If other cables have the same problem,
do not assemble these cables.

Checking Connectors
● Do not use the connectors with visible defects, damage, rust, or scuffing.
● Do not use the connectors if the pins or shells of the connectors are damaged.
● Do not use the connectors if there is dirt on the pins or in the jacks of the
connectors or if there are conductors between pins or between pins and the
shell.

Precautions for Assembly
● Use dedicated tools or tools delivered by Huawei and follow the correct
assembly methods.
● Hold the terminals of cables instead of pulling the cables when installing or
removing the cable components.
● Take the following precautions when cutting or peeling cables:

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– Leave a little extra length when cutting cables.
– Coil cables that are longer than 2 m (6.56 ft.). Bind the cables using
bundling ropes. The inner diameter of the coil should be larger than 20
times the outer diameter of the cable.
– When peeling the jackets of cables, avoid damaging the shield layers
(braid or aluminum foil), insulation layers, core conductors, and other
jackets that do not need to be peeled.
– Clean the exposed jackets section (such as, the dead ends of power
cables). Cut all cables flush.
– Do not touch the core conductors of cables with your hands. Process the
conductor peeled from cables in time so that the surface of the conductor
does not need to be oxidized.
● Take the following precautions when crimping and connecting cables or
connectors:
– The terminals and conductors should be connected tightly after they are
crimped. They should not be moved or turned.
– Cut all the exposed copper wires.
– Try to avoid a second crimping of sleeves.
– Keep all the conductors clean and aligned.

NO TE

The connectors, cables, and tools provided by different vendors may differ. Figures in this
document are for reference only.

NO TICE

● The intra-building port(s) (list the port or ports) of the equipment or
subassembly is suitable for connection to intra-building or unexposed wiring or
cabling only. The intra-building port(s) of the equipment or subassembly MUST
NOT be metallically connected to interfaces that connect to the OSP or its
wiring. These interfaces are designed for use as intra-building interfaces only
(Type 2 or Type 4 ports as described in GR- 1089) and require isolation from
the exposed OSP cabling. The addition of Primary Protectors is not sufficient
protection in order to connect these interfaces metallically to OSP wiring.
● The intra-building port(s) (list the port or ports) of the equipment or
subassembly must use shielded intra-building cabling/wiring that is grounded
at both ends.
● The preceding requirements only apply to North America.

4.2.3.2 Assembling Power Cables
This section describes how to assemble power cables with an OT terminal, JG
terminal, and cord end terminal.

4.2.3.2.1 Assembling a Power Cable with an OT Terminal
This section describes how to assemble a power cable with an OT terminal.

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Context
Figure 4-27shows the components of an OT terminal and a power cable.

Figure 4-27 Components of an OT terminal and a power cable

A Heat shrink tubing B. Bare crimp terminal C. Insulation layer of D. Conductor of the
the power cable power cable

Procedure

Step 1 Based on the cross-sectional area of the cable conductor, strip a part of the
insulation layer. The L1-long conductor is exposed, as shown in Figure 4-28. Table
4-11 lists the recommended values for L1.

Figure 4-28 Stripping a power cable (OT terminal)

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NO TICE

● When you strip a power cable, do not damage the conductor of the cable.
● If the bare crimp terminal is not provided by Huawei, ensure that the value of
L1 is 1 mm (0.04 in.) to 2 mm (0.08 in.) greater than the value of L.

Table 4-11 Mapping between the cross-sectional area of the conductor and the
value of L1

Cross- Value of L1 (mm) Cross-Sectional Value of L1 (mm)
Sectional (in.) Area of Conductor (in.)
Area of (mm2) (in.2)
Conductor
(mm2) (in.2)

1 (0.002 in.2) 7 (0.28 in.) 10 (0.02 in.2) 11 (0.43 in.)

1.5 (0.002 7 (0.28 in.) 16 (0.02 in.2) 13 (0.51 in.)
in.2)

2.5 (0.004 7 (0.28 in.) 25 (0.04 in.2) 14 (0.55 in.)
in.2)

4 (0.006 in.2) 8 (0.31 in.) 35 (0.05 in.2) 16 (0.63 in.)

6 (0.009 in.2) 9 (0.35 in.) 50 (0.08 in.2) 16 (0.63 in.)

NO TE

If you are proficient in assembling a power cable with an OT terminal, you can determine
the value of L1 by comparing the part to be crimped with the power cable.

Step 2 Put the heat shrink tubing (A) onto the bare crimp terminal, as shown in Figure
4-29.

Figure 4-29 Putting the heat shrink tubing onto the bare crimp terminal

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Step 3 Put the OT terminal onto the exposed conductor and ensure that the OT terminal
is in good contact with the insulation layer of the power cable, as shown in Figure
4-29.

NO TICE

After the conductor is fed into the OT terminal, the protruding part of the
conductor (L2 in Figure 4-29) must not be longer than 2 mm (0.08 in.).

Step 4 Crimp the joint parts of the bare crimp terminal and the conductor, as shown in
Figure 4-30.

NO TE

The shapes of the crimped parts may vary with the crimping dies.

Figure 4-30 Crimping the joint parts of the bare crimp terminal and the conductor

Step 5 Push the heat shrink tubing (A) towards the connector until the tube covers the
crimped part, and then heat the tube using a heat gun, as shown in Figure 4-31.

Figure 4-31 Heating the heat shrink tubing

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NO TICE

Stop heating the heat shrink tubing when it has shrunk firmly around the
connector.

----End

4.2.3.2.2 Assembling a Power Cable with a JG Terminal

This section describes how to assemble a power cable with a JG terminal.

Context

Figure 4-32 shows the components of a JG terminal and a power cable.

Figure 4-32 Components of a JG terminal and a power cable

A. JG terminal B. Heat shrink tubing C. Insulation layer of D. Conductor of the
the power cable power cable

Procedure

Step 1 Based on the cross-sectional area of the cable conductor, strip a part of the cable.
The L-long conductor is exposed, as shown in Figure 4-33. Table 4-12 lists the
recommended values for L.

NO TICE

● When you strip a power cable, do not damage the conductor of the cable.
● If the bare crimp terminal is not provided by Huawei, determine the value of L
according to the L value of the JG terminal.

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Figure 4-33 Stripping a power cable (JG terminal)

Table 4-12 Mapping between the cross-sectional area of the conductor and the
value of L
Cross-Sectional Area of Conductor Value of L (mm) (in.)
(mm2) (in.2)

16 (0.02 in.2) 13 (0.51 in.)

25 (0.04 in.2) 14 (0.55 in.)

35 (0.05 in.2) 16 (0.63 in.)

50 (0.08 in.2) 16 (0.63 in.)

Step 2 Put the heat shrink tubing onto the bare crimp terminal, as shown in Figure 4-34.

Figure 4-34 Putting the heat shrink tubing onto the bare crimp terminal

Step 3 Put the bare crimp terminal onto the exposed conductor, and ensure that the bare
crimp terminal is in good contact with the insulation layer of the power cable, as
shown in Figure 4-34.
Step 4 Crimp the joint parts of the bare crimp terminal and the conductor, as shown in
Figure 4-35.

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Figure 4-35 Crimping the joint parts of the bare crimp terminal and the conductor
(JG terminal)

Step 5 Push the heat shrink tubing towards the connector until the tube covers the
crimped part, and then heat the tube using a heat gun, as shown in Figure 4-36.

Figure 4-36 Heating the heat shrink tubing (JG terminal)

----End

4.2.3.2.3 Assembling a Power Cable to a Cord End Terminal
This section describes how to assemble a power cable with a cord end terminal.

Context
Figure 4-37 shows the components of a cord end terminal and a power cable.

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Figure 4-37 Components of a cord end terminal and a power cable

A. Cord end terminal B. Insulation layer of a power C. Conductor of a power cable
cable

Procedure

Step 1 Based on the cross-sectional area of the cable conductor, strip a part of the
insulation layer. The L1-long conductor is exposed, as shown in Figure 4-38. Table
4-13 lists the recommended values for L1.

NO TICE

When you strip a power cable, do not damage the conductor of the cable.

Figure 4-38 Stripping a power cable (cord end terminal)

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Table 4-13 Mapping between the cross-sectional area of the conductor and the
value of L1
Cross- Value of L1 (mm) Cross-Sectional Value of L1 (mm)
Sectional (in.) Area of Conductor (in.)
Area of (mm2) (in.2)
Conductor
(mm2) (in.2)

1 (0.002 in.2) 8 (0.31 in.) 10 (0.02 in.2) 15 (0.59 in.)

1.5 (0.002 10 (0.39 in.) 16 (0.02 in.2) 15 (0.59 in.)
in.2)

2.5 (0.004 10 (0.39 in.) 25 (0.04 in.2) 18 (0.71 in.)
in.2)

4 (0.006 in.2) 12 (0.47 in.) 35 (0.05 in.2) 19 (0.75 in.)

6 (0.009 in.2) 14 (0.55 in.) 50 (0.08 in.2) 26 (1.02 in.)

Step 2 Put the cord end terminal onto the conductor and ensure that the conductor is
aligned with the edge of the cord end terminal, as shown in Figure 4-39.

NO TICE

After the conductor is fed into the cord end terminal, the protruding part of the
conductor must not be longer than 1 mm (0.04 in.).

Figure 4-39 Putting the cord end terminal onto the conductor

Step 3 Crimp the joint parts of the cord end terminal and the conductor, as shown in
Figure 4-40.

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Figure 4-40 Crimping the cord end terminal and the conductor

Step 4 Check the maximum width of the cord end terminal. Table 4-14 lists the
maximum width of a cord end terminal.

Table 4-14 Maximum width of a cord end terminal

Cross-Sectional Area of the Terminal Maximum Width of the Terminal W1
(mm2) (in.2) (mm) (in.)

0.25 (0.0004 in.2) 1 (0.04 in.)

0.5 (0.0008 in.2) 1 (0.04 in.)

1.0 (0.002 in.2) 1.5 (0.06 in.)

1.5 (0.002 in.2) 1.5 (0.06 in.)

2.5 (0.004 in.2) 2.4 (0.09 in.)

4 (0.006 in.2) 3.1 (0.12 in.)

6 (0.009 in.2) 4 (0.16 in.)

10 (0.02 in.2) 5.3 (0.21 in.)

16 (0.02 in.2) 6 (0.24 in.)

25 (0.04 in.2) 8.7 (0.34 in.)

35 (0.05 in.2) 10 (0.39 in.)

----End

4.2.3.3 Assembling Ethernet Cables

This section describes how to assemble an Ethernet cable with an RJ45 connector.

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4.2.3.3.1 Assembling an Ethernet Cable with a Shielded RJ45 Connector
This section describes how to assemble a straight-through cable with a shielded
RJ45 connector.

Context
Figure 4-41 shows the components of a shielded RJ45 connector and a straight-
through cable.

Figure 4-41 Components of a shielded RJ45 connector and a straight-through
cable

A. Connector jacket B. Metal shell of the C. Wire holder of the D. Connector plug
connector connector

E. Ethernet cable jacket F. Shield layer of the G. Twisted pairs -
Ethernet cable

Procedure
Step 1 Thread the Ethernet cable through the connector jacket (A), as shown in Figure
4-42.

Figure 4-42 Threading the Ethernet cable through the connector jacket

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Step 2 Remove a 30-mm (1.18 in.) long section of the cable jacket (E), cut off the nylon
ripcord inside the jacket, and cut a 5-mm (0.20 in.) cleft in the cable jacket (E), as
shown Figure 4-43.

NO TICE

● When you remove a section of the jacket, do not damage the shield layer of
the twisted-pair cable.
● When you remove the shield layer, do not damage the insulation layer of the
twisted-pair cable.

Figure 4-43 Removing the jacket of a twisted pair cable (unit: mm (in.))

Step 3 Thread the twisted pair cable through the metal shell (B) and make sure that the
shield layer (F) is completely covered by the metal shell, as shown in Figure 4-44.

Figure 4-44 Threading the twisted pair cable through the metal shell

Step 4 Along the edge of the metal shell, cut off the shield layer with aluminum foil and
ensure that there is no surplus copper wire. The exposed twisted pairs (G) are
about 20 mm (0.79 in.) long, as shown in Figure 4-45.

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Figure 4-45 Removing the shield layer of a twisted pair cable (unit: mm (in.))

Step 5 Based on the colors, lead the four twisted pairs through the wire holder (C), as
shown in Figure 4-46 and Figure 4-47.

Figure 4-46 Leading twisted pairs through the wire holder

Figure 4-47 Twisted pair positions in a wire holder

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Step 6 Route the four twisted pairs (G) in the wire holder (C) based on their colors, as
shown in Figure 4-48. Figure 4-49 shows and Table 4-15 lists the mapping
between core wire colors and pins.

Figure 4-48 Routing the four twisted pairs in the wire holder

Figure 4-49 Mapping between core wire colors and pins

Table 4-15 Mapping between core wire colors and pins

Pin Number Core Wire Color

1 Brown

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Pin Number Core Wire Color

2 White-Brown

3 Green

4 White-Blue

5 Blue

6 White-Green

7 Orange

8 White-Orange

Step 7 Cut off any surplus cable along the lower edge of the wire holder (C), as shown in
Figure 4-50.

Figure 4-50 Cutting off surplus cable

Step 8 Put the connector body (D) onto the wire holder and turn the metal shell by 90°,
as shown in Figure 4-51.
NO TE

Ensure that the wire holder is in good contact with the connector body.

Figure 4-51 Putting the connector body onto the wire holder

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Step 9 Push the metal shell (B) towards the connector body until the wire holder and
connector body are completely covered. Crimp the connector, as shown in Figure
4-52.

Figure 4-52 Crimping the connector

Step 10 Push the connector jacket towards the metal shell until the metal shell is covered,
as shown in Figure 4-53.

Figure 4-53 Covering the metal shell

Step 11 Repeat Step 1 through Step 10 for the other end of the Ethernet cable.

----End

4.2.3.3.2 Checking the Metal Contacts

This section describes how to check the metal contacts to preliminarily determine
if an assembled RJ45 connector meets the necessary standards.

Context
● To ensure proper contact between the crimped parts and core wires, the
heights and sizes of the metal contacts must be uniform and standard.

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● The metal contacts must be parallel to each other, with an offset less than 5°.
The top margin of a metal contact must be parallel to the axis of the
connector, with an offset less than 10°.
● To ensure proper conduction, the surface of the metal contacts must be clean.
● The metal contacts must be in good contact with the RJ45 socket. The plastic
spacings must remain intact and must be aligned properly.
● The soldering edge of a metal contact must surpass the ends of the core
wires. The ends of the core wires must be in contact with the edge of the RJ45
trough. The distance between them must be less than 0.5 mm (0.02 in.).

Procedure
Step 1 Hold the crimped connector, with the front side facing you, and check whether the
metal contacts are the same height. The height must be 6.02 ± 0.13 mm (0.24 ±
0.005 in.). If a measuring tool is not available, you can visually compare the
connector with a standard connector. Figure 4-54 shows a defective connector
and Figure 4-55 shows a well-made connector.
NO TE

All defective connectors must be crimped again.

Figure 4-54 Metal contacts of different heights

Figure 4-55 Metal contacts of the same height

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Step 2 Hold the RJ45 connector and turn it by 45°. Observe the top edges of the metal
contacts. Figure 4-56 shows a defective connector.

Figure 4-56 Unparallel metal contacts of different heights

Step 3 Check whether the metal contacts are clean. If they are not clean and the dirt
cannot be removed, replace the RJ45 connector. Figure 4-57 shows a defective
connector.

Figure 4-57 Dirt on a metal contact

Step 4 Check whether the metal contacts and the plastic spacings are intact and stand
straight. If a part is skewed and it cannot be fixed, replace the RJ45 connector.
Figure 4-58 shows a defective connector.

Figure 4-58 RJ45 connector with oblique plastic spacings

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Step 5 Hold the connector, with the side facing towards you, and check whether you can
see the cross-sections of the core wires. Ensure that the ends of the core wires are
in good contact with the edge of the RJ45 trough, and that the soldering edge of
the metal contact surpasses the ends of the core wires and is reliably crimped with
the core wires. If not, replace the RJ45 connector. Figure 4-59 shows a defective
connector.

Figure 4-59 Core wires not in good contact with the edge of the RJ45 trough

----End

4.2.3.3.3 Testing the Connectivity of Assembled Ethernet Cables

This section describes how to test an assembled Ethernet cable to check whether
the connectors and wires at both ends are correctly connected. A straight-through
cable is used as an example.

Context

Straight-through cables and crossover cables are both commonly used in Huawei
products.

● Straight-through cables are connected in a one-to-one manner. They are used
to connect network adapters to equipment such as switches and hubs. Table
4-16 lists the connections of core wires in a straight-through cable.

Table 4-16 Connections of core wires in a straight-through cable

RJ45 Connector RJ45 Connector Core Wire Color Twisted
1 2

2 2 Orange Yes

1 1 Orange-White

6 6 Green Yes

3 3 Green-White

4 4 Blue Yes

5 5 Blue-White

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RJ45 Connector RJ45 Connector Core Wire Color Twisted
1 2

8 8 Brown Yes

7 7 Brown-White

● Crossover cables are connected in a crossover manner. They are used to
connect network adapters to equipment such as switches and hubs. Table
4-17 lists the connections of core wires in a crossover cable.

Table 4-17 Connections of core wires in a crossover cable

RJ45 Connector RJ45 Connector Core Wire Color Twisted
1 2

6 2 Orange Yes

3 1 Orange-White

2 6 Green Yes

1 3 Green-White

4 4 Blue Yes

5 5 Blue-White

8 8 Brown Yes

7 7 Brown-White

Figure 4-60 shows the pins of an RJ45 connector.

Figure 4-60 Pins of an RJ45 connector

Procedure

Step 1 Feed both cable connectors into the ports on a cable tester.

Step 2 Turn on the tester. If the indicators 1 to G light simultaneously, pins are working
normally and the wires are connected correctly.

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NO TE

Turn the switch to the S position and check whether indicators on the left and right sections
of the tester light simultaneously, as shown in Figure 4-61.

Figure 4-61 Testing the connectivity of an assembled Ethernet cable

Step 3 Gently shake the connectors and check whether indicators on the left and right
sections of the tester light simultaneously. If yes, the metal contact strips are in
good contact with the core wires and the ports on the cable tester, as shown in
Figure 4-62.

Figure 4-62 Checking the reliability of metal contacts

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The procedure for testing a crossover cable is similar to that for testing a straight-
through cable except for the sequence in which the indicators light. You need to
refer to the core wire connections of a crossover cable provided in Table 4-17.

A crossover cable is well-made only if the indicators light in the following
sequence:

In the master (left) section of the tester, the indicators turn on in the sequence of
1-8-G. In the slave (right) section of the tester, the indicators turn on in the
sequence of 3-6-1-4-5-2-7-8-G.

NO TE

If a cable tester is unavailable, you can use a multimeter to perform a simple test, as shown
in Figure 4-63.

Figure 4-63 Testing the connectivity of an Ethernet cable using a multimeter

----End

4.2.3.4 Installing Cable Accessories

This section describes how to install the cable accessories, including power
adapters, network adapters, and fiber connectors.

4.2.3.4.1 Precautions for Installing Cable Accessories

You must take precautions when installing cable accessories and follow the correct
installation procedure.

NO TE

Illustrations of components in this document may differ from actual components. For
example, in this document the adapters of cable connectors have independent interfaces,
whereas adapters may actually have interfaces fixed on equipment. However, the
installation procedures are similar.

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Tools
Use dedicated tools provided or specified by Huawei and use them in accordance
with their specifications and instructions.

Bending Radius
Unless otherwise specified, the bending radius (R) of cables or fibers must meet
the requirements listed in Table 4-18.

Table 4-18 Bending radius of cables or fibers
Cable or Fiber Bending Radius (R)

Ordinary cable R ≥ 5d, for the part near the cable
connector R ≥ 2d, for the rest of the
cable

Fiber For a single-mode G.657A2 optical
fiber, R≥10 mm; for a multi-mode A1b
optical fiber,R≥30 mm.
Bending angle > 90°

NO TE

The letter d indicates the diameter of the cable or fiber.

Precautions for Installation
● Hold the terminals of cables instead of pulling the cables when installing or
removing the cable components.
● Do not use excessive force when inserting a connector into an adapter. If a
connector cannot be fully inserted, pull it out using a dedicated tool and
ensure that you are trying to insert the connector into the correct position.
● Before tightening screws on cable connectors, make sure that the connectors
are in good contact with their adapters. Use a flat-head or Phillips screwdriver
rather than hands or an electric screwdriver to tighten the screws. Stop
immediately if the screws cannot be tightened. Identify the cause and rectify
the fault before attempting to tighten the screws again so as to prevent
damage to the connector and adapter.
● When removing densely distributed cables or fiber connectors, use dedicated
pliers such as cable-pulling pliers and fiber-pulling pliers.
● Do not twist, bend, stretch, or squeeze fibers during installation.
● Cover the fiber connectors that are not being used with dust-proof caps.
Remove the dust-proof caps only when you are about to use the fiber
connectors.
● Power cables in the cabinet are delivered by Huawei in standard
configuration.
– The AC and DC power cables in the cabinet should be bound in bundles
with a maximum of two loops.

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– When active/standby PSUs are used, the maximum number of AC and DC
power cables that can be bound in bundles with a maximum of four
loops (2 active loops + 2 standby loops).

NO TE

The power cable of a single AC power module represents a loop. The blue and black wires
of a single DC power supply represent a loop.
● If power cables in the cabinet are purchased by the frontline engineers or by
the customer locally:
The power cables in the cabinet are bound according to the IEC 60364-5-52
standard. That is, the power consumption and current-carrying requirements
of the device can still be met after the derating (routing and temperature) is
considered. In addition, the minimum distance between different cable
bundles must be greater than twice the outer diameter of a single cable.

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NO TE

For example, the maximum power consumption of a device is 2000 W, and there are two
power inputs in 1+1 mode. When one power input is used, the current-carrying capacity of
a single cable is 2000/220 ≈ 9.1 A.
If the cross-sectional area of the power cable is 1.5 mm2, the current-carrying capacity is 22
A according to the IEC 60364-5-52 standard (table B.52.10).

If the ambient temperature near the cable is 45°C, the derating factor is 0.79 according to
the IEC 60364-5-52 standard (table B.52.14).

Derating factor of a bundle = Actually required current-carrying capacity/(Current-carrying
capacity of a single cable x Temperature derating) = 9.1/(22 x 0.79) = 0.52. The derating
factor of a bundle should be greater than 0.52 to meet the actual 2000 W power
consumption requirement. According to the IEC 60364-5-52 derating standard (table
B.52.17), the number of cables in a bundle should be less than or equal to 8.

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Requirements for Cable Routing
● To protect cables, remove the burrs in the cable-through holes or install
protective rings in the holes.
● To ease the connection and to avoid stress, do not make cables too tight at
cable joints. After connecting multiple cables to a connector that has multiple
interfaces, keep the cables slack to avoid generating stress.
● Bind and clean cables gently to avoid cable distortion, which affects signal
quality.
● Keep cables away from moveable objects, such as doors.
● Sharp objects must not touch cable wiring to prevent damage to cables.
● To protect power cables, route power cables of the active and standby power
modules separately.

4.2.3.4.2 Installing Power Adapters
This section describes how to install OT terminals and cord end terminals.

Installing OT Terminals
This section describes how to install one or two OT terminals onto a wiring post.

Procedure
● Installing one OT terminal onto a wiring post
a. Turn the OT terminal so that the conductor is facing upward and align
the hole of the OT terminal with a connecting hole, as shown in Figure
4-64.

Figure 4-64 Aligning the OT terminal with a connecting hole

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NO TE

When you install an OT terminal, make sure that you orient the crimp sleeve
correctly. See Figure 4-65, in which A shows the correct orientation while B
shows the wrong orientation.

Figure 4-65 Orientation of the crimp sleeve

b. Put a spring washer and a flat washer. Then insert an appropriate screw
and tighten it, as shown in Figure 4-66.

Figure 4-66 Installing a screw to secure one terminal

NO TICE

The OT terminal may slip round on the pivot. Make sure that it is never in
contact with other terminals or metal components.

c. Pull the cable gently to check that it is securely installed. Figure 4-67
shows a securely installed OT terminal.

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Figure 4-67 Installed OT terminal

● Installing two OT terminals onto a wiring post
Ensure that the wiring post can support two OT terminals before starting the
installation. Also ensure that the electrical connecting pieces have the largest
possible area of contact. Two OT terminals can be installed in one of the
following ways:
– Bend the upper OT terminal at a 45- or 90-degree angle, as shown in
Figure 4-68.
– Lay the two terminals across each other, as shown in Figure 4-69.
– Install the two terminals back-to-back, as shown in Figure 4-70.

Figure 4-68 Bending the upper OT terminal at a 45- or 90-degree angle

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Figure 4-69 Laying the two terminals across each other

Figure 4-70 Installing the two terminals back-to-back

NO TICE

If the two terminals are different sizes, place the smaller one above the bigger
one. A maximum of two terminals can be installed onto a wiring post.

● To remove an OT terminal, loosen the screw counterclockwise.

----End

Installing Cord End Terminals

This section describes how to install a cord end terminal.

Procedure

Step 1 Hold a cord end terminal upright and place it over a terminal jack, as shown in
Figure 4-71. To ensure the largest area of contact, place the plain side of the
terminal so that it is facing outwards.

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Figure 4-71 Placing a terminal on a terminal jack vertically

Step 2 Feed the terminal into the terminal jack vertically, and fasten the terminal by
turning the matching screw clockwise, as shown in Figure 4-72.

Figure 4-72 Feeding the terminal into the jack

NO TICE

● Ensure that the exposed section of the terminal is less than 2 mm (0.08 in.) in
length, as shown in Figure 4-73.
● Do not press the insulation layer of the terminal.
● Feed only one terminal into one jack.

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Figure 4-73 Exposed section of the terminal

Step 3 Pull the cable gently to check that it is securely installed.

Step 4 Before you remove a cord end terminal, loosen the screw counterclockwise.

----End

4.2.3.4.3 Installing Network Port Connectors

This section describes how to install network port connectors.

Installing Shielded Network Port Connectors

This section describes how to install a shielded network port connector.

Procedure

Step 1 Hold the male and female connectors, with the male connector facing the female
connector, as shown in Figure 4-74.

Figure 4-74 Holding the male and female connectors

Step 2 Feed the male connector into the female connector until you hear a click, as
shown in Figure 4-75.

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Figure 4-75 Feeding the male connector into the female connector

Step 3 Pull the connector gently to check that it is securely installed. Figure 4-76 shows a
securely installed shielded network port connector.

Figure 4-76 Installed shielded network port connector

NO TE

To remove a shielded network port connector, press the locking key and pull out the
connector, as shown in Figure 4-77.

Figure 4-77 Removing a shielded network port connector

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----End

4.2.3.4.4 Installing Fiber Connectors

This section describes how to clean fiber connectors and MT connectors with
guide pins, and how to install fiber connectors.

Context

NO TICE

● Leave the dust-proof caps in place until you are about to install the fiber
connectors.
● For an area where fiber connectors are densely distributed, use a dedicated tool
to remove them.

Cleaning Fiber Connectors

This section describes how to clean fiber connectors.

Procedure

Step 1 Dip lint-free cotton in alcohol and let it dry for a moment.

Step 2 Use the cotton to clean the end face of a fiber connector.

Step 3 Clean the end face again using new dust-free cotton without alcohol. Ensure that
the pins are clean. If necessary, use an air gun to remove the residual objects on
the pins.

----End

Cleaning MT Connectors (MTP/MTRJ) That Have Guide Pins

This section describes how to clean the guide pins of MT connectors.

Procedure

Step 1 Fold a piece of lint-free cotton and dip it in alcohol. Then use the cotton to clean
the pins.

Step 2 Clean the pins again using new piece of lint-free cotton without alcohol.

Step 3 Use an air gun to remove any residual objects on the pins.

----End

Installing FC Connectors

This section describes how to install an FC connector.

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Procedure

Step 1 Remove the dust-proof cap on the FC connector and store it properly for future
use.
Step 2 Align the core pin of the FC (male) connector with that of the female connector,
as shown in Figure 4-78.

Figure 4-78 Aligning the male connector with the female connector

Step 3 Feed the male connector into the female connector, as shown in Figure 4-79.

Figure 4-79 Feeding the male connector into the female connector

Step 4 Fasten the swivel nut and ensure that the connector is securely installed, as shown
in Figure 4-80.

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Figure 4-80 Fastening the swivel nut

Step 5 To remove an FC connector, loosen the swivel nut, as shown in Figure 4-81.

Figure 4-81 Removing an FC connector

----End

Installing LC Connectors

This section describes how to install an LC connector.

Procedure

Step 1 Remove the dust-proof cap on the LC connector and store it properly for future
use.

Step 2 Align the core pin of the LC (male) connector with that of the female connector,
as shown in Figure 4-82.

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Figure 4-82 Aligning the male connector with the female connector

Step 3 Feed the male connector into the female connector, as shown in Figure 4-83.

Figure 4-83 Feeding the male connector into the female connector

Step 4 Stop inserting the connector when it clicks into place, as shown in Figure 4-84.

Figure 4-84 Installed LC connector

Step 5 To remove an LC connector, depress the latch to release it, as shown in Figure
4-85.

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Figure 4-85 Removing an LC connector

----End

Installing SC Connectors

This section describes how to install an SC connector.

Procedure

Step 1 Remove the dust-proof cap on the SC connector and store it properly for future
use.

Step 2 Align the core pin of the SC (male) connector with that of the female connector,
as shown in Figure 4-86.

Figure 4-86 Aligning the male connector with the female connector

Step 3 Feed the male connector into the female connector until it clicks into place, as
shown in Figure 4-87.

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Figure 4-87 Installed SC connector

Step 4 To remove an SC connector, pull it slightly to unlock it and then remove it, as
shown in Figure 4-88.

Figure 4-88 Removing an SC connector

----End

Installing MTRJ Connectors

This section describes how to install an MTRJ connector.

Procedure

Step 1 Remove the dust-proof cap on the MTRJ connector and store it properly for future
use.

Step 2 Align the core pin of the MTRJ (male) connector with that of the female
connector, as shown in Figure 4-89.

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Figure 4-89 Aligning the male connector with the female connector

Step 3 Feed the male connector into the female connector, as shown in Figure 4-90.

Figure 4-90 Feeding the male connector into the female connector

Step 4 Stop inserting the connector when it clicks into place, as shown in Figure 4-91.

Figure 4-91 Installed MTRJ connector

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Step 5 To remove an MTRJ connector, depress the latch to release it, as shown in Figure
4-92.

Figure 4-92 Removing an MTRJ connector

----End

Installing MPO Connectors
This section describes how to install an MPO connector.

Procedure
Step 1 Remove the dust-proof cap on the MPO connector and store it properly for future
use.
Step 2 Align the core pin of the MPO (male) connector with that of the female
connector, as shown in Figure 4-93.

Figure 4-93 Aligning the male connector with the female connector

Step 3 Hold the shell part labeled "PUSH" and feed the male connector into the female
connector until it clicks into place, as shown in Figure 4-94.

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Figure 4-94 Installed MPO connector

Step 4 To remove an MPO connector, hold the shell part labeled "PULL" and pull the
connector gently, as shown in Figure 4-95.

Figure 4-95 Removing an MPO connector

----End

4.2.3.5 Replacing the Mould of a Crimping Tool
This section describes how to replace the mould of a crimping tool.

Procedure

Step 1 Hold the handles of the crimping tool. Loosen the two fastening screws, as shown
in Figure 4-96.

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Figure 4-96 Loosening two fastening screws

Step 2 Hold the handles of the crimping tool to open the self-locking lock. At this time,
the jaw of the crimping tool opens automatically, as shown in Figure 4-97.

Figure 4-97 Pliers jaw opening automatically

Step 3 Remove the mould from the crimping tool, as shown in Figure 4-98.

Figure 4-98 Removing the mould from the crimping tool

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Step 4 Place the new mould into the jaw of the crimping tool and align the screw holes,
as shown in Figure 4-99.

Figure 4-99 Installing a new mould in the crimping tool

NO TICE

Keep the short side of the mould inwards and the long side outwards. The teeth of
the mould should go from largest toward the inside to smallest toward the
outside.

Step 5 Hold the handles of the crimping tool tightly to match the mould and the jaw
completely. Align the screw holes, as shown in Figure 4-100.

Figure 4-100 Aligning the screw holes

Step 6 Hold the handles of the crimping tool with one hand. Tighten the two fastening
screws. Figure 4-101 shows the mould installed in the crimping tool.

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Figure 4-101 Mould installed in the crimping tool

Figure 4-102 shows the finished crimping tool.

Figure 4-102 Finished crimping tool

----End
4.2.4 Equipment Grounding Specifications
This chapter describes grounding specifications, including general grounding
specifications, the grounding specifications for equipment rooms, devices, power
supply systems, signal cables, and the specifications for laying out ground cables.

4.2.4.1 General Grounding Specifications
This section describes the general grounding specifications.
Table 4-19 lists the general grounding specifications.

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Table 4-19 General grounding specifications
No. Description

1 The grounding design must follow the principles of equal voltage and
equipotential connection. Specifically, the working ground and protection
ground, including the shielded grounding and surge protection
grounding of a distribution frame, are connected to the same ground
busbar.

2 The cabling trays, racks or shells, metal ventilation pipes, metal doors
and windows in the equipment room must be grounded for protection.

3 The metal parts of a device that are neutral in normal conditions must
be grounded for protection.

4 The ground cable must be connected properly to the protection ground
bar in the equipment room.

5 Do not take other devices as the component part of the ground cable or
electrical connection.

4.2.4.2 Grounding Specifications for Equipment Room
This section describes the grounding specifications for equipment room.
It is recommended that the grounding resistance be less than or equal to ten ohm.

4.2.4.3 Grounding Specifications for Devices
This section describes the specifications for devices.
Table 4-20 lists the grounding specifications for devices.

Table 4-20 Equipment grounding specifications
No. Description

1 All communication devices and auxiliary devices (such as mobile base
stations, transmission and switching devices, and power supply devices)
in equipment room should be grounded for protection. Connect the
protection ground for various devices to the same ground busbar, and
then to the same protection ground bar in the room together with the
PGND of the devices.

2 The PGND of a device is shorted to the copper protection ground bar
provided by the user. The short-circuiting cable used should have
alternating yellow and green plastic insulating and a copper core, with
cross-sectional area greater than 35 mm2 (0.05 in.2).

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No. Description

3 There are ground terminals and ground flags at the lower part of the
front door, rear door, and side panel of a cabinet. The ground terminals
must be connected to the ground terminals of the cabinet framework
through connection cables with a cross-sectional area no less than 1.6
mm2 (0.002 in.2).

4 Ensure that all metal components of a cabinet have good conductibility.
No insulating coating should be sprayed on the connections of metal
components.

5 Connect cabinets in the same row closely by fastening captive screws
and washers on the top of the cabinets. Do not spray coating into a
rectangle area of 30 mm (1.18 in.) x 50 mm (1.97 in.) around the
connection hole for a captive screw. Measures to prevent rust and
corrosion must be taken for this area. Zinc electroplating with iridescent
yellow chromate conversion coating should be applied to the washer
and nut to ensure sufficient electric contact.

6 When combining cabinets of the same type, short-circuiting cables are
required to connect the ground busbars (if any) for the cabinets. The
cross-sectional area of the short-circuiting cable is 6 mm2 (0.009 in.2)
and is less than 300 mm (11.81 in.) long. Connect the two ends of a
short-circuiting cable to the ground busbar terminals of the neighboring
cabinets and fix them firmly.

4.2.4.4 Grounding Specifications for Power Supply Systems
This section describes the grounding specifications for power supply systems.
Table 4-21 lists the grounding specifications for power supply systems.

Table 4-21 Grounding specifications for power supply systems
No. Description

1 The AC power supply system for equipment room should use a TN-S
power supply.

2 The inlet for an AC power cable to enter the equipment room should be
equipped with a surge protection device (C-level) with a nominal
discharging current no less than 20 kA.

3 The protection ground for the power supply and that for devices are
connected to the same ground busbar. If the power supply and devices
are located in the same equipment room, try to use the same protection
ground bar for them.

4 A surge protection circuit should be added for an AC power interface.

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No. Description

5 The anode of the -48 V DC power supply or negative pole of the 24 V
DC power supply should be grounded at the output point of the DC
power supply.

6 The working ground and protection ground of the DC power supply
must be connected to the same ground busbar as the protection ground
of the devices. If the power supply and devices are located in the same
equipment room, try to use the same protection ground bar for them.

7 A surge protection circuit should be added for a DC power interface.

4.2.4.5 Grounding Specifications for Signal Cables
This section describes the grounding specifications for signal cables.
Table 4-22 lists the grounding specifications for signal cables.

Table 4-22 Grounding specifications for signal cables
No. Description

1 If there are digital trunk lines that connect a transmission device directly
or indirectly to the base station of a wireless communication device,
install an E1 surge protector for the corresponding interfaces of the
transmission device.

2 Equip cables laid outdoors with metal jackets, and ground both ends, or
connect them to the protection ground bar in the equipment room. For
cables inside the equipment room, install surge protection devices at the
corresponding interfaces of the device. The PGND cable for the surge
protection devices should be as short as possible.

3 Both ends of the external conductor of a coaxial cable and those of the
shield layer of the shielded cable should have good electric contact with
the metal shell of the device that they connect to.

4 The incoming and outgoing signal cables at a site and the idle wire pair
inside the cables should be grounded for protection.

5 Tone & Data Access (TDA) cables must pass the main distribution frame
(MDF) with a security unit when going out of an office or site. Its shield
layer should be connected to the protection ground of the MDF. The
MDF and cabinet must be connected to the same ground busbar.

6 Signal cables in a communication office or mobile station should not be
routed overhead.

4.2.4.6 Specifications for Laying Ground Cables
This section describes the specifications for laying ground cables.

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Table 4-23 lists the specifications for laying ground cables.

Table 4-23 Specifications for laying ground cables

No. Description

1 The ground lead should not be parallel with or twist around the signal
cable.

2 The ground cable cannot be led in aerially, but should be buried in the
earth or laid indoors.

3 Do not connect two protection ground cables to extend the cable length.
Do not add any switches or fuses.

4 The protection ground cable should have alternating yellow and green
plastic insulating and a copper core.

5 The neutral line of an AC power cable cannot be connected to the
protection ground of any transmission or communication devices in the
equipment room.

6 The length of a protection ground cable should not exceed 45 m (177
in.). The protection ground cable should be as short as possible. When it
is longer than 45 m (177 in.), you can advise the user to move the
ground bar to a closer position.

4.2.5 Labels for Cables

This chapter gives you an overview of labels and describes the labels for optical
fibers, Ethernet cables, and power cables.

A label serves as an identifier for on-site installation and maintenance. Labels on
the cables facilitate correct and neat cable connections, and easy maintenance.

Two types of labels are defined: one for power cables and the other for signal
cables.
● Signal cables include network cables, fibers, trunk cables, and user cables
(excluding antenna feeders).
● Power cables include AC power cables and DC power cables (excluding power
bus cables).

NO TE

Labels can be filled in based on user's requirements. In this case, make a relevant statement
in the self-check report.

4.2.5.1 Introduction to Labels

This section describes the material, types, structure, and contents of labels, the
way to print, fill in, and attach labels, and the precautions for using labels.

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4.2.5.1.1 Label Materials
Label materials must meet the following requirements:
● Thickness: 0.09 mm (0.004 in.)
● Color: chalk white
● Material: polyester (PET)
● Allowable temperature range: -29 °C to +149 °C (-20.2 °F to 300.2 °F)
● Supports laser printing and can be written on with oil-based markers
● Passed UL and CSA authentication

4.2.5.1.2 Type and Structure

Signal Cable Label
A signal cable label is L-shaped with fixed dimensions, as shown in Figure 4-103.

Figure 4-103 Signal cable label

To clearly specify the position of a cable, dividing lines are used on the label. For
example, there is a dividing line between the cabinet number and chassis number,
and another one between the chassis number and slot number. A dividing line is
1.5 mm (0.06 in.) x 0.6 mm (0.02 in.) in size with the color of PANTONE 656c
(light blue).

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The label can be folded along the perforated line and its size is 1 mm (0.04 in.) x 2
mm (0.08 in.).

Write information about the other end of the cable after "TO:" (which is upside
down in Figure 4-103) in the lower right corner of the label.

Power Cable Label

As shown in Figure 4-104, the label for power cables should be affixed to to the
identification plate on the cable ties that are fastened around the cable. The
identification plate has an embossed area 0.2 mm x 0.6 mm (0.008 in. x 0.02 in.)
around (symmetric on both sides), and the area in the middle is for affixing the
label.

Figure 4-104 Power cable label

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4.2.5.1.3 Label Printing
The contents can be printed or written on labels. Printing is recommended as it is
usually more efficient and maintains consistency.

Template for Printing
You must use a template to print a label. You can obtain the template in the
following ways:
● Log in to the technical support website at https://support.huawei.com to
download the template. Here is the path:Cable Engineering Label Printing
Template.
● Obtain the template from the Huawei local office.
The template is made in Microsoft Word. Adhere to the following requirements
when using the template:
● You can modify the contents of the template if required. However, do not
change the centered setting, direction, and fonts of the characters.
● You can use a smaller text size if there is too much information to fill in, but
ensure that the text can still be read clearly after it has been printed out.

Merging Cells in the Template
To merge two or more cells, do as follows:
1. Choose Edit > Select All.
2. Choose Format > Borders and Shading > Borders. Click the Box tab and click
OK.
3. Drag the mouse to select cells to be merged and choose Table > Merge Cells.

Requirements for the Printer
A laser jet printer is required for printing labels. Before printing a label, adjust the
page setup and print some test labels.
1. Cover a piece of label paper with an ordinary piece of blank paper, and check
whether the page setup conforms to the requirements.
2. Make sure the printer properties such as "paper size" and "direction" have
been set correctly.
3. Try printing and check that the printout is clear and correctly laid out:
– If yes, print labels directly.
– If not, adjust the page setup and try printing again. Repeat until the
correct printout is produced.
Do as follows to adjust the page setup:
1. Choose File > Page Setup.
2. Choose Layout and set Header and Footer to 0.
3. Click the Margins tab. Select Left for Gutter Position and set Top, Bottom,
Left, and Right.

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NO TE

If the warning prompt as shown in Figure 4-105 appears before printing, click Ignore
to continue printing.

Figure 4-105 Warning prompt before printing

After the page setup has been made correctly, save it for future use. This page
setup is only necessary for the first time you use the template to print labels.

Requirements for Feeding Paper Into the Printer

Different from ordinary paper, a piece of label paper is composed of two layers.
Feed in label papers one piece at a time manually. Never use auto-feed for label
paper to avoid paper jams.

Different models of printers may have different methods of feeding paper. Make
sure to feed in label papers correctly.

Requirements for Printed Labels

Make sure that the printed labels satisfy the following requirements:
● All the printouts are within the label.
● Contents in cells are aligned in the center. In a single-line printout, the
dividing lines and the "TO:" should not be covered by printed text.
● When the cells are merged and the printouts are made in multiple lines, avoid
covering the "TO:" with printing text. To do so, use space bar to move the
printing contents to the next line.

4.2.5.1.4 Writing Labels

Writing Tools

To make sure that the printouts are clear and legible, use black oil-based markers
instead of ball-point pens to write the labels.

In special cases, black ball-point pens are allowed, although not recommended.
When writing with a ball-point pen, take care not to leave smudged ink on the
label, which may contaminate the label and blur the words.

NO TE

The delivered marker has two nibs. Use the smaller nib to write labels.

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Font
So that handwriting is legible, it should be as similar as possible to the standard
Times New Roman typeface. Table 4-24 shows the standard typeface.

Table 4-24 Standard typeface for handwriting
0 1 2 3 4 5 6 7 8

9 A B C D E F G H

I J K L M N O P Q

R S T U V W X Y Z

Write characters at a size that is easy to read. The characters should be clear,
distinct, and tidy.
Figure 4-106 shows the writing direction.

Figure 4-106 Writing direction for characters on a label

4.2.5.1.5 Attaching Labels
After printing or writing a label, remove the label from the bottom of the page
and attach it to a signal cable, or the identification plate of a power cable. The
following section describes how to attach labels.

Signal Cable Label
● Determine the position for a label.
The label is attached 2 cm (0.08 in.) away from the connector of a signal
cable. A label can also be attached at other positions if required, for example,
to avoid the cable being bent or affecting other cables. The attached label
needs to face to the right or downwards, as shown in Figure 4-107. The
details are as follows:
– If a signal cable is routed vertically, the label needs to face to the right.
– If a signal cable is routed horizontally, the label needs to face
downwards.

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Figure 4-107 Direction of an attached label

● Procedure for attaching signal labels
Figure 4-108 shows the methods and procedures for attaching a signal label.

Figure 4-108 Attaching a signal cable label

Power Cable Label

Remove a label from the bottom of the page, and then attach it to the
identification plate with a cable tie. The label should be stuck to the rectangular
flute and should be stuck to only one side of the identification plate. The cable tie
is tied 2 cm (0.08 in.) away from the connector of the power cable. A cable tie can
also be tied at other positions if required.

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Both ends of a cable require a label. The attached identification plate should be
on top of the cable or on the right side of the cable, as shown in Figure 4-109.
The details are as follows:
● The identification plate is on the right side of the cable when the cable is
routed vertically.
● The identification plate is on top of the cable when the cable is routed
horizontally.

Figure 4-109 Binding a label for a power cable

4.2.5.1.6 Contents of Labels

Contents of Power Cable Labels
A power cable label is attached only on one side of an identification plate. On the
label, there is information (the contents after the "TO:") about the location of the
device on the other end of the cable, such as the location of the control cabinet,
distribution box, or power socket.

Contents of Signal Cable Labels
The two sides of a signal cable label carry information about the location of the
ports connected to both ends of the cable. Figure 4-110 shows the information on
both sides of a signal cable label.
● Area 1 contains the location information of the local end of the cable.
● Area 2 marked with "TO:" contains the location information of the opposite
end of the cable.
● Area 3 will be folded.

Figure 4-110 Contents of a signal cable label

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Observed from the cabling end of a device, the text part of a label is on the right
side of the cable. The side marked with "TO:" carries the location information of
the opposite end; and the other side carries the location information of the local
end.
Therefore, the information in Area 1 at one end is the same as the information in
Area 2 at the other end of a cable.

4.2.5.1.7 Precautions for Using Labels
When using labels, note the following:
● When printing, writing, or attaching labels, keep the labels clean.
● Since the label paper is made of moistureproof and waterproof materials, do
not use ink-jet printers and ink pens to print or write labels.
● Labels should be attached neatly. New-type labels are strip-shaped. If they are
attached at incorrect locations or in the wrong direction, the appearance of
the device is affected.
● Power cable ties should be tied at the same position on each power cable,
with identification plates on the same side.
● The positions of "up", "down", "left" or "right" are all based on the viewpoint
of the engineer working on the label.
● Engineering labels are auxiliary materials for engineering installation. The
engineering labels in Huawei auxiliary material packages are simple labels
that are provided free of charge. After-sales and maintenance services are not
provided. Customers who have warranty quality requirements for engineering
labels are recommended to purchase locally.

4.2.5.2 Labels for Fibers
This section describes the labels for fibers, including the labels for fibers between
devices and the labels for fibers between a device and an ODF.
These labels are attached to fibers that connect optical interfaces on the boards in
a chassis or a fixed-configuration device. There are two types of labels for fibers:
● One is for the fiber that connects optical interfaces on two devices.
● The other is for the fiber that connects the device and ODF.

4.2.5.2.1 Labels for Fibers Connecting Devices

Information on the Label
Table 4-25 provides information on both sides of a label for a fiber that connects
two devices.

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Table 4-25 Information on a label for a fiber between two devices
Content Meaning Description

MN-B-C-D- MN: cabinet M identifies the row number of a cabinet. Rows
R/T number are numbered from A to Z from front to back.
N identifies the column number of a cabinet.
Columns are numbered from 01 to 99 from left
to right.
For example, A01 indicates row A, column 01.

B: chassis A two-digit number that indicates the position
number of a subrack in a cabinet, for example, 01.
Subracks are numbered from bottom to top.

C: physical A two-digit number starting from 01. For
slot number example, 01 indicates slot 1. Slots are numbered
from top to bottom and from left to right.

D: optical A two-digit number starting from 00. For
interface example, 01 indicates the second optical
number. interface. Optical interfaces are numbered from
top to bottom and from left to right.

R: receive -
optical
interface
T: transmit
optical
interface

MN-B-C-D- MN: cabinet M identifies the row number of a cabinet. Rows
R/T number are numbered from A to Z from front to back.
N identifies the column number of a cabinet.
Columns are numbered from 01 to 99 from left
to right.
For example, A01 indicates row A, column 01.

B: chassis A two-digit number that indicates the position
number of a subrack in a cabinet, for example, 01.
Subracks are numbered from bottom to top.

C: physical A two-digit number starting from 01. For
slot number example, 01 indicates slot 1. Slots are numbered
from top to bottom and from left to right.

D: optical A two-digit number starting from 00. For
interface example, 01 indicates the second optical
number. interface. Optical interfaces are numbered from
top to bottom and from left to right.

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Content Meaning Description

R: receive -
optical
interface
T: transmit
optical
interface

Example Label

Figure 4-111 shows an example label for a fiber connecting two devices.

Figure 4-111 Example label for a fiber connecting two devices

The label shown in Figure 4-111 contains the following information:
● "A01-01-05-01-R" indicates that the local end of the optical fiber is connected
to receive optical interface 02 on slot 05 in chassis 01 in the cabinet in row A,
column 01.
● "G01-01-01-01-T" indicates that the other end of the optical fiber is
connected to transmit optical interface 02 on slot 01 in chassis 01 in the
cabinet in row G, column 01.

4.2.5.2.2 Labels for Fibers Connecting the Device and ODF

Information on the Label

Table 4-26 provides information on both sides of a label for a fiber that connects
the device and ODF.

Table 4-26 Information on a label for a fiber between the device and ODF

Content Meaning Description

MN-B-C-D- MN: cabinet M identifies the row number of a cabinet. Rows
R/T number are numbered from A to Z from front to back.
N identifies the column number of a cabinet.
Columns are numbered from 01 to 99 from left
to right.
For example, A01 indicates row A, column 01.

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Content Meaning Description

B: chassis A two-digit number that indicates the position
number of a subrack in a cabinet, for example, 01.
Subracks are numbered from bottom to top.

C: physical slot A two-digit number starting from 01. For
number example, 01 indicates slot 1. Slots are
numbered from top to bottom and from left to
right.

D: optical A two-digit number starting from 00. For
interface example, 01 indicates the second optical
number. interface. Optical interfaces are numbered from
top to bottom and from left to right.

R: receive -
optical
interface
T: transmit
optical
interface

ODF-MN-B- MN: ODF M identifies the row number of an ODF. Rows
C-R/T number are numbered from A to Z from front to back.
N identifies the column number of an ODF.
Columns are numbered from 01 to 99 from left
to right.
For example, G01 indicates row G, column 01.

B: row number A two-digit number ranging from 01 to 99, for
of a terminal example, 01.
device

C: column
number of the
terminal
device

R: receive -
optical
interface
T: transmit
optical
interface

Example Label
Figure 4-112 shows an example label.

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Figure 4-112 Example label for a fiber connecting the device and ODF

The label shown in Figure 4-112 contains the following information:
● "ODF-G01-01-01-R" indicates that the local end of the optical fiber is
connected to receive terminal in row 01, column 01 of the ODF in row G,
column 01.
● "A01-01-05-01-R" indicates that the other end of the optical fiber is
connected to receive optical interface 02 on slot 05 in chassis 01 in the
cabinet in row A, column 01.

4.2.5.3 Labels for Network Cables

This section describes the applicable ranges and meaning of the labels for network
cables.

Applicable Ranges

The labels apply to Ethernet cables.

Information on the Label

Table 4-27 provides information on both sides of a label for an Ethernet cable.

You can modify the label contents if required. If the device is not installed in a
cabinet, you can remove the cabinet number.

Table 4-27 Information on a label for an Ethernet cable

Content Meaning Description

MN-B-C-D MN: cabinet The row and column number of a cabinet.
number For example, A01 indicates row A, column 01.

B: chassis A two-digit number that indicates the
number position of a chassis in a cabinet, for
example, 01. Chassis are numbered from
bottom to top.

C: physical slot A two-digit number, for example, 01. Slots
number are numbered from top to bottom and from
left to right.

D: network port A two-digit number, for example, 01.
number Network ports are numbered from top to
bottom and from left to right.

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Content Meaning Description

MN-Z MN: cabinet The row and column number of a cabinet.
number For example, B02 indicates row B, column 02.

Z: location The location number of the terminal device.
Fill this information in the label on site. If the
cable is connected to a router in a cabinet,
specify the numbers of the cabinet, the
chassis, and the Ethernet interface, for
example, B02-03-12. If the cable is connected
to the network management system (NMS),
provide the specific location of the NMS.

The contents of the labels for network cables connecting hubs and routers or
agents and the network cables for other purposes should be specified according to
actual connections. The details are as follows:
● For the network cable connecting a hub and router, the label on the hub end
should indicate the numbers of the chassis and cabinet where the hub resides,
and the serial number on the hub. The label on the router end should indicate
the number of the chassis and cabinet where the router resides. In case it is a
stand-alone router, the specific position of the router should be provided.
● For the network cable connecting a hub and an agent or a terminal, the label
on the agent or terminal end should contain the number of the network
interface. The definitions of the cabinet number and chassis number are the
same as those described in Table 4-27.
● If it is a stand-alone hub without a cabinet or chassis, the label should contain
specific location information that identifies the hub.
The serial number on the hub, the network interface number of the agent or
terminal, and the location of the stand-alone router should be specified according
to actual connections.

Example Label
Figure 4-113 shows an example label for a network cable.

Figure 4-113 Example label for a network cable

The label shown in Figure 4-113 contains the following information:
● "A01-03-01-01" indicates that the local end of the network cable is connected
to network interface 01 on slot 01 in chassis 03 in the cabinet in row A,
column 01.

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● "B02-03-01" indicates that the other end of the network cable is connected to
network interface 01 in chassis 03 in the cabinet in row B, column 02. No slot
number is specified.

4.2.5.4 Labels for Trunk Cables
This section describes the labels for trunk cables, including the labels for cables
between devices and the labels for cables between a device and a DDF.
There are two types of labels for trunk cables:
● Labels for cables between devices, for example, the label for a cable between
a trunk board and a built-in transmission device and the label for a cable
between two trunk boards. Attach labels to both ends of a cable to indicate
the locations of the cable on both ends.
● Labels for cables between the device and a DDF. Attach labels to both ends of
a cable to indicate the locations of the cable on the device and the DDF.
Trunk cables include 75Ω/120Ω E1 cables, 100Ω T1 cables, 34M, 45M, 140M, and
155M cables, and 120Ω to 75Ω trunk cables.

4.2.5.4.1 Labels for Trunk Cables Between Devices

Meaning of Labels for Trunk Cables Between Devices
Table 4-28 provides information on a label for a trunk cable between devices.

Table 4-28 Information on a label for a trunk cable between devices

Content Meaning Description

MN-B-C-D- MN: cabinet The row and column number of a cabinet. For
R/T number example, A01 indicates row A, column 01.

B: chassis A two-digit number that indicates the position
number of a chassis in a cabinet, for example, 01.
Chassis are numbered from bottom to top.

C: physical slot A two-digit number, for example, 01. Slots are
number numbered from top to bottom and from left to
right.

D: interface A two-digit number, for example, 01. Interfaces
number are numbered from top to bottom and from left
to right.

R: receive -
optical
interface
T: transmit
optical
interface

MN-B-C-D- MN: cabinet The row and column number of a cabinet. For
R/T number example, A01 indicates row A, column 01.

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Content Meaning Description

B: chassis A two-digit number that indicates the position
number of a chassis in a cabinet, for example, 01.
Chassis are numbered from bottom to top.

C: physical slot A two-digit number, for example, 01. Slots are
number numbered from top to bottom and from left to
right.

D: interface A two-digit number, for example, 01. Interfaces
number. are numbered from top to bottom and from left
to right.

R: receive -
optical
interface
T: transmit
optical
interface

Example Label

Figure 4-114 shows an example label for a trunk cable between devices.

Figure 4-114 Example label for a trunk cable between devices

The label shown in Figure 4-114 contains the following information:

● "G01-01-05-01-T" indicates that the local end of the trunk cable is connected
to transmit interface 01 on slot 05 in chassis 01 in the cabinet in row G,
column 01.
● "D02-01-01-01-R" indicates that the other end of the trunk cable is connected
to receive interface 01 on slot 01 in chassis 01 in the cabinet in row D, column
02.

4.2.5.4.2 Labels for Trunk Cables Between the Device and a DDF

Meaning of the Labels for Trunk Cables Between the Device and a DDF

Table 4-29 provides information on a label for a trunk cable between the device
and a DDF.

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Table 4-29 Information on a label for a trunk cable between the device and a
DDF
Content Meaning Description

MN-B-C-D- MN: cabinet The row and column number of a cabinet. For
R/T number example, A01 indicates row A, column 01.

B: chassis A two-digit number that indicates the position
number of a chassis in a cabinet, for example, 03.
Chassis are numbered from bottom to top.

C: physical slot A two-digit number, for example, 01. Slots are
number numbered from top to bottom and from left to
right.

D: interface A two-digit number, for example, 01. Interfaces
number are numbered from top to bottom and from left
to right.

R: receive -
optical
interface
T: transmit
optical
interface

DDF-MN-B- MN: DDF M identifies the row number of a DDF. Rows are
C-D/R/T number numbered from A to Z from front to back.
N identifies the column number of a DDF.
Columns are numbered from 01 to 99 from left
to right.
For example, G01 indicates row G, column 01.

B: row number A two-digit number ranging from 01 to 99, for
of a terminal example, 01.
device

C: column
number of the
terminal
device

DDF-MN-B- D: terminal Valid values for D are A and B. A indicates that
C-D/R/T type the DDF is connected to an optical network
R: receive device; B indicates that the DDF is connected to
optical a switching device.
interface
T: transmit
optical
interface

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Example Label

Figure 4-115 shows an example label for a trunk cable between the device and a
DDF.

Figure 4-115 Example label for a trunk cable between the device and a DDF

The label shown in Figure 4-115 contains the following information:

● "A01-03-01-01-R" indicates that the local end of the trunk cable is connected
to receive interface 01 on slot 01 in chassis 03 in the cabinet in row A, column
01.
● "DDF-G01-01-01-AR" indicates that the other end of the trunk cable is
connected to the receive interface of terminal A in row 01, column 01 of the
DDF in row G, column 01.

4.2.5.5 Labels for User Cables

This section describes the applicable ranges and meaning of the labels for user
cables.

Attach labels to both ends of a cable to indicate the locations of the cable on the
device and the MDF.

Meaning of the Labels for User Cables

Table 4-30 provides information on a label for a user cable.

Table 4-30 Information on a label for a user cable

Content Meaning Description

MN-B-C-D MN: cabinet The row and column number of a cabinet.
number For example, A01 indicates row A, column
01.

B: frame A two-digit number that indicates the
number position of a frame in a cabinet, for example,
03. Frames are numbered from bottom to
top.

C: physical slot A two-digit number, for example, 01. Slots
number are numbered from top to bottom and from
left to right.

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Content Meaning Description

D: cable number A two-digit number, for example, 01. Cables
are numbered from top to bottom and from
left to right.

MDF-MN-B-C MN: MDF M identifies the row number of an MDF.
number Rows are numbered from A to Z from front
to back.
N identifies the column number of an MDF.
Columns are numbered from 01 to 99 from
left to right.
For example, G01 indicates row G, column
01.

B: row number A two-digit number ranging from 01 to 99,
of a terminal for example, 01.
device

C: column
number of the
terminal device

Example Label

Figure 4-116 shows an example label for a user cable.

Figure 4-116 Example label for a user cable

The label shown in Figure 4-116 contains the following information:

● "A01-03-01-01" indicates that the local end of the user cable is connected to
port 01 on slot 01 in chassis 03 in the cabinet in row A, column 01.
● "MDF-G01-01-01" indicates that the other end of the user cable is connected
to the terminal in row 01, column 01 of the MDF in row G, column 01.

4.2.5.6 Labels for Power Cables

This section describes the labels for power cables, including DC and AC power
cables.

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4.2.5.6.1 Labels for DC Power Cables
DC power cable labels are attached to DC power cables that feed power to
cabinets, including the -48 V, PGND, and BGND cables. DC power cables refer to
both the power cables themselves and also the protection ground cables.
A label for DC power cables is attached to one side of an identification plate with
a cable tie. Table 4-31 provides information on a label for a DC power cable.

Table 4-31 Information on a label for a DC power cable
Content Description

MN(BC)- MN(BC): BC is written right under MN.
B--48Vn B is a two-digit number that identifies the chassis number, for
example, 01. Chassis are numbered from bottom to top.
MN(BC)-B-
BGND n identifies the power socket number. Power sockets are
numbered 1 to 3 from bottom to top and from left to right.
MN(BC)-B- On the loaded cabinet side, only MN is used to identify the
PGND cabinet.
On the power distribution cabinet side, MN identifies the row
and column number of the power distribution facilities, such
as the power control cabinet and power distribution box. BC
identifies the row and column number of the -48 V connector.
BC can be omitted if there is no row or column number, or if
the connector can be identified without them. BGND and
PGND are not assigned rows or columns for identification.

The label carries location information only about the destination of the power
cable while information of the local end is unnecessary. That is, the label carries
location information only about the opposite device, the control cabinet, or the
power distribution box. Table 4-31 provides information of the label when two
-48 V power connections are used. Label information is similar when other DC
voltages, such as 24 V and 60 V, are used.
Make sure that labels are attached in the correct direction. After the cable ties are
tied onto cables, the identification plates with the labels should face upwards, and
the text on labels in the same cabinet should be in the same direction. Figure
4-117 shows example labels for a DC power cable.

Figure 4-117 Example labels for a DC power cable

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The labels shown in Figure 4-117 contain the following information:
● On the loaded cabinet side, the label "A01/B08--48V2" indicates that the
cable is connected to the eighth connector in row B of the -48 V busbar in the
cabinet in row A, column 1.
● On the power distribution box side, the label "B03--48V2" indicates that the
cable is connected to -48 V DC power socket 2 in the loaded cabinet in row B,
column 03.

NO TE

In the power distribution box or power distribution cabinet in a transmission equipment
room, every terminal block on the -48 V connector bar has a numeric identification. For
example, in the above label of "A01/B08--48V2", "08" (or "8") is the numeric identification
of the terminal block.
The terminal blocks are both short-circuited on the PGND and BGND copper bars,
so it makes no difference which terminal is connected. It is only necessary to give
the row and column of the power distribution box, instead of giving the specific
serial number of the terminal block on the copper bar. For example, if the label on
the loaded cabinet side is "A01-BGND", it means that the power cable is a BGND
that connects to the BGND copper bar in the power distribution box in row A,
column 01. Information on the labels for PGND cables should be given in a similar
way.

4.2.5.6.2 Labels for AC Power Cables
AC power cable labels are attached to both ends of an AC power cable that feeds
AC power to cabinets, including 220 V, PGND, and BGND cables. The 220 V AC
cables and related PGND and BGND cables are covered with insulating sheath, so
the labels need to contain only the word "AC" and the cabinet number.
A label for AC power cables is attached to one side of an identification plate with
a cable tie. Table 4-32 provides information on a label for an AC power cable.

Table 4-32 Information on a label for an AC power cable
Content Description

MN-(B)-ACn MN identifies the row and column number of a cabinet or
socket where power is led in.
B is a two-digit number that identifies the chassis number, for
example, 01. Chassis are numbered from bottom to top.
n identifies the power socket number. Power sockets are
numbered 1 to 3 from bottom to top and from left to right.
Serial number of the socket where the power is led in: The
location of the socket is marked according to the actual
location. If the sockets can be identified by row and column
number, they can be numbered following the same rule as for
cabinets. If the sockets cannot be identified by row and
column number, specify the detailed location to avoid
confusion with other sockets.

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The label carries location information only about the opposite device and the
power socket. Information about the local end is unnecessary.

Make sure that labels are attached in the correct direction. After the cable ties are
tied onto cables, the identification plates with the labels should face upwards, and
the text on the labels in the same cabinet should be in the same direction. Figure
4-118 shows example labels for an AC power cable.

Figure 4-118 Example labels for an AC power cable

The labels shown in Figure 4-118 contain the following information:
● On the loaded cabinet side, the label "A01-AC" indicates that the power cable
is connected to the socket in row A, column 01.
● On the power socket side, the label "B01-AC" indicates that the power cable
is connected to the cabinet in row B, column 01.
4.2.6 Powering on Devices

This chapter describes to the procedures for powering on and powering off a
device.

4.2.6.1 Checking the Installation

After you complete the hardware installation, you need to check the installation of
the devices and cables.

Prerequisite

All hardware devices and cables must be installed.

Background Information

A check before power-on is performed to ensure that the hardware is installed
properly. This is mainly to check the appearance of the devices, and also the
cabinet, cables, plugs, sockets, labels, and environment.

4.2.6.1.1 Device Installation Checklist

This section provides a checklist for checking an installed device before power-on.

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NO TICE

Before power-on, make sure that the switches of all power distribution units
(PDUs) and power distribution frames (PDFs) are in the "OFF" state.

Table 4-33 lists the items that need to be checked for the installed device.

Table 4-33 Checklist for the installed device
No. Check Item and Description Method

1 The cabinet is placed as required Check this according to the
in the design drawing. engineering design document.

2 The expansion bolts used to fix Check this according to the
the cabinet or holder to the following figure.
ground are fastened firmly. Flat
washers and spring washers are
used and spring washers are
placed on top of flat washers.

3 The installation holes on the Check this by measuring the
support and feet are fit for the megohm range of a multimeter.
expansion bolts. The support is The resistance of each insulating
insulated from the ground; the point must be greater than 5
floor holder is insulated from the megohms.
guide rails.

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No. Check Item and Description Method

4 The cabinets in the same row are -
evenly aligned with each other.
Rows of cabinets are aligned
along the main aisle, with a
deviation of up to 5 mm (0.20
in.).

5 The accessories on the front and -
back doors of the cabinet are
present. A connecting plate is
installed if two cabinets are
attached to each other.

6 The front door of the cabinet can Check this by unlocking the door
be opened and closed smoothly. according to the following figure.

Check this by locking the door
according to the following figure.

7 The boards can be plugged and -
removed smoothly. Screws on the
board panels, if any, are fastened
properly. The steel wires on the
screws are intact.

8 The surfaces of the device are -
clean and tidy. No component of
the cabinet is deformed.
Otherwise, it will affect the
appearance of the entire device.
All labels are correct, clear, and
complete.

9 The cabinet is clean and there are -
no dust particles inside the
cabinet. There are no extra
bundling straps, cable ends, or
other foreign objects inside the
cabinet.

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No. Check Item and Description Method

10 The electrostatic discharge (ESD)- Check this according to the
preventive wrist strap is inserted following figure.
into the ESD hole on the cabinet.

11 Blank filler panels are installed in -
all empty slots.

4.2.6.1.2 Cable Installation Checklist
This section provides a checklist for checking the installed cables.

Power Cables and Ground Cables
Table 4-34 lists the items that need to be checked for the installed power cables
and ground cables.

Table 4-34 Checklist for the installed power cables and ground cables
No. Check Item and Description Method

1 Each power cable or ground cable -
must be a single cable with a
copper wire inside it. The cables
must be connected reliably
according to the standards.

2 The power cables and ground -
cables of the devices are connected
reliably. For each grounding
terminal, the spring washer is
placed on top of the flat washer.

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No. Check Item and Description Method

3 The lug of a power cable or a -
ground cable is welded or pressed
firmly.

4 The power cables and ground Check this according to the
cables outside the cabinet are following figure.
straight. They are bundled
separately from other types of
cables.

5 The extra ends of the power cables -
and ground cables are cut off
instead of being coiled.

6 The ground cable for the cabinet -
door is connected reliably and
firmly.

7 Each power cable or ground cable -
must be labeled according to the
standards. The labels are stuck on a
fixed position on the cables and
they face the same direction
(including the label on the power
distribution switch). It is
recommended that the labels be
stuck at 20 mm away from the
plugs.

8 The power cables and ground -
cables outside the cabinet are at
least 30 mm (1.18 in.) away from
the signal cables.

Cables Inside the Cabinet
Table 4-35 lists the items that need to be checked for the installed cables inside
the cabinet.

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Table 4-35 Checklist for the installed cables inside the cabinet
No. Check Item and Description Method

1 The cables are connected properly -
and firmly.

2 The cable ties do not overlap. They -
are cut smoothly and evenly at
both ends without any burr or
sharp edge.

Signal Cables
Table 4-36 lists the items that need to be checked for the installed signal cables.

Table 4-36 Checklist for the installed signal cables
No. Check Item and Description Method

1 All the signal cables have passed -
the continuity test before they are
laid.

2 The signal cables are not laid over -
the heat-dissipation mesh of the
cabinet.

3 Adequate space is provided for the Check this according to the
cables at the turning points. The following figure.
cables cannot be compressed at the
turning points.

4 The cables are straight and smooth. -
The cables inside the cabinet are
not crossed and the cables outside
the cabinet are bundled.

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No. Check Item and Description Method

5 Each signal cable is clearly labeled -
at both ends. The labels face the
same direction.

6 The screws on the cables, if any, -
are fastened firmly.

4.2.7 (Optional) Checking Optical Power

The following table describes comparison between the transmit optical power of
50 Gbps optical modules and damaged optical power threshold at the receive end:

Optical Maximum Minimum Damaged Description
Module Type Average Average Optical
Transmit Transmit Power
Optical Optical Threshold at
Power Power the Receive
End

50GBASE-FR 3 -4.1 5.2 The damaged
optical power
50GBASE-LR 4.2 -4.5 5.2 threshold is
greater than
the maximum
average
transmit
optical power,
posting low
self-loop risks.

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Optical Maximum Minimum Damaged Description
Module Type Average Average Optical
Transmit Transmit Power
Optical Optical Threshold at
Power Power the Receive
End

50GBASE-ER 6.6 0.4 -2.4 The damaged
optical power
threshold is
9dBm lower
than the
maximum
average
transmit
optical power
and 2.8dBm
lower than
the minimum
average
transmit
optical power,
posing high
self-loop risks.
In this case,
an optical
attenuator
must be
configured for
self-loop.

For applications of the 50 Gbps optical module supporting a distance of 40 km:
1. To ensure that the optical module runs stably for a long time, adjust the
receive optical power of the optical module to a value lower than -4 dB.
According to the IEEE 802.3 standard, if the receive optical power of the
optical module exceeds -2.3 dB, the optical module may be permanently
damaged.
2. Before connecting to the optical module, use an optical power meter to
measure the receive optical power (P). If P is less than -4 dB, the optical
module can be directly connected. If P is greater than -4 dB, add an optical
attenuator at the receive end to ensure that the receive optical power is less
than -4 dB. Alternatively, add an optical attenuator (no less than 10 dB is
recommended) before the interconnection, and then adjust the optical
attenuator based on the site requirements to prevent the optical module from
being damaged.
3. If a loopback occurs on the pigtail of the optical module or the optical
module is connected for a short distance, an optical attenuator must be
added. It is recommended that the optical attenuator be no less than 10 dB.

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4.2.8 NE5000E-X16A/X16B Installation Guide

4.2.8.1 Specifications and Components of the NE5000E-X16A/X16B

Device Components

The left figure shows the front view and the right figure shows the rear view of
the NE5000E-X16A/X16B.

No. Component Name Quantity

1 Air intake frame 2

2 Mounting ear 4

3 ESD jack (front) 2

4 Air intake vent 1

5 Lifting handle 8

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No. Component Name Quantity

6 Power module cage 1
cover

7 Power module (PM) slot 16

8 Power monitoring 2
module (PMU) slot

9 Switch module slot 2

10 Main processing unit 2
(MPU) slot

11 Cable trough 2

12 Cable guide for switch 2
and fabric units (SFUs)

13 SFU slot 4

14 Line processing unit 16
(LPU) slot

15 Power entry module 4
(PEM) slot

16 Fan module slot 6 (For a platform with forwarding
capacity as 400 Gbit/s or below,
only four fan modules need to be
configured.)

17 Air filter 1

18 Ground terminal 1

19 Non-lifting handle 2

20 ESD jack (rear) 2

Air Flow of the NE5000E-X16A/X16B

NO TICE

Engineers must have access to both the front and rear of an NE5000E-X16A/X16B.
Do not place the rack against a wall. Leave an aisle of more than 76 cm (2.49 ft.)
for maintenance access.

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4.2.8.2 Cabinet Introduction
This section describes the cabinet for the NE5000E CLC.
The device can be installed in the A610 cabinet. The height of the A610 cabinet is
46 U. The dimensions of the A610 cabinet are 600 mm x 1000 mm x 2200 mm
(width x depth x height).
The outline of the A68 cabinet is shown inFigure 4-119

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Figure 4-119 A610 cabinet outline

The NE5000E CLCs can be mounted in an N68E-22 cabinet or an International
Electrotechnical Commission (IEC) 19-inch standard cabinet. For the latter one, the
depth should not be less than 800 mm (31.50 in.), and its column should be at a
distance of 100 mm (3.94 in.) away from the front door. The N68E-22 interior is
46 U (80.50 in.) high and its dimensions are 600 mm x 800 mm x 2200 mm (23.62
in. x 31.50 in. x 86.61 in.) (width x depth x height).
The outline of the N68E-22 cabinet is shown in Figure 4-120.

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Figure 4-120 N68E-22 cabinet outline

The CCC can be mounted in an N610E cabinet. The N610E interior is 46 U (80.50
in.) high and its dimensions are 600 mm x 1000 mm x 2200 mm (23.62 in. x 39.37
in. x 86.61 in.) (width x depth x height).
The outline of the N610E cabinet is shown in Figure 4-121.

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Figure 4-121 N610E cabinet outline

4.2.8.3 Installation Preparations

Following All Safety Precautions
● Before any operations, read the instructions and precautions in this document
carefully to minimize the possibility of accidents. The Danger, Caution, and
Note items in this document do not cover all the safety precautions that must
be observed. They provide only the generic safety precautions for operations.
● When operating Huawei products and equipment, comply with safety
precautions and special safety instructions relevant to the corresponding
equipment provided by Huawei. The safety precautions in this document are
relevant only to Huawei products. Huawei is not liable for any consequence
that results from violation of universal regulations for safety operations and
safety codes on design, production, and equipment use.

Complying with Local Safety Regulations

When operating the product or equipment, comply with local safety regulations.

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Installation Personnel Requirement

Installation and maintenance personnel must be trained to perform operations
correctly and safely.

Personnel Safety
● The high-voltage power supply provides power for the system. Avoid direct
contact with the high-voltage power supply or contact with it through damp
objects. Otherwise, serious personnel injuries may occur.
● Non-standard and incorrect operations on the high-voltage power supply may
result in fire and electric shock.
● Ground a device before powering it on. This operation prevents damages to
the device or personal injuries.
● Power off a device before performing operations on the power supply
facilities.
● Do not stand close to or look into the optical fiber outlet without eye
protection when handling optical fibers.
● Take preventive measures when drilling holes. Otherwise, dust may hurt your
eyes or you may inhale the dust.
● When working at heights, be cautious about falling objects.

Device Safety
● Keep an unpacked device upright and handle it with care when carrying it or
installing it into a cabinet.

● Do not tilt the device when removing the package or installing it in a cabinet.
Otherwise, the device components may be damaged due to mutual pressing.

● Do not trample in the cabinet interior. Otherwise, the cabinet will be
damaged or deformed.

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● Use the handles at both sides of the device to carry it. Do not use handles on
any other module.

● Do not trample on a device. Instead, use a ladder to lay out cables.

● Wear an ESD wrist strap or ESD gloves when handling circuit boards.
Otherwise, the static electricity discharged from the human body may
damage the electrostatic sensitive components, such as large-scale integrated
circuits (LSIs) on the circuit board.

● Do not place damageable materials on the ground. Otherwise, they may be
trampled.

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● Do not sit on or lean against the materials that are piled on site. Otherwise,
they may be damaged.

● Check the electrical connection of a device before operating on it. Make sure
that the device is securely grounded.

NO TE

In this document, the device appearance is for reference only. In real-world situations, the
device appearance may differ from what is shown in this document.

4.2.8.4 Installation Instructions

About This Document
● This document provides guidelines for quickly installing the device. It does not
cover pre-delivery installations.
● The illustrations in this document are for reference only.

Installation Precautions
● The device is serviceable from both the front and back. Do not install it
against walls. Leave a clearance of 760 mm at the front and back of the
device for maintenance.
● Ensure that the air intake and exhaust vents of the device remain
unobstructed. In addition, ensure that the exhaust vent of one device does not
blow air into the intake vent of another device. Furthermore, do not blow air
directly onto the device using an air conditioner.
● The side with the grounding identifier on the top is the back of the cabinet.
The ground cable only needs to connect to the terminal on the back of the
cabinet.

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Installation Flowchart

NO TE

The device can use either AC or DC PDMs. Distribute power for the device as required. For
details, see the related sections.

Figure 4-122 Installation flowchart

4.2.8.5 Cabinet Specifications

Huawei standard cabinets are recommended. A self-purchases cabinet must meet
the following requirements.

1. The cabinet must be a 19-inch standard cabinet. The depth of the cabinet is
greater than 800 mm (31.50 in.), and the interior height inside the cabinet is
not smaller than 2000 mm (78.74 in.).

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NO TE

NE5000E-X16B must be installed in a cabinet with an air filter. If the NE5000E-X16B is
installed on an open rack, install an air filter door.
2. A mounting bar is more than 150 mm (5.91 in.) from the front door of the
cabinet. The front door is less than 25 mm (0.98 in.) thick, ensuring that the
available space is over 125 mm (4.92 in.).

3. The distance between the installation panels of the front and rear mounting
bars must be less than 530 mm or greater than 615 mm. Otherwise, power
cable installation will be affected.
4. The porosity must be larger than 50% on the front and rear doors.
5. The cabinet must contain installation accessories, such as guide rails, floating
nuts, and screws.
6. If the overhead cabling mode is used, a cable outlet should be reserved on the
top of the cabinet. If the underfloor cabling mode is used, cable holes should
be reserved at the bottom of the cabinet.

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4.2.8.6 Required Tools and Meters

Tools

Diagonal pliers Phillips screwdriver Flat-head screwdriver

Adjustable wrench Heat gun Marker

Ladder Multimeter ESD gloves

ESD wrist strap Utility knife Wire stripper

Wire clippers RJ45 crimping tool Power cable crimping
tool

Hydraulic pliers Protective gloves Socket wrench

Hammer drill Measuring tape Torque wrench

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Level Network cable tester
Wire fusion handle

Vacuum cleaner Plumb line COAX crimping tool

-

Hammer Torque batch

Installation Related Material
1. PVC black insulation tape
2. Cable tie
3. Binding strap
4. Heat shrink tubing
5. Corrugated pipe
6. Label

4.2.8.6.1 Inspecting and Cleaning Optical Fiber Connectors and Adapters

Overview
This topic introduces the purpose and procedure of cleaning optical fiber
connectors, as well as polluters to optical fiber connectors.
Cleaning fiber connectors is to remove dust or other dirt to avoid performance
degradation of optical transmission systems.
Figure 4-123 shows an optical fiber connector.

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Figure 4-123 Optical fiber connector

Optical fiber connectors should be free of:
● Dust
● Grease (usually brought by hands)
● Condensate residue
● Powder (evaporated residue of water or solvent)
Dust is the most common dirt in optical fiber connectors. The dust particles that
can be seen only by a microscope can affect the quality of optical signals,
deteriorate the system performance, and cause instability in network operation.
A 1-micrometer dust particle on the single-mode fiber connector can block 1%
light and cause 0.05 dB attenuation. A 9-micrometer dust particle that cannot be
seen by human eyes can block an entire fiber core. Therefore, small dirt even that
cannot be seen by human eyes should be removed.

NO TE

Before you connect any optical component, make sure that you have checked and cleaned
the component.

Procedure
Table 4-37 describes the procedure of inspecting and cleaning the optical fiber
connectors and adapters.

Table 4-37 Procedure of inspecting and cleaning the optical fiber connectors and
adapters

Step Details

Clean optical fiber connectors using See "Cleaning Optical Fiber Connectors
the cassette cleaner Using the Cassette Cleaner".

Clean optical fiber connectors using See "Cleaning Optical Fiber Connectors
lens tissue Using Lens Tissue".

Clean optical fiber adapters using See "Cleaning Optical Fiber Adapters
dustfree absorbent swabs Using Dustfree Absorbent Swabs".

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Protection of Optical Fiber Connectors
This topic describes requirements for fiber connector protection.
The requirements are as follows:
● All boards with optical ports must be packed properly, to avoid mechanical
and electrostatic damages and to reduce vibrations.
● The protective caps must be put in an ESD bag.
● Protective caps must be installed on all optical fiber connectors when not in
use. The optical fiber connectors must be stored in proper packages to keep
them clean.
● Figure 4-124 shows the recommended protective caps, whereas Figure 4-125
shows the protective caps not recommended.

Figure 4-124 Protective caps recommended

Figure 4-125 Protective caps not recommended

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NO TE

The protective caps not recommended are made of soft rubber, which are apt to absorb
dust and sundries, and difficult to clean.

Tools, Equipment, and Materials
Optical connectors should be cleaned using recommended tools, equipment and
materials.
The following provides the recommended tools, equipment and materials:
● Optical power meter
● 400X fiber microscope (A video fiber microscope is recommended.)
● Cassette cleaner shown in Figure 4-126
● Cleaning solvent (Isoamylol is preferred, propyl alcohol is the next, and
alcohol or formalin is forbidden.)
● Non-woven lens tissue, fiber cleaning tissue, and dustfree cloth (Non-woven
lens tissue is recommended.)
● Special compressed air
● Special cleaning roll
● Dustfree absorbent swab (made of medical cotton or long fiber cotton)
shown in Figure 4-127 and Figure 4-128

Figure 4-126 Cassette cleaner

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Figure 4-127 Dustfree absorbent swabs for cleaning the SC and FC connectors

Figure 4-128 Dustfree absorbent swabs for cleaning the LC connectors

Inspecting Optical Fiber Connectors
This topic describes how to inspect the end face of optical fibers using a fiber
microscope.

Tools, Equipment, and Materials
The following provides the required tools, equipment and materials for inspecting
optical fiber connectors:
● Optical power meter
● 400X fiber microscope (A video fiber microscope is recommended.)

Precautions

CA UTION

Laser energy is invisible and may cause eye injuries. Never look directly into fiber
connectors or ports.
Use a fiber microscope equipped with a safety device or a desktop video fiber
microscope when inspecting the optical fiber connectors.

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NO TICE

Electrostatic discharge is hazardous to the electronic equipment. Wear an ESD
wrist strap and ensure that the strap is grounded properly before touching the
equipment and boards, to protect the static-sensitive components against
electrostatic discharge of the human body. Otherwise, the equipment may be
damaged or the service may be interrupted.

Procedure
1. Shut down the laser and disconnect the fiber end before inspecting the fiber
connector.
2. Test the optical power using a power meter to ensure that the laser is shut
down.
3. Use a fiber microscope to check whether the fiber connector is contaminated
or damaged. See the examples below.
– Clean fiber and face
Figure 4-129 shows an image of a clean fiber end face under the fiber
microscope.

Figure 4-129 Clean fiber and face

– Damaged fiber end face
Figure 4-130 shows images of the damaged fiber end face. The image on
the left shows a severely damaged fiber. Severely damaged fibers can
cause damage to the equipment and should not be used. The image on
the right shows a defective fiber. If the output power is within a certain
range, the defective fiber might not cause any damage to the equipment.
If the output power is unstable or out of the range, however, the
defective fiber can cause damage to the equipment.

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Figure 4-130 Damaged or defective fiber end face

NO TE

Figure 4-130 shows only the 800-micrometer fiber cores.
For details on acceptable and unacceptable fibers, see Figure 4-131, Figure
4-132 and Figure 4-133.

Figure 4-131 Clean fiber end face

Figure 4-132 Acceptable fibers with imperfections

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Figure 4-133 Unacceptable fibers with imperfections

4. If any dirt is detected, clean the optical fiber connector. For details, see
"Cleaning Optical Fiber Connectors Using the Cassette Cleaner" and "Cleaning
Optical Fiber Connectors Using Lens Tissue".
5. If any damage is detected, replace the fiber.

Inspecting the Optical Fiber Link
This section describes the insertion loss and reflection requirements of optical links
and the method of checking the quality of optical links for the application of 50G
optical modules with the PAM4 coding technology.

Tools, Equipment, and Materials
Tools and instruments for checking optical fiber links are as follows:
● OTDR meter
● Fiber microscope

Precautions

CA UTION

Because the transmit optical power of the OTDR meter is much higher than the
damaged optical power threshold at the receive end, the optical fiber must be
removed from the optical module when the OTDR meter is used to test the optical
path quality.

Currently, the Ethernet port rate is increasing. Since the 50G optical module link
uses the PAM4 encoding technology, there are higher requirements on the optical
fiber and cable quality and the link is more sensitive to multipath reflection
interference of signals. If the fiber link connector, fiber section, or fiber splicing
surface is dirty, optical signals are reflected back and forth on the fiber link,
causing interference due to co-channel noise on the receive side. As a result, the
optical link is unstable or intermittently disconnected.

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According to the national standard (GBT50312-2016), the loss of the optical fiber
link connector must meet the requirements described in Table 4-38.

Table 4-38 Maximum attenuation of the optical fiber connector

Type Maximum attenuation of an optical fiber
connector (dB)

Fiber splicing connector 0.3

Optical mechanical connector 0.3

Optical connector 0.75

NO TE

Fiber cores are connected through connectors, such as the ODF, optical attenuator, and
flange, in splicing and mechanical modes.

Table 4-39 describes requirements for the reflection of the optical fiber connector
when Ethernet ports (such as 50G) use PAM4 encoding to double the rate. More
connectors bring lower requirements for the reflection.

Table 4-39 Maximum reflection of connectors

Number of Maximum Reflection of Each Connector (dB)
Optical Fiber
Connectors 50GBASE-FR 50GBASE-LR 50GBASE-ER

1 -25 -22 -19

2 -31 -29 -27

4 -35 -33 -32

6 -38 -35 -35

8 -40 -37 -37

10 -41 -39 -39

Procedure
1. After the optical fiber at the peer end is disconnected, use the OTDR meter to
test the local end. Check whether the loss and reflection of each link and
node are normal. (The loss of a fiber splicing connector should be less than
0.3 dB, the loss of a connector should be less than 0.75 dB, and the reflection
of a connector should be less than -30 dB.) If the test result is not within the
required range, process the abnormal port.
2. Locate the equipment room where the port resides based on the distance
between abnormal points in the OTDR test result. Preliminarily determine the
port location, disconnect the port, and perform an OTDR test on the port that

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reports alarms. Check whether the distance is consistent with that in the
previous test. If not, continue to test other ports.
3. After the abnormal port is found, test the port using a fiber microscope. If the
port is dirty, clean it. For details, see "Inspecting and Cleaning Optical Fiber
Connectors and Adapters".
4. After the port is cleaned, restore the port, and ensure that the connector is
tightened. Perform an OTDR test on the port to check whether loss and
reflection of each link and node are normal.
5. If the fault persists, replace the flange and perform an OTDR test on the port
that reports alarms to check whether loss and reflection of each link and
node are normal.
6. If the fault persists, replace the optical fiber and perform an OTDR test on the
port that reports alarms to check whether loss and reflection of each link and
node are normal.
7. If multiple abnormal points exist on the link, repeat steps 2 to 6.

Cleaning Optical Fiber Connectors Using the Cassette Cleaner

This topic describes how to clean the fiber connectors using a cassette cleaner.

Prerequisites

Before cleaning, inspect the fiber end face with a fiber microscope or a magnifier
to confirm the degree of fiber contamination. Clean the fiber only when it is
severely contaminated. This is because the cleaning operation itself may introduce
dust, dirt, or cause damage to the fiber.

The following procedure provides the steps to clean the fiber connectors using
cartridge type cleaners.

Tools, Equipment, and Materials

The following lists the required tools, equipment and materials for cleaning optical
fiber connectors:

● Cassette cleaner
● Optical power meter
● 400X fiber microscope (A video fiber microscope is recommended.)

Precautions

CA UTION

Laser energy is invisible and may cause eye injuries. Never look directly into fiber
connectors or ports.

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NO TICE

Electrostatic discharge is hazardous to the electronic equipment. Wear an ESD
wrist strap and ensure that the strap is grounded properly before touching the
equipment and boards, to protect the static-sensitive components against
electrostatic discharge of the human body. Otherwise, the equipment may be
damaged or the service may be interrupted.

Procedure
1. Shut down the laser and disconnect the fiber end before inspecting the fiber
connector.
2. Test the optical power using a power meter to ensure that the laser is shut
down.
3. Press down and hold the lever of the cassette cleaner. The shutter slides back
and exposes a new cleaning area. See Figure 4-134.

Figure 4-134 Using the cassette cleaner

4. Place the fiber end face gently against the cleaning area.
5. Drag the fiber end face gently on one cleaning area in the arrow direction
each time. See Figure 4-135. Do it again on the other cleaning area in the
same direction as the first time once. See Figure 4-136.

NO TICE

Do not drag the fiber end face on the same cleaning area more than once.
Otherwise, the connector can be contaminated or damaged.

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Figure 4-135 Dragging the fiber end face gently on one cleaning area

Figure 4-136 Dragging the fiber end face gently on the other cleaning area

6. Release the lever of the cassette cleaner to close the cleaning area.
7. Use a fiber microscope to inspect the fiber to check whether there is any dirt.
For details see the examples shown in "Inspecting Optical Fiber Connectors".
If the fiber end face is still dirty, repeat 1 to 6.
8. Connect the fiber to the optical port immediately. If it is not used for the time
being, put a protective cap on it.
9. Turn on the laser after connecting the fiber to the board.

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Cleaning Optical Fiber Connectors Using Lens Tissue

This topic describes how to clean the fiber connectors using lens tissue.

Prerequisites

Before cleaning, inspect the fiber end face with a fiber microscope or a magnifier
to confirm the degree of fiber contamination. Clean the fiber only when it is
severely contaminated. This is because the cleaning operation itself may introduce
dust, dirt, or cause damage to the fiber.

Tools, Equipment, and Materials

The following provides the required tools, equipment and materials:
● Optical power meter
● 400X fiber microscope (A video fiber microscope is recommended.)
● Cleaning solvent (Isoamylol is preferred, propyl alcohol is the next, and
alcohol or formalin is forbidden.)
● Non-woven lens tissue, fiber cleaning tissue, and dustfree cloth (Non-woven
lens tissue is recommended.)
● Special compressed air or cleaning roll

Precautions

CA UTION

Laser energy is invisible and may cause eye injuries. Never look directly into fiber
connectors or ports.

NO TICE

Electrostatic discharge is hazardous to the electronic equipment. Wear an ESD
wrist strap and ensure that the strap is grounded properly before touching the
equipment and boards, to protect the static-sensitive components against
electrostatic discharge of the human body. Otherwise, the equipment may be
damaged or the service may be interrupted.

Procedure
1. Shut down the laser and disconnect the fiber end before inspecting the fiber
connector.
2. Test the optical power using a power meter to ensure that the laser is shut
down.
3. Put a little cleaning solvent on the lens tissue.
4. Clean the fiber end face on the lens tissue. See Figure 4-137 and Figure
4-138.

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NO TICE

Drag the fiber end face on the same area in the lens tissue only once.
Otherwise, the connector can be contaminated or damaged.

Figure 4-137 Cleaning the fiber end face using the lens tissue on the desk

Figure 4-138 Cleaning the fiber end face using the lens tissue on the hand

5. Repeat 4 several times on the areas of the lens tissue that have not been
used.
6. Use the compressed air to blow off dust on the fiber end face.

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NO TE

● When using the compressed air, keep the nozzle as close as possible to the fiber
end face without touching it.
● Before using the compressed air, first spray it into the air to expel deposits in the
compressed air.
● If the compressed air is not available, use a cleaning roll instead.
7. Use a fiber microscope to inspect the fiber to check whether there is any dirt.
For details, see the examples shown in "Inspecting Optical Fiber Connectors".
If the fiber end face is still dirty, repeat 1 to 6.
8. Do not touch the fiber connector after cleaning it. Connect it to the optical
port immediately. If it is not used for the time being, put a protective cap on
it.

NO TE

Do not use the same cleaning area to clean the fiber connector for more than one
time.
9. Turn on the laser after connecting the fiber to the board.

Cleaning Optical Fiber Adapters Using Dustfree Absorbent Swabs

This topic describes how to clean fiber adapters using dustfree absorbent swabs.

Prerequisites

There are several types of dustfree absorbent swabs available. Select appropriate
dustfree absorbent swabs based on site conditions. You can obtain the following
tools and materials from a fiber cable and connector manufacturer.

Tools, Equipment, and Materials

The following lists the required tools, equipment and materials:
● Optical power meter
● 400X fiber microscope (A video fiber microscope is recommended.)
● Cleaning solvent (Isoamylol is preferred, propyl alcohol is the next, and
alcohol or formalin is forbidden.)
● Special compressed air
● Dustfree absorbent swab (made of medical cotton or long fiber cotton)

Precautions

CA UTION

Laser energy is invisible and may cause eye injuries. Never look directly into fiber
connectors or ports.

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NO TICE

Electrostatic discharge is hazardous to the electronic equipment. Wear an ESD
wrist strap and ensure that the strap is grounded properly before touching the
equipment and boards, to protect the static-sensitive components against
electrostatic discharge of the human body. Otherwise, the equipment may be
damaged or the service may be interrupted.

Procedure
1. Shut down the laser and disconnect the fiber end before inspecting the fiber
connector.
2. Test the optical power using a power meter to ensure that the laser is shut
down.
3. Select the dustfree absorbent swab with a proper diameter based on the type
of an adapter.

NO TE

For SC and FC fiber adapters, use the dustfree absorbent swab with a diameter of 2.5
mm (0.1 in.); for the LC fiber adapter, use the dustfree absorbent swab with a
diameter of 1.25 mm (0.05 in.). See Figure 4-139 and Figure 4-140.

Figure 4-139 Dustfree absorbent swabs for cleaning the SC and FC connectors

Figure 4-140 Dustfree absorbent swabs for cleaning the LC connectors

4. Put a little cleaning solvent on the dustfree absorbent swab.
5. Place the dustfree absorbent swab gently on the adapter so that the cleaning
solvent is against the fiber end face. Draw out the dustfree absorbent swab
from the fiber adapter and then rotate the dustfree absorbent swab clockwise
once. Ensure that the tip of the dustfree absorbent swab directly contacts the
fiber end face.

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6. Use the compressed air to blow off dust on the fiber end face.

NO TE

● When using the compressed air, keep the nozzle as close as possible to the fiber
end face without touching it.
● Before using the compressed air, first spray it into the air to expel deposits in the
compressed air.
7. Step 7 Use a fiber microscope to inspect the fiber to check whether there is
any dirt. For details, see "Inspecting Optical Fiber Connectors". If the fiber end
face is still dirty, repeat 1 to 6.
8. Connect the fiber to the optical port immediately. If it is not used for the time
being, put a protective cap on it.
9. Turn on the laser after connecting the fiber to the board.

4.2.8.7 Installing the NE5000E-X16A/X16B in a Cabinet

NO TICE

● The NE5000E-X16A/X16B is heavy. We recommend you use a mechanical lift to
lift and move the device.
● Before moving the device into a cabinet, remove the filler panels and fan
assemblies from the device to reduce the weight, as shown in Figure 4-141 and
Figure 4-142. Extra care should be taken to prevent damaging slot connectors.
● Remove the air intake frame from the device before installing the device into
the cabinet to avoid damaging the air intake frame, as shown in Figure 4-143.
● Use only the lifting handles at both sides of the device to slightly lift and move
the chassis, as shown in Figure 4-144. Do not use handles on any of the boards
or components.
● Do not step on the air filter at the bottom of the cabinet when installing the
device.

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Figure 4-141 Removing filler panels

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Figure 4-142 Removing fan assemblies

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Figure 4-143 Removing the air intake frame

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Figure 4-144 Handles for moving the device

1. Install guide rails.

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Figure 4-145 Installing guide rails

NO TE

● The side with ground screws on top is the rear of a Huawei cabinet.
● Ensure that the bottom of each guide rail is aligned with the markings on the
mounting bar.
● Ensure that the floating nuts are installed securely so that they will not disconnect
when they are fastened with screws.
● Ensure a clearance of 1 U between the guide rails and the bottom of the cabinet.
(1 U = 44.45 mm)
2. Use a measuring tape to measure and locate the positions for mounting ear
screws on mounting bars. Install floating nuts in these positions.

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Figure 4-146 Installing floating nuts

3. Place the NE5000E-X16A/X16B on the guide rails and slide the chassis into the
cabinet from the front. Put M6 panel screws into the floating nuts and fasten
the screws to secure the chassis.
4. Attach an ID nameplate on each panel and cabinet based on the engineering
design.

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Figure 4-147 Installing the NE5000E-X16A/X16B in the cabinet

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4.2.8.8 Installing Ground Cables

Ground Cable and Terminal Specifications
Item Specification Huawei Remark
BOM
Number

Cabinet 25mm2 25030431 -
ground
cable/
chassis
ground
cable

Cabinet 25 mm2–M8 single-hole OT 14170060 Connects to the
ground naked crimping terminal ground terminal on
cable the top of the cabinet
terminal and the ground bar in
the equipment room.

Chassis 25 mm2–M6 single-hole OT 14170147 Used when the device
ground naked crimping terminal is connected to the
cable cabinet.
terminal
25 mm2–M6 double-hole JG 14170119 Connects to the
naked crimping terminal ground terminal of the
device.

Installing Ground Cables
NO TE

● You can connect the ground cable of the chassis directly to the ground bar in the
equipment room or to the ground point of the cabinet.
● In this section, connecting a device ground cable directly to the ground bar in the
equipment room is used as an example.
1. Attach temporary labels to both ends of each ground cable.
2. Route the ground cable for the cabinet along the cable ladder and connect
the ground cable to the terminal at the cabinet top. Connect the other end of
the ground cable to the ground bar in the equipment room.
3. Route the ground cable for the device along the cable ladder and then the
cable tray and connect the ground cable to the device. Connect the other end
of the ground cable to the ground bar in the equipment room.
4. Attach permanent labels 20 mm (0.79 in.) from both ends of each ground
cable.

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Figure 4-148 Installing ground cables

4.2.8.9 DC Power Distribution

Overview

The device uses non-partitioned power supply, which consists of PEMs, PMs,
PMUs, and switches. In the DC power distribution mode, the DC PEM and DC PM
are used. The PEM connects to the PM in the chassis. Power is input into the PM
through the PEM. The PM smoothens the current and stabilizes the voltage before
providing power for the device.

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There are two power supply switches on a device. When one or two switches are
on, the device powers on. When two switches are off, the device powers off. To
ensure power supply for a running device, ensure that two switches are on.

Figure 4-149 Main components of the DC power supply system

1. DC PM 2. PMU 3. 4. DC PEM
Switch

You can configure PMs based on the board power consumption on the device. PMs
work in N+N backup mode. The PMs that back up each other obtains power from
different power sources so that one can provide power when the other becomes
faulty. When the power supply system is fully configured with eight pairs of PMs
(16 PMs), a maximum of 17600 W power is provided.
The following table shows the DC PM technical specifications.

Table 4-40 DC PM technical specifications
Item Parameter

Rated input voltage -48 V DC to -60 V DC

Input voltage range -40 V DC to -72 V DC

Maximum input current 63 A

Maximum output 2200 W
power of a module

PEMs connect to PMs in the chassis. The mappings between PMs and PEM wiring
terminals are as follows.

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Figure 4-150 Mappings between PEMs and PMs

Power Distribution Principle
NO TE

● One PM outputs a maximum of 2200 W power. You can configure PMs based on the
required power.
● PMs work in N+N backup mode. N PMs (N >= 1) are configured on planes A and B,
respectively. The PMs are backed up in the pair of A1 and B1, A2 and B2, A3 and B3, and
so on.
● Note that different power sources must be provided for PMs on planes A and B so that
one can provide power when the other becomes faulty.
● To facilitate further expansion, configure the PMs and install power cables in ascending
order of PM slot numbers.
Power Distribution Instance
The following table shows the number of PMs required for specific power
consumption.

Power PM Configurations
Consumption

2200 W One pair of PMs, A1 and B1

4400 W Two pairs of PMs, A1 and B1, A2 and B2

6600 W Three pairs of PMs, A1 and B1, A2 and B2, A3 and B3

...... ......

17600 W Eight pairs of PMs

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Recommended configurations
The following table shows the recommended power supply configurations. You
can choose the PM configuration based on the actual platform.

Power Supply -48 V DC power supply
Scenario

400G 6+6

1T 8+8

Cable and Terminal Specifications
The PDF requires protection components to ensure that the rated current of each
channel is not less than 63 A. The following table shows the cable and terminal
specifications.

Table 4-41 Cable and terminal specifications
Distance Item Specification Huawei BOM Remarks
from the Number
PDF to the
NE5000E-
X16A

Shorter DC power 25 mm2 (4 25030101 Blue
than or cable AWG)
equal to 25 25030432 Black
m (82.02
Terminal 25 mm2 (4 14170119 It is connected
ft.)
AWG)–M6 to the device.
double-hole JG
naked crimping
terminal

25 mm2 (4 14170060 It is connected
AWG)–M8 to the PDF.
single-hole OT
naked crimping
terminal

Heat shrink Heat Shrink 28040009 -
tube Tube, D14,
Radial
Shrinkage
Ratio>50%,Blac
k

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Distance Item Specification Huawei BOM Remarks
from the Number
PDF to the
NE5000E-
X16A

Greater DC power 35mm2 (2 25030199 Blue
than 25 m cable AWG)
(82.02 ft.) 25030420 Black
and less
Terminal 35 mm2 (2 14170159 It is connected
than 35 m
AWG)–M6 to the device.
(114.83 ft.)
double-hole JG
naked crimping
terminal

35 mm2 (2 14170063 It is connected
AWG)–M8 to the PDF.
single-hole OT
naked crimping
terminal

Heat shrink Heat Shrink 28040013 -
tube Tube, D18,
Radial
Shrinkage
Ratio>50%,Blac
k

Greater - A PDF or end - -
than 35 m of row needs
(114.83 ft.) to be placed
near the
NE5000E-X16A.

Installing Power Cables

DANGER

Do not install power cables when the power is on.

1. Install PMs.

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Figure 4-151 Installing PMs

2. Route power cables along the cable ladder to the chassis.
3. Remove plastic covers on connection boxes of power modules and connect
power cables to the corresponding terminals. Connect the other end of each
power cable to the PDF.
4. After connecting power cables, re-install the plastic covers for the power
modules.
5. Use cable ties to bundle cables every 150 mm (5.91 in.) upwards from the
bottom and fasten the cables to the cable tray.
6. Attach permanent labels 20 mm (0.79 in.) from both ends of each ground
cable.

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Figure 4-152 Installing power cables

NO TE

To ensure that the power cable is of sufficient length, perform the following steps:
1. Prepare a power cable with a length longer than the distance between the power
module and PDF.
2. Install a terminal on one end of the power cable and connect the terminal to the device.
3. Route the power cable, bind it to the cable tray, and cut any excess length from the
cable. Install a terminal on the other end of the power cable and connect the terminal
to the PDF.

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4.2.8.10 240V High Voltage DC Power Distribution

Overview
The device uses non-partitioned power supply, which consists of PEMs, PMs,
PMUs, and switches. In the DC power distribution mode, the DC PEM and DC PM
are used. The PEM connects to the PM in the chassis. Power is input into the PM
through the PEM. The PM smoothens the current and stabilizes the voltage before
providing power for the device.
There are two power supply switches on a device. When one or two switches are
on, the device powers on. When two switches are off, the device powers off. To
ensure power supply for a running device, ensure that two switches are on, if there
is a power supply switch is off, it will be generated an alarm in PM.

Figure 4-153 Main components of the 240V High Voltage DC power supply
system

1. DC PM 2. PMU 3. 4. DC PEM
Switch

You can configure PMs based on the board power consumption on the device. PMs
work in N+N backup mode. The PMs that back up each other obtains power from
different power sources so that one can provide power when the other becomes
faulty. When the power supply system is fully configured with eight pairs of PMs
(16 PMs), a maximum of 24000 W power is provided.
The following table shows the 240V High Voltage DC PM technical specifications.

Table 4-42 240V High Voltage DC PM technical specifications

Item Parameter

Rated input voltage 240 V DC

Input voltage range 192 V DC to 288 V DC

Output voltage range 53.5 V DC ± 0.5 V DC

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Item Parameter

Maximum input current 14 A
of each supply

Maximum output 3000 W
power of a module

PEMs connect to PMs in the chassis. The mappings between PMs and PEM wiring
terminals are as follows.

Figure 4-154 Mappings between PEMs and PMs

Power Distribution Principle
NO TE

● One PM outputs a maximum of 3000 W power. You can configure PMs based on the
required power.
● PMs work in N+N backup mode. N PMs (N >= 1) are configured on planes A and B,
respectively. The PMs are backed up in the pair of A1 and B1, A2 and B2, A3 and B3, and
so on.
● Note that different power sources must be provided for PMs on planes A and B so that
one can provide power when the other becomes faulty.
● To facilitate further expansion, configure the PMs and install power cables in ascending
order of PM slot numbers.
Power Distribution Instance
The following table shows the number of PMs required for specific power
consumption.

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Power PM Configurations
Consumption

3000 W One pair of PMs, A1 and B1

6000 W Two pairs of PMs, A1 and B1, A2 and B2

9000 W Three pairs of PMs, A1 and B1, A2 and B2, A3 and B3

...... ......

24000 W Eight pairs of PMs

Recommended configurations

The following table shows the recommended power supply configurations. You
can choose the PM configuration based on the actual platform.

Power Supply 240 V HVDC power supply
Scenario

400G 5+5

1T 7+7

Cable and Terminal Specifications

The PDF requires protection components to ensure that the rated current of each
channel is not less than 14 A. The following table shows the cable and terminal
specifications.

Table 4-43 Cable and terminal specifications

Item Description Huawei BOM Number

DC input External Suite, Power Cords 04000207
cables All Over The World, Class I
Equipment With Connector
C19, External Cable Set

Installing Power Cables

DANGER

Do not install power cables when the power is on.

1. Install PMs.

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Figure 4-155 Installing PMs

2. Route power cables along the cable ladder to the chassis.
3. Remove plastic covers on connection boxes of power modules and connect
power cables to the corresponding terminals. Connect the other end of each
power cable to the PDF.
4. After connecting power cables, re-install the plastic covers for the power
modules.
5. Use cable ties to bundle cables every 150 mm (5.91 in.) upwards from the
bottom and fasten the cables to the cable tray.
6. Attach permanent labels 20 mm (0.79 in.) from both ends of each ground
cable.

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Figure 4-156 Installing power cables

4.2.8.11 380 V High Voltage DC Power Distribution

Overview

The device uses non-partitioned power supply, which consists of PEMs, PMs,
PMUs, and switches. In the DC power distribution mode, the DC PEM and DC PM
are used. The PEM connects to the PM in the chassis. Power is input into the PM
through the PEM. The PM smoothens the current and stabilizes the voltage before
providing power for the device.

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There are two power supply switches on a device. When one or two switches are
on, the device powers on. When two switches are off, the device powers off. To
ensure power supply for a running device, ensure that two switches are on, if there
is a power supply switch is off, it will be generated an alarm in PM.

Figure 4-157 Main components of the 380 V High Voltage DC power supply
system

1. DC PM 2. PMU 3. 4. DC PEM
Switch

You can configure PMs based on the board power consumption on the device. PMs
work in N+N backup mode. The PMs that back up each other obtains power from
different power sources so that one can provide power when the other becomes
faulty. When the power supply system is fully configured with eight pairs of PMs
(16 PMs), a maximum of 24000 W power is provided.
The following table shows the 380 V High Voltage DC PM technical specifications.

Table 4-44 380 V High Voltage DC PM technical specifications
Item Parameter

Rated input voltage 380 V DC

Input voltage range 260 V DC to 400 V DC

Input voltage range 53.5 V DC ± 0.5 V DC

Maximum input current 14 A
of each supply

Maximum output 3000 W
power of a module

PEMs connect to PMs in the chassis. The mappings between PMs and PEM wiring
terminals are as follows.

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Figure 4-158 Mappings between PEMs and PMs

Power Distribution Principle
NO TE

● One PM outputs a maximum of 3000 W power. You can configure PMs based on the
required power.
● PMs work in N+N backup mode. N PMs (N >= 1) are configured on planes A and B,
respectively. The PMs are backed up in the pair of A1 and B1, A2 and B2, A3 and B3, and
so on.
● Note that different power sources must be provided for PMs on planes A and B so that
one can provide power when the other becomes faulty.
● To facilitate further expansion, configure the PMs and install power cables in ascending
order of PM slot numbers.
Power Distribution Instance
The following table shows the number of PMs required for specific power
consumption.

Power PM Configurations
Consumption

3000 W One pair of PMs, A1 and B1

6000 W Two pairs of PMs, A1 and B1, A2 and B2

9000 W Three pairs of PMs, A1 and B1, A2 and B2, A3 and B3

...... ......

24000 W Eight pairs of PMs

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Recommended configurations
The following table shows the recommended power supply configurations. You
can choose the PM configuration based on the actual platform.

Power Supply 380 V HVDC power supply
Scenario

400G 5+5

1T 7+7

Cable and Terminal Specifications
The PDF requires protection components to ensure that the rated current of each
channel is not less than 14 A. The following table shows the cable and terminal
specifications.

Table 4-45 Cable and terminal specifications
Item Description Huawei BOM Number

DC input Power Cable-3m-3*1.5mm^2- 04151269
cables (HVDC
3SF)-(227IEC53-1.5^2(3C))-(3
*OT1-8)-380V High Voltage
DC PEM Dedicated

Installing Power Cables

DANGER

Do not install power cables when the power is on.

1. Install PMs.

Figure 4-159 Installing PMs

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2. Route power cables along the cable ladder to the chassis.
3. Remove plastic covers on connection boxes of power modules and connect
power cables to the corresponding terminals. Connect the other end of each
power cable to the PDF.
4. After connecting power cables, re-install the plastic covers for the power
modules.
5. Use cable ties to bundle cables every 150 mm (5.91 in.) upwards from the
bottom and fasten the cables to the cable tray.
6. Attach permanent labels 20 mm (0.79 in.) from both ends of each ground
cable.

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Figure 4-160 Installing power cables

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4.2.8.12 AC Power Distribution

Power Distribution Principle
NO TE

● One PM outputs a maximum of 2700 W or 3000 W power. You can configure PMs based
on the required power.
● PMs work in N+N backup mode. N PMs (N >= 1) are configured on planes A and B,
respectively. The PMs are backed up in the pair of A1 and B1, A2 and B2, A3 and B3, and
so on.
● Note that different power sources must be provided for PMs on planes A and B so that
one can provide power when the other becomes faulty.
● To facilitate further expansion, configure the PMs and install power cables in ascending
order of PM slot numbers.

Power Distribution Instance
The following table shows the number of PMs required for specific power
consumption.

Table 4-46 2700 W power distribution instance
Power PM Configurations
Consumption

2700 W One pair of PMs, A1 and B1

5400 W Two pairs of PMs, A1 and B1, A2 and B2

8100 W Three pairs of PMs, A1 and B1, A2 and B2, A3 and B3

... ...

21600 W Eight pairs of PMs

Recommended configurations
The following table shows the recommended power supply configurations. You
can choose the PM configuration based on the actual platform.

Power Supply AC Power Supply
Scenario

400G 5+5

1T 7+7

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Cable and Terminal Specifications
The PDF requires protection components to ensure that the rated current of each
channel is not less than 16 A. The following table shows the cable and terminal
specifications.

Table 4-47 Cable and terminal specifications

Item Description Huawei BOM Number

AC input cables External Suite, Power Cords 04000408 or 04000207
All Over The World, Class I
Equipment With Connector
C19, External Cable Set

NO TE

Choose cables in the package according to standards in various countries and areas.

Installing AC PMs and Power Cables

DANGER

Ensure that the device is powered off before installing power cables.

1. Install AC PMs.

Figure 4-161 Installing AC PMs

2. Attach temporary labels to both ends of each power cable.
3. Route AC power cables along the cable ladder to the chassis.

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4. Connect one end of each power cable to an input terminal of the AC power
distribution box and the other end to the PDF.
5. After cables are connected to the terminals, use cable fasteners to secure the
cables to the terminals.
6. Use cable ties to bundle the cables every 150 mm (5.91 in.) upwards from the
bottom and secure the cables to the vertical cable trough.
7. Attach permanent labels 20 mm (0.79 in.) to both ends of each power cable.

Figure 4-162 Installing power cables

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4.2.8.13 Installing Boards and Subcards

CA UTION

● Ensure that no liquid is on the chassis or board before you install the board.
● Before installing a board, wear an ESD wrist strap or gloves to prevent
electrostatic discharge of the human body from damaging sensitive
components.
● Vacant slots must be covered with filler panels.

NO TICE

● Boards must be installed upside down in the lower part of the chassis. The
installation method is similar to that in the upper part of the chassis.
● If a board cannot be inserted into the chassis, check whether the color on both
ends of the board is the same as that of the slot label on the chassis. If their
colors are different, check whether the board is inserted into the correct slot.
● Before installing a subcard, remove unnecessary guide rails from the
corresponding board and store them properly.

Slot Layout

Figure 4-163 Slot layout

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Interface Numbering Rules
An interface is numbered in the format of LPU number/subcard number/port
number.
● LPU number: The slots are numbered from 1 to 16, starting from 1.
● Subcard number: The subcards are numbered from 0. If there is no subcard
on a board, the subcard number is 0.
● Port number: The ports are numbered from 0.

Removing Redundant Guide Rails for Installing Subcards
Before installing a half-width or full-width subcard, remove unnecessary guide
rails in the middle from the corresponding board.
1. Use a Phillips screwdriver to remove the screws.
2. Remove the guide rails from the corresponding board.

Figure 4-164 Removing redundant guide rails (1)

Figure 4-165 Removing redundant guide rails (2)

Installing Boards and Subcards
Install a board, as shown by A in Figure 4-166..
1. Remove the filler panel from the target slot.
2. Gently insert the board along the guide rails in the slot.
3. Use the Phillips screwdriver to tighten the two captive screws.
Install a subcard, as shown by B in Figure 4-166.

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1. Check whether the subcard has a connector protection cover. If it has, remove
the cover.
2. Gently push a subcard along the guide rails in the corresponding board slot.
3. Use the Phillips screwdriver to tighten the two captive screws.

Figure 4-166 Installing a board and its subcard

Installing an SFU

NO TE

● SFU installation requires flexible ejector levers. Otherwise, the SFU may fail to be
powered on.
● After installing an SFU, remove the flexible ejector levers from it and attach them to the
cabinet or chassis for future use.

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Figure 4-167 Flexible ejector levels

NO TICE

● Do not use flexible ejector levers to lift a board.
● Never use a single flexible ejector lever to install or remove a board.

1. Take out the flexible ejector levers from both sides of the chassis.

2. Insert an SFU along the guide rails into the slot about half of the board
depth.

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3. Release the latch on each flexible ejector lever, and then insert the levers into
the two ejector lever connectors of the SFU.

4. Use both hands to open the two ejector lever connectors on the SFU using
flexible ejector levers, and push the SFU into the slot along the guide rails
until the two ejector lever connectors reach the edge of the chassis.

5. Use both hands to move the flexible ejector levers inward until the SFU is
fully inserted into the slot, and then use a Phillips screwdriver to tighten the
captive screws.

6. Release the latch on each flexible ejector lever to remove the levers.

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7. Place the flexible ejector levers back in place.

4.2.8.14 Installing Cascading Optical Fibers
NO TE

When installing cascading optical fibers, reserve an extra length of about 3 meters to
facilitate cabling. The extra optical fibers can be twisted around the cable tray.
CXP series optical fibers cannot be deployed across floors.

4.2.8.14.1 Installing Fiber Management Trays

Components of a Fiber Management Tray
A drawer of a fiber management tray can hold two coiling trays. Therefore, two
drawers in a fiber management tray can hold four coiling trays, each of which
provides a fiber spool with a maximum of 6 fibers twisted. The following figure
shows the front and rear views of a fiber management tray.

Figure 4-168 Front view of a fiber management tray

Figure 4-169 Rear view of a fiber management tray

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Installing Fiber Management Trays
1. Locate and install slide rails.
Reserve about 1 U space for installing fiber management trays. Then, install
four fiber management trays without separating them.

2. Install rack mounting ears.
Install rack mounting ears on both sides at the rear of each fiber
management tray.

NO TE

If the rack mounting ears are not installed, the rear parts of the fiber management
trays will droop, adversely affecting future maintenance.

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4.2.8.14.2 Laying Out Optical Fibers

Precautions
CXP optical fibers are expensive precision components because they have optical
modules embedded. When laying out optical fibers, pay attention to the following
points:
1. Do not pull optical fiber connectors or ribbons forcefully.
2. Do not obviously bend optical fiber ribbons to prevent from breaking off
optical fiber cores.
3. Do not rotate optical fiber ribbons to prevent from breaking off optical fiber
cores.
4. Do not remove the protective covers of optical fiber connectors until the
connectors are inserted into devices.
5. Do not fling optical fiber connectors to prevent damaging associated
components.

Installing Optical Fiber Ribbons
1. Attach temporary labels (format: clc1/19/0/0-ccc1/1/3/1) to both ends of
each CXP optical fiber.
2. Spread out optical fibers following the circumferential direction, and bundle
up every six optical fibers as a group to facilitate routing.
3. Insert the optical fibers into CCCs, and connect optical fiber connectors. Tie up
optical fiber ribbons.

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4. Lay out the whole group of optical fiber ribbons in the cable trough and insert
them into the CLC.
5. Put optical fibers on the left of the CCC into the CLC from its right side.
6. Bundle up optical fiber ribbons tidily in the fiber management tray after
connecting optical fiber connectors of the CLC.

Managing Redundant Optical Fibers
The four fiber management trays mounted on the CLC correspond to four SFUs.

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1. Use the coiling tray at the midpoint of redundant optical fibers. Stretch the
redundant optical fibers and put the fiber spool which the optical fibers coil
around in the linear gap of the coiling tray. Then coil redundant optical fibers
around the fiber spool in a clockwise direction.

2. Pull out the front drawer and the rear drawer of the fiber management tray
horizontally to the limit, put each coiling tray with six optical fibers in it into
the fiber management tray. Left slots from 19 to 22 of the SFUs correspond to
8 coiling trays of the front drawer of four fiber management trays, but right
slots from 19 to 22 of the SFUs correspond to the 8 coiling trays of the rear
drawer of four fiber management trays.

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3. Tighten redundant optical fibers outside the fiber management tray by
rotating the hole on the coiling tray after all optical fibers have been coiled to
the fiber management tray.

4.2.8.15 Installing Network Cables

NO TICE

● Before binding network cables, use a network cable tester to test cable
connectivity.
● Ensure that network cables do not block the air filters of SFUs or hinder air
filter removal for cleaning purposes.

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NO TE

● The distance between the power cable, ground cable, and signal cable must be greater
than 30 mm (1.18 in.).
● Bind the cables neatly and secure the cable ties in a uniform manner.
1. Attach temporary labels to both ends of each network cable.
2. Route network cables along the vertical cable trough and plug them into the
corresponding interfaces, as shown in 1 in Figure Installing network cables.
3. Use a network cable tester to test the connectivity of network cables. If there
is no connectivity, replace the cable connectors.
4. Use cable ties to bind network cables every 150 mm (5.91 in.) and secure the
network cables to the cabinet, as shown in 2 in Figure Installing network
cables.
5. Remove the temporary labels and attach permanent labels 20 mm (0.79 in.)
to both ends of each network cable, as shown in 3 in Figure Installing
network cables.

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Figure 4-170 Installing network cables

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4.2.8.16 Installing Optical Fibers

NO TICE

● The distance between the power cable, ground cable, and signal cable must be
greater than 30 mm (1.18 in.). The bending radius of an optical fiber must be
greater than 40 mm (1.57 in.).
● Always keep an open optical module covered by a dust-proof cap.
● Do not bind optical fibers too tightly or too loosely.
● When laying out a cascading optical fiber, reserve a 1.6-meter optical fiber in
the cabinet for cabling and wind the rest optical fiber to the cable rack.
● Ensure that optical fibers do not block the air filters of SFUs or hinder air filter
removal for cleaning purposes.

1. Attach temporary labels to both ends of each optical fiber.
2. Arrange optical fibers into a bundle and insert each bundle into a corrugated
pipe.
3. To prevent damage to fibers, wrap the edges of the corrugated pipe with PVC
insulation tape, as shown in 1 in Figure 4-171.
4. Route the corrugated pipe along the cable ladder. Then, lead the corrugated
pipe about 100 mm (3.94 in.) into the cabinet through the cable outlet at the
top. Secure the corrugated pipe to the cabinet using cable ties. See 2 in
Figure 4-171.

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Figure 4-171 Fixing corrugated pipe

5. Install optical modules, as shown in 1 in Figure Installing optical fibers.
6. Install dust caps on optical interfaces on which no optical modules are
installed, as shown in 2 in Figure Installing optical fibers.
7. Route optical fibers along the vertical cable trough, remove dust-proof caps
from the optical modules and protective caps from optical fibers, and connect
the optical fibers to the corresponding optical modules, as shown in 3 in
Figure Installing optical fibers.
8. Connect the other end of each optical fiber to an optical distribution frame
(ODF).

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9. Bind optical fibers every 150 mm (5.91 in.) using binding taps and secure the
bound optical fibers to the vertical cable trough using cable fasteners.
10. Remove the temporary labels and attach permanent labels 20 mm (0.79 in.)
to both ends of each optical fiber, as shown in 4 in Figure Installing optical
fibers.

Figure 4-172 Installing optical fibers

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4.2.8.17 Installation in Underfloor Cabling Mode

NO TE

● Underfloor cabling is applicable when a device is installed on the ESD floor.
● For details on cable installation in underfloor cabling mode, see cable installation in
overhead cabling mode. The following figures show how cables are routed.
● In both overhead and underfloor cabling modes, the ground cable of a cabinet is
connected to the ground point on the top of the cabinet.

Underfloor cabling of power cables

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Underfloor cabling of optical fibers and network cables

4.2.8.18 Installing Noise Reduction Modules

NO TE

You can install noise reduction modules only after installing the NE5000E-X16B into an
N610E cabinet.
The method of installing a noise reduction module into the upper chassis is similar to that
of installing a noise reduction module into the lower chassis, except that the module must
be inversely installed into the lower chassis.
1. Install fasteners for noise reduction modules.

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NO TE

There are a total of four fasteners marked with 1, 2, 3, and 4, respectively. Fasteners 1
and 2 are used to install the noise reduction module into the upper chassis, and the
other two fasteners are used to install the noise reduction module into the lower
chassis.
Install the two fasteners used for the noise reduction module in the upper
chassis onto the NE5000E-X16B, and fasten the captive screws.

2. Install the desired noise reduction module.
Place the noise reduction module in the middle of the two fasteners and
fasten the seven captive screws.

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4.2.8.19 Checking the Installation

Cabinet Installation Checklist
No. Requirement

1 The cabinet is in the correct location.

2 The cabinet is properly placed with a horizontal/vertical
deviation of no more than 3 mm (0.12 in.).

3 All bolts and screws are firmly fastened, especially on
electrical connections. Flat and spring washers are used
with each bolt, and spring washers are placed on the
top of flat washers.

4 The cabinet is neat and clean.

5 Cabinet doors can be opened and closed smoothly.

6 All labels, tags, and nameplates are correct, legible, and
complete.

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Device Environment Checklist
No. Requirement

1 No fingerprints or smears exist on the device.

2 There are no unnecessary electrical tapes or cable ties
on cables.

3 No electrical tapes, cable ties, wastepaper, or packing
bags are left around the device.

4 All other items around the device are organized, neat,
and clean.

Electrical Connection Checklist
No. Requirement

1 All assembled PGND cables are copper-based with
proper wire diameters. Cables meet quality standards.

2 All ground cables, AC input cables, and intra-cabinet
cables are connected correctly according to the wiring
diagram, and all screws are tightened. The input and
output cables are not short-circuited.

3 Any redundant parts of power cables or PGND cables
are trimmed off and not coiled.

4 The terminals at both ends of each power cable or
PGND cable are crimped securely.

5 The wiring terminals on cables are wrapped tightly
using PVC insulation tapes or heat shrink tubes.

6 The wiring terminals with heat shrink tubes are heated
using a heat gun.

7 Flat and spring washers are properly installed on each
bolt of a wiring terminal.

8 All cables, especially the cables in the lower area of the
cabinet, are securely connected.

9 Cables are properly bound. Cable ties are installed at
equal spacing and in the same direction.

10 Power and ground cables are bound separately from
other cables.

11 The cable layout accounts for easy maintenance and
expansion in the future.

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No. Requirement

12 The labels at both ends of each cable are correct,
legible, and complete.

13 Excess cable ties are trimmed off.

4.2.8.20 (Optional) Checking Optical Power

The following table describes comparison between the transmit optical power of
50 Gbps optical modules and damaged optical power threshold at the receive end:

Optical Maximum Minimum Damaged Description
Module Type Average Average Optical
Transmit Transmit Power
Optical Optical Threshold at
Power Power the Receive
End

50GBASE-FR 3 -4.1 5.2 The damaged
optical power
50GBASE-LR 4.2 -4.5 5.2 threshold is
greater than
the maximum
average
transmit
optical power,
posting low
self-loop risks.

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Optical Maximum Minimum Damaged Description
Module Type Average Average Optical
Transmit Transmit Power
Optical Optical Threshold at
Power Power the Receive
End

50GBASE-ER 6.6 0.4 -2.4 The damaged
optical power
threshold is
9dBm lower
than the
maximum
average
transmit
optical power
and 2.8dBm
lower than
the minimum
average
transmit
optical power,
posing high
self-loop risks.
In this case,
an optical
attenuator
must be
configured for
self-loop.

For applications of the 50 Gbps optical module supporting a distance of 40 km:
1. To ensure that the optical module runs stably for a long time, adjust the
receive optical power of the optical module to a value lower than -4 dB.
According to the IEEE 802.3 standard, if the receive optical power of the
optical module exceeds -2.3 dB, the optical module may be permanently
damaged.
2. Before connecting to the optical module, use an optical power meter to
measure the receive optical power (P). If P is less than -4 dB, the optical
module can be directly connected. If P is greater than -4 dB, add an optical
attenuator at the receive end to ensure that the receive optical power is less
than -4 dB. Alternatively, add an optical attenuator (no less than 10 dB is
recommended) before the interconnection, and then adjust the optical
attenuator based on the site requirements to prevent the optical module from
being damaged.
3. If a loopback occurs on the pigtail of the optical module or the optical
module is connected for a short distance, an optical attenuator must be
added. It is recommended that the optical attenuator be no less than 10 dB.

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4.2.8.21 Power-on Check

Power-on Check Flowchart

NO TICE

● Before performing a power-on check, ensure that the device power switch is
OFF. Ensure that the input voltage is normal before powering on the device.
● The normal DC power distribution voltage ranges from -40 V DC to -72 V DC.
The normal AC power distribution voltage ranges from 100 V AC to 240 V AC.

Figure 4-173 Device power switch

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Figure 4-174 Power-on check flowchart

Indicators on the NE5000E-
Module/ Indicator Color Description
Board

Power RUN Green ● Blinking quickly (2 Hz) indicates
monitoring that the board has not
module registered.
(PMU) ● Blinking slowly (0.5 Hz)
indicates that the board has
registered and communicates
normally with other boards.

ALM Red ON indicates that an alarm is
generated and OFF indicates that
no alarm is generated.

ACT Green ON indicates that the PMU is the
master one and OFF indicates that
the PMU is the backup one.

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Module/ Indicator Color Description
Board

Power module Input Green ● Blinking slowly (0.5 Hz)
(PM) indicates overvoltage or
undervoltage of input power.
● ON indicates correct input
voltage.

Output Green ON indicates correct output
voltage and OFF indicates
incorrect output voltage.

Alarm Red ON indicates that an alarm is
generated and OFF indicates that
no alarm is generated.

Fan assembly STATUS Green Blinking slowly (0.5 Hz) indicates
(FAN) that fans work normally, and
blinking quickly (2 Hz) indicates
that fans work abnormally.

Red Blinking slowly (0.5 Hz) indicates
that communication is normal but
an alarm is generated. The alarm
indicates an error in fans, one
channel of power, or sensors.

MPU RUN Green Before the MPU is powered on and
registers, the indicator status
changes in the following sequence:
off -> blinking quickly (2 Hz) -> off
-> steady on -> blinking slowly
(0.5 Hz).
After the MPU is powered on and
registers, the indicator blinks at 0.5
Hz, indicating that the board is
working properly.
NOTE
Possible causes for the indicator to
stay off are as follows:
● The BootROM is damaged.
● The MPU cannot be powered on.
Possible causes for the indicator to
blink quickly are as follows:
● The SSD card is faulty.
● The other control modules on the
MPU are faulty, causing an
initialization failure on the MPU.

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Module/ Indicator Color Description
Board

ALM Red If the indicator is steady off, the
MPU works normally. If the
indicator is steady red, an alarm is
generated.

SFU RUN Green After the board is powered on but
before it registers, the indicator
status changes in the following
sequence: off -> blinking once
every 500 ms (2 Hz) -> off ->
steady on -> blinking once every
two seconds (0.5 Hz).
After the board registers, the
indicator blinks at 0.5 Hz,
indicating that the board is
working properly.
NOTE
Possible causes for the indicator to
stay off are as follows:
● The BootROM is damaged.
● The SFU cannot be powered on.
Possible causes for the indicator to
blink quickly are as follows:
● The flash memory is faulty.
● The network port is faulty.

ACT Green If this indicator is steady green, the
board is working properly; if this
indicator is off, the board is faulty.

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Module/ Indicator Color Description
Board

LPU RUN Green After the board is powered on but
before it registers, the indicator
status changes in the following
sequence: off -> blinking once
every 500 ms (2 Hz) -> off ->
steady on -> blinking once every
two seconds (0.5 Hz).
After the board registers, the
indicator blinks at 0.5 Hz,
indicating that the board is
working properly.
NOTE
Possible causes for the indicator to
stay off are as follows:
● The BootROM is damaged.
● The LPU cannot be powered on.
Possible causes for the indicator to
blink quickly are as follows:
● The flash memory is faulty.
● The network port is faulty.

LINK/ACT Green ● If this indicator is off, the link is
Down.
● If this indicator is steady on, the
link is Up.
● If this indicator is blinking, data
is being transmitted.

4.2.9 NE5000E CCC-A Installation Guide

4.2.9.1 Specifications and Components of the NE5000E CCC-A

Device Components
The left figure shows the front view and the right figure shows the rear view of
the NE5000E CCC-A.

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No. Component Name Quantity

1 Power module cage 1
cover

2 Power module (PM) slot 20

3 Switch module slot 2

4 Power monitoring 2
module (PMU) slot

5 Cable trough for the 2
vertically inserted board

6 Main processing unit 2
(MPU) slot

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No. Component Name Quantity

7 ICU slot 2

8 Cable trough for the 2
horizontally inserted
board

9 SFU slot 18

10 Mounting ear 4

11 Air intake frame 2

12 Power entry module 5
(PEM) slot

13 Fan assembly slot 6

14 Lifting handle 6

15 ESD jack 2

16 Air filter 1

17 Ground terminal 1

4.2.9.2 Installation Preparations

Following All Safety Precautions
● Before any operations, read the instructions and precautions in this document
carefully to minimize the possibility of accidents. The Danger, Caution, and
Note items in this document do not cover all the safety precautions that must
be observed. They provide only the generic safety precautions for operations.
● When operating Huawei products and equipment, comply with safety
precautions and special safety instructions relevant to the corresponding
equipment provided by Huawei. The safety precautions in this document are
relevant only to Huawei products. Huawei is not liable for any consequence
that results from violation of universal regulations for safety operations and
safety codes on design, production, and equipment use.

Complying with Local Safety Regulations
When operating the product or equipment, comply with local safety regulations.

Installation Personnel Requirement
Installation and maintenance personnel must be trained to perform operations
correctly and safely.

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Personnel Safety
● The high-voltage power supply provides power for the system. Avoid direct
contact with the high-voltage power supply or contact with it through damp
objects. Otherwise, serious personnel injuries may occur.
● Non-standard and incorrect operations on the high-voltage power supply may
result in fire and electric shock.
● Ground a device before powering it on. This operation prevents damages to
the device or personal injuries.
● Power off a device before performing operations on the power supply
facilities.
● Do not stand close to or look into the optical fiber outlet without eye
protection when handling optical fibers.
● Take preventive measures when drilling holes. Otherwise, dust may hurt your
eyes or you may inhale the dust.
● When working at heights, be cautious about falling objects.

Device Safety
● Keep an unpacked device upright and handle it with care when carrying it or
installing it into a cabinet.

● Do not tilt the device when removing the package or installing it in a cabinet.
Otherwise, the device components may be damaged due to mutual pressing.

● Do not trample in the cabinet interior. Otherwise, the cabinet will be
damaged or deformed.

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● Use the handles at both sides of the device to carry it. Do not use handles on
any other module.

● Do not trample on a device. Instead, use a ladder to lay out cables.

● Wear an ESD wrist strap or ESD gloves when handling circuit boards.
Otherwise, the static electricity discharged from the human body may
damage the electrostatic sensitive components, such as large-scale integrated
circuits (LSIs) on the circuit board.

● Do not place damageable materials on the ground. Otherwise, they may be
trampled.

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● Do not sit on or lean against the materials that are piled on site. Otherwise,
they may be damaged.

● Check the electrical connection of a device before operating on it. Make sure
that the device is securely grounded.

NO TE

In this document, the device appearance is for reference only. In real-world situations, the
device appearance may differ from what is shown in this document.

4.2.9.3 Installation Instructions

About This Guide
● This document provides simple and clear guidelines for quick hardware
installation, but does not describe operations for pre-delivery installations.
● Cable installation procedures for overhead cabling are used as an example in
this document. For details on how to make and use labels, and how to install
cables, see the electronic version of Installation Guide.
● To better illustrate how to install a device into a cabinet, a Huawei cabinet
without the rear door is used as an example. For details on how to install a
cabinet, see the Cabinet Installation Guide included with the cabinet.
● In this document, the equipment exterior is for reference only. The actual
equipment may differ from what is shown in the figures.

Installation Precautions
● Allow a clearance of more than 1100 mm (39.89 in.) in front of and behind
the device for maintenance.
● The side the top of which has a ground screw is the rear side of the cabinet.
Face the rear side of an N610E cabinet and install the Cluster Central Chassis.
● Power modules must be connected correctly to a power distribution box to
ensure power supply reliability.

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● Connect a ground cable to either of the ground terminals on the top of the
cabinet.

Installation Procedure
NO TE
The device supports both DC and AC power supplies. Deploy a power distribution system as
required. For details, see DC Power Distribution or AC Power Distribution.

4.2.9.4 Cabinet Specifications
By default, the is customized for the device.
If you purchase a cabinet for use with a device, ensure that the cabinet meets the
following conditions:

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NO TE

Huawei standard cabinets must be used and meet the standard of 19-inch standard
cabinet.
1. The depth of the cabinet is greater than 1000 mm (39.37 in.), the height of
the cabinet is greater than 2000 mm (78.74 in.).

NO TE

The chassis must be installed in a cabinet with an air filter. If the chassis is installed on
an open rack, an air filter door must be installed for the chassis.
2. The rack mounting rail is more than 275 mm (10.83 in.) away from the front
door of the cabinet, and the front door is less than 25 mm (0.98 in.) thick.

The porosity must be greater than 50% on the front and rear doors.
3. A cabinet must contain installation accessories such as guide rails, tray,
floating nuts, and screws.
4. If the overhead cabling mode is adopted, a cable outlet must be reserved on
the top of the cabinet; if the underfloor cabling mode is adopted, a cable
outlet must be reserved on the bottom of the cabinet.

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4.2.9.5 Installation tools

Tools

Diagonal pliers Phillips screwdriver Flat-head screwdriver

Adjustable wrench Heat gun Marker

Ladder Multimeter ESD gloves

ESD wrist strap Utility knife Wire stripper

Wire clippers RJ45 crimping tool Power cable crimping
tool

Hydraulic pliers Protective gloves Socket wrench

Hammer drill Measuring tape Torque wrench

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Level Network cable tester
Wire fusion handle

Vacuum cleaner Plumb line COAX crimping tool

-

Hammer Torque batch

Installation Related Material
1. PVC black insulation tape
2. Cable tie
3. Binding strap
4. Heat shrink tubing
5. Corrugated pipe
6. Label

4.2.9.6 Inspecting and Cleaning Optical Fiber Connectors and Adapters

4.2.9.6.1 Overview
This topic introduces the purpose and procedure of cleaning optical fiber
connectors, as well as polluters to optical fiber connectors.
Cleaning fiber connectors is to remove dust or other dirt to avoid performance
degradation of optical transmission systems.
Figure 4-175 shows an optical fiber connector.

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Figure 4-175 Optical fiber connector

Optical fiber connectors should be free of:
● Dust
● Grease (usually brought by hands)
● Condensate residue
● Powder (evaporated residue of water or solvent)
Dust is the most common dirt in optical fiber connectors. The dust particles that
can be seen only by a microscope can affect the quality of optical signals,
deteriorate the system performance, and cause instability in network operation.
A 1-micrometer dust particle on the single-mode fiber connector can block 1%
light and cause 0.05 dB attenuation. A 9-micrometer dust particle that cannot be
seen by human eyes can block an entire fiber core. Therefore, small dirt even that
cannot be seen by human eyes should be removed.

NO TE

Before you connect any optical component, make sure that you have checked and cleaned
the component.

Procedure
Table 4-48 describes the procedure of inspecting and cleaning the optical fiber
connectors and adapters.

Table 4-48 Procedure of inspecting and cleaning the optical fiber connectors and
adapters

Step Details

Clean optical fiber connectors using See "Cleaning Optical Fiber Connectors
the cassette cleaner Using the Cassette Cleaner".

Clean optical fiber connectors using See "Cleaning Optical Fiber Connectors
lens tissue Using Lens Tissue".

Clean optical fiber adapters using See "Cleaning Optical Fiber Adapters
dustfree absorbent swabs Using Dustfree Absorbent Swabs".

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4.2.9.6.2 Protection of Optical Fiber Connectors
This topic describes requirements for fiber connector protection.
The requirements are as follows:
● All boards with optical ports must be packed properly, to avoid mechanical
and electrostatic damages and to reduce vibrations.
● The protective caps must be put in an ESD bag.
● Protective caps must be installed on all optical fiber connectors when not in
use. The optical fiber connectors must be stored in proper packages to keep
them clean.
● Figure 4-176 shows the recommended protective caps, whereas Figure 4-177
shows the protective caps not recommended.

Figure 4-176 Protective caps recommended

Figure 4-177 Protective caps not recommended

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NO TE

The protective caps not recommended are made of soft rubber, which are apt to absorb
dust and sundries, and difficult to clean.

4.2.9.6.3 Tools, Equipment, and Materials
Optical connectors should be cleaned using recommended tools, equipment and
materials.
The following provides the recommended tools, equipment and materials:
● Optical power meter
● 400X fiber microscope (A video fiber microscope is recommended.)
● Cassette cleaner shown in Figure 4-178
● Cleaning solvent (Isoamylol is preferred, propyl alcohol is the next, and
alcohol or formalin is forbidden.)
● Non-woven lens tissue, fiber cleaning tissue, and dustfree cloth (Non-woven
lens tissue is recommended.)
● Special compressed air
● Special cleaning roll
● Dustfree absorbent swab (made of medical cotton or long fiber cotton)
shown in Figure 4-179 and Figure 4-180

Figure 4-178 Cassette cleaner

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Figure 4-179 Dustfree absorbent swabs for cleaning the SC and FC connectors

Figure 4-180 Dustfree absorbent swabs for cleaning the LC connectors

4.2.9.6.4 Inspecting Optical Fiber Connectors
This topic describes how to inspect the end face of optical fibers using a fiber
microscope.

Tools, Equipment, and Materials
The following provides the required tools, equipment and materials for inspecting
optical fiber connectors:
● Optical power meter
● 400X fiber microscope (A video fiber microscope is recommended.)

Precautions

CA UTION

Laser energy is invisible and may cause eye injuries. Never look directly into fiber
connectors or ports.
Use a fiber microscope equipped with a safety device or a desktop video fiber
microscope when inspecting the optical fiber connectors.

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NO TICE

Electrostatic discharge is hazardous to the electronic equipment. Wear an ESD
wrist strap and ensure that the strap is grounded properly before touching the
equipment and boards, to protect the static-sensitive components against
electrostatic discharge of the human body. Otherwise, the equipment may be
damaged or the service may be interrupted.

Procedure
1. Shut down the laser and disconnect the fiber end before inspecting the fiber
connector.
2. Test the optical power using a power meter to ensure that the laser is shut
down.
3. Use a fiber microscope to check whether the fiber connector is contaminated
or damaged. See the examples below.
– Clean fiber and face
Figure 4-181 shows an image of a clean fiber end face under the fiber
microscope.

Figure 4-181 Clean fiber and face

– Damaged fiber end face
Figure 4-182 shows images of the damaged fiber end face. The image on
the left shows a severely damaged fiber. Severely damaged fibers can
cause damage to the equipment and should not be used. The image on
the right shows a defective fiber. If the output power is within a certain
range, the defective fiber might not cause any damage to the equipment.
If the output power is unstable or out of the range, however, the
defective fiber can cause damage to the equipment.

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Figure 4-182 Damaged or defective fiber end face

NO TE

Figure 4-182 shows only the 800-micrometer fiber cores.
For details on acceptable and unacceptable fibers, see Figure 4-183, Figure
4-184 and Figure 4-185.

Figure 4-183 Clean fiber end face

Figure 4-184 Acceptable fibers with imperfections

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Figure 4-185 Unacceptable fibers with imperfections

4. If any dirt is detected, clean the optical fiber connector. For details, see
"Cleaning Optical Fiber Connectors Using the Cassette Cleaner" and "Cleaning
Optical Fiber Connectors Using Lens Tissue".
5. If any damage is detected, replace the fiber.

4.2.9.6.5 Inspecting the Optical Fiber Link
This section describes the insertion loss and reflection requirements of optical links
and the method of checking the quality of optical links for the application of 50G
optical modules with the PAM4 coding technology.

Tools, Equipment, and Materials
Tools and instruments for checking optical fiber links are as follows:
● OTDR meter
● Fiber microscope

Precautions

CA UTION

Because the transmit optical power of the OTDR meter is much higher than the
damaged optical power threshold at the receive end, the optical fiber must be
removed from the optical module when the OTDR meter is used to test the optical
path quality.

Currently, the Ethernet port rate is increasing. Since the 50G optical module link
uses the PAM4 encoding technology, there are higher requirements on the optical
fiber and cable quality and the link is more sensitive to multipath reflection
interference of signals. If the fiber link connector, fiber section, or fiber splicing
surface is dirty, optical signals are reflected back and forth on the fiber link,
causing interference due to co-channel noise on the receive side. As a result, the
optical link is unstable or intermittently disconnected.

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According to the national standard (GBT50312-2016), the loss of the optical fiber
link connector must meet the requirements described in Table 4-49.

Table 4-49 Maximum attenuation of the optical fiber connector

Type Maximum attenuation of an optical fiber
connector (dB)

Fiber splicing connector 0.3

Optical mechanical connector 0.3

Optical connector 0.75

NO TE

Fiber cores are connected through connectors, such as the ODF, optical attenuator, and
flange, in splicing and mechanical modes.

Table 4-50 describes requirements for the reflection of the optical fiber connector
when Ethernet ports (such as 50G) use PAM4 encoding to double the rate. More
connectors bring lower requirements for the reflection.

Table 4-50 Maximum reflection of connectors

Number of Maximum Reflection of Each Connector (dB)
Optical Fiber
Connectors 50GBASE-FR 50GBASE-LR 50GBASE-ER

1 -25 -22 -19

2 -31 -29 -27

4 -35 -33 -32

6 -38 -35 -35

8 -40 -37 -37

10 -41 -39 -39

Procedure
1. After the optical fiber at the peer end is disconnected, use the OTDR meter to
test the local end. Check whether the loss and reflection of each link and
node are normal. (The loss of a fiber splicing connector should be less than
0.3 dB, the loss of a connector should be less than 0.75 dB, and the reflection
of a connector should be less than -30 dB.) If the test result is not within the
required range, process the abnormal port.
2. Locate the equipment room where the port resides based on the distance
between abnormal points in the OTDR test result. Preliminarily determine the
port location, disconnect the port, and perform an OTDR test on the port that

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reports alarms. Check whether the distance is consistent with that in the
previous test. If not, continue to test other ports.
3. After the abnormal port is found, test the port using a fiber microscope. If the
port is dirty, clean it. For details, see "Inspecting and Cleaning Optical Fiber
Connectors and Adapters".
4. After the port is cleaned, restore the port, and ensure that the connector is
tightened. Perform an OTDR test on the port to check whether loss and
reflection of each link and node are normal.
5. If the fault persists, replace the flange and perform an OTDR test on the port
that reports alarms to check whether loss and reflection of each link and
node are normal.
6. If the fault persists, replace the optical fiber and perform an OTDR test on the
port that reports alarms to check whether loss and reflection of each link and
node are normal.
7. If multiple abnormal points exist on the link, repeat steps 2 to 6.

4.2.9.6.6 Cleaning Optical Fiber Connectors Using the Cassette Cleaner

This topic describes how to clean the fiber connectors using a cassette cleaner.

Prerequisites

Before cleaning, inspect the fiber end face with a fiber microscope or a magnifier
to confirm the degree of fiber contamination. Clean the fiber only when it is
severely contaminated. This is because the cleaning operation itself may introduce
dust, dirt, or cause damage to the fiber.

The following procedure provides the steps to clean the fiber connectors using
cartridge type cleaners.

Tools, Equipment, and Materials

The following lists the required tools, equipment and materials for cleaning optical
fiber connectors:

● Cassette cleaner
● Optical power meter
● 400X fiber microscope (A video fiber microscope is recommended.)

Precautions

CA UTION

Laser energy is invisible and may cause eye injuries. Never look directly into fiber
connectors or ports.

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Hardware Guide 4 Hardware Installation and Parts Replacement

NO TICE

Electrostatic discharge is hazardous to the electronic equipment. Wear an ESD
wrist strap and ensure that the strap is grounded properly before touching the
equipment and boards, to protect the static-sensitive components against
electrostatic discharge of the human body. Otherwise, the equipment may be
damaged or the service may be interrupted.

Procedure
1. Shut down the laser and disconnect the fiber end before inspecting the fiber
connector.
2. Test the optical power using a power meter to ensure that the laser is shut
down.
3. Press down and hold the lever of the cassette cleaner. The shutter slides back
and exposes a new cleaning area. See Figure 4-186.

Figure 4-186 Using the cassette cleaner

4. Place the fiber end face gently against the cleaning area.
5. Drag the fiber end face gently on one cleaning area in the arrow direction
each time. See Figure 4-187. Do it again on the other cleaning area in the
same direction as the first time once. See Figure 4-188.

NO TICE

Do not drag the fiber end face on the same cleaning area more than once.
Otherwise, the connector can be contaminated or damaged.

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Hardware Guide 4 Hardware Installation and Parts Replacement

Figure 4-187 Dragging the fiber end face gently on one cleaning area

Figure 4-188 Dragging the fiber end face gently on the other cleaning area

6. Release the lever of the cassette cleaner to close the cleaning area.
7. Use a fiber microscope to inspect the fiber to check whether there is any dirt.
For details see the examples shown in "Inspecting Optical Fiber Connectors".
If the fiber end face is still dirty, repeat 1 to 6.
8. Connect the fiber to the optical port immediately. If it is not used for the time
being, put a protective cap on it.
9. Turn on the laser after connecting the fiber to the board.

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Hardware Guide 4 Hardware Installation and Parts Replacement

4.2.9.6.7 Cleaning Optical Fiber Connectors Using Lens Tissue

This topic describes how to clean the fiber connectors using lens tissue.

Prerequisites

Before cleaning, inspect the fiber end face with a fiber microscope or a magnifier
to confirm the degree of fiber contamination. Clean the fiber only when it is
severely contaminated. This is because the cleaning operation itself may introduce
dust, dirt, or cause damage to the fiber.

Tools, Equipment, and Materials

The following provides the required tools, equipment and materials:
● Optical power meter
● 400X fiber microscope (A video fiber microscope is recommended.)
● Cleaning solvent (Isoamylol is preferred, propyl alcohol is the next, and
alcohol or formalin is forbidden.)
● Non-woven lens tissue, fiber cleaning tissue, and dustfree cloth (Non-woven
lens tissue is recommended.)
● Special compressed air or cleaning roll

Precautions

CA UTION

Laser energy is invisible and may cause eye injuries. Never look directly into fiber
connectors or ports.

NO TICE

Electrostatic discharge is hazardous to the electronic equipment. Wear an ESD
wrist strap and ensure that the strap is grounded properly before touching the
equipment and boards, to protect the static-sensitive components against
electrostatic discharge of the human body. Otherwise, the equipment may be
damaged or the service may be interrupted.

Procedure
1. Shut down the laser and disconnect the fiber end before inspecting the fiber
connector.
2. Test the optical power using a power meter to ensure that the laser is shut
down.
3. Put a little cleaning solvent on the lens tissue.
4. Clean the fiber end face on the lens tissue. See Figure 4-189 and Figure
4-190.

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Hardware Guide 4 Hardware Installation and Parts Replacement

NO TICE

Drag the fiber end face on the same area in the lens tissue only once.
Otherwise, the connector can be contaminated or damaged.

Figure 4-189 Cleaning the fiber end face using the lens tissue on the desk

Figure 4-190 Cleaning the fiber end face using the lens tissue on the hand

5. Repeat 4 several times on the areas of the lens tissue that have not been
used.
6. Use the compressed air to blow off dust on the fiber end face.

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Hardware Guide 4 Hardware Installation and Parts Replacement

NO TE

● When using the compressed air, keep the nozzle as close as possible to the fiber
end face without touching it.
● Before using the compressed air, first spray it into the air to expel deposits in the
compressed air.
● If the compressed air is not available, use a cleaning roll instead.
7. Use a fiber microscope to inspect the fiber to check whether there is any dirt.
For details, see the examples shown in "Inspecting Optical Fiber Connectors".
If the fiber end face is still dirty, repeat 1 to 6.
8. Do not touch the fiber connector after cleaning it. Connect it to the optical
port immediately. If it is not used for the time being, put a protective cap on
it.

NO TE

Do not use the same cleaning area to clean the fiber connector for more than one
time.
9. Turn on the laser after connecting the fiber to the board.

4.2.9.6.8 Cleaning Optical Fiber Adapters Using Dustfree Absorbent Swabs

This topic describes how to clean fiber adapters using dustfree absorbent swabs.

Prerequisites

There are several types of dustfree absorbent swabs available. Select appropriate
dustfree absorbent swabs based on site conditions. You can obtain the following
tools and materials from a fiber cable and connector manufacturer.

Tools, Equipment, and Materials

The following lists the required tools, equipment and materials:
● Optical power meter
● 400X fiber microscope (A video fiber microscope is recommended.)
● Cleaning solvent (Isoamylol is preferred, propyl alcohol is the next, and
alcohol or formalin is forbidden.)
● Special compressed air
● Dustfree absorbent swab (made of medical cotton or long fiber cotton)

Precautions

CA UTION

Laser energy is invisible and may cause eye injuries. Never look directly into fiber
connectors or ports.

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Hardware Guide 4 Hardware Installation and Parts Replacement

NO TICE

Electrostatic discharge is hazardous to the electronic equipment. Wear an ESD
wrist strap and ensure that the strap is grounded properly before touching the
equipment and boards, to protect the static-sensitive components against
electrostatic discharge of the human body. Otherwise, the equipment may be
damaged or the service may be interrupted.

Procedure
1. Shut down the laser and disconnect the fiber end before inspecting the fiber
connector.
2. Test the optical power using a power meter to ensure that the laser is shut
down.
3. Select the dustfree absorbent swab with a proper diameter based on the type
of an adapter.

NO TE

For SC and FC fiber adapters, use the dustfree absorbent swab with a diameter of 2.5
mm (0.1 in.); for the LC fiber adapter, use the dustfree absorbent swab with a
diameter of 1.25 mm (0.05 in.). See Figure 4-191 and Figure 4-192.

Figure 4-191 Dustfree absorbent swabs for cleaning the SC and FC connectors

Figure 4-192 Dustfree absorbent swabs for cleaning the LC connectors

4. Put a little cleaning solvent on the dustfree absorbent swab.
5. Place the dustfree absorbent swab gently on the adapter so that the cleaning
solvent is against the fiber end face. Draw out the dustfree absorbent swab
from the fiber adapter and then rotate the dustfree absorbent swab clockwise
once. Ensure that the tip of the dustfree absorbent swab directly contacts the
fiber end face.

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Hardware Guide 4 Hardware Installation and Parts Replacement

6. Use the compressed air to blow off dust on the fiber end face.

NO TE

● When using the compressed air, keep the nozzle as close as possible to the fiber
end face without touching it.
● Before using the compressed air, first spray it into the air to expel deposits in the
compressed air.
7. Step 7 Use a fiber microscope to inspect the fiber to check whether there is
any dirt. For details, see "Inspecting Optical Fiber Connectors". If the fiber end
face is still dirty, repeat 1 to 6.
8. Connect the fiber to the optical port immediately. If it is not used for the time
being, put a protective cap on it.
9. Turn on the laser after connecting the fiber to the board.

4.2.9.7 Installing the NE5000E CCC-A into the Cabinet

NO TICE

● The NE5000E CCC-A is heavy. Using a mechanical lift to lift and move the
device is recommended.
● The NE5000E CCC-A is completely covered with protective plates during
transport. Before installing the NE5000E CCC-A into the cabinet, remove the
protective plate covering the rear surface and retain that covering the front
surface, as shown in Figure 4-193 and Figure 4-194.
● Use only the lifting handles at both sides of the device to slightly lift and move
the chassis, as shown in Figure 4-195. Do not use handles on any of the boards
or components.
● Do not step on the air filter at the bottom of the cabinet when installing the
device.

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Hardware Guide 4 Hardware Installation and Parts Replacement

Figure 4-193 Removing the protective plate covering the rear surface of the
NE5000E CCC-A

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Hardware Guide 4 Hardware Installation and Parts Replacement

Figure 4-194 Retaining the protective plate covering the front surface of the
NE5000E CCC-A

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Hardware Guide 4 Hardware Installation and Parts Replacement

Figure 4-195 Moving the NE5000E CCC-A

1. Make sure the tray is in the front of the cabinet. Place the NE5000E CCC-A on
the tray of the cabinet, and use the Phillips screwdriver to secure the captive
screws in the cabinet.
2. After installing the NE5000E CCC-A into the cabinet, remove the protective
plate covering the front surface of the NE5000E CCC-A.

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Hardware Guide 4 Hardware Installation and Parts Replacement

Figure 4-196 Installing the NE5000E CCC-A into the cabinet

3. Attach an ID nameplate on each CCC based on the engineering design.

Figure 4-197 Attach an ID nameplate

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Hardware Guide 4 Hardware Installation and Parts Replacement

4.2.9.8 Installing Ground Cables

Ground Cable and Terminal Specifications
Item Specification Huawei BOM Number

Cabinet 25mm2 25030431
ground
cable/
chassis
ground
cable

Cabinet 25 mm2–M8 single-hole OT 14170060
ground naked crimping terminal
cable
terminal

Chassis 25 mm2–M6 single-hole OT 14170147
ground naked crimping terminal
cable
terminal 25 mm2–M6 double-hole JG 14170119
naked crimping terminal

Installing Ground Cables
NO TE

● You can connect the ground cable of the chassis directly to the ground bar in the
equipment room or to the ground point of the cabinet.
● In this section, connecting a device ground cable directly to the ground bar in the
equipment room is used as an example.
1. Attach temporary labels to both ends of each ground cable.
2. Route the ground cable for the cabinet along the cable ladder and connect
the ground cable to the terminal at the cabinet top. Connect the other end of
the ground cable to the ground bar in the equipment room.
3. Route the ground cable for the device along the cable ladder and then the
cable tray and connect the ground cable to the device. Connect the other end
of the ground cable to the ground bar in the equipment room.
4. Attach permanent labels 20 mm (0.79 in.) from both ends of each ground
cable.

4.2.9.9 DC Power Distribution

Overview
The NE5000E CCC-A uses non-partitioned power supply, which consists of PEMs,
PMs, PMUs, and switches. In the DC power distribution mode, the DC PEM and DC
PM are used. The PEM connects to the PM in the chassis. Power is input into the
PM through the PEM. The PM smoothens the current and stabilizes the voltage
before providing power for the device.

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Hardware Guide 4 Hardware Installation and Parts Replacement

There are two power supply switches on a device. When one or two switches are
on, the device powers on. When two switches are off, the device powers off. To
ensure power supply for a running device, ensure that two switches are on and
function in 1+1 backup mode.

Figure 4-198 Main components of the DC power supply system

1. DC PM 2. Switch 3. PMU 4. DC PEM

The NE5000E CCC-A chassis features dual-plane power supply. For a DC power
system, the number of PMs that can be installed depends on the board power
configured. PMs work in N+N backup mode. The PMs that back up each other
obtains power from different power sources so that one can provide power when
the other becomes faulty. When the power supply system is fully configured with
ten pairs of PMs (20 PMs), a maximum of 22000 W power is provided.
The following table shows the DC PM technical specifications.

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Hardware Guide 4 Hardware Installation and Parts Replacement

Table 4-51 DC PM technical specifications
Item Parameter

Rated input voltage -48 V DC to -60 V DC

Input voltage range -40 V DC to -72 V DC

Maximum input current 63 A

Maximum output 2200 W
power of a module

PEMs connect to PMs in the chassis. The mappings between PMs and PEM wiring
terminals are as follows.

The NE5000E CCC-A chassis B features single-plane power supply. For a DC power
system, the number of PMs that can be installed depends on the board power
configured. PMs work in N+M backup mode. (N indicates the number of working
PMs, and M indicates the number of backup PMs. The default M value is 1.) Each
power module has two power inputs, which are connected to power supply areas
A and B respectively. Power supply areas A and B back up each other. A single-
area fault or m module faults do not affect system running.
The following table shows the DC PM technical specifications.

Table 4-52 DC PM technical specifications
Item Parameter

Rated input voltage -48 V DC to -60 V DC

Input voltage range -40 V DC to -72 V DC

Maximum input current 63 A

Maximum output 2200 W
power of a module

PEMs connect to PMs in the chassis. The mappings between PMs and PEM wiring
terminals are as follows.

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Hardware Guide 4 Hardware Installation and Parts Replacement

Power Distribution Principle

NO TE

● One PM outputs a maximum of 2200 W power. You can configure PMs based on the
required power.
● Note that different power sources must be provided for PMs on planes A and B so that
one can provide power when the other becomes faulty.
● To facilitate further expansion, configure the PMs and install power cables in ascending
order of PM slot numbers.

Power Distribution Instance

For the NE5000E CCC-A chassis featuring dual-plane power supply, determine the
number of PMs that can be installed based on the power consumption data listed
in the following table.

Power PM Configurations
Consumption

2200 W One pair of PMs, A1 and B1

4400 W Two pairs of PMs, A1 and B1, A2 and B2

6600 W Three pairs of PMs, A1 and B1, A2 and B2, A3 and B3

...... ......

22000 W Ten pairs of PMs

For the NE5000E CCC-A chassis B featuring single-plane power supply, determine
the number of PMs that can be installed based on the power consumption data
listed in the following table.

Power PM Configurations
Consumption

2200W 1,2

4400W 1,2,3

6600W 1,2,3,4

...... ......

41800W 19+1

Cable and Terminal Specifications

The PDF requires protection components to ensure that the rated current of each
channel is not less than 63 A. The following table shows the cable and terminal
specifications.

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Hardware Guide 4 Hardware Installation and Parts Replacement

Table 4-53 Cable and terminal specifications
Distance Item Specification Huawei BOM Remarks
from the Number
PDF to the
NE5000E
CCC-A

Shorter DC power 25 mm2 (4 25030101 Blue
than or cable AWG)
equal to 30 25030432 Black
m (98.42
OT/JG 25 mm2 (4 14170119 It is connected
ft.)
terminal AWG)–M6 to the device.
double-hole JG
naked crimping
terminal

25 mm2 (4 14170060 It is connected
AWG)–M8 to the PDF.
single-hole OT
naked crimping
terminal

Heat shrink Heat shrink 28040009 -
tube tube, D14,
Radial
Shrinkage
Ratio>50%,Blac
k

Greater DC power 35mm2 (2 25030199 Blue
than 30 m cable AWG)
(98.42 ft.) 25030420 Black
and less
OT/JG 35 mm2 (2 14170159 It is connected
than 43 m
terminal AWG)–M6 to the device.
(141.07 ft.)
double-hole JG
naked crimping
terminal

35 mm2 (2 14170063 It is connected
AWG)–M8 to the PDF.
single-hole OT
naked crimping
terminal

Heat shrink Heat shrink 28040013 -
tube Tube, D18,
Radial
Shrinkage
Ratio>50%,Blac
k

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Hardware Guide 4 Hardware Installation and Parts Replacement

Distance Item Specification Huawei BOM Remarks
from the Number
PDF to the
NE5000E
CCC-A

Greater - A PDF or end - -
than 43 m of row needs
(141.07 ft.) to be placed
near the
NE5000E CCC-
A.

Installing Power Cables

DANGER

Do not install power cables when the power is on.

1. Install PMs.

Figure 4-199 Installing PMs

2. Attach temporary labels to both ends of each power cable.
3. Route power cables along the cable ladder to the chassis.
4. Remove plastic covers on connection boxes of power modules and connect
power cables to the corresponding terminals. Connect the other end of each
power cable to the PDF.
5. After connecting power cables, re-install the plastic covers for the power
modules.
6. Use cable ties to bundle cables every 150 mm (5.91 in.) upwards from the
bottom and fasten the cables to the cable tray.
7. Attach permanent labels 20 mm (0.79 in.) from both ends of each ground
cable.

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Hardware Guide 4 Hardware Installation and Parts Replacement

NO TE

To ensure that the power cable is of sufficient length, perform the following steps:
1. Prepare a power cable with a length longer than the distance between the power
module and PDF.
2. Install a terminal on one end of the power cable and connect the terminal to the device.
3. Route the power cable, bind it to the cable tray, and cut any excess length from the
cable. Install a terminal on the other end of the power cable and connect the terminal
to the PDF.

4.2.9.10 240 V High Voltage DC Power Distribution

Overview
The device uses non-partitioned power supply, which consists of PEMs, PMs,
PMUs, and switches. In the DC power distribution mode, the DC PEM and DC PM
are used. The PEM connects to the PM in the chassis. Power is input into the PM
through the PEM. The PM smoothens the current and stabilizes the voltage before
providing power for the device.
There are two power supply switches on a device. When one or two switches are
on, the device powers on. When two switches are off, the device powers off. To
ensure power supply for a running device, ensure that two switches are on.

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Hardware Guide 4 Hardware Installation and Parts Replacement

Figure 4-200 Main components of the 240V High Voltage DC power supply
system

1. DC PM 2. Switch 3. PMU 4. DC PEM

The NE5000E CCC-A chassis features dual-plane power supply. You can configure
PMs based on the board power consumption on the device. PMs work in N+N
backup mode. The PMs that back up each other obtains power from different
power sources so that one can provide power when the other becomes faulty.
When the power supply system is fully configured with ten pairs of PMs (20 PMs),
a maximum of 30000 W power is provided.

The following table shows the 240V High Voltage DC PM technical specifications.

Table 4-54 240V High Voltage DC PM technical specifications

Item Parameter

Rated input voltage 240 V DC

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Hardware Guide 4 Hardware Installation and Parts Replacement

Item Parameter

Input voltage range 190 V DC to 290 V DC

Output voltage range 53.5 V DC ± 0.5 V DC

Maximum input current 14 A
of each supply

Maximum output 3000 W
power of a module

PEMs connect to PMs in the chassis. The mappings between PMs and PEM wiring
terminals are as follows.

The NE5000E CCC-A chassis B features single-plane power supply. You can
configure PMs based on the board power consumption on the device. Each PM has
two power inputs, which are from power supply areas A and B output by the
power entry module (PEM), respectively. The PM combines the two power inputs
and outputs one. The system uses N+M (M ≥ 1) power module backup mode so
that the device works properly even if M power modules fail.
The following table shows the 240V High Voltage DC PM technical specifications.

Table 4-55 240V High Voltage DC PM technical specifications
Item Parameter

Rated input voltage 240 V DC

Input voltage range 192 V DC to 290 V DC

Output voltage range 53.5 V DC ± 0.5 V DC

Maximum input current 14 A
of each supply

Maximum output 3000 W
power of a module

PEMs connect to PMs in the chassis. The mappings between PMs and PEM wiring
terminals are as follows.

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Hardware Guide 4 Hardware Installation and Parts Replacement

Power Distribution Principle
NO TE

● One PM outputs a maximum of 3000 W power. You can configure PMs based on the
required power.
● Note that different power sources must be provided for PMs on planes A and B so that
one can provide power when the other becomes faulty.
● To facilitate further expansion, configure the PMs and install power cables in ascending
order of PM slot numbers.
Power Distribution Instance
For the NE5000E CCC-A chassis featuring dual-plane power supply, determine the
number of PMs that can be installed based on the power consumption data listed
in the following table.

Power PM Configurations
Consumption

3000 W One pair of PMs, A1 and B1

6000 W Two pairs of PMs, A1 and B1, A2 and B2

9000 W Three pairs of PMs, A1 and B1, A2 and B2, A3 and B3

...... ......

30000 W Ten pairs of PMs

For the NE5000E CCC-A chassis B featuring single-plane power supply, determine
the number of PMs that can be installed based on the power consumption data
listed in the following table.

Power PM Configurations
Consumption

3000W 1,2

6000W 1,2,3

9000W 1,2,3,4

...... ......

57000W 1,2,3,4,5,6,7,8,9,10,11,12,13,14,15,16,17,18,19,20

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Cable and Terminal Specifications

The PDF requires protection components to ensure that the rated current of each
channel is not less than 16 A. The following table shows the cable and terminal
specifications.

Table 4-56 Cable and terminal specifications

Item Description Huawei BOM Number

DC input External Suite, Power Cords 04000207
cables All Over The World, Class I
Equipment With Connector
C19, External Cable Set

NO TE

Choose cables in the package according to standards in various countries and areas.

Installing Power Cables

DANGER

Ensure that the device is powered off before installing power cables.

1. Install PMs.

Figure 4-201 Installing PMs

2. Attach temporary labels to both ends of each power cable.

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Hardware Guide 4 Hardware Installation and Parts Replacement

3. Route power cables along the cable ladder to the chassis.
4. Connect one end of each power cable to an input terminal of the power
distribution box and the other end to the PDF.
5. After cables are connected to the terminals, use cable fasteners to secure the
cables to the terminals.
6. Use cable ties to bundle the cables every 150 mm (5.91 in.) upwards from the
bottom and secure the cables to the vertical cable trough.
7. Attach permanent labels 20 mm (0.79 in.) to both ends of each power cable.

4.2.9.11 380 V High Voltage DC Power Distribution

Overview
The device uses non-partitioned power supply, which consists of PEMs, PMs,
PMUs, and switches. In the DC power distribution mode, the DC PEM and DC PM
are used. The PEM connects to the PM in the chassis. Power is input into the PM
through the PEM. The PM smoothens the current and stabilizes the voltage before
providing power for the device.
There are two power supply switches on a device. When one or two switches are
on, the device powers on. When two switches are off, the device powers off. To
ensure power supply for a running device, ensure that two switches are on.

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Hardware Guide 4 Hardware Installation and Parts Replacement

Figure 4-202 Main components of the 380 V High Voltage DC power supply
system

1. PM 2. Switch 3. PMU 4. PEM

The NE5000E CCC-A chassis features dual-plane power supply. You can configure
PMs based on the board power consumption on the device. PMs work in N+N
backup mode. The PMs that back up each other obtains power from different
power sources so that one can provide power when the other becomes faulty.
When ten pairs of PMs (20 PMs) are fully configured on a device, a maximum of
30000 W power is provided.

The following table shows the 380 V High Voltage DC PM technical specifications.

Table 4-57 380 V High Voltage DC PM technical specifications

Item Parameter

Rated input voltage 380 V DC

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Hardware Guide 4 Hardware Installation and Parts Replacement

Item Parameter

Input voltage range 260 V DC to 400 V DC

Input voltage range 53.5 V DC ± 0.5 V DC

Maximum input current 14 A
of each supply

Maximum output 3000 W
power of a module

PEMs connect to PMs in the chassis. The mappings between PMs and PEM wiring
terminals are as follows.

Figure 4-203 Mappings between PEMs and PMs

The NE5000E CCC-A chassis B features single-plane power supply. You can
configure PMs based on the board power consumption on the device. Each PM has
two power inputs, which are from power supply areas A and B output by the
power entry module (PEM), respectively. The PM combines the two power inputs
and outputs one. The system uses N+M (M ≥ 1) power module backup mode so
that the device works properly even if M power modules fail.

The following table shows the 380 V High Voltage DC PM technical specifications.

Table 4-58 380 V High Voltage DC PM technical specifications

Item Parameter

Rated input voltage 380 V DC

Input voltage range 260 V DC to 400 V DC

Input voltage range 53.5 V DC ± 0.5 V DC

Maximum input current 14 A
of each supply

Maximum output 3000 W
power of a module

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Hardware Guide 4 Hardware Installation and Parts Replacement

PEMs connect to PMs in the chassis. The mappings between PMs and PEM wiring
terminals are as follows.

Figure 4-204 Mappings between PEMs and PMs

Power Distribution Principle

NO TE

● One PM outputs a maximum of 3000 W power. You can configure PMs based on the
required power.
● Note that different power sources must be provided for PMs on planes A and B so that
one can provide power when the other becomes faulty.
● To facilitate further expansion, configure the PMs and install power cables in ascending
order of PM slot numbers.

Power Distribution Instance

For the NE5000E CCC-A chassis featuring dual-plane power supply, determine the
number of PMs that can be installed based on the power consumption data listed
in the following table.

Power PM Configurations
Consumption

3000 W One pair of PMs, A1 and B1

6000 W Two pairs of PMs, A1 and B1, A2 and B2

9000 W Three pairs of PMs, A1 and B1, A2 and B2, A3 and B3

... ...

30000 W Ten pairs of PMs

For the NE5000E CCC-A chassis B featuring single-plane power supply, determine
the number of PMs that can be installed based on the power consumption data
listed in the following table.

Power PM Configurations
Consumption

3000W 1,2

6000W 1,2,3

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Power PM Configurations
Consumption

9000W 1,2,3,4

...... ......

57000W 1,2,3,4,5,6,7,8,9,10,11,12,13,14,15,16,17,18,19,20

Cable and Terminal Specifications
The PDF requires protection components to ensure that the rated current of each
channel is not less than 16 A. The following table shows the cable and terminal
specifications.

Table 4-59 Cable and terminal specifications
Item Description Huawei BOM Number

DC input Power Cable-3m-3*1.5mm^2- 04151269
cables (HVDC
3SF)-(227IEC53-1.5^2(3C))-(3
*OT1-8)-380V High Voltage
DC PEM Dedicated

NO TE

Choose cables in the package according to standards in various countries and areas.

Installing PMs and Power Cables

DANGER

Ensure that the device is powered off before installing power cables.

1. Install PMs.

Figure 4-205 Installing PMs

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2. Attach temporary labels to both ends of each power cable.
3. Route power cables along the cable ladder to the chassis.
4. Connect one end of each power cable to an input terminal of the power
distribution box and the other end to the PDF.
5. After cables are connected to the terminals, use cable fasteners to secure the
cables to the terminals.
6. Use cable ties to bundle the cables every 150 mm (5.91 in.) upwards from the
bottom and secure the cables to the vertical cable trough.
7. Attach permanent labels 20 mm (0.79 in.) to both ends of each power cable.

4.2.9.12 AC Power Distribution

Overview
The NE5000E CCC-A uses non-partitioned power supply, which consists of PEMs,
PMs, PMUs, and switches. In the AC power distribution mode, the AC PEM and AC
PM are used. The PEM connects to the PM in the chassis. Power is input into the
PM through the PEM. The PM converts the AC power into DC power before
providing power for the device.
There are two power supply switches on a device. When one or two switches are
on, the device powers on. When two switches are off, the device powers off. To
ensure power supply for a running device, ensure that two switches are on and
function in 1+1 backup mode.

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Figure 4-206 Main components of the AC power supply system

1. AC PM 2. Switch 3. PMU 4. AC PEM

The NE5000E CCC-A chassis features dual-plane power supply. You can configure
PMs based on the board power consumption on the NE5000E CCC-A. PMs work in
N+N backup mode. The PMs that back up each other obtains power from different
power sources so that one can provide power when the other becomes faulty.
When ten pairs of PMs (20 PMs) are fully configured on a device with the 220 V
AC power supply system, a maximum of 27000 W power is provided. The 110 V
double live wire input, instead of 110 V AC single-phase input, is supported.

The following table lists the AC PM technical specifications.

Table 4-60 AC PM technical specifications

Item Specification

Input voltage 200 V AC to 240 V AC / 100 V AC to 120 V AC
range

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Item Specification

Maximum input 16 A
current

Maximum output 3000 W
power of a
module

PEMs connect to PMs in the chassis. The mappings between PMs and PEM wiring
terminals are as follows.

Figure 4-207 Mappings between PEMs and PMs

The NE5000E CCC-A chassis B features single-plane power supply. You can
configure PMs based on the board power consumption on the device. Each PM has
two power inputs, which are from power supply areas A and B output by the
power entry module (PEM), respectively. The PM combines the two power inputs
and outputs one. The system uses N+M (M ≥ 1) power module backup mode so
that the device works properly even if M power modules fail.

The following table lists the AC PM technical specifications.

Table 4-61 AC PM technical specifications

Item Specification

Input voltage 180V to 264V (rated voltage 200V to 240V)
range

Maximum input 16 A
current

Maximum output 3000 W
power of a
module

PEMs connect to PMs in the chassis. The mappings between PMs and PEM wiring
terminals are as follows.

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Figure 4-208 Mappings between PEMs and PMs

Power Distribution Principle

NO TE

● One PM outputs a maximum of 2700 W or 3000W power. You can configure PMs based
on the required power.
● Note that different power sources must be provided for PMs on planes A and B so that
one can provide power when the other becomes faulty.
● To facilitate further expansion, configure the PMs and install power cables in ascending
order of PM slot numbers.

Power Distribution Instance

For the NE5000E CCC-A chassis featuring dual-plane power supply, determine the
number of PMs that can be installed based on the power consumption data listed
in the following table.

Power PM Configurations
Consumption

3000 W One pair of PMs, A1 and B1

6000 W Two pairs of PMs, A1 and B1, A2 and B2

9000 W Three pairs of PMs, A1 and B1, A2 and B2, A3 and B3

... ...

30000 W Ten pairs of PMs

For the NE5000E CCC-A chassis B featuring single-plane power supply, determine
the number of PMs that can be installed based on the power consumption data
listed in the following table.

Power PM Configurations
Consumption

3000W 1,2

6000W 1,2,3

9000W 1,2,3,4

...... ......

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Power PM Configurations
Consumption

57000W 1,2,3,4,5,6,7,8,9,10,11,12,13,14,15,16,17,18,19,20

Cable and Terminal Specifications
The PDF requires protection components to ensure that the rated current of each
channel is not less than 16 A. The following table shows the cable and terminal
specifications.

Table 4-62 Cable and terminal specifications
Item Description Huawei BOM Number

AC input cables External Suite, Power Cords 04000408 or 04000207
All Over The World, Class I
Equipment With Connector
C19, External Cable Set

NO TE

Choose cables in the package according to standards in various countries and areas.

Installing AC PMs and Power Cables

DANGER

Ensure that the device is powered off before installing power cables.

1. Install AC PMs.

Figure 4-209 Installing AC PMs

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2. Attach temporary labels to both ends of each power cable.
3. Route AC power cables along the cable ladder to the chassis.
4. Connect one end of each power cable to an input terminal of the AC power
distribution box and the other end to the PDF.
5. After cables are connected to the terminals, use cable fasteners to secure the
cables to the terminals.
6. Use cable ties to bundle the cables every 150 mm (5.91 in.) upwards from the
bottom and secure the cables to the vertical cable trough.
7. Attach permanent labels 20 mm (0.79 in.) to both ends of each power cable.

4.2.9.13 Installing Boards and Subcards

CA UTION

● Ensure that no water is on the device or board before inserting the board into
the device.
● Before you install boards, wear a grounding ESD wrist strap or ESD gloves to
prevent electrostatic discharge on the human body from damaging sensitive
components.
● Empty slots must be filled with filler panels.

NO TICE

Boards must be installed upside down in the lower board cage of the NE5000E
CCC-A.

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Slot Layout

Figure 4-210 Slot layout

Interface Numbering

An interface is numbered in the format of slot number/subcard number/port
number.

● SFU number: Slots for SFUs are numbered 1 to 18.
● OFC number: OFC on SFUs are numbered starting with 0.
● Port number: Ports are numbered starting with 0.

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Installing MPUs and ICUs

NO TICE

The method of installing MPUs is the same as that of installing ICUs. Ensure that
MPUs and ICUs are installed in correct slots.

1. Slide a board smoothly along the guide rail into the slot.
2. Turn the ejector levers inward to secure the board in slot.
3. Use the Phillips screwdriver to secure the captive screws.

Figure 4-211 Installing MPUs and ICUs

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Installing SFUs
NO TE

● Before installing an SFU, ensure that ejector levers are available for use. Installing SFUs
without ejector levers may cause the boards to fail to be powered on and registered.
● After installing an SFU, remove the ejector levers from the SFU and attach them on the
cabinet or chassis for future use.

Figure 4-212 Ejector levers for installing SFUs

NO TICE

● Do not use ejector levers to lift a board.
● Use both ejector levers when pushing or pulling a board. Never use only one.

1. Obtain the ejector levers from the vertical cable trough on the NE5000E CCC-
A.

2. Slide an SFU along the guide rails halfway into the slot. Stop when the SFU
makes contact with the chassis connector in the back of the slot.

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3. Press down the elastomer fasteners on the ejector levers and insert them into
ejector lever connectors on the SFU.

4. Grasp the ejector levers and simultaneously pivot them inward to secure the
SFU in the slot.

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5. Press down the elastomer fasteners on the ejector levers and remove them
from the SFU.

6. Put the ejector levers back to their original positions.

Installing OFC subcards
1. Slide a subcard along the guide rail into the slot.
2. Turn the ejector levers inward to secure the subcard in slot.
3. Use the Phillips screwdriver to tighten the captive screws.

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Figure 4-213 Installing OFC subcards

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4.2.9.14 Installing Cascading Optical Fibers

Installing Cascading Optical Fibers

NO TICE

● The bending radius of a single-mode G.657A2 optical fiber is greater than or
equal to 10 mm, and the bending radius of a multi-mode A1b optical fiber is
greater than or equal to 30 mm.Always keep an open optical module covered
by a dust-proof cap.
● Do not bind optical fibers too tightly or too loosely.
● When laying out a cascading optical fiber, reserve a 2.4-meter optical fiber in
the cabinet for cabling and wind the rest optical fibler to the cable rack.
● Always keep an CXP optical fiber covered by a protect cap when laid out.
● To insert a CXP module, you are advised to perform the following steps: 1.
Insert; 2. Listen; 3. Press. Insert: Insert the CXP module into the corresponding
port on the board. Listen: You can hear a click sound when the module is
locked after it is inserted. Press: Press the empty space on both sides of the
shell of the CXP optical fiber interface to push the CXP module tightly. After
inserting the CXP module, check whether it is securely inserted.
● CXP series optical fibers cannot be deployed across floors.

1. Attach temporary labels to both ends of each optical fiber.
2. Route optical fibers along the cable tray and remove the dust-proof caps from
the optical modules and optical fibers. Then connect the optical fibers to the
optical modules.
3. Connect the other end of each optical fiber to the NE5000E CLC.
4. Bind optical fibers every 150 mm (5.91 in.) using binding taps and secure the
bound optical fibers to the vertical cable trough using cable fasteners.
5. Remove the temporary labels and attach permanent labels 20 mm (0.79 in.)
to both ends of each optical fiber.

4.2.9.15 Installation in Underfloor Cabling Mode

NO TE

● Underfloor cabling is applicable when a device is installed on the ESD floor.
● For details on cable installation in underfloor cabling mode, see cable installation in
overhead cabling mode. The following figures show how cables are routed.
● In both overhead and underfloor cabling modes, the ground cable of a cabinet is
connected to the ground point on the top of the cabinet.

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Underfloor cabling of power cables

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Underfloor cabling of optical fibers and network cables

4.2.9.16 Installing Network Cables

NO TICE

Before binding network cables, use a network cable tester to test cable
connectivity.

NO TE

The distance between the power cable, ground cable, and signal cable must be greater than
30 mm (1.18 in. ).

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1. Attach temporary labels to both ends of each network cable.
2. Route network cables along the vertical cable trough and plug them into the
corresponding interfaces.
3. Use a network cable tester to test the connectivity of network cables. If there
is no connectivity, replace the cable connectors.
4. Use cable ties to bind network cables every 150 mm (5.91 in.) and secure the
network cables to the cabinet.
5. Remove the temporary labels and attach permanent labels 20 mm (0.79 in.)
to both ends of each network cable.

4.2.9.17 Checking the Installation

Cabinet Installation Checklist
No. Requirement

1 The cabinet is in the correct location.

2 The cabinet is properly placed with a horizontal/vertical
deviation of no more than 3 mm (0.12 in.).

3 All bolts and screws are firmly fastened, especially on
electrical connections. Flat and spring washers are used
with each bolt, and spring washers are placed on the
top of flat washers.

4 The cabinet is neat and clean.

5 Cabinet doors can be opened and closed smoothly.

6 All labels, tags, and nameplates are correct, legible, and
complete.

Device Environment Checklist
No. Requirement

1 No fingerprints or smears exist on the device.

2 There are no unnecessary electrical tapes or cable ties
on cables.

3 No electrical tapes, cable ties, wastepaper, or packing
bags are left around the device.

4 All other items around the device are organized, neat,
and clean.

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Electrical Connection Checklist
No. Requirement

1 All assembled PGND cables are copper-based with
proper wire diameters. Cables meet quality standards.

2 All ground cables, AC input cables, and intra-cabinet
cables are connected correctly according to the wiring
diagram, and all screws are tightened. The input and
output cables are not short-circuited.

3 Any redundant parts of power cables or PGND cables
are trimmed off and not coiled.

4 The terminals at both ends of each power cable or
PGND cable are crimped securely.

5 The wiring terminals on cables are wrapped tightly
using PVC insulation tapes or heat shrink tubes.

6 The wiring terminals with heat shrink tubes are heated
using a heat gun.

7 Flat and spring washers are properly installed on each
bolt of a wiring terminal.

8 All cables, especially the cables in the lower area of the
cabinet, are securely connected.

9 Cables are properly bound. Cable ties are installed at
equal spacing and in the same direction.

10 Power and ground cables are bound separately from
other cables.

11 The cable layout accounts for easy maintenance and
expansion in the future.

12 The labels at both ends of each cable are correct,
legible, and complete.

13 Excess cable ties are trimmed off.

4.2.9.18 (Optional) Checking Optical Power

The following table describes comparison between the transmit optical power of
50 Gbps optical modules and damaged optical power threshold at the receive end:

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Optical Maximum Minimum Damaged Description
Module Type Average Average Optical
Transmit Transmit Power
Optical Optical Threshold at
Power Power the Receive
End

50GBASE-FR 3 -4.1 5.2 The damaged
optical power
50GBASE-LR 4.2 -4.5 5.2 threshold is
greater than
the maximum
average
transmit
optical power,
posting low
self-loop risks.

50GBASE-ER 6.6 0.4 -2.4 The damaged
optical power
threshold is
9dBm lower
than the
maximum
average
transmit
optical power
and 2.8dBm
lower than
the minimum
average
transmit
optical power,
posing high
self-loop risks.
In this case,
an optical
attenuator
must be
configured for
self-loop.

For applications of the 50 Gbps optical module supporting a distance of 40 km:
1. To ensure that the optical module runs stably for a long time, adjust the
receive optical power of the optical module to a value lower than -4 dB.
According to the IEEE 802.3 standard, if the receive optical power of the
optical module exceeds -2.3 dB, the optical module may be permanently
damaged.
2. Before connecting to the optical module, use an optical power meter to
measure the receive optical power (P). If P is less than -4 dB, the optical
module can be directly connected. If P is greater than -4 dB, add an optical

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attenuator at the receive end to ensure that the receive optical power is less
than -4 dB. Alternatively, add an optical attenuator (no less than 10 dB is
recommended) before the interconnection, and then adjust the optical
attenuator based on the site requirements to prevent the optical module from
being damaged.
3. If a loopback occurs on the pigtail of the optical module or the optical
module is connected for a short distance, an optical attenuator must be
added. It is recommended that the optical attenuator be no less than 10 dB.

4.2.9.19 Power-on Check

Power-on Check Flowchart

NO TICE

Before performing a power-on check, ensure that the two device power switchs
are OFF. Ensure that the input voltage is normal before powering on the device.

Figure 4-214 Device power switch

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Figure 4-215 Power-on check flowchart

Indicators on the NE5000E CCC-A
Module/ Indicator Color Description
Board

Power RUN Green ● Blinking quickly (4 Hz) indicates
monitoring that the board has not
module registered.
(PMU) ● Blinking slowly (0.5 Hz)
indicates that the board has
registered and communicates
normally with other boards.

ALM Red ON indicates that an alarm is
generated and OFF indicates that
no alarm is generated.

ACT Green ON indicates that the PMU is the
master one and OFF indicates that
the PMU is the backup one.

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Module/ Indicator Color Description
Board

Power module Input Green ● Blinking slowly (0.5 Hz)
(PM) indicates overvoltage or
undervoltage of input power.
● Blinking quickly (4 Hz) indicates
a parity check failure.
● ON indicates correct input
voltage.

Output Green ON indicates correct input voltage
and OFF indicates incorrect input
voltage.

Alarm Red ON indicates that an alarm is
generated and OFF indicates that
no alarm is generated.

Fan assembly STATUS Green Blinking slowly (0.5 Hz) indicates
(FAN) that fans work normally, and
blinking quickly (2 Hz) indicates
that fans work abnormally.

Red Blinking slowly (0.5 Hz) indicates
that communication is normal but
an alarm is generated. The alarm
indicates an error in fans, one
channel of power, or sensors.

MPU RUN Green Before the MPU is powered on and
registers, the indicator status
changes in the following sequence:
off -> blinking quickly (4 Hz) -> off
-> steady on -> blinking slowly
(0.5 Hz).
After the MPU is powered on and
registers, the indicator blinks at 0.5
Hz, indicating that the board is
working properly.
NOTE
Possible causes for the indicator to
stay off are as follows:
● The BootROM is damaged.
● The MPU cannot be powered on.
Possible causes for the indicator to
blink quickly are as follows:
● The SSD card is faulty.
● The other control modules on the
MPU are faulty, causing an
initialization failure on the MPU.

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Module/ Indicator Color Description
Board

ALM Red If the indicator is steady off, the
MPU works normally. If the
indicator is steady red, an alarm is
generated.

SFU RUN Green After the board is powered on but
before it registers, the indicator
status changes in the following
sequence: off -> blinking once
every 250 ms (4 Hz) -> off ->
steady on -> blinking once every
two seconds (0.5 Hz).
After the board registers, the
indicator blinks at 0.5 Hz,
indicating that the board is
working properly.
NOTE
Possible causes for the indicator to
stay off are as follows:
● The BootROM is damaged.
● The SFU cannot be powered on.
Possible causes for the indicator to
blink quickly are as follows:
● The flash memory is faulty.
● The network port is faulty.

ACT Green If this indicator is steady green, the
board is working properly; if this
indicator is off, the board is faulty.

ICU RUN Green Before the ICU is powered on and
registers, the indicator status
changes in the following sequence:
off -> blinks quickly (4 Hz) -> off -
> steady on -> blinks slowly (0.5
Hz).
After the ICU is powered on and
registers, if the indicator blinks at
0.5 Hz, the system is working
properly.

LINK/ACT Green ● If the indicator is steady on, the
link is normal.
● If the indicator blinks, data is
being transmitted.
● If the indicator is off, the link is
Down.

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4.2.10 NE5000E CCC Installation Guide

4.2.10.1 NE5000E CCC Introduction

Device Parts

No. Part Quantity

1 Air exhaust vent 1

2 Rear fan module 2

3 - -

4 Ground terminal 1

5 Mounting ear 2

6 Front fan module 2

7 MPU slot 2

8 SFU slot 8

9 Handle 4

10 Power module 2

11 ESD jack 2

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No. Part Quantity

12 ICU slot 2

13 Cable trough 1

14 Air filter 1

4.2.10.2 Installation Preparations

Following All Safety Precautions
● Before any operations, read the instructions and precautions in this document
carefully to minimize the possibility of accidents. The Danger, Caution, and
Note items in this document do not cover all the safety precautions that must
be observed. They provide only the generic safety precautions for operations.
● When operating Huawei products and equipment, comply with safety
precautions and special safety instructions relevant to the corresponding
equipment provided by Huawei. The safety precautions in this document are
relevant only to Huawei products. Huawei is not liable for any consequence
that results from violation of universal regulations for safety operations and
safety codes on design, production, and equipment use.

Complying with Local Safety Regulations

When operating the product or equipment, comply with local safety regulations.

Installation Personnel Requirement

Installation and maintenance personnel must be trained to perform operations
correctly and safely.

Personnel Safety
● The high-voltage power supply provides power for the system. Avoid direct
contact with the high-voltage power supply or contact with it through damp
objects. Otherwise, serious personnel injuries may occur.
● Non-standard and incorrect operations on the high-voltage power supply may
result in fire and electric shock.
● Ground a device before powering it on. This operation prevents damages to
the device or personal injuries.
● Power off a device before performing operations on the power supply
facilities.
● Do not stand close to or look into the optical fiber outlet without eye
protection when handling optical fibers.
● Take preventive measures when drilling holes. Otherwise, dust may hurt your
eyes or you may inhale the dust.
● When working at heights, be cautious about falling objects.

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Device Safety
● Keep an unpacked device upright and handle it with care when carrying it or
installing it into a cabinet.

● Do not tilt the device when removing the package or installing it in a cabinet.
Otherwise, the device components may be damaged due to mutual pressing.

● Do not trample in the cabinet interior. Otherwise, the cabinet will be
damaged or deformed.

● Use the handles at both sides of the device to carry it. Do not use handles on
any other module.

● Do not trample on a device. Instead, use a ladder to lay out cables.

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● Wear an ESD wrist strap or ESD gloves when handling circuit boards.
Otherwise, the static electricity discharged from the human body may
damage the electrostatic sensitive components, such as large-scale integrated
circuits (LSIs) on the circuit board.

● Do not place damageable materials on the ground. Otherwise, they may be
trampled.

● Do not sit on or lean against the materials that are piled on site. Otherwise,
they may be damaged.

● Check the electrical connection of a device before operating on it. Make sure
that the device is securely grounded.
NO TE

In this document, the device appearance is for reference only. In real-world situations, the
device appearance may differ from what is shown in this document.

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4.2.10.3 Installation Notes

About This Guide
● This document provides simple and clear guidelines for quick hardware
installation, but does not describe operations for pre-delivery installations.
● Cable installation procedures for overhead cabling are used as an example in
this document. For details on how to make and use labels, and how to install
cables, see the electronic version of Installation Guide.
● To better illustrate how to install a device into a cabinet, a Huawei cabinet
without the rear door is used as an example. For details on how to install a
cabinet, see the Cabinet Installation Guide included with the cabinet.
● In this document, the equipment exterior is for reference only. The actual
equipment may differ from what is shown in the figures.

Installation Precautions
● Allow a clearance of more than 1100 mm (39.89 in.) in front of and behind
the device for maintenance.
● The side the top of which has a ground screw is the rear side of the cabinet.
Face the rear side of an N610E cabinet and install the Cluster Central Chassis.
● Power modules must be connected correctly to a power distribution box to
ensure power supply reliability.
● Connect a ground cable to either of the ground terminals on the top of the
cabinet.

Installation Procedure
NO TE
The device supports both DC and AC power supplies. Deploy a power distribution system as
required. For details, see DC Power Distribution or AC Power Distribution.

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4.2.10.4 Requirements on Customers' Cabinets Purchased from Other
Vendors
NO TE

Huawei standard cabinets are recommended. A self-purchases cabinet must meet the
following requirements.
1. The cabinet customized by the customer should be a 19-inch standard
cabinet, the depth of the cabinet is greater than 1000 mm (39.37 in.), the
hight of the cabinet is greater than 2000 mm (78.74 in.).
2. The rack mounting rail is more than 150 mm (5.91 in.) from the front door of
the cabinet, and the front door is less than 25 mm (0.98 in.) thick, ensuring
that the available space is over 125 mm (4.92 in.).

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3. The porosity must be larger than 50% on the front and rear doors, and air
filters on cabinet doors must be removed.
4. A cabinet should contain installation accessories such as slide rails, floating
nuts, and screws.
5. Check whether there is a ground point on the cabinet. If the ground point is
reserved, connect the device to the ground point and connect the ground
point to the ground busbar. If the ground point is not reserved, connect the
device to the ground busbar directly.
6. If the overhead cabling mode is adopted, a cable outlet must be reserved on
the top of the cabinet; if the underfloor cabling mode is adopted, a cable
outlet must be reserved in the bottom of the cabinet.

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4.2.10.5 Installation tools

Tools

Diagonal pliers Phillips screwdriver Flat-head screwdriver

Adjustable wrench Marker Ladder

Heat gun ESD gloves ESD wrist strap

Multimeter Box cutter Wire stripper

Cable cutter RJ11 crimping tool Power cable crimping
tool

Hydraulic pliers Protective gloves Socket wrench

Hammer drill Long measuring tape Torque wrench

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Level Network cable tester
Fuse handle

Vacuum cleaner Plummet Crimping tool

Hammer Torque screwdriver
2.5 mm hex screwdriver

- -

fiber-pulling pliers

Related Materials
1. PVC insulation tape
2. Tie wrap
3. Fiber binding tape
4. Heat shrink tube
5. Corrugated pipe
6. Cable label
7. fiber-pulling pliers

4.2.10.5.1 Inspecting and Cleaning Optical Fiber Connectors and Adapters

Overview
This topic introduces the purpose and procedure of cleaning optical fiber
connectors, as well as polluters to optical fiber connectors.
Cleaning fiber connectors is to remove dust or other dirt to avoid performance
degradation of optical transmission systems.

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Figure 4-216 shows an optical fiber connector.

Figure 4-216 Optical fiber connector

Optical fiber connectors should be free of:

● Dust
● Grease (usually brought by hands)
● Condensate residue
● Powder (evaporated residue of water or solvent)

Dust is the most common dirt in optical fiber connectors. The dust particles that
can be seen only by a microscope can affect the quality of optical signals,
deteriorate the system performance, and cause instability in network operation.

A 1-micrometer dust particle on the single-mode fiber connector can block 1%
light and cause 0.05 dB attenuation. A 9-micrometer dust particle that cannot be
seen by human eyes can block an entire fiber core. Therefore, small dirt even that
cannot be seen by human eyes should be removed.

NO TE

Before you connect any optical component, make sure that you have checked and cleaned
the component.

Procedure

Table 4-63 describes the procedure of inspecting and cleaning the optical fiber
connectors and adapters.

Table 4-63 Procedure of inspecting and cleaning the optical fiber connectors and
adapters

Step Details

Clean optical fiber connectors using See "Cleaning Optical Fiber Connectors
the cassette cleaner Using the Cassette Cleaner".

Clean optical fiber connectors using See "Cleaning Optical Fiber Connectors
lens tissue Using Lens Tissue".

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Step Details

Clean optical fiber adapters using See "Cleaning Optical Fiber Adapters
dustfree absorbent swabs Using Dustfree Absorbent Swabs".

Protection of Optical Fiber Connectors
This topic describes requirements for fiber connector protection.
The requirements are as follows:
● All boards with optical ports must be packed properly, to avoid mechanical
and electrostatic damages and to reduce vibrations.
● The protective caps must be put in an ESD bag.
● Protective caps must be installed on all optical fiber connectors when not in
use. The optical fiber connectors must be stored in proper packages to keep
them clean.
● Figure 4-217 shows the recommended protective caps, whereas Figure 4-218
shows the protective caps not recommended.

Figure 4-217 Protective caps recommended

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Figure 4-218 Protective caps not recommended

NO TE

The protective caps not recommended are made of soft rubber, which are apt to absorb
dust and sundries, and difficult to clean.

Tools, Equipment, and Materials
Optical connectors should be cleaned using recommended tools, equipment and
materials.
The following provides the recommended tools, equipment and materials:
● Optical power meter
● 400X fiber microscope (A video fiber microscope is recommended.)
● Cassette cleaner shown in Figure 4-219
● Cleaning solvent (Isoamylol is preferred, propyl alcohol is the next, and
alcohol or formalin is forbidden.)
● Non-woven lens tissue, fiber cleaning tissue, and dustfree cloth (Non-woven
lens tissue is recommended.)
● Special compressed air
● Special cleaning roll
● Dustfree absorbent swab (made of medical cotton or long fiber cotton)
shown in Figure 4-220 and Figure 4-221

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Figure 4-219 Cassette cleaner

Figure 4-220 Dustfree absorbent swabs for cleaning the SC and FC connectors

Figure 4-221 Dustfree absorbent swabs for cleaning the LC connectors

Inspecting Optical Fiber Connectors
This topic describes how to inspect the end face of optical fibers using a fiber
microscope.

Tools, Equipment, and Materials
The following provides the required tools, equipment and materials for inspecting
optical fiber connectors:

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● Optical power meter
● 400X fiber microscope (A video fiber microscope is recommended.)

Precautions

CA UTION

Laser energy is invisible and may cause eye injuries. Never look directly into fiber
connectors or ports.
Use a fiber microscope equipped with a safety device or a desktop video fiber
microscope when inspecting the optical fiber connectors.

NO TICE

Electrostatic discharge is hazardous to the electronic equipment. Wear an ESD
wrist strap and ensure that the strap is grounded properly before touching the
equipment and boards, to protect the static-sensitive components against
electrostatic discharge of the human body. Otherwise, the equipment may be
damaged or the service may be interrupted.

Procedure
1. Shut down the laser and disconnect the fiber end before inspecting the fiber
connector.
2. Test the optical power using a power meter to ensure that the laser is shut
down.
3. Use a fiber microscope to check whether the fiber connector is contaminated
or damaged. See the examples below.
– Clean fiber and face
Figure 4-222 shows an image of a clean fiber end face under the fiber
microscope.

Figure 4-222 Clean fiber and face

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– Damaged fiber end face
Figure 4-223 shows images of the damaged fiber end face. The image on
the left shows a severely damaged fiber. Severely damaged fibers can
cause damage to the equipment and should not be used. The image on
the right shows a defective fiber. If the output power is within a certain
range, the defective fiber might not cause any damage to the equipment.
If the output power is unstable or out of the range, however, the
defective fiber can cause damage to the equipment.

Figure 4-223 Damaged or defective fiber end face

NO TE

Figure 4-223 shows only the 800-micrometer fiber cores.
For details on acceptable and unacceptable fibers, see Figure 4-224, Figure
4-225 and Figure 4-226.

Figure 4-224 Clean fiber end face

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Figure 4-225 Acceptable fibers with imperfections

Figure 4-226 Unacceptable fibers with imperfections

4. If any dirt is detected, clean the optical fiber connector. For details, see
"Cleaning Optical Fiber Connectors Using the Cassette Cleaner" and "Cleaning
Optical Fiber Connectors Using Lens Tissue".
5. If any damage is detected, replace the fiber.

Inspecting the Optical Fiber Link
This section describes the insertion loss and reflection requirements of optical links
and the method of checking the quality of optical links for the application of 50G
optical modules with the PAM4 coding technology.

Tools, Equipment, and Materials
Tools and instruments for checking optical fiber links are as follows:
● OTDR meter
● Fiber microscope

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Precautions

CA UTION

Because the transmit optical power of the OTDR meter is much higher than the
damaged optical power threshold at the receive end, the optical fiber must be
removed from the optical module when the OTDR meter is used to test the optical
path quality.

Currently, the Ethernet port rate is increasing. Since the 50G optical module link
uses the PAM4 encoding technology, there are higher requirements on the optical
fiber and cable quality and the link is more sensitive to multipath reflection
interference of signals. If the fiber link connector, fiber section, or fiber splicing
surface is dirty, optical signals are reflected back and forth on the fiber link,
causing interference due to co-channel noise on the receive side. As a result, the
optical link is unstable or intermittently disconnected.

According to the national standard (GBT50312-2016), the loss of the optical fiber
link connector must meet the requirements described in Table 4-64.

Table 4-64 Maximum attenuation of the optical fiber connector

Type Maximum attenuation of an optical fiber
connector (dB)

Fiber splicing connector 0.3

Optical mechanical connector 0.3

Optical connector 0.75

NO TE

Fiber cores are connected through connectors, such as the ODF, optical attenuator, and
flange, in splicing and mechanical modes.

Table 4-65 describes requirements for the reflection of the optical fiber connector
when Ethernet ports (such as 50G) use PAM4 encoding to double the rate. More
connectors bring lower requirements for the reflection.

Table 4-65 Maximum reflection of connectors

Number of Maximum Reflection of Each Connector (dB)
Optical Fiber
Connectors 50GBASE-FR 50GBASE-LR 50GBASE-ER

1 -25 -22 -19

2 -31 -29 -27

4 -35 -33 -32

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Number of Maximum Reflection of Each Connector (dB)
Optical Fiber
Connectors 50GBASE-FR 50GBASE-LR 50GBASE-ER

6 -38 -35 -35

8 -40 -37 -37

10 -41 -39 -39

Procedure
1. After the optical fiber at the peer end is disconnected, use the OTDR meter to
test the local end. Check whether the loss and reflection of each link and
node are normal. (The loss of a fiber splicing connector should be less than
0.3 dB, the loss of a connector should be less than 0.75 dB, and the reflection
of a connector should be less than -30 dB.) If the test result is not within the
required range, process the abnormal port.
2. Locate the equipment room where the port resides based on the distance
between abnormal points in the OTDR test result. Preliminarily determine the
port location, disconnect the port, and perform an OTDR test on the port that
reports alarms. Check whether the distance is consistent with that in the
previous test. If not, continue to test other ports.
3. After the abnormal port is found, test the port using a fiber microscope. If the
port is dirty, clean it. For details, see "Inspecting and Cleaning Optical Fiber
Connectors and Adapters".
4. After the port is cleaned, restore the port, and ensure that the connector is
tightened. Perform an OTDR test on the port to check whether loss and
reflection of each link and node are normal.
5. If the fault persists, replace the flange and perform an OTDR test on the port
that reports alarms to check whether loss and reflection of each link and
node are normal.
6. If the fault persists, replace the optical fiber and perform an OTDR test on the
port that reports alarms to check whether loss and reflection of each link and
node are normal.
7. If multiple abnormal points exist on the link, repeat steps 2 to 6.

Cleaning Optical Fiber Connectors Using the Cassette Cleaner

This topic describes how to clean the fiber connectors using a cassette cleaner.

Prerequisites

Before cleaning, inspect the fiber end face with a fiber microscope or a magnifier
to confirm the degree of fiber contamination. Clean the fiber only when it is
severely contaminated. This is because the cleaning operation itself may introduce
dust, dirt, or cause damage to the fiber.

The following procedure provides the steps to clean the fiber connectors using
cartridge type cleaners.

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Tools, Equipment, and Materials
The following lists the required tools, equipment and materials for cleaning optical
fiber connectors:
● Cassette cleaner
● Optical power meter
● 400X fiber microscope (A video fiber microscope is recommended.)

Precautions

CA UTION

Laser energy is invisible and may cause eye injuries. Never look directly into fiber
connectors or ports.

NO TICE

Electrostatic discharge is hazardous to the electronic equipment. Wear an ESD
wrist strap and ensure that the strap is grounded properly before touching the
equipment and boards, to protect the static-sensitive components against
electrostatic discharge of the human body. Otherwise, the equipment may be
damaged or the service may be interrupted.

Procedure
1. Shut down the laser and disconnect the fiber end before inspecting the fiber
connector.
2. Test the optical power using a power meter to ensure that the laser is shut
down.
3. Press down and hold the lever of the cassette cleaner. The shutter slides back
and exposes a new cleaning area. See Figure 4-227.

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Figure 4-227 Using the cassette cleaner

4. Place the fiber end face gently against the cleaning area.
5. Drag the fiber end face gently on one cleaning area in the arrow direction
each time. See Figure 4-228. Do it again on the other cleaning area in the
same direction as the first time once. See Figure 4-229.

NO TICE

Do not drag the fiber end face on the same cleaning area more than once.
Otherwise, the connector can be contaminated or damaged.

Figure 4-228 Dragging the fiber end face gently on one cleaning area

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Figure 4-229 Dragging the fiber end face gently on the other cleaning area

6. Release the lever of the cassette cleaner to close the cleaning area.
7. Use a fiber microscope to inspect the fiber to check whether there is any dirt.
For details see the examples shown in "Inspecting Optical Fiber Connectors".
If the fiber end face is still dirty, repeat 1 to 6.
8. Connect the fiber to the optical port immediately. If it is not used for the time
being, put a protective cap on it.
9. Turn on the laser after connecting the fiber to the board.

Cleaning Optical Fiber Connectors Using Lens Tissue
This topic describes how to clean the fiber connectors using lens tissue.

Prerequisites
Before cleaning, inspect the fiber end face with a fiber microscope or a magnifier
to confirm the degree of fiber contamination. Clean the fiber only when it is
severely contaminated. This is because the cleaning operation itself may introduce
dust, dirt, or cause damage to the fiber.

Tools, Equipment, and Materials
The following provides the required tools, equipment and materials:
● Optical power meter
● 400X fiber microscope (A video fiber microscope is recommended.)
● Cleaning solvent (Isoamylol is preferred, propyl alcohol is the next, and
alcohol or formalin is forbidden.)
● Non-woven lens tissue, fiber cleaning tissue, and dustfree cloth (Non-woven
lens tissue is recommended.)
● Special compressed air or cleaning roll

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Precautions

CA UTION

Laser energy is invisible and may cause eye injuries. Never look directly into fiber
connectors or ports.

NO TICE

Electrostatic discharge is hazardous to the electronic equipment. Wear an ESD
wrist strap and ensure that the strap is grounded properly before touching the
equipment and boards, to protect the static-sensitive components against
electrostatic discharge of the human body. Otherwise, the equipment may be
damaged or the service may be interrupted.

Procedure
1. Shut down the laser and disconnect the fiber end before inspecting the fiber
connector.
2. Test the optical power using a power meter to ensure that the laser is shut
down.
3. Put a little cleaning solvent on the lens tissue.
4. Clean the fiber end face on the lens tissue. See Figure 4-230 and Figure
4-231.

NO TICE

Drag the fiber end face on the same area in the lens tissue only once.
Otherwise, the connector can be contaminated or damaged.

Figure 4-230 Cleaning the fiber end face using the lens tissue on the desk

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Figure 4-231 Cleaning the fiber end face using the lens tissue on the hand

5. Repeat 4 several times on the areas of the lens tissue that have not been
used.
6. Use the compressed air to blow off dust on the fiber end face.

NO TE

● When using the compressed air, keep the nozzle as close as possible to the fiber
end face without touching it.
● Before using the compressed air, first spray it into the air to expel deposits in the
compressed air.
● If the compressed air is not available, use a cleaning roll instead.
7. Use a fiber microscope to inspect the fiber to check whether there is any dirt.
For details, see the examples shown in "Inspecting Optical Fiber Connectors".
If the fiber end face is still dirty, repeat 1 to 6.
8. Do not touch the fiber connector after cleaning it. Connect it to the optical
port immediately. If it is not used for the time being, put a protective cap on
it.

NO TE

Do not use the same cleaning area to clean the fiber connector for more than one
time.
9. Turn on the laser after connecting the fiber to the board.

Cleaning Optical Fiber Adapters Using Dustfree Absorbent Swabs

This topic describes how to clean fiber adapters using dustfree absorbent swabs.

Prerequisites

There are several types of dustfree absorbent swabs available. Select appropriate
dustfree absorbent swabs based on site conditions. You can obtain the following
tools and materials from a fiber cable and connector manufacturer.

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Tools, Equipment, and Materials
The following lists the required tools, equipment and materials:
● Optical power meter
● 400X fiber microscope (A video fiber microscope is recommended.)
● Cleaning solvent (Isoamylol is preferred, propyl alcohol is the next, and
alcohol or formalin is forbidden.)
● Special compressed air
● Dustfree absorbent swab (made of medical cotton or long fiber cotton)

Precautions

CA UTION

Laser energy is invisible and may cause eye injuries. Never look directly into fiber
connectors or ports.

NO TICE

Electrostatic discharge is hazardous to the electronic equipment. Wear an ESD
wrist strap and ensure that the strap is grounded properly before touching the
equipment and boards, to protect the static-sensitive components against
electrostatic discharge of the human body. Otherwise, the equipment may be
damaged or the service may be interrupted.

Procedure
1. Shut down the laser and disconnect the fiber end before inspecting the fiber
connector.
2. Test the optical power using a power meter to ensure that the laser is shut
down.
3. Select the dustfree absorbent swab with a proper diameter based on the type
of an adapter.
NO TE

For SC and FC fiber adapters, use the dustfree absorbent swab with a diameter of 2.5
mm (0.1 in.); for the LC fiber adapter, use the dustfree absorbent swab with a
diameter of 1.25 mm (0.05 in.). See Figure 4-232 and Figure 4-233.

Figure 4-232 Dustfree absorbent swabs for cleaning the SC and FC connectors

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Figure 4-233 Dustfree absorbent swabs for cleaning the LC connectors

4. Put a little cleaning solvent on the dustfree absorbent swab.
5. Place the dustfree absorbent swab gently on the adapter so that the cleaning
solvent is against the fiber end face. Draw out the dustfree absorbent swab
from the fiber adapter and then rotate the dustfree absorbent swab clockwise
once. Ensure that the tip of the dustfree absorbent swab directly contacts the
fiber end face.
6. Use the compressed air to blow off dust on the fiber end face.

NO TE

● When using the compressed air, keep the nozzle as close as possible to the fiber
end face without touching it.
● Before using the compressed air, first spray it into the air to expel deposits in the
compressed air.
7. Step 7 Use a fiber microscope to inspect the fiber to check whether there is
any dirt. For details, see "Inspecting Optical Fiber Connectors". If the fiber end
face is still dirty, repeat 1 to 6.
8. Connect the fiber to the optical port immediately. If it is not used for the time
being, put a protective cap on it.
9. Turn on the laser after connecting the fiber to the board.

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4.2.10.6 Installing the Chassis into the Cabinet

Installing the Chassis

NO TICE

● The device is heavy and needs to be carried by four to five people.
● Make sure that floating nuts are secured. This is to prevent them from dropping
when they are fastened to screws.
● When installing a device into the cabinet, do not hold the handles on other
modules, and do not step on the air filter at the bottom of the cabinet.

1. Unpacking the carton and take out the device by following the instructions on
the carton.

NO TE

● Space permitting, carry the wooden carton into or near the equipment room
before unpacking it.
● This can prevent the device from being damaged when it is moved without
protection. Wear gloves when unpacking the wooden carton to avoid injuries by
sharp objects.
● Handle the device with care when unpacking it.
● Store materials in the packaging box properly for future use. Avoid losing any
material in installation.
2. Installing the guide rail in the cabinet.

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NO TE

● The side the top of which has a ground screw is the rear side of the cabinet. Face
the rear side of an N610E cabinet and install the Cluster Central Chassis.
● The bottom of each guide rail must be aligned with the scale on the mounting bar.
● Install the guide rail 4 U (7 in.) at the fourth scale on the mounting bar above the
bottom of the cabinet.
● 1 U = 44.45 mm (1.75 in.)
3. Use a measuring tape to locate the holes where to install panel screws.
Determine the positions where to install floating nuts and install floating nuts
on mounting bars.
4. Install the device in the cabinet and then fix rack-mounting ears to the
cabinet using M6 screws. See (1) and (2) in the following figure.
5. Attach a device label. See (3) in the following figure.

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NO TE

Attach an ID nameplate on each CLC and CCC based on the engineering design.

Installing fiber management trays

NO TE

● The bottom of each guide rail must align with a specific scale on the mounting bar.
● The floating nuts must be installed in each mounting bar's first and third holes counted
from the bottom of a guide rail.
1. Install guide rails. See (1) in the following figure.
2. Install the floating nuts. See (2) in the following figure.
3. Install the fiber management trays and secure them to the cabinet using M6
screws. See (3) and (4) in the following figure.

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4.2.10.7 Installing the PGND Cable

Cable Specifications

Item Specifications

Cabinet ground cable/device ground 25 mm^2
cable

Ground terminal of the cabinet ground 25 mm^2-M8 single-hole OT naked
cable crimping terminal

Ground terminal of the device ground 25 mm^2-M6 single-hole OT naked
cable crimping terminal
25 mm^2-M6 double-hole JG naked
crimping terminal

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Installing the PGND Cable
NO TE

● You can connect the ground cable of the chassis directly to the ground bar in the
equipment room or to the ground point of the cabinet.
● In this section, connecting a device ground cable directly to the ground busbar is used as
an example.
1. Attach temporary labels on both ends of a ground cable.
2. Route the ground cable along the cable ladder. Connect one end of the
ground cable to the terminal at the top of the cabinet. See (1) in the
following figure. Connect the other end of the ground cable to the copper bar
ground in the equipment room.
3. Install the ground cable of the chassis, connect the other end of the ground
cable to the copper bar ground in the equipment room. See (2) in the
following figure.
4. Attach permanent labels 20 mm (0.79 in.) from both ends of the cabinet
ground cable. See (3) and (4) in the following figure.

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4.2.10.8 Installing Power Cables-DC Power Distribution

DANGER
Installing power cables while power is on is potentially dangerous and must be
avoided.

NO TE

The maximum power consumption of a fully configured NE5000E CCC is 4500 W.

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Power Distribution Guide
Item Parameter

Number of power module 2

Input voltage range -38 V DC to -72 V DC

Maximum input current 75A×3

Maximum output power 8000 W

Output current 67.5A×3

Current of user's circuit breaker ≥80 A

Table 4-66 Cable specifications
Cable Length Cable Diameter

Shorter than or equal to 25 m 25 mm^2

Longer than 25 m and shorter 35 mm^2
than 35 m

Longer than 35 m A PDF needs to be placed near the device
or the first cabinet in a row.

NO TE

The cable connected to the device must be equipped with a single-hole M6-OT naked
crimping terminal.

Table 4-67 Air circuit and current parameters for a PDF
Item Specifications Note

Each circuit ≥80 A To meet the requirement of
breaker hierarchical protection in power
distribution, it is recommended that
the circuit breaker at the user side be
not smaller than that of the power
module (80 A).

Current of each ≥75 A (-48 V) It is recommended that at least 75 A
power supply (-48 V) DC power be supplied for each
channel to support the maximum
configuration of the device.

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Installing Power Cables

NO TICE

● On a DC power module, connect NEG(-) cables to the second row of terminals
and install a plastic cover over the terminals. Then, connect RTN(+) cables to
the first row of terminals.
● To provide better power supply reliability, make sure that three power inputs on
one power module are connected to the primary PDF, and three power inputs
on the other power module are connected to the backup PDF.

1. Attach temporary labels on both ends of a power cable.
2. Route power cables along the cable ladder, and connect them to the device.
3. Remove the protective cover of the terminals on the power module and
connect power cables to the corresponding terminals. See (1) and (2) in the
following figure. Connect the other end of each power cable to a power
distribution cabinet.
4. After connecting power cables, re-install the protective cover. See (3) in the
following figure.
5. Bundle the cables together from bottom up with tie wraps at 150 mm (5.91
in.) intervals. Then affix the cables to the cable rack.
6. Attach labels 20 mm (0.79 in.) from both ends of each power cable. See (4) in
the following figure.

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NO TE

Power cables can be routed from either the left or right side or from both the left and right
sides. The following figure shows that power cables are routed from both the left and right
sides.

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NO TE

Perform the following steps to install a power cable:
1. Cut a power cable to a specific length. The cable needs to be longer than the distance
from a power module to the PDF.
2. Install a terminal on one end of the power cable and connect the power cable with the
terminal to the device.
3. Route the power cable, bind the power cable to the cable rack, and cut the excess
power cable. Install a terminal on the other end of the power cable and connect the
power cable with this terminal to the PDF.

4.2.10.9 Installing Power Cables-AC Power Distribution

DANGER

Installing power cables while power is on is potentially dangerous and must be
avoided.

NO TE

● NE5000E CCC needs two EPS150-4850A AC-DC converters.
● If customers do not use Huawei power cables, they need to select suitable power cables
based on the local cable standards.

EPS150-4850A

Table 4-68 Technical specifications

Item Parameter

Dimensions (H x W x D) 442 mm x 650 mm x 88 mm

Input voltage range 200 VAC to 240 VAC (220 V power supply); 100
VAC to 120 VAC (110 V power supply)

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Item Parameter

Maximum input current 18.5 A per module

Maximum output current 50 A per module

Maximum output power 2900 W per module

Number of power inputs/ 3
outputs

Table 4-69 Cable specifications
Item Specifications

AC input 6 mm^2 - black jacket (cores: blue, brown) - 43 A,
two equivalent cores

DC output 25 mm^2

Ground cable 25 mm^2

NO TE

● If the power cable connecting an AC chassis to an AC PDF in site survey is longer than
20 m, the AC PDF or the cabinet in the first cabinet in a row must be deployed near the
device.
● An OT-6mm^2-M6 naked terminal must be installed on the end of the AC power cable
connected to the device.
● For details on the DC power cable and terminal specifications, see DC Power
Distribution.

Installing the AC-DC converters
1. Install slide rails. See (1) in the following figure.
2. Determine where to install floating nuts, mark the positions using a marker
and install floating nuts to the marked positions. See (2) in the following
figure.
3. Install the AC-DC converters, and secure it to the cabinet using M6 screws.
See (3) and (4) in the following figure.

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4. Install the PE wire and ensure that the power supply system is correctly
grounded.

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NO TE

A power distribution box grounded by connecting to the ground busbar in the equipment
room.

Connecting Cables

CA UTION

● To provide better power supply reliability, make sure one EPS150-4850A are
connected to the primary PDF, and the other one are connected to the backup
PDF.
● To ensure power supply backup, connect cables as shown in the following
figure.

Connections between the device and AC-DC converters are as follows:

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The following figure shows how AC input power cables are connected to AC
power distribution boxes.

Installing Power Cables

NO TICE

On a DC power module, connect NEG(-) cables to the second row of terminals
and install a plastic cover over the terminals. Then, connect RTN(+) cables to the
first row of terminals.

1. Attach temporary labels on both ends of a power cable.
2. Remove the panel from power modules. See (1) in the following figure.
3. Route the AC power cables along the cable ladder, and connect one end of
each AC power. See (2) and (3) in the following figure.
4. Connect the input terminals on the AC-DC converters to the power
distribution cabinet in the equipment room.
5. Bundle the cables together from the bottom up with tie wraps placed at 150
mm (5.91 in.) intervals.

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6. Then affix the power cables to the cable rack. Attach labels 20 mm (0.79 in.)
from both ends of each power cable. See (4) in the following figure.

7. Install the plastic cover to each power module.

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Installing a Three-core AC Power Cable
NO TE

If the AC-input power cable is a three-wire cable, do as follows.
1. Remove a specific length of the cable sheath and cut the PE wire (yellow-
and-green) at the point where the cable sheath is removed (you can wrap the
exposed PE wire with a PVC insulation tape to prevent leakage of electricity or
short circuit). Then, remove the sheath of the L wire (brown) and that of the
N wire (blue) and crimp OT terminals. See the following figures.

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2. Connect the L wire and the N wire to the L/N input OT terminals on the AC
power distribution box.

NO TE

When two L wires and one N wire are used, perform the following steps:
● When 110 V power supply (two L wires) is provided, connect two L wires to the L
and N input terminals (OT terminals). Cut the N wire. For methods, see the
preceding description of cutting the PE wire.
● When 220 V power supply (one L wire and one N wire) is provided, connect the N
wire and one L wire to the N and L input terminals (OT terminals) on the AC
distribution box and cut the other L wire. For methods, see the preceding
description of cutting the PE.

The reason of the PE wire in a three-core AC power cable does not need to
be connected to an AC power distribution box.
NO TE

If an AC power distribution box has been grounded properly, the PE wire in the three-core
AC power cable does not need to be connected.
● The power modules are connected to the AC power distribution box through
AC-DC convertors, as shown in (1) of the following figure. PE wires (green-
and-yellow) on the AC-DC convertors are connected to the AC power
distribution box, as shown in (2) of the following figure.
● If the PE wire is not needed, the AC power distribution box must be grounded
using the PE terminal on the front panel to ensure reliable and secure
grounding of the entire power supply system, as shown in (3) of the following
figure.

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4.2.10.10 Installing Boards and Sub-cards

Board cage

Figure 4-234 Front board cage

Installing Boards and OFCs

NO TICE

● Before installing the boards, wear the ESD wrist strap or ESD gloves to prevent
the electrostatic discharge of the human body from damaging the sensitive
components.
● Check whether the color of the two ends of the board panel is consistent with
that of the board name label on the chassis to decide whether the board is
installed in a proper slot.
● Insert MPUs in slot 9 and slot 10. Insert ICUs in slot 11 and slot 12.
● Blank filler panels must be installed into vacant slots.

1. Remove blank filler panels.

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4.2.10.11 Laying Network Cables

NO TICE

● The device does not support unshielded network cables. Install shielded
network cables on the device.
● Before bundling network cables together, use a network cable tester to test
connectivity.

NO TE

● Connect network cables based on the control channel connections.
● The space between power cables, ground cables, and signal cables must be more than
30 mm (1.18 in.).
● Inside the cabinet, bundle the network cables together in a rectangular shape. Make
sure that the tie wraps face the same direction.
1. Mark both ends of a network cable using an erasable marker.
2. Route the network cables along the cable ladder, and pass the network cables
through the cable inlet on the top of the cabinet.
3. Remove the panel from the cable trough. See (1) in the following figure.
4. Route the network cables along the cable trough of the device and connect
them to the corresponding interfaces. See (2) in the following figure.

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5. Bundle the cables together with tie wraps at 150 mm (5.91 in.) intervals. Then
affix the network cables to the cabinet. See (3) in the following figure.
6. Attach labels 20 mm (0.79 in.) from both ends of each network cable. See (4)
in the following figure.

4.2.10.12 (Optional) Checking Optical Power

The following table describes comparison between the transmit optical power of
50 Gbps optical modules and damaged optical power threshold at the receive end:

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Optical Maximum Minimum Damaged Description
Module Type Average Average Optical
Transmit Transmit Power
Optical Optical Threshold at
Power Power the Receive
End

50GBASE-FR 3 -4.1 5.2 The damaged
optical power
50GBASE-LR 4.2 -4.5 5.2 threshold is
greater than
the maximum
average
transmit
optical power,
posting low
self-loop risks.

50GBASE-ER 6.6 0.4 -2.4 The damaged
optical power
threshold is
9dBm lower
than the
maximum
average
transmit
optical power
and 2.8dBm
lower than
the minimum
average
transmit
optical power,
posing high
self-loop risks.
In this case,
an optical
attenuator
must be
configured for
self-loop.

For applications of the 50 Gbps optical module supporting a distance of 40 km:
1. To ensure that the optical module runs stably for a long time, adjust the
receive optical power of the optical module to a value lower than -4 dB.
According to the IEEE 802.3 standard, if the receive optical power of the
optical module exceeds -2.3 dB, the optical module may be permanently
damaged.
2. Before connecting to the optical module, use an optical power meter to
measure the receive optical power (P). If P is less than -4 dB, the optical
module can be directly connected. If P is greater than -4 dB, add an optical

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attenuator at the receive end to ensure that the receive optical power is less
than -4 dB. Alternatively, add an optical attenuator (no less than 10 dB is
recommended) before the interconnection, and then adjust the optical
attenuator based on the site requirements to prevent the optical module from
being damaged.
3. If a loopback occurs on the pigtail of the optical module or the optical
module is connected for a short distance, an optical attenuator must be
added. It is recommended that the optical attenuator be no less than 10 dB.
4.2.11 NE5000E-20 Installation Guide

4.2.11.1 Precautions

Safety Precautions
● To ensure user safety and device security, comply with all safety precautions
marked on the device and instructed in the product document. The
"CAUTION", "WARNING", and "DANGER" signs in the product document do
not include all necessary safety precautions. The signs only highlight certain
safety precautions.
● When operating Huawei products and devices, you must comply with relevant
safety precautions and special safety instructions provided by Huawei. The
safety precautions in this document are only some that Huawei can predict.
Huawei is not liable for any consequence that results from violation of
universal regulations for safety operations and safety codes on design,
production, and device use.

Local Safety Regulations
When operating a device, abide by local laws and regulations.

Installation Personnel Training
Installation and maintenance personnel must be trained to perform operations
correctly and safely.

Personnel Safety
● Do not touch the high-voltage power supply directly or with objects that
conduct electricity, including damp objects. Touching the power supply risks
electric shock and serious injury.
● Non-standard operation of the high-voltage power supply may pose a fire risk
or a risk of electric shock.
● To prevent device damage or personal injury, ensure that all devices are
grounded before powering the devices on.
● Ensure that devices are powered off before attempting to operate power
supplies.
● Do not stand close to or look into the optical fiber outlet without eye
protection when handling optical fibers.
● To prevent dust inhalation or injury to eyes from dust, wear appropriate eye,
nose, and mouth protection when drilling holes.

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● When working at heights, ensure that objects are placed securely and not at
risk of falling onto personnel below.

4.2.11.2 Installation Flowchart

Installation Precautions
● Allow 760 mm (29.92 in.) of clearance in front of and behind the NE5000E-20
for maintenance.
● Power modules must be connected correctly to the power distribution box to
ensure power supply reliability.

Installation Flowchart

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4.2.11.3 Preparing for Installation

Tools

Diagonal pliers Phillips screwdriver Flat-head screwdriver

Adjustable wrench Marker Ladder

Heat gun ESD gloves ESD wrist strap

Multimeter Box cutter Wire stripper

Cable cutter RJ11 crimping tool Power cable crimping
tool

Hydraulic pliers Protective gloves Socket wrench

Hammer drill Long measuring tape Torque wrench

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Level Network cable tester
Fuse handle

Vacuum cleaner Plummet Crimping tool

Hammer Torque screwdriver
2.5 mm hex screwdriver

- -

fiber-pulling pliers

Related Materials
1. PVC insulation tape
2. Tie wrap
3. Fiber binding tape
4. Heat shrink tube
5. Corrugated pipe
6. Cable label
7. fiber-pulling pliers

4.2.11.3.1 Inspecting and Cleaning Optical Fiber Connectors and Adapters

Overview
This topic introduces the purpose and procedure of cleaning optical fiber
connectors, as well as polluters to optical fiber connectors.
Cleaning fiber connectors is to remove dust or other dirt to avoid performance
degradation of optical transmission systems.

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Figure 4-235 shows an optical fiber connector.

Figure 4-235 Optical fiber connector

Optical fiber connectors should be free of:

● Dust
● Grease (usually brought by hands)
● Condensate residue
● Powder (evaporated residue of water or solvent)

Dust is the most common dirt in optical fiber connectors. The dust particles that
can be seen only by a microscope can affect the quality of optical signals,
deteriorate the system performance, and cause instability in network operation.

A 1-micrometer dust particle on the single-mode fiber connector can block 1%
light and cause 0.05 dB attenuation. A 9-micrometer dust particle that cannot be
seen by human eyes can block an entire fiber core. Therefore, small dirt even that
cannot be seen by human eyes should be removed.

NO TE

Before you connect any optical component, make sure that you have checked and cleaned
the component.

Procedure

Table 4-70 describes the procedure of inspecting and cleaning the optical fiber
connectors and adapters.

Table 4-70 Procedure of inspecting and cleaning the optical fiber connectors and
adapters

Step Details

Clean optical fiber connectors using See "Cleaning Optical Fiber Connectors
the cassette cleaner Using the Cassette Cleaner".

Clean optical fiber connectors using See "Cleaning Optical Fiber Connectors
lens tissue Using Lens Tissue".

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Step Details

Clean optical fiber adapters using See "Cleaning Optical Fiber Adapters
dustfree absorbent swabs Using Dustfree Absorbent Swabs".

Protection of Optical Fiber Connectors
This topic describes requirements for fiber connector protection.
The requirements are as follows:
● All boards with optical ports must be packed properly, to avoid mechanical
and electrostatic damages and to reduce vibrations.
● The protective caps must be put in an ESD bag.
● Protective caps must be installed on all optical fiber connectors when not in
use. The optical fiber connectors must be stored in proper packages to keep
them clean.
● Figure 4-236 shows the recommended protective caps, whereas Figure 4-237
shows the protective caps not recommended.

Figure 4-236 Protective caps recommended

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Figure 4-237 Protective caps not recommended

NO TE

The protective caps not recommended are made of soft rubber, which are apt to absorb
dust and sundries, and difficult to clean.

Tools, Equipment, and Materials
Optical connectors should be cleaned using recommended tools, equipment and
materials.
The following provides the recommended tools, equipment and materials:
● Optical power meter
● 400X fiber microscope (A video fiber microscope is recommended.)
● Cassette cleaner shown in Figure 4-238
● Cleaning solvent (Isoamylol is preferred, propyl alcohol is the next, and
alcohol or formalin is forbidden.)
● Non-woven lens tissue, fiber cleaning tissue, and dustfree cloth (Non-woven
lens tissue is recommended.)
● Special compressed air
● Special cleaning roll
● Dustfree absorbent swab (made of medical cotton or long fiber cotton)
shown in Figure 4-239 and Figure 4-240

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Figure 4-238 Cassette cleaner

Figure 4-239 Dustfree absorbent swabs for cleaning the SC and FC connectors

Figure 4-240 Dustfree absorbent swabs for cleaning the LC connectors

Inspecting Optical Fiber Connectors
This topic describes how to inspect the end face of optical fibers using a fiber
microscope.

Tools, Equipment, and Materials
The following provides the required tools, equipment and materials for inspecting
optical fiber connectors:

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● Optical power meter
● 400X fiber microscope (A video fiber microscope is recommended.)

Precautions

CA UTION

Laser energy is invisible and may cause eye injuries. Never look directly into fiber
connectors or ports.
Use a fiber microscope equipped with a safety device or a desktop video fiber
microscope when inspecting the optical fiber connectors.

NO TICE

Electrostatic discharge is hazardous to the electronic equipment. Wear an ESD
wrist strap and ensure that the strap is grounded properly before touching the
equipment and boards, to protect the static-sensitive components against
electrostatic discharge of the human body. Otherwise, the equipment may be
damaged or the service may be interrupted.

Procedure
1. Shut down the laser and disconnect the fiber end before inspecting the fiber
connector.
2. Test the optical power using a power meter to ensure that the laser is shut
down.
3. Use a fiber microscope to check whether the fiber connector is contaminated
or damaged. See the examples below.
– Clean fiber and face
Figure 4-241 shows an image of a clean fiber end face under the fiber
microscope.

Figure 4-241 Clean fiber and face

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– Damaged fiber end face
Figure 4-242 shows images of the damaged fiber end face. The image on
the left shows a severely damaged fiber. Severely damaged fibers can
cause damage to the equipment and should not be used. The image on
the right shows a defective fiber. If the output power is within a certain
range, the defective fiber might not cause any damage to the equipment.
If the output power is unstable or out of the range, however, the
defective fiber can cause damage to the equipment.

Figure 4-242 Damaged or defective fiber end face

NO TE

Figure 4-242 shows only the 800-micrometer fiber cores.
For details on acceptable and unacceptable fibers, see Figure 4-243, Figure
4-244 and Figure 4-245.

Figure 4-243 Clean fiber end face

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Figure 4-244 Acceptable fibers with imperfections

Figure 4-245 Unacceptable fibers with imperfections

4. If any dirt is detected, clean the optical fiber connector. For details, see
"Cleaning Optical Fiber Connectors Using the Cassette Cleaner" and "Cleaning
Optical Fiber Connectors Using Lens Tissue".
5. If any damage is detected, replace the fiber.

Inspecting the Optical Fiber Link
This section describes the insertion loss and reflection requirements of optical links
and the method of checking the quality of optical links for the application of 50G
optical modules with the PAM4 coding technology.

Tools, Equipment, and Materials
Tools and instruments for checking optical fiber links are as follows:
● OTDR meter
● Fiber microscope

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Precautions

CA UTION

Because the transmit optical power of the OTDR meter is much higher than the
damaged optical power threshold at the receive end, the optical fiber must be
removed from the optical module when the OTDR meter is used to test the optical
path quality.

Currently, the Ethernet port rate is increasing. Since the 50G optical module link
uses the PAM4 encoding technology, there are higher requirements on the optical
fiber and cable quality and the link is more sensitive to multipath reflection
interference of signals. If the fiber link connector, fiber section, or fiber splicing
surface is dirty, optical signals are reflected back and forth on the fiber link,
causing interference due to co-channel noise on the receive side. As a result, the
optical link is unstable or intermittently disconnected.

According to the national standard (GBT50312-2016), the loss of the optical fiber
link connector must meet the requirements described in Table 4-71.

Table 4-71 Maximum attenuation of the optical fiber connector

Type Maximum attenuation of an optical fiber
connector (dB)

Fiber splicing connector 0.3

Optical mechanical connector 0.3

Optical connector 0.75

NO TE

Fiber cores are connected through connectors, such as the ODF, optical attenuator, and
flange, in splicing and mechanical modes.

Table 4-72 describes requirements for the reflection of the optical fiber connector
when Ethernet ports (such as 50G) use PAM4 encoding to double the rate. More
connectors bring lower requirements for the reflection.

Table 4-72 Maximum reflection of connectors

Number of Maximum Reflection of Each Connector (dB)
Optical Fiber
Connectors 50GBASE-FR 50GBASE-LR 50GBASE-ER

1 -25 -22 -19

2 -31 -29 -27

4 -35 -33 -32

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Number of Maximum Reflection of Each Connector (dB)
Optical Fiber
Connectors 50GBASE-FR 50GBASE-LR 50GBASE-ER

6 -38 -35 -35

8 -40 -37 -37

10 -41 -39 -39

Procedure
1. After the optical fiber at the peer end is disconnected, use the OTDR meter to
test the local end. Check whether the loss and reflection of each link and
node are normal. (The loss of a fiber splicing connector should be less than
0.3 dB, the loss of a connector should be less than 0.75 dB, and the reflection
of a connector should be less than -30 dB.) If the test result is not within the
required range, process the abnormal port.
2. Locate the equipment room where the port resides based on the distance
between abnormal points in the OTDR test result. Preliminarily determine the
port location, disconnect the port, and perform an OTDR test on the port that
reports alarms. Check whether the distance is consistent with that in the
previous test. If not, continue to test other ports.
3. After the abnormal port is found, test the port using a fiber microscope. If the
port is dirty, clean it. For details, see "Inspecting and Cleaning Optical Fiber
Connectors and Adapters".
4. After the port is cleaned, restore the port, and ensure that the connector is
tightened. Perform an OTDR test on the port to check whether loss and
reflection of each link and node are normal.
5. If the fault persists, replace the flange and perform an OTDR test on the port
that reports alarms to check whether loss and reflection of each link and
node are normal.
6. If the fault persists, replace the optical fiber and perform an OTDR test on the
port that reports alarms to check whether loss and reflection of each link and
node are normal.
7. If multiple abnormal points exist on the link, repeat steps 2 to 6.

Cleaning Optical Fiber Connectors Using the Cassette Cleaner

This topic describes how to clean the fiber connectors using a cassette cleaner.

Prerequisites

Before cleaning, inspect the fiber end face with a fiber microscope or a magnifier
to confirm the degree of fiber contamination. Clean the fiber only when it is
severely contaminated. This is because the cleaning operation itself may introduce
dust, dirt, or cause damage to the fiber.

The following procedure provides the steps to clean the fiber connectors using
cartridge type cleaners.

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Tools, Equipment, and Materials
The following lists the required tools, equipment and materials for cleaning optical
fiber connectors:
● Cassette cleaner
● Optical power meter
● 400X fiber microscope (A video fiber microscope is recommended.)

Precautions

CA UTION

Laser energy is invisible and may cause eye injuries. Never look directly into fiber
connectors or ports.

NO TICE

Electrostatic discharge is hazardous to the electronic equipment. Wear an ESD
wrist strap and ensure that the strap is grounded properly before touching the
equipment and boards, to protect the static-sensitive components against
electrostatic discharge of the human body. Otherwise, the equipment may be
damaged or the service may be interrupted.

Procedure
1. Shut down the laser and disconnect the fiber end before inspecting the fiber
connector.
2. Test the optical power using a power meter to ensure that the laser is shut
down.
3. Press down and hold the lever of the cassette cleaner. The shutter slides back
and exposes a new cleaning area. See Figure 4-246.

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Figure 4-246 Using the cassette cleaner

4. Place the fiber end face gently against the cleaning area.
5. Drag the fiber end face gently on one cleaning area in the arrow direction
each time. See Figure 4-247. Do it again on the other cleaning area in the
same direction as the first time once. See Figure 4-248.

NO TICE

Do not drag the fiber end face on the same cleaning area more than once.
Otherwise, the connector can be contaminated or damaged.

Figure 4-247 Dragging the fiber end face gently on one cleaning area

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Figure 4-248 Dragging the fiber end face gently on the other cleaning area

6. Release the lever of the cassette cleaner to close the cleaning area.
7. Use a fiber microscope to inspect the fiber to check whether there is any dirt.
For details see the examples shown in "Inspecting Optical Fiber Connectors".
If the fiber end face is still dirty, repeat 1 to 6.
8. Connect the fiber to the optical port immediately. If it is not used for the time
being, put a protective cap on it.
9. Turn on the laser after connecting the fiber to the board.

Cleaning Optical Fiber Connectors Using Lens Tissue
This topic describes how to clean the fiber connectors using lens tissue.

Prerequisites
Before cleaning, inspect the fiber end face with a fiber microscope or a magnifier
to confirm the degree of fiber contamination. Clean the fiber only when it is
severely contaminated. This is because the cleaning operation itself may introduce
dust, dirt, or cause damage to the fiber.

Tools, Equipment, and Materials
The following provides the required tools, equipment and materials:
● Optical power meter
● 400X fiber microscope (A video fiber microscope is recommended.)
● Cleaning solvent (Isoamylol is preferred, propyl alcohol is the next, and
alcohol or formalin is forbidden.)
● Non-woven lens tissue, fiber cleaning tissue, and dustfree cloth (Non-woven
lens tissue is recommended.)
● Special compressed air or cleaning roll

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Precautions

CA UTION

Laser energy is invisible and may cause eye injuries. Never look directly into fiber
connectors or ports.

NO TICE

Electrostatic discharge is hazardous to the electronic equipment. Wear an ESD
wrist strap and ensure that the strap is grounded properly before touching the
equipment and boards, to protect the static-sensitive components against
electrostatic discharge of the human body. Otherwise, the equipment may be
damaged or the service may be interrupted.

Procedure
1. Shut down the laser and disconnect the fiber end before inspecting the fiber
connector.
2. Test the optical power using a power meter to ensure that the laser is shut
down.
3. Put a little cleaning solvent on the lens tissue.
4. Clean the fiber end face on the lens tissue. See Figure 4-249 and Figure
4-250.

NO TICE

Drag the fiber end face on the same area in the lens tissue only once.
Otherwise, the connector can be contaminated or damaged.

Figure 4-249 Cleaning the fiber end face using the lens tissue on the desk

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Figure 4-250 Cleaning the fiber end face using the lens tissue on the hand

5. Repeat 4 several times on the areas of the lens tissue that have not been
used.
6. Use the compressed air to blow off dust on the fiber end face.

NO TE

● When using the compressed air, keep the nozzle as close as possible to the fiber
end face without touching it.
● Before using the compressed air, first spray it into the air to expel deposits in the
compressed air.
● If the compressed air is not available, use a cleaning roll instead.
7. Use a fiber microscope to inspect the fiber to check whether there is any dirt.
For details, see the examples shown in "Inspecting Optical Fiber Connectors".
If the fiber end face is still dirty, repeat 1 to 6.
8. Do not touch the fiber connector after cleaning it. Connect it to the optical
port immediately. If it is not used for the time being, put a protective cap on
it.

NO TE

Do not use the same cleaning area to clean the fiber connector for more than one
time.
9. Turn on the laser after connecting the fiber to the board.

Cleaning Optical Fiber Adapters Using Dustfree Absorbent Swabs

This topic describes how to clean fiber adapters using dustfree absorbent swabs.

Prerequisites

There are several types of dustfree absorbent swabs available. Select appropriate
dustfree absorbent swabs based on site conditions. You can obtain the following
tools and materials from a fiber cable and connector manufacturer.

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Hardware Guide 4 Hardware Installation and Parts Replacement

Tools, Equipment, and Materials
The following lists the required tools, equipment and materials:
● Optical power meter
● 400X fiber microscope (A video fiber microscope is recommended.)
● Cleaning solvent (Isoamylol is preferred, propyl alcohol is the next, and
alcohol or formalin is forbidden.)
● Special compressed air
● Dustfree absorbent swab (made of medical cotton or long fiber cotton)

Precautions

CA UTION

Laser energy is invisible and may cause eye injuries. Never look directly into fiber
connectors or ports.

NO TICE

Electrostatic discharge is hazardous to the electronic equipment. Wear an ESD
wrist strap and ensure that the strap is grounded properly before touching the
equipment and boards, to protect the static-sensitive components against
electrostatic discharge of the human body. Otherwise, the equipment may be
damaged or the service may be interrupted.

Procedure
1. Shut down the laser and disconnect the fiber end before inspecting the fiber
connector.
2. Test the optical power using a power meter to ensure that the laser is shut
down.
3. Select the dustfree absorbent swab with a proper diameter based on the type
of an adapter.
NO TE

For SC and FC fiber adapters, use the dustfree absorbent swab with a diameter of 2.5
mm (0.1 in.); for the LC fiber adapter, use the dustfree absorbent swab with a
diameter of 1.25 mm (0.05 in.). See Figure 4-251 and Figure 4-252.

Figure 4-251 Dustfree absorbent swabs for cleaning the SC and FC connectors

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Hardware Guide 4 Hardware Installation and Parts Replacement

Figure 4-252 Dustfree absorbent swabs for cleaning the LC connectors

4. Put a little cleaning solvent on the dustfree absorbent swab.
5. Place the dustfree absorbent swab gently on the adapter so that the cleaning
solvent is against the fiber end face. Draw out the dustfree absorbent swab
from the fiber adapter and then rotate the dustfree absorbent swab clockwise
once. Ensure that the tip of the dustfree absorbent swab directly contacts the
fiber end face.
6. Use the compressed air to blow off dust on the fiber end face.

NO TE

● When using the compressed air, keep the nozzle as close as possible to the fiber
end face without touching it.
● Before using the compressed air, first spray it into the air to expel deposits in the
compressed air.
7. Step 7 Use a fiber microscope to inspect the fiber to check whether there is
any dirt. For details, see "Inspecting Optical Fiber Connectors". If the fiber end
face is still dirty, repeat 1 to 6.
8. Connect the fiber to the optical port immediately. If it is not used for the time
being, put a protective cap on it.
9. Turn on the laser after connecting the fiber to the board.

4.2.11.4 Installing the Power Chassis

NO TE

● The power chassis is separately packed and delivered. Install it before installing the
panel door plate of the main chassis.
● Space permitting, carry the wooden carton into or near the equipment room before
unpacking it. This prevents the device from being damaged during transportation.
● Wear gloves when unpacking the wooden carton to avoid injuries by sharp objects.

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Figure 4-253 Power chassis

Figure 4-254 Main chassis

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Hardware Guide 4 Hardware Installation and Parts Replacement

Installation Procedure
1. Unpack the carton and take out the main chassis and power chassis of by
following the instructions on the carton.
2. Remove the front protective covers (marked 1 and 2 in the following figure),
protective cover for shielded cables (marked 3), and BUSBAR ESD bag
(marked 4) in sequence.

3. Use the front protective covers as steps, step on the steps, and carry the
power chassis to the top of the main chassis with four persons.

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Hardware Guide 4 Hardware Installation and Parts Replacement

NO TE

● Before moving the power chassis, loosen the screws of the switch blades so that
the switch blades can spring up.

● Before installing the power chassis, use diagonal pliers to cut off the small package
accessories and screws that are bound on the side cable ties. Use the screws to
secure the power subrack.

4. Install and fasten the power chassis to positions marked 1 and 2 (4PCS M12
screws, tightening torque 45N * m). Then, connect monitoring cables to ports
marked 3 (tightening torque 0.25N * m) on the main chassis and install the
protective cover for the monitoring cables.

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Hardware Guide 4 Hardware Installation and Parts Replacement

NO TICE

The monitoring cable connector must be connected to the bottom and the
captive screws must be tightened to avoid poor contact.

CA UTION

Do not affect the adjacent connection lines when installing the monitoring
lines. After installation, you need to check and confirm that all three cables
are well installed.
Do not remove the monitoring cable of the power chassis before securing the
power chassis to the master chassis. Otherwise, the cable may be damaged
during the installation.

5. Align the BUSBAR connectors with the jacks on the power chassis (marked 1),
gently pull the BUSBAR outwards, push back the 2-3cm, and push the into the
socket to ensure that the BUSBAR is securely installed. And clip the switch
blades to fasten the connectors (marked 2). Then, use a screwdriver to fasten
the screws of the connectors and switch blades from left to right (marked 3),
and remove the temporary protective cover for the power chassis (marked 4).

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6. Install and fasten the overhead cable tray and protective covers. Then install
the bottom cable tray after successfully installing the NE5000E-20 on a
concrete floor or leveling off the ESD floor.

The following figure shows the positions of four captive screws on the
overhead cable tray.

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Hardware Guide 4 Hardware Installation and Parts Replacement

NO TE

The overhead cable tray, underfloor cable tray, protective cover, and front door are in
the same packing case.
7. Install the middle side-doors before installing the NE5000E-20 and another
device side by side.

8. Install the NE5000E-20 in a specified position in the equipment room. Use
rear handles to facilitate NE5000E-20 transportation and remove them after
installing the NE5000E-20.

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4.2.11.5 Installing the NE5000E-20 on a Concrete Floor

NO TICE

● The NE5000E-20 is heavy and needs to be carried by hoisting equipment.
● During NE5000E-20 installation, do not hold the handles on modules of the
NE5000E-20.

1. Attach a plumb line to the cable tray that is vertical to the front of the
NE5000E-20. Use a marker to mark the point of the plumb on the ground.
Then, mark the second point in the same way, and draw the baseline with a
powder marker.

2. Lay a marking-off template as planned, and mark the installation position of
the NE5000E-20.

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Hardware Guide 4 Hardware Installation and Parts Replacement

NO TE

● If multiple NE5000E-20 are required, it is recommended that you install one
NE5000E-20 before you mark the installation positions of others.
● To mark installation positions and drill holes for multiple NE5000E-20 or cabinets
(a maximum of three at a time), ensure that the distance between the central lines
of two adjacent marking-off templates is 600 mm (23.62 in.).
● After marking the installation positions, use a ruler to check the hole positions.
3. Use an electric drill to drill holes and install expansion bolts.

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4. Use hoisting equipment to move the NE5000E-20 to the installation position
and place an insulation washer between the NE5000E-20 and floor.

NO TE

● As the NE5000E-20 is an integrated device, directly fix it to the floor.
● The screw holes on the front of the NE5000E-20 can be used only before you
install the bottom cable tray.
● The screw holes at the rear of the NE5000E-20 can be used only after you remove
the fan modules on both sides of the NE5000E-20.

Figure 4-255 Screw holes on the front of the NE5000E-20

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Figure 4-256 Screw holes at the rear of the NE5000E-20

5. Level the NE5000E-20. Use a level and plumb line to check whether the
NE5000E-20 is level. If not, use a socket wrench to adjust the leveling feet.

6. Use a torque socket to tighten the four expansion bolts to a torque of 45 N.m.

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7. Conduct an insulation test and measure the resistance between the expansion
bolts and the ground bolts on the supports. The resistance must be greater
than 5 megohms. If the resistance is less than 5 megohms, the NE5000E-20 is
not isolated from the ground. In this case, uninstall all the components and
check whether some insulating parts are damaged or are not installed. Then,
re-install the NE5000E-20 and conduct an insulation test again.

8. Install the NE5000E-20 with another device side by side after installing middle
side-doors of the NE5000E-20.
– Installing the NE5000E-20 with an N68E side by side
Remove the parallel plate from position 1 and install the plate on
position 2. Then, turn the parallel plates on position 3 outward and
connect them to the N68E.

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– Installing the NE5000E-20 with another NE5000E-20 side by side
Turn the parallel plates on positions 1 and 2 on each NE5000E-20
outward and connect the plates to the peer NE5000E-20.

– Installing the NE5000E-20 with an N610 side by side
Remove the parallel plate from position 1 and install the plate on
position 2. Then, turn the parallel plate on position 3 outward and
connect it to the N610.

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9. Use a level and plumb line to measure the bottom of combined cabinets and
the front of columns, respectively, to check whether the cabinets are level. If
not, use a socket wrench to loosen the screws and adjust the leveling feet.

10. Install the bottom cable tray.

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4.2.11.6 Installing the NE5000E-20 on an ESD Floor

NO TICE

● The NE5000E-20 is heavy and needs to be carried by hoisting equipment.
● During NE5000E-20 installation, do not hold the handles on modules of the
NE5000E-20.

Floor Preparations
1. Lay a marking-off template as planned, and mark the installation position of
the NE5000E-20.

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NO TE

● If multiple NE5000E-20 are required, it is recommended that you install one
NE5000E-20 before you mark the installation positions of others.
● To mark installation positions and drill holes for multiple NE5000E-20 or cabinets
(a maximum of three at a time), ensure that the distance between the central lines
of two adjacent marking-off templates is 600 mm (23.62 in.).
● After marking the installation positions, use a ruler to check the hole positions.
2. Use an electric drill to drill holes and install expansion bolts.

Installing Supports
Adjusting the Support Height
1. Use a ruler to measure the distance between the concrete floor and the upper
surface of the ESD floor.
2. Adjust the support to the required height based on the measurement results
and the silk-screen scale on the support.
3. Tighten the height locking bolts on both sides.

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Assembling Supports

1. Adjust the telescopic rod based on the cabinet depth until the silk-screen scale
indicating the cabinet length is displayed.
2. Use a torque socket to tighten the 6 M8x20 bolt assemblies on the telescopic
rods to a torque of 13 N.m.
3. Assemble the telescopic rod and support using eight M8x20 bolt assemblies
and ensure that the protruding side of the guide rail faces outwards. Then,
use a torque socket to tighten all bolt assemblies to a torque of 13 N.m.
4. Use a level to check the levelness of the support. If the support is not level,
loosen the bolt and slightly adjust the support till it is level.
5. Use a torque socket to tighten all height locking bolts to a torque of 45 N.m.

Installing a Single Support

1. Align the four mounting holes of the support with the four expansion bolt
holes on the floor and install four expansion bolts.
2. Adjust the position of the support and use a level to measure the levelness of
the support.
3. If the support is not level, place spacers under the support.

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4. Use a torque socket to tighten the four expansion bolts to a torque of 45 N.m.
5. Use M8x20 screws to assemble the combining parts to the support to a
torque of 13 N.m.

Installing Supports in a Row
1. Combine other supports with the first support using combining parts. Ensure
that the fronts of all supports are aligned and the centers of adjacent
combining parts are 600 mm (23.62 in.) away from each other. Use a torque
socket to tighten the M8x20 bolt assemblies on the telescopic rods to 13 N.m.
2. Use the level to check the levelness of the support.
3. If the support is not level, place spacers under the support.
4. Use a torque socket to tighten all expansion bolts to a torque of 45 N.m.

Placing the NE5000E-20
1. Place the NE5000E-20 on the support, and align the installation holes of the
NE5000E-20 with the holes of the support. In addition, fit the spring washer,
flat washer, and insulation tube on the four M12x40 bolts, insert the bolts
into the installation holes, and tighten the bolts.

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NO TICE

● The NE5000E-20 provides board slots on the front and houses fan modules
at the rear.
● The NE5000E-20 weighs 347.1 kg (DC)/340.7 kg (AC). Therefore, it is
recommended that the NE5000E-20 be carried by enough persons to
prevent risks when it is carried to the support.
● The screw holes at the rear of the NE5000E-20 can be used only after you
remove the fan modules on both sides of the NE5000E-20.

Figure 4-257 Screw holes on the front of the NE5000E-20

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Figure 4-258 Screw holes at the rear of the NE5000E-20

2. Level the NE5000E-20. Use a level and plumb line to check whether the
NE5000E-20 is level. If not, use a socket wrench to adjust the leveling feet.

3. Use a torque socket to tighten the four M12x40 bolts to a torque of 45 N.m.

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4. Conduct an insulation test and measure the resistance between the M12x40
bolts and the ground bolts on the support. The resistance must be greater
than 5 megohms. If the resistance is less than 5 megohms, the NE5000E-20 is
not isolated from the ground. In this case, uninstall all the components and
check whether some insulating parts are damaged or are not installed. Then,
re-install the NE5000E-20 and conduct an insulation test again.

5. Install the NE5000E-20 with another device side by side after installing middle
side-doors of the NE5000E-20.
– Installing the NE5000E-20 with an N68E side by side
Remove the parallel plate from position 1 and install the plate on
position 2. Then, turn the parallel plates on position 3 outward and
connect them to the N68E.

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– Installing the NE5000E-20 with another NE5000E-20 side by side
Turn the parallel plates on positions 1 and 2 on each NE5000E-20
outward and connect the plates to the peer NE5000E-20.

– Installing the NE5000E-20 with an N610 side by side
Remove the parallel plate from position 1 and install the plate on
position 2. Then, turn the parallel plate on position 3 outward and
connect it to the N610.

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6. Use a level and plumb line to measure the bottom of combined cabinets and
the front of columns, respectively, to check whether the cabinets are level. If
not, use a socket wrench to loosen the screws and adjust the leveling feet.

7. Install the bottom cable tray.

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Restoring the ESD Floor
NO TE

After the ESD floor is installed on holders, the floor cannot be higher than the cabinet
bottom; otherwise, advanced doors fail to be properly installed.
1. Install front and rear holders and fix the holders to the support through
M12x25 bolt assemblies.

2. Cut and restore the ESD floor.

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4.2.11.7 Installing Cabinet Doors

Installing Side-Doors
NO TE

● The left and right side-doors at the front are the same, as are those at the middle.
However, the left and right side-doors at the rear differ. Follow the instructions provided
on the rear side-doors to install them.
● The screws for side-doors are packed in the fitting bag.
● The door status switch can be connected to the Alarm_IN port on the MPU over a
network cable to monitor the opening and closing of the cabinet door. By default, an
alarm is generated if the cabinet door is open for 30 minutes.
1. Install the two middle side-doors before installing the NE5000E-20 and
another device side by side.

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2. Install the two front side-doors.

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3. Install the two rear side-doors.

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Installing Front Doors
1. Install the front doors.

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2. Connect equipotential cables between the cabinet doors and master subrack.

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4.2.11.8 Installing a Ground Cable

Cable and Terminal Specifications
Item Specifications BOM Number

Ground 25 mm2 25030431
cable

Terminal 25 mm2-M8 single-hole OT 14170060
naked crimping terminal

25 mm2-M8 double-hole JG 14170121
naked crimping terminal

Installing a Ground Cable
1. Attach temporary labels to both ends of the ground cable.
2. Route the ground cable along the cable tray, and connect one end of the
cable to the grounding terminal on the top of the NE5000E-20.
3. Connect the other end of the cable to the ground bar of the equipment room.
4. Attach permanent labels at a position 20 mm (0.79 in.) from both ends of the
ground cable.

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Figure 4-259 Installing a ground cable

4.2.11.9 Installing the Fan Module of the NE5000E-20

Tools
● ESD wrist strap or ESD gloves
● Phillips screwdriver

Procedure
Step 1 Wear the ESD wrist strap and connect the grounding terminal to the ESD jack on
the chassis.
Step 2 Remove the filler panel.

Figure 4-260 Diagram of the filler panel

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Step 3 Insert the fans module into the chassis.

Hold the left and right handles of the fan module, and slowly and horizontally
insert the fan module along the guide rails in the slot until the back of the fan
module properly connects to the backplane. Turn the Phillips screwdriver to fasten
the fan module to the chassis by tightening the captive screws, as shown in Figure
4-261.

Figure 4-261 Diagram of installing the fan module FAN-120 on the NE5000E-20

Figure 4-262 Diagram of installing the fan module FAN-80 on the NE5000E-20

----End

4.2.11.10 Installing a PDU into a Cabinet

Tools and accessories
● Flat-head screwdriver
● Phillips screwdriver
● Marker
● Installation template (Quick Installation Guide)
● Floating nuts and matching screws

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● Floating nut hook
● Expandable guide rails and matching screws

Procedure
1. Mark the position for installing the PDU on the mounting bar at the rear of
the cabinet, and install floating nuts.

NO TE

Positions of mounting brackets only need to be marked on the front mounting rails,
whereas positions of expandable guide rails must be marked on both the front and
rear mounting rails. Keep the mounting holes on the front and rear mounting rails on
the same horizontal plane.

Figure 4-263 Marking the mounting holes for floating nuts

2. Install floating nuts and expandable guide rails in the marked positions.

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Figure 4-264 Installing floating nuts

Figure 4-265 Installing expandable guide rails

NO TE

Before installing a PDU, install square adjustable guide rails to place the PDU. Four
floating nuts are required to fix the mounting brackets of the PDU. Ten floating nuts
are required to fix the guide rails. Two floating nuts are required at the front end of
each guide rail, and three floating nuts are required at the rear end of each guide rail.

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3. Install the PDU in a cabinet or rack using front or rear mounting brackets,
depending on the cabinet type.

Figure 4-266 Installing the PDU in the cabinet using the front mounting
brackets

Figure 4-267 Installing the PDU in the cabinet using the rear mounting
brackets

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Table 4-73 Cabinet application scenarios
Cabi PDU Mounti Distance Distance Distance PD Re
net Instal ng ear from the from the Between U qui
Insta latio installa front rear Mounting Ins re
llatio n tion mounting mountin Bars (mm) tall me
n Positi positio bar to g bar to ati nts
Descr on n the outer the on for
iptio surface of outer Pos the
n the door surface itio Inst
header of the n alla
(mm) door tio
header n
(mm) Spa
ce
of
the
PD
U

800 Top Front 75~105 / 500~550 Top If
mm install mounti inst one
deep ation ng alla PD
cabin bracket tio U is
et s in the n conf
first igur
gear ed,
the
Front 125~155 / 500~505 hei
mounti ght
ng of
bracket the
s in the PD
second U is
gear 4
Front Not recommended due to limited U.
mounti operation space If
ng two
bracket PD
s in the Bs
third are
gear conf
igur
Rear / 115~145 > 500 ed,
mounti the
ng cab
bracket ling
s in the spa
first ce
gear is
ins
Rear / 165~195 > 500 uffi
mounti cie

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Cabi PDU Mounti Distance Distance Distance PD Re
net Instal ng ear from the from the Between U qui
Insta latio installa front rear Mounting Ins re
llatio n tion mounting mountin Bars (mm) tall me
n Positi positio bar to g bar to ati nts
Descr on n the outer the on for
iptio surface of outer Pos the
n the door surface itio Inst
header of the n alla
(mm) door tio
header n
(mm) Spa
ce
of
the
PD
U

ng nt.
bracket The
s in the refo
second re,
gear it is
not
rec
om
me
nde
d.

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Hardware Guide 4 Hardware Installation and Parts Replacement

Cabi PDU Mounti Distance Distance Distance PD Re
net Instal ng ear from the from the Between U qui
Insta latio installa front rear Mounting Ins re
llatio n tion mounting mountin Bars (mm) tall me
n Positi positio bar to g bar to ati nts
Descr on n the outer the on for
iptio surface of outer Pos the
n the door surface itio Inst
header of the n alla
(mm) door tio
header n
(mm) Spa
ce
of
the
PD
U

1000 Top Front 75~300 / 500~550 or On
mm install mounti 740~850 e
deep ation ng po
cabin bracket wer
et s in the dist
first ribu
gear tion
box
Front 125~300 / 500~505 or is 4
mounti 690~850 U
ng hig
bracket h. A
s in the ma
second xim
gear um
Front 175~300 / 640~850 of
mounti two
ng po
bracket wer
s in the dist
third ribu
gear tion
box
Rear / 115~340 500~850 es
mounti are
ng sup
bracket por
s in the ted.
first
gear

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Hardware Guide 4 Hardware Installation and Parts Replacement

Cabi PDU Mounti Distance Distance Distance PD Re
net Instal ng ear from the from the Between U qui
Insta latio installa front rear Mounting Ins re
llatio n tion mounting mountin Bars (mm) tall me
n Positi positio bar to g bar to ati nts
Descr on n the outer the on for
iptio surface of outer Pos the
n the door surface itio Inst
header of the n alla
(mm) door tio
header n
(mm) Spa
ce
of
the
PD
U

Rear / 165~390 500~850
mounti
ng
bracket
s in the
second
gear

1200 Top Front 75–300 / 500~550 or
mm install mounti 740~850
deep ation ng
cabin bracket
et s in the
first
gear

Front 125–300 / 500~505 or
mounti 690~850
ng
bracket
s in the
second
gear

Front 175–300 / 640~850
mounti
ng
bracket
s in the
third
gear

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Hardware Guide 4 Hardware Installation and Parts Replacement

Cabi PDU Mounti Distance Distance Distance PD Re
net Instal ng ear from the from the Between U qui
Insta latio installa front rear Mounting Ins re
llatio n tion mounting mountin Bars (mm) tall me
n Positi positio bar to g bar to ati nts
Descr on n the outer the on for
iptio surface of outer Pos the
n the door surface itio Inst
header of the n alla
(mm) door tio
header n
(mm) Spa
ce
of
the
PD
U

Rear / 305–540 500~850
mounti
ng
bracket
s in the
first
gear

Rear / 355–590 500~850
mounti
ng
bracket
s in the
second
gear

Figure 4-268 Positions of the mounting ears on the PDU

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Hardware Guide 4 Hardware Installation and Parts Replacement

4. Connect input and output power cables.Route the PDU input power cable
through the cable hole on the top of the cabinet, and align the PDU
mounting holes with floating nuts. One person holds the PDU, and the other
person secures the PDU using M6 screws to a torque of 3 N·m.

Figure 4-269 PDU input and output cables

5. Connect the ground cable to the closest ground point on the cabinet using
M6 screws with a torque of 3 N·m.

NO TE

You can install floating nuts on the mounting bar of the cabinet and set a ground point
near the floating nuts.

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Figure 4-270 Ground cable connection (left)

Figure 4-271 Ground cable connection (right)

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CA UTION

1. The ground cable is tightly connected to the PDU. The ground screw is M6 and
the torque is 5 N·m.
2. Onsite installation tool list (additional preparation is required): 3# screwdriver,
used to secure input power cables and ground cable screws; flat-head
screwdriver with a head size of 0.6 mm x 3.5 mm, used to connect output
power cables.
3. If inter-cabinet installation is involved, A610 and N610 cabinets support inter-
cabinet installation of a maximum of two PDUs, and A68 and N68 cabinets
support inter-cabinet installation of a maximum of one PDU.
4. The PDU uses 32 A circuit breakers, which are derated to 16 A.

4.2.11.11 Connecting PDU Input and Output Power Cables

Input Power Cable Connection

Figure 4-272 Input terminals

The input terminal block is divided into three layers. Connect the PE, N, and L
wires of the input multi-wire cable from bottom to top. Use a 3# screwdriver to
secure the input cable to a torque of 5 N·m. Connect each input cable from the
lower layer to the upper layer. When connecting cables, ensure that the OT
terminals are level and the cables are not crossed. After connecting cables, close
the protective cover of the input terminal block, and tighten the screws on the
protective cover to a torque of 0.5 N·m. For details about the cable mapping, see
the label on the protective cover of the input terminal block. Before connecting
the power cable to the input terminal block of the PDB, strip a part of the
insulation sheath off the power cable. The following table lists the length of the
insulation sheath to be stripped off the power cable.

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Table 4-74 Stripping length of the input power cable
PDB Input Scenario Diamete Stripped Length Remarks
Code r of the
Input
Cable

02354 Single-phase 32 6 mm2 The stripped length After the cable is
GYQ A input low of the live wire, stripped and the
smoke neutral wire, and wiring terminal is
zero PE wire on the crimped, use a
halogen cable side of the heat shrink tubing
(LSZH) PDB is 350 mm, to wrap the
three- 332 mm, and 314 stripped part. The
core mm respectively. input power cable
cable must be a 90°C
heat-resistant
02354 Three-phase 32 A 6 mm2 power cable.
GYS input low
smoke
zero
halogen
(LSZH)
five-core
cable

02354 Three-phase 63 A 16 mm2
GYV input low
smoke
zero
halogen
(LSZH)
five-core
cable

02354 Single-phase 63 16 mm2
GYT A input low
smoke
zero
halogen
(LSZH)
three-
core
cable

NO TE

Determine the length of the cable to be stripped from the other end of the EoS based on
site requirements. After stripping the cable, crimp an OT terminal, and use a heat shrink
tubing to wrap the stripped part. The cable quantity and connection method vary
depending on the input scenario. Connect cables based on the label on the rear cover of the
input terminal block.

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Output Power Cable Connection
The output terminal block is divided into three layers. Connect the PE, N, and L
wires of the output cables from bottom to top. Connect each output cable from
the lower layer to the upper layer. After the cable is connected, use the cable
management frames on both sides to sort the cables. Install the rear cover. When
installing the rear cover, push the rear cover inward, lift it up a little, hang it on
the gourd-shaped mounting pegs, and then tighten the captive screws. Secure the
output power cables using a flat-head screwdriver with a diameter of 0.6 mm x
3.5 mm to a torque of 0.5 N·m. Reserve 1 U space under the PDB for connecting
output power cables. The specific procedures for connecting the cables are as
follows:

Figure 4-273 Input and output power cable connections of the APD32-12-24 AC
PDU

Figure 4-274 Input and output power cable connections of the APD32-4-24 AC
PDU

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Figure 4-275 Input and output power cable connections of the APD63-2-24 AC
PDU

Figure 4-276 Connecting the input and output power cables of the APD63-6-24
AC PDU

CA UTION

Cable connection sequence in the scenario of one cabinet with two subracks:
If two PDBs need to be installed in a cabinet, pay attention to the cable
connection sequence because there are a large number of cables. It is
recommended that you install the two PDBs in the cabinet and select the proper
position for installing the mounting brackets. You need to install the cables of the
upper PDB first, and then install the cables of the lower PDB.

4.2.11.12 Installing the Power Cable

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4.2.11.12.1 DC Power Distribution

Overview
The NE5000E-20 power system is located at the top of the chassis. The main
components are the PMs, CMUs, and switches in the front of the chassis and the
PEMs at the rear of the chassis.

Figure 4-277 Main components of the power system

1 Cover plate 2 PM 3 CMU 4 Switch 5 PEM
for the PM

The power system consists of 24 PMs that are working in N+M backup mode (N
indicates the number of working modules and M indicates the number of backup
modules). The value M is determined based on the PM model and version.
The inputs on areas A and B back up each other, and power module backup
allows the system to work properly even if some PMs become faulty. In the -48 V

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DC power supply system, a PM has two channels of inputs. Therefore, the PM
itself supports input backup of areas A and B. In this case, only module backup
needs to be configured. The minimum value of M is 1.
● -48 V DC
An NE5000E-20 has six PEMs. Each PEM has eight inputs. There are
altogether 48 inputs (24 inputs in each of area A and area B). Power supply
areas A and B back up each other. If one power supply area has no current
output, the other power supply area can provide all the current required for
the normal operation of the device. In this way, power supply source-level
backup is implemented. A maximum of 24 PMs can be configured. Each PM
has two power inputs, which are from power supply areas A and B output by
the power entry module (PEM), respectively. The PM combines the two power
inputs and outputs one. Figure 4-278 and Table 4-75 show the mappings
between PEMs and PMs

Figure 4-278 Connections between PEMs and PMs

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Table 4-75 Mappings between PEMs and PMs
Name Location

PEM A1/B1 A2/B2 A3/B3 ...... A22/B2 A23/B2 A24/B2
2 3 4

PM 1 2 3 ...... 22 23 24

Power Supply Principles
A DC PM has output power of 2200 W. Use the N+1 PM backup mechanism as an
example. N+1 PMs are configured for power supply, with N being the number of
PMs required for the power consumption of the entire device. The value of N x
2200 W must be greater than the overall power consumption of the entire device.
Table 4-76 shows the details.

NO TE

If PMs are not fully configured, power cables are routed only for the PEM interfaces whose
corresponding PMs are installed. To facilitate the deployment of new power cables during
capacity expansion of PMs, you are advised to configure the PMs from the top down and
leave a filler panel in the position where no PM is installed.

Table 4-76 Power supply examples
Overall Power PM PM Cabling N+1 Backup
Consumption Configuration

P<2200W 1,2 A1,B1,A2,B2 1+1

2200W=<P<4400 1,2,3 A1,B1,A2,B2,A3,B3 2+1
W

4400W=<P<6600 1,2,3,4 A1,B1,A2,B2,A3,B3 3+1
W ,A4,B4

... ... ... ...

48400W=<P<5060 1,2,3,4,5,6,7,8,9,10 A1,B1,A2,B2,A3,B3 23+1
0W ,11,12,13,14,15,16, ...A24,B24
17,18,19,20,21,22,
23,24

The following table shows the recommended power supply configurations. You
can choose the PM configuration based on the actual platform.

Table 4-77 Recommended configurations
Power Supply Scenario -48 V DC power supply

1.6T Platform 17+1

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Installing PMs and Power Cables

DANGER

Never install power cables when the power is on.

1. Install PMs.

Figure 4-279 Installing PMs

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NO TE

Guide for the installation and removal of a PM module:
● When installing a PM module into a slot, hold the module firmly with one hand
and align it with the slot opening. Use your other hand to hold the bottom of the
module, pushing it into the slot in parallel. The latch automatically snaps into the
inside of the slot and you can feel the latch vibrate.
● When removing the PM module from the slot, use one hand to hold the green
button on the front right side (Area B in the figure below). Press the button on the
bottom and then pull it out. Use your other hand to hold the bottom of the
module, ensuring that it is level throughout this process. Avoid tilting the module
as this may damage it.
Verify that a PM module is properly installed:
● After inserting the module in its place, grasp the green button on the front left
side, pulling it as if to pull it out (Area A in the figure below). If the module cannot
be removed, then the module has been properly inserted and latched in place.

2. Attach temporary labels to both ends of each power cable.
3. Route power cables along the cable ladder to the chassis.
4. Remove protective covers from PEM connection boxes and connect one end of
each power cable to the corresponding terminal. Connect the other end to the
PDF.
5. After connecting power cables, re-install the protective covers of the PEM
connection boxes.
6. Use cable ties to bundle cables every 150 mm upwards from the bottom and
fasten the cables to the cable tray.
7. Attach permanent labels 20 mm (0.79 in.) from both ends of each power
cable.

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Figure 4-280 Installing power cables(Overhead cabling)

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Figure 4-281 Installing power cables(underfloor cabling)

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NO TE

To install power cables, perform the following steps:
1. Prepare power cables with lengths longer than the distance between the power module
and PDF.
2. Install terminals on the device end of the power cables and connect the cables to the
device.
3. Trim any excess length of the cables from the end near the PDF. Install terminals on the
PDF end of the cables and connect the cables to the PDF.
4. When power cables are installed in underfloor cabling mode, side cabling cabinets are
required to secure the power cables.

4.2.11.12.2 AC Power Distribution

Power Supply Principles
A PM has output power of 3000 W. Use the N+1 PM backup mechanism as an
example. N+1 PMs are configured for power supply, with N being the number of
PMs required for the power consumption of the entire device. The value of N x
3000 W must be greater than the overall power consumption of the entire device.
Table 4-78 shows the details.

NO TE

If PMs are not fully configured, power cables are routed only for the PEM interfaces whose
corresponding PMs are installed. To facilitate the deployment of new power cables during
capacity expansion of PMs, you are advised to configure the PMs from the top down and
leave a filler panel in the position where no PM is not installed.

Table 4-78 Power supply examples
Overall Power PM Configuration PEM Cabling N+1
Consumption Backup

P<3000W 1,2 A1,B1,A2,B2 1+1

3000W≤P<6000 1,2,3 A1,B1,A2,B2,A3,B3 2+1
W

6000W≤P<9000 1,2,3,4 A1,B1,A2,B2,A3,B3,A4,B 3+1
W 4

... ... ... ...

66000W≤P<6900 1,2,3,4,5,6,7,8,9,10,11, A1,B1,A2,B2,A3,B3...A2 23+1
0W 12,13,14,15,16,17,18, 4,B24
19,20,21,22,23,24

The following table shows the recommended power supply configurations. You
can choose the PM configuration based on the actual platform.

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Table 4-79 Recommended configurations
Power Supply Scenario AC power supply

1.6T Platform 13+1

Installing PMs and Power Cables

DANGER

Never install power cables when the power is on.

1. Install PMs.

Figure 4-282 Installing PMs

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NO TE

Guide for the installation and removal of a PM module:
● When installing a PM module into a slot, hold the module firmly with one hand
and align it with the slot opening. Use your other hand to hold the bottom of the
module, pushing it into the slot in parallel. The latch automatically snaps into the
inside of the slot and you can feel the latch vibrate.
● When removing the PM module from the slot, use one hand to hold the green
button on the front right side (Area B in the figure below). Press the button on the
bottom and then pull it out. Use your other hand to hold the bottom of the
module, ensuring that it is level throughout this process. Avoid tilting the module
as this may damage it.
Verify that a PM module is properly installed:
● After inserting the module in its place, grasp the green button on the front left
side, pulling it as if to pull it out (Area A in the figure below). If the module cannot
be removed, then the module has been properly inserted and latched in place.

2. Attach temporary labels to both ends of each power cable.
3. Route power cables along the cable ladder to the chassis.
4. Connect one end of the power cables to the input terminals of the PMs and
the other end to the power distribution frame (PDF) in the equipment room.
5. Secure the cables using card fasteners.
6. Use cable ties to bundle the cables every 150 mm (5.91 in.) from the bottom
up and secure the cables to the cable tray.
7. Attach permanent labels 20 mm (0.79 in.) from both ends of each power
cable.

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Figure 4-283 Installing power cables

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4.2.11.12.3 HVDC Power Distribution

Overview
The NE5000E-20 power system is located at the top of the chassis. The main
components are the PMs, CMUs, and switches in the front of the chassis and the
PEMs at the rear of the chassis.

Figure 4-284 Main components of the power system

1 Cover plate 2 PM 3 CMU 4 Switch 5 PEM
for the PM

The power system consists of 24 PMs that are working in N+M backup mode (N
indicates the number of working modules and M indicates the number of backup
modules). The value M is determined based on the PM model and version.
The inputs on areas A and B back up each other, and power module backup
allows the system to work properly even if some PMs become faulty. In the HVDC

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supply system, a PM has two channels of inputs. Therefore, the PM itself supports
input backup of areas A and B. In this case, only module backup needs to be
configured. The minimum value of M is 1.

● HVDC
The NE5000E-20 has six PEMs. Each PEM has eight inputs. There are
altogether 48 inputs (24 inputs in each of area A and area B). Each PM has
two inputs. The two inputs are from power supply areas A and B, respectively.
In this manner, power supply areas A and B back up each other. A maximum
of 24 PMs can be configured based on the N+M backup mechanism. Figure
4-285 and Table 4-80 show the mappings between PEMs and PMs

Figure 4-285 Connections between PEMs and PMs

Table 4-80 Mappings between PEMs and PMs

Name Location

PEM A1/B1 A2/B2 A3/B3 ...... A22/B2 A23/B2 A24/B2
2 3 4

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Name Location

PM 1 2 3 ...... 22 23 24

Power Supply Principles
A PM has output power of 3000 W. Use the N+1 PM backup mechanism as an
example. N+1 PMs are configured for power supply, with N being the number of
PMs required for the power consumption of the entire device. The value of N x
3000 W must be greater than the overall power consumption of the entire device.
Table 4-81 shows the details.

NO TE

If PMs are not fully configured, power cables are routed only for the PEM interfaces whose
corresponding PMs are installed. To facilitate the deployment of new power cables during
capacity expansion of PMs, you are advised to configure the PMs from the top down and
leave a filler panel in the position where no PM is not installed.

Table 4-81 Power supply examples
Overall Power PM Configuration PEM Cabling N+1
Consumption Backup

P<3000W 1,2 A1,B1,A2,B2 1+1

3000W≤P<6000 1,2,3 A1,B1,A2,B2,A3,B3 2+1
W

6000W≤P<9000 1,2,3,4 A1,B1,A2,B2,A3,B3,A4,B 3+1
W 4

... ... ... ...

66000W≤P<6900 1,2,3,4,5,6,7,8,9,10,11, A1,B1,A2,B2,A3,B3…… 23+1
0W 12,13,14,15,16,17,18, A24,B24
19,20,21,22,23,24

The following table shows the recommended power supply configurations. You
can choose the PM configuration based on the actual platform.

Table 4-82 Recommended configurations
Power Supply Scenario HVDC power supply

1.6T Platform 13+1

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Installing PMs and Power Cables

DANGER

Never install power cables when the power is on.

1. Install PMs.

Figure 4-286 Installing PMs

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NO TE

Guide for the installation and removal of a PM module:
● When installing a PM module into a slot, hold the module firmly with one hand
and align it with the slot opening. Use your other hand to hold the bottom of the
module, pushing it into the slot in parallel. The latch automatically snaps into the
inside of the slot and you can feel the latch vibrate.
● When removing the PM module from the slot, use one hand to hold the green
button on the front right side (Area B in the figure below). Press the button on the
bottom and then pull it out. Use your other hand to hold the bottom of the
module, ensuring that it is level throughout this process. Avoid tilting the module
as this may damage it.
Verify that a PM module is properly installed:
● After inserting the module in its place, grasp the green button on the front left
side, pulling it as if to pull it out (Area A in the figure below). If the module cannot
be removed, then the module has been properly inserted and latched in place.

2. Attach temporary labels to both ends of each power cable.
3. Route AC power cables along the cable tray and connect them to the input
terminals of the AC power distribution box. Connect the other end of each
power cable to the PDF in the equipment room.
4. Use cable ties to bundle the cables every 150 mm (5.91 in.) from the bottom
up and secure the cables to the cable tray.
5. Attach permanent labels 20 mm (0.79 in.) from both ends of each power
cable.

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Figure 4-287 Installing power cables

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NO TE

There is a latch in the power cable connector. When you need to remove the power
cable, press the latch to unlock the power cable connector, and then remove the
power cable.

4.2.11.13 Installing an Advanced Door
NO TE

The advanced door of an NE5000E-20, which consists of left and right door plates and an
enclosure frame, is installed on the rear of the chassis. The advanced door weighs 43.5 kg
and is 2200 mm high, 600 mm wide, and 227.5 deep.

NO TICE

The foam on the advanced door is attached with the noise reduction function. The
foam is not a protective foam, preventing the foam from being damaged by
mistake.

Installing the Enclosure Frame
NO TE

The screws for the enclosure frame are packed in the fitting bag attached to the middle
protective beam. The fitting bag attached to the lower protective beam and the three
beams are not required any more.
1. Install the enclosure frame in the NE5000E-20, fasten the 12 screws at both
sides, and remove the three protective beams from the enclosure frame.

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2. Connect the enclosure frame and NE5000E-20 through parallel plates.

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3. Connect the equipotential ground cables of the enclosure frame and
NE5000E-20.

Installing an Advanced Door
1. Install the advanced door.

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2. Connect the equipotential ground cables of the enclosure frame and
advanced door plate.

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4.2.11.14 Installing Boards and Subcards

Slot Layout

Figure 4-288 Slot layout

Table 4-83 Description of slot layout
Slot Name Slot Quantity Slot ID Remarks

Line Processing 20 1 to 20 -
Unit

Main control unit 2 21 to 22 -

Switch fabric unit 8 23 to 30 -

Central 2 32 to 33 -
monitoring unit

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Slot Name Slot Quantity Slot ID Remarks

Fan module in the 8 39 to 46 FAN 1 to FAN 8
LPU area correspond to
slots 39 to 46.

Fan module in the 2 47 to 48 FAN 9 to FAN 10
SFU area corresponds to
slots 47 and 48.

Interface Numbering

A port is numbered in the format of slot ID/card number/port number.

NO TE

Slot number: On the NE5000E-20, the slot number ranges from 1 to 20. Slots are
numbered in left-right and top-down order. The slot number is marked on the slots.
Card number:
● Upper chassis
● Cards are numbered from 0 in top-down. If a board has no card installed, the
card number is 0.
● Lower chassis
● Cards are numbered from 0 in down-top. If a board has no card installed, the
card number is 0.
Port number:
● Upper chassis
● Ports are numbered from 0 in left-right and top-down order.
● Lower chassis
● Ports are numbered from 0 in right-left and down-top order.

Installing Boards

CA UTION

● Ensure that no water is on the device or board before installing the board on
the device.
● Before installing boards, wear the electrostatic discharge (ESD) wrist strap or
ESD gloves to prevent any electrostatic discharge of the human body from
damaging sensitive components.
● Align a board with a slot and insert it into the slot vertically or horizontally,
preventing any damage to the board.
● In the lower board cage, install an LPU inversely and follow the same
procedure for installing an LPU in the upper board cage.
● Install a filler panel in each vacant slot. Since the ventilation paths vary
according to device types, ensure that filter panel types match device types.

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NO TE

If a board cannot be inserted into a slot, check that the color on both ends of the board
panel is the same as the color on the slot.

Installing an LPU
NO TE

To facilitate cabling and expansion, it is recommended that the LPU be installed in the
lower half of the chassis, and then in the upper half of the chassis. For the upper or lower
half, install LPUs in the middle slots, and then the left and right slots. Some LPUs do not
come with a wrench. Equip yourself with a wrench when replacing these LPUs. For more
details, see Installing an SFU.
1. Use a Phillips screwdriver to loosen the two captive screws (marked 1), press
the latches of the filler panel (marked 2) with two hands, and pull the panel
out through the guide rails (marked 3).

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2. Stably insert the LPU along the guide rails of the slot (marked 1), turn both
ejector levers inward (marked 2), and use the Phillips screwdriver to fasten
the two captive screws (marked 3).

Figure 4-289 Installing an LPU

Installing an MPU
1. Remove a filler panel from a slot.
2. Stably insert the MPU along the guide rails of the slot, fasten ejector levers,
and use the Phillips screwdriver to fasten the two captive screws.

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3. Install a cable holder on the MPU.

NO TE

The cable holder is placed in the auxiliary material package of the device.

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Installing an SFU
NO TE

● Ensure that ejector levers are used to install an SFU. Without ejector levers, the SFU
may fail to be powered on.
● Ejector levers are placed in the tool boxes on both sides of the cabinet.
● After installing an SFU, take the ejector levers back to the tool boxes to keep them in
good and ready-to-use condition.

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NO TICE

● Do not use ejector levers to lift a board.
● Never use an ejector lever alone. Use both ejector levers when pushing or
pulling a board.

1. Obtain ejector levers.
2. Insert the SFU into the slot till the SFU is fully seated.

3. Press the latch on each ejector lever to eject the handle and insert each
ejector lever to a connector on the SFU.

4. Turn the ejector levers outward and insert the SFU in the slot.
5. Use both hands to turn the ejector levers inward to fully secure the SFU in the
slot and use the Phillips screwdriver to tighten captive screws.

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6. Press the latch on each ejector lever to eject the handle and remove each
ejector lever from the board.

4.2.11.15 Installing Cascading Optical Fibers

NO TE

When installing cascading optical fibers, reserve an extra length of about 3 meters to
facilitate cabling. The extra optical fibers can be twisted around the cable tray.
For the NE5000E-20, if cascading optical fibers are redundant and need to be coiled, a fiber
management tray and fiber management cabinet can be configured.
CXP series optical fibers cannot be deployed across floors.

4.2.11.15.1 Installing Fiber Management Trays

Components of a Fiber Management Tray

A drawer of a fiber management tray can hold two coiling trays. Therefore, two
drawers in a fiber management tray can hold four coiling trays. One fiber spool
can be used to coil six 8-meter optical fibers. The following figures show the front
and rear views of a fiber management tray.

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Figure 4-290 Front view of a fiber management tray

Figure 4-291 Rear view of a fiber management tray

Components of a Fiber Management Cabinet
A filler panel is placed in the middle of a fiber management cabinet. Remove the
filler panel before installing fiber management trays. Labels are attached to the
filler panel and the upper left corner of the cabinet to identify the fiber
management cabinet and the front side of the cabinet.

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Installing Fiber Management Trays
1. Locate and install slide rails.
A fiber management tray is installed from bottom to top in a fiber management
cabinet. Each six fiber management trays are installed for one NE5000E-20
chassis. Six are installed forward, and six are installed backward. This facilitates
the identification of the mapping between the fiber management trays and the
entire device. Fiber management trays are installed from the 01 position at the
bottom. Each fiber management tray occupies 1U space, and there is no gap
between fiber management trays. A fiber management cabinet can house 46 fiber
management trays.

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2. Install rear mounting ears.
Install rear mounting ears on both sides at the rear of each fiber management
tray.

NO TE

If the rear mounting ears are not installed, the rear parts of the fiber management trays
will droop, adversely affecting future maintenance.

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4.2.11.15.2 Laying Out Optical Fibers

Precautions
CXP optical fibers are expensive precision components because they have optical
modules embedded. When laying out optical fibers, pay attention to the following
points:
1. Do not pull forcefully on the optical fiber connectors or ribbons.
2. Do not bend optical fiber ribbons, to avoid breaking off optical fiber cores.
3. Do not rotate optical fiber ribbons, to avoid breaking off optical fiber cores.
4. Do not remove the protective covers of optical fiber connectors until the
connectors are inserted into devices.
5. Do not fling optical fiber connectors, to avoid damaging associated
components.
6. Do not use optical fibers with bundling tape or cable ties. Otherwise, fiber
management trays cannot rotate smoothly

Installing Optical Fiber Ribbons
1. Attach temporary labels (format: clc1/23/0/0-ccc1/1/3/1) to both ends of
each CXP optical fiber.
2. Spread out optical fibers following the circumferential direction, and bundle
up every six optical fibers as a group to facilitate routing.

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3. Insert the optical fibers into the NE5000E-20 and CCC-A chassis, and connect
optical fiber connectors. Tie up optical fiber ribbons.
4. Put the entire group of optical fibers into the cable trough, route them into
the fiber management cabinet, and bind them to the fiber management tray.

Managing Redundant Optical Fibers
1. Use the coiling tray at the midpoint of redundant optical fibers. Stretch the
redundant optical fibers and put the fiber post which the optical fibers coil
around in the linear gap of the coiling tray. Then coil redundant optical fibers
around the fiber post in a clockwise direction.

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2. Pull out the front drawer and the rear drawer of a fiber management tray
horizontally to the limit, put each coiling tray with six optical fibers in it into
the fiber management tray. Left slots from 23 to 30 of the SFUs correspond to
12 coiling trays of the front drawer of six fiber management trays, and right
slots from 23 to 30 of the SFUs correspond to the 12 coiling trays of the rear
drawer of six fiber management trays.

3. After optical fibers are coiled in a fiber management tray, the redundant
optical fibers outside the fiber management tray can be tightened by
adjusting the round hole on the coiling tray. A maximum of 8-meter
redundant optical fibers are allowed for each coiling tray. Additional optical
fibers must be placed on the upper cable tray.

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4.2.11.16 Installing Network Cables

NO TICE

Before bundling network cables, use a network cable tester to test cable
connectivity.

NO TE

The space between power cables, PGND cables, and signal cables must be greater than 30
mm (1.18 in.).
1. Attach temporary labels to both ends of each network cable.
2. Route network cables along the cable trough and plug them into correct
interfaces.
3. Use a network cable tester to test the connectivity of network cables.
4. Use cable ties to bundle network cables at an interval of 150 mm (5.91 in.)
and fasten the network cables to the rack.
5. Attach permanent labels at a position 20 mm (0.79 in.) from both ends of
each cable.

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Figure 4-292 Installing network cables

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Figure 4-293 Installing network cables(Bottom Cabling)

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4.2.11.17 Installing Optical Fibers

Installing Optical Fibers

NO TICE

● The bending radius of a single-mode G.657A2 optical fiber is greater than or
equal to 10 mm, and the bending radius of a multi-mode A1b optical fiber is
greater than or equal to 30 mm.
● Install dust-proof caps on optical modules not connected to optical fibers.
● Do not bundle optical fibers too tightly, so that you can conveniently remove a
single fiber from the bundle.
● Installing corrugated pipes is not recommended because such installation
requires a lot of cabling space.

1. Attach temporary labels to both ends of each optical fiber.
2. Use cable ties to bundle optical fibers.
3. Install optical modules, as shown in 1 in Figure 4-294.
4. Route optical fibers along the cable tray and remove dust-proof caps from
optical modules and optical fibers. Then connect optical fibers to the optical
modules, as shown in 2 in Figure 4-294.
5. Connect the other end of each optical fiber to an optical distribution frame
(ODF).
6. Bundle optical fibers with binding tapes at an interval of about 150 mm (5.91
in.). Use cable ties to secure the optical fibers to the cable tray.
7. Attach permanent labels at a position 20 mm (0.79 in.) from both ends of
each optical fiber.

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Figure 4-294 Installing optical fibers

NO TE

As a 72-Port 10GBase LAN/WAN-SFP+ Integrated Line Process Unit(NE5000E LPUI-1T6) is
equipped with a large number of ports, bundle optical fibers using the method shown in
Figure 4-295. This method enables you to conveniently check port indicator status.

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Figure 4-295 72-Port 10GBase LAN/WAN-SFP+ Integrated Line Process
Unit(NE5000E LPUI-1T6)

4.2.11.18 Checking Installation

Cabinet Installation Checklist
No. Requirement

1 The cabinet is in the correct location.

2 The cabinet is properly placed with a horizontal/vertical
deviation of no more than 3 mm (0.12 in.).

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No. Requirement

3 All bolts and screws are firmly fastened, especially on
electrical connections. Flat and spring washers are used
with each bolt, and spring washers are placed on the
top of flat washers.

4 The cabinet is neat and clean.

5 Cabinet doors can be opened and closed smoothly.

6 All labels, tags, and nameplates are correct, legible, and
complete.

Device Environment Checklist

No. Requirement

1 No fingerprints or smears exist on the device.

2 There are no unnecessary electrical tapes or cable ties
on cables.

3 No electrical tapes, cable ties, wastepaper, or packing
bags are left around the device.

4 All other items around the device are organized, neat,
and clean.

Electrical Connection Checklist

No. Requirement

1 All assembled PGND cables are copper-based with
proper wire diameters. Cables meet quality standards.

2 All ground cables, AC input cables, and intra-cabinet
cables are connected correctly according to the wiring
diagram, and all screws are tightened. The input and
output cables are not short-circuited.

3 Any redundant parts of power cables or PGND cables
are trimmed off and not coiled.

4 The terminals at both ends of each power cable or
PGND cable are crimped securely.

5 The wiring terminals on cables are wrapped tightly
using PVC insulation tapes or heat shrink tubes.

6 The wiring terminals with heat shrink tubes are heated
using a heat gun.

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No. Requirement

7 Flat and spring washers are properly installed on each
bolt of a wiring terminal.

8 All cables, especially the cables in the lower area of the
cabinet, are securely connected.

9 Cables are properly bound. Cable ties are installed at
equal spacing and in the same direction.

10 Power and ground cables are bound separately from
other cables.

11 The cable layout accounts for easy maintenance and
expansion in the future.

12 The labels at both ends of each cable are correct,
legible, and complete.

13 Excess cable ties are trimmed off.

4.2.11.19 Performing a Power-on Check

Power-on Check Flowchart

NO TICE

● Before a power-on check, ensure that the switch is Off and the input voltage is
within the correct range.
● Two switches are used to control the power supply. Specifically, when one or
both switches are On, the device is powered on. When both switches are Off,
the device is powered off.
● The resistance of a PGND cable must be less than 10 Ω.

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Figure 4-296 Power-on check flowchart

Indicators
Item Indicator Color Description

Central RUN Green ● Blinking once every 500 ms (2
monitoring Hz): A board is not registered.
unit (CMU) ● Blinking once every 2 seconds
(0.5 Hz): The board is
successfully registered and
properly communicates with
other boards.

ALM Red On: Alarms are generated.
Off: No alarms are generated.

ACT Green On: The CMU is active.
Off: The CMU is standby.

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Item Indicator Color Description

Power module Input Green ● Blinking once every 2 seconds
(PM) (0.5 Hz): Undervoltage or
overvoltage occurs in input
power.
● Blinking once every 500 ms (2
Hz): Parity check errors occur.
● Steady on: The input voltage is
within a proper range.

Output Green Steady on: The output voltage is
within the proper range.
Off: The output voltage is
abnormal.

Alarm Red On: Alarms are generated.
Off: No alarms are generated.

Fan module STATUS Green Blinking once every 2 seconds (0.5
Hz): The fan module is working
properly.
Blinking once every 250 ms (4 Hz):
A fan channel is faulty.

Red Blinking once every 2 seconds (0.5
Hz): The communication status is
normal, whereas alarms are
generated. The alarms can be fan
fault alarms, single-line power
supply alarms, and sensor fault
alarms.

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Item Indicator Color Description

MPU RUN Green From MPU power-on till
registration, the indicator status
changes in the sequence of Off–
blinking once every 500 ms (2
Hz)–Off–steady on–blinking once
every 2 seconds (0.5 Hz).
After being registered, the MPU is
working properly if the indicator
blinks once every 2 seconds (0.5
Hz).
NOTE
Possible causes for the indicator off
are:
● The BootROM is damaged.
● The board cannot be powered on.
Possible causes for the indicator
blinking quickly are:
● The SSD card is faulty.
● Some control modules on the MPU
are faulty, causing the MPU to fail
to initialize.

ALM Red Steady on: Alarms are generated.
Off: No alarms are generated.

SFU RUN Green From SFU power-on till
registration, the indicator status
changes in the sequence of Off–
blinking once every 500 ms (2
Hz)–Off–steady on–blinking once
every 2 seconds (0.5 Hz).
After being registered, the SFU is
working properly if the indicator
blinks once every 2 seconds (0.5
Hz).
NOTE
Possible causes for the indicator off
are:
● The BootROM is damaged.
● The board cannot be powered on.
Possible causes for the indicator
blinking quickly are:
● The flash memory is faulty.
● The involved network port is faulty.

ACT Green On: The SFU is working properly.
Off: The SFU is faulty.

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Item Indicator Color Description

LPU RUN Green From LPU power-on till
registration, the indicator status
changes in the sequence of Off–
blinking once every 500 ms (2
Hz)–Off–steady on–blinking once
every 2 seconds (0.5 Hz).
After being registered, the LPU is
working properly if the indicator
blinks once every 2 seconds (0.5
Hz).
NOTE
Possible causes for the indicator off
are:
● The BootROM is damaged.
● The board cannot be powered on.
Possible causes for the indicator
blinking quickly are:
● The flash memory is faulty.
● The involved network port is faulty.

LINK/ACT Green ● Off: A link is Down.
● Steady on: The link is Up.
● Blinking: Data is being
transmitted.

4.2.12 Quick Installation Guide for the Cable Management
Cabinet

4.2.12.1 Quick Installation Guide for the Cable Management Cabinet
When underfloor cabling is required for the NE5000E-20 installed on an ESD floor,
a side cabling cabinet can be delivered.
For details about how to install a side cabling cabinet, see NE5000E-20 Fiber
Cable Management Frame Quick Installation Guide.
After the installation is complete, optical fibers and power cables are routed
downward in the side cabling cabinet. No coiling is required on the fiber post in
the side cabling cabinet. When a large number of cables are routed, you can
remove the fiber post in the side cabling cabinet.

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Figure 4-297 Front view of cable routing

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Figure 4-298 Rear view of cable routing

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4.3 Parts Replacement

4.3.1 Overview of Parts Replacement
This chapter describes the basic operation process of parts replacement.

4.3.1.1 Basic Operation Process
This section describes the basic operation process of replacing parts.

Context
To ensure that the NE5000E provides uninterrupted communication services for
users in networks, parts of a device are replaced mostly when the power is on.
Therefore, to ensure safe operation of a device and to minimize the impact of
parts replacement on services, maintenance personnel must strictly abide by the
basic operation process regulated in the manual, as shown in Figure 4-299.

Figure 4-299 Basic operation process of replacing parts

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Procedure

Step 1 Assess the feasibility of the operation.
During the process of troubleshooting or repairing a device, maintenance
personnel must assess whether the operation is feasible before replacing a certain
part.
1. Whether the needed spare parts are available in the depot.
2. Whether the maintenance personnel is qualified for carrying out the
operation. Parts replacement can be carried out only by maintenance
personnel who are professionally trained. That is, maintenance personnel
must familiarize themselves with the functions of each part of the NE5000E
know the basic operation process of parts replacement, and master the basic
skills of parts replacement.
3. Whether the risks of the operation can be controlled. Parts replacement is
risky to a certain extent. Hence, improper operation may cause abnormal
running of the device, service interruption, or injuries to the personnel.
Therefore, before replacing parts, maintenance personnel must
comprehensively evaluate the risks of the operation, that is, whether the risks
can be controlled through certain measures if the system remains active.
Maintenance personnel can replace the parts only when the risks can be
controlled. Otherwise, contact a Huawei local office for timely technical
support.
Step 2 Prepare tools and spare parts.
After determining that the operation is feasible, maintenance personnel need to
prepare tools and spare parts.
1. Prepare spare parts.
2. The common tools include the multimeter, cable tester, ESD wrist strap,
Phillips screwdriver, flat-head screwdriver, needle-nose pliers, cutter, and
pliers.
Step 3 Take protective measures.
Although parts replacement is risky, in most cases, however, maintenance
personnel can prevent the risks by taking protective measures. For example, before
replacing a master board, maintenance personnel can switch services on the
master board to the slave board. After the slave board runs properly, maintenance
personnel can replace the master board. In this manner, interruption of services is
prevented.
Therefore, to ensure safe operation of a device and to minimize the impact of
parts replacement on services, maintenance personnel must take related
protective measures.
Step 4 Replace parts.
After checking that the protective measures are available, maintenance personnel
can carry out parts replacement according to the regulations specified in the
manual, such as removing and inserting a board and setting the Dual In-Line
Package (DIP) switch of a board.

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Step 5 Verify the functions of the new parts.
After completing parts replacement, maintenance personnel must verify the
functions of the new parts through the testing methods described in the manual.
The operation is considered as successful only when the new parts are proved to
be running normally. Otherwise, contact a Huawei local office for timely technical
support.
Step 6 Return and repair the faulty parts.
If a part that is replaced is confirmed to be faulty, maintenance personnel should
fill in the Offsite Repair Card for Faulty Materials, and send the card and the faulty
part to a Huawei local office for timely maintenance.

NO TICE

The CF card on the MPU stores data information. Before you replace the MPU or
its CF card, delete data from the CF card to prevent data embezzlement.

----End
4.3.2 Replacing Parts of the NE5000E CCC-A
This chapter describes the precaution and procedure for replacing boards, CF card,
fan module, air filter, and power module.

4.3.2.1 Replacing Boards
This chapter describes the precaution and procedure for replacing the MPU, the
ICU, the SFU, and the OFC.

4.3.2.1.1 Overview of Boards
This section describes the mechanical specifications and the procedure for
installing the boards.

Mechanical Specifications of Boards

Mechanical Specifications of Boards
The boards of the NE5000E are of the plug-in type and consists of a circuit board,
connectors, a front panel, ejector levers, captive screws, and a bolt, as shown in
Figure 4-300.

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Figure 4-300 Schematic diagram of a common LPU

1.Captive screw 2. Ejector lever 3. Connector 4. Bolt

Installation of Boards

NO TICE
Before installing a board, check whether the there are any damaged pin holes on
the board connector. If some pin holes are damaged, do not insert the board in
the chassis. In addition, do not insert any other boards in the corresponding slot
unless it is examined and repaired.

Installation of Boards
Figure 4-301 shows the installation of boards.

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Figure 4-301 Schematic diagram of installing boards

1. Connector 2. Backplane

4.3.2.1.2 Introduction to Boards

This section describes the types and layout of boards on the NE5000E.

Types of Boards

The NE5000E CCC-A supports the following types of boards:
● MPU
● ICU
● SFU
● OFC

Layout of Boards

This section describes the slot layout of the NE5000E CCC-A.

The CCC-A has one board insertion area on the front and one board insertion area
on the rear. Eighteen SFUs can be inserted vertically in the front board insertion
area. Two MPUs and two ICUs can be inserted horizontally in the rear board
insertion area.

Figure 4-302 shows the slots layout on the front of the CCC-A.

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Figure 4-302 Slots layout on the NE5000E CCC-A

Table 4-84 Board distribution in the board cage of the NE5000E CCC-A
Slot Number Quanti Remarks
ty

1-18 18 These slots can hold 16 SFUs, with slots 5 and 14
being reserved.

19,22 2 These slots can hold ICUs that work in 1+1 backup
mode.

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Slot Number Quanti Remarks
ty

20,21 2 These slots can hold MPUs that work in 1:1 backup
mode.

23,24 2 These slots can hold power modules.

25~32 8 These slots can hold fan modules.

33,34 2 These slots can hold PMUs.

4.3.2.1.3 Replacing an MPU
This section describes the precaution and procedure for replacing an MPU.

Context
Before replacing a Main Processing Unit (MPU), you need to note the following
points:
● When the system is running, you can replace only the slave MPU.
● If you need to replace the master MPU, you must first perform the master/
slave switchover to enable the master MPU to become the slave one.
● The system software package and configuration file in the new MPU must be
consistent with those in the MPU to be replaced.

Tool
Before replacing an MPU, you need the following tools:
● ESD wrist strap or ESD glove
● Phillips screwdriver
● ESD bag

Procedure

Step 1 Check the version of the running software package.
Run the display version command to check the version of the running software
package.
Step 2 Prepare a new MPU and check whether there is any bent pin in the connector.
Step 3 Check the location of the MPU to be replaced.
Before pulling out an MPU that is to be replaced, you should first determine the
location of the MPU, for example, the cabinet, chassis, and slot where the MPU
resides. The NE5000E CCC-A has two MPUs. The MPUs of the NE5000E CCC-A
reside in slots 20 and 21.
Locate the MPU to be replaced in the chassis and attach a label to identify the
MPU.

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Step 4 Check whether the MPU to be replaced is the master MPU.
Run the display device command to check the slot ID of the current main control
board. If the main control board to be replaced is the active one, switch it to the
standby state first:
● In the case of the system-level active main control board, run the slave
switchover command on the console to forcibly perform a system-level
active/standby switchover.
● In other cases, run the reset slot slot-id command on the console to forcibly
perform an intra-chassis active/standby switchover. Then run the display
device command to check the slot ID of the active main control board after
the switchover to check whether the switchover is successful.
Step 5 Remove the cables from the MPU and label the cables.
Step 6 Power off the MPU to be replaced.
Press and hold the OFL button on the panel of the MPU for six seconds till the
OFFLINE indicator is on. It means that the MPU is powered off.
Step 7 Pull out the MPU to be replaced from the chassis.
1. Wear the ESD wrist strap and connect the grounding terminal to the ESD jack
on the rack.
2. Turn the Phillips screwdriver counter-clockwise to loosen the captive screws
on the board, as (1) shown in Figure 4-303.
3. Turn the ejector levers on the panel of the MPU outward and upward, as (2)
shown in Figure 4-303.

NO TICE

– During the operation, pull out the MPU slowly and smoothly to prevent it
from colliding with the neighboring boards and from causing the failure of
the running boards.
– When swapping an MPU, do not touch the parts on the MPU. This is to
prevent it from being damaged.

4. Hold the ejector levers on the panel of the MPU and pull out the MPU
smoothly from the chassis along the guide rail of the slot. When part of the
MPU is removed out of the slot, support the MPU with one hand and hold the
MPU panel with the other. Then, remove the MPU completely out of the slot,
as (3) shown in Figure 4-303.
5. Place the MPU that is removed in the ESD bag.

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Hardware Guide 4 Hardware Installation and Parts Replacement

Figure 4-303 Schematic diagram of removing an MPU

Step 8 Insert the new MPU into the chassis.
1. Take out the new MPU from the ESD bag.

NO TICE

– During the operation, pull out the MPU slowly and smoothly to prevent it
from colliding with the neighboring boards and from causing the failure of
the running boards.
– When swapping an MPU, do not touch the parts on the MPU. This is to
prevent it from being damaged.

2. Support the lower edge of the new MPU with one hand and hold the panel
with the other hand. Then, insert the new MPU smoothly into the chassis
along the guide rail of the slot. Stop sliding the MPU forward when the
ejector levers on the front panel of the MPU touch the chassis, as (1) shown
in Figure 4-304.

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Hardware Guide 4 Hardware Installation and Parts Replacement

3. Turn the ejector levers on the MPU outward and upward to form a 45-degree
angle, and at the same time push the MPU into the slot. Then, turn the
ejector levers inward and downward till the panel of the MPU touches the
slot, as (2) shown in Figure 4-304.
4. Turn the Phillips screwdriver clockwise to tighten the captive screws, as (3)
shown in Figure 4-304.

Figure 4-304 Schematic diagram of inserting an MPU

Step 9 Check the running status of the new MPU.

In normal situations, after the new MPU is inserted into the chassis, the MPU
automatically communicates with the boards in the chassis. In this case, you can
check the running status of the new MPU in the following ways:
● If the RUN indicator (green) on the panel of the MPU is blinking once every
2s, it indicates that the MPU is running normally.
● Check the alarms. In normal situations, the system does not generate any
alarm related to the new MPU.

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Hardware Guide 4 Hardware Installation and Parts Replacement

● Run the display device chassis command on the console interface to view the
running status of the new MPU. If the output is displayed as follows, it
indicates that the MPU is running normally.
<HUAWEI> display device
Total Chassis Number: 4
Central Chassis Number: 2
Line Chassis Number: 2
Chassis ID: ccc1
NE5000E-CCC-A's Device status:
-------------------------------------------------------------------------------
Slot # Type Online Register Status Role LsId Primary
-------------------------------------------------------------------------------
ccc1/11 SFU Present Registered Normal OTHER 0 NA
ccc1/12 SFU Present Registered Normal OTHER 0 NA
ccc1/13 SFU Present Registered Normal OTHER 0 NA
ccc1/15 SFU Present Registered Normal OTHER 0 NA
ccc1/17 SFU Present Registered Normal OTHER 0 NA
ccc1/18 SFU Present Registered Normal OTHER 0 NA
ccc1/19 ICU Present Registered Normal OTHER 0 NA
ccc1/20 MPU Present Registered Normal MMB 0 System masterc
cc1/21 MPU Present Registered Normal MMB 0 Slave
ccc1/23 PWR Present Registered Normal OTHER 0 NA
ccc1/24 PWR Present Registered Normal OTHER 0 NA
ccc1/25 FAN Present Registered Normal OTHER 0 NA
ccc1/27 FAN Present Registered Normal OTHER 0 NA
ccc1/31 FAN Present Registered Normal OTHER 0 NA
ccc1/32 FAN Present Registered Normal OTHER 0 NA
ccc1/33 PMU Present Registered Normal OTHER 0 NA
ccc1/34 PMU Present Registered Normal OTHER 0 NA
-------------------------------------------------------------------------------
Chassis ID: ccc2
NE5000E-CCC-A's Device status:
-------------------------------------------------------------------------------
Slot # Type Online Register Status Role LsId Primary
-------------------------------------------------------------------------------
ccc2/6 SFU Present Registered Normal OTHER 0 NA
ccc2/11 SFU Present Registered Normal OTHER 0 NA
ccc2/13 SFU Present Registered Normal OTHER 0 NA
ccc2/15 SFU Present Registered Normal OTHER 0 NA
ccc2/17 SFU Present Registered Normal OTHER 0 NA
ccc2/19 ICU Present Registered Normal OTHER 0 NA
ccc2/20 MPU Present Registered Normal MMB 0 Slave
ccc2/21 MPU Present Registered Normal MMB 0 System slave
ccc2/24 PWR Present Registered Normal OTHER 0 NA
ccc2/25 FAN Present Registered Normal OTHER 0 NA
ccc2/31 FAN Present Registered Normal OTHER 0 NA
ccc2/32 FAN Present Registered Normal OTHER 0 NA
ccc2/33 PMU Present Registered Normal OTHER 0 NA
ccc2/34 PMU Present Registered Normal OTHER 0 NA
-------------------------------------------------------------------------------
Chassis ID: clc1
NE5000E-20's Device status:
-------------------------------------------------------------------------------
Slot # Type Online Register Status Role LsId Primary
-------------------------------------------------------------------------------
clc1/1 LPU Present Registered Normal LC 0 NA
clc1/2 LPU Present Registered Normal LC 0 NA
clc1/5 LPU Present Registered Normal LC 0 NA
clc1/13 LPU Present Registered Normal LC 0 NA
clc1/20 LPU Present Registered Normal LC 0 NA
clc1/21 MPU Present Registered Normal MB 0 Master
clc1/22 MPU Present Registered Normal MB 0 Slave
clc1/23 SFU Present Registered Normal OTHER 0 NA
clc1/24 SFU Present Registered Normal OTHER 0 NA
clc1/25 SFU Present Registered Normal OTHER 0 NA
clc1/26 SFU Present Registered Normal OTHER 0 NA
clc1/27 SFU Present Registered Normal OTHER 0 NA
clc1/28 SFU Present Registered Normal OTHER 0 NA

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clc1/29 SFU Present Registered Normal OTHER 0 NA
clc1/30 SFU Present Registered Normal OTHER 0 NA
clc1/35 CLK Present Registered Normal OTHER 0 Master
clc1/36 CLK Present Registered Normal OTHER 0 Slave
clc1/37 PWR Present Registered Normal OTHER 0 NA
clc1/39 FAN Present Registered Normal OTHER 0 NA
clc1/40 FAN Present Registered Normal OTHER 0 NA
clc1/41 FAN Present Registered Normal OTHER 0 NA
clc1/42 FAN Present Registered Normal OTHER 0 NA
clc1/43 FAN Present Registered Normal OTHER 0 NA
clc1/44 FAN Present Registered Normal OTHER 0 NA
clc1/45 FAN Present Registered Normal OTHER 0 NA
clc1/46 FAN Present Registered Normal OTHER 0 NA
clc1/47 FAN Present Registered Normal OTHER 0 NA
clc1/48 FAN Present Registered Normal OTHER 0 NA
clc1/32 CMU Present Registered Normal OTHER 0 Slave
clc1/33 CMU Present Registered Normal OTHER 0 Master
-------------------------------------------------------------------------------
Chassis ID: clc2
NE5000E-20's Device status:
-------------------------------------------------------------------------------
Slot # Type Online Register Status Role LsId Primary
-------------------------------------------------------------------------------
clc2/1 LPU Present Registered Normal LC 0 NA
clc2/2 LPU Present Registered Normal LC 0 NA
clc2/5 LPU Present Registered Normal LC 0 NA
clc2/13 LPU Present Registered Normal LC 0 NA
clc2/20 LPU Present Registered Normal LC 0 NA
clc2/21 MPU Present Registered Normal MB 0 Master
clc2/22 MPU Present Registered Normal MB 0 Slave
clc2/23 SFU Present Registered Normal OTHER 0 NA
clc2/24 SFU Present Registered Normal OTHER 0 NA
clc2/25 SFU Present Registered Normal OTHER 0 NA
clc2/26 SFU Present Registered Normal OTHER 0 NA
clc2/27 SFU Present Registered Normal OTHER 0 NA
clc2/28 SFU Present Registered Normal OTHER 0 NA
clc2/29 SFU Present Registered Normal OTHER 0 NA
clc2/30 SFU Present Registered Normal OTHER 0 NA
clc2/35 CLK Present Registered Normal OTHER 0 Master
clc2/36 CLK Present Registered Normal OTHER 0 Slave
clc2/37 PWR Present Registered Normal OTHER 0 NA
clc2/39 FAN Present Registered Normal OTHER 0 NA
clc2/40 FAN Present Registered Normal OTHER 0 NA
clc2/41 FAN Present Registered Normal OTHER 0 NA
clc2/42 FAN Present Registered Normal OTHER 0 NA
clc2/43 FAN Present Registered Normal OTHER 0 NA
clc2/44 FAN Present Registered Normal OTHER 0 NA
clc2/45 FAN Present Registered Normal OTHER 0 NA
clc2/46 FAN Present Registered Normal OTHER 0 NA
clc2/47 FAN Present Registered Normal OTHER 0 NA
clc2/48 FAN Present Registered Normal OTHER 0 NA
clc2/32 CMU Present Registered Normal OTHER 0 Slave
clc2/33 CMU Present Registered Normal OTHER 0 Master
-------------------------------------------------------------------------------

----End

Follow-up Procedure
After replacing an MPU, collect the tools. If an MPUthat is replaced is confirmed
to be faulty, you should fill in the Offsite Repair Card for Faulty Materials, and
send the card and the faulty MPUto a Huawei local office for timely maintenance.

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Hardware Guide 4 Hardware Installation and Parts Replacement

NO TICE

When replacing the main control board or CF card, you are advised to delete the
data in the old main control board's CF card to prevent data theft. You can use
either of the following methods:
● Use a card reader to connect the CF card to a PC, delete the data in the CF
card, and then recycle the old CF card.
● Physically destroy the old CF card.

4.3.2.1.4 Replacing an ICU
This section describes the precaution and procedure for replacing an ICU.

Precaution
Before replacing an ICU, you need to note the following points:
● The ICU supports hot swap.
● There are two ICUs in CCC-2. Two ICUs are in 1+1 backup mode.
● Before replacing an ICU, prepare the same ICU.

Tool
Before replacing an ICU, you need the following tools:
● ESD wrist strap or ESD gloves
● Phillips screwdriver
● ESD bag

Procedure

Step 1 Check the location of the ICU to be replaced.
Before removing the ICU that is to be replaced, you should first check the location
of the ICU, for example, the cabinet and chassis where the ICU resides. Then,
locate the ICU to be replaced in the chassis and attach a label to the panel to
identify the ICU.
Step 2 Check whether there is any bent pin in the connector of the new ICU.
Step 3 Remove the cables from the ICU to be replaced and label the cables to mark the
corresponding interface numbers.
Step 4 Wear the ESD wrist strap and connect the grounding terminal to the ESD jack on
the rack.
Step 5 Power off the ICU to be replaced.
Press and hold the OFL button on the panel of the ICU for six seconds till the
OFFLINE indicator is on. It means that the ICU is powered off.
Step 6 Pull out the cables from the ICU and label the cables to mark the corresponding
interface numbers.

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Hardware Guide 4 Hardware Installation and Parts Replacement

Step 7 Pull out the ICU to be replaced from the chassis.

NO TICE

During the operation, pull out the ICU slowly and smoothly to prevent it from
colliding with the neighboring boards and from causing the failures of the running
boards.
When removing or inserting an ICU, do not touch the components of the ICU. This
is to prevent it from being damaged.

1. Loosen the captive screws counter-clockwise with a Phillips screwdriver, as (1)
shown in Figure 4-305.
2. Turn the ejector levers on the panel of the ICU outward and upward, as (2)
shown in Figure 4-305.
3. Hold the ejector levers on the panel of the ICU and pull out the ICU smoothly
from the chassis along the guide rail of the slot. When part of the ICU is
removed out of the slot, support the ICU with one hand and hold the ICU
panel with the other. Then, remove the ICU completely out of the slot, as (3)
shown in Figure 4-305.
4. Place the ICU that is pulled out into the ESD bag.

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Hardware Guide 4 Hardware Installation and Parts Replacement

Figure 4-305 Removing an ICU from a chassis

Step 8 Insert a new ICU into the chassis.

NO TICE

During the operation, pull out the ICU slowly and smoothly to prevent it from
colliding with the neighboring boards and from causing the failures of the running
boards.
When removing or inserting an ICU, do not touch the components of the ICU. This
is to prevent it from being damaged.

1. Take out a new ICU from the ESD bag.
2. Support the lower edge of the new ICU with one hand and hold the panel
with the other hand. Then, insert the new ICU smoothly into the chassis along
the guide rail of the slot, as (1) shown in Figure 4-306.Stop sliding the ICU
forward when the ejector levers on the front panel of the ICU touch the
chassis.

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Hardware Guide 4 Hardware Installation and Parts Replacement

3. Turn the ejector levers on the ICU outward and upward to form a 45-degree
angle, and push the ICU into the slot with both hands. Then, turn the ejector
levers inward and downward with both hands till the panel of the ICU
touches the slot, as (2) shown in Figure 4-306.
4. Turn the Phillips screwdriver clockwise to tighten the captive screws, as (3)
shown in Figure 4-306.

Figure 4-306 Inserting an ICU into the chassis

Step 9 Connect the cables to the corresponding interfaces in the original sequence.

Step 10 Check the running status of the new ICU.

In normal situations, after the new ICU is inserted into the chassis, the ICU
automatically communicates with the MPU. In this case, maintenance personnel
can check the running status of the new ICU in the following ways:

● If the RUN indicator (green) on the panel of the ICU is blinking once every 2s,
it indicates that the ICU is running normally.

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Hardware Guide 4 Hardware Installation and Parts Replacement

● You can check the alarms. In normal situations, the system does not generate
any alarm related to the new ICU.
● Run the display device command on the console interface to view the
running status of the new ICU. If the status of the boards corresponding to
slots is displayed as the following black characters, it indicates that the ICU is
running normally.
<HUAWEI> display device
Total Chassis Number: 4
Central Chassis Number: 2
Line Chassis Number: 4
Chassis ID: ccc1
NE5000E-CCC-A's Device status:
-------------------------------------------------------------------------------
Slot # Type Online Register Status Role LsId Primary
-------------------------------------------------------------------------------
ccc1/11 SFU Present Registered Normal OTHER 0 NA
ccc1/12 SFU Present Registered Normal OTHER 0 NA
ccc1/13 SFU Present Registered Normal OTHER 0 NA
ccc1/15 SFU Present Registered Normal OTHER 0 NA
ccc1/17 SFU Present Registered Normal OTHER 0 NA
ccc1/18 SFU Present Registered Normal OTHER 0 NA
ccc1/19 ICU Present Registered Normal OTHER 0 NA
ccc1/20 MPU Present Registered Normal MMB 0 System master
ccc1/21 MPU Present Registered Normal MMB 0 Slave
ccc1/23 PWR Present Registered Normal OTHER 0 NA
ccc1/24 PWR Present Registered Normal OTHER 0 NA
ccc1/25 FAN Present Registered Normal OTHER 0 NA
ccc1/27 FAN Present Registered Normal OTHER 0 NA
ccc1/31 FAN Present Registered Normal OTHER 0 NA
ccc1/32 FAN Present Registered Normal OTHER 0 NA
ccc1/33 PMU Present Registered Normal OTHER 0 NA
ccc1/34 PMU Present Registered Normal OTHER 0 NA
-------------------------------------------------------------------------------
Chassis ID: ccc2
NE5000E-CCC-A's Device status:
-------------------------------------------------------------------------------
Slot # Type Online Register Status Role LsId Primary
-------------------------------------------------------------------------------
ccc2/6 SFU Present Registered Normal OTHER 0 NA
ccc2/11 SFU Present Registered Normal OTHER 0 NA
ccc2/13 SFU Present Registered Normal OTHER 0 NA
ccc2/15 SFU Present Registered Normal OTHER 0 NA
ccc2/17 SFU Present Registered Normal OTHER 0 NA
ccc2/19 ICU Present Registered Normal OTHER 0 NA
ccc2/20 MPU Present Registered Normal MMB 0 Slave
ccc2/21 MPU Present Registered Normal MMB 0 System slave
ccc2/24 PWR Present Registered Normal OTHER 0 NA
ccc2/25 FAN Present Registered Normal OTHER 0 NA
ccc2/31 FAN Present Registered Normal OTHER 0 NA
ccc2/32 FAN Present Registered Normal OTHER 0 NA
ccc2/33 PMU Present Registered Normal OTHER 0 NA
ccc2/34 PMU Present Registered Normal OTHER 0 NA
-------------------------------------------------------------------------------
Chassis ID: clc1
NE5000E-20's Device status:
-------------------------------------------------------------------------------
Slot # Type Online Register Status Role LsId Primary
-------------------------------------------------------------------------------
clc1/1 LPU Present Registered Normal LC 0 NA
clc1/2 LPU Present Registered Normal LC 0 NA
clc1/5 LPU Present Registered Normal LC 0 NA
clc1/13 LPU Present Registered Normal LC 0 NA
clc1/20 LPU Present Registered Normal LC 0 NA
clc1/21 MPU Present Registered Normal MB 0 Master
clc1/22 MPU Present Registered Normal MB 0 Slave
clc1/23 SFU Present Registered Normal OTHER 0 NA
clc1/24 SFU Present Registered Normal OTHER 0 NA

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Hardware Guide 4 Hardware Installation and Parts Replacement

clc1/25 SFU Present Registered Normal OTHER 0 NA
clc1/26 SFU Present Registered Normal OTHER 0 NA
clc1/27 SFU Present Registered Normal OTHER 0 NA
clc1/28 SFU Present Registered Normal OTHER 0 NA
clc1/29 SFU Present Registered Normal OTHER 0 NA
clc1/30 SFU Present Registered Normal OTHER 0 NA
clc1/35 CLK Present Registered Normal OTHER 0 Master
clc1/36 CLK Present Registered Normal OTHER 0 Slave
clc1/37 PWR Present Registered Normal OTHER 0 NA
clc1/39 FAN Present Registered Normal OTHER 0 NA
clc1/40 FAN Present Registered Normal OTHER 0 NA
clc1/41 FAN Present Registered Normal OTHER 0 NA
clc1/42 FAN Present Registered Normal OTHER 0 NA
clc1/43 FAN Present Registered Normal OTHER 0 NA
clc1/44 FAN Present Registered Normal OTHER 0 NA
clc1/45 FAN Present Registered Normal OTHER 0 NA
clc1/46 FAN Present Registered Normal OTHER 0 NA
clc1/47 FAN Present Registered Normal OTHER 0 NA
clc1/48 FAN Present Registered Normal OTHER 0 NA
clc1/32 CMU Present Registered Normal OTHER 0 Slave
clc1/33 CMU Present Registered Normal OTHER 0 Master
-------------------------------------------------------------------------------
Chassis ID: clc2
NE5000E-20's Device status:
-------------------------------------------------------------------------------
Slot # Type Online Register Status Role LsId Primary
-------------------------------------------------------------------------------
clc2/1 LPU Present Registered Normal LC 0 NA
clc2/2 LPU Present Registered Normal LC 0 NA
clc2/5 LPU Present Registered Normal LC 0 NA
clc2/13 LPU Present Registered Normal LC 0 NA
clc2/20 LPU Present Registered Normal LC 0 NA
clc2/21 MPU Present Registered Normal MB 0 Master
clc2/22 MPU Present Registered Normal MB 0 Slave
clc2/23 SFU Present Registered Normal OTHER 0 NA
clc2/24 SFU Present Registered Normal OTHER 0 NA
clc2/25 SFU Present Registered Normal OTHER 0 NA
clc2/26 SFU Present Registered Normal OTHER 0 NA
clc2/27 SFU Present Registered Normal OTHER 0 NA
clc2/28 SFU Present Registered Normal OTHER 0 NA
clc2/29 SFU Present Registered Normal OTHER 0 NA
clc2/30 SFU Present Registered Normal OTHER 0 NA
clc2/35 CLK Present Registered Normal OTHER 0 Master
clc2/36 CLK Present Registered Normal OTHER 0 Slave
clc2/37 PWR Present Registered Normal OTHER 0 NA
clc2/39 FAN Present Registered Normal OTHER 0 NA
clc2/40 FAN Present Registered Normal OTHER 0 NA
clc2/41 FAN Present Registered Normal OTHER 0 NA
clc2/42 FAN Present Registered Normal OTHER 0 NA
clc2/43 FAN Present Registered Normal OTHER 0 NA
clc2/44 FAN Present Registered Normal OTHER 0 NA
clc2/45 FAN Present Registered Normal OTHER 0 NA
clc2/46 FAN Present Registered Normal OTHER 0 NA
clc2/47 FAN Present Registered Normal OTHER 0 NA
clc2/48 FAN Present Registered Normal OTHER 0 NA
clc2/32 CMU Present Registered Normal OTHER 0 Slave
clc2/33 CMU Present Registered Normal OTHER 0 Master
-------------------------------------------------------------------------------
Step 11 Check whether the services are normal.
----End

Follow-ups
After replacing an ICU, collect the tools. If an ICU that is replaced is confirmed to
be faulty, you should fill in the Offsite Repair Card for Faulty Materials, and send
the card and the faulty ICU to a Huawei local office for timely maintenance.

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Hardware Guide 4 Hardware Installation and Parts Replacement

4.3.2.1.5 Replacing an SFU
This section describes the precaution and procedure for replacing an SFU.

Context
Before replacing a Switch Fabric Unit (SFU), you need to note the following points:
SFUs on a CCC work in 6+2 backup mode. When a CCC is working, at most one
SFU can be replaced at a time.

Tool
Before replacing an SFU, you need the following tools:
● ESD wrist strap or ESD glove
● Phillips screwdriver
● ESD bag

Procedure

Step 1 Check the location of the SFU to be replaced.
Before pulling out an SFU that is to be replaced, you should first determine the
location of the SFU, for example, the cabinet, chassis, and slot where the SFU
resides. The SFUs is in slots 1 to 18.
Locate the SFU to be replaced in the chassis and attach a label to identify the SFU.
Step 2 Prepare a new SFU and check whether there is any bent pin in the connector.
Step 3 Power off the SFU to be replaced.
Press and hold the OFL button on the panel of the SFU for six seconds till the
OFFLINE indicator is on. It means that the SFU is powered off.
Step 4 Pull out the SFU to be replaced from the chassis.

NO TE

● Before installing an SFU, ensure that ejector levers are available for use.
● After installing an SFU, remove the ejector levers from the SFU and attach them on the
cabinet or chassis for future use.

NO TICE

● During the operation, pull out the SFU slowly and smoothly to prevent it from
colliding with the neighboring boards and from causing the failure of the
running boards.
● When swapping an SFU, do not touch the parts on the SFU. This is to prevent it
from being damaged.
● Do not use ejector levers to lift a board.
● Use both ejector levers when pushing or pulling a board. Never use only one.

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Hardware Guide 4 Hardware Installation and Parts Replacement

1. Wear the ESD wrist strap and connect the grounding terminal to the ESD jack
on the rack.
2. Press down the elastomer fasteners on the ejector levers and insert them into
ejector lever connectors on the SFU. as 1 and 2 shown in Figure 4-307.
3. Loosen the captive screws counter-clockwise with a Phillips screwdriver, as 3
shown in Figure 4-307
4. Turn the ejector levers on the panel of the SFU outward and upward, as 4
shown in Figure 4-307
5. Hold the ejector levers on the panel of the SFU and pull out the SFU
smoothly from the chassis along the guide rail of the slot. When part of the
SFU is removed out of the slot, support the SFU with one hand and hold the
SFU panel with the other. Then, remove the SFU completely out of the slot, as
5 shown in Figure 4-307.
6. Press down the elastomer fasteners on the ejector levers and remove them
from the SFU. as 6 and 7 shown in Figure 4-307.
7. Place the SFU that is pulled out in the ESD-preventative bag.

Figure 4-307 Schematic diagram of removing an SFU

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Hardware Guide 4 Hardware Installation and Parts Replacement

Step 5 Insert the new SFU into the chassis.

NO TICE

● During the operation, pull out the SFU slowly and smoothly to prevent it from
colliding with the neighboring boards and from causing the failure of the
running boards.
● When swapping an SFU, do not touch the parts on the SFU. This is to prevent it
from being damaged.

1. Take out the new SFU from the ESD bag.
2. Support the lower edge of the new SFU with one hand and hold the panel
with the other hand. Then, insert the new SFU smoothly into the chassis
along the guide rail of the slot. Stop sliding the SFU forward when the ejector
levers on the front panel of the SFU touch the chassis, as 1 shown in Figure
4-308.
3. Press down the elastomer fasteners on the ejector levers and insert them into
ejector lever connectors on the SFU. as 2 and 3 shown in Figure 4-308.
4. Turn the ejector levers inward and downward till the panel of the SFU touches
the slot, as 4 shown in Figure 4-308.
5. Turn the Phillips screwdriver clockwise to tighten the captive screws, as 5
shown in Figure 4-308.
6. Press down the elastomer fasteners on the ejector levers and remove them
from the SFU. See 6 and 7 in Figure 4-308.

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Hardware Guide 4 Hardware Installation and Parts Replacement

Figure 4-308 Schematic diagram of inserting the new SFU into the chassis

Step 6 Check the running status of the new SFU.
In normal situations, after the new SFU is inserted into the chassis, the SFU
automatically communicates with the boards in the chassis. In this case, you can
check the running status of the new SFU in the following ways:
● If the RUN indicator (green) on the panel of the SFU is blinking once every 2s,
it indicates that the SFU is running normally.
● Check the alarms. In normal situations, the system does not generate any
alarm related to the new SFU.
● Run the display device command on the console interface to view the
running status of the new SFU. If the output is displayed as follows, it
indicates that the SFUs are running normally.
<HUAWEI> display device
Total Chassis Number: 5
Central Chassis Number: 2
Line Chassis Number: 3
Chassis ID: ccc1
NE5000E-CCC-A's Device status:
-------------------------------------------------------------------------------
Slot # Type Online Register Status Role LsId Primary
-------------------------------------------------------------------------------

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Hardware Guide 4 Hardware Installation and Parts Replacement

ccc1/11 SFU Present Registered Normal OTHER 0 NA
ccc1/12 SFU Present Registered Normal OTHER 0 NA
ccc1/13 SFU Present Registered Normal OTHER 0 NA
ccc1/15 SFU Present Registered Normal OTHER 0 NA
ccc1/17 SFU Present Registered Normal OTHER 0 NA
ccc1/18 SFU Present Registered Normal OTHER 0 NA
ccc1/19 ICU Present Registered Normal OTHER 0 NA
ccc1/20 MPU Present Registered Normal MMB 0 System master
ccc1/21 MPU Present Registered Normal MMB 0 Slave
ccc1/23 PWR Present Registered Normal OTHER 0 NA
ccc1/24 PWR Present Registered Normal OTHER 0 NA
ccc1/25 FAN Present Registered Normal OTHER 0 NA
ccc1/27 FAN Present Registered Normal OTHER 0 NA
ccc1/31 FAN Present Registered Normal OTHER 0 NA
ccc1/32 FAN Present Registered Normal OTHER 0 NA
ccc1/33 PMU Present Registered Normal OTHER 0 NA
ccc1/34 PMU Present Registered Normal OTHER 0 NA
-------------------------------------------------------------------------------
Chassis ID: ccc2
NE5000E-CCC-A's Device status:
-------------------------------------------------------------------------------
Slot # Type Online Register Status Role LsId Primary
-------------------------------------------------------------------------------
ccc2/6 SFU Present Registered Normal OTHER 0 NA
ccc2/11 SFU Present Registered Normal OTHER 0 NA
ccc2/13 SFU Present Registered Normal OTHER 0 NA
ccc2/15 SFU Present Registered Normal OTHER 0 NA
ccc2/17 SFU Present Registered Normal OTHER 0 NA
ccc2/19 ICU Present Registered Normal OTHER 0 NA
ccc2/20 MPU Present Registered Normal MMB 0 Slave
ccc2/21 MPU Present Registered Normal MMB 0 System slave
ccc2/24 PWR Present Registered Normal OTHER 0 NA
ccc2/25 FAN Present Registered Normal OTHER 0 NA
ccc2/31 FAN Present Registered Normal OTHER 0 NA
ccc2/32 FAN Present Registered Normal OTHER 0 NA
ccc2/33 PMU Present Registered Normal OTHER 0 NA
ccc2/34 PMU Present Registered Normal OTHER 0 NA
-------------------------------------------------------------------------------
Chassis ID: clc1
NE5000E-20's Device status:
-------------------------------------------------------------------------------
Slot # Type Online Register Status Role LsId Primary
-------------------------------------------------------------------------------
clc1/1 LPU Present Registered Normal LC 0 NA
clc1/2 LPU Present Registered Normal LC 0 NA
clc1/5 LPU Present Registered Normal LC 0 NA
clc1/13 LPU Present Registered Normal LC 0 NA
clc1/20 LPU Present Registered Normal LC 0 NA
clc1/21 MPU Present Registered Normal MB 0 Master
clc1/22 MPU Present Registered Normal MB 0 Slave
clc1/23 SFU Present Registered Normal OTHER 0 NA
clc1/24 SFU Present Registered Normal OTHER 0 NA
clc1/25 SFU Present Registered Normal OTHER 0 NA
clc1/26 SFU Present Registered Normal OTHER 0 NA
clc1/27 SFU Present Registered Normal OTHER 0 NA
clc1/28 SFU Present Registered Normal OTHER 0 NA
clc1/29 SFU Present Registered Normal OTHER 0 NA
clc1/30 SFU Present Registered Normal OTHER 0 NA
clc1/35 CLK Present Registered Normal OTHER 0 Master
clc1/36 CLK Present Registered Normal OTHER 0 Slave
clc1/37 PWR Present Registered Normal OTHER 0 NA
clc1/39 FAN Present Registered Normal OTHER 0 NA
clc1/40 FAN Present Registered Normal OTHER 0 NA
clc1/41 FAN Present Registered Normal OTHER 0 NA
clc1/42 FAN Present Registered Normal OTHER 0 NA
clc1/43 FAN Present Registered Normal OTHER 0 NA
clc1/44 FAN Present Registered Normal OTHER 0 NA
clc1/45 FAN Present Registered Normal OTHER 0 NA
clc1/46 FAN Present Registered Normal OTHER 0 NA

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clc1/47 FAN Present Registered Normal OTHER 0 NA
clc1/48 FAN Present Registered Normal OTHER 0 NA
clc1/32 CMU Present Registered Normal OTHER 0 Slave
clc1/33 CMU Present Registered Normal OTHER 0 Master
-------------------------------------------------------------------------------
Chassis ID: clc2
NE5000E-20's Device status:
-------------------------------------------------------------------------------
Slot # Type Online Register Status Role LsId Primary
-------------------------------------------------------------------------------
clc2/1 LPU Present Registered Normal LC 0 NA
clc2/2 LPU Present Registered Normal LC 0 NA
clc2/5 LPU Present Registered Normal LC 0 NA
clc2/13 LPU Present Registered Normal LC 0 NA
clc2/20 LPU Present Registered Normal LC 0 NA
clc2/21 MPU Present Registered Normal MB 0 Master
clc2/22 MPU Present Registered Normal MB 0 Slave
clc2/23 SFU Present Registered Normal OTHER 0 NA
clc2/24 SFU Present Registered Normal OTHER 0 NA
clc2/25 SFU Present Registered Normal OTHER 0 NA
clc2/26 SFU Present Registered Normal OTHER 0 NA
clc2/27 SFU Present Registered Normal OTHER 0 NA
clc2/28 SFU Present Registered Normal OTHER 0 NA
clc2/29 SFU Present Registered Normal OTHER 0 NA
clc2/30 SFU Present Registered Normal OTHER 0 NA
clc2/35 CLK Present Registered Normal OTHER 0 Master
clc2/36 CLK Present Registered Normal OTHER 0 Slave
clc2/37 PWR Present Registered Normal OTHER 0 NA
clc2/39 FAN Present Registered Normal OTHER 0 NA
clc2/40 FAN Present Registered Normal OTHER 0 NA
clc2/41 FAN Present Registered Normal OTHER 0 NA
clc2/42 FAN Present Registered Normal OTHER 0 NA
clc2/43 FAN Present Registered Normal OTHER 0 NA
clc2/44 FAN Present Registered Normal OTHER 0 NA
clc2/45 FAN Present Registered Normal OTHER 0 NA
clc2/46 FAN Present Registered Normal OTHER 0 NA
clc2/47 FAN Present Registered Normal OTHER 0 NA
clc2/48 FAN Present Registered Normal OTHER 0 NA
clc2/32 CMU Present Registered Normal OTHER 0 Slave
clc2/33 CMU Present Registered Normal OTHER 0 Master
-------------------------------------------------------------------------------

----End

Follow-up Procedure
After replacing an SFU, collect the tools. If an SFU that is replaced is confirmed to
be faulty, you should fill in the Offsite Repair Card for Faulty Materials, and send
the card and the faulty SFU to a Huawei local office for timely maintenance.

4.3.2.1.6 Replacing an OFC
This section describes the precaution and procedure for replacing an OFC.

Precaution
Before replacing an OFC, you need to note the following points:
● The OFC supports hot swap.
● Before replacing an OFC, prepare the same OFC.

Tool
Before replacing an OFC, you need the following tools:

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● ESD wrist strap or ESD gloves
● Phillips screwdriver
● ESD bag

Procedure

Step 1 Check the location of the OFC to be replaced.

Before removing the OFC that is to be replaced, you should first check the location
of the OFC, for example, the cabinet and chassis where the OFC resides. Then,
locate the OFC to be replaced in the chassis and attach a label to the panel to
identify the OFC.

Step 2 Check whether there is any bent pin in the connector of the new OFC.

Step 3 Remove the cables from the OFC to be replaced and label the cables to mark the
corresponding interface numbers.

Step 4 Wear the ESD wrist strap and connect the grounding terminal to the ESD jack on
the rack.

Step 5 Power off the OFC to be replaced.

Press and hold the OFL button on the panel of the OFC for six seconds till the
OFFLINE indicator is on. It means that the OFC is powered off.

Step 6 Pull out the cables from the OFC and label the cables to mark the corresponding
interface numbers.

Step 7 Pull out the OFC to be replaced from the chassis.

NO TICE

During the operation, pull out the OFC slowly and smoothly to prevent it from
colliding with the neighboring boards and from causing the failures of the running
boards.
When removing or inserting an OFC, do not touch the components of the OFC.
This is to prevent it from being damaged.

1. Loosen the captive screws counter-clockwise with a Phillips screwdriver, as (1)
shown in Figure 4-309.
2. Turn the ejector levers on the panel of the OFC outward and upward, as (2)
shown in Figure 4-309.
3. Hold the ejector levers on the panel of the OFC and pull out the OFC
smoothly from the chassis along the guide rail of the slot. When part of the
OFC is removed out of the slot, support the OFC with one hand and hold the
OFC panel with the other. Then, remove the OFC completely out of the slot,
as (3) shown in Figure 4-309.
4. Place the OFC that is pulled out into the ESD bag.

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Figure 4-309 Removing an OFC from a chassis

Step 8 Insert a new OFC into the chassis.

NO TICE

During the operation, pull out the OFC slowly and smoothly to prevent it from
colliding with the neighboring boards and from causing the failures of the running
boards.
When removing or inserting an OFC, do not touch the components of the OFC.
This is to prevent it from being damaged.

1. Take out a new OFC from the ESD bag, as shown in Figure 4-310.
2. Support the lower edge of the new OFC with one hand and hold the panel
with the other hand. Then, insert the new OFC smoothly into the chassis
along the guide rail of the slot, as (1) shown in Figure 4-310. Stop sliding the
OFC forward when the ejector levers on the front panel of the OFC touch the
chassis.

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3. Turn the ejector levers on the OFC outward and upward to form a 45-degree
angle, and push the OFC into the slot with both hands. Then, turn the ejector
levers inward and downward with both hands till the panel of the OFC
touches the slot, as (2) shown in Figure 4-310.
4. Turn the Phillips screwdriver clockwise to tighten the captive screws, as (3)
shown in Figure 4-310.

Figure 4-310 Inserting an OFC into the chassis

Step 9 Connect the cables to the corresponding interfaces in the original sequence.

Step 10 Check the running status of the new OFC.

In normal situations, after the new OFC is inserted into the chassis, the OFC
automatically communicates with the MPU. In this case, maintenance personnel
can check the running status of the new OFC in the following ways:

● If the RUN indicator (green) on the panel of the OFC is blinking once every
2s, it indicates that the OFC is running normally.

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● You can check the alarms. In normal situations, the system does not generate
any alarm related to the new OFC.
● Run the display device command on the console interface to view the
running status of the new OFC. If the status of the boards corresponding to
slots is displayed as the following black characters, it indicates that the OFC is
running normally.
<HUAWEI> display device ofc-status chassis ccc1
Ofc-status information in chassis ccc1:
--------------------------------------------------------------------------------
Ofc# Status Type Port_count Init_result Logic_down
--------------------------------------------------------------------------------
ccc1/1/3 Registered OFC100B_CARD 6 SUCCESS SUCCESS
ccc1/2/3 Registered OFC100B_CARD 6 SUCCESS SUCCESS
ccc1/3/3 Registered OFC100B_CARD 6 SUCCESS SUCCESS
ccc1/4/3 Registered OFC100B_CARD 6 SUCCESS SUCCESS
ccc1/5/3 Registered OFC100B_CARD 6 SUCCESS SUCCESS
ccc1/6/3 Registered OFC100B_CARD 6 SUCCESS SUCCESS
ccc1/7/3 Registered OFC100B_CARD 6 SUCCESS SUCCESS
ccc1/8/3 Registered OFC100B_CARD 6 SUCCESS SUCCESS
--------------------------------------------------------------------------------

Step 11 Check whether the services are normal.

----End

Follow-ups
After replacing an OFC, collect the tools. If an OFC that is replaced is confirmed to
be faulty, you should fill in the Offsite Repair Card for Faulty Materials, and send
the card and the faulty OFC to a Huawei local office for timely maintenance.

4.3.2.2 Replacing the SSD

Context
The MPUB provides the Solid State Disk (SSD) as the mass storage device to store
data files.

Precautions
Before removing the SSD, note the following issues:
● As the SSD is located on the MPU circuit board, remove the MPU first.
● Contents on the new SSD must be consistent with those on the old one.

Tool
Before replacing the SSD, you need the following tools:
● ESD wrist strap or ESD glove
● ESD bag

Procedure

Step 1 Check the location of the old SSD.

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Before removing the old SSD, first check its location, for example, the cabinet and
chassis where it resides. Then locate the MPU where the old SSD resides in the
chassis and attach a label to the panel to identify the MPU.
Step 2 Check whether the MPU where the old SSD resides is the master one.
You can view the ACT indicator on the MPU to check whether the MPU is the
master one. If the ACT indicator is on, it means that the MPU is the master one;
otherwise, the MPU is the slave one.
Step 3 If it is the master one, run the following command to perform the master/slave
switchover:
[~HUAWEI] slave switchover chassis clc1
Step 4 Power off the MPU where the SSD resides.
Press and hold the OFL button on the panel of the MPU for six seconds till the
OFFLINE indicator is on. It means that the MPU is powered off.
Step 5 Remove the MPU where the old SSD resides and place it on the worktable.
Step 6 Press the SSD slot ejector clips, as indicated by (1) in Figure 4-311. Remove the
SSD horizontally, as indicated by (2) in Figure 4-311

Figure 4-311 Diagram of removing the SSD

Step 7 Place the old SSD into an ESD bag.
Step 8 Install the new SSD to the MPU SSD slot.
Step 9 Install the MPU to the chassis.
Step 10 Check the running status of the new SSD.
Perform the following operations to check the running status of the new SSD:

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● Check the alarms. In normal situations, the system does not generate any
alarm related to the new MPU.
● Run the dir command on the console port to check whether information
about the new SSD can be displayed. If the command output is displayed as
follows, the new SSD runs normally.
<HUAWEI> dir ?
/all List all files
> Redirects the output to a file
>> Append the command output to the end of a file
STRING<1-128> [drive][path][file name]
10#cfcard2: Device name
10#cfcard: Device name
9#cfcard2: Device name
9#cfcard: Device name
cfcard2: Device name
cfcard: Device name
| Matching output
<cr>

If the new SSD does not work, contact a Huawei local office for timely technical
support.

----End

Follow-up Procedure

After finishing the replacement, put all the tools away. If the old SSD is confirmed
to be faulty, fill in the Offsite Repair Card for Faulty Materials, and send it with
the faulty SSD to the Huawei local office for timely maintenance.

4.3.2.3 Replacing the Fan Module of the NE5000E CCC-A

Precautions
● In the process of removing an old fan module, you need to pull it out about 5
cm (1.97 in.) first. After the fans stop rotating, you can pull out the complete
module.
● You can replace only one fan at a time.

Tools
● ESD wrist strap or ESD gloves
● Phillips screwdriver

Procedure

Step 1 Check the location of the fan module to be replaced.

Before removing the old fan module, check its location, for example, the cabinet
and chassis where the fan module resides. Then, find the fan module to be
replaced in the chassis and attach a label to the panel to identify the fan module
to avoid misoperation.

Step 2 Wear the ESD wrist strap and connect the grounding terminal to the ESD jack on
the chassis.

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Step 3 Turn the Phillips screwdriver to loosen the captive screws on the fan module, as
shown in Figure 4-312.
Step 4 Hold the left handle and right handle to draw the fan module about 5 cm (1.97
in.) out of the slot. When the fans stop rotating, pull out the fan module
completely, as shown in Figure 4-312.

Figure 4-312 Diagram of removing the fan module from the NE5000E CCC-A

Step 5 Insert a new fan module into the chassis.
Hold the left and right handles of the fan module, and slowly and horizontally
insert the fan module along the guide rails in the slot until the back of the fan
module properly connects to the backplane. Turn the Phillips screwdriver to fasten
the fan module to the chassis by tightening the captive screws, as shown in Figure
4-313.

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Figure 4-313 Diagram of installing the fan module on the NE5000E CCC-A

Step 6 Verify the function of the new fan module.
In normal situations, after the new fan module is inserted into the chassis, the
fans inside it immediately start to operate to draw air from the chassis. In this
case, you can check whether the new fan module functions normally in the
following manners:
● If the FAN indicator on the panel of the fan module is on and green, it
indicates that the fan module runs normally. If the indicator is red, it indicates
that the fan module fails to run normally.
● Run the display fan command on the console interface to view the running
status of the fan module. If the command output is displayed as follows, it
indicates that the fan module runs normally.
<HUAWEI> display fan
Chassis ID : clc2
Slotid : 27
Present : YES
Registered: YES
Status : AUTO
FanSpeed : [No.]Speed
[1] 35% [2] 35% [3] 35%
[4] 35% [5] 35% [6] 35%
Slotid : 28

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Present : YES
Registered: YES
Status : AUTO
FanSpeed : [No.]Speed
[1] 35% [2] 35% [3] 35%
[4] 35% [5] 35% [6] 35%
Slotid : 31
Present : YES
Registered: YES
Status : AUTO
FanSpeed : [No.]Speed
[1] 35% [2] 35% [3] 35%
[4] 35% [5] 35% [6] 35%
Slotid : 32
Present : YES
Registered: YES
Status : AUTO
FanSpeed : [No.]Speed
[1] 35% [2] 35% [3] 35%
[4] 35% [5] 35% [6] 35%

Chassis ID : clc3
Slotid : 27
Present : YES
Registered: YES
Status : AUTO
FanSpeed : [No.]Speed
[1] 50%
Slotid : 28
Present : YES
Registered: YES
Status : AUTO
FanSpeed : [No.]Speed
[1] 50%
Slotid : 29
Present : YES
Registered: YES
Status : AUTO
FanSpeed : [No.]Speed
[1] 50%
Slotid : 30
Present : YES
Registered: YES
Status : AUTO
FanSpeed : [No.]Speed
[1] 50%

Chassis ID : clc4
Slotid : 27
Present : YES
Registered: YES
Status : MANUAL
FanSpeed : [No.]Speed
[1]100% [2]100% [3]100%
Slotid : 28
Present : YES
Registered: YES
Status : MANUAL
FanSpeed : [No.]Speed
[1]100% [2]100% [3]100%

Chassis ID : ccc1
Slotid : 25
Present : YES
Registered: YES
Status : AUTO
FanSpeed : [No.]Speed
[1] 70% [2] 70% [3] 70%
[4] 70% [5] 70% [6] 70%

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Slotid : 27
Present : YES
Registered: YES
Status : AUTO
FanSpeed : [No.]Speed
[1] 70% [2] 70% [3] 70%
[4] 70% [5] 70% [6] 70%
Slotid : 31
Present : YES
Registered: YES
Status : AUTO
FanSpeed : [No.]Speed
[1] 70% [2] 70% [3] 70%
[4] 70% [5] 70% [6] 70%
Slotid : 32
Present : YES
Registered: YES
Status : AUTO
FanSpeed : [No.]Speed
[1] 70% [2] 70% [3] 70%
[4] 70% [5] 70% [6] 70%

Chassis ID : ccc2
Slotid : 25
Present : YES
Registered: YES
Status : AUTO
FanSpeed : [No.]Speed
[1]100% [2]100% [3]100%
[4]100% [5]100% [6]100%
Slotid : 31
Present : YES
Registered: YES
Status : AUTO
FanSpeed : [No.]Speed
[1] 85% [2] 85% [3] 85%
[4] 85% [5] 85% [6] 85%
Slotid : 32
Present : YES
Registered: YES
Status : AUTO
FanSpeed : [No.]Speed
[1] 85% [2] 85% [3] 85%
[4] 85% [5] 85% [6] 85%
The preceding command output indicates that the new fan module is normal. If
the new fan module fails to return to the normal state, contact Huawei technical
personnel.
----End

Follow-up Procedure
After finishing the replacement, collect the tools. If a fan module that is replaced
is confirmed to be faulty, you need to fill in the Offsite Repair Card for Faulty
Materials and send the faulty fan module together with the card to the Huawei
local office for timely repair.

4.3.2.4 Replacing the Air Filter of the NE5000E CCC-A

Precautions
To ensure good heat dissipation and ventilation for the system and to prevent the
accumulation of dust on an air filter, you need to clean the air filter regularly. It is

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recommended that an air filter be cleaned at least once every three months and
be replaced once every year. When an air filter is placed in the dusty environment,
it needs to be cleaned more frequently.

Tools
● ESD wrist strap or ESD gloves
● Phillips screwdriver

Procedure

Step 1 Check the location of the air filter to be replaced.
Before removing the old air filter, check its location, for example, the cabinet and
chassis where the air filter resides. Then, find the air filter to be replaced in the
chassis and attach a label to the panel to identify the air filter and avoid
misoperation.
Step 2 Wear the ESD wrist strap and connect the grounding terminal to the ESD jack on
the chassis.
Step 3 Remove the air filter from the air intake frame.
There is an air intake frame on the upper and lower chassis. Place fingers in the
holes on both sides of the panel to pull it out of the air intake frame horizontally.
In this manner, the panel is removed,Remove the air filter from the panel of the
air intake frame, as shown Figure 4-314.

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Figure 4-314 Diagram of removing the air filter from the air intake frame on the
NE5000E CCC-A

Step 4 Remove the air filter from the SFU area.
The air filter is located on the left in the middle of the device. Turn the Phillips
screwdriver to loosen the captive screws on the air filter. When removing the air
filter, hold the upper handle of the air filter with one hand and pull the air filter
out horizontally, as shown in Figure 4-315.

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Figure 4-315 Diagram of removing the air filter from the SFU area on the
NE5000E CCC-A

Step 5 Install an air filter on the air intake frame.
Place the clean and dry air filter onto the panel of the air intake frame,Place
fingers in the holes on both sides of the panel to install the panel back to the
original place, as shown in Figure 4-316.

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Figure 4-316 Diagram of installing the air filter on the air intake frame of the
NE5000E CCC-A

Step 6 Install an air filter in the SFU area.
Support the bottom of the air filter with one hand and hold the handle on the air
filter with the other hand. Then, insert the clean and dry air filter in the chassis
horizontally, turn the Phillips screwdriver to tighten the captive screws on the air
filter, as shown in Figure 4-317.

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Figure 4-317 Diagram of installing the air filter in the SFU area on the NE5000E
CCC-A

----End

Follow-up Procedure

After finishing the replacement, put all the tools away. Dispose of an air filter that
is replaced according to the compliance and safety standards.

4.3.2.5 Replacing a Power Module

This section describes the power module of the device and the procedure for
replacing the power module.

4.3.2.5.1 Introduction to a Power Module

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Appearance of the power supply module of the NE5000E CCC-A

Figure 4-318, Figure 4-319 and Figure 4-320 show the appearance of the PEM
and PM of NE5000E CCC-A.

Figure 4-318 Appearance of the DC PEM module

Figure 4-319 Appearance of the AC PEM module

Figure 4-320 Appearance of the PM module

4.3.2.5.2 Replacing the PM, switch, or PMU of the NE5000E CCC-A

Precautions
● Before replacing a power supply module, ensure that its backup power supply
module works properly.
● Only one PM, switch, or PMU can be replaced at a time.
● The steps to replace a DC PM, switch, or PMU module are similar to those of
replacing an AC PM, switch, or PMU module on the NE5000E CCC-A. This
topic uses replacing an AC PM, switch, or PMU module as an example.

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Tools
● ESD wrist strap or ESD gloves
● Phillips screwdriver

Procedure

Step 1 Check the location of the PM, switch, or PMU to be replaced.
Before removing the old PM, switch, or PMU, check its location, for example, the
cabinet and chassis where the PM, switch, or PMU resides. Then, find the PM,
switch, or PMU to be replaced in the chassis and attach a label to the panel to
identify the PM, switch, or PMU and avoid misoperation.
Step 2 Wear the ESD wrist strap and connect the grounding terminal to the ESD jack on
the chassis.
Step 3 Press the button on the handle of the PM.
Step 4 Hold the handle on the PM, switch, or PMU with one hand and hold the PM,
switch, or PMU with the other hand. Then, pull the PM, switch, or PMU
horizontally and slowly out of the chassis, as shown in Figure 4-321.

Figure 4-321 Diagram of removing the PM, switch, or PMU from the NE5000E
CCC-A

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Step 5 Insert the new PM, switch, or PMU into the chassis.
Hold the handle on the PM, switch, or PMU with one hand and the PM, switch, or
PMU with the other hand. Then, insert the PM, switch, or PMU horizontally and
slowly along the guide rails in the slot until the back of the PM, switch, or PMU
properly connects to the backplane, Turn the Phillips screwdriver to fasten the PM,

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switch, or PMU to the chassis by tightening the captive screws, as shown in Figure
4-322.

Figure 4-322 Diagram of installing the PM, switch, or PMU on the NE5000E CCC-
A

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Step 6 Connect the cables to the power module in original sequence.
Step 7 Verify the function of the new PM, switch, or PMU.
● If the RUN indicator on the PM, switch, or PMU panel is on and green, it
indicates that the PM, switch, or PMU runs normally.
If the ALM indicator on the PM, switch, or PMU panel is on and red, it
indicates that the PM, switch, or PMU fails to run normally.
● Run the display device chassis chassis-id command on the console interface
to check the running status of the new PM, switch, or PMU. If the PM, switch,
or PMU statuses are displayed as the following bold characters, it indicates
that the PM, switch, or PMU runs normally.
<HUAWEI> display device chassis ccc1
Chassis ID: ccc1
NE5000E-CCC-A's Device status:
-------------------------------------------------------------------------------
Slot # Type Online Register Status Role LsId Primary
-------------------------------------------------------------------------------
ccc1/11 SFU Present Registered Normal OTHER 0 NA
ccc1/12 SFU Present Registered Normal OTHER 0 NA
ccc1/13 SFU Present Registered Normal OTHER 0 NA
ccc1/15 SFU Present Registered Normal OTHER 0 NA
ccc1/17 SFU Present Registered Normal OTHER 0 NA
ccc1/18 SFU Present Registered Normal OTHER 0 NA
ccc1/19 ICU Present Registered Normal OTHER 0 NA
ccc1/20 MPU Present Registered Normal MMB 0 System master
ccc1/21 MPU Present Registered Normal MMB 0 Slave
ccc1/23 PWR Present Registered Normal OTHER 0 NA
ccc1/24 PWR Present Registered Normal OTHER 0 NA
ccc1/25 FAN Present Registered Normal OTHER 0 NA
ccc1/27 FAN Present Registered Normal OTHER 0 NA
ccc1/31 FAN Present Registered Normal OTHER 0 NA
ccc1/32 FAN Present Registered Normal OTHER 0 NA

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Hardware Guide 4 Hardware Installation and Parts Replacement

ccc1/33 PMU Present Registered Normal OTHER 0 NA
ccc1/34 PMU Present Registered Normal OTHER 0 NA
-------------------------------------------------------------------------------
The preceding command output indicates that the new PM, switch, or PMU is
normal. If the new PM, switch, or PMU fails to return to the normal state, contact
Huawei technical personnel.

----End

Follow-up Procedure
After finishing the replacement, put all the tools away. If a PM, switch, or PMU is
replaced and confirmed to be faulty, you need to fill in the Offsite Repair Card for
Faulty Materials and send the card with the faulty PM, switch, or PMU to the
Huawei local office for timely maintenance.
4.3.3 Replacing Parts of the NE5000E CCC
This chapter describes the precaution and procedure for replacing boards, CF card,
fan module, air filter, and power module.

4.3.3.1 Replacing Boards
This chapter describes the precaution and procedure for replacing the MPU, the
ICU, the SFU, and the OFC.

4.3.3.1.1 Overview of Boards
This section describes the mechanical specifications and the procedure for
installing the boards.

Mechanical Specifications of Boards

Mechanical Specifications of Boards
The boards of the NE5000E are of the plug-in type and consists of a circuit board,
connectors, a front panel, ejector levers, captive screws, and a bolt, as shown in
Figure 4-323.

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Hardware Guide 4 Hardware Installation and Parts Replacement

Figure 4-323 Schematic diagram of a common LPU

1.Captive screw 2. Ejector lever 3. Connector 4. Bolt

Installation of Boards

NO TICE
Before installing a board, check whether the there are any damaged pin holes on
the board connector. If some pin holes are damaged, do not insert the board in
the chassis. In addition, do not insert any other boards in the corresponding slot
unless it is examined and repaired.

Installation of Boards
Figure 4-324 shows the installation of boards.

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Figure 4-324 Schematic diagram of installing boards

1. Connector 2. Backplane

4.3.3.1.2 Introduction to Boards
This section describes the types and layout of boards on the NE5000E.

Types of Boards

The NE5000E CCC supports the following types of boards:
● MPU
● ICU
● SFU
● OFC

Layout of Boards
The CCC has one board insertion area on the front and one board insertion area
on the rear. Two MPUs, eight 400G SFUs, and two ICUs can be inserted vertically
in the front board insertion area.

Figure 4-325 shows the slot layout on the rear of the CCC.

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Figure 4-325 Rear board insertion area on the CCC

shows the slot layout on the CCC.

4.3.3.1.3 Replacing an MPU

This section describes the precaution and procedure for replacing an MPU.

Context

Before replacing a Main Processing Unit (MPU), you need to note the following
points:

● When the system is running, you can replace only the slave MPU.
● If you need to replace the master MPU, you must first perform the master/
slave switchover to enable the master MPU to become the slave one.
● The system software package and configuration file in the new MPU must be
consistent with those in the MPU to be replaced.

Tool

Before replacing an MPU, you need the following tools:

● ESD wrist strap or ESD glove
● Phillips screwdriver
● ESD bag

Procedure

Step 1 Check the version of the running software package.

Run the display version command to check the version of the running software
package.

Step 2 Prepare a new MPU and check whether there is any bent pin in the connector.

Step 3 Check the location of the MPU to be replaced.

Before pulling out an MPU that is to be replaced, you should first determine the
location of the MPU, for example, the cabinet, chassis, and slot where the MPU
resides. The NE5000E CCC has two MPUs. The MPUs of the NE5000E CCC reside in
slots 9 and 10.

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Locate the MPU to be replaced in the chassis and attach a label to identify the
MPU.
Step 4 Check whether the MPU to be replaced is the master MPU.
Run the display device command to check the slot ID of the current main control
board. If the main control board to be replaced is the active one, switch it to the
standby state first:
● In the case of the system-level active main control board, run the slave
switchover command on the console to forcibly perform a system-level
active/standby switchover.
● In other cases, run the reset slot slot-id command on the console to forcibly
perform an intra-chassis active/standby switchover. Then run the display
device command to check the slot ID of the active main control board after
the switchover to check whether the switchover is successful.
Step 5 Remove the cables from the MPU and label the cables.
Step 6 Power off the MPU to be replaced.
Press and hold the OFL button on the panel of the MPU for six seconds till the
OFFLINE indicator is on. It means that the MPU is powered off.
Step 7 Pull out the MPU to be replaced from the chassis.
1. Wear the ESD wrist strap and connect the grounding terminal to the ESD jack
on the rack.
2. Turn the Phillips screwdriver counter-clockwise to loosen the captive screws
on the board, as (1) shown in Figure 4-326.
3. Turn the ejector levers on the panel of the MPU outward and upward, as (2)
shown in Figure 4-326.

NO TICE

– During the operation, pull out the MPU slowly and smoothly to prevent it
from colliding with the neighboring boards and from causing the failure of
the running boards.
– When swapping an MPU, do not touch the parts on the MPU. This is to
prevent it from being damaged.

4. Hold the ejector levers on the panel of the MPU and pull out the MPU
smoothly from the chassis along the guide rail of the slot. When part of the
MPU is removed out of the slot, support the MPU with one hand and hold the
MPU panel with the other. Then, remove the MPU completely out of the slot,
as (3) shown in Figure 4-326.
5. Place the MPU that is removed in the ESD bag.

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Figure 4-326 Schematic diagram of removing an MPU

Step 8 Insert the new MPU into the chassis.
1. Take out the new MPU from the ESD bag.

NO TICE

– During the operation, pull out the MPU slowly and smoothly to prevent it
from colliding with the neighboring boards and from causing the failure of
the running boards.
– When swapping an MPU, do not touch the parts on the MPU. This is to
prevent it from being damaged.

2. Support the lower edge of the new MPU with one hand and hold the panel
with the other hand. Then, insert the new MPU smoothly into the chassis
along the guide rail of the slot. Stop sliding the MPU forward when the
ejector levers on the front panel of the MPU touch the chassis, as (1) shown
in Figure 4-327.
3. Turn the ejector levers on the MPU outward and upward to form a 45-degree
angle, and at the same time push the MPU into the slot. Then, turn the
ejector levers inward and downward till the panel of the MPU touches the
slot, as (2) shown in Figure 4-327.

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4. Turn the Phillips screwdriver clockwise to tighten the captive screws, as (3)
shown in Figure 4-327.

Figure 4-327 Schematic diagram of inserting an MPU

Step 9 Check the running status of the new MPU.
In normal situations, after the new MPU is inserted into the chassis, the MPU
automatically communicates with the boards in the chassis. In this case, you can
check the running status of the new MPU in the following ways:
● If the RUN indicator (green) on the panel of the MPU is blinking once every
2s, it indicates that the MPU is running normally.
● Check the alarms. In normal situations, the system does not generate any
alarm related to the new MPU.
● Run the display device chassis chassis-id command on the console interface
to view the running status of the new MPU. If the output is displayed as
follows, it indicates that the MPU is running normally.

----End

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Follow-up Procedure
After replacing an MPU, collect the tools. If an MPUthat is replaced is confirmed
to be faulty, you should fill in the Offsite Repair Card for Faulty Materials, and
send the card and the faulty MPUto a Huawei local office for timely maintenance.

NO TICE

When replacing the main control board or CF card, you are advised to delete the
data in the old main control board's CF card to prevent data theft. You can use
either of the following methods:
● Use a card reader to connect the CF card to a PC, delete the data in the CF
card, and then recycle the old CF card.
● Physically destroy the old CF card.

4.3.3.1.4 Replacing an ICU

This section describes the precaution and procedure for replacing an ICU.

Precaution
Before replacing an ICU, you need to note the following points:

● The ICU supports hot swap.
● There are two ICUs in CCC-2. Two ICUs are in 1+1 backup mode.
● Before replacing an ICU, prepare the same ICU.

Tool
Before replacing an ICU, you need the following tools:

● ESD wrist strap or ESD gloves
● Phillips screwdriver
● ESD bag

Procedure

Step 1 Check the location of the ICU to be replaced.

Before removing the ICU that is to be replaced, you should first check the location
of the ICU, for example, the cabinet and chassis where the ICU resides. Then,
locate the ICU to be replaced in the chassis and attach a label to the panel to
identify the ICU.

Step 2 Check whether there is any bent pin in the connector of the new ICU.

Step 3 Remove the cables from the ICU to be replaced and label the cables to mark the
corresponding interface numbers.

Step 4 Wear the ESD wrist strap and connect the grounding terminal to the ESD jack on
the rack.

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Step 5 Power off the ICU to be replaced.
Press and hold the OFL button on the panel of the ICU for six seconds till the
OFFLINE indicator is on. It means that the ICU is powered off.
Step 6 Pull out the cables from the ICU and label the cables to mark the corresponding
interface numbers.
Step 7 Pull out the ICU to be replaced from the chassis.

NO TICE

During the operation, pull out the ICU slowly and smoothly to prevent it from
colliding with the neighboring boards and from causing the failures of the running
boards.
When removing or inserting an ICU, do not touch the components of the ICU. This
is to prevent it from being damaged.

1. Loosen the captive screws counter-clockwise with a Phillips screwdriver, as (1)
shown in Figure 4-328.
2. Turn the ejector levers on the panel of the ICU outward and upward, as (2)
shown in Figure 4-328.
3. Hold the ejector levers on the panel of the ICU and pull out the ICU smoothly
from the chassis along the guide rail of the slot. When part of the ICU is
removed out of the slot, support the ICU with one hand and hold the ICU
panel with the other. Then, remove the ICU completely out of the slot, as (3)
shown in Figure 4-328.
4. Place the ICU that is pulled out into the ESD bag.

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Figure 4-328 Removing an ICU from a chassis

Step 8 Insert a new ICU into the chassis.

NO TICE

During the operation, pull out the ICU slowly and smoothly to prevent it from
colliding with the neighboring boards and from causing the failures of the running
boards.
When removing or inserting an ICU, do not touch the components of the ICU. This
is to prevent it from being damaged.

1. Take out a new ICU from the ESD bag.
2. Support the lower edge of the new ICU with one hand and hold the panel
with the other hand. Then, insert the new ICU smoothly into the chassis along
the guide rail of the slot, as (1) shown in Figure 4-329.Stop sliding the ICU
forward when the ejector levers on the front panel of the ICU touch the
chassis.
3. Turn the ejector levers on the ICU outward and upward to form a 45-degree
angle, and push the ICU into the slot with both hands. Then, turn the ejector
levers inward and downward with both hands till the panel of the ICU
touches the slot, as (2) shown in Figure 4-329.

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4. Turn the Phillips screwdriver clockwise to tighten the captive screws, as (3)
shown in Figure 4-329.

Figure 4-329 Inserting an ICU into the chassis

Step 9 Connect the cables to the corresponding interfaces in the original sequence.
Step 10 Check the running status of the new ICU.
In normal situations, after the new ICU is inserted into the chassis, the ICU
automatically communicates with the MPU. In this case, maintenance personnel
can check the running status of the new ICU in the following ways:
● If the RUN indicator (green) on the panel of the ICU is blinking once every 2s,
it indicates that the ICU is running normally.
● You can check the alarms. In normal situations, the system does not generate
any alarm related to the new ICU.
● Run the display device command on the console interface to view the
running status of the new ICU. If the status of the boards corresponding to
slots is displayed as the following black characters, it indicates that the ICU is
running normally.
Step 11 Check whether the services are normal.

----End

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Follow-ups
After replacing an ICU, collect the tools. If an ICU that is replaced is confirmed to
be faulty, you should fill in the Offsite Repair Card for Faulty Materials, and send
the card and the faulty ICU to a Huawei local office for timely maintenance.

4.3.3.1.5 Replacing a 100G SFU

This section describes the precaution and procedure for replacing an SFU.

Context
Before replacing a Switch Fabric Unit (SFU), you need to note the following points:

When a CCC is working, at most one SFU can be replaced at a time.

Tool
Before replacing an SFU, you need the following tools:

● ESD wrist strap or ESD glove
● Phillips screwdriver
● ESD bag

Procedure

Step 1 Check the location of the SFU to be replaced.

Before pulling out an SFU that is to be replaced, you should first determine the
location of the SFU, for example, the cabinet, chassis, and slot where the SFU
resides.The NE5000E CCC has eight SFUs in slots 13 to 20.

Locate the SFU to be replaced in the chassis and attach a label to identify the SFU.

Step 2 Prepare a new SFU and check whether there is any bent pin in the connector.

Step 3 Power off the SFU to be replaced.

Press and hold the OFL button on the panel of the SFU for six seconds till the
OFFLINE indicator is on. It means that the SFU is powered off.

Step 4 Pull out the SFU to be replaced from the chassis.

NO TICE

● During the operation, pull out the SFU slowly and smoothly to prevent it from
colliding with the neighboring boards and from causing the failure of the
running boards.
● When swapping an SFU, do not touch the parts on the SFU. This is to prevent it
from being damaged.

1. Wear the ESD wrist strap and connect the grounding terminal to the ESD jack
on the rack.

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2. Loosen the captive screws counter-clockwise with a Phillips screwdriver, as (1)
shown in Figure 4-330
3. Turn the ejector levers on the panel of the SFU outward and upward, as (2)
shown in Figure 4-330
4. Hold the ejector levers on the panel of the SFU and pull out the SFU
smoothly from the chassis along the guide rail of the slot. When part of the
SFU is removed out of the slot, support the SFU with one hand and hold the
SFU panel with the other. Then, remove the SFU completely out of the slot, as
(3) shown in Figure 4-330.
5. Place the SFU that is pulled out in the ESD-preventative bag.

Figure 4-330 Schematic diagram of removing an SFU

Step 5 Insert the new SFU into the chassis.

NO TICE

● During the operation, pull out the SFU slowly and smoothly to prevent it from
colliding with the neighboring boards and from causing the failure of the
running boards.
● When swapping an SFU, do not touch the parts on the SFU. This is to prevent it
from being damaged.

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1. Take out the new SFU from the ESD bag.
2. Support the lower edge of the new SFU with one hand and hold the panel
with the other hand. Then, insert the new SFU smoothly into the chassis
along the guide rail of the slot. Stop sliding the SFU forward when the ejector
levers on the front panel of the SFU touch the chassis, as (1) shown in Figure
4-331.
3. Turn the ejector levers on the SFU outward and upward to form a 45-degree
angle, and at the same time push the SFU into the slot. Then, turn the ejector
levers inward and downward till the panel of the SFU touches the slot, as (2)
shown in Figure 4-331.
4. Turn the Phillips screwdriver clockwise to tighten the captive screws, as (3)
shown in Figure 4-331.

Figure 4-331 Schematic diagram of inserting the new SFU into the chassis

Step 6 Check the running status of the new SFU.

In normal situations, after the new SFU is inserted into the chassis, the SFU
automatically communicates with the boards in the chassis. In this case, you can
check the running status of the new SFU in the following ways:
● If the RUN indicator (green) on the panel of the SFU is blinking once every 2s,
it indicates that the SFU is running normally.
● Check the alarms. In normal situations, the system does not generate any
alarm related to the new SFU.

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● Run the display device command on the console interface to view the
running status of the new SFU. If the output is displayed as follows, it
indicates that the SFUs are running normally.

----End

Follow-up Procedure
After replacing an SFU, collect the tools. If an SFU that is replaced is confirmed to
be faulty, you should fill in the Offsite Repair Card for Faulty Materials, and send
the card and the faulty SFU to a Huawei local office for timely maintenance.

4.3.3.1.6 Replacing an ECU/400G SFU
This section describes the precaution and procedure for replacing an ECU/400G
SFU.

Precaution
Before replacing an Electronic Control Unit (ECU) or 400G Central Switch Fabric
Unit (400G SFU), you need to note the following points:
● There are eight ECU/SFUs in the Cluster Central Chassis (CCC). The eight ECU/
SFUs support hot swap.
● Before replacing an ECU/SFU, prepare a new ECU/SFU and install the same
OFC as the original one on the ECU/SFU.

Tool
Before replacing an ECU/SFU, you need the following tools:
● ESD wrist strap or ESD gloves
● Phillips screwdriver
● ESD bag

Procedure

Step 1 Check the location of the ECU/SFU to be replaced.
Before pulling out an ECU/SFU that is to be replaced, maintenance personnel
should first check the location of the ECU/SFU, for example, the cabinet, chassis,
and slot where the ECU/SFU resides. Then, locate the ECU/SFU to be replaced in
the chassis and attach a label to the panel to identify the ECU/SFU.
Step 2 Check whether there is any bent pin in the connector of the new ECU/SFU.
Step 3 Remove the cables from the ECU/SFU to be replaced and label the cables to mark
the corresponding interface numbers.
Step 4 Wear the ESD wrist strap and connect the grounding terminal to the ESD jack on
the rack.
Step 5 Power off the ECU/SFU to be replaced.
Press and hold the OFL button on the panel of the ECU/SFU for six seconds till the
OFFLINE indicator is on. It means that the ECU/SFU is powered off.

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Step 6 Remove the cables from the ECU/SFU and label the cables to mark the
corresponding interface numbers.
Step 7 Pull out the ECU/SFU to be replaced from the chassis.

NO TICE

During the operation, pull out the ECU/SFU slowly and smoothly to prevent it
from colliding with the neighboring boards and from causing the failures of the
running boards.
When removing or inserting an ECU/SFU, do not touch the components of the
ECU/SFU. This is to prevent it from being damaged.

1. Loosen the captive screws counter-clockwise with a Phillips screwdriver, as (1)
shown in Figure 4-332.
2. Turn the ejector levers on the panel of the ECU/SFU outward and upward, as
(2) shown in Figure 4-332.
3. Hold the ejector levers on the panel of the ECU/SFU and pull out the ECU/SFU
smoothly along the guide rail of the slot. When part of the ECU/SFU is
removed out of the slot, support the ECU/SFU with one hand and hold the
ECU/SFU panel with the other. Then, remove the ECU/SFU completely out of
the slot, as (3) shown in Figure 4-332.
4. Place the ECU/SFU that is pulled out into the ESD bag.

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Figure 4-332 Removing an ECU/SFU from a chassis (Use ECU as an example)

Step 8 Insert the new ECU/SFU into the chassis.

NO TICE

During the operation, pull out the ECU/SFU slowly and smoothly to prevent it
from colliding with the neighboring boards and from causing the failures of the
running boards.
When removing or inserting an ECU/SFU, do not touch the components of the
ECU/SFU. This is to prevent it from being damaged.

1. Take out the new ECU/SFU from the ESD bag.
2. Support the lower edge of the new ECU/SFU with one hand and hold the
panel with the other hand. Then, insert the new ECU/SFU smoothly into the
chassis along the guide rail of the slot, as (1) shown in Figure 4-333. Stop
sliding the ECU/SFU forward when the ejector levers on the front panel of the
ECU/SFU touch the chassis.
3. Turn the ejector levers on the ECU/SFU outward and upward to form a 45-
degree angle, and push the ECU/SFU into the slot with both hands. Then, turn
the ejector levers inward and downward with both hands till the panel of the
ECU/SFU touches the slot, as (2) shown in Figure 4-333.

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4. Turn the Phillips screwdriver clockwise to tighten the captive screws, as (3)
shown in Figure 4-333.

Figure 4-333 Inserting an ECU/SFU into the chassis

Step 9 Connect the cables to the corresponding interfaces in the original sequence.

Step 10 Check the running status of the new ECU/SFU.

In normal situations, after the new ECU/SFU is inserted into the chassis, the
ECU/SFU automatically communicates with the MPU. In this case, maintenance
personnel can check the running status of the new ECU/SFU in the following ways:

● If the RUN indicator (green) on the panel of the ECU/SFU is blinking once
every 2s, it indicates that the ECU/SFU is running normally.
● You can check the alarms. In normal situations, the system does not generate
any alarm related to the new ECU/SFU.
● Run the display device command on the console interface to view the
running status of the new ECU/SFU. If the status of the boards corresponding
to slots is displayed as the following black characters, it indicates that the
ECU/SFU is running normally.
<HUAWEI> display device
Total Chassis Number: 4
Central Chassis Number: 2

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Line Chassis Number: 2
Chassis ID: ccc2
NE5000E-CCC-A's Device status:
-----------------------------------------------------------------------------
Slot # Type Online Register Status Role LrId Primary
-----------------------------------------------------------------------------
ccc2/9 MPU Present Registered Normal MMB 0 System master
ccc2/10 MPU Present Registered Normal MMB 0 Slave
ccc2/11 ICU Present Registered Normal OTHER 0 NA
ccc2/22 PWR Present Registered Normal OTHER 0 NA
ccc2/24 FAN Present Registered Normal OTHER 0 NA
ccc2/26 FAN Present Registered Normal OTHER 0 NA
-----------------------------------------------------------------------------
Chassis ID: ccc1
NE5000E-CCC-A's Device status:
-----------------------------------------------------------------------------
Slot # Type Online Register Status Role LrId Primary
-----------------------------------------------------------------------------
ccc1/1 ECU Present Registered Normal OTHER 0 NA
ccc1/3 ECU Present Registered Normal OTHER 0 NA
ccc1/5 ECU Present Registered Normal OTHER 0 NA
ccc1/7 ECU Present Registered Normal OTHER 0 NA
ccc1/9 MPU Present Registered Normal MMB 0 Slave
ccc1/10 MPU Present Registered Normal MMB 0 System slave
ccc1/11 ICU Present Registered Normal OTHER 0 NA
ccc1/13 SFU Present Registered Normal OTHER 0 NA
ccc1/14 SFU Present Registered Normal OTHER 0 NA
ccc1/15 SFU Present Registered Normal OTHER 0 NA
ccc1/16 SFU Present Registered Normal OTHER 0 NA
ccc1/17 SFU Present Registered Normal OTHER 0 NA
ccc1/18 SFU Present Registered Normal OTHER 0 NA
ccc1/19 SFU Present Registered Normal OTHER 0 NA
ccc1/20 SFU Present Registered Normal OTHER 0 NA
ccc1/21 PWR Present Registered Normal OTHER 0 NA
ccc1/23 FAN Present Registered Normal OTHER 0 NA
ccc1/25 FAN Present Registered Normal OTHER 0 NA
ccc1/26 FAN Present Registered Normal OTHER 0 NA
-----------------------------------------------------------------------------
Chassis ID: clc1
NE5000E-20's Device status:
-------------------------------------------------------------------------------
Slot # Type Online Register Status Role LsId Primary
-------------------------------------------------------------------------------
clc1/1 LPU Present Registered Normal LC 0 NA
clc1/2 LPU Present Registered Normal LC 0 NA
clc1/5 LPU Present Registered Normal LC 0 NA
clc1/13 LPU Present Registered Normal LC 0 NA
clc1/20 LPU Present Registered Normal LC 0 NA
clc1/21 MPU Present Registered Normal MB 0 Master
clc1/22 MPU Present Registered Normal MB 0 Slave
clc1/23 SFU Present Registered Normal OTHER 0 NA
clc1/24 SFU Present Registered Normal OTHER 0 NA
clc1/25 SFU Present Registered Normal OTHER 0 NA
clc1/26 SFU Present Registered Normal OTHER 0 NA
clc1/27 SFU Present Registered Normal OTHER 0 NA
clc1/28 SFU Present Registered Normal OTHER 0 NA
clc1/29 SFU Present Registered Normal OTHER 0 NA
clc1/30 SFU Present Registered Normal OTHER 0 NA
clc1/35 CLK Present Registered Normal OTHER 0 Master
clc1/36 CLK Present Registered Normal OTHER 0 Slave
clc1/37 PWR Present Registered Normal OTHER 0 NA
clc1/39 FAN Present Registered Normal OTHER 0 NA
clc1/40 FAN Present Registered Normal OTHER 0 NA
clc1/41 FAN Present Registered Normal OTHER 0 NA
clc1/42 FAN Present Registered Normal OTHER 0 NA
clc1/43 FAN Present Registered Normal OTHER 0 NA
clc1/44 FAN Present Registered Normal OTHER 0 NA
clc1/45 FAN Present Registered Normal OTHER 0 NA
clc1/46 FAN Present Registered Normal OTHER 0 NA

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clc1/47 FAN Present Registered Normal OTHER 0 NA
clc1/48 FAN Present Registered Normal OTHER 0 NA
clc1/32 CMU Present Registered Normal OTHER 0 Slave
clc1/33 CMU Present Registered Normal OTHER 0 Master
-------------------------------------------------------------------------------
Chassis ID: clc2
NE5000E-20's Device status:
-------------------------------------------------------------------------------
Slot # Type Online Register Status Role LsId Primary
-------------------------------------------------------------------------------
clc2/1 LPU Present Registered Normal LC 0 NA
clc2/2 LPU Present Registered Normal LC 0 NA
clc2/5 LPU Present Registered Normal LC 0 NA
clc2/13 LPU Present Registered Normal LC 0 NA
clc2/20 LPU Present Registered Normal LC 0 NA
clc2/21 MPU Present Registered Normal MB 0 Master
clc2/22 MPU Present Registered Normal MB 0 Slave
clc2/23 SFU Present Registered Normal OTHER 0 NA
clc2/24 SFU Present Registered Normal OTHER 0 NA
clc2/25 SFU Present Registered Normal OTHER 0 NA
clc2/26 SFU Present Registered Normal OTHER 0 NA
clc2/27 SFU Present Registered Normal OTHER 0 NA
clc2/28 SFU Present Registered Normal OTHER 0 NA
clc2/29 SFU Present Registered Normal OTHER 0 NA
clc2/30 SFU Present Registered Normal OTHER 0 NA
clc2/35 CLK Present Registered Normal OTHER 0 Master
clc2/36 CLK Present Registered Normal OTHER 0 Slave
clc2/37 PWR Present Registered Normal OTHER 0 NA
clc2/39 FAN Present Registered Normal OTHER 0 NA
clc2/40 FAN Present Registered Normal OTHER 0 NA
clc2/41 FAN Present Registered Normal OTHER 0 NA
clc2/42 FAN Present Registered Normal OTHER 0 NA
clc2/43 FAN Present Registered Normal OTHER 0 NA
clc2/44 FAN Present Registered Normal OTHER 0 NA
clc2/45 FAN Present Registered Normal OTHER 0 NA
clc2/46 FAN Present Registered Normal OTHER 0 NA
clc2/47 FAN Present Registered Normal OTHER 0 NA
clc2/48 FAN Present Registered Normal OTHER 0 NA
clc2/32 CMU Present Registered Normal OTHER 0 Slave
clc2/33 CMU Present Registered Normal OTHER 0 Master
-------------------------------------------------------------------------------

Step 11 Check whether the services are normal.

----End

Follow-ups
After replacing an ECU/SFU, collect the tools. If an ECU/SFU that is replaced is
confirmed to be faulty, you should fill in the Offsite Repair Card for Faulty
Materials, and send the card and the faulty ECU/SFU to a Huawei local office for
timely maintenance.

4.3.3.1.7 Replacing an 400G SFU
This section describes the precaution and procedure for replacing an 400G SFU.

Precaution
Before replacing an 400G Central Switch Fabric Unit (400G SFU), you need to note
the following points:
● There are eight SFUs in the Cluster Central Chassis (CCC). The eight SFUs
support hot swap.

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● Before replacing an SFU, prepare a new SFU and install the same OFC as the
original one on the SFU.

Tool
Before replacing an SFU, you need the following tools:
● ESD wrist strap or ESD gloves
● Phillips screwdriver
● ESD bag

Procedure

Step 1 Check the location of the SFU to be replaced.
Before pulling out an SFU that is to be replaced, maintenance personnel should
first check the location of the SFU, for example, the cabinet, chassis, and slot
where the SFU resides. Then, locate the SFU to be replaced in the chassis and
attach a label to the panel to identify the SFU.
Step 2 Check whether there is any bent pin in the connector of the new SFU.
Step 3 Remove the cables from the SFU to be replaced and label the cables to mark the
corresponding interface numbers.
Step 4 Wear the ESD wrist strap and connect the grounding terminal to the ESD jack on
the rack.
Step 5 Power off the SFU to be replaced.
Press and hold the OFL button on the panel of the SFU for six seconds till the
OFFLINE indicator is on. It means that the SFU is powered off.
Step 6 Remove the cables from the SFU and label the cables to mark the corresponding
interface numbers.
Step 7 Pull out the SFU to be replaced from the chassis.

NO TICE

During the operation, pull out the SFU slowly and smoothly to prevent it from
colliding with the neighboring boards and from causing the failures of the running
boards.
When removing or inserting an SFU, do not touch the components of the SFU.
This is to prevent it from being damaged.

1. Loosen the captive screws counter-clockwise with a Phillips screwdriver, as (1)
shown in Figure 4-334.
2. Turn the ejector levers on the panel of the SFU outward and upward, as (2)
shown in Figure 4-334.
3. Hold the ejector levers on the panel of the SFU and pull out the SFU
smoothly along the guide rail of the slot. When part of the SFU is removed
out of the slot, support the SFU with one hand and hold the SFU panel with

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the other. Then, remove the SFU completely out of the slot, as (3) shown in
Figure 4-334.
4. Place the SFU that is pulled out into the ESD bag.

Figure 4-334 Removing an SFU from a chassis

Step 8 Insert the new SFU into the chassis.

NO TICE

During the operation, pull out the SFU slowly and smoothly to prevent it from
colliding with the neighboring boards and from causing the failures of the running
boards.
When removing or inserting an SFU, do not touch the components of the SFU.
This is to prevent it from being damaged.

1. Take out the new SFU from the ESD bag.
2. Support the lower edge of the new SFU with one hand and hold the panel
with the other hand. Then, insert the new SFU smoothly into the chassis
along the guide rail of the slot, as (1) shown in Figure 4-335. Stop sliding the
SFU forward when the ejector levers on the front panel of the SFU touch the
chassis.

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3. Turn the ejector levers on the SFU outward and upward to form a 45-degree
angle, and push the SFU into the slot with both hands. Then, turn the ejector
levers inward and downward with both hands till the panel of the SFU
touches the slot, as (2) shown in Figure 4-335.
4. Turn the Phillips screwdriver clockwise to tighten the captive screws, as (3)
shown in Figure 4-335.

Figure 4-335 Inserting an SFU into the chassis

Step 9 Connect the cables to the corresponding interfaces in the original sequence.

Step 10 Check the running status of the new SFU.

In normal situations, after the new SFU is inserted into the chassis, the SFU
automatically communicates with the MPU. In this case, maintenance personnel
can check the running status of the new SFU in the following ways:

● If the RUN indicator (green) on the panel of the SFU is blinking once every 2s,
it indicates that the SFU is running normally.
● You can check the alarms. In normal situations, the system does not generate
any alarm related to the new SFU.
● Run the display device command on the console interface to view the
running status of the new SFU. If the status of the boards corresponding to

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slots is displayed as the following black characters, it indicates that the SFU is
running normally.
<HUAWEI> display device
Total Chassis Number: 4
Central Chassis Number: 2
Line Chassis Number: 2
Chassis ID: ccc2
NE5000E-CCC-A's Device status:
-----------------------------------------------------------------------------
Slot # Type Online Register Status Role LrId Primary
-----------------------------------------------------------------------------
ccc2/9 MPU Present Registered Normal MMB 0 System master
ccc2/10 MPU Present Registered Normal MMB 0 Slave
ccc2/11 ICU Present Registered Normal OTHER 0 NA
ccc2/22 PWR Present Registered Normal OTHER 0 NA
ccc2/24 FAN Present Registered Normal OTHER 0 NA
ccc2/26 FAN Present Registered Normal OTHER 0 NA
-----------------------------------------------------------------------------
Chassis ID: ccc1
NE5000E-CCC-A's Device status:
-----------------------------------------------------------------------------
Slot # Type Online Register Status Role LrId Primary
-----------------------------------------------------------------------------
ccc1/9 MPU Present Registered Normal MMB 0 Slave
ccc1/10 MPU Present Registered Normal MMB 0 System slave
ccc1/11 ICU Present Registered Normal OTHER 0 NA
ccc1/13 SFU Present Registered Normal OTHER 0 NA
ccc1/14 SFU Present Registered Normal OTHER 0 NA
ccc1/15 SFU Present Registered Normal OTHER 0 NA
ccc1/16 SFU Present Registered Normal OTHER 0 NA
ccc1/17 SFU Present Registered Normal OTHER 0 NA
ccc1/18 SFU Present Registered Normal OTHER 0 NA
ccc1/19 SFU Present Registered Normal OTHER 0 NA
ccc1/20 SFU Present Registered Normal OTHER 0 NA
ccc1/21 PWR Present Registered Normal OTHER 0 NA
ccc1/23 FAN Present Registered Normal OTHER 0 NA
ccc1/25 FAN Present Registered Normal OTHER 0 NA
ccc1/26 FAN Present Registered Normal OTHER 0 NA
-----------------------------------------------------------------------------
Chassis ID: clc1
NE5000E-20's Device status:
-------------------------------------------------------------------------------
Slot # Type Online Register Status Role LsId Primary
-------------------------------------------------------------------------------
clc1/1 LPU Present Registered Normal LC 0 NA
clc1/2 LPU Present Registered Normal LC 0 NA
clc1/5 LPU Present Registered Normal LC 0 NA
clc1/13 LPU Present Registered Normal LC 0 NA
clc1/20 LPU Present Registered Normal LC 0 NA
clc1/21 MPU Present Registered Normal MB 0 Master
clc1/22 MPU Present Registered Normal MB 0 Slave
clc1/23 SFU Present Registered Normal OTHER 0 NA
clc1/24 SFU Present Registered Normal OTHER 0 NA
clc1/25 SFU Present Registered Normal OTHER 0 NA
clc1/26 SFU Present Registered Normal OTHER 0 NA
clc1/27 SFU Present Registered Normal OTHER 0 NA
clc1/28 SFU Present Registered Normal OTHER 0 NA
clc1/29 SFU Present Registered Normal OTHER 0 NA
clc1/30 SFU Present Registered Normal OTHER 0 NA
clc1/35 CLK Present Registered Normal OTHER 0 Master
clc1/36 CLK Present Registered Normal OTHER 0 Slave
clc1/37 PWR Present Registered Normal OTHER 0 NA
clc1/39 FAN Present Registered Normal OTHER 0 NA
clc1/40 FAN Present Registered Normal OTHER 0 NA
clc1/41 FAN Present Registered Normal OTHER 0 NA
clc1/42 FAN Present Registered Normal OTHER 0 NA
clc1/43 FAN Present Registered Normal OTHER 0 NA
clc1/44 FAN Present Registered Normal OTHER 0 NA
clc1/45 FAN Present Registered Normal OTHER 0 NA

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clc1/46 FAN Present Registered Normal OTHER 0 NA
clc1/47 FAN Present Registered Normal OTHER 0 NA
clc1/48 FAN Present Registered Normal OTHER 0 NA
clc1/32 CMU Present Registered Normal OTHER 0 Slave
clc1/33 CMU Present Registered Normal OTHER 0 Master
-------------------------------------------------------------------------------
Chassis ID: clc2
NE5000E-20's Device status:
-------------------------------------------------------------------------------
Slot # Type Online Register Status Role LsId Primary
-------------------------------------------------------------------------------
clc2/1 LPU Present Registered Normal LC 0 NA
clc2/2 LPU Present Registered Normal LC 0 NA
clc2/5 LPU Present Registered Normal LC 0 NA
clc2/13 LPU Present Registered Normal LC 0 NA
clc2/20 LPU Present Registered Normal LC 0 NA
clc2/21 MPU Present Registered Normal MB 0 Master
clc2/22 MPU Present Registered Normal MB 0 Slave
clc2/23 SFU Present Registered Normal OTHER 0 NA
clc2/24 SFU Present Registered Normal OTHER 0 NA
clc2/25 SFU Present Registered Normal OTHER 0 NA
clc2/26 SFU Present Registered Normal OTHER 0 NA
clc2/27 SFU Present Registered Normal OTHER 0 NA
clc2/28 SFU Present Registered Normal OTHER 0 NA
clc2/29 SFU Present Registered Normal OTHER 0 NA
clc2/30 SFU Present Registered Normal OTHER 0 NA
clc2/35 CLK Present Registered Normal OTHER 0 Master
clc2/36 CLK Present Registered Normal OTHER 0 Slave
clc2/37 PWR Present Registered Normal OTHER 0 NA
clc2/39 FAN Present Registered Normal OTHER 0 NA
clc2/40 FAN Present Registered Normal OTHER 0 NA
clc2/41 FAN Present Registered Normal OTHER 0 NA
clc2/42 FAN Present Registered Normal OTHER 0 NA
clc2/43 FAN Present Registered Normal OTHER 0 NA
clc2/44 FAN Present Registered Normal OTHER 0 NA
clc2/45 FAN Present Registered Normal OTHER 0 NA
clc2/46 FAN Present Registered Normal OTHER 0 NA
clc2/47 FAN Present Registered Normal OTHER 0 NA
clc2/48 FAN Present Registered Normal OTHER 0 NA
clc2/32 CMU Present Registered Normal OTHER 0 Slave
clc2/33 CMU Present Registered Normal OTHER 0 Master
-------------------------------------------------------------------------------

Step 11 Check whether the services are normal.

----End

Follow-ups

After replacing an SFU, collect the tools. If an SFU that is replaced is confirmed to
be faulty, you should fill in the Offsite Repair Card for Faulty Materials, and send
the card and the faulty SFU to a Huawei local office for timely maintenance.

4.3.3.1.8 Replacing an OFC

This section describes the precaution and procedure for replacing an OFC.

Precaution

Before replacing an OFC, you need to note the following points:

● The OFC supports hot swap.
● Before replacing an OFC, prepare the same OFC.

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Tool
Before replacing an OFC, you need the following tools:
● ESD wrist strap or ESD gloves
● Phillips screwdriver
● ESD bag

Procedure

Step 1 Check the location of the OFC to be replaced.
Before removing the OFC that is to be replaced, you should first check the location
of the OFC, for example, the cabinet and chassis where the OFC resides. Then,
locate the OFC to be replaced in the chassis and attach a label to the panel to
identify the OFC.
Step 2 Check whether there is any bent pin in the connector of the new OFC.
Step 3 Remove the cables from the OFC to be replaced and label the cables to mark the
corresponding interface numbers.
Step 4 Wear the ESD wrist strap and connect the grounding terminal to the ESD jack on
the rack.
Step 5 Power off the OFC to be replaced.
Press and hold the OFL button on the panel of the OFC for six seconds till the
OFFLINE indicator is on. It means that the OFC is powered off.
Step 6 Pull out the cables from the OFC and label the cables to mark the corresponding
interface numbers.
Step 7 Pull out the OFC to be replaced from the chassis.

NO TICE

During the operation, pull out the OFC slowly and smoothly to prevent it from
colliding with the neighboring boards and from causing the failures of the running
boards.
When removing or inserting an OFC, do not touch the components of the OFC.
This is to prevent it from being damaged.

1. Loosen the captive screws counter-clockwise with a Phillips screwdriver, as (1)
shown in Figure 4-336.
2. Turn the ejector levers on the panel of the OFC outward and upward, as (2)
shown in Figure 4-336.
3. Hold the ejector levers on the panel of the OFC and pull out the OFC
smoothly from the chassis along the guide rail of the slot. When part of the
OFC is removed out of the slot, support the OFC with one hand and hold the
OFC panel with the other. Then, remove the OFC completely out of the slot,
as (3) shown in Figure 4-336.
4. Place the OFC that is pulled out into the ESD bag.

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Figure 4-336 Removing an OFC from a chassis

Step 8 Insert a new OFC into the chassis.

NO TICE

During the operation, pull out the OFC slowly and smoothly to prevent it from
colliding with the neighboring boards and from causing the failures of the running
boards.
When removing or inserting an OFC, do not touch the components of the OFC.
This is to prevent it from being damaged.

1. Take out a new OFC from the ESD bag, as shown in Figure 4-337.
2. Support the lower edge of the new OFC with one hand and hold the panel
with the other hand. Then, insert the new OFC smoothly into the chassis
along the guide rail of the slot, as (1) shown in Figure 4-337. Stop sliding the
OFC forward when the ejector levers on the front panel of the OFC touch the
chassis.
3. Turn the ejector levers on the OFC outward and upward to form a 45-degree
angle, and push the OFC into the slot with both hands. Then, turn the ejector
levers inward and downward with both hands till the panel of the OFC
touches the slot, as (2) shown in Figure 4-337.

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4. Turn the Phillips screwdriver clockwise to tighten the captive screws, as (3)
shown in Figure 4-337.

Figure 4-337 Inserting an OFC into the chassis

Step 9 Connect the cables to the corresponding interfaces in the original sequence.

Step 10 Check the running status of the new OFC.

In normal situations, after the new OFC is inserted into the chassis, the OFC
automatically communicates with the MPU. In this case, maintenance personnel
can check the running status of the new OFC in the following ways:

● If the RUN indicator (green) on the panel of the OFC is blinking once every
2s, it indicates that the OFC is running normally.
● You can check the alarms. In normal situations, the system does not generate
any alarm related to the new OFC.
● Run the display device command on the console interface to view the
running status of the new OFC. If the status of the boards corresponding to
slots is displayed as the following black characters, it indicates that the OFC is
running normally.
<HUAWEI> display device ofc-status chassis ccc1
Ofc-status information in chassis ccc1:
--------------------------------------------------------------------------------

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Ofc# Status Type Port_count Init_result Logic_down
--------------------------------------------------------------------------------
ccc1/1/3 Registered OFC100B_CARD 6 SUCCESS SUCCESS
ccc1/2/3 Registered OFC100B_CARD 6 SUCCESS SUCCESS
ccc1/3/3 Registered OFC100B_CARD 6 SUCCESS SUCCESS
ccc1/4/3 Registered OFC100B_CARD 6 SUCCESS SUCCESS
ccc1/5/3 Registered OFC100B_CARD 6 SUCCESS SUCCESS
ccc1/6/3 Registered OFC100B_CARD 6 SUCCESS SUCCESS
ccc1/7/3 Registered OFC100B_CARD 6 SUCCESS SUCCESS
ccc1/8/3 Registered OFC100B_CARD 6 SUCCESS SUCCESS
--------------------------------------------------------------------------------
Step 11 Check whether the services are normal.

----End

Follow-ups
After replacing an OFC, collect the tools. If an OFC that is replaced is confirmed to
be faulty, you should fill in the Offsite Repair Card for Faulty Materials, and send
the card and the faulty OFC to a Huawei local office for timely maintenance.

4.3.3.2 Replacing a CF Card
This section describes the CF card of the device and the procedure for replacing
the CF card.

4.3.3.2.1 Introduction to a CF Card

MPUs of the router has two CF cards numbered CF card 1 and CF card 2.
CF card 1 lies on the circuit board of the MPU and is used to store system files and
configuration files.
CF card 2 lies on the panel of the MPU and is used to store logs and alarms.

NO TICE

Before you replace the MPU or its CF card, delete data from the CF card to prevent
data embezzlement.
Use either of the following methods to delete data from the CF card on an MPU:
● Connect a CF card reader to a PC and then delete data from the CF card on
the PC.
● Physically destroy the CF card.

4.3.3.2.2 Replacing CF Card 1

Context
Before replacing CF card 1, you need to note the following points:
● CF card 1 lies on the circuit board of the MPU, so you must pull out the MPU
before replacing CF card 1.

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● Contents on the new CF card must be consistent with the contents on CF card
1.

Tool
Before replacing CF card 1, you need the following tools:
● ESD wrist strap or ESD glove
● ESD bag
● Phillips screwdriver

Procedure

Step 1 Check the location of the CF card to be replaced.
Before pulling out the CF card that is to be replaced, you should first check the
location of the CF card, for example, the cabinet and chassis where the CF card
resides. Then, locate the MPU on which the CF card needs to be replaced and
attach a label to the panel to identify the MPU.
Step 2 Check whether the MPU on which the CF card needs to be replaced is the master
MPU.
You can view the ACT indicator on the MPU to check whether the MPU is the
master one. If the ACT indicator is on, it means that the MPU is the master one;
otherwise, the MPU is the slave one.
Step 3 (Optional) If the MPU on which the CF card needs to be replaced is the master
one, run the following commands to perform the master/slave switchover.
[~HUAWEI] slave switchover chassis ccc2
Step 4 Power off the MPU on which the CF card needs to be replaced.
Press and hold the OFL button on the panel of the MPU for six seconds till the
OFFLINE indicator is on. It means that the MPU is powered off.
Step 5 Pull out the MPU on which the CF card needs to be replaced and place the MPU
horizontally on the worktable, as (1) shown in Figure 4-338.
Step 6 Press the button on the jack of CF card 1, as (2) shown in Figure 4-338. The CF
card then automatically comes out. Remove the CF card horizontally, as (3) shown
in Figure 4-338.

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Figure 4-338 Schematic diagram of pulling out CF card 1

Step 7 Place the removed CF card in the ESD bag.
Step 8 Insert the new CF card into the slot of CF card 1 of the MPU. Then, push the CF
card in the proper position, as (1) shown in Figure 4-339.
Step 9 Insert the MPU into the chassis, as (2) shown in Figure 4-339.

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Figure 4-339 Schematic diagram of inserting CF card 1

Step 10 Check the running status of the new CF card.
You can check the running status of the new CF card in the following ways:
● You can check the alarms. In normal situations, the system does not generate
any alarm related to the new MPU.
● Run the dir command on the console interface to check whether the new CF
card can be displayed. If the output is displayed as follows, it indicates that
the new CF card runs normally.
<HUAWEI> dir ?
/all List all files
> Redirects the output to a file
>> Append the command output to the end of a file
STRING<1-128> [drive][path][file name]
ccc1/10#cfcard2: Device name
ccc1/10#cfcard: Device name
ccc2/10#cfcard2: Device name
ccc2/10#cfcard: Device name
ccc2/9#cfcard2: Device name
ccc2/9#cfcard: Device name
cfcard2: Device name
cfcard: Device name
clc1/17#cfcard2: Device name
clc1/17#cfcard: Device name
clc1/18#cfcard2: Device name
clc1/18#cfcard: Device name

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clc2/17#cfcard2: Device name
clc2/17#cfcard: Device name
clc2/18#cfcard2: Device name
clc2/18#cfcard: Device name
| Matching output
<cr>
The preceding output also indicates that the new CF card has returned to the
normal state. If the new CF card fails to return to the normal state, you should
contact a Huawei local office for timely technical support.

----End

Follow-up Procedure
After replacing a CF card, collect the tools. If a CF card that is replaced is
confirmed to be faulty, you should fill in the Offsite Repair Card for Faulty
Materials, and send the card and the faulty CF card to a Huawei local office for
timely maintenance.

4.3.3.2.3 Replacing CF Card 2

Precautions
Before replacing CF card 2, you need to note the following points:
● The CF card 2 on the MPU is not hot-swappable. Perform the following
operations before you remove and re-install the CF card 2 when the power is
on:
– Run the close device cfcard2 slot slot-id command to disable the CF card
2. Then, the system displays a message, indicating whether the CF card 2
is hot-swappable.
– Hold down the CF OFL button on the MPU panel until the OFL indicator
is steady on. Then, remove and re-install the CF card 2.
If any of the preceding operations is not performed, the MPU may reset.
● Note the following when you remove and re-install the CF card 2:
– Inserting a damaged CF card 2 into a device may cause the MPU to reset.
– If a CF card 2 is unavailable or unrecognizable by the system after the
card is removed and re-installed, remove the CF card 2, wait 10s, and
then re-install the CF card 2.

Tool
Before replacing CF card 2, you need the following tools:
● ESD wrist strap or ESD glove
● ESD bag

Procedure
Step 1 Check the location of the CF card to be replaced.
Before pulling out the CF card that is to be replaced, you should first check the
location of the CF card, for example, the cabinet and chassis where the CF card

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resides. Then, locate the MPU on which the CF card needs to be replaced in the
chassis and attach a label to the panel to identify the MPU.
Step 2 Disable or power off CF card 2 based on description in Precautions.
Step 3 Open the protective cover on the CF card. Press the button beside the CF card slot,
as (1) shown in Figure 4-340. The CF card then automatically comes out. Remove
the CF card horizontally, as (2) shown in Figure 4-340.

Figure 4-340 Schematic diagram of pulling out CF card 2

Step 4 Place the removed CF card in the ESD bag.
Step 5 Insert the new CF card into the slot of CF card 2 of the MPU. Then, push the CF
card in the proper position, as (2) shown in Figure 4-341. Then, close the
protective cover.

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Figure 4-341 Schematic diagram of inserting CF card 2

Step 6 Check the running status of the new CF card.
You can check the running status of the new CF card in the following ways:
● Check the alarms. In normal situations, the system does not generate any
alarm related to the new MPU.
● Run the dir command on the console interface to check whether the new CF
card can be displayed. If the output is displayed as follows, it indicates that
the new CF card runs normally.
<HUAWEI> dir ?
/all List all files
> Redirects the output to a file
>> Append the command output to the end of a file
STRING<1-128> [drive][path][file name]
ccc1/10#cfcard2: Device name
ccc1/10#cfcard: Device name
ccc2/10#cfcard2: Device name
ccc2/10#cfcard: Device name
ccc2/9#cfcard2: Device name
ccc2/9#cfcard: Device name
cfcard2: Device name
cfcard: Device name
clc1/17#cfcard2: Device name
clc1/17#cfcard: Device name
clc1/18#cfcard2: Device name
clc1/18#cfcard: Device name
clc2/17#cfcard2: Device name
clc2/17#cfcard: Device name
clc2/18#cfcard2: Device name

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clc2/18#cfcard: Device name
| Matching output
<cr>

The preceding output also indicates that the new CF card has returned to the
normal state. If the new CF card fails to return to the normal state, you should
contact a Huawei local office for timely technical support.

----End

Follow-up Procedure

After replacing a CF card, collect the tools. If a CF card that is replaced is
confirmed to be faulty, you should fill in the Offsite Repair Card for Faulty
Materials, and send the card and the faulty CF card to a Huawei local office for
timely maintenance.

4.3.3.3 Replacing a Fan Module

This section describes the fan module of the device and the procedure for
replacing the fan module.

4.3.3.3.1 Introduction to a Fan Module

The fan module meets the ventilation and heat dissipation requirements of the
system and supports hot swapping.

The fan modules of a CCC include front fan modules and rear fan modules. Figure
4-342 and Figure 4-343 show fan module appearances.

Figure 4-342 Front fan module appearance on the NE5000E CCC

Figure 4-343 Rear fan module appearance on the NE5000E CCC

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4.3.3.3.2 Replacing a Front Fan Module of the CCC

Precaution

Before replacing a fan module, you need to note the following points:

● You must spend not more than five minutes in replacing a fan module.
Otherwise, the security and stability of the device is severely affected.
● The CCC has four fan modules; two fan modules reside in the frontal board
cage and the other two fan modules reside in the rear board cage. When
replacing a fan module, make sure that at least one fan module works
normally in the frontal board cage or the rear board cage.
● During the process of pulling out the old fan module, you should first pull out
part of the fan module. After the fans stop rotating, pull out the complete
frame.

NO TICE

Support the fan module while pulling it out, to avoid the physical injury.

Tool
● ESD wrist strap or ESD gloves
● Phillips screwdriver

Procedure

Step 1 Check the location of the fan module to be replaced.

Before pulling out a fan module that is to be replaced, you should first check the
location of the fan module, for example, the cabinet and chassis where the fan
module resides. Then, locate the fan module to be replaced in the chassis and
attach a label to the panel to identify the fan module.

Step 2 Prepare a new fan module. Check the connector and check whether there are
other articles left in the fan module.

Step 3 Wear the ESD wrist strap and connect the grounding terminal to the ESD jack on
the rack.

Step 4 Pull out the fan module to be replaced from the chassis.
1. Horizontally remove the plastic panel with fingers in the holes on both sides
of the panel, as shown in Figure 4-344.
2. Turn the Phillips screwdriver to loosen the captive screws on both ends of the
fan module, as shown in Figure 4-344.
3. Hold the handle on the fan module and draw out part of the fan module, as
shown in Figure 4-344.
4. After the fans stop rotating, support the bottom of the fan module with one
hand and carefully pull out the complete fan module from the chassis.

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Figure 4-344 Schematic diagram of removing a front fan module from the CCC

Step 5 Insert the backup fan module into the chassis.
Hold the handle of the fan module with one hand and support the bottom of the
fan module with the other hand. Then, insert the fan module smoothly and slowly
along the guide rail of the slot till the back of the fan module properly connects
the backplane of the chassis, as shown in Figure 4-345.
Step 6 Turn the Phillips screwdriver to fasten the fan module to the chassis by tightening
the captive screws, as shown in Figure 4-345.
Step 7 After inserting the fan module, hold the grooves at both ends of the panel. Then,
push the plastic panel horizontally, and secure the panel through the set holes on
the chassis, as shown in Figure 4-345.

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Figure 4-345 Schematic diagram of installing a front fan module of the CCC

Step 8 Verify the function of the new fan module.
In normal situations, after the new fan module is inserted into the chassis, the
fans start to operate and meet the ventilation and heat dissipation requirements
of the chassis. In this case, maintenance personnel can check whether the fan
module functions normally in the following ways:
● If the RUN indicator (green) on the panel of the fan module is blinking once
every 2s, it indicates that the fan module runs normally. If the ALM indicator
(red) is on, it indicates that the fan module fails to run normally.
● Run the display fan command on the console interface to view the running
status of the fan module. If the output is displayed as follows, it indicates that
the fan module runs normally.
<HUAWEI> display fan chassis ccc1
Chassis ID : ccc1
Slotid : 23
Present : YES
Registered: YES
Status : MANUAL
FanSpeed : [No.]Speed
[1]100% [2]100% [3]100%
[4]100%
Slotid : 24
Present : YES
Registered: YES

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Status : MANUAL
FanSpeed : [No.]Speed
[1]100% [2]100% [3]100%
[4]100%
Slotid : 25
Present : YES
Registered: YES
Status : MANUAL
FanSpeed : [No.]Speed
[1]100% [2]100%
Slotid : 26
Present : YES
Registered: YES
Status : MANUAL
FanSpeed : [No.]Speed
[1]100% [2]100%

The preceding output also indicates that the fan module has returned to the
normal state. If the fan module fails to return to the normal state, you should
contact a Huawei local office for timely technical support.

----End

Follow-ups

After replacing a fan module, collect the tools. If a fan module that is replaced is
confirmed to be faulty, you should fill in the Offsite Repair Card for Faulty
Materials, and send the card and the faulty fan module to a Huawei local office
for timely maintenance.

4.3.3.3.3 Replacing a Rear Fan Module of the CCC

Precaution

Before replacing a fan module, you need to note the following points:

● You must spend not more than five minutes in replacing a fan module.
Otherwise, the security and stability of the device is severely affected.
● The CCC has four fan modules; two fan modules reside in the frontal board
cage and the other two fan modules reside in the rear board cage. When
replacing a fan module, make sure that at least one fan module works
normally in the frontal board cage or the rear board cage.
● During the process of pulling out the old fan module, you should first pull out
part of the fan module. After the fans stop rotating, pull out the complete
frame.

NO TICE

Support the fan module while pulling it out, to avoid the physical injury.

Tool
● ESD wrist strap or ESD gloves
● Phillips screwdriver

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Procedure

Step 1 Check the location of the fan module to be replaced.
Before pulling out a fan module that is to be replaced, you should first check the
location of the fan module, for example, the cabinet and chassis where the fan
module resides. Then, locate the fan module to be replaced in the chassis and
attach a label to the panel to identify the fan module.
Step 2 Prepare a new fan module. Check the connector and check whether there are
other articles left in the fan module.
Step 3 Wear the ESD wrist strap and connect the grounding terminal to the ESD jack on
the rack.
Step 4 Pull out the fan module to be replaced from the chassis.
1. Turn the Phillips screwdriver to loosen the captive screws on both ends of the
fan module, as (1) shown in Figure 4-346.
2. Hold the handle on the fan module and draw out part of the fan module.
After the fans stop rotating, support the bottom of the fan module with one
hand and carefully pull out the complete fan module from the chassis.as (2)
shown in Figure 4-346.

Figure 4-346 Schematic diagram of removing a rear fan module from the CCC

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Step 5 Insert the backup fan module into the chassis.
Hold the handle of the fan module with one hand and support the bottom of the
fan module with the other hand. Then, insert the fan module smoothly and slowly
along the guide rail of the slot till the back of the fan module properly connects
the backplane of the chassis, as (1) shown in Figure 4-347.
Step 6 Turn the Phillips screwdriver to fasten the fan module to the chassis by tightening
the captive screws, as (2) shown in Figure 4-347.

Figure 4-347 Schematic diagram of installing a rear fan module of the CCC

Step 7 Verify the function of the new fan module.
In normal situations, after the new fan module is inserted into the chassis, the
fans start to operate and meet the ventilation and heat dissipation requirements
of the chassis. In this case, maintenance personnel can check whether the fan
module functions normally in the following ways:
● If the RUN indicator (green) on the panel of the fan module is blinking once
every 2s, it indicates that the fan module runs normally. If the ALM indicator
(red) is on, it indicates that the fan module fails to run normally.
● Run the display fan command on the console interface to view the running
status of the fan module. If the output is displayed as follows, it indicates that
the fan module runs normally.

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<HUAWEI>display fan chassis ccc1
Chassis ID : ccc1
Slotid : 23
Present : YES
Registered: YES
Status : MANUAL
FanSpeed : [No.]Speed
[1]100% [2]100% [3]100%
[4]100%
Slotid : 24
Present : YES
Registered: YES
Status : MANUAL
FanSpeed : [No.]Speed
[1]100% [2]100% [3]100%
[4]100%
Slotid : 25
Present : YES
Registered: YES
Status : MANUAL
FanSpeed : [No.]Speed
[1]100% [2]100%
Slotid : 26
Present : YES
Registered: YES
Status : MANUAL
FanSpeed : [No.]Speed
[1]100% [2]100%

The preceding output also indicates that the fan module has returned to the
normal state. If the fan module fails to return to the normal state, you should
contact a Huawei local office for timely technical support.

----End

Follow-ups

After replacing a fan module, collect the tools. If a fan module that is replaced is
confirmed to be faulty, you should fill in the Offsite Repair Card for Faulty
Materials, and send the card and the faulty fan module to a Huawei local office
for timely maintenance.

4.3.3.4 Replacing an Air Filter

This section describes the air filter of the device and the procedure for replacing
the air filter.

4.3.3.4.1 Replacing an Air Filter of the CCC

Precaution

To ensure good heat dissipation and ventilation for the system and to prevent the
accumulation of dust on an air filter, you need to clean the air filter regularly. It is
recommended that an air filter be cleaned at least once every three months and
be replaced once every year. When an air filter is placed in the dusty environment,
the air filter should be cleaned more frequently.

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Tool
● ESD wrist strap or ESD gloves
● Phillips screwdriver

Procedure

Step 1 Check the location of the air filter to be replaced.
Before pulling out an air filter that is to be replaced, maintenance personnel
should first check the location of the air filter, for example, the cabinet and chassis
where the air filter resides. Then, locate the air filter to be replaced in the chassis
and attach a label to the panel to identify the air filter.
Step 2 Wear the ESD wrist strap and connect the grounding terminal to the ESD jack on
the rack.
Step 3 Remove the air filter from the air intake frame.
1. Pull out the panel of the air intake frame (panel of the power module)
horizontally with fingers in the holes at both sides of the panel. In this
manner, the panel is removed, as (1) shown in Figure 4-348.
2. Loosen the captive screws on both ends of the air filter counter-clockwise
with a Phillips screwdriver, as (2) shown in Figure 4-348.
3. Hold the captive screws and pull out the air filter, as (3) shown in Figure
4-348.

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Figure 4-348 Schematic diagram of removing an air filter of the CCC

Step 4 Install the air filter to the air intake frame.
1. Insert the clean and dry air filter into the chassis, as (1) shown in Figure
4-349.
2. Tighten the captive screws on both ends of the air filter with a Phillips
screwdriver, as (2) shown in Figure 4-349.
3. Install the panel of the air intake frame (panel of the power module) to its
original position, as (3) shown in Figure 4-349.

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Figure 4-349 Schematic diagram of installing an air filter of the CCC

----End

Follow-ups
After replacing an air filter, collect the tools. Dispose of an air filter that is
replaced according to the compliance and safety standards.

4.3.3.5 Replacing a Power Module
This section describes the power module of the device and the procedure for
replacing the power module.

4.3.3.5.1 Introduction to a Power Module

Appearance
Figure 4-350 shows the DC power module appearances of the NE5000E CCC.

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Figure 4-350 NE5000E CCC DC Appearance of a power module

4.3.3.5.2 Replacing the Power Module of the NE5000E CCC
This section describes the power module of the device and the procedure for
replacing the power module.

Context
Before replacing a power module, you need to note the following points:
● Before replacing a power module, you must switch off the corresponding
circuit breaker on the power distribution cabinet. Thus, the power module to
be replaced is powered off. In addition, the power module to be replaced
must be switched off.
● The NE5000E CCC has two power modules. Do not power off the other during
the process of removing one power module.
NO TE

Replacing a DC power module is used as an example.

Tool
Before replacing a power module, you need the following tools:
● ESD wrist strap or ESD glove
● Phillips screwdriver

Procedure

Step 1 Check the location of the power module to be replaced.
Before pulling out a power module that is to be replaced, you should first check
the location of the module, for example, the cabinet and chassis where the power
module resides. Then, locate the power module to be replaced in the chassis and
attach a label to the panel to identify the power module.
Step 2 Switch off the corresponding circuit breaker on the power distribution cabinet.
Thus, the power module to be replaced is powered off. In addition, the power
module to be replaced must be switched off.
Step 3 Wear the ESD wrist strap and connect the grounding terminal to the ESD jack on
the rack.

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Step 4 Hold the plastic panel of the power module and pull it out horizontally. In this
manner, the plastic panel is removed, as (1) shown in Figure 4-351.
Step 5 Remove the cables from the power module to be replaced and label the cables to
mark the corresponding interface numbers.
Step 6 Pull out the power module to be replaced from the chassis.
1. Turn the Phillips screwdriver to loosen the captive screws on both sides of the
power module, as (2) shown in Figure 4-351.
2. Hold the handle of the power module and pull out the module. Support the
bottom of the power module with the other hand and slowly pull out the
complete module from the chassis, as (3) shown in Figure 4-351.

Figure 4-351 Removing a power module

Step 7 Insert the backup power module into the chassis.
Hold the handle of the power module with one hand and support the bottom with
the other hand. Then, insert the power module smoothly and slowly along the
guide rail of the slot till the back of the module is connected properly to the
backplane of the chassis, as (1) shown in Figure 4-352.

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Step 8 Turn the Phillips screwdriver to fasten the power module to the chassis by
tightening the captive screws, as (2) shown in Figure 4-352.

Step 9 Connect the cables to the new power module in the original sequence.

Step 10 Place all the locking blades on the plastic panel of the power module facing the
installation holes in the power frame of the chassis, and then flap the panel until
it is installed in position, as (3) shown in Figure 4-352.

Figure 4-352 Inserting a power module

Step 11 Verify the functions of the new power module.

After inserting the power module into the chassis, switch on the circuit breaker on
the power distribution cabinet and then switch on the power module. Then, you
can verify the functions of the new power module in the following ways:

● If the indicator on the panel of the power module is on and is green, it
indicates that the power module runs normally. If the indicator is red, it
indicates that the power module fails to run normally.

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● Run the display device command on the console interface to check the
running status of the new power module. If the output is displayed as follows,
it indicates that the power module runs normally.
The preceding output also indicates that the power module has returned to the
normal state. If the fan module fails to return to the normal state, you should
contact a Huawei local office for timely technical support.

----End

Follow-up Procedure
After replacing the power module, collect the tools. If a power module that is
replaced is confirmed to be faulty, you should fill in the Offsite Repair Card for
Faulty Materials, and send the card and the faulty power module to a Huawei
local office for timely maintenance.
4.3.4 Replacing Parts of the NE5000E-X16A/X16B
This chapter describes the precaution and procedure for replacing boards, CF card,
optical module, fan module, air filter, power module, filtering box, and centralized
monitoring unit.

4.3.4.1 Replacing Boards
This chapter describes the precaution and procedure for replacing the MPU, the
SFU, the Common LPU, and the FPIC.

4.3.4.1.1 Overview of Boards
This section describes the mechanical specifications and the procedure for
installing the boards.

Mechanical Specifications of Boards

Mechanical Specifications of Boards
The boards of the NE5000E are of the plug-in type and consists of a circuit board,
connectors, a front panel, ejector levers, captive screws, and a bolt, as shown in
Figure 4-353.

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Figure 4-353 Schematic diagram of a common LPU

1.Captive screw 2. Ejector lever 3. Connector 4. Bolt

Installation of Boards

NO TICE
Before installing a board, check whether the there are any damaged pin holes on
the board connector. If some pin holes are damaged, do not insert the board in
the chassis. In addition, do not insert any other boards in the corresponding slot
unless it is examined and repaired.

Installation of Boards
Figure 4-354 shows the installation of boards.

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Figure 4-354 Schematic diagram of installing boards

1. Connector 2. Backplane

4.3.4.1.2 Introduction to Boards
This section describes the types and layout of boards on the NE5000E.

Types of Boards

The NE5000E-X16A supports the following types of boards:
● MPU
● SFU
● LPU

NE5000E-X16A Layout of Boards
Figure 4-355 shows the slot layout on the NE5000E-X16A/X16B.

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Figure 4-355 Slot layout on the NE5000E-X16A/X16B

Table 4-85 describes the slot layout on the NE5000E-X16A/X16B.

Table 4-85 Board distribution in the board cage of the NE5000E-X16A/X16B

Slot Number Quantity Remarks

1 to 16 16 These slots hold LPUs.

17 to 18 2 These slots hold MPUs that work in 1:1 backup
mode.

19 to 22 4 These slots hold SFUs that work in 3+1 load
balancing mode.

4.3.4.1.3 Replacing an MPU
This section describes the precaution and procedure for replacing an MPU.

Context
Before replacing a Main Processing Unit (MPU), you need to note the following
points:

● When the system is running, you can replace only the slave MPU.
● If you need to replace the master MPU, you must first perform the master/
slave switchover to enable the master MPU to become the slave one.

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● The system software package and configuration file in the new MPU must be
consistent with those in the MPU to be replaced.

Tool
Before replacing an MPU, you need the following tools:
● ESD wrist strap or ESD glove
● Phillips screwdriver
● ESD bag

Procedure

Step 1 Check the version of the running software package.
Run the display version command to check the version of the running software
package.
Step 2 Prepare a new MPU and check whether there is any bent pin in the connector.
Step 3 Check the location of the MPU to be replaced.
Before pulling out an MPU that is to be replaced, you should first determine the
location of the MPU, for example, the cabinet, chassis, and slot where the MPU
resides. The device has two MPUs. The MPUs of the device reside in slots 17 and
18. Locate the MPU to be replaced in the chassis and attach a label to identify the
MPU.
Step 4 Check whether the MPU to be replaced is the master MPU.
Run the display device command to check the slot number of the current MPU. If
the MPU to be replaced is the master one, you must run the slave
switchovercommand on the console interface to forcibly perform the master/slave
switchover. If you can log in to the device by using the slave MPU, it indicates that
the switchover is successful. Then, run the display device command to check the
slot number of the MPU after the master/slave switchover.

[~HUAWEI] slave switchover
Step 5 Remove the cables from the MPU and label the cables.
Step 6 Power off the MPU to be replaced.
Press and hold the OFL button on the panel of the MPU for six seconds till the
OFFLINE indicator is on. It means that the MPU is powered off.
Step 7 Pull out the MPU to be replaced from the chassis.
1. Wear the ESD wrist strap and connect the grounding terminal to the ESD jack
on the rack.
2. Turn the Phillips screwdriver counter-clockwise to loosen the captive screws
on the board, as (1) shown in Figure 4-356.
3. Turn the ejector levers on the panel of the MPU outward and upward, as (2)
shown in Figure 4-356.
4. Hold the ejector levers on the panel of the MPU and pull out the MPU
smoothly from the chassis along the guide rail of the slot. When part of the
MPU is removed out of the slot, support the MPU with one hand and hold the

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MPU panel with the other. Then, remove the MPU completely out of the slot,
as (3) shown in Figure 4-356.

NO TICE

– During the operation, pull out the MPU slowly and smoothly to prevent it
from colliding with the neighboring boards and from causing the failure of
the running boards.
– When swapping an MPU, do not touch the parts on the MPU. This is to
prevent it from being damaged.

5. Place the MPU that is removed in the ESD bag.

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Figure 4-356 Schematic diagram of removing an MPU

Step 8 Insert the new MPU into the chassis.
1. Take out the new MPU from the ESD bag.

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NO TICE

– During the operation, pull out the MPU slowly and smoothly to prevent it
from colliding with the neighboring boards and from causing the failure of
the running boards.
– When swapping an MPU, do not touch the parts on the MPU. This is to
prevent it from being damaged.

2. Support the lower edge of the new MPU with one hand and hold the panel
with the other hand. Then, insert the new MPU smoothly into the chassis
along the guide rail of the slot. Stop sliding the MPU forward when the
ejector levers on the front panel of the MPU touch the chassis, as (2) shown
in Figure 4-357.
3. Turn the ejector levers on the MPU outward and upward to form a 45-degree
angle, and at the same time push the MPU into the slot. Then, turn the
ejector levers inward and downward till the panel of the MPU touches the
slot, as (3) shown in Figure 4-357.
4. Turn the Phillips screwdriver clockwise to tighten the captive screws, as (4)
shown in Figure 4-357.

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Figure 4-357 Schematic diagram of inserting an MPU

Step 9 Check the running status of the new MPU.

In normal situations, after the new MPU is inserted into the chassis, the MPU
automatically communicates with the boards in the chassis. In this case, you can
check the running status of the new MPU in the following ways:
● If the RUN indicator (green) on the panel of the MPU is blinking once every
2s, it indicates that the MPU is running normally.

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● Check the alarms. In normal situations, the system does not generate any
alarm related to the new MPU.
● Run the display device command on the console interface to view the
running status of the new MPU.

----End

Follow-up Procedure
After replacing an MPU, collect the tools. If an MPUthat is replaced is confirmed
to be faulty, you should fill in the Offsite Repair Card for Faulty Materials, and
send the card and the faulty MPUto a Huawei local office for timely maintenance.

NO TICE

When replacing the main control board or CF card, you are advised to delete the
data in the old main control board's CF card to prevent data theft. You can use
either of the following methods:
● Use a card reader to connect the CF card to a PC, delete the data in the CF
card, and then recycle the old CF card.
● Physically destroy the old CF card.

4.3.4.1.4 Replacing the SFU of the NE5000E-X16A/X16B
This section describes the precaution and procedure for replacing an SFU.

Context
Before replacing a Switch Fabric Unit (SFU), you need to note the following points:
● SFUs of HUAWEI NetEngine5000E-X16A/X16B are in 3+1 backup mode, so
only one SFU can be replaced at a time when the system is running.
● If you need to replace multiple SFUs, you must replace one SFU first. After the
new SFU is inserted and runs normally, you can then replace the other SFUs.

Tool
Before replacing an SFU, you need the following tools:
● ESD wrist strap or ESD glove
● Phillips screwdriver
● ESD bag

Procedure

Step 1 Check the location of the SFU to be replaced.
Before pulling out an SFU that is to be replaced, you should first determine the
location of the SFU, for example, the cabinet, chassis, and slot where the SFU
resides.The HUAWEI NetEngine5000E-X16A/X16B has four SFUs in slots 19, 20, 21,
and 22 separately.

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Locate the SFU to be replaced in the chassis and attach a label to identify the SFU.
Step 2 Prepare a new SFU and check whether there is any bent pin in the connector.
Step 3 Power off the SFU to be replaced.
Press and hold the OFL button on the panel of the SFU for six seconds till the
OFFLINE indicator is on. It means that the SFU is powered off.
Step 4 Pull out the SFU to be replaced from the chassis.

NO TE

● Before installing an SFU, ensure that ejector levers are available for use.
● After installing an SFU, remove the ejector levers from the SFU and attach them on the
cabinet or chassis for future use.

NO TICE

● During the operation, pull out the SFU slowly and smoothly to prevent it from
colliding with the neighboring boards and from causing the failure of the
running boards.
● When swapping an SFU, do not touch the parts on the SFU. This is to prevent it
from being damaged.
● Do not use ejector levers to lift a board.
● Use both ejector levers when pushing or pulling a board. Never use only one.

1. Wear the ESD wrist strap and connect the grounding terminal to the ESD jack
on the rack.
2. Press down the elastomer fasteners on the ejector levers and insert them into
ejector lever connectors on the SFU. as 1 and 2 shown in Figure 4-358.
3. Loosen the captive screws counter-clockwise with a Phillips screwdriver, as 3
shown in Figure 4-358.
4. Turn the ejector levers on the panel of the SFU outward and upward, as 4
shown in Figure 4-358.
5. Hold the ejector levers on the panel of the SFU and pull out the SFU
smoothly from the chassis along the guide rail of the slot. When part of the
SFU is removed out of the slot, support the SFU with one hand and hold the
SFU panel with the other. Then, remove the SFU completely out of the slot, as
5 shown in Figure 4-358.
6. Press down the elastomer fasteners on the ejector levers and remove them
from the SFU. as 6 and 7 shown in Figure 4-358.
7. Place the SFU that is pulled out in the ESD-preventative bag.

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Figure 4-358 Schematic diagram of removing an SFU

Step 5 Insert the new SFU into the chassis.

NO TICE

● During the operation, pull out the SFU slowly and smoothly to prevent it from
colliding with the neighboring boards and from causing the failure of the
running boards.
● When swapping an SFU, do not touch the parts on the SFU. This is to prevent it
from being damaged.

1. Take out the new SFU from the ESD bag.
2. Support the lower edge of the new SFU with one hand and hold the panel
with the other hand. Then, insert the new SFU smoothly into the chassis
along the guide rail of the slot, as 1 shown in Figure 4-359.
3. Press down the elastomer fasteners on the ejector levers and insert them into
ejector lever connectors on the SFU. as 2 and 3 shown in Figure 4-359.

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4. Turn the ejector levers on the SFU outward and upward to form a 45-degree
angle, and at the same time push the SFU into the slot. Then, turn the ejector
levers inward and downward till the panel of the SFU touches the slot, as 4
shown in Figure 4-359.
5. Turn the Phillips screwdriver clockwise to tighten the captive screws, as 5
shown in Figure 4-359.
6. Press down the elastomer fasteners on the ejector levers and remove them
from the SFU. See 6 and 7 in Figure 4-359.

Figure 4-359 Schematic diagram of inserting the new SFU into the chassis

Step 6 Check the running status of the new SFU.

In normal situations, after the new SFU is inserted into the chassis, the SFU
automatically communicates with the boards in the chassis. In this case, you can
check the running status of the new SFU in the following ways:
● If the RUN indicator (green) on the panel of the SFU is blinking once every 2s,
it indicates that the SFU is running normally.

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● Check the alarms. In normal situations, the system does not generate any
alarm related to the new SFU.
● Run the display device command on the console interface to view the
running status of the new SFU. If the output is displayed as follows, it
indicates that the SFUs are running normally.
Step 7 Check service operations.

----End

Follow-up Procedure
After replacing an SFU, collect the tools. If an SFU that is replaced is confirmed to
be faulty, you should fill in the Offsite Repair Card for Faulty Materials, and send
the card and the faulty SFU to a Huawei local office for timely maintenance.

4.3.4.1.5 Replacing a Common LPU
This section describes the precaution and procedure for replacing a common LPU.

Context
Before replacing a common LPU, you need to note the following points:
● Before replacing a common LPU, prepare a same LPU. The interfaces on the
prepared LPU should have the same numbers as the LPU to be replaced.

Tool
Before replacing a common LPU, you need the following tools:
● ESD wrist strap or ESD glove
● Phillips screwdriver
● ESD bag

Procedure

Step 1 Check the location of the LPU to be replaced.
Before pulling out an LPU that is to be replaced, you should first check the
location of the LPU, for example, the cabinet, chassis, and slot where the LPU
resides. The NE5000E has 16 LPU slots numbered from 1 to 16.
Locate the LPU to be replaced in the chassis and attach a label to identify the LPU.
Step 2 Check whether there is any bent pin in the connector of the new LPU.
Step 3 Power off the LPU to be replaced.
Press and hold the OFL button on the panel of the LPU for six seconds till the
OFFLINE indicator is on. It means that the LPU is powered off.
Step 4 Remove the cables from the LPU and label the cables to mark the corresponding
interface numbers.
Step 5 Pull out the LPU to be replaced from the chassis.

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1. Wear the ESD wrist strap and connect the grounding terminal to the ESD jack
on the rack.
2. Loosen the captive screws counter-clockwise with a Phillips screwdriver, as (1)
shown in Figure 4-360.
3. Turn the ejector levers on the panel of the LPU outward and upward, as (2)
shown in Figure 4-360.

NO TICE

– During the operation, pull out the LPU slowly and smoothly to prevent it
from colliding with the neighboring boards and from causing the failure of
the running boards.
– When swapping an LPU, do not touch the parts on the LPU. This is to
prevent it from being damaged.

4. Hold the ejector levers on the panel of the LPU and pull out the LPU
smoothly from the chassis along the guide rail of the slot. When part of the
LPU is removed out of the slot, support the LPU with one hand and hold the
LPU panel with the other. Then, remove the LPU completely out of the slot, as
(3) shown in Figure 4-360.
5. Place the LPU that is pulled out in the ESD bag.

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Figure 4-360 Pulling out a common LPU from a chassis

Step 6 Insert the new LPU into the chassis.
1. Take out the new LPU from the ESD bag.

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NO TICE

– During the operation, pull out the LPU slowly and smoothly to prevent it
from colliding with the neighboring boards and from causing the failure of
the running boards.
– When swapping an LPU, do not touch the parts on the LPU. This is to
prevent it from being damaged.

2. Support the lower edge of the new LPU with one hand and hold the panel
with the other hand. Then, insert the new LPU smoothly into the chassis
along the guide rail of the slot. Stop sliding the LPU forward when the ejector
lever on the front panel of the LPU reaches the chassis, as (1) shown in
Figure 4-361.
3. Turn the ejector levers on the LPU outward and upward to form a 45-degree
angle, and at the same time push the LPU into the slot. Then, turn the ejector
levers inward and downward till the panel of the LPU touches the frame, as
(2) shown in Figure 4-361.
4. Turn the Phillips screwdriver clockwise to tighten the captive screws, as (3)
shown in Figure 4-361.

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Figure 4-361 Insert a common LPU into a chassis

Step 7 Connect the cables to the corresponding interfaces in the original sequence.
Step 8 Check the running status of the new LPU.
In normal situations, after the new LPU is inserted into the chassis, the LPU
automatically communicates with the MPU. In this case, you can check the
running status of the new LPU in the following ways:

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● If the RUN indicator (green) on the panel of the LPU is blinking once every 2s,
it indicates that the LPU is running normally.
● Check the alarms. In normal situations, the system does not generate any
alarm related to the new LPU.
● Run the display device command on the console interface to view the
running status of the new LPU. If the output is displayed as follows, it
indicates that the LPUs in the corresponding slots are running normally.

Step 9 Check service operations.

----End

Follow-up Procedure
After replacing an LPU, collect the tools. If the LPU that is replaced is confirmed to
be faulty, you should fill in the Offsite Repair Card for Faulty Materials, and send
the card and the faulty LPU to a Huawei local office for timely maintenance.

4.3.4.1.6 Replacing an FPIC
This section describes the precautions and procedures for replacing an FPIC.

Context
Before replacing an FPIC, you need to note the following points:

● Prepare a same FPIC as the one to be replaced.
● Do not power off the LPU where an FPIC to be replaced resides because all
FPICs support hot swap.
● Before installing two half-width subcards, remove two redundant guide rails
from the LPU and keep them properly.

Tool
Before replacing an FPIC, you need the following tools:

● ESD wrist strap or ESD gloves
● Phillips screwdriver
● ESD bag

Procedure

Step 1 Check the location of the FPIC to be replaced.

Before pulling out an FPIC to be replaced, you should first check the location of
the FPIC, for example, the cabinet, chassis, and slot where the FPIC resides. Then,
locate the FPIC to be replaced in the chassis and attach a label to identify the
FPIC.

Step 2 Check whether there is any bent pin in the connector of the new FPIC.

Step 3 Pull out the cables from the FPIC and label the cables to mark the corresponding
interface numbers.

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Step 4 Pull out the FPIC to be replaced from the LPU.
1. Wear the ESD wrist strap and connect the ground terminal to the ESD jack on
the rack.
2. Turn the Phillips screwdriver counter-clockwise to loosen the captive screws,
as (1) shown in Figure 4-362.
3. Hold the handle of the FPIC and pull out the FPIC, as (2) shown in Figure
4-362.

NO TICE

– During the operation, pull out the LPU slowly and smoothly to prevent it
from colliding with the neighboring boards and from interrupting other
running boards.
– When removing an LPU, do not touch the parts on it to avoid damages to
the LPU.

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Figure 4-362 Pulling out an FPIC from the LPU

4. Place the removed FPIC into the ESD bag.
Step 5 Insert a new FPIC into the LPU.
1. Take out the new FPIC from the ESD bag.

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NO TICE

– During the operation, pull out the LPU slowly and smoothly to prevent it
from colliding with the neighboring boards and from interrupting other
running boards.
– When removing an LPU, do not touch the parts on it to avoid damages to
the LPU.

2. Hold the handle of the FPIC, and insert the FPIC smoothly along the guide
rails of the slot till the FPIC is completely seated in the slot, as (1) shown in
Figure 4-363.
3. Turn the Phillips screwdriver clockwise to tighten the captive screws, as (2)
shown in Figure 4-363.

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Figure 4-363 Inserting an FPIC into the LPU

Step 6 Connect the cables to the corresponding interfaces in the original sequence.

Step 7 Check the running status of the new FPIC.

Check the running status of the new FPIC in the following ways:
● If the RUN indicator (green) on the panel of the FPIC is blinking once every
2s, it indicates that the FPIC is running normally.
● Check the alarms. In normal situations, the system does not generate any
alarm related to the new FPIC.

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● Run the display device command on the console interface to view the
running status of LPUs. If the output is displayed as follows, it indicates that
the LPUs in the corresponding slots are running normally.
<HUAWEI> display device chassis clc1
Chassis ID: clc1
NE5000E-CCC-A's Device status:
-----------------------------------------------------------------------------
Slot # Type Online Register Status Role LrId Primary
-----------------------------------------------------------------------------
clc1/1 LPU Present Registered Normal LC 0 NA
clc1/5 LPU Present Registered Normal LC 0 NA
clc1/7 LPU Present Registered Normal LC 0 NA
clc1/17 MPU Present Registered Normal MB 0 Master
clc1/18 MPU Present Registered Normal MB 0 Slave
clc1/19 SFU Present Registered Normal OTHER 0 NA
clc1/20 SFU Present Registered Normal OTHER 0 NA
clc1/21 SFU Present Registered Normal OTHER 0 NA
clc1/22 SFU Present Registered Normal OTHER 0 NA
clc1/23 CLK Present Registered Normal OTHER 0 Master
clc1/24 CLK Present Registered Normal OTHER 0 Slave
clc1/25 PWR Present Registered Normal OTHER 0 NA
clc1/26 PWR Present Registered Normal OTHER 0 NA
clc1/27 FAN Present Registered Normal OTHER 0 NA
clc1/28 FAN Present Registered Normal OTHER 0 NA
clc1/29 FAN Present Registered Normal OTHER 0 NA
clc1/30 FAN Present Registered Normal OTHER 0 NA
-----------------------------------------------------------------------------
● Run the display device pic-status command on the console interface to view
the running status of FPICs. If the output is displayed as follows, it indicates
that the FPICs on the corresponding LPUs are running normally.
<HUAWEI> display device pic-status chassis clc1
Pic-status information in chassis clc1:
------------------------------------------------------------------------------
Pic# Status Type Port_count Init_result Logic_down
------------------------------------------------------------------------------
1/1/0 Registered POS_4X2.5G_CARD 4 SUCCESS SUCCESS
1/1/1 Registered POS_4X2.5G_CARD 4 SUCCESS SUCCESS
1/5/0 Registered LAN_WAN_5x10GX_CARD 5 SUCCESS SUCCESS
1/7/0 Registered ETH_10XGE_CARD 10 SUCCESS SUCCESS
1/7/1 Registered ETH_10XGE_CARD 10 SUCCESS SUCCESS
------------------------------------------------------------------------------

Step 8 Check whether services are normal.

----End

Follow-up Procedure

After replacing an FPIC, collect the tools. If an FPIC that is replaced is confirmed to
be faulty, you should fill in the Offsite Repair Card for Faulty Materials and send
the faulty FPIC together with the card to the Huawei local office for timely repair.

4.3.4.2 Replacing a CF Card

This section describes the CF card of the device and the procedure for replacing
the CF card.

4.3.4.2.1 Introduction to a CF Card

MPUs of the router has two CF cards numbered CF card 1 and CF card 2.

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CF card 1 lies on the circuit board of the MPU and is used to store system files and
configuration files.
CF card 2 lies on the panel of the MPU and is used to store logs and alarms.

NO TICE

Before you replace the MPU or its CF card, delete data from the CF card to prevent
data embezzlement.
Use either of the following methods to delete data from the CF card on an MPU:
● Connect a CF card reader to a PC and then delete data from the CF card on
the PC.
● Physically destroy the CF card.

4.3.4.2.2 Replacing CF Card 1

Context
Before replacing CF card 1, you need to note the following points:
● CF card 1 lies on the circuit board of the MPU, so you must pull out the MPU
before replacing CF card 1.
● Contents on the new CF card must be consistent with the contents on CF card
1.

Tool
Before replacing CF card 1, you need the following tools:
● ESD wrist strap or ESD glove
● ESD bag
● Phillips screwdriver

Procedure

Step 1 Check the location of the CF card to be replaced.
Before pulling out the CF card that is to be replaced, you should first check the
location of the CF card, for example, the cabinet and chassis where the CF card
resides. Then, locate the MPU on which the CF card needs to be replaced and
attach a label to the panel to identify the MPU.
Step 2 Check whether the MPU on which the CF card needs to be replaced is the master
MPU.
You can view the ACT indicator on the MPU to check whether the MPU is the
master one. If the ACT indicator is on, it means that the MPU is the master one;
otherwise, the MPU is the slave one.
Step 3 (Optional) If the MPU on which the CF card needs to be replaced is the master
one, run the following commands to perform the master/slave switchover.

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[~HUAWEI] slave switchover chassis clc1
Step 4 Power off the MPU on which the CF card needs to be replaced.
Press and hold the OFL button on the panel of the MPU for six seconds till the
OFFLINE indicator is on. It means that the MPU is powered off.
Step 5 Pull out the MPU on which the CF card needs to be replaced and place the MPU
horizontally on the worktable, as (1) shown in Figure 4-364.
Step 6 Press the button on the jack of CF card 1, as (2) shown in Figure 4-364. The CF
card then automatically comes out. Remove the CF card horizontally, as (3) shown
in Figure 4-364.

Figure 4-364 Schematic diagram of pulling out CF card 1

Step 7 Place the removed CF card in the ESD bag.
Step 8 Insert the new CF card into the slot of CF card 1 of the MPU. Then, push the CF
card in the proper position, as (1) shown in Figure 4-365.
Step 9 Insert the MPU into the chassis, as (2) shown in Figure 4-365.

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Figure 4-365 Schematic diagram of inserting CF card 1

Step 10 Check the running status of the new CF card.
You can check the running status of the new CF card in the following ways:
● You can check the alarms. In normal situations, the system does not generate
any alarm related to the new MPU.
● Run the dir command on the console interface to check whether the new CF
card can be displayed. If the output is displayed as follows, it indicates that
the new CF card runs normally.
<HUAWEI> dir ?
/all List all files
> Redirects the output to a file
>> Append the command output to the end of a file
STRING<1-128> [drive][path][file name]
ccc1/10#cfcard2: Device name
ccc1/10#cfcard: Device name
ccc2/10#cfcard2: Device name
ccc2/10#cfcard: Device name
ccc2/9#cfcard2: Device name
ccc2/9#cfcard: Device name
cfcard2: Device name
cfcard: Device name
clc1/17#cfcard2: Device name
clc1/17#cfcard: Device name
clc1/18#cfcard2: Device name
clc1/18#cfcard: Device name

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clc2/17#cfcard2: Device name
clc2/17#cfcard: Device name
clc2/18#cfcard2: Device name
clc2/18#cfcard: Device name
| Matching output
<cr>
The preceding output also indicates that the new CF card has returned to the
normal state. If the new CF card fails to return to the normal state, you should
contact a Huawei local office for timely technical support.

----End

Follow-up Procedure
After replacing a CF card, collect the tools. If a CF card that is replaced is
confirmed to be faulty, you should fill in the Offsite Repair Card for Faulty
Materials, and send the card and the faulty CF card to a Huawei local office for
timely maintenance.

4.3.4.2.3 Replacing CF Card 2

Precautions
Before replacing CF card 2, you need to note the following points:
● The CF card 2 on the MPU is not hot-swappable. Perform the following
operations before you remove and re-install the CF card 2 when the power is
on:
– Run the close device cfcard2 slot slot-id command to disable the CF card
2. Then, the system displays a message, indicating whether the CF card 2
is hot-swappable.
– Hold down the CF OFL button on the MPU panel until the OFL indicator
is steady on. Then, remove and re-install the CF card 2.
If any of the preceding operations is not performed, the MPU may reset.
● Note the following when you remove and re-install the CF card 2:
– Inserting a damaged CF card 2 into a device may cause the MPU to reset.
– If a CF card 2 is unavailable or unrecognizable by the system after the
card is removed and re-installed, remove the CF card 2, wait 10s, and
then re-install the CF card 2.

Tool
Before replacing CF card 2, you need the following tools:
● ESD wrist strap or ESD glove
● ESD bag

Procedure
Step 1 Check the location of the CF card to be replaced.
Before pulling out the CF card that is to be replaced, you should first check the
location of the CF card, for example, the cabinet and chassis where the CF card

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resides. Then, locate the MPU on which the CF card needs to be replaced in the
chassis and attach a label to the panel to identify the MPU.

Step 2 Disable or power off CF card 2 based on description in Precautions.

Step 3 Press the button beside the CF card slot, as (1) shown in Figure 4-366. The CF
card then automatically comes out. Remove the CF card horizontally, as (2) shown
in Figure 4-366.

Figure 4-366 Schematic diagram of pulling out CF card 2

Step 4 Place the removed CF card in the ESD bag.

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Step 5 Insert the new CF card into the slot of CF card 2 of the MPU. Then, push the CF
card in the proper position, as (2) shown in Figure 4-367. Then, close the
protective cover.

Figure 4-367 Schematic diagram of inserting CF card 2

Step 6 Check the running status of the new CF card.

You can check the running status of the new CF card in the following ways:

● Check the alarms. In normal situations, the system does not generate any
alarm related to the new MPU.

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● Run the dir command on the console interface to check whether the new CF
card can be displayed. If the output is displayed as follows, it indicates that
the new CF card runs normally.
<HUAWEI> dir ?
/all List all files
> Redirects the output to a file
>> Append the command output to the end of a file
STRING<1-128> [drive][path][file name]
ccc1/10#cfcard2: Device name
ccc1/10#cfcard: Device name
ccc2/10#cfcard2: Device name
ccc2/10#cfcard: Device name
ccc2/9#cfcard2: Device name
ccc2/9#cfcard: Device name
cfcard2: Device name
cfcard: Device name
clc1/17#cfcard2: Device name
clc1/17#cfcard: Device name
clc1/18#cfcard2: Device name
clc1/18#cfcard: Device name
clc2/17#cfcard2: Device name
clc2/17#cfcard: Device name
clc2/18#cfcard2: Device name
clc2/18#cfcard: Device name
| Matching output
<cr>

The preceding output also indicates that the new CF card has returned to the
normal state. If the new CF card fails to return to the normal state, you should
contact a Huawei local office for timely technical support.

----End

Follow-up Procedure

After replacing a CF card, collect the tools. If a CF card that is replaced is
confirmed to be faulty, you should fill in the Offsite Repair Card for Faulty
Materials, and send the card and the faulty CF card to a Huawei local office for
timely maintenance.

4.3.4.3 Replacing the SSD

Context

The MPUB provides the Solid State Disk (SSD) as the mass storage device to store
data files.

Precautions

Before removing the SSD, note the following issues:
● As the SSD is located on the MPU circuit board, remove the MPU first.
● Contents on the new SSD must be consistent with those on the old one.

Tool

Before replacing the SSD, you need the following tools:

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● ESD wrist strap or ESD glove
● ESD bag

Procedure

Step 1 Check the location of the old SSD.

Before removing the old SSD, first check its location, for example, the cabinet and
chassis where it resides. Then locate the MPU where the old SSD resides in the
chassis and attach a label to the panel to identify the MPU.

Step 2 Check whether the MPU where the old SSD resides is the master one.

You can view the ACT indicator on the MPU to check whether the MPU is the
master one. If the ACT indicator is on, it means that the MPU is the master one;
otherwise, the MPU is the slave one.

Step 3 If it is the master one, run the following command to perform the master/slave
switchover:
[~HUAWEI] slave switchover chassis clc1

Step 4 Power off the MPU where the SSD resides.

Press and hold the OFL button on the panel of the MPU for six seconds till the
OFFLINE indicator is on. It means that the MPU is powered off.

Step 5 Remove the MPU where the old SSD resides and place it on the worktable.

Step 6 Press the SSD slot ejector clips, as indicated by (1) in Figure 4-368. Remove the
SSD horizontally, as indicated by (2) in Figure 4-368

Figure 4-368 Diagram of removing the SSD

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Step 7 Place the old SSD into an ESD bag.
Step 8 Install the new SSD to the MPU SSD slot.
Step 9 Install the MPU to the chassis.
Step 10 Check the running status of the new SSD.
Perform the following operations to check the running status of the new SSD:
● Check the alarms. In normal situations, the system does not generate any
alarm related to the new MPU.
● Run the dir command on the console port to check whether information
about the new SSD can be displayed. If the command output is displayed as
follows, the new SSD runs normally.
<HUAWEI> dir ?
/all List all files
> Redirects the output to a file
>> Append the command output to the end of a file
STRING<1-128> [drive][path][file name]
10#cfcard2: Device name
10#cfcard: Device name
9#cfcard2: Device name
9#cfcard: Device name
cfcard2: Device name
cfcard: Device name
| Matching output
<cr>
If the new SSD does not work, contact a Huawei local office for timely technical
support.

----End

Follow-up Procedure
After finishing the replacement, put all the tools away. If the old SSD is confirmed
to be faulty, fill in the Offsite Repair Card for Faulty Materials, and send it with
the faulty SSD to the Huawei local office for timely maintenance.

4.3.4.4 Replacing an Optical Module
This section describes the optical module of the device and the procedure for
replacing the optical module.

Context
Before replacing an optical module, you need to note the following points:
● Replacing an optical module interrupts services. Therefore, make sure that the
optical module is faulty before replacing it.
● Only an external optical module can be replaced. An external optical module
is pluggable.
● You need to take antistatic measures before replacing an optical module.
● You need not swap a board when replacing an optical module.
● Be careful when you remove or insert an optical cable in case the connector
of an optical cable is damaged.

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● When replacing an optical module, do not look directly into the fiber
connector as the laser radiation may harm your eyes.

CA UTION

An optical module is an electrostatic sensitive device. Therefore, you must take
antistatic measures during the whole process of replacing an optical module to
prevent the optical module from being damaged.

Tool
Before replacing an optical module, you need the following tools:
● ESD wrist strap or ESD glove
● ESD bag

Procedure

Step 1 Check the location of the optical module to be replaced.
Before pulling out an optical module that is to be replaced, you should first check
the location of the module, for example, the cabinet and chassis where the optical
module resides. Then, locate the optical module to be replaced in the chassis and
attach a label to the panel to identify the optical module.
Step 2 Run the display interface interface-type interface-number command to view and
record the type of the optical module to be replaced, as the following output in
bold displays:
<HUAWEI> display interface GigabitEthernet 1/1/0/4
GigabitEthernet1/0/4 current state : DOWN
Line protocol current state : DOWN
Last line protocol up time : 2011-03-28 15:49:51
Description: HUAWEI,GigabitEthernet1/0/4 Interface (ifindex: 8,
vr: 0)
Route Port,The Maximum Transmit Unit is 1500
Internet protocol processing : disabled
IP Sending Frames' Format is PKTFMT_ETHNT_2, Hardware address is 286e-d44d-9a2c
The Vendor PN is FTLF8519P2BNL-HW
The Vendor Name is FINISAR CORP.
Port BW: 1G, Transceiver max BW: 1G, Transceiver Mode: MultiMode
WaveLength: 850nm, Transmission Distance: 500m
Rx Power: -5.17dBm, Tx Power: -5.47dBm
Loopback:none, full-duplex mode, negotiation: disable, Pause Flowcontrol:Receive
Enable and Send Enable
Last physical up time : 2011-03-28 15:44:25
Last physical down time : 2011-03-28 15:41:19
Current system time: 2011-03-29 12:35:41
Statistics last cleared:never
Last 300 seconds input rate: 0 bits/sec, 0 packets/sec
Last 300 seconds output rate: 1486 bits/sec, 0 packets/sec
Input: 0 bytes, 0 packets
Output: 13824426 bytes, 9107 packets
Input:
Unicast: 0 packets, Multicast: 0 packets
Broadcast: 0 packets, JumboOctets: 0 packets
CRC: 0 packets, Symbol: 0 packets
Overrun: 0 packets, InRangeLength: 0 packets
LongPacket: 0 packets, Jabber: 0 packets, Alignment: 0 packets
Fragment: 0 packets, Undersized Frame: 0 packets

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Hardware Guide 4 Hardware Installation and Parts Replacement

RxPause: 0 packets
Output:
Unicast: 0 packets, Multicast: 9107 packets
Broadcast: 0 packets, JumboOctets: 0 packets
Lost: 0 packets, Overflow: 0 packets, Underrun: 0 packets
System: 0 packets, Overruns: 0 packets
TxPause: 0 packets
Last 300 seconds input utility rate: 0.00%
Last 300 seconds output utility rate: 0.01%
Step 3 Record the location of the cables and check whether the labels on the cables are
correct and clear. If the labels are hard to identify, re-make labels and re-label the
cables in case the cables are not connected properly.
Step 4 Wear the ESD gloves or wrist strap and connect the grounding terminal to the
ESD jack on the rack.
Step 5 Pull out the optical module to be replaced.
1. Remove the optical cables from the connector and cover the connector with a
dust cap.
2. Turn the pulled handle of the optical module downward, as (1) shown in
Figure 4-370.
When removing a CFP optical module, loosen the two screw rods until they
are fully ejected, hold the screw rods with both hands, and slightly pull out
the optical module from the optical interface, as shown in Figure 4-371. (If
the screw rods cannot be easily loosened with hands, use a screwdriver.)

NO TE

When the operation space is insufficient, you can use a fiber interface clamp to
remove an optical module. Figure 4-369 shows the appearance of a fiber interface
clamp.

Figure 4-369 Fiber interface clamp

3. Hold the handle to pull out the optical module carefully from the optical
interface, as (2) shown in Figure 4-370.
4. Place the removed optical module in the ESD bag.

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Figure 4-370 Schematic diagram of pulling out an optical module

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Figure 4-371 Schematic diagram of pulling out an optical module

Step 6 Insert the new optical module into the optical interface.
1. Take out the new optical module from the ESD bag and check whether there
is any damage or component missing. Check whether the new optical module
is of the same type as the optical module to be replaced.
2. Insert the new optical module into the optical interface, as shown in Figure
4-372. When the click of the reed in the optical module is heard, it indicates
that the optical module is correctly inserted.
Insert the new CFP optical module into the optical interface of the board, as
shown in Figure 4-373. Push the module panel horizontally into the
connector using even force with both thumbs. After the module is inserted,
push the module slightly to ensure that it has reached the stop position. Pull
out the two screw rods slightly to ensure that they can properly function. Pre-
tighten one of the screw rods. Then, tighten the other screw rod. After that,
tighten the first screw rod. To prevent the module from getting loosened due
to vibration or collision, you are advised to use a screwdriver to tighten the
screw rods.

CA UTION

An optical module must not be inserted inversely. If you cannot completely
insert an optical module into the interface, do not push it. Instead, you should
reverse it and insert it into the interface again.

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Figure 4-372 Schematic diagram of inserting an optical module

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Figure 4-373 Schematic diagram of inserting an optical module

3. Remove the dust cap from the connector and insert the optical cables in the
original sequence.
Step 7 Verify the functions of the new optical module.
Then, you can verify the functions of the new optical module in the following
ways:
● Check whether the LINK indicator on the optical interface works normally. If
the indicator is green, it indicates that the links connected to the interface are
Up.
● Run the display interface interface-type interface-number command on the
console interface to view the type and running status of the new optical
module. Check whether the type of the new optical module corresponds to
that of the original optical module, as the following output in bold displays:

<HUAWEI> display interface GigabitEthernet 1/1/0/4
GigabitEthernet1/0/4 current state : UP
Line protocol current state : UP
Last line protocol up time : 2011-03-28 15:49:51
Description: HUAWEI,GigabitEthernet1/0/4 Interface (ifindex: 8,
vr: 0)
Route Port,The Maximum Transmit Unit is 1500
Internet Address is 192.168.1.1/24
IP Sending Frames' Format is PKTFMT_ETHNT_2, Hardware address is 286e-d44d-9a2c
The Vendor PN is FTLF8519P2BNL-HW
The Vendor Name is FINISAR CORP.
Port BW: 1G, Transceiver max BW: 1G, Transceiver Mode: MultiMode
WaveLength: 850nm, Transmission Distance: 500m
Rx Power: -5.17dBm, Tx Power: -5.47dBm
Loopback:none, full-duplex mode, negotiation: disable, Pause Flowcontrol:Receive
Enable and Send Enable
Last physical up time : 2011-03-28 15:44:25
Last physical down time : 2011-03-28 15:41:19
Current system time: 2011-03-29 12:35:41
Statistics last cleared:never
Last 300 seconds input rate: 0 bits/sec, 0 packets/sec
Last 300 seconds output rate: 1486 bits/sec, 0 packets/sec
Input: 0 bytes, 0 packets
Output: 13824426 bytes, 9107 packets
Input:
Unicast: 0 packets, Multicast: 0 packets
Broadcast: 0 packets, JumboOctets: 0 packets
CRC: 0 packets, Symbol: 0 packets
Overrun: 0 packets, InRangeLength: 0 packets
LongPacket: 0 packets, Jabber: 0 packets, Alignment: 0 packets
Fragment: 0 packets, Undersized Frame: 0 packets

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RxPause: 0 packets
Output:
Unicast: 0 packets, Multicast: 9107 packets
Broadcast: 0 packets, JumboOctets: 0 packets
Lost: 0 packets, Overflow: 0 packets, Underrun: 0 packets
System: 0 packets, Overruns: 0 packets
TxPause: 0 packets
Last 300 seconds input utility rate: 0.00%
Last 300 seconds output utility rate: 0.01%
● Check whether there is any new alarm or performance event.
● Check whether the services are normal on the new optical module. If the
services are normal, it indicates that replacing an optical module is successful.
If the new optical module fails to return to the normal state, you should contact a
Huawei local office for timely technical support.

----End

Follow-up Procedure
After replacing an optical module, collect the tools. If an optical module that is
repSaced and is confirmed to be faulty, you should fill in the Offsite Repair Card
for Faulty Materials, and send the card and the faulty optical module to a Huawei
local office for timely maintenance.

4.3.4.5 Replacing a Fan Frame
This section describes the fan module of the device and the procedure for
replacing the fan module.

4.3.4.5.1 Introduction to a Fan Module

The fan module of the NE5000E-X16A/X16B is located at the rear of the chassis. It
meets the ventilation and heat dissipation requirements of the system and
supports hot swapping.
The fan module consists of fan components and an FCB board. Figure 4-374shows
the appearance of the fan module.

Figure 4-374 Appearance of the fan module of the NE5000E-X16A/X16B

The RUN indicator of the fan module is located on the fan module panel at the
rear of the chassis.

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4.3.4.5.2 Replacing the Fan Module of the NE5000E-X16A/X16B

Precautions
● In the process of removing an old fan module, you need to pull it out about 5
cm (1.97 in.) first. After the fans stop rotating, you can pull out the complete
module.
● You can replace only one fan at a time.

Tools
● ESD wrist strap or ESD gloves
● Phillips screwdriver

Procedure

Step 1 Check the location of the fan module to be replaced.
Before removing the old fan module, check its location, for example, the cabinet
and chassis where the fan module resides. Then, find the fan module to be
replaced in the chassis and attach a label to the panel to identify the fan module
to avoid misoperation.
Step 2 Wear the ESD wrist strap and connect the grounding terminal to the ESD jack on
the chassis.
Step 3 Turn the Phillips screwdriver to loosen the captive screws on the fan module, as
shown in Figure 4-375.
Step 4 Hold the left handle and right handle to draw the fan module about 5 cm (1.97
in.) out of the slot. When the fans stop rotating, pull out the fan module
completely, as shown in Figure 4-375.

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Figure 4-375 Diagram of removing the fan module from the NE5000E-X16A/X16B

Step 5 Insert a new fan module into the chassis.
Hold the left and right handles of the fan module, and slowly and horizontally
insert the fan module along the guide rails in the slot until the back of the fan
module properly connects to the backplane. Turn the Phillips screwdriver to fasten
the fan module to the chassis by tightening the captive screws, as shown in Figure
4-376.

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Hardware Guide 4 Hardware Installation and Parts Replacement

Figure 4-376 Diagram of installing the fan module on the NE5000E-X16A/X16B

Step 6 Verify the function of the new fan module.
In normal situations, after the new fan module is inserted into the chassis, the
fans inside it immediately start to operate to draw air from the chassis. In this
case, you can check whether the new fan module functions normally in the
following manners:
● If the FAN indicator on the panel of the fan module is on and green, it
indicates that the fan module runs normally. If the indicator is red, it indicates
that the fan module fails to run normally.
● Run the display fan command on the console interface to view the running
status of the fan module. If the command output is displayed as follows, it
indicates that the fan module runs normally.
<HUAWEI> display fan
Slotid : 27
Present : YES
Registered: YES
Status : MANUAL
FanSpeed : [No.]Speed
[1]60% [2]60% [3]60%
[4]60% [5]60% [6]60%
Slotid : 28
Present : YES
Registered: YES
Status : MANUAL
FanSpeed : [No.]Speed

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[1]100% [2]100% [3]100%
[4]100% [5]100% [6]100%
Slotid : 31
Present : YES
Registered: YES
Status : MANUAL
FanSpeed : [No.]Speed
[1]50% [2]50% [3]50%
[4]50% [5]50% [6]50%
Slotid : 32
Present : YES
Registered: YES
Status : MANUAL
FanSpeed : [No.]Speed
[1]55% [2]55% [3]55%
[4]55% [5]55% [6]55%

The preceding command output indicates that the new fan module is normal. If
the new fan module fails to return to the normal state, contact Huawei technical
personnel.

----End

Follow-up Procedure
After finishing the replacement, collect the tools. If a fan module that is replaced
is confirmed to be faulty, you need to fill in the Offsite Repair Card for Faulty
Materials and send the faulty fan module together with the card to the Huawei
local office for timely repair.

4.3.4.6 Replacing an Air Filter
This section describes the air filter of the device and the procedure for replacing
the air filter.

4.3.4.6.1 Replacing the Air Filter of the NE5000E-X16A/X16B

Precautions
To ensure good heat dissipation and ventilation for the system and to prevent the
accumulation of dust on an air filter, you need to clean the air filter regularly. It is
recommended that an air filter be cleaned at least once every three months and
be replaced once every year. When an air filter is placed in the dusty environment,
it needs to be cleaned more frequently.

Tools
● ESD wrist strap or ESD gloves
● Phillips screwdriver

Procedure

Step 1 Check the location of the air filter to be replaced.
Before removing the old air filter, check its location, for example, the cabinet and
chassis where the air filter resides. Then, find the air filter to be replaced in the

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chassis and attach a label to the panel to identify the air filter and avoid
misoperation.

Step 2 Wear the ESD wrist strap and connect the grounding terminal to the ESD jack on
the chassis.

Step 3 Remove the air filter from the air intake frame.

There is an air intake frame on the upper and lower chassis. Place fingers in the
holes on both sides of the panel to pull it out of the air intake frame horizontally.
In this manner, the panel is removed,Remove the air filter from the panel of the
air intake frame, as shown Figure 4-377.

Figure 4-377 Diagram of removing the air filter from the air intake frame on the
NE5000E-X16A/X16B

Step 4 Remove the air filter from the SFU area.

The air filter is located on the left in the middle of the device.Turn the Phillips
screwdriver to loosen the captive screws on the air filter. When removing the air

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filter, hold the upper handle of the air filter with one hand and pull the air filter
out horizontally, as shown in Figure 4-378.

Figure 4-378 Diagram of removing the air filter from the SFU area on the
NE5000E-X16A/X16B

Step 5 Install an air filter on the air intake frame.
Place the clean and dry air filter onto the panel of the air intake frame,Place
fingers in the holes on both sides of the panel to install the panel back to the
original place, as shown in Figure 4-379.

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Figure 4-379 Diagram of installing the air filter on the air intake frame of the
NE5000E-X16A/X16B

Step 6 Install an air filter in the SFU area.
Support the bottom of the air filter with one hand and hold the handle on the air
filter with the other hand. Then, insert the clean and dry air filter in the chassis
horizontally, as shown in Figure 4-380.

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Figure 4-380 Diagram of installing the air filter in the SFU area on the NE5000E-
X16A/X16B

----End

Follow-up Procedure
After finishing the replacement, put all the tools away. Dispose of an air filter that
is replaced according to the compliance and safety standards.

4.3.4.7 Replacing a Power Module
This section describes the power module of the device and the procedure for
replacing the power module.

4.3.4.7.1 Introduction to a Power Module

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Appearance of the power supply module of the NE5000E-X16A/X16B

Figure 4-381, Figure 4-382 and Figure 4-383 show the appearance of the PEM
and PM of NE5000E-X16AX16B.

Figure 4-381 Appearance of the DC PEM module

Figure 4-382 Appearance of the AC PEM module

Figure 4-383 Appearance of the PM module

4.3.4.7.2 Replacing the PM, switch, or PMU of the NE5000E-X16A/X16B

Precautions
● Before replacing a power supply module, ensure that its backup power supply
module works properly.
● Only one PM, switch, or PMU can be replaced at a time.
● The steps to replace a DC PM, switch, or PMU module are similar to those of
replacing an AC PM, switch, or PMU module on the NE5000E-X16A/X16B. This
topic uses replacing an AC PM, switch, or PMU module as an example.

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Tools
● ESD wrist strap or ESD gloves
● Phillips screwdriver

Procedure
Step 1 Check the location of the PM, switch, or PMU to be replaced.
Before removing the old PM, switch, or PMU, check its location, for example, the
cabinet and chassis where the PM, switch, or PMU resides. Then, find the PM,
switch, or PMU to be replaced in the chassis and attach a label to the panel to
identify the PM, switch, or PMU and avoid misoperation.
Step 2 Wear the ESD wrist strap and connect the grounding terminal to the ESD jack on
the chassis.
Step 3 Press the button on the handle of the PM.
Step 4 Hold the handle on the PM, switch, or PMU with one hand and hold the PM,
switch, or PMU with the other hand. Then, pull the PM, switch, or PMU
horizontally and slowly out of the chassis, as shown in Figure 4-384.

Figure 4-384 Diagram of removing the PM, switch, or PMU from the NE5000E-
X16A/X16B

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Step 5 Insert the new PM, switch, or PMU into the chassis.
Hold the handle on the PM, switch, or PMU with one hand and the PM, switch, or
PMU with the other hand. Then, insert the PM, switch, or PMU horizontally and
slowly along the guide rails in the slot until the back of the PM, switch, or PMU
properly connects to the backplane, Turn the Phillips screwdriver to fasten the PM,
switch, or PMU to the chassis by tightening the captive screws, as shown in Figure
4-385.

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Figure 4-385 Diagram of installing the PM, switch, or PMU on the NE5000E-X16A/
X16B

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Step 6 Connect the cables to the power module in original sequence.

Step 7 Verify the function of the new PM, switch, or PMU.
● If the RUN indicator on the PM panel is on and green, it indicates that the PM
runs normally.
If the ALM indicator on the PM panel is on and red, it indicates that the PM
fails to run normally.
● Run the display device slot id command on the console interface to check the
running status of the new PM, switch, or PMU. If the PM, switch, or PMU
statuses are displayed as the following bold characters, it indicates that the
PM, switch, or PMU runs normally.
– DC Power Supply System
<HUAWEI> display device
NE5000E-X16A's Device status:
Slot # Type Online Register Status Primary
- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
3 LPU Present Registered Normal NA
5 VSU Present Registered Normal NA
6 VSU Present Registered Normal NA
7 LPU Present Registered Normal NA
18 MPU Present NA Normal Master
20 SFU Present Registered Normal NA
22 SFU Present Registered Normal NA
24 CLK Present Registered Normal Master
25 PWR Present Registered Normal NA
27 FAN Present Registered Normal NA
28 FAN Present Registered Normal NA
31 FAN Present Registered Normal NA

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32 FAN Present Registered Normal NA
33 PMU Present Registered Normal Master
34 PMU Present Registered Normal Slave
<HUAWEI> display device 25
- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
Mode :DC
--------------------------------------------------------------------------------
PM # Online Status InVol InCur InPower OutVol OutCur OutPower
--------------------------------------------------------------------------------
PM9 Present Normal 51.86 10.64 0.00 48.48 10.70 521.56
PM13 Present Normal 51.86 9.78 0.00 48.79 9.86 479.63
PM14 Present Normal 52.33 10.47 0.00 48.50 10.62 517.85
PM15 Present Normal 52.33 1.33 0.00 49.15 1.25 61.39
PM16 Present Normal 52.82 1.52 0.00 49.15 1.43 71.28
--------------------------------------------------------------------------------
– AC Power Supply System
<HUAWEI> display device
NE5000E-X16A's Device status:
Slot # Type Online Register Status Primary
- - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - -
3 LPU Present Registered Normal NA
5 VSU Present Registered Normal NA
6 VSU Present Registered Normal NA
7 LPU Present Registered Normal NA
18 MPU Present NA Normal Master
20 SFU Present Registered Normal NA
22 SFU Present Registered Normal NA
24 CLK Present Registered Normal Master
25 PWR Present Registered Normal NA
27 FAN Present Registered Normal NA
28 FAN Present Registered Normal NA
31 FAN Present Registered Normal NA
32 FAN Present Registered Normal NA
33 PMU Present Registered Normal Master
34 PMU Present Registered Normal Slave
<HUAWEI> display device 25
Mode :AC
--------------------------------------------------------------------------------
PM # Online Status InVol InCur InPower OutVol OutCur OutPower
--------------------------------------------------------------------------------
A7 Present Normal 225.31 2.43 547.04 53.49 9.51 512.31
A8 Present Normal 225.38 2.43 548.63 53.58 9.53 513.81
--------------------------------------------------------------------------------
<HUAWEI> display device 26
Mode :AC
--------------------------------------------------------------------------------
PM # Online Status InVol InCur InPower OutVol OutCur OutPower
--------------------------------------------------------------------------------
B7 Present Normal 222.59 2.39 532.89 53.52 9.57 499.06
B8 Present Normal 225.53 2.42 545.19 53.48 9.53 510.59
--------------------------------------------------------------------------------
The preceding command output indicates that the new PM is normal. If the new
PM fails to return to the normal state, contact Huawei technical personnel.

----End

Follow-up Procedure
After finishing the replacement, put all the tools away. If a PM is replaced and
confirmed to be faulty, you need to fill in the Offsite Repair Card for Faulty
Materials and send the card with the faulty PM to the Huawei local office for
timely maintenance.

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4.3.5 Replacing Parts of the NE5000E-20

This section describes the precaution and procedure for replacing boards, SSD
cards, optical modules, fan modules, power modules, and centralized monitoring
units.

4.3.5.1 Replacing Boards

This chapter describes the precaution and procedure for replacing the MPU, the
SFU, and the LPU.

4.3.5.1.1 Introduction to Boards

This section describes the mechanical specifications and types of boards on the
NE5000E.

Mechanical Specifications of Boards

Mechanical Specifications of Boards

The boards of the NE5000E-20 are of the plug-in type and consists of a circuit
board, connectors, a front panel, ejector levers, captive screws, and Cable
manager, as shown in Figure 4-386.

Figure 4-386 Schematic diagram of a common LPU

1. Connector 2. Captive screw 3. Ejector lever 4.

Cable manager

Types of Boards

The NE5000E supports the following types of boards:
● MPU
● SFU
● LPU

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4.3.5.1.2 Replacing an MPU
This section describes the precaution and procedure for replacing an MPU.

Context
Before replacing a Main Processing Unit (MPU), you need to note the following
points:
● When the system is running, you can replace only the slave MPU.
● If you need to replace the master MPU, you must first perform the master/
slave switchover to enable the master MPU to become the slave one.
● The system software package and configuration file in the new MPU must be
consistent with those in the MPU to be replaced.

Tool
Before replacing an MPU, you need the following tools:
● ESD wrist strap or ESD glove
● Phillips screwdriver
● ESD bag

Procedure

Step 1 Check the version of the running software package.
Run the display version command to check the version of the running software
package.
Step 2 Prepare a new MPU and check whether there is any bent pin in the connector.
Step 3 Check the location of the MPU to be replaced.
Before pulling out an MPU that is to be replaced, you should first determine the
location of the MPU, for example, the cabinet, chassis, and slot where the MPU
resides. The HUAWEI NetEngine5000E has two MPUs. The MPUs of the HUAWEI
NetEngine5000E reside in slots 21 and 22.
Locate the MPU to be replaced in the chassis and attach a label to identify the
MPU.
Step 4 Check whether the MPU to be replaced is the master MPU.
Run the display device command to check the slot number of the current MPU. If
the MPU to be replaced is the master one, you must run the slave switchover
command on the console interface to forcibly perform the master/slave
switchover. If you can log in to the device by using the slave MPU, it indicates that
the switchover is successful. Then, run the display device command to check the
slot number of the MPU after the master/slave switchover.

[~HUAWEI] slave switchover

Step 5 Remove the cables from the MPU and label the cables.
Step 6 Power off the MPU to be replaced.

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Press and hold the OFL button on the panel of the MPU for six seconds till the
OFFLINE indicator is on. It means that the MPU is powered off.
Step 7 Pull out the MPU to be replaced from the chassis.
1. Wear the ESD wrist strap and connect the grounding terminal to the ESD jack
on the rack.
2. Turn the Phillips screwdriver counter-clockwise to loosen the captive screws
on the board, as (1) shown in Figure 4-387.
3. Turn the ejector levers on the panel of the MPU outward and upward, as (2)
shown in Figure 4-387.
4. Hold the ejector levers on the panel of the MPU and pull out the MPU
smoothly from the chassis along the guide rail of the slot. When part of the
MPU is removed out of the slot, support the MPU with one hand and hold the
MPU panel with the other. Then, remove the MPU completely out of the slot,
as (3) shown in Figure 4-387.

NO TICE

– During the operation, pull out the MPU slowly and smoothly to prevent it
from colliding with the neighboring boards and from causing the failure of
the running boards.
– When swapping an MPU, do not touch the parts on the MPU. This is to
prevent it from being damaged.

5. Place the MPU that is removed in the ESD bag.

Figure 4-387 Schematic diagram of removing an MPU

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Step 8 Insert the new MPU into the chassis.
1. Take out the new MPU from the ESD bag.

NO TICE

– During the operation, pull out the MPU slowly and smoothly to prevent it
from colliding with the neighboring boards and from causing the failure of
the running boards.
– When swapping an MPU, do not touch the parts on the MPU. This is to
prevent it from being damaged.

2. Support the lower edge of the new MPU with one hand and hold the panel
with the other hand. Then, insert the new MPU smoothly into the chassis
along the guide rail of the slot. Stop sliding the MPU forward when the
ejector levers on the front panel of the MPU touch the chassis, as (2) shown
in Figure 4-388.
3. Turn the ejector levers on the MPU outward and upward to form a 45-degree
angle, and at the same time push the MPU into the slot. Then, turn the
ejector levers inward and downward till the panel of the MPU touches the
slot, as (3) shown in Figure 4-388.
4. Turn the Phillips screwdriver clockwise to tighten the captive screws, as (4)
shown in Figure 4-388.

Figure 4-388 Schematic diagram of inserting an MPU

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Step 9 (Optional) Upgrade the new MPU using the BootROM
For details about how to upgrade the new MPU using the BootROM, see "4.5
Upgrading the System Software Using the BootROM" in the Upgrade Guide.
Step 10 Check the running status of the new MPU.
In normal situations, after the new MPU is inserted into the chassis, the MPU
automatically communicates with the boards in the chassis. In this case, you can
check the running status of the new MPU in the following ways:
● If the RUN indicator (green) on the panel of the MPU is blinking once every
2s, it indicates that the MPU is running normally.
● Check the alarms. In normal situations, the system does not generate any
alarm related to the new MPU.
● Run the display device command on the console interface to view the
running status of the new MPU.

----End

Follow-up Procedure
After replacing an MPU, collect the tools. If an MPUthat is replaced is confirmed
to be faulty, you should fill in the Offsite Repair Card for Faulty Materials, and
send the card and the faulty MPUto a Huawei local office for timely maintenance.

NO TICE

Before you replace the MPU or its CF card, delete data from the CF card to prevent
data embezzlement.
Use either of the following methods to delete data from the CF card on an MPU:
● Connect a CF card reader to a PC, delete data from the CF card on the PC,
then reuse the CF card.
● Physically destroy the CF card.

4.3.5.1.3 Replacing an SFU of NE5000E-20
This section describes the precaution and procedure for replacing an SFU.

Context
Before replacing a Switch Fabric Unit (SFU), you need to note the following points:
● Only one SFU can be replaced at a time when the system is running.
● If you need to replace multiple SFUs, you must replace one SFU first. After the
new SFU is inserted and runs normally, you can then replace the other SFUs.

Tool
Before replacing an SFU, you need the following tools:
● ESD wrist strap or ESD glove

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● Phillips screwdriver
● ESD bag

Procedure

Step 1 Check the location of the SFU to be replaced.

Before pulling out an SFU that is to be replaced, you should first determine the
location of the SFU, for example, the cabinet, chassis, and slot where the SFU
resides.

Locate the SFU to be replaced in the chassis and attach a label to identify the SFU.

Step 2 Prepare a new SFU and check whether there is any bent pin in the connector.

Step 3 Power off the SFU to be replaced.

Press and hold the OFL button on the panel of the SFU for six seconds till the
OFFLINE indicator is on. It means that the SFU is powered off.

Step 4 Pull out the SFU to be replaced from the chassis.

NO TE

● Before installing an SFU of NE5000E-20, ensure that ejector levers are available for use.
● After installing an SFU, remove the ejector levers from the SFU and attach them on the
cabinet or chassis for future use.

NO TICE

● During the operation, pull out the SFU slowly and smoothly to prevent it from
colliding with the neighboring boards and from causing the failure of the
running boards.
● When swapping an SFU, do not touch the parts on the SFU. This is to prevent it
from being damaged.
● Do not use ejector levers to lift a board.
● Use both ejector levers when pushing or pulling a board. Never use only one.

1. Wear the ESD wrist strap and connect the grounding terminal to the ESD jack
on the rack.
2. Press down the elastomer fasteners on the ejector levers and insert them into
ejector lever connectors on the SFU. as 1 and 2 shown in Figure 4-389.
3. Loosen the captive screws counter-clockwise with a Phillips screwdriver, as 3
shown in Figure 4-389.
4. Turn the ejector levers on the panel of the SFU outward and upward, as 4
shown in Figure 4-389.
5. Hold the ejector levers on the panel of the SFU and pull out the SFU
smoothly from the chassis along the guide rail of the slot. When part of the
SFU is removed out of the slot, support the SFU with one hand and hold the
SFU panel with the other. Then, remove the SFU completely out of the slot, as
5 shown in Figure 4-389.

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6. Press down the elastomer fasteners on the ejector levers and remove them
from the SFU. as 6 and 7 shown in Figure 4-389.
7. Place the SFU that is pulled out in the ESD-preventative bag.

Figure 4-389 Schematic diagram of removing an SFU

Step 5 Insert the new SFU into the chassis.

NO TICE

● During the operation, pull out the SFU slowly and smoothly to prevent it from
colliding with the neighboring boards and from causing the failure of the
running boards.
● When swapping an SFU, do not touch the parts on the SFU. This is to prevent it
from being damaged.

1. Take out the new SFU from the ESD bag.
2. Support the lower edge of the new SFU with one hand and hold the panel
with the other hand. Then, insert the new SFU smoothly into the chassis
along the guide rail of the slot, as 1 shown in Figure 4-390.
3. Press down the elastomer fasteners on the ejector levers and insert them into
ejector lever connectors on the SFU. as 2 and 3 shown in Figure 4-390.
4. Turn the ejector levers on the SFU outward and upward to form a 45-degree
angle, and at the same time push the SFU into the slot. Then, turn the ejector
levers inward and downward till the panel of the SFU touches the slot, as 4
shown in Figure 4-390.
5. Turn the Phillips screwdriver clockwise to tighten the captive screws, as 5
shown in Figure 4-390.
6. Press down the elastomer fasteners on the ejector levers and remove them
from the SFU. See 6 and 7 in Figure 4-390.

Figure 4-390 Schematic diagram of inserting the new SFU into the chassis

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Step 6 Check the running status of the new SFU.
In normal situations, after the new SFU is inserted into the chassis, the SFU
automatically communicates with the boards in the chassis. In this case, you can
check the running status of the new SFU in the following ways:
● If the RUN indicator (green) on the panel of the SFU is blinking once every 2s,
it indicates that the SFU is running normally.
● Check the alarms. In normal situations, the system does not generate any
alarm related to the new SFU.
● Run the display device command on the console interface to view the
running status of the new SFU.
Step 7 Check service operations.

----End

Follow-up Procedure
After replacing an SFU, collect the tools. If an SFU that is replaced is confirmed to
be faulty, you should fill in the Offsite Repair Card for Faulty Materials, and send
the card and the faulty SFU to a Huawei local office for timely maintenance.

4.3.5.1.4 Replacing an LPU
This section describes the precaution and procedure for replacing a LPU.

Context
Before replacing a LPU, you need to note the following points:
● Before replacing a LPU, prepare a same LPU. The interfaces on the prepared
LPU should have the same numbers as the LPU to be replaced.

Tool
Before replacing a LPU, you need the following tools:
● ESD wrist strap or ESD glove
● Phillips screwdriver
● ESD bag

NO TE

Some LPUs do not come with a wrench. Equip yourself with a wrench when replacing these
LPUs. For more details, see 4.3.5.1.3 Replacing an SFU of NE5000E-20.

Procedure

Step 1 Check the location of the LPU to be replaced.
Before pulling out an LPU that is to be replaced, you should first check the
location of the LPU, for example, the cabinet, chassis, and slot where the LPU
resides.
Locate the LPU to be replaced in the chassis and attach a label to identify the LPU.

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Step 2 Check whether there is any bent pin in the connector of the new LPU.
Step 3 Power off the LPU to be replaced.
Press and hold the OFL button on the panel of the LPU for six seconds till the
OFFLINE indicator is on. It means that the LPU is powered off.
Step 4 Remove the cables from the LPU and label the cables to mark the corresponding
interface numbers.
Step 5 Pull out the LPU to be replaced from the chassis.
1. Wear the ESD wrist strap and connect the grounding terminal to the ESD jack
on the rack.
2. Loosen the captive screws counter-clockwise with a Phillips screwdriver, as (1)
shown in Figure 4-391.
3. Turn the ejector levers on the panel of the LPU outward and upward, as (2)
shown in Figure 4-391.

NO TICE

– During the operation, pull out the LPU slowly and smoothly to prevent it
from colliding with the neighboring boards and from causing the failure of
the running boards.
– When swapping an LPU, do not touch the parts on the LPU. This is to
prevent it from being damaged.

4. Hold the ejector levers on the panel of the LPU and pull out the LPU
smoothly from the chassis along the guide rail of the slot. When part of the
LPU is removed out of the slot, support the LPU with one hand and hold the
LPU panel with the other. Then, remove the LPU completely out of the slot, as
(3) shown in Figure 4-391.
5. Place the LPU that is pulled out in the ESD bag.

Figure 4-391 Pulling out a common LPU from a chassis

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Step 6 Insert the new LPU into the chassis.
1. Take out the new LPU from the ESD bag.

NO TICE

– During the operation, pull out the LPU slowly and smoothly to prevent it
from colliding with the neighboring boards and from causing the failure of
the running boards.
– When swapping an LPU, do not touch the parts on the LPU. This is to
prevent it from being damaged.

2. Support the lower edge of the new LPU with one hand and hold the panel
with the other hand. Then, insert the new LPU smoothly into the chassis
along the guide rail of the slot. Stop sliding the LPU forward when the ejector
lever on the front panel of the LPU reaches the chassis, as (1) shown in
Figure 4-392.
3. Turn the ejector levers on the LPU outward and upward to form a 45-degree
angle, and at the same time push the LPU into the slot. Then, turn the ejector
levers inward and downward till the panel of the LPU touches the frame, as
(2) shown in Figure 4-392.
4. Turn the Phillips screwdriver clockwise to tighten the captive screws, as (3)
shown in Figure 4-392.

Figure 4-392 Insert a common LPU into a chassis

Step 7 Connect the cables to the corresponding interfaces in the original sequence.
Step 8 Check the running status of the new LPU.
In normal situations, after the new LPU is inserted into the chassis, the LPU
automatically communicates with the MPU. In this case, you can check the
running status of the new LPU in the following ways:
● If the RUN indicator (green) on the panel of the LPU is blinking once every 2s,
it indicates that the LPU is running normally.

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● Check the alarms. In normal situations, the system does not generate any
alarm related to the new LPU.
● Run the display device command on the console interface to view the
running status of the new LPU.
Step 9 Check service operations.

----End

Follow-up Procedure
After replacing an LPU, collect the tools. If the LPU that is replaced is confirmed to
be faulty, you should fill in the Offsite Repair Card for Faulty Materials, and send
the card and the faulty LPU to a Huawei local office for timely maintenance.

4.3.5.2 Replacing Air Filters

Air filter positions
The device has four air filters, installed on the inner sides of the cabinet's front
doors, PM cover, and protective cover of the bottom cable tray, as shown in Figure
4-393.

Figure 4-393 Air filter positions

Precautions
To ensure good heat dissipation and system ventilation, clean the air filters
regularly. It is recommended that they are cleaned at least once every three
months and replaced once every year. Air filters in a dusty environment must be
cleaned more frequently.

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Tools Required

Ensure that a Phillips screwdriver is available.

Replacing the Air Filter on the Inner Side of the Right Front Door
1. Check the position of the air filter to be replaced.
Before replacing an air filter, determine the specific position of the air filter,
for example, the cabinet and chassis where the air filter resides. Then, locate
the air filter in the chassis and attach a label to the panel for identification.
2. Remove the air filter.
Uninstall the right front door (marked 1), remove the metal parts securing
the air filter (marked 2), and hold one end of the air filter to slowly remove
the air filter without tearing it.

3. Install a clean and dry air filter.
Press the air filter into the right front door along the four edges, install the
metal parts to secure the air filter, and re-install the door.

NO TE

The procedure for replacing the air filter on the inner side of the left front door is the same
as that for the right front door.

Replacing the Air Filter on the Inner Side of the Bottom Cable Tray
1. Check the position of the air filter to be replaced.
Before replacing an air filter, determine the specific position of the air filter,
for example, the cabinet and chassis where the air filter resides. Then, locate
the air filter in the chassis and attach a label to the panel for identification.
2. Remove the air filter.
a. Open the protective cover of the bottom cable tray, loosen the four captive
screws on the air filter using a Phillips screwdriver, and remove the air filter
module.

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b. Remove the metal parts securing the air filter, and hold one end of the air
filter to slowly remove the air filter without tearing it.

3. Install a clean and dry air filter.
Press the air filter into the air filter module along the four edges, install the
metal parts to secure the air filter, re-install the air filter module using the
Phillips screwdriver, and close the protective cover.

NO TE

The procedure for replacing the air filter on the inner side of the PM cover is the same as
that for the bottom cable tray.

Follow-up Procedure
After finishing the replacement, put the Phillips screwdriver away. Handle the
replaced air filter in compliance with local safety regulations.

4.3.5.3 Replacing the SSD

Context
The MPU provides the Solid State Disk (SSD) as the mass storage device to store
data files.

Precautions
Before removing the SSD, note the following issues:
● As the SSD is located on the MPU circuit board, remove the MPU first.

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● Contents on the new SSD must be consistent with those on the old one.

Tool
Before replacing the SSD, you need the following tools:
● ESD wrist strap or ESD glove
● ESD bag

Procedure

Step 1 Check the location of the old SSD.
Before removing the old SSD, first check its location, for example, the cabinet and
chassis where it resides. Then locate the MPU where the old SSD resides in the
chassis and attach a label to the panel to identify the MPU.
Step 2 Check whether the MPU where the old SSD resides is the master one.
You can view the ACT indicator on the MPU to check whether the MPU is the
master one. If the ACT indicator is on, it means that the MPU is the master one;
otherwise, the MPU is the slave one.
Step 3 If it is the master one, run the following command to perform the master/slave
switchover:
[~HUAWEI] slave switchover
Step 4 Power off the MPU where the SSD resides.
Press and hold the OFL button on the panel of the MPU for six seconds till the
OFL indicator is on. It means that the MPU is powered off.
Step 5 Remove the MPU where the old SSD resides and place it on the worktable.
Step 6 Press the SSD slot ejector clips, as indicated by (1) in Figure 4-394. Remove the
SSD horizontally, as indicated by (2) in Figure 4-394

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Figure 4-394 Diagram of removing the SSD

Step 7 Place the old SSD into an ESD bag.

Step 8 Install the new SSD to the MPU SSD slot.

Step 9 Install the MPU to the chassis.

Step 10 Check the running status of the new SSD.

Perform the following operations to check the running status of the new SSD:

● Check the alarms. In normal situations, the system does not generate any
alarm related to the new MPU.
● Run the dir command on the console port to check whether information
about the new SSD can be displayed. If the command output is displayed as
follows, the new SSD runs normally.
<HUAWEI> dir ?
STRING<1-255> [drive][path][file name]
/all List all files
/all-filesystems List files on all filesystems
cfcard: List on cfcard: file system
slave#cfcard: List on slave#cfcard: file system
| Matching output
> Redirect the output to a file
>> Redirect the output to a file in append mode
<cr>

If the new SSD does not work, contact a Huawei local office for timely technical
support.

----End

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Follow-up Procedure

After finishing the replacement, put all the tools away. If the old SSD is confirmed
to be faulty, fill in the Offsite Repair Card for Faulty Materials, and send it with
the faulty SSD to the Huawei local office for timely maintenance.

4.3.5.4 Replacing an Optical Module

This section describes the optical module of the device and the procedure for
replacing the optical module.

Context

Before replacing an optical module, you need to note the following points:

● Replacing an optical module interrupts services. Therefore, make sure that the
optical module is faulty before replacing it.
● Only an external optical module can be replaced. An external optical module
is pluggable.
● You need to take antistatic measures before replacing an optical module.
● Remove the optical fiber before the replacement.
● You need not swap a board when replacing an optical module.
● Be careful when you remove or insert an optical cable in case the connector
of an optical cable is damaged.
● When replacing an optical module, do not look directly into the fiber
connector as the laser radiation may harm your eyes.

CA UTION

An optical module is an electrostatic sensitive device. Therefore, you must take
antistatic measures during the whole process of replacing an optical module to
prevent the optical module from being damaged.

Tool

Before replacing an optical module, you need the following tools:

● ESD wrist strap or ESD glove
● ESD bag

Procedure

Step 1 Check the location of the optical module to be replaced.

Before pulling out an optical module that is to be replaced, you should first check
the location of the module, for example, the cabinet and chassis where the optical
module resides. Then, locate the optical module to be replaced in the chassis and
attach a label to the panel to identify the optical module.

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Step 2 Run the display interface interface-type interface-number command to view and
record the type of the optical module to be replaced, as the following output in
bold displays:

Step 3 Record the location of the cables and check whether the labels on the cables are
correct and clear. If the labels are hard to identify, re-make labels and re-label the
cables in case the cables are not connected properly.
Step 4 Wear the ESD gloves or wrist strap and connect the grounding terminal to the
ESD jack on the rack.
Step 5 Pull out the optical module to be replaced.
1. Remove the optical cables from the connector and cover the connector with a
dust cap.
2. Turn the pulled handle of the optical module downward, as (1) shown in
Figure 4-395.
When removing a CFP optical module, loosen the two screw rods until they
are fully ejected, as (1) shown in Figure 4-396. (If the screw rods cannot be
easily loosened with hands, use a screwdriver.)
3. Hold the handle to pull out the optical module carefully from the optical
interface, as (2) shown in Figure 4-395.
When removing a CFP optical module, hold the screw rods with both hands,
and slightly pull out the optical module from the optical interface.
4. Place the removed optical module in the ESD bag.

Figure 4-395 Schematic diagram of pulling out an optical module

Figure 4-396 Schematic diagram of pulling out an optical module

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Step 6 Insert the new optical module into the optical interface.
1. Take out the new optical module from the ESD bag and check whether there
is any damage or component missing. Check whether the new optical module
is of the same type as the optical module to be replaced.
2. Insert the new optical module into the optical interface, as shown in Figure
4-397. When the click of the reed in the optical module is heard, it indicates
that the optical module is correctly inserted.

Insert the new CFP optical module into the optical interface of the board, as
shown in Figure 4-398. Push the module panel horizontally into the
connector using even force with both thumbs. After the module is inserted,
push the module slightly to ensure that it has reached the stop position. Pull
out the two screw rods slightly to ensure that they can properly function. Pre-
tighten one of the screw rods. Then, tighten the other screw rod. After that,
tighten the first screw rod. To prevent the module from getting loosened due
to vibration or collision, you are advised to use a screwdriver to tighten the
screw rods.

CA UTION

An optical module must not be inserted inversely. If you cannot completely
insert an optical module into the interface, do not push it. Instead, you should
reverse it and insert it into the interface again.

Figure 4-397 Schematic diagram of inserting an optical module

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Figure 4-398 Schematic diagram of inserting an optical module

3. Remove the dust cap from the connector and insert the optical cables in the
original sequence.
Step 7 Verify the functions of the new optical module.
Then, you can verify the functions of the new optical module in the following
ways:
● Check whether the LINK indicator on the optical interface works normally. If
the indicator is green, it indicates that the links connected to the interface are
Up.
● Run the display interface interface-type interface-number command on the
console interface to view the type and running status of the new optical
module. Check whether the type of the new optical module corresponds to
that of the original optical module, as the following output in bold displays:

<HUAWEI> display interface GigabitEthernet 2/0/0
GigabitEthernet2/0/0 current state : UP (ifindex: 14)
Line protocol current state : UP
Last line protocol up time : 2016-04-12 10:56:02
Description:
Route Port,The Maximum Transmit Unit is 1500
Internet Address is 2.0.0.1/24
IP Sending Frames' Format is PKTFMT_ETHNT_2, Hardware address is d494-e814-c397
The Vendor PN is LTF8502-BC+
The Vendor Name is Hisense
Port BW: 10G, Transceiver max BW: 10G, Transceiver Mode: MultiMode
WaveLength: 850nm, Transmission Distance: 300m
Rx Power: -1.78dBm, Warning range: [-9.901, -1.000]dBm
Tx Power: -2.42dBm, Warning range: [-7.300, -1.000]dBm
Loopback: none, LAN full-duplex mode, Pause Flowcontrol: Receive Enable and Send Enable
Last physical up time : 2016-04-12 10:56:02
Last physical down time : 2016-04-12 10:55:53
Current system time: 2016-04-12 17:52:06
Statistics last cleared:never
Last 10 seconds input rate: 8682863376 bits/sec, 8222406 packets/sec
Last 10 seconds output rate: 558 bits/sec, 0 packets/sec
Input peak rate 8698465184 bits/sec, Record time: 2016-04-12 05:17:15
Output peak rate 16757 bits/sec, Record time: 2016-04-12 10:56:06
Input: 103600824381560 bytes, 784854739797 packets
Output: 3142252 bytes, 32725 packets
Input:
Unicast: 0 packets, Multicast: 0 packets
Broadcast: 784854741783 packets, JumboOctets: 0 packets
CRC: 0 packets, Symbol: 0 packets
Overrun: 0 packets, InRangeLength: 0 packets
LongPacket: 0 packets, Jabber: 0 packets, Alignment: 0 packets

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Fragment: 0 packets, Undersized Frame: 0 packets
RxPause: 0 packets
Output:
Unicast: 19150 packets, Multicast: 13575 packets
Broadcast: 0 packets, JumboOctets: 0 packets
Lost: 0 packets, Overflow: 0 packets, Underrun: 0 packets
System: 0 packets, Overruns: 0 packets
TxPause: 241 packets
Local fault: normal, Remote fault: normal.
Last 10 seconds input utility rate: 99.99%
Last 10 seconds output utility rate: 0.01%
● Check whether there is any new alarm or performance event.
● Check whether the services are normal on the new optical module. If the
services are normal, it indicates that replacing an optical module is successful.

If the new optical module fails to return to the normal state, you should contact a
Huawei local office for timely technical support.

----End

Follow-up Procedure

After replacing an optical module, collect the tools. If an optical module that is
replaced and is confirmed to be faulty, you should fill in the Offsite Repair Card
for Faulty Materials, and send the card and the faulty optical module to a Huawei
local office for timely maintenance.

4.3.5.5 Replacing the Fan Module of the NE5000E-20

Precautions
● In the process of removing an old fan module, you need to pull it out about 5
cm (1.97 in.) first. After the fans stop rotating, you can pull out the complete
module.
● You can replace only one fan at a time.

Tools
● ESD wrist strap or ESD gloves
● Phillips screwdriver

Procedure

Step 1 Check the location of the fan module to be replaced.

Before removing the old fan module, check its location, for example, the cabinet
and chassis where the fan module resides. Then, find the fan module to be
replaced in the chassis and attach a label to the panel to identify the fan module
to avoid misoperation.

Step 2 Wear the ESD wrist strap and connect the grounding terminal to the ESD jack on
the chassis.

Step 3 Turn the Phillips screwdriver to loosen the captive screws on the fan module, as
shown in Figure 4-399.

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Step 4 Hold the left handle and right handle to draw the fan module about 5 cm (1.97
in.) out of the slot. When the fans stop rotating, pull out the fan module
completely, as shown in Figure 4-399.

Figure 4-399 Diagram of removing the fan module FAN-120 from the
NE5000E-20

Figure 4-400 Diagram of removing the fan module FAN-80 from the NE5000E-20

Step 5 Insert a new fan module into the chassis.
Hold the left and right handles of the fan module, and slowly and horizontally
insert the fan module along the guide rails in the slot until the back of the fan
module properly connects to the backplane. Turn the Phillips screwdriver to fasten
the fan module to the chassis by tightening the captive screws, as shown in Figure
4-401.

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Figure 4-401 Diagram of installing the fan module FAN-120 on the NE5000E

Figure 4-402 Diagram of installing the fan module FAN-80 on the NE5000E-20

Step 6 Verify the function of the new fan module.

In normal situations, after the new fan module is inserted into the chassis, the
fans inside it immediately start to operate to draw air from the chassis. In this
case, you can check whether the new fan module functions normally in the
following manners:
● If the FAN indicator on the panel of the fan module is on and green, it
indicates that the fan module runs normally. If the indicator is red, it indicates
that the fan module fails to run normally.
● Run the display fan command on the console interface to view the running
status of the fan module. If the command output is displayed as follows, it
indicates that the fan module runs normally.
<HUAWEI> display fan

Slotid : FAN1
Present : YES
Registered: YES
Status : MANUAL
FanSpeed : [No.]Speed
[1] 30% [2] 30% [3] 30%
[4] 30% [5] 30% [6] 30%
Slotid : FAN2
Present : YES
Registered: YES
Status : MANUAL

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FanSpeed : [No.]Speed
[1] 30% [2] 30% [3] 30%
[4] 30% [5] 30% [6] 30%
Slotid : FAN3
Present : YES
Registered: YES
Status : MANUAL
FanSpeed : [No.]Speed
[1] 30% [2] 30% [3] 30%
[4] 30% [5] 30% [6] 30%
Slotid : FAN4
Present : YES
Registered: YES
Status : MANUAL
FanSpeed : [No.]Speed
[1] 30% [2] 30% [3] 30%
[4] 30% [5] 30% [6] 30%
Slotid : FAN9
Present : YES
Registered: YES
Status : MANUAL
FanSpeed : [No.]Speed
[1] 95% [2] 95% [3] 95%
[4] 95%
The preceding command output indicates that the new fan module is normal. If
the new fan module fails to return to the normal state, contact Huawei technical
personnel.
----End

Follow-up Procedure
After finishing the replacement, collect the tools. If a fan module that is replaced
is confirmed to be faulty, you need to fill in the Offsite Repair Card for Faulty
Materials and send the faulty fan module together with the card to the Huawei
local office for timely repair.

4.3.5.6 Replacing the PM

Precautions
● Before replacing a power supply module, ensure that its backup power supply
module works properly.
● Only one PM can be replaced at a time.
● The steps to replace a DC PM module are similar to those of replacing an AC
PM module on the NE5000E-20. This topic uses replacing an AC PM module
as an example.

Tools
● ESD wrist strap or ESD gloves

Procedure
Step 1 Check the location of the PM to be replaced.
Before removing the old PM, check its location, for example, the cabinet and
chassis where the PM resides. Then, find the PM to be replaced in the chassis and
attach a label to the panel to identify the PM and avoid misoperation.

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Step 2 Wear the ESD wrist strap and connect the grounding terminal to the ESD jack on
the chassis.
Step 3 Press
Step 4 Hold the handle on the PM with one hand and hold the PM with the other hand.
Then, pull the PM horizontally and slowly out of the chassis, as shown in Figure
4-403.

Figure 4-403 Diagram of removing the PM from the NE5000E

Step 5 Insert the new PM into the chassis.
Hold the handle on the PM with one hand and the PM with the other hand. Then,
insert the PM horizontally and slowly along the guide rails in the slot until the
back of the PM properly connects to the backplane, Turn the Phillips screwdriver
to fasten the PM to the chassis by tightening the captive screws, as shown in
Figure 4-404.

Figure 4-404 Diagram of installing the PM on the NE5000E

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Step 6 Connect the cables to the power module in original sequence.
Step 7 Verify the function of the new PM.
● If the Input and Output indicators on the PM panel is on and green, it
indicates that the PM runs normally.
If the ALM indicator on the PM panel is on and red, it indicates that the PM
fails to run normally.
● Run the display device command on the console interface to check the
running status of the new PM. If the PM statuses are displayed as the
following bold characters, it indicates that the PM runs normally.
<HUAWEI> display device
NE5000E-20's Device status:
-------------------------------------------------------------------------------
Slot # Type Online Register Status Role LsId Primary
-------------------------------------------------------------------------------
7 LPU Present Registered Normal LC 0 NA
21 MPU Present Registered Normal MMB 0 Master
22 MPU Present Registered Normal MMB 0 Slave
26 SFU Present Registered Normal OTHER 0 NA
27 SFU Present Registered Normal OTHER 0 NA
35 CLK Present Registered Normal OTHER 0 Master
36 CLK Present Registered Normal OTHER 0 Slave
37 PWR Present Registered Normal OTHER 0 NA
39 FAN Present Registered Normal OTHER 0 NA
40 FAN Present Registered Normal OTHER 0 NA
41 FAN Present Registered Normal OTHER 0 NA
42 FAN Present Registered Normal OTHER 0 NA
43 FAN Present Registered Normal OTHER 0 NA
44 FAN Present Registered Normal OTHER 0 NA
45 FAN Present Registered Normal OTHER 0 NA
46 FAN Present Registered Normal OTHER 0 NA
47 FAN Present Registered Normal OTHER 0 NA
48 FAN Present Registered Normal OTHER 0 NA
32 CMU Present Registered Normal OTHER 0 Slave
33 CMU Present Registered Normal OTHER 0 Master

The preceding command output indicates that the new PM is normal. If the new
PM fails to return to the normal state, contact Huawei technical personnel.

----End

Follow-up Procedure
After finishing the replacement, put all the tools away. If a PM is replaced and
confirmed to be faulty, you need to fill in the Offsite Repair Card for Faulty
Materials and send the card with the faulty PM to the Huawei local office for
timely maintenance.

4.3.5.7 Replacing the Centralized Monitoring Unit (CMU) of NE5000E-20

Precautions
None

Tools
● ESD wrist strap or ESD gloves

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● Phillips screwdriver

Procedure

Step 1 Check the location of the CMU to be replaced.
Before removing the old CMU, check its location, for example, the cabinet and
chassis where the CMU resides. Then, find the CMU to be replaced in the chassis
and attach a label to the panel to identify the CMU and avoid misoperation.
Step 2 Wear the ESD wrist strap and connect the grounding terminal to the ESD jack on
the chassis.
Step 3 Loosen the captive screws on both ends of the CMU with the Phillips screwdriver,
as (1) shown in Figure 4-405.
Step 4 Open the CMU wrench, hold the CMU horizontally with one hand, and lightly pull
the CMU out of the chassis, as (2) shown in Figure 4-405.

Figure 4-405 Diagram of removing the CMU from the NE5000E-20

Step 5 Insert the new CMU into the chassis.
Hold the CMU horizontally, slightly insert it into the slot along the guide rails, and
fasten the CMU wrench, as (1) shown in Figure 4-406.
Step 6 Tighten the captive screws to fasten the CMU to the chassis, as (2) shown in
Figure 4-406.

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Figure 4-406 Diagram of installing the CMU on the NE5000E-20

Step 7 Verify the function of the new CMU.
● Run the display device slot id command on the console interface to check the
running status of the new CMU.

----End

Follow-up Procedure
After finishing the replacement, put all the tools away. If a CMU is replaced and
confirmed to be faulty, you need to fill in the Offsite Repair Card for Faulty
Materials and send the card with the faulty CMU to the Huawei local office for
timely maintenance.
4.3.6 Replacing Cables
This chapter describes the precaution and procedure for replacing power cable and
ground cable, clock cable, network cable, optical cable, and CXP Fiber Optic.

4.3.6.1 Cable Types
This section describes the cable types of the device.
This chapter introduces the cable types supported by the NE5000E and their uses,
as shown in Table 4-86.

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Table 4-86 Cable types and uses

Type Use

Power cable and ground Power cable: connecting the external power to the
cable input terminal on the power module; Ground
cable: connecting the ground terminal on a device
to the ground terminal on a power distribution
cabinet

Clock cable Connecting a clock interface to a BITS device

Network cable Connecting an Ethernet interface to a terminal
equipment

Optical cable Connecting an optical interface to the ODF or a
transmission device

CXP optical fiber Connecting switching channels in the NE5000E
cluster

4.3.6.2 Replacing a Power Cable and a Ground Cable

Context

Before replacing a power cable, you need to note the following points:

● Make sure that service data is backed up before replacing a power cable or a
ground cable.
● Before operation, make sure to cut off all input power supplies in the power
distribution cabinet, and attach a label to the switch to be used.
● The terminals of a DC power cable and other exposed surfaces must be fully
insulated.

Tool

Before replacing a power cable, you need the following tools:

● Terminal of the power module and ground terminal
● Power cable
● ESD wrist strap
● Phillips screwdriver

Procedure

Step 1 Record the location of both ends of the power cable to be replaced and the
cabling mode in case of misoperation.

Step 2 Make a new external power cable and a ground cable. For details, refer to the On-
site Cable Assembly and Installation in the Installation Guide.

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Step 3 Loosen the screws on the terminal of the power module with a wrench. Then,
remove the terminal. Pull out the power cable from the guide-in hole on the
cabinet.

Step 4 Install the power cable and ground cable. Pass the new power cable through the
guide-in hole on the cabinet, and connect the terminal of the power module to
the input terminal of the power module in the power distribution cabinet. Then,
tighten the setscrews with a wrench. For details, see the relevant Installation
Guide.

Step 5 Make new labels according to the contents of the labels on the old power cable.
For label regulations, refer to "Engineering Labels for Cables" in the Installation
Guide.

----End

Follow-up Procedure
After replacing a power cable, collect the tools and the replaced cable. Do not
place the old and the new cables together to avoid confusions.

4.3.6.3 Replacing a Clock Cable
This section describes the clock cable of the device and the procedure for replacing
the clock cable.

Context
Before replacing a clock cable, you need to note the following points:

● During the process of replacing a clock cable, the services are interrupted
temporarily.
● It is recommended that you replace a clock cable during the hours when the
network is not busy, for example, from 00:00 am to 06:00 am.

Tool
Before replacing a clock cable, you need the following tools"

● flat-head screwdriver
● Cutter
● Cable tie
● ESD wrist strap or ESD glove
● Multimeter

Procedure

Step 1 Record the location of both ends of the clock cable to be replaced and the cabling
mode.

Step 2 Check the type of the new clock cable.

There are two types of clock cables:

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● 75 Ω coaxial cable
● 120 Ω twisted pair cable

Step 3 The type of the new clock cable must be consistent with that of the old one. Make
a new label according to the contents of the label on the old clock cable.

Step 4 Lay out the new clock cable according to the original cabling mode.

Step 5 Remove the old clock cable.
1. Put on the ESD gloves or wrist strap and connect the grounding terminal to
the ESD jack on the rack.
2. Turn a screwdriver counter-clockwise to loosen the screws on the connector of
the clock cable that connects the board.
3. Hold the connector and remove it.
4. Cut the cable tie with a cutter and take out the clock cable.

Step 6 Insert the connector of the clock cable into the interface of which the location is
recorded and turn the screwdriver clockwise to tighten the screws on the
connector.

Step 7 Attach a label to the new clock cable, as shown in Figure 4-407.

Figure 4-407 Schematic diagram of attaching a label to a clock cable

Step 8 Bind the cable with a cable tie and cut the redundancies of the tie.

Step 9 Check whether the new clock cable works normally.
● Check whether the services on the board to which the new cable connects are
normal.

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● If there is any alarm or if the services, you need to test the connectivity of the
cable with the multimeter.

----End

Follow-up Procedure
After replacing a clock cable, collect the tools and the replaced cable. Do not place
the old and the new cables together to avoid confusions.

4.3.6.4 Replacing a Network Cable
This section describes the network cable of the device and the procedure for
replacing the network cable.

Context
Before replacing a network cable, you need to note the following points:
● During the process of replacing a network cable, the services are interrupted
temporarily.
● It is recommended that you replace a network cable during the hours when
the network is not busy, for example, from 00:00 am to 06:00 am.

Tool
Before replacing a network cable, you need the following tools:
● Cutter
● Cable tie
● ESD wrist strap or ESD glove
● Cable tester
● Crimper

Procedure

Step 1 Check the location and cabling of the network cable to be replaced.
Step 2 Prepare a new network cable. The type of the new network cable must be
consistent with that of the old network cable. When a network cable is made, test
its connectivity with a cable tester.
Step 3 Wear the ESD gloves or wrist strap and connect the grounding terminal to the
ESD jack on the rack.
Step 4 Lay out the new network cable according to the original cabling mode.
If you need to replace more than one network cable at a time, you should attach
temporary labels to the new network cables to identify the cables. The new
network cables must be numbered consistently with the network cables to be
replaced.
Step 5 Remove the old network cable and record the location where the old network
cable is installed.

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1. Remove the connectors of the network cable.
2. Cut the cable tie with a cutter and remove the network cable.
Step 6 Insert the new network cable connector into the network interface of which the
location is recorded. If a click is heard, it indicates that the insertion is successful.
The indicator of the network interface being steady on and green indicates that
the link is Up.
Step 7 Attach a label to the new network cable, as shown in Figure 4-408.

Figure 4-408 Schematic diagram of attaching a label to a new network cable

Step 8 Bind the cable with a cable tie and cut the redundancies of the tie.
Step 9 Run the ping command to check the connection between both ends of the new
network cable. If both ends fail to communicate normally, check whether the
network cable is damaged or whether the connectors are secured.

----End

Follow-up Procedure
After replacing a network cable, collect the tools and the replaced cable. Do not
place the old and the new cables together to avoid confusions.

4.3.6.5 Replacing an Optical Cable
This section describes the optical cable of the device and the procedure for
replacing the optical cable.

Context
Before replacing an optical cable, you need to note the flowing points:

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● During the process of replacing an optical cable, the services are interrupted
temporarily.
● Be careful when you remove or insert an optical cable in case that the
connector of the optical cable is damaged.
● When installing or maintaining an optical interface board or an optical cable,
do not observe an optical interface or connectors of an optical cable.
● The curvature radius of an optical cable should be 20 times greater than its
diameter. Generally, the curvature radius should be greater than 40 mm.
● Connectors of optical cables are divided into the LC type and the SC type. You
must select an optical cable according to the interface type.

Tool

Before replacing an optical cable, you need the following tools:

● Cutter
● Binding strap
● ESD wrist strap or ESD glove

Procedure

Step 1 Record the location of both ends of the optical cable to be replaced and the
cabling mode.

Step 2 Take out the new optical cable and check whether the type of the new optical
cable is consistent with that of the old one. The multi-mode optical cable is
orange and the single-mode optical cable is yellow.

Step 3 Make a new label according to the contents of the label on the old optical cable.

Step 4 Lay out the new optical cable in the original place.

Step 5 Remove the old optical cable.
1. Put on the ESD gloves or wrist strap and connect the grounding terminal to
the ESD jack on the rack.
2. Hold the connectors and remove them. Then, cover the connectors with dust
caps.

NO TE

If a connector is dusty, clean it with dust-free cloth or fiber cleaning paper.
3. Remove the old optical cable from the corrugated pipe.

Step 6 Insert the new optical cable.

Before inserting the new optical cable, remove the dust caps and keep them
properly for future use. Then, connect both ends of the new optical cable to the
optical interfaces and secure the optical cables.

Step 7 Attach a label to the new optical cable, as shown in Figure 4-409.

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Figure 4-409 Schematic diagram of attaching a label to a new optical cable

Step 8 Lay out the new optical cable in a tidy manner in the cabinet and bind the optical
cable with a binding strap. Note that the optical cable should be bound with
proper strength and with even space in between. Bind the redundancies of the
optical cable at the ODF side.
Step 9 Check whether the new optical cable works normally.
● Check the LINK indicator at the optical interface. If the indicator is steady on
and green, it indicates that the link is Up.
● Check whether the service on the board where the new optical cable connects
is normal. If the services are normal, it indicates that the optical cable is
replaced successfully.
● Check whether there is any new alarm or performance event.

----End

Follow-up Procedure
After replacing an optical cable, collect the tools and the replaced optical cable.
Do not place the old and the new optical cables together to avoid confusions.

4.3.6.6 Replacing a CXP Fiber Optic

Precaution
● During the process of replacing a CXP fiber optic, the services over this
network cable are interrupted temporarily.
● You are recommended to replace a CXP fiber optic during the hours when the
network is not busy, for example, from 0 am to 6 am.

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Tool
● Diagonal pliers
● Cable ties
● ESD wrist strap or ESD gloves

Procedure

Step 1 Check the location and cabling route of the CXP fiber optic to be replaced.
Step 2 Prepare a new CXP fiber optic of the same type as the one to be replaced.
Step 3 Wear the ESD gloves or wrist strap and connect the grounding terminal to the
ESD jack on the rack.
Step 4 Remove the original CXP fiber optic and record the location where the original
CXP fiber optic is installed.
1. Loosen the captive screws on both ends of the CXP fiber optic and pull out
the connector.
2. Loosen the captive screws on both ends of the CXP fiber optic and pull out
the connector.
3. Cut the cable tie with a diagonal plier and remove the CXP fiber optic.
Step 5 Lay a new CXP fiber optic according to the original cabling mode.
If more than one CXP fiber optic need be replaced at a time, you should attach
temporary labels to the new CXP fiber optics to identify the CXP fiber optic. The
new CXP fiber optics must be numbered consistently with the CXP fiber optics to
be replaced.
Step 6 Remove the fiber caps on both ends of the CXP fiber optic, insert the connector to
the corresponding interface according to the recorded location, and tighten the
captive screws on both ends of the connector.
Step 7 Attach a label to the new CXP fiber optic, as shown in Figure 4-410.

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Figure 4-410 Schematic diagram of attaching a label to the new CXP fiber optic

Step 8 Bind the CXP fiber optic with a cable tie and cut the redundancies of the tie.

Step 9 Check whether the RUN indicator of the interface that is connected to the CXP
fiber optic to be replaced is on. If so, it indicates the interface link is normal.

----End

Follow-ups

After replacing a CXP fiber optic, collect the tools and the replaced CXP fiber optic.
Do not mix the old and new CXP fiber optics.
4.3.7 Glossary

A
Asynchronizati Asynchronization does not use the exact data signals timed by
on the clock. The signals have different frequencies and phases.
The asynchronizatioin usually encapsulates the bits into the
control flag, which specifies the beginning and end of the bits.
D
DCE Data Circuit-terminating Equipment is a network device
composing the UNI. DCE provides the physical connection to
the network, forwards the data, and provides the clock signals
for the DTE.

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DRAM Dynamic Random Access Memory. The information stored in
the RAM must be refreshed periodically. When the contents of
the DRAM are being refreshed, a user cannot access it. Delay
can thus occur.
DTE Data terminal equipment is a user device composing the UNI.
The DTE accesses the data network through the DCE
equipment (for example, model) and usually uses the clock
signals produced by DCE.
F
Flash Flash is a kind of special Erasable Programmable Read Only
Memory (EEPROM), which can be completely erased and
rewritten one time instead of only one byte.
N
NVRAM Nonvolatile Random Access Memory. The data in NVRAM
cannot be lost when the system is Down.
R
RAM Random Access Memory is a memory that can be lost easily,
and read and rewritten by the micro processor.
ROM Read Only Memory is a memory that cannot be lost easily, and
can only be read, but not written by the micro processor.
S
SRAM Static Random Access Memory is a type of random access
memory. Its contents can be saved only if the SRAM is
provided with the uninterruptible power supply. Unlike the
DRAM, the SRAM does not need to be refreshed repeatedly.

4.3.8 Acronyms and Abbreviations

A
AC Alternating Current
ATM Asynchronous Transfer Mode
AUX Auxiliary (port)
C
CAN Control Area Network
CCC Cluster Central Chassis
CF Compact Flash
CLC Cluster Line-card Chassis

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CLK Clock Card
CPU Central Processing Unit
CT1 Channelized T1
CTS Clear to Send
D
DC Direct Current
DCE Data Circuit-terminating Equipment
DSR Data Set Ready
DTE Data Terminal Equipment
DTR Data Terminal Ready
E
EMC Electro Magnetic Compatibility
F
FAD Fabric Adapter
FC Patch Cord (Connector + Fiber)
FCB Fan Control Board
FPIC Flexible Plug-in Card
G
GND Ground
I
IEC International Electrotechnical
Commission
L
LC Lucent Connector
LPU Line Processing Unit
M
MPU Main Processing Unit
N
NEG Negative
NVRAM Non-Volatile Random Access Memory
O
ODF Optical Distribution Frame
OFL Offline

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P
PC Personal Computer
PCB Printed Circuit Board
PCS Physical Coding Sublayer
PGND Protection Ground
PMD Physical Medium Dependent
R
RJ45 Registered Jack 45
RTS Request to Send
RXD Receive Data
S
SC Square Connector
SDRAM Synchronous Dynamic Random Access
Memory
SFU Switch Fabric Unit
SMB Sub-miniature B
T
TXD Transmit Data
U
UART Universal Asynchronous Receiver/
Transmitter
UTP Unshielded Twisted Pair
V
VRP Versatile Routing Platform

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